KR100816617B1 - Board for detecting articles of stay in articles tray - Google Patents

Abstract

The present invention discloses a component tray residual component detection board which enables to quickly and easily detect a component remaining in a component tray containing a large number of components such as a semiconductor chip or an IC. The present invention comprises a plurality of photosensors consisting of a light emitting element and a light receiving element so that the light receiving element receives the light reflected from the surface of the part accommodated in the component storage groove of the user tray by the light emitting element to detect the residual of the component. The number of photosensors is arranged at a predetermined interval so as to correspond to the plurality of component storage grooves of one row of the component trays, and the number of photosensors is selectively made to operate selectively according to the number of component storage grooves of one row of the component trays to be inspected. A sensor unit having a plurality of sensor strings; Information on various parts contained in the parts tray and a control program such as a detection program are stored, and the signal input from the sensor unit determines whether there is a residual part in the user tray and outputs the signal to the outside. Control unit; A signal selection unit for selecting one sensor string corresponding to the number of component storage grooves in one row of the component tray to be inspected among the plurality of sensor strings of the sensor unit according to the signal of the controller; It includes a communication unit for transmitting the signal of the control unit to the outside, and receives an external signal; including a plurality of component storage grooves of the component tray by passing once horizontally at an interval from the top of the component tray by the moving means Non-contact, simple and accurate detection of the presence of residual parts.

Semiconductor, Tray, Scan, Residual Detection, IC, Photo Sensor

Description

Component Tray Residual Component Detection Board {Board for detecting articles of stay in articles tray}

1 is a block diagram schematically illustrating a general semiconductor inspection process;

2 is a partially enlarged perspective view showing a user tray for semiconductor storage;

3 is a block diagram showing a component tray residual component detection board according to the present invention;

4 is a cross-sectional view schematically showing a detection method of a photosensor used in the parts tray residual part detection board of the present invention;

Fig. 5 is a diagram showing a display example of a component type display portion of the component tray residual part detection board of the present invention.

<Description of the symbols for the main parts of the drawings>

60: user tray 61: parts storage groove

70 semiconductor 80 test tray

100: detection board 110: sensor

111: six-row sensor section 111a, 112a, 113a: sensitivity adjustment section

112: 8-row sensor section 113: 10-row sensor section

114: photosensor 114a: light emitting element

114b: Light receiving element 115a: Detection light

120: signal selector 121, 122, 123: multiplexer

130: control unit 131: semiconductor type selection unit

132: semiconductor type display unit 133: storage unit

140: communication unit 200: main control means

300: vehicle 400: computer

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a tray residual part detection device for detecting a part remaining in a part tray for mounting a plurality of parts by providing a part storage groove on a matrix, and more particularly, a part to be detected. Regardless of the type, the present invention relates to a component tray residual component detection board that enables to quickly, accurately and easily detect the components remaining in the component tray.

As is well known, various electric and electronic products are composed of many parts, and each parts are generally manufactured in large quantities in separate production lines or factories and supplied to finished product mass production lines or manufacturing companies.

At this time, the individually produced parts are shipped with a certain amount mounted on a tray having a plurality of parts storage grooves in a matrix for convenience of storage / movement and input of a mass production line, and also are put into a finished product production line.

In the meantime, the electrical and electronic parts manufactured in the production line (hereinafter referred to as "parts") are tested by predetermined test equipment to determine whether they finally perform their own functions before being shipped. Will go through. The equipment used in this test process is called a "test handler", and only the parts that pass the test by the test handler are supplied as a good product to a finished product production line or a manufacturing company.

For example, in the manufacture of semiconductor devices such as ICs (Integrated Circuits) or semiconductor chips (hereinafter referred to as "semiconductors"), once semiconductor assembly is completed, a plurality of semiconductors are put in trays for final inspection through a test handler. The process is outlined as follows. Here, a component tray on which the assembled semiconductor 70 is mounted is referred to as a user tray 60, and a component tray for temporarily mounting the semiconductor 70 in a test handler to perform an inspection process is referred to as a test tray 80. Separate.

1 and 2, the assembled semiconductors 70 are mounted in the user tray 60 in a predetermined quantity and introduced into the supply unit 10 of the handler, followed by transfer means such as pick and place (pick & place). Not to be transferred to the test tray 80 of the loading unit 20. At this time, the bin user tray 60 from which the semiconductor 70 has been transferred is transferred to the discharge part 50 of the handler.

The semiconductor 70 transferred to the test tray 80 is transferred to the inspection unit 30 and inspected for its performance, and then transferred to the unloading unit 40.

The semiconductor 70 in the test tray 80 transferred to the unloading part 40 is moved back to the empty user tray 60 transferred from the supply part 10 to the discharge part 50 by transfer means, and in such a state. Is shipped.

However, in the inspection process as described above, when the semiconductor 70 is transferred from the user tray 60 to the test tray 80, the semiconductor 70 remains in the user tray 60 due to a miss of the transfer means. In this case, when the tested semiconductor 70 is transferred to the user tray 60 again, there is a problem that two semiconductors 70 overlap with one component storage groove 61 and are shipped. In this case, the user All of the semiconductors 70 mounted on the tray 60 are treated as defective.

In addition, when the two semiconductors 70 do not know that they are brought in an overlapped state and are put into the finished product mass production line as it is, the first semiconductor 70 remaining in the user tray 60 and not undergoing an inspection process is used to produce the finished product. There is also a high possibility of causing defective products.

In addition, when the semiconductor 70 remains in the user tray 60, the two semiconductors 70 may collide with each other in the process of transferring the inspected semiconductor 70 to the user tray 60 to cause post damage.

On the other hand, the conventional technology that is used as a method for solving such a problem, a push button method, a technology using a heterogeneous robot, such as pick and place to transfer the semiconductor and vision camera (vision camera) method It is used.

By the way, while the standard of the user tray 60 is determined to be consistent with the test handler, the semiconductor 70 has different sizes for each type, so that the component storage grooves 61 of one row of the user tray 60 are provided. Since the number varies depending on the type of the semiconductor 70, the push button method of detecting the direct contact with the semiconductor 70 should be equipped with the type of the semiconductor 70.

In addition, since the contact is frequently broken, in particular, there is a high risk of cracking in the semiconductor 70.

In the transfer robot method, since the residual inspection and transfer of the semiconductor 70 are performed by one means, transfer of the semiconductor 70 is impossible during the inspection, and thus the yield is lowered. Detection errors are also a frequent problem.

In addition, even in the case of the vision camera method, it is difficult to change the type of the semiconductor 70, and in particular, it is very expensive and difficult to maintain, which may act as a factor that causes a cost increase of the product.

The present invention was devised to solve the above-mentioned conventional problems, and parts that allow to quickly, accurately and easily inspect whether there is a residual part in the parts tray due to a material failure during the inspection of the manufactured parts. The purpose is to provide a tray residual part detection board.

Another object of the present invention is to provide a component tray residual part detection board that enables inspection of various types of component residues regardless of the type of component to be inspected.

It is still another object of the present invention to provide a component tray residual part detection board which can be inexpensively supplied without any inspection errors or failures without any possibility of causing damage to components during the inspection process without contact.

The component tray residual part detection board according to the present invention for achieving the above objects is accommodated in a component tray having a plurality of component insertion grooves in a matrix to detect whether or not various components remaining in the tray undergo a series of processes. Component tray residual part detection board for use in

A plurality of photo sensors composed of light-emitting and light-receiving elements for detecting the remaining of parts by receiving the light receiving element receives the light reflected from the surface of the part accommodated in the component storage groove of the user tray. Are arranged at regular intervals so as to correspond to each of a plurality of component storage grooves in a row of component trays, and the number of photosensors is selectively made to operate selectively according to the number of component storage grooves in a row of component trays to be inspected. A sensor unit having a plurality of sensor strings; Information on various parts contained in the parts tray and a control program such as a detection program are stored, and the signal input from the sensor unit determines whether there is a residual part in the user tray and outputs the signal to the outside. Control unit; A signal selection unit for selecting one sensor string corresponding to the number of component storage grooves in one row of the component tray to be inspected among the plurality of sensor strings of the sensor unit according to the signal of the controller; Including a communication unit for transmitting a signal from the control unit to the outside, and receives an external signal,
By moving the horizontally at an interval from the top of the parts tray by the moving means is characterized in that the presence of the remaining parts to the plurality of parts storage groove of the parts tray.

According to one preferred feature of the present invention, the sensor row of the sensor unit is arranged in parallel with a predetermined interval of the six-row sensor unit, the eight-row sensor unit and the ten-row sensor unit, the signal selection unit according to the signal of the control unit A plurality of multiplexers are respectively connected to the sensor rows so as to select the number of photosensors to be used for detection among the rows.

According to another preferred aspect of the present invention, the control unit includes a component type selection unit for selecting a type of the component tray to be inspected as an external input signal, and a component type display unit for displaying the type of the selected component tray and the type of the parts stored therein. Is installed more.

The present invention, for example, in the final inspection process of the various components manufactured, by moving the upper part of the component tray to the test tray of the test handler by the transfer means once by the moving means The photosensors of the selected specific row activated to correspond to the one row of the component storage grooves can detect the parts remaining in the parts tray easily and accurately in a non-contact manner.

In particular, the number of component storage grooves in one row of the component tray varies depending on the type of component. The detection board of the present invention can be selected by having a plurality of sensor strings having different numbers of photosensors, and the photo to be used for detection among the sensor rows. Since the number of sensors can be set to match the number of component storage grooves in the first row of the component tray, it is easy to check whether there are any kinds of parts remaining regardless of the type of the component to be inspected.

In addition, since there is no fear of damaging parts during the inspection process without contact, the optical detection method has almost no inspection error or failure compared to the conventional technologies, and can be relatively inexpensive.

Such specific features and other advantages of the present invention will become more apparent from the following description of the preferred embodiment with reference to the accompanying drawings, and will be described taking the semiconductor 70 as an inspection object as an example.

3, the component tray residual component detection board 100 according to the present invention includes a sensor unit for detecting a semiconductor 70 present in the component storage groove 61 of the user tray 60 by including a plurality of detection sensors. 110, a control unit 130 for controlling the operation of the detection board 100, and various detection sensors of the sensor unit 110 corresponding to the type of the semiconductor 70 to be inspected according to the signal of the control unit 130. Among them, a signal selecting unit 120 for selecting the detection sensors to operate, and a communication unit 140 for transmitting an external signal and receiving a signal from the controller 130 is configured.

As illustrated in FIG. 4, the detection sensor constituting the sensor unit 110 includes a light-emitting and light-receiving element 114a (114b) integrally formed so that the light 115a irradiated from the light-emitting element 14a is transferred to the user tray. The light receiving element 114b receives the light 115b reflected from the surface of the component 70 accommodated in the component storage groove 61 of the plurality of photo sensors 114. Is done.

The sensor unit 110 includes three sensor arrays each having a different number of photosensors 114 so as to selectively operate according to the type of the semiconductor 70, that is, the number of component storage grooves 61 in one row of the user tray 60. 111, 112, and 113, and these sensor rows 111, 112, and 113 are arranged at regular intervals so as to be in parallel with the component storage grooves 61 of the user tray 60. The three sensor arrays include, for example, a six-row sensor section 111, an eight-row sensor section 112, and a ten-row sensor section 113, and a photo sensor constituting each of the sensor rows 111, 112, and 113. 114 operate simultaneously.

This is because the number of component storage grooves 61 constituting one row of the user tray 60 depends on the type of the semiconductor 70, and the component storage grooves of one row of the user tray 60 that are currently used for general purpose ( 61) is based on the number less than ten. Therefore, when the size of the semiconductor 70 becomes smaller and the number of one row of the component storage grooves 61 of the user tray 60 increases, the respective sensor rows 111, 112, and 113 of the sensor unit 110 are increased. Of course, the number of photosensors 114 may vary.

On the other hand, preferably, the six-row sensor 111, the eight-row sensor 112 and the ten-row sensor 113 is a sensitivity adjusting unit (111a, 112a, 113a) to adjust the output so that the detection signal is constant, respectively. Is installed.

The sensitivity adjusting units 111a, 112a, and 113a are made of resistors attached to the outputs of the photosensors 114, and control the sensitivity of the output signal by limiting the collector current of the output transistors.

The signal selection unit 120 is connected between the sensor unit 110 and the control unit 130, and any one sensor string 111 or 112 or 113 to operate the sensor unit 110 according to the signal of the control unit 130. Select.

The signal selection unit 120 may be composed of one multiplexer connected to both the six-row sensor unit 111, the eight-row sensor unit 112, and the ten-row sensor unit 113, but preferably each sensor column ( Three multiplexers 121, 122, and 123 that connect the 111, 112, 113 and the controller 130 individually to each of the photosensors 114 of the respective sensor arrays 111, 112, 113. ) To select.

That is, the number of component storage grooves 61 in one row of the user tray 60 varies depending on the type of the semiconductor 70. The sensor rows constituting the sensor unit 110 include six rows, eight rows, and ten rows of sensor units ( Only three columns of 111, 112, and 113 are used. In the case where the number of component storage grooves 61 in one row has a different number from those of the sensor rows, three sensor rows 111, 112, and 113 are used. One column suitable for the number of component storage grooves 61 of the corresponding user tray 60 is selected, and a photo sensor 114 to be used for detection can be selected from among the photo sensors 114 in the sensor row.

The control unit 130 sends a control signal to the sensor unit 110 and the like, and calculates whether the semiconductor 70 remains in the user tray 60 by using the detection signal input therefrom, and outputs the detection board 100 to the outside. By controlling the overall function, the storage unit 133 is provided to store various semiconductors 70 contained in the user tray 60 and information about the user tray 60 and a control program such as a detection program thereof. .

The controller 130 is connected to a semiconductor type selector 131 that can externally input the type of the semiconductor 70 to be detected, and a semiconductor type display unit 132 that displays the type of the selected semiconductor 70.

The semiconductor type selector 131 is configured as, for example, a push button, and the controller 130 checks the stored information based on the stored information by sending an up / down signal to the controller 130 each time it is pressed. Select the target semiconductor type.

For example, the semiconductor type display unit 132 is composed of a combination of ten LEDs 135, as shown in FIG. 5, and the control unit 130 is binary-controlled each time the semiconductor type selection unit 131 is pressed once. It adds and emits light. Accordingly, as long as 10 LEDs 135 are formed, semiconductor types can be displayed as many as 2 ¹⁰ .

The communicator 140 is connected to the moving unit 300 and the detection board 100 for moving the control unit 130 and an external device, for example, the detection board 100, and thus the presence of the remaining semiconductor 70 in the user tray 60. RS-232 communication is performed to send and receive signals with the main control means 200 to control the inspection.

The remaining code 400 is a computer, connected to the main control means 200 to monitor the detection result output from the control unit 130 of the detection board 100, the control unit 130 of the main control means 200 and the detection board 100 Can send the necessary information signal.

Next, the operation of the component tray residual component detection board according to the present invention configured as described above will be described in detail.

The detection board 100 of the present invention, for example, is mounted to the supply unit 10 of the test handler together with a moving means 300 that can reciprocate horizontally from the upper portion of the user tray 60, the detection board 100 And an external main control means 200 capable of controlling the operation of the moving means 300.

First, the manufacturing is completed and the semiconductor type selection unit 132 of the detection board 100 is operated in a predetermined manner according to the type of the semiconductor 70 for the final test, and information about the same is input. Then, the control unit 130 outputs the display signal for the semiconductor 70 from the information stored by the input signal of the semiconductor type selection unit 132 to the semiconductor type display unit 133, and accordingly the semiconductor type display unit 133. LEDs 135 emit light in a specific pattern to visually indicate the inspection target semiconductor 70.

At the same time, the controller 130 determines the number of component storage grooves 61 in one row of the user tray 60 according to the type of the semiconductor 70, and sends the corresponding signal to the signal selector 120. Then, the signal selector 120 selects one column to operate among the six columns, the eight columns, and the ten columns of the sensor units 111, 112, and 113 according to the signal from the controller 130.

At this time, if the number of component storage grooves 61 in one row of the user tray 60 matches the number of sensors in any one of the three rows provided in the sensor unit 110, the photosensors of the selected sensor row 111, 112, or 113. All of the 114 are selected and operated; otherwise, one row of the user tray 60 by the multiplexers 121, 122, 123 connected to the respective sensor rows 111, 112, 113. Select the photosensor 134 to operate to correspond to the number and position of the parts receiving groove 61 of the.

In this state, the user tray 60 mounted with the semiconductor 70 to be inspected is introduced into the supply portion 10 of the test handler so that the transfer means of the handler is contained in the component storage groove 61 of the user tray 60. After moving the 70 to the test tray, when the detection start signal is input from the external main control means 200, the upper part of the empty user tray 60 in which the detection board 100 of the present invention is loaded by the moving means 300. Move horizontally in the.

At this time, the photosensors 114 of the selected sensor unit 110 irradiate the detection light 115a into the component storage groove 61 of the user tray 60 by the light emitting unit 114a.

Accordingly, when there is no semiconductor 70 in the component storage groove 61 of the user tray 60, the reflected light 115b does not enter the light receiving portion 114b of the photosensor 114, and thus the current value of the output portion changes. However, if the semiconductor 70 is present in the component storage groove 61 due to mistransmission, the detection light 115a irradiated from the light emitting unit 114a is reflected from the semiconductor 70 and the reflected light 115b is reflected. The incident on the 114b causes the current of the output of the photosensor 114 to be amplified.

The controller 130 finds the amplified current value through the multiplexer 121, 122, or 123, determines that the semiconductor 70 remains at the corresponding position, and stores the corresponding position value.

That is, after the inspection is started, the controller 130 is configured to output the output signals of the preselected photosensors 114 to each of the sensor strings 111, 112, and 113. Comparing and operating the signals read from the stored data with the stored information, the position value of the sensor data showing a voltage difference out of a predetermined reference value determined by the program is stored, and the semiconductor 70 is determined to remain.

Such an operation is repeatedly performed while moving with respect to the plurality of rows of component storage grooves 61 provided in the matrix on the user tray 60, and external position control means is stored in the process through the communication unit 140. 200 is sent in real time.

At this time, when the computer 400 is connected to the main control means 200, the corresponding position is displayed as a monitor.

In the above, the present invention has been described by taking a semiconductor tray as an example, but this is merely for the purpose of illustration, the present invention is not limited to this, it can be applied to other electrical, electronic component trays stored in the tray / moved Of course.

In addition, the present invention can be used not only for the remaining parts of the tray as described above, but also for the quantity coefficient of components, such as semiconductors contained in a specific container, or the quantity coefficient of an object stacked at an inconsistent height.

As described above, according to the component tray residual component detection board according to the present invention, for example, in the final inspection process of various manufactured components, the upper parts of the component trays in which the mounted components are transferred to the test tray of the test handler by the transfer means are removed. By passing once in a scan method by the moving means, it is possible to detect the parts remaining in the parts tray with a non-contact very easily and accurately missed material.

As a result, it is possible to surely prevent various problems that may occur due to the remaining parts in the user tray during the test process.

In particular, the detection board of the present invention can be selected and provided with a plurality of sensor rows having different numbers of photosensors, so that the number of photosensors to be used for detection among the respective sensor rows is matched to the number of parts storage grooves in one row of the parts tray. Since it can be selected, it can be used universally for the inspection of various kinds of parts regardless of the type of inspection target parts.

In addition, since there is no fear of damaging parts during the inspection process without contact, the optical detection method has almost no inspection error or failure compared to conventional technologies, and can be inexpensively supplied.

Claims (6)

A component tray residual component detection board for receiving a component tray having a plurality of component insertion grooves in a matrix and for using it to detect whether various components undergoing a series of processes remain in the tray. A plurality of photosensors consisting of a light emitting and a light receiving element and receiving a light reflected from a component housed in the component storage groove of the component tray after being irradiated from the light emitting element, detect a residue of the component. A plurality of sensor arrays each having a different number of photosensors to be selectively operated according to the number of component storage grooves in a row of component trays to be inspected. Sensor unit provided; Information about various components contained in the parts tray and a control program such as a detection program are stored. The signal input from the sensor unit determines the presence or absence of remaining parts in the parts tray and outputs the signal to the outside. A control unit; A signal selection unit for selecting one sensor string corresponding to the number of component storage grooves in one row of the component tray to be inspected among the plurality of sensor rows of the sensor unit according to the signal of the controller; And a communication unit transmitting a signal of the controller to the outside and receiving an external signal. Residual part detection board of the component tray, characterized in that for moving the horizontally spaced from the upper portion of the component tray by a moving means for the presence or absence of residual parts to the plurality of component storage groove of the component tray. The method of claim 1, wherein the sensor string of the sensor unit, Component tray residual part detection board, characterized in that consisting of a six-row sensor unit, an eight-row sensor unit and a ten-row sensor unit arranged side by side at a predetermined interval. 3. The component tray residual component detection board according to claim 2, wherein each of the sensor strings is provided with a sensitivity controller for maintaining a constant sensitivity of the output signal. According to any one of claims 1 to 3, wherein the signal selection unit is connected to each of the plurality of sensor strings so as to select the number of photosensors to be used for detection in each sensor string by the control signal of the control unit Component tray residual component detection board comprising a multiplexer. The apparatus of claim 1, wherein the controller further includes a component type selection unit for selecting a type of the component tray to be inspected as an external input signal, and a component type display unit for displaying the type of the selected component tray and the type of the parts contained therein. Component tray residual component detection board, characterized in that the. The display unit of claim 5, wherein the display unit includes a plurality of display columns including a plurality of LEDs, and the LEDs of each display column emit light in a specific pattern for each type of component by an external input signal through the component type selection unit. Component Tray Residual Component Detection Board.

Images