KR101446485B1 - Pattern forming system - Google Patents

Abstract

The imaging position is appropriately corrected in accordance with the deformation of the object to be imaged such as the substrate, so that it is possible to cope with various manufacturing steps and the imaging pattern is precisely formed.

In a drawing apparatus using an optical modulation element such as a DMD, the position of four alignment holes M0 to M3 is measured using a CCD. The standard divided regions DV0 to DV3 defined by dividing the preset reference rectangle Z0 by 2x2 and the deformed rectangles Z defined by the measured four alignment holes M0 to M3 are divided into 2 占 divided And calculates the offset amount, rotation angle, and scale ratio of each divided area on the basis of the modified divisional areas DM0 to DM3 defined by the above-described modified divisional areas DM0 to DM3. Then, the drawing data belonging to the reference division area is corrected based on the offset amount, the rotation angle, and the scale ratio.

A drawing system, an optical modulation element, a measuring means, a position coordinate, a correction means, and a drawing means.

Description

Drawing system {PATTERN FORMING SYSTEM}

1 is a perspective view schematically showing a painting system as a first embodiment.

2 is a diagram schematically showing an exposure unit provided in the drawing apparatus.

Fig. 3 is a diagram showing the relative movement of the exposure area, that is, scanning with the exposure area.

4 is a block diagram of the imaging system.

Fig. 5 is a diagram showing the entire drawing area as a reference and the modified drawing area.

6 is a diagram showing a divided area in which the entire drawing area as a reference is divided and a divided area of the modified drawing area.

Fig. 7 is a view showing a modified divided area corrected to a rectangular shape.

8 is a view showing a deformed divided area corrected to a rectangular shape.

9 is a flowchart of the rendering process.

10 is a view showing a reference rectangle before the substrate is deformed.

11 is a view showing a deformed rectangle after the substrate is deformed.

12 is a diagram showing the correction of the deformed divided area when the scale ratio in the second embodiment is made constant.

(Explanation of Symbols)

10 Drawing device 20 Exposure unit

21 Light source 22 DMD (optical modulation unit)

30 Drawing control unit 30A Control unit

32 System control circuit 34 DMD control section

38 stage position control section 40 alignment mark detection section

42 Data operation unit 43 Data buffer

SW substrate (object to be painted) EA exposure area

X _ij Digital micromirror (optical modulation device)

Y _ij micro spot (exposure spot)

Z0, Z'0 Reference Rectangle

Z, Z 'rectangle (deformed rectangle)

DV0 to DV3 standard division area

DM0 to DM3 modified division area

SM0 to SM3 Modified deformed partitions with a rectangular shape

SM'0 ~ SM'3 rectangle-modified deformed partitions

M0 to M3 Measuring alignment hole (measurement indicator)

PP drawing position

PD 'correction position

X X coordinate Y Y coordinate

The present invention relates to a photomask (reticle) serving as a disk, or a drawing apparatus for forming a pattern such as a circuit pattern directly on a printing substrate or a drawing body such as a silicon wafer. More particularly, the present invention relates to a process for correcting a drawing position in accordance with deformation of a substrate.

In a manufacturing process of a substrate such as a substrate, a drawing process for forming a pattern is performed on a substrate to which a photosensitive material such as a photoresist is applied, and the substrate is subjected to a process such as development processing, etching or plating processing, , A pattern is formed on the drawing body. For example, in an imaging apparatus using an optical modulation unit in which light modulation elements such as LCD, DMD, and SLM (Spatial Light Modulators) are arranged two-dimensionally, an irradiation spot (hereinafter referred to as an exposure region) Is scanned relative to the substrate, and each optical modulation element is controlled at a predetermined timing according to the imaging pattern.

Since the substrate itself is deformed by heat treatment or lamination, a mark for alignment adjustment is made, and the position of pattern drawing is corrected based on the positional mark measured in the state where the substrate is deformed. For example, an alignment mark constituting a rectangle is set at four corners of the substrate, and an offset of the center position due to the substrate deformation and a rotational inclination angle of the drawing area are calculated based on the position of the actually measured alignment mark. Then, the drawing position is corrected based on the calculated data (see Patent Documents 1 and 2).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-300628

[Patent Document 2] Japanese Patent Application Laid-Open No. 2000-122303

Since the deformation state of the substrate is uneven, deformation states such as deformation direction and deformation amount of the substrate are different near the center of the drawing area and other areas, for example, near the boundary. Therefore, when a plurality of drawing patterns of substantially the same size are assigned to the substrate and the drawing position is corrected by a typical correction amount for the entire drawing area, the drawing position is not corrected to an appropriate position, The pattern can not be formed.

The drawing system of the present invention is a drawing system capable of properly correcting the position of drawing data according to deformation of a substrate and capable of maintaining the area shape of each drawing (chamfer) pattern when forming a drawing pattern in a hierarchical manner . The imaging system includes at least one light modulation element for modulating the illumination light from the light source in accordance with the imaging data having the position coordinates based on the coordinate system defined for the light source and the imaging element. For example, the position coordinates of the drawing data having the position coordinate information of the vector data may be corrected, converted into raster data or the like, and the drawing process may be executed. As the optical modulation device, for example, a plurality of optical modulation devices such as a DMD and an LCD may be arranged in a two-dimensionally regular manner.

For the purpose of correction of the imaging position, the positions of the four measurement indices set in the object to be imaged are set so as to form a vertex of a rectangle (hereinafter, referred to as a reference rectangle) on the substrate. The imaging system includes a measurement means capable of measurement in a state in which the imaging object is deformed, correction means for generating imaging data (correction imaging data) in which the position coordinates of the imaging data are corrected, and correction means for generating imaging data based on the correction imaging data And imaging operation means for controlling the optical modulation element.

In the present invention, a plurality of divided regions (hereinafter, referred to as reference divided regions) are defined by dividing the reference rectangle, and four measured measurement indices are set as apexes. (Hereinafter, referred to as a deformed divided area) is defined by dividing a deformed rectangle of a reference rectangle (hereinafter referred to as a deformed rectangle). That is, a plurality of drawing regions are defined for each of the reference rectangle and the deformed rectangle in the entire drawing region of the four measurement indexes. Each of the divided drawing areas becomes a drawing pattern area. Then, the correction means corrects the position coordinates of the drawing data in the reference division area. Further, the correction means corrects the position coordinates of the drawing data so that each deformed divided area is corrected into a rectangular area based on the deformation state from the reference divided area. Here, the deformation state is a deformation amount expressed by the center position, the offset of the center position, the degree of rotation, the scale ratio, and the like with respect to the reference division area. The pattern deviation does not occur even when the pattern is hierarchically formed by the imaging position correction such that the deformed divided imaging area has a rectangular shape. Also, since it is corrected based on the error of each divided area, the local error of the entire drawing area also becomes 1 / n according to the number n of divided areas, thereby improving the accuracy of correction. As a drawing pattern formed in each drawing area, it is only necessary to have the same pattern size to be repeatedly drawn (chamfered), and a correction process is performed for each repeated pattern. In this case, the vector data includes coordinates of the same drawing pattern and information on the interval (pitch) between adjacent patterns.

For example, four vertices of each deformation divided area are virtually set as four deformation dividing indices, and four vertices of the reference divided rectangle are virtually set as four reference division indices, . The correction means may calculate at least one of the offset amount, the rotation amount, and the scale ratio of the center position as the deformation amount, and correct the position coordinates of the drawing data. For example, based on the offset amount of the center position of the deformed divided area with respect to the reference divided area, the rotation angle of the deformed divided area with respect to the reference divided area, and the scale ratio of the deformed divided area with respect to the reference divided area, Correct the coordinates.

There are various methods of capturing the scale ratio. Considering the modification of the deformed divided area into a rectangle, for example, the average of the lengths of the pair of opposing sides of the deformed divided area and the average of the lengths of the pair of corresponding reference divided areas And the ratio of the length of the sides. On the other hand, in the production of a substrate, there is a case where a pattern is formed in a stacked manner by repeating a drawing (exposure) step several times. In this case, since the same pattern is formed overlappingly in the backward stroke, it is desirable to modify the deformed divided region into a rectangle of the same size. For this purpose, the correcting means corrects the position of the drawing data based on the offset amount of the center position of the deformed divided area with respect to the reference divided area, the rotation angle of the deformed divided area with respect to the reference divided area, and the scale ratio of the deformed rectangle to the reference rectangle Correct the coordinates.

The imaging data correcting device of the present invention is characterized in that the imaging data correcting device comprises measurement means capable of measuring the positions of the four measurement indicators provided in advance on the imaging object so as to constitute the apexes of the reference rectangle in a state in which the imaging object is deformed, The position coordinates of the rendering data are corrected in the respective reference division areas based on a plurality of reference division areas and a plurality of rectangular deformed division areas defined by dividing the deformed rectangle having the measured four measurement indices as apexes And correction means for generating correction drawing data, wherein the correction means corrects the position coordinates of the drawing data so that each deformed division region is corrected into a rectangular region based on the amount of deformation from the corresponding reference division region .

The program of the present invention is characterized in that the position of the four measuring indices installed in advance on the object to form the apexes of the reference rectangle is measured by a measuring means capable of measuring in a state in which the object is deformed and a plurality of reference points defined by dividing the reference rectangle The position coordinates of the rendering data are corrected in the respective reference division areas based on the plurality of rectangular deformed division areas that are defined by dividing the deformed rectangle with the apexes of the measured four measurement indexes, And correcting the position coordinates of the drawing data so as to correct each of the deformed divided areas into a rectangular area based on the amount of deformation from the corresponding reference divided area, do.

The imaging data correction method of the present invention is a method of correcting imaging data by measuring the positions of four measurement indicators provided in advance on the imaging object so as to form apexes of the reference rectangle in a state in which the imaging object is deformed, Position coordinates of the rendering data in each of the reference division areas based on a plurality of rectangular deformed division areas that are defined by dividing the deformed rectangle having the measured measurement indexes as the apexes, And corrects the position coordinates of the drawing data so that each deformed divided area is corrected into a rectangular area based on the amount of deformation from the corresponding reference divided area.

The method of manufacturing a substrate of the present invention comprises the steps of: 1) applying a photosensitive material to a blank substrate, 2) performing a drawing process on the coated substrate, 3) performing development processing on the substrate subjected to the drawing process, and 4) A method for manufacturing a substrate which performs etching or plating processing on a processed substrate and which performs a peeling process of a photosensitive material on an etched or plated substrate, characterized in that in the drawing process, the drawing data is corrected by the drawing data correction method .

Best Mode for Carrying Out the Invention [

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a perspective view schematically showing the painting system according to the present embodiment. 2 is a diagram schematically showing an exposure unit provided in the drawing apparatus. Fig. 3 is a view showing relative movement of the exposure area EA, that is, scanning by the exposure area EA.

The painting system has a painting apparatus (10). The drawing apparatus 10 is an apparatus for forming a circuit pattern by irradiating light onto a substrate SW coated with a photosensitive material such as a photoresist and has a gate structure 12 and a base 14. [ An X-Y stage driving mechanism 19 for supporting the X-Y stage 18 is mounted on the base 14 and a substrate SW is mounted on the X-Y stage 18. The gate structure 12 is provided with an exposure unit 20 for forming a circuit pattern on the surface of the substrate SW and the exposure unit 20 operates in accordance with the movement of the XY stage 18. [

The drawing system also includes a drawing control unit 30 that controls the movement of the X-Y stage 18 and the operation of the exposure unit 20. The drawing control unit 30 is composed of a control unit 30A, a keyboard 30B and a monitor 30C, and an operator sets exposure conditions and the like. The substrate SW is, for example, a silicon wafer, a film, a glass substrate, or a copper-plated laminated board, and is mounted on the X-Y stage 18 in the state of blanks in which prebaking treatment, Here, four large-sized photoresists are formed on the surface of the substrate SW.

In the substrate SW, alignment holes AM for aligning the imaging positions are formed at four corners of the substrate SW. The CCD 13 for detecting the position of the alignment hole AM is attached to the gate shaped structure 12 so as to face the substrate SW and the alignment hole AM ). For the substrate SW, mutually orthogonal X-Y coordinate systems are defined, and alignment adjustment is performed based on the X-Y coordinate system. Here, the main scanning direction is the X direction and the sub-scanning q direction is the Y direction.

2, the exposure unit 20 includes a light source 21, a DMD (Digital Micro-mirror Device) 22, an illumination optical system 24 as an optical system for exposure, and an imaging optical system 26 An illumination optical system 24 is disposed between the light source 21 and the DMD 22 and an imaging optical system 26 is disposed between the DMD 22 and the substrate SW. A light source 21 such as a semiconductor laser continuously emits a beam with a constant intensity, and the emitted light is led to the illumination optical system 24. [ The illumination optical system 24 is composed of a diffuser plate 24A and a collimator lens 24B and is formed into light consisting of a light flux that entirely illuminates the DMD 22 when the beam LB passes through the illumination optical system 24 . A plurality of DMDs are arranged along the main scanning direction (X direction) as well as the DMD 22 shown in Fig. 2, and a beam emitted from the light source 22 is transmitted to each DMD through an optical fiber .

The DMD 22 is a light modulation unit in which minute micromirrors in micrometer (탆) are arranged in a matrix, and each micromirror rotates by electrostatic interaction. In the present embodiment, the DMD 22 is constituted by arranging M × N micromirrors in a matrix form. In the following description, the micromirrors corresponding to the positions of the array (i, j) are denoted by "X _ij " M, 1? J? N). For example, the DMD 22 is constituted by a micro mirror of 1024 x 768.

The micromirror X _ij has a first posture in which the beam LB from the light source 21 is reflected in the direction of the exposure surface SU of the substrate SW and a second posture in which the beam LB is reflected in a direction outside the exposure surface SU Position, and the posture is switched in accordance with the control signal from the control unit 30A. When the micro mirror (X _ij ) is positioned in the first posture, the light reflected on the micromirror (X _ij ) is directed in the direction of the imaging optical system (26). The imaging optical system 26 shown schematically is composed of two convex lenses and a reflector lens (not shown), and light passing through the imaging optical system 26 is incident on the surface of the exposure surface SU on which the photoresist layer is formed The predetermined area is inspected.

On the other hand, when the micromirror X _ij is positioned in the second posture, the light reflected by the micromirror X _ij is guided in the direction of a light absorption plate (not shown) It does not. Hereinafter, the state in which the micromirror X _ij is supported in the first posture is referred to as the ON state, and the state in which the micro mirror X _ij is supported in the second posture is defined as the OFF state.

The size (width, height) of the irradiation spot Y _ij by one micromirror X _ij is determined by the size of the micromirror X _ij and the size Match. When the height corresponding to the sub-scan direction (Y direction) of the micro mirror (X _ij ) is represented by h and the width corresponding to the scan direction (X direction) is represented by 1, an irradiation spot having a size of 1 x h Spot "). The micromirror X _ij has a square shape (h = 1), and the size of the micromirror X _ij is very small with respect to the line width of the pattern, and the length of one piece is determined to be several micrometers to several tens micrometers.

The size of the DMD 22 is determined in accordance with the display standard of the television, and the direction corresponding to the main scanning direction of the DMD 22 is defined as the transverse direction, the direction corresponding to the sub-scanning direction is defined as the longitudinal direction, The aspect ratio (lateral width ratio W: K) of the DMD 22 is set to 3: 4 by expressing the height (length) and height (longitudinal length)

When all of the micromirrors are in the ON state with the X-Y stage 18 stopped, a spot EA having a predetermined size is irradiated on the exposure surface SU (hereinafter, this spot region is referred to as an exposure region). Since the magnification of the imaging optical system 26 is 1, the relationship of D x R = K x W (= (M x h) x (N x 1)) is established.

In the DMD 22, since the micromirrors X _ij are individually controlled to be ON / OFF, the light irradiated to the entire DMD 22 becomes light composed of the light flux of the light selectively reflected by each micromirror. As a result, light in accordance with the circuit pattern to be formed is irradiated to an arbitrary area Ew where the exposure area EA is located on the exposure surface SU. The XY stage 18 moves at a constant speed in accordance with the raster scanning so that the exposure area EA moves on the exposure surface SU at a relatively constant speed along the main scanning direction , A circuit pattern is formed along the main scanning direction (X direction).

While the XY stage 18 is moving at a constant speed, the exposure operation is performed so as to displace, that is, overlapping, the irradiation position (Y _ij ) of the micro spot. That is, ON switching control of the micro mirror (X _ij ) for starting the projection of the repeated light at a predetermined exposure operation time interval (exposure period) is executed, and at the same time, the digital micromirrors arranged in the X- The scanning speed and the interval during the exposure operation are set so that the positions of the microspots to be sequentially irradiated overlap (overlap). Here, the exposure operation is performed at a time interval shorter than the time taken for the exposure area EA to move over the section 1 along the width 1 of the micro spot (Y _ij ) of the micro mirror (X _ij ).

By the timing control of the exposure operation, the operation of the exposure area is repeatedly performed each time the exposure area EA advances by a distance d (<1) while the substrate SW relatively moves at a constant speed. The micromirror is controlled such that the time during which the ON state of each micromirror continues in one exposure operation becomes shorter than the time required for the exposure area EA to travel by the distance d. Here, the micromirrors are kept in the ON state for the time the exposure area EA advances by the distance Ld (<d), and while the exposure area EA moves the remaining distance, the micromirrors are turned OFF have.

When the scanning is completed along one scanning band SB, the X-Y stage 18 moves by the distance D in the Y direction (sub scanning direction), and the next scanning band moves relative to the scanning band (see FIG. 3). When all the scan bands are scanned while the exposure area EA reciprocates, the drawing process ends. After the rendering process, developing process, etching or plating, resist stripping process, and the like are performed to produce a substrate having a circuit pattern formed thereon.

4 is a block diagram of the imaging system.

The control unit 30A of the drawing control unit 30 includes a system control circuit 32, a DMD control unit 34, a stage position control unit 38, an alignment mark detection unit 40, a data operation unit 42, a light source control unit 44 And a system control circuit 32 including a CPU, a RAM and a ROM controls the entire drawing apparatus 10 and supplies a control signal to the light source control unit 44 so as to emit light from the light source 21 And also outputs a control signal for controlling the exposure timing to the DMD control unit 34. [ The DMD control unit 34 controls the DMD 22 in accordance with the rendering program stored in advance in the ROM.

The circuit pattern data is input as a vector data (CAM data) from the work station (not shown) to the data input section 41 of the control unit 30A and is temporarily stored in the data buffer 43 which is a memory. When the pattern data is sent to the data operation unit 42, the vector data is converted into raster data in accordance with the raster scan, and is sent to the DMD control unit 34. The vector data is data having position coordinate information of the drawing pattern and has data of position coordinates based on the X-Y coordinate system. Raster data is binarized data indicating ON / OFF of a micromirror and is displayed as a two-dimensional dot pattern of a circuit pattern.

In the DMD control unit 34, the raster data is sequentially read at a predetermined timing in accordance with the relative position of the exposure area EA. That is, a control signal for ON / OFF control of the micromirror is output to the DMD 22 based on the read-out two-dimensional dot data and relative position information of the exposure area EA sent from the stage position control unit 38. The stage position control section 38 controls the XY stage drive mechanism 19 having a motor (not shown), whereby the moving speed of the XY stage 18 and the like are controlled. The stage position control section 38 detects the relative position of the exposure area EA with respect to the X-Y stage 18. [

The position information of the alignment hole AM is detected by transmitting the detection signal of the alignment hole AM read from the CCD 13 to the alignment mark detection section 40 and the position information of the alignment hole AM is detected by the data buffer 43 To the data operation unit 42. [ The data computing unit 42 corrects the position coordinates of the vector data based on the position information of the alignment hole AM, and raster data is generated based on the corrected vector data.

Fig. 5 is a diagram showing the entire drawing area as a reference and the modified drawing area. 6 is a diagram showing a divided area in which the entire drawing area as a reference is divided and a divided area of the modified drawing area. Figs. 7 and 8 are views showing deformed divided regions corrected in a rectangular shape. The process of correcting the drawing position will be described with reference to Figs. 5 to 8. Fig.

The four alignment holes HO to H3 are positioned so as to form the vertex of the rectangle Z0 (reference rectangle) parallel to the XY coordinate system when the alignment holes are formed in the entire one drawing region of the substrate SW . Here, the rectangle Z0 is indicated by a broken line.

When the substrate SW coated with the photoresist is placed on the XY table 18 and the drawing process is performed, the substrate SW is deformed due to heat or the like, and the positions of the alignment holes H0 to H3 are deviated. Here, the alignment holes (hereinafter referred to as measurement alignment holes) after the deformation seen from the XY coordinate system (hereinafter referred to as measurement alignment holes) are denoted by reference numerals M0 to M3 and the rectangles Z (Deformed rectangle) is shown by a solid line. However, in FIG. 5, the deformed state is exaggerated to simplify the explanation, and the actual deformation amount is small.

6, in order to form a plurality of drawing patterns on the substrate SW, the reference rectangle Z0 is evenly divided into 2 × 2, and four drawing regions DV0 to DV3 Quot; divided area &quot;). The size of the reference division area, which is a rectangle, corresponds to the size of the rendering pattern, and the data of the position coordinates of the four vertices of each area is input as the CAM data together with the vector data. In Fig. 6, the vertices PD0 to PD3 of the reference division area DV0 are shown.

On the other hand, for the deformed rectangle Z after the substrate is deformed, each deformed reference division region is determined based on the position coordinates of the measurement alignment holes M0 to M3. Four drawing areas DM0 to DM3 (hereinafter referred to as a deformed divided area) are defined by straight lines connecting the middle points of the sides of the deformed rectangle Z. [ In Fig. 6, the position, shape, and size of the deformation drawing areas DM0 to DM3 do not coincide with the reference drawing areas DV0 to DV3. Here, the apexes of the deformation drawing area DM0 are denoted by "PM0 to PM3".

In the present embodiment, the coordinate position of the rendering data is corrected for each reference division region. The correction amount of the coordinate position is calculated by comparing the reference divided region to which the coordinate position belongs and the deformed divided region corresponding to the reference divided region. Specifically, the offset of the center position of the deformed division area with respect to the center position of the reference division area, the rotation angle of the deformed division area with respect to the reference division area, and the scale ratio of the modified division area with respect to the reference division area are calculated, Is corrected on the basis of the obtained offset amounts, rotation angles, and scale ratios, respectively.

According to this correction, each deformation divided area is modified into a rectangular (rectangular) area corresponding to the degree of deformation of the place. For example, when a pair of opposing sides of each deformation drawing area is not parallel, the representative length of the drawing area is defined along the sides of the deformation drawing area do. Since each drawing position is corrected to a predetermined scale ratio calculated, when the drawing position is set in the entire reference drawing area, the modification drawing area is corrected to a rectangle.

7, an average value of the respective lengths of the pair of sides MT1 and MT2 with respect to the opposite sides of the modified divisional area DM0 is defined as the average value of the lengths of the modified divided area distance M0 along the sides DT1 and DT2 (Size), and the ratio of the length of the corresponding side DT1 (DT2) of the reference division area DV0 to the scale ratio. Likewise, the ratio of the average of the lengths of the pair of sides MT3 and MT4 opposed to the deformed divided area DM0 to the length of the corresponding side DT3 (DT4) of the reference divided area DV0 is set as a scale ratio . Then, the drawing position PP is corrected to the drawing position PP 'based on the offset amount, the rotation angle, and the scale ratio. When all the drawing positions in the reference division area DV0 are corrected, the deformed division area DM0 is converted to the coordinate position within the rectangular area SM0 (indicated by one-dot chain line).

This correction of the drawing position is also performed for the drawing position in the other deformed division areas DM1, DM2, and DM3. In Fig. 8, rectangle regions SM0 to SM3 in which the deformed division areas DM0 to DM3 are modified are shown.

9 is a flowchart of the rendering process. 10 is a view showing a reference rectangle before the substrate is deformed. 11 is a view showing a deformed rectangle after the substrate is deformed.

In step S101, vector data, which is rendering data, is transmitted from the workstation or the like to the rendering system 30, and is temporarily stored in the data buffer 43. [ Here, in addition to the vector data, the position data and the size information of the division drawing area are included. Specifically, the position coordinates of the four vertexes of the reference division area are input. In step S102, the position coordinate of the measured alignment hole is detected by the alignment mark detecting unit 40. [ Then, in step S103, the position coordinates of the apexes of the deformed division areas are calculated based on the position coordinates of the measured alignment holes.

10 _{shows,, A1 (ax 1, ay} 1), A2 (ax 2, ay 2), A3 (ax 3 position coordinate A0 (ax _0, ay ₀₎ of the alignment holes of the reference rectangle (N0) that is set in advance , ay ₃ ), four divided position coordinates B00 (bx ₀₀ , by ₀₀ ) and B01 (bx ₀₁ ) constituting the vertices of one reference division area NV0 among the reference division areas defined by dividing the reference rectangle by 2x2 , by ₀₁ ), B02 (bx ₀₂ , by ₀₂ ), and B03 (bx ₀₃ , by ₀₃ ).

On the other hand, FIG. 11, the position coordinates of the alignment hole in the measurement of strain rectangular _{(N) C0 (cx 0,} cy 0), C1 (cx 1, cy 1), C2 (cx 2, cy 2), C3 (cx 3 , cy ₃ ), four divided position coordinates D00 (dx ₀₀ , dy ₀₀ ), D01 (dx ₀₀ , dy ₀₀ ) which form the vertices of one deformation divided area MV0 among the deformation divided areas defined by dividing the deformed rectangle by 2x2, (dx ₀₁ , dy ₀₁ ), D02 (dx ₀₂ , dy ₀₂ ), and D03 (dx ₀₃ , dy ₀₃ ).

The position coordinates of each reference division area are included in the vector data in advance. On the other hand, the four position coordinates constituting the vertices of each deformation divided area are obtained based on the position coordinates C0 to C3 of the measured alignment holes. The four position coordinates constituting the apexes of one deformation divided area MV0 are obtained by the following equations.

When step S103 is executed, the process proceeds to step S104.

In step S104, it is determined which reference division area the position coordinates of the drawing data belongs to, and the position coordinates of the drawing data are corrected based on the scale ratio, the offset amount, and the rotation angle calculated for the reference division area to which they belong. Then, the corrected drawing data is stored in the data buffer 43.

The scale ratio of the deformed division area MV0 shown in Fig. 11 is obtained by the following expression. and scx represents the length of the modified divided area MV0 along the X direction and represents the average of a pair of opposing sides Q1 and Q2. Similarly, scy represents the average length of the modified division area MV0 along the Y direction.

only,

only,

Next, the offset amount is obtained by the following equation. Where offx and offy represent the offset amounts of the center positions of the deformed division areas MV0.

only,

only,

Then, the rotation angle is obtained by the following expression. Here, th represents the rotation angle.

only,

With respect to the vector data correction processing, first, the viewpoint coordinates are corrected by the offset amounts offx and offy with respect to the vector data having the coordinate information of the viewpoint and the end point. The coordinates of the new end point are temporarily obtained so that the length in the X and Y axis directions with respect to the new end point becomes the length multiplied by the original scales scx and scy, respectively, with reference to the corrected point in time. The end point is finally obtained as if the corrected vector data consisting of the temporary point and the end point is rotated by the rotation angle th with respect to the original vector data.

This position correction of the rendering data is performed for each rendering data. Then, in step S105, raster data is generated based on the corrected vector data, and the DMD 22 is ON / OFF controlled based on the raster data.

As described above, according to the present embodiment, the reference division areas DV0 to DV3 defined by dividing the preset reference rectangle Z0 into 2 占 divisions and the deformations defined by the four aligned alignment holes M0 to M3 The offset amount, the rotation angle, and the scale ratio of each divided area are calculated based on the modified divisional areas DM0 to DM3 defined by dividing the rectangle Z by 2 占. Then, the drawing data belonging to the reference division area is corrected based on the offset amount, the rotation angle, and the scale ratio, and correction such as correcting the modified division area to a rectangle is performed. A drawing area composed of four alignments is divided and a drawing position is corrected on the basis of a misalignment distributed by a divided amount in order to perform a correction process in each drawing area, and a fine correction is performed. Further, since the drawing position is corrected in a state in which the rectangle is maintained, it can also be used in a substrate manufacturing process in which a pattern is repeated hierarchically.

Next, a second embodiment will be described. In the second embodiment, the scale ratio is calculated from the deformation state of the entire substrate, and the size of each drawing pattern is made the same. Other configurations are substantially the same as those of the first embodiment.

12 is a diagram showing the correction of the deformed divided area when the scale ratio is made constant.

The positional coordinates of the four measurement alignment holes M'0 to M3 constituting the apex of the deformed rectangle Z 'are measured by the substrate deformation with respect to the reference rectangle Z'0 set on the substrate SW in advance . The deformed rectangle Z 'is divided into four to define a deformed divided area (not shown), and the offset of the drawing position (not shown) based on the reference divided area (not shown) obtained by dividing the reference rectangle Z'0 into four Amount, rotation angle, and scale ratio are calculated.

With respect to the offset amount and the rotation angle, the offset amount and the rotation angle with respect to the center position of each deformation divided area are calculated as in the first embodiment. On the other hand, regarding the scale ratio, the scale ratio of the deformed rectangle Z 'to the reference rectangle Z'0 is calculated rather than the scale ratio of each of the four divided regions. More specifically, it is determined from the positional coordinates of the four vertexes HO to H3 of the reference rectangle Z'0 and the measured alignment holes M0 to M3. As a result, four rectangular divided areas SM'0 to SM'3 are formed. Since the same scale ratio is used for each of the divided areas, the imaging pattern of the same size can be hierarchically formed.

Correction may be performed based on imaging data other than the vector data. An optical modulation element such as an LCD other than the DMD may be applied. Furthermore, the present invention may be applied to an imaging apparatus for scanning a laser beam with an optical modulation element such as an AOM. The process of modifying the divided area into a rectangular shape may be performed by a parameter other than the scale ratio, the offset amount, and the rotation angle.

According to the present invention, a drawing position can be appropriately corrected in accordance with deformation of a drawing object such as a substrate, a drawing pattern can be formed with high accuracy while being compatible with various manufacturing steps.

Claims (12)

A light source, At least one light modulation element for modulating illumination light from the light source in accordance with imaging data having positional coordinates based on a coordinate system defined for the imaging element, Measuring means for measuring the position of the four measuring indices installed in advance in the drawing body so as to constitute the apexes of the reference rectangle in a state in which the drawing body is deformed; A plurality of deformed segments of a rectangular shape defined by a plurality of reference division regions defined by uniformly dividing the reference rectangle into four segments and a straight line connecting the middle points of the respective sides of the deformed rectangle having the measured measurement indexes as the apexes, Correction means for correcting the position coordinates of the rendering data for each reference division region and generating correction drawing data based on the area, And imaging operation means for controlling the light modulation element so as to form a drawing pattern based on the correction drawing data, The correction means calculates the amount of deformation from the corresponding reference division region corresponding to each deformed division region and corrects the drawing position based on the amount of deformation corresponding to the reference division region to which the drawing data belongs, And corrects the position coordinates of the rendering data. The apparatus according to claim 1, wherein the correction means virtually sets the four vertexes of each deformation divided area as four deformation dividing indices, and simultaneously, the four vertices of the reference divided area are assumed to be four And corrects the position coordinates of the rendering data based on the four transform division indices and the four reference division indices. The imaging system according to claim 1, wherein the correction means calculates at least one of an offset amount, a rotation angle, and a scale ratio of the center position as the deformation amount, and corrects the position coordinates of the drawing data. 4. The system of claim 3, wherein the scale ratio is a ratio of an average length of a pair of opposite sides of the deformed divided area to a length of a pair of sides of the corresponding reference divided area. 4. The apparatus according to claim 3, wherein the correction means corrects the offset amount of the center position of the deformed division region with respect to the reference division region, the rotation angle of the deformed division region with respect to the reference division region, And corrects the position coordinates of the painting data based on the scale ratio of the divided area. 4. The apparatus according to claim 3, wherein the correction means corrects the amount of offset of the center position of the deformed divided region with respect to the reference divided region, the rotational angle of the deformed divided region with respect to the reference divided region, The position coordinates of the drawing data are corrected based on the scale ratio of the drawing data. 2. The imaging system according to claim 1, wherein the light modulation element is composed of a plurality of light modulation elements arranged in a regular two-dimensionally manner. The drawing system according to claim 1, wherein the drawing data is vector data. Measuring means for measuring the position of the four measuring indices installed in advance on the object to form the apexes of the reference rectangle in a state in which the object is deformed; A plurality of rectangular deformed division regions defined by straight lines connecting the plurality of reference division regions defined by uniformly dividing the reference rectangle into four and a middle point of each side of the deformed rectangle having the measured measurement indexes as the apexes, And correction means for correcting the position coordinates of the rendering data for each reference division region and generating correction drawing data, The correction means calculates the amount of deformation from the corresponding reference division region corresponding to each deformed division region and corrects the drawing position based on the amount of deformation corresponding to the reference division region to which the drawing data belongs, And corrects the position coordinates of the drawing data. A computer-readable recording medium having recorded thereon a computer program, Computer program code for measuring the positions of four measurement indices installed in advance on the object to form apexes of the reference rectangle in a state in which the object is deformed; A plurality of deformed segments of a rectangular shape defined by a plurality of reference division regions defined by uniformly dividing the reference rectangle into four segments and a straight line connecting the middle points of the respective sides of the deformed rectangle having the measured measurement indexes as the apexes, Computer program code for correcting the positional coordinates of the drawing data for each reference division area and generating correction drawing data based on the area; And The amount of deformation from the corresponding reference division area is calculated for each deformation division area, and the amount of deformation of the drawing data is calculated based on the deformation amount corresponding to the reference division area to which the drawing data belongs so that the drawing position is corrected while each reference division area is maintained in a rectangular shape. Computer program code for correcting position coordinates; Readable recording medium. The positions of the four measurement indices installed in advance on the image writing body so as to form the apexes of the reference rectangle are measured in a state in which the image writing body is deformed, A plurality of deformed segments of a rectangular shape defined by a plurality of reference division regions defined by uniformly dividing the reference rectangle into four segments and a straight line connecting the middle points of the respective sides of the deformed rectangle having the measured measurement indexes as the apexes, The position coordinates of the rendering data are corrected for each reference division region, the correction drawing data is generated, The amount of deformation from the corresponding reference division area is calculated for each deformation division area, and the amount of deformation of the drawing data is calculated based on the deformation amount corresponding to the reference division area to which the drawing data belongs so that the drawing position is corrected while each reference division area is maintained in a rectangular shape. And correcting the position coordinate. 1) A photosensitive material is applied to a substrate which is a blank, 2) The imaging process is performed on the coated substrate, 3) The substrate subjected to the imaging process is subjected to development processing, 4) The developed substrate is etched or plated, 5) A method of manufacturing a substrate for performing a peeling treatment of a photosensitive material on a substrate subjected to etching or plating, Wherein the drawing data is corrected by the drawing data correction method according to claim 11 in the drawing operation.

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