KR20070122371A - Pattern forming system - Google Patents

Abstract

A drawing system is provided to correct drawing positions properly when a substrate is deformed, cope with various production processes, and to form a drawing pattern with good accuracy. A drawing system includes: a light source; at least one optical modulator which modulates an illumination light from the light source according to drawing data having position coordinates based on a coordinate system prescribed to a substrate; a measuring unit which measures the positions of four indices with the substrate deformed, wherein the four indices are preset on the substrate to constitute fixed points of a reference rectangle(Z0); a correction unit which corrects the position coordinates of the drawing data in each reference division region, based on many reference division regions(DV0-DV3) and many deformed division regions(DM0-DM3), wherein the reference division regions are prescribed by dividing the reference rectangle, and the deformed division regions with rectangular shape are prescribed by dividing a deformed rectangle(Z) that uses the measured four indices as fixed points; and a drawing processor which controls the optical modulators so as to form a drawing pattern based on the corrected drawing data. The correction unit corrects the position coordinates of the drawing data so as to modify each deformed division region into the rectangular region based on the amount deviated from the corresponding reference division region.

Description

Drawing system {PATTERN FORMING SYSTEM}

FIG. 1: is a perspective view which shows typically the drawing system which is 1st Embodiment.

It is a figure which shows typically the exposure unit provided in the drawing apparatus.

3 is a view showing relative movement of the exposure area, that is, scanning by the exposure area.

4 is a block diagram of a drawing system.

FIG. 5 is a view showing the entire drawing region and the modified drawing region as reference.

FIG. 6 is a diagram showing a divided area obtained by dividing the entire drawing area as a reference and a divided area of the modified drawing area.

FIG. 7 is a diagram illustrating a modified divided region corrected to a rectangular shape. FIG.

8 is a diagram illustrating a modified divided region corrected to a rectangular shape.

9 is a flowchart of a drawing process.

10 is a diagram showing a reference rectangle before substrate deformation.

11 is a diagram illustrating a deformation rectangle after deformation of the substrate.

It is a figure which shows correction | amendment of the deformation | transformation division area | region when the scale ratio in 2nd Embodiment is made constant.

(Explanation of the sign)

10 drawing device 20 exposure unit

21 Light Source 22 DMD (Light Modulation Unit)

30 drawing control unit 30A control unit

32 System Control Circuit 34 DMD Control Unit

38 Stage position controller 40 Alignment mark detector

42 Data calculation section 43 Data buffer

SW Substrate (Subject) EA Exposure Area

X _ij Digital Micro Mirror (Optical Modulator)

Y _ij micro spot (exposure spot)

Z0, Z'0 reference rectangle

Z, Z 'rectangle (deformation rectangle)

DV0 to DV3 reference partition

DM0 to DM3 variant partitions

Deformation Partition Modified to SM0 to SM3 Rectangular Shapes

SM'0 to SM'3 Modified partition area modified to rectangular shape

M0 to M3 measurement alignment holes (measurement index)

PP drawing position

PD 'calibration position

X X coordinate Y Y coordinate

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a drawing apparatus for forming a pattern such as a circuit pattern on a photomask (reticle) serving as an original or directly on a subject such as a printed board or a silicon wafer. In particular, it is related with the process which correct | amends a drawing position according to deformation | transformation of a board | substrate.

In the manufacturing process of a to-be-photographed object, such as a board | substrate, the drawing process for pattern formation is performed with respect to the to-be-painted object which apply | coated photosensitive materials, such as a photoresist, and is subjected to processes, such as a development process, an etching or plating process, and resist peeling. The pattern is formed on the object to be rendered. For example, in a drawing apparatus using an optical modulation unit in which optical modulation elements such as LCD, DMD, and SLM (Spatial Light Modulators) are two-dimensionally arranged, an irradiation spot by the light modulation unit (hereinafter referred to as an exposure area) Is scanned relative to the substrate, and each light modulation element is controlled at a predetermined timing in accordance with the drawing pattern.

Since the substrate itself is deformed by heat treatment and lamination, a mark for alignment adjustment is made, and the drawing position of the pattern is corrected based on the positioning mark measured in the state where the substrate is deformed. For example, an alignment mark constituting a rectangle is set at four corners of the substrate, and the offset of the center position due to substrate deformation, the rotational inclination angle of the drawing region, and the like are calculated based on the position of the alignment mark actually measured. And a drawing position is correct | amended based on the calculated data (refer patent document 1, 2).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-300628

[Patent Document 2] Japanese Patent Application Laid-Open No. 2000-122303

Since the deformation state of a board | substrate is nonuniform, deformation states, such as a deformation direction of a board | substrate, a deformation amount, etc. differ in the vicinity of the center of a drawing area | region, and other than that, for example, a boundary. Therefore, in the case where a plurality of drawing patterns of approximately the same size are allocated to a substrate (multiple drawing), the drawing position is corrected by a typical correction amount for the entire drawing region, and the drawing position is not corrected to an appropriate position, and the accuracy is high. You cannot form a pattern.

The drawing system of the present invention is a drawing system capable of appropriately correcting the position of drawing data according to deformation of a substrate and maintaining the area shape of each drawing (chamfering) pattern when forming a drawing pattern hierarchically. . The drawing system includes at least one light modulator that modulates the illumination light from the light source in accordance with the drawing data having a position coordinate based on the light source and the coordinate system defined for the object to be rendered. For example, the positional coordinates of the drawing data having the positional coordinate information of the vector data may be corrected, converted into raster data or the like, and the drawing process may be executed. Moreover, what is necessary is just to comprise several optical modulation elements, such as DMD and LCD, and arrange | positioning regularly two-dimensionally as an optical modulation element.

For drawing position correction, the positions of the four measurement indices set on the drawing body are set to form a vertex of a rectangle (hereinafter referred to as a reference rectangle) on the substrate. The drawing system is configured to form a drawing pattern based on measurement means that can be measured in a state where the object is deformed, correction means for generating drawing data (correction drawing data) correcting the position coordinates of the drawing data, and correction drawing data. And drawing processing means for controlling the light modulation element.

In the present invention, a plurality of divided regions (hereinafter referred to as reference divided regions) are defined by dividing the reference rectangle, and four measured indexes for measurement are taken as vertices. By dividing the deformed rectangle of the reference rectangle (hereinafter referred to as a deformed rectangle), a plurality of rectangular divided areas (hereinafter referred to as deformed divided areas) are defined. That is, a plurality of drawing areas are defined for each of the reference rectangle and the deformation rectangle in the overall drawing areas of the four-point measurement indicators. Each of these divided drawing regions becomes a drawing pattern region. And the correction means correct | amends the position coordinate of the drawing data in that area | region in each reference division area. Further, the correction means corrects the position coordinates of the drawing data so as to correct each deformation division region into a rectangular region based on the deformation state from the reference division region. The deformation state here is a deformation amount expressed by the center position, the offset of the center position, the degree of rotation, the scale ratio and the like with respect to the reference divided region. Even when a pattern is formed hierarchically by drawing position correction such as making the deformed divided drawing region into a rectangular shape, pattern deviation does not occur. In addition, since it is corrected based on the error of each divided area, the local error amount of the entire drawing area is also 1 / n depending on the number n of divided areas, and the accuracy of correction is improved. As a drawing pattern formed in each drawing area, what is necessary is just the same pattern size repeated drawing (chamfered), and a correction process is performed for every repeating pattern. In this case, the vector data includes the arrangement coordinates of the same drawing pattern and information on the interval (pitch) between adjacent patterns.

For example, four vertices of each deformation division are virtually set as four indexes for deformation division, at the same time, four vertices of the reference division rectangle are virtually set as four reference division indices, and drawing data is set. Correct. The correction means may calculate at least one of the offset amount, rotation amount, and scale ratio of the center position as the deformation amount, and corrects the position coordinates of the drawing data. For example, the position of the drawing data based on the offset amount of the center position of the strain division with respect to the reference division, the rotation angle of the deformation division with respect to the reference division, and the scale ratio of the deformation division with respect to the reference division. Correct the coordinates.

Although there are various ways to set the scale ratio, it is conceivable to modify the deformation division into a rectangle, for example, the average of the lengths of the pair of sides facing each other of the deformation division and the pair of the corresponding reference divisions. It is good to obtain by ratio of side length. On the other hand, in manufacture of a board | substrate, a drawing (exposure) stroke may be repeated several times, and a pattern may be formed laminated | stacked. In this case, since the same pattern is superimposed also in a back stroke, it is preferable to modify the deformation | transformation division area | region into the rectangle of the same size. To that end, the correction means positions the drawing data based on the offset amount of the center position of the deformation division region with respect to the reference division area, the rotation angle of the deformation division region with respect to the reference division area, and the scale ratio of the deformation rectangle with respect to the reference rectangle. Correct the coordinates.

The drawing data correction device of the present invention is defined by dividing the measurement means capable of measuring the positions of four measurement indices pre-installed on the drawing object in a state where the drawing object is deformed so as to form a vertex of the reference rectangle, and dividing the reference rectangle. The position coordinates of the drawing data are corrected in each reference division region based on the plurality of reference division regions and the plurality of deformation division regions having a rectangular shape defined by dividing the deformation rectangles with the measured four measurement indexes as the vertices. And correction means for generating correction drawing data, wherein the correction means corrects the position coordinates of the drawing data so that each deformation division region is corrected into a rectangular region based on the deformation amount from the corresponding reference division region. .

The program of the present invention comprises a plurality of criteria defined by dividing the position of four measurement indices pre-installed in the subject to be measured so as to form a vertex of the reference rectangle, by dividing the measurement means and the reference rectangle. The position coordinates of the drawing data are corrected in each reference division region based on a plurality of rectangular division regions, which are defined by dividing the division region and the deformation rectangles having the measured four measurement indexes as vertices, and correcting the drawing. Function correction means for generating data, and correcting means for correcting the positional coordinates of the drawing data to correct each deformation division area into a rectangular area based on the deformation amount from the corresponding reference division area. do.

The drawing data correction method of the present invention measures a plurality of reference divisions defined by dividing the reference rectangle by measuring the positions of four measurement indices pre-installed in the drawing object so as to form a vertex of the reference rectangle, and dividing the reference rectangle. The position coordinates of the drawing data are corrected in each reference division area based on a plurality of rectangular shape division areas defined by dividing the area and the deformation rectangle having the measured four measurement indexes as vertices, and corrected drawing data. Is generated, and the position coordinates of the drawing data are corrected to correct each deformation division region into a rectangular region based on the deformation amount from the corresponding reference division region.

In the method for manufacturing a substrate of the present invention, 1) a photosensitive material is applied to a blank substrate, 2) a drawing process is performed on the applied substrate, 3) a developing process is performed on the drawn substrate, and 4) a development is performed. 5) A method of manufacturing a substrate which is subjected to an etching or plating process on a treated substrate and 5) a peeling process of a photosensitive material on the substrate which has been etched or plated, wherein in the drawing process, the drawing data is corrected by the drawing data correction method. Characterized in that.

(The best form to carry out invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

1: is a perspective view which shows typically the drawing system which is this embodiment. It is a figure which shows typically the exposure unit provided in the drawing apparatus. 3 is a view showing relative movement of the exposure area EA, that is, scanning by the exposure area EA.

The drawing system includes the drawing device 10. The drawing apparatus 10 is a device which forms a circuit pattern by irradiating light to the board | substrate SW which apply | coated the photosensitive material, such as photoresist, on the surface, and is provided with the gate-shaped structure 12 and the base 14. As shown in FIG. The base 14 is mounted with an X-Y stage driving mechanism 19 for supporting the X-Y stage 18, and a substrate SW is provided on the X-Y stage 18. The gate unit structure 12 is provided with an exposure unit 20 for forming a circuit pattern on the surface of the substrate SW, and the exposure unit 20 operates in accordance with the movement of the X-Y stage 18.

Moreover, the drawing system is provided with the drawing control part 30 which controls the movement of the X-Y stage 18, and the operation of the exposure unit 20. FIG. The drawing control part 30 is comprised by the control unit 30A, the keyboard 30B, and the monitor 30C, and an operator sets exposure conditions etc .. FIG. The board | substrate SW is a silicon wafer, a film, a glass substrate, or a copper clad laminated board, for example, and is mounted in the X-Y stage 18 in the state of the blanks which processed, such as a prebaking process and application | coating of a photoresist. Here, a negative photoresist is formed on the surface of the board | substrate SW.

In the board | substrate SW, the alignment hole AM for alignment adjustment of a drawing position is formed in four corners of the board | substrate SW. A CCD 13 for detecting the position of the alignment hole AM is attached to the gate-shaped structure 12 so as to face the direction of the substrate SW, and the alignment hole AM is moved in accordance with the movement of the XY stage 18. ). About the board | substrate SW, the X-Y coordinate system orthogonal to each other is prescribed | regulated, and alignment adjustment is performed based on an X-Y coordinate system. Here, the main scanning direction is the X direction and the sub scanning q direction is the Y direction.

As shown in FIG. 2, the exposure unit 20 includes a light source 21, a DMD (Digital Micro-mirror Device) 22, and an illumination optical system 24 and an imaging optical system 26 as optical systems for exposure. The illumination optical system 24 is disposed between the light source 21 and the DMD 22, and the imaging optical system 26 is disposed between the DMD 22 and the substrate SW. A light source 21 such as a semiconductor laser continuously emits a beam at a constant intensity, and the emitted light is directed to the illumination optical system 24. The illumination optical system 24 is composed of a diffuser plate 24A and a collimator lens 24B. When the beam LB passes through the illumination optical system 24, the illumination optical system 24 is formed into light composed of a light beam that illuminates the DMD 22 as a whole. . In addition to the DMD 22 shown in FIG. 2, a plurality of DMDs are arranged along the main scanning direction (X direction), and the beams radiated from the light source 22 are transmitted through optical fibers (not shown) to each DMD. Delivered.

The DMD 22 is a light modulation unit in which micromirrors in micrometer (µm) units are arranged in a matrix, and each micromirror is rotated and changed by an electrostatic field action. In the present embodiment, the DMD 22 is configured by arranging M × N micromirrors in a matrix, and hereinafter, the micromirrors according to the positions of the arrays i and j are referred to as "X _ij " (1≤i≤). M, 1 ≦ j ≦ N). For example, the DMD 22 is formed of a micro mirror of 1024x768.

The micromirror X _ij has a first posture for reflecting the beam LB from the light source 21 in the direction of the exposure surface SU of the substrate SW, and a second for reflecting in the direction outside the exposure surface SU. It is positioned in one of the postures, and the posture is switched in accordance with the control signal from the control unit 30A. When the micro mirror X _ij is positioned in the first posture, the light reflected on the micro mirror X _ij is guided in the direction of the imaging optical system 26. The imaging optical system 26 schematically shown is composed of two convex lenses and a reflector lens (not shown), and the light passing through the imaging optical system 26 is formed on the exposure surface SU on which the photoresist layer is formed. The predetermined area is examined.

On the other hand, when the micromirror X _ij is positioned in the second posture, the light reflected from the micromirror X _ij is guided in the direction of the light absorption plate (not shown), and the light is irradiated onto the exposure surface SU. It doesn't work. Hereinafter, the state in which the micromirror X _ij is supported in the first posture is set to the ON state, and the state in which the micromirror X _ij is supported in the second posture is set to the OFF state.

Since the magnification of the imaging optical system 26 is set to 1 time here, the size (width and height) of the irradiation spot Y _ij by one micromirror X _ij is equal to the size of the micromirror X _ij . Matches. When the height corresponding to the sub-scanning direction (Y direction) of the micromirror X _ij is h and the width corresponding to the scanning direction (X-direction) is 1, the irradiation spot having a size of 1 × h (hereinafter, minutely) Spots). The micromirror X _ij is square (h = 1), and the size of the micromirror X _ij is very small with respect to the line width of the pattern, and the length of one piece is set to several micrometers to several tens of micrometers.

The size of the DMD 22 is determined according to the display standard of the television, and the direction corresponding to the main scanning direction of the DMD 22 is defined as the transverse direction and the direction corresponding to the sub scanning direction as the longitudinal direction, and the width (the horizontal direction). When length) and height (lengthwise length) are represented by "W" and "K", respectively, the aspect ratio (lateral aspect ratio W: K) of DMD 22 is set to 3: 4.

When all the micro mirrors are in the ON state while the X-Y stage 18 is stopped, the spot EA having a predetermined size is exposed on the exposure surface SU (hereinafter, this spot region is referred to as an exposure region). Since the magnification of the imaging optical system 26 is 1 times, the relationship of D x R = K x W (= (M x h) x (N x 1)) is established.

In the DMD 22, since the micromirrors X _ij are independently turned on and off, the light irradiated to the entire DMD 22 becomes light composed of a light beam of light selectively reflected by each micromirror. As a result, the light according to the circuit pattern which should be formed in the place is irradiated to arbitrary area | region Ew in which exposure area EA is located in exposure surface SU. In accordance with the raster scanning, the XY stage 18 moves at a constant speed, whereby the exposure area EA moves at a relatively constant speed on the exposure surface SU along the main scanning direction (X direction). The circuit pattern is formed along the main scanning direction (X direction).

While the XY stage 18 is moving at a constant speed, the exposure operation is executed to deviate, i.e., overlap the irradiation position Y _ij of the microspot. That is, the ON-switching control of the micromirror X _ij for starting projection of repetitive light at a predetermined exposure operation time interval (exposure period) is executed, and the digital micromirrors arranged in the X direction sequentially move the predetermined region. When the light is projected toward each other, the interval and the scanning speed are determined during the exposure operation so that the positions of the microspots that are sequentially irradiated partially overlap (overlap). Here, the exposure operation is performed at a time interval shorter than the time taken for the exposure area EA to move in the section 1 along the width 1 of the _microspot X _{ij of the} micromirror X _ij .

By the timing control of the exposure operation, while the substrate SW is relatively moved at a constant speed, the operation of the exposure area is repeatedly performed whenever the exposure area EA advances by the distance d (<1). Moreover, the micromirror is controlled so that the time which the ON state of each micromirror continues in one exposure operation | movement becomes shorter than the time which it takes for the exposure area EA to advance by the distance d. Here, the micromirrors are kept in the ON state for a time in which the exposure area EA advances by the distance Ld (<d), and each micromirror is in the OFF state while the remaining area is moved in the exposure area EA. have.

When the scanning is finished along one scan band SB, the X-Y stage 18 moves in the Y direction (sub-scan direction) by the distance D, and the next scan band is relatively moved (see FIG. 3). If all the scanning bands are scanned while the exposure area EA reciprocates, the drawing process is completed. After the drawing treatment, development treatment, etching or plating, resist stripping treatment, and the like are performed to produce a substrate on which a circuit pattern is formed.

4 is a block diagram of a drawing system.

The control unit 30A of the drawing control unit 30 includes the system control circuit 32, the DMD control unit 34, the stage position control unit 38, the alignment mark detection unit 40, the data operation unit 42, and the light source control unit 44. System control circuit 32 including a CPU, a RAM, a ROM, and the like, controls the entire drawing apparatus 10 and sends a control signal to the light source controller 44 to emit light from the light source 21. In addition, the control signal for controlling the exposure timing is output to the DMD controller 34. The DMD control unit 34 controls the DMD 22 according to the drawing processing program stored in the ROM in advance.

The circuit pattern data is input from the workstation (not shown) to the data input unit 41 of the control unit 30A as vector data (CAM data) and temporarily stored in the data buffer 43 which is a memory. When the pattern data is sent to the data calculating section 42, the vector data is converted into raster data according to the raster scanning and sent to the DMD control section 34. The vector data is data having position coordinate information of the drawing pattern, and has data of position coordinates based on the X-Y coordinate system. The raster data is binarized data indicating either ON / OFF of the micromirror and is displayed as a two-dimensional dot pattern of a circuit pattern.

The DMD control unit 34 reads the raster data sequentially at a predetermined timing in accordance with the relative position of the exposure area EA. That is, the control signal which controls ON / OFF of the micromirror based on the read two-dimensional dot data and the relative position information of the exposure area EA sent from the stage position control part 38 is output to DMD22. The stage position control part 38 controls the X-Y stage drive mechanism 19 provided with the motor (not shown), and the movement speed of the X-Y stage 18, etc. are controlled by this. Moreover, the stage position control part 38 detects the relative position with respect to the X-Y stage 18 of exposure area EA.

When the detection signal of the alignment hole AM read out from the CCD 13 is transmitted to the alignment mark detection part 40, the positional information of the alignment hole AM is detected, and the positional information of the alignment hole AM is stored in the data buffer 43 Is sent to the data calculating section 42 via The data calculating section 42 corrects the position coordinates of the vector data based on the positional information of the alignment hole AM, and generates raster data based on the corrected vector data.

FIG. 5 is a view showing the entire drawing region and the modified drawing region as reference. FIG. 6 is a diagram showing a divided area obtained by dividing the entire drawing area as a reference and a divided area of the modified drawing area. 7 and 8 are diagrams showing the modified divided region corrected to the rectangular shape. 5-8, the correction process of a drawing position is demonstrated.

When forming an alignment hole with respect to the whole drawing area of the board | substrate SW, four alignment holes HO-H3 are located so that the vertex of the parallel rectangle Z0 (reference rectangle) may be comprised according to an XY coordinate system. Is determined. Here, rectangle Z0 is shown by the broken line.

When drawing the substrate SW coated with the photoresist on the X-Y table 18 and performing the drawing process, the substrate SW is deformed due to heat or the like, and the positions of the alignment holes H0 to H3 are deviated. Here, the alignment holes (hereinafter, referred to as measurement alignment holes) after deformation viewed from the XY coordinate system are denoted by the symbols "M0 to M3", and the squares (Z) configured by using the measurement alignment holes M0 to M3 as vertices. ) (Deformation rectangle) is indicated by a solid line. In FIG. 5, the deformation state is exaggerated for simplicity, and the actual deformation amount is small.

As shown in FIG. 6, in order to form a plurality of drawing patterns on the substrate SW, the reference rectangle Z0 is equally divided into 2 × 2, and four drawing regions DV0 to DV3 (hereinafter referred to as reference) Partitioned area). The size of the rectangular reference division region corresponds to the size of the drawing pattern, and data of the position coordinates of the four vertices of each region is input as the CAM data together with the vector data. In Fig. 6, vertices PD0 to PD3 of the reference divisional area DV0 are shown.

On the other hand, about the deformation | transformation rectangle Z after board | substrate deformation, each deformed reference division area | region is determined based on the position coordinate of measurement alignment hole M0-M3. Four drawing regions DM0 to DM3 (hereinafter referred to as strain division regions) are defined by a straight line connecting the midpoints of the sides of the deformation rectangle Z. In FIG. 6, the position, shape, and size of the deformation drawing regions DM0 to DM3 do not coincide with the reference drawing regions DV0 to DV3. The vertex of the deformation drawing area DM0 is represented here as "PM0 to PM3".

In this embodiment, the coordinate position of the drawing data is corrected for each reference division area. The correction amount of the coordinate position is calculated by comparing the reference division region to which the coordinate position belongs and the deformation division region corresponding to the region. Specifically, the offset of the center position of the strain division with respect to the center position of the reference division, the rotation angle of the deformation division with respect to the reference division, and the scale ratio of the deformation division with respect to the reference division are calculated, The coordinate positions of the resulting drawing data are corrected based on the obtained offset amounts, rotation angles, and scale ratios, respectively.

According to this correction, each deformation | transformation division area | region is correct | amended to the rectangular (rectangular) area according to the deformation | transformation degree of the place. The scale ratio applies a representative length of each drawing region, and, for example, when a pair of sides facing each deformation drawing region are not parallel, the representative length of the drawing region is defined along the sides of the deformation drawing region. do. Since each drawing position is corrected by the calculated predetermined scale ratio, when the drawing position is set in the entire reference drawing region, the deformation drawing region is corrected to a rectangle.

In FIG. 7, the average value of the lengths of the pair of sides MT1 and MT2 facing each other in the strain dividing area DM0 is determined along the sides DT1 and DT2 (see FIG. 6) of the strain dividing area distance M0. The length (size) is set, and the ratio with the length of the corresponding side DT1 (DT2) of the reference divided area DV0 is a scale ratio. Similarly, the ratio of the lengths of the pairs of sides MT3 and MT4 facing each other in the strain division DM0 to the length of the corresponding sides DT3 (DT4) of the reference division DV0 is a scale ratio. . Then, the drawing position PP is corrected to the drawing position PP 'based on the offset amount, the rotation angle, and the scale ratio. When all the drawing positions in the reference division area DV0 are corrected, the deformation division area DM0 is converted into the coordinate position in the rectangular area SM0 (indicated by the dashed-dotted line).

This drawing position correction is also performed for the drawing positions in the other modified division regions DM1, DM2, and DM3. In Fig. 8, rectangular regions SM0 to SM3 in which the modified divided regions DM0 to DM3 are modified are shown.

9 is a flowchart of a drawing process. 10 is a diagram showing a reference rectangle before substrate deformation. 11 is a diagram illustrating a deformation rectangle after deformation of the substrate.

In step S101, vector data which is drawing data from a workstation or the like is transmitted to the drawing system 30 and temporarily stored in the data buffer 43. Here, together with the vector data, the position data of the division drawing area and the information of the size are included. Specifically, the position coordinates of four vertices of the reference division area are input. In step S102, the alignment mark detection part 40 detects the position coordinates of the measured alignment hole. And in step S103, the position coordinate of the vertex of a deformation | transformation division area | region is calculated based on the measured position coordinate of the alignment hole.

10 shows position coordinates A0 (ax ₀ , ay ₀ ), A1 (ax ₁ , ay ₁ ), A2 (ax ₂ , ay ₂ ), and A3 (ax ₃ ) of the alignment holes of the reference rectangle N0 set in advance. , ay ₃ ) and four division position coordinates B00 (bx ₀₀ , by ₀₀ ) and B01 (bx ₀₁ which constitute a vertex of one reference division region NV0 among the reference division regions defined by dividing the reference rectangle into 2 × 2. , by ₀₁ ), B02 (bx ₀₂ , by ₀₂ ), B03 (bx ₀₃ , by ₀₃ ) are shown.

11, the position coordinates C0 (cx ₀ , cy ₀ ), C1 (cx ₁ , cy ₁ ), C2 (cx ₂ , cy ₂ ), and C3 (cx ₃ ) of the measured alignment holes of the deformation rectangle N are shown in FIG. 11. , cy ₃ ) and four division position coordinates D00 (dx ₀₀ , dy ₀₀ ) and D01 which form the vertices of one deformation division MV0 among the deformation division regions defined by dividing the deformation rectangle into 2 × 2. (dx ₀₁ , dy ₀₁ ), D02 (dx ₀₂ , dy ₀₂ ) and D03 (dx ₀₃ , dy ₀₃ ) are shown.

The position coordinates of each reference division area are previously included in the vector data. On the other hand, the four position coordinates constituting the vertex of each deformation division region are obtained based on the measured position coordinates C0 to C3 of the alignment holes. Four position coordinates constituting the vertex of one deformation | transformation division area | region MV0 are calculated | required by the following formula | equation.

When step S103 is executed, the flow proceeds to step S104.

In step S104, it is determined whether the position coordinate of the drawing data belongs to which reference division area, and the position coordinate of the drawing data is corrected based on the scale ratio, the offset amount, and the rotation angle calculated for the reference division area to which the drawing data belongs. The corrected drawing data is stored in the data buffer 43.

The scale ratio of the deformation | transformation division area | region MV0 shown in FIG. 11 is calculated | required by the formula shown below. scx represents the length of the strain division MV0 along the X direction, and represents the average of a pair of opposing sides Q1 and Q2. Similarly, scy represents the average length of the strain division MV0 along the Y direction.

only,

only,

Next, the offset amount is obtained by the following equation. However, offx and offy represent the offset amounts of the center positions of the strain division MV0.

only,

only,

And a rotation angle is calculated | required by the following formula. However, th represents a rotation angle.

only,

Regarding the vector data correction process, first, the view coordinates are corrected by the offset amounts offx and offy with respect to the vector data having the coordinate information of the start point and the end point. Next, on the basis of the corrected time point, the coordinates of the new end point are temporarily obtained so that the length in the X and Y axis directions with the new end point is the length multiplied by the original ratio by the scale ratio scx and scy, respectively. The end point is finally obtained as if the corrected vector data consisting of the temporary point and the end point were rotated by the rotation angle th with respect to the original vector data.

Position correction of such drawing data is performed for each drawing data. In step S105, raster data is generated based on the corrected vector data, and the DMD 22 is ON / OFF controlled based on the raster data.

As described above, according to the present embodiment, the deformation defined by the reference division regions DV0 to DV3 defined by dividing the preset reference rectangle Z0 by 2 × 2 and the four alignment holes M0 to M3 measured. The offset amount, rotation angle, and scale ratio of each divided area are calculated based on the deformed divided areas DM0 to DM3 defined by dividing the rectangle Z by 2x2. Then, the drawing data belonging to the reference divided area is corrected based on the offset amount, rotation angle, and scale ratio, and correction such as correcting the deformation divided area into a rectangle is performed. In order to divide the drawing area which consists of four alignments, and to perform a correction process in each drawing area, a drawing position is correct | amended based on the error amount distributed by the divided quantity, and correction with high precision is performed. Moreover, since a drawing position is correct | amended in the state holding a rectangle, it can be used also for the board | substrate manufacturing process which repeats a pattern hierarchically.

Next, a second embodiment will be described. In 2nd Embodiment, a scale ratio is calculated from the deformation state of the whole board | substrate, and the size of each drawing pattern is made the same. About the other than that structure, it is substantially the same as 1st Embodiment.

FIG. 12 is a diagram illustrating correction of the strain division region when the scale ratio is made constant.

The position coordinates of the four measurement alignment holes M'0 to M3 constituting the vertex of the deformation rectangle Z 'are measured with respect to the reference rectangle Z'0 set in advance in the substrate SW. . Then, the deformation rectangle Z 'is divided into four to define a deformation division area (not shown), and the offset of the drawing position is based on the reference division area (not shown) which is divided into four reference rectangles Z'0. The amount, rotation angle, and scale ratio are calculated.

About the offset amount and rotation angle, the offset amount and rotation angle regarding the center position of each deformation | transformation division area | region are calculated similarly to 1st Embodiment. In contrast, the scale ratio of each of the four divided regions is not calculated, but the scale ratio of the modified rectangle Z 'to the reference rectangle Z'0 is calculated. Specifically, it is calculated | required from the position coordinates of four vertices HO-H3 of the reference rectangle Z'0, and the measured alignment holes M0-M3. As a result, four divided regions SM'0 to SM'3 are formed. Since the same scale ratio is used for each divided region, it is possible to form hierarchical drawing patterns of the same size.

You may correct based on drawing data other than vector data. Moreover, you may apply an optical modulator like LCD other than DMD. Moreover, you may apply to the drawing apparatus which scans a laser beam with optical modulators, such as AOM. In addition, the processing for correcting the divided region into a rectangular shape may be performed by parameters other than the scale ratio, the offset amount, the rotation angle, and the like.

According to the present invention, a drawing position can be appropriately corrected in accordance with deformation of a to-be-formed object such as a substrate, so that it is possible to cope with various manufacturing strokes and to form a drawing pattern with high accuracy.

Claims (12)

Light source, At least one light modulator for modulating illumination light from the light source in accordance with drawing data having a position coordinate based on a coordinate system defined for the subject; Measurement means capable of measuring the positions of four measurement indices pre-installed on the subject to be formed so as to form a vertex of a reference rectangle in a state where the subject is deformed; Each reference division area based on a plurality of reference division areas defined by dividing the reference rectangle and a plurality of deformation division areas of a rectangular shape defined by dividing a deformation rectangle having the measured four measured indexes as vertices. Correction means for correcting the position coordinates of the drawing data in the step of generating the corrected drawing data; Drawing processing means for controlling the light modulation element so as to form a drawing pattern based on correction drawing data, And the position coordinates of the drawing data are corrected so that the correction means corrects each deformation division region into a rectangular region based on the deformation amount from the corresponding reference division region. The virtual machine according to claim 1, wherein the correction means virtually sets four vertices of each strain division region as four indexes for division of division, and at the same time, four vertices of the reference division rectangle are virtual as four index division indicators. And the positional coordinates of the drawing data are corrected based on the four deformation dividing indexes and the four reference dividing indexes. The writing system according to claim 1, wherein the correction means calculates at least one of an offset amount, a rotation amount, and a scale ratio of the center position as the deformation amount, and corrects the position coordinates of the drawing data. 4. The drawing system according to claim 3, wherein the scale ratio is a ratio of an average of lengths of pairs of sides facing each other of the deformation division region and lengths of pairs of sides of a corresponding reference division region. 4. The method according to claim 3, wherein the correction means includes an offset amount of a center position of the deformation division area with respect to the reference division area, a rotation angle of the deformation division area with respect to the reference division area, and the deformation with respect to the reference division area. A drawing system, characterized by correcting the position coordinates of the drawing data based on the scale ratio of the divided region. The deformation rectangle according to claim 3, wherein the correction means includes an offset amount of a center position of the deformation division area with respect to the reference division area, a rotation angle of the deformation division area with respect to the reference division area, and the deformation rectangle with respect to the reference rectangle. A drawing system, characterized in that for correcting the position coordinates of the drawing data on the basis of the scale ratio of. The writing system according to claim 1, wherein the light modulator is composed of a plurality of light modulators arranged regularly in two dimensions. The writing system according to claim 1, wherein the drawing data is vector data. Measurement means capable of measuring the positions of four measurement indices pre-installed on the subject to be formed so as to form a vertex of a reference rectangle in a state where the subject is deformed; In each reference division area, based on a plurality of reference division areas defined by dividing the reference rectangle and a plurality of deformation division areas in a rectangle defined by dividing a deformation rectangle having the measured four measured indexes as vertices. Correction means for correcting the position coordinates of the drawing data and generating corrected drawing data; And the position coordinates of the drawing data are corrected so that the correction means corrects each deformation division region into a rectangular region based on the deformation amount from the corresponding reference division region. Measurement means capable of measuring the positions of four measurement indices pre-installed on the subject to be formed so as to form a vertex of a reference rectangle in a state where the subject is deformed; Each reference division area based on a plurality of reference division areas defined by dividing the reference rectangle and a plurality of deformation division areas of a rectangular shape defined by dividing a deformation rectangle having the measured four measured indexes as vertices. Function correction means for correcting the position coordinates of the drawing data, and generating the corrected drawing data, And the correcting means functions to correct the position coordinates of the drawing data to correct each deformation division region into a rectangular region based on the deformation amount from the corresponding reference division region. The positions of the four measurement indices pre-installed on the subject to be measured are constituted by deforming the subject to be deformed so as to form a vertex of the reference rectangle. Each reference division area based on a plurality of reference division areas defined by dividing the reference rectangle and a plurality of deformation division areas of a rectangular shape defined by dividing a deformation rectangle having the measured four measured indexes as vertices. Corrects the position coordinates of the drawing data in to generate the corrected drawing data, And correcting the position coordinates of the drawing data so as to correct each deformation division region into a rectangular region based on the deformation amount from the corresponding reference division region. 1) apply a photosensitive material to a blank substrate; 2) drawing processing is performed on the applied substrate; 3) Developing is performed on the drawn substrate, 4) The developed substrate is etched or plated, 5) A method of manufacturing a substrate in which a photosensitive material is peeled off on an etched or plated substrate, In the drawing process, the drawing data is corrected by the drawing data correction method according to claim 11, wherein the manufacturing method of the substrate.

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