KR100691580B1 - Image-displaying device, method of producing spacer used for image-displaying device, and image-displaying device with the spacer produced by the method - Google Patents

Abstract

A first substrate 10 having a fluorescent surface, and a second substrate disposed opposite to each other with a gap between the first substrates and provided with a plurality of electron sources 18, and between the first and second substrates; A plurality of spacers 30a and 30b are provided to support an acting atmospheric load. The tip portion on the first substrate side and the tip portion on the second substrate side of each spacer are impregnated with a conductive material to form conductivity provision portions 31a and 31b, respectively.

Description

IMAGE-DISPLAYING DEVICE, METHOD OF PRODUCING SPACER USED FOR IMAGE-DISPLAYING DEVICE, AND IMAGE-DISPLAYING DEVICE WITH THE SPACER PRODUCED BY THE METHOD}

The present invention provides an image display device having an opposingly disposed substrate, a plurality of electron sources disposed on an inner surface of one substrate, a method of manufacturing a spacer used in the image display device, and a spacer manufactured by the method. It relates to a display device.

In recent years, there has been a demand for high-definition broadcasting or a high resolution image display device accompanying it, and more stringent performance is desired for the screen display performance. In order to achieve these demands, planarization and high resolution of the screen surface are essential, and at the same time, it is necessary to achieve light weight and thickness.

As an image display apparatus that satisfies the above-mentioned demands, flat display apparatuses such as a field emission display (hereinafter referred to as FED) have attracted attention. This FED has a 1st board | substrate and a 2nd board | substrate arrange | positioned facing the predetermined gap. The periphery of these board | substrates is joined to each other directly or through the side wall of rectangular frame shape, and comprises the vacuum casing. A phosphor layer for displaying an image is formed on the inner surface of the first substrate, and a plurality of electron emission elements are provided on the inner surface of the second substrate as electron sources for exciting and emitting the phosphor layer.

In order to support the atmospheric pressure load applied to a 1st board | substrate and a 2nd board | substrate, several spacer is arrange | positioned as a support member between these board | substrates. In this FED, when an image is displayed, an anode voltage is applied to the phosphor layer, and the phosphor emits light by accelerating the electron beam emitted from the electron emitting element by the anode voltage to collide with the phosphor layer to display the image.

In such an FED, the size of the electron emitting device is a micrometer order, and the distance between the first substrate and the second substrate can be set to the micrometer order. For this reason, in FED, compared with the cathode ray tube (CRT) currently used as a display of a television or a computer, it becomes possible to achieve high resolution, light weight, and thinning of an image display apparatus.

In the above image display apparatus, in order to obtain practical display characteristics, it is preferable to set the anode voltage to several kV or more using the same phosphor as a normal cathode ray tube. However, the gap between the first substrate and the second substrate cannot be made large in view of the resolution, the characteristics of the support member, the manufacturability, and the like, and needs to be set to about 1 to 3 mm. Therefore, secondary electrons and reflective electrons are emitted when electrons emitted from the second substrate collide with the fluorescent surface formed on the first substrate, and these secondary electrons and reflective electrons collide with the spacer disposed between the substrates. As a result, the spacer is charged. In general, at an accelerating voltage in the FED, the spacer is positively charged, and the electron beam emitted from the electron emitting element is attracted to the spacer and deviates from the original orbit. As a result, there is a problem that miss landing of the electron beam occurs with respect to the phosphor layer, thereby degrading the color purity of the display image.

In order to reduce the suction of the electron beam according to such a spacer, it is conceivable to conduct a conductive treatment to all or part of the surface of the spacer to avoid charging. For example, US Pat. No. 5,726,529 discloses a structure in which the end of the insulating spacer is subjected to conductive treatment to avoid charging of the spacer.

However, when the spacer is subjected to the conductive treatment, the reactive current flowing from the first substrate to the second substrate via the spacer increases, causing an increase in temperature and an increase in power consumption. In addition, it is difficult to avoid an increase in manufacturing cost in the conventional conductive treatment method.

1 is a perspective view showing a surface conduction electron emission device (hereinafter referred to as SED) according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the SED broken along line II-II of FIG.

3 is an enlarged cross-sectional view of the SED.

Fig. 4 is a sectional view showing a state in which the first and second molds are attached to the grid in the manufacturing process of the spacer used for the SED.

Fig. 5 is a cross-sectional view showing a state in which UV irradiation and silver paste are applied after the mold is filled with the spacer forming material in the manufacturing step.

6 is a cross-sectional view showing a state in which the mold is released in the manufacturing step.

Fig. 7 is a sectional view showing the spacer manufacturing method of the SED according to the second embodiment of the present invention.

8 is a cross-sectional view showing a step of attaching a solution containing a conductive component to a spacer tip in the spacer manufacturing method according to the second embodiment.

Fig. 9 is a sectional view showing the spacer manufacturing method of the SED according to the third embodiment of the present invention.

Fig. 10 is a sectional view showing a state in which a mold is filled with a first paste and a second paste in the spacer manufacturing method according to the third embodiment.

FIG. 11 is a cross-sectional view showing a state in which a mold is released and fired in the spacer manufacturing method according to the third embodiment. FIG.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object thereof is to provide an image display device having an improved image quality by preventing the deviation of an orbit of an electron beam, a manufacturing method of a spacer for use in the image display device, and a spacer manufactured by the manufacturing method. An image display apparatus is provided.

In order to achieve the above object, the image display device according to the aspect of the present invention includes a first substrate having a fluorescent surface, and a plurality of electrons which are disposed to face each other with a gap on the first substrate and emit electrons to excite the fluorescent surface. A second substrate provided with a circle, and a plurality of spacers each formed of an insulating material and disposed between the first substrate and the second substrate and supporting atmospheric loads acting on the first and second substrates, A conductive material is impregnated with the tip portion on the first substrate side and the tip portion on the second substrate side of each of the spacers to form a conductive imparting portion, respectively.

According to the image display device of the above structure, the electrons emitted from the electron source located near the spacer are repelled by an electric field formed by the conductive imparting portions located at both ends of the spacer, and then orbited in a direction away from the spacer. It is attracted to the spacer and orbits in a direction approaching the spacer. This repulsion and suction cancel the deviation of the electrons, and the electrons emitted from the electron source finally reach the target position on the image display surface. Thereby, the deterioration of the color purity resulting from the former miss landing can be reduced, and the image display apparatus with improved image quality can be obtained. In addition, an increase in temperature and an increase in power consumption can be suppressed as compared with the case where the entire spacer has conductivity.

In the method for manufacturing a spacer of an image display device according to another aspect of the present invention, a spacer is molded from an insulating material, and a paste or a solution containing a conductive component is attached to the tip of the molded spacer, thereby capillary action occurs. The paste or solution is impregnated into the tip of the spacer, and the spacer into which the paste or solution is soaked is fired to form a spacer having the conductive end impregnated with the conductive material at the tip.

Moreover, in the manufacturing method of the spacer which concerns on another form of this invention, a spacer is shape | molded by an insulating material, the paste containing a component which has electroconductivity is affixed on the front-end | tip of the said molded spacer, and the said paste-attached spacer is heat-processed Then, a conductive component is thermally diffused in the tip portion of the spacer to form a spacer having the electroconductive impregnation portion impregnated with the conductive material at the tip portion.

According to still another aspect of the present invention, there is provided a method of manufacturing a spacer, which comprises preparing a mold having a plurality of through holes for molding a spacer, injecting a first paste containing no conductive component into the through holes, thereby providing conductivity. A second paste having a component dispersed therein is superimposed on the first paste and injected into the through hole, and the first and second pastes are heat-treated to form a spacer having a conductive end portion at which a conductive component is dispersed at a distal end thereof. .

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which applied this invention to SED which is a kind of FED as a planar image display apparatus is described in detail, referring drawings.

As shown in Figs. 1 to 3, this SED is a transparent insulating substrate having a first substrate 10 and a second substrate 12 each formed of rectangular glass, each of which is about 1.0 to 2.0 mm. They are arranged opposite to each other with a gap of. The second substrate 12 is formed to have a size slightly larger than that of the first substrate 10. The first substrate 10 and the second substrate 12 constitute a flat rectangular vacuum casing 15 in which peripheral edges are joined to each other via a rectangular frame-shaped side wall 14 made of glass, and the inside thereof is maintained in a vacuum. Doing.

The phosphor screen 16 is formed on the inner surface of the first substrate 10 as a phosphor surface. The phosphor screen 16 is composed of phosphor layers (R, G, B) and a black light shielding layer (11) side by side which emit red, green, and blue light due to the collision of electrons. The phosphor layers R, G, and B are formed in a stripe shape or a dot shape. On the phosphor screen 16, a metal back 17 made of aluminum or the like is formed. Between the first substrate 10 and the phosphor screen 16, for example, a transparent conductive film made of ITO or the like or a color filter film may be provided.

On the inner surface of the second substrate 12, a plurality of surface conduction electron emitting elements 18 are provided as electron sources for exciting the phosphor layers R, G, and B of the phosphor screen 16, each emitting an electron beam. It is. These electron emission elements 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron emission element 18 is composed of an electron emission portion (not shown) and a pair of element electrodes for applying a voltage to the electron emission portion. On the inner surface of the second substrate 12, a plurality of wirings 21 for supplying electric potential to the electron emission element 18 are provided in a metric shape, and the ends thereof are drawn out of the vacuum casing 15 outside.

The side wall 14 which functions as a joining member is sealed to the periphery of the 1st board | substrate 10 and the periphery of the 2nd board | substrate 12 by the sealing adhesive 20, such as low melting glass and low melting metal, for example. It adheres and joins the 1st board | substrate and the 2nd board | substrate.

As shown in Figs. 2 and 3, the SED has a spacer assembly 22 disposed between the first substrate 10 and the second substrate 12. As shown in Figs. In the present embodiment, the spacer assembly 22 includes a plate-shaped grid 24 and a plurality of columnar spacers which are integrally provided on both sides of the grid.

In detail, the grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12. It is arranged parallel to. In the grid 24, a plurality of electron beam through holes 26 and a plurality of spacer openings 28 are formed by etching or the like. The electron beam passing holes 26 are respectively arranged opposite to the electron emission element 18 and transmit the electron beam emitted from the electron emission element. The spacer openings 28 are each located between the electron beam through holes 26 and are arranged at a predetermined pitch.

The grid 24 is formed with a thickness of 0.1 to 0.25 mm, for example by an iron-nickel metal plate. On the surface of the grid 24, an oxide film made of an element constituting a metal plate, for example, an oxide film made of Fe ₃ O ₄ and NiFe ₂ O ₄ is formed. A high resistance film is formed on the surface of at least the second substrate side of the grid 24. The high resistance film is formed by applying and firing a high resistance material made of glass, ceramic, or the like on the grid surface. The resistance of the high resistance film is set to E + 8 Ω / □ or more.

The electron beam through hole 26 is formed into a rectangular shape of, for example, 0.15 to 0.25 mm × 0.15 to 0.25 mm, and the spacer opening 28 is formed into a circle of, for example, about 0.2 to 0.5 mm in diameter. . The high resistance film mentioned above is also formed in the wall surface which defines the electron beam passage hole 26.

On the first surface 24a of the grid 24, the first spacer 30a is integrally provided so as to overlap each spacer opening 28. The extended end of the first spacer 30a is in contact with the inner surface of the first substrate 10 via the black light shielding layer 11 of the metal back 17 and the phosphor screen 16. On the second surface 24b of the grid 24, the second spacers 30b are integrally installed so as to overlap each spacer opening 28, and the extended end thereof is in contact with the inner surface of the second substrate 12. . The extended end of each second spacer 30b is located on the wiring 21 provided on the inner surface of the second substrate 12.

The first and second spacers 30a and 30b are formed of an insulating material. The tip portion of the first spacer 30a and the tip portion of the second spacer 30b are impregnated with a conductive material to form the conductivity providing portions 31a and 31b, respectively. In each electroconductive provision part 31a, 31b, the content density | concentration of electroconductive material is gradually decreasing toward the middle part from the front-end | tip part of a spacer, ie toward the grid 24 side.

As described later, the conductivity providing portions 31a and 31b form an electric field so as to repel the electron beam emitted from the electron emission element 18 in the direction away from the first and second spacers 30a and 30b. As an electroconductive material contained in each electroconductive provision part 31a, 31b, Ni, In, Ag, Au, Pt, Ir, Ru, W, etc. can be used, for example. The heights of the conductivity providing portions 31a and 31b and the content concentration of the conductive material are arbitrarily set in consideration of the repulsive force applied to the electron beam, that is, the trajectory correction amount of the electron beam.

Each of the first and second spacers 30a and 30b is formed in a tapered shape having a narrow end diameter from the grid 24 side toward the extension end portion, that is, the tip portion. For example, each of the first spacers 30a is formed to have a diameter of about 0.4 mm, a diameter of a tip portion of about 0.3 mm, and a height of about 0.6 mm at the base end portion located on the grid 24 side. Each of the second spacers 30b is formed with a diameter of about 0.4 mm, a diameter of a tip of about 0.25 mm, and a height of about 0.8 mm at the base end located on the grid 24 side. Thus, the height of the 1st spacer 30a is formed lower than the height of the 2nd spacer 30b.

The surface resistance of the 1st spacer 30a and the 2nd spacer 30b is 5 * 10 <^{13> (} ohm). Each spacer opening 28 and the first and second spacers 30a and 30b are aligned with each other, and the first and second spacers are integrally connected to each other via the spacer opening 28. Thereby, the 1st and 2nd spacers 30a and 30b are integrally formed with the grid 24 in the state which pinched the grid 24 from both surfaces.

The spacer assembly 22 configured as described above is disposed between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b are in contact with the inner surfaces of the first substrate 10 and the second substrate 12 to support atmospheric loads acting on these substrates to maintain the spacing between the substrates to a predetermined value. Doing.

As shown in Fig. 2, the SED includes a voltage supply unit (not shown) for applying a voltage to the grid 24 and the metal back 17 of the first substrate 10. As shown in Figs. The voltage supply part is connected to the grid 24 and the metal back 17, respectively, and applies a voltage of 12 kV or less to the grid 24 and 12 kV or less to the metal back 17, for example. The voltage applied to the grid 24 is set equal to or higher than the voltage applied to the first substrate 10.

In this SED, when an image is displayed, the phosphor screen 16 and the metal back 17 are applied as an anode voltage, and the electron beam B emitted from the electron emission element 18 is accelerated by the anode voltage to cause phosphors. It hits the screen 16. As a result, the phosphor layer of the phosphor screen 16 is excited to emit light to display an image.

Next, the manufacturing method of the SED comprised as mentioned above is demonstrated. When manufacturing the spacer assembly 22, first, a grid 24 having a predetermined dimension and first and second molds 36a and 36b in a rectangular plate shape having substantially the same dimensions as the grid are prepared. In this case, after degreasing, cleaning, and drying a thin plate having a thickness of 0.12 mm made of Fe-45 to 55% Ni, the electron beam passage hole 26 and the spacer opening 28 are formed by etching to form a grid 24. do. Thereafter, the entirety of the grid 24 is oxidized by an oxidation process, and an insulating film is formed on the surface of the grid including the electron beam passage hole 26 and the inner surface of the spacer opening 28. Furthermore, the liquid which disperse | distributed the fine particle of tin oxide and antimony oxide was sprayed and coat | covered on an insulating film, and this liquid is dried and baked, and a high resistance film is formed.

As shown in Fig. 4, the first and second molds 36a and 36b functioning as molds have through holes 38a and 38b for forming spacers, and these through holes respectively open the spacers of the grid 24. It is arrange | positioned corresponding to (28). In the 1st metal mold | die 36a and the 2nd metal mold | die 36b, resin which thermally decomposes by heat processing is apply | coated at least on the inner surface of the permeation hole 38a, 38b.

The first die 36a is brought into close contact with the first surface 24a of the grid in a state where each of the transmission holes 38a is aligned with the spacer opening 28 of the grid 24. Similarly, the second die 36b is brought into close contact with the second surface 24b of the grid in a state where each of the transmission holes 38b is aligned with the spacer opening 28 of the grid 24. These 1st metal mold | die 36a, the grid 24, and the 2nd metal mold | die 36b are mutually fixed using the clamper etc. which are not shown in figure.

Next, for example, the paste-shaped spacer forming material 40 is supplied from the outer surface side of the first mold 36a, and the perforation holes 38a of the first mold, the spacer opening 28 of the grid 24, and The spacer forming material 40 is filled into the permeation hole 38b of the second mold 36b. As the spacer forming material 40, an insulating glass paste containing an ultraviolet curable binder (organic component) and a glass filler is used.

Subsequently, the filled spacer forming material 40 is irradiated with ultraviolet rays (hereinafter referred to as UV) from the outer surface sides of the first and second molds 36a and 36b as radiation to cure the spacer forming material. Then, you may thermoset as needed. Next, the resin applied to each of the transmission holes 38a and 38b of the first and second molds 36a and 36b is thermally decomposed by heat treatment, and as shown in Fig. 5, the spacer forming material 40 and the transmission hole are shown. Make a gap in between. Silver paste as a conductive material at both ends of each spacer forming material 40, i.e., only at the tip of the portion to be the first spacer 30a and at the tip of the portion to be the second spacer 30b, for example, by screen printing. (42) is attached. Thereafter, the first and second molds 36a and 36b are released from the grid 24.

Subsequently, the grid 24 in which the first and second spacers 30a and 30b were formed by the spacer forming material 40 was heat-treated in a heating furnace, and after the binder was scattered from the spacer forming material, about 500 30 to 1 hour at -550 degreeC, the spacer formation material and the silver paste 42 are baked together. Thereby, as shown in FIG. 6, the spacer assembly 22 in which the 1st and 2nd spacers 30a and 30b were formed on the grid 24 can be obtained. At the same time, the silver component in the silver paste 42 diffuses over the range of about 0.15 mm in the tip portions of the first and second spacers 30a and 30b. As a result, the first and second spacers 30a and 30b, which are provided integrally with the conductive imparting portions 31a and 31b containing silver at the distal ends, that is, integrally provided, can be obtained.

On the other hand, the second substrate on which the first substrate 10 on which the phosphor screen 16 and the metal back 17 are provided, the electron emission element 18 and the wiring 21 are provided, and the sidewall 14 is bonded to each other. Prepare (12).

Subsequently, the spacer assembly 22 configured as described above is positioned on the second substrate 12. At this time, the spacer assembly 22 is positioned so that the extended ends of the second spacers 30b are disposed on the wirings 21, respectively. In this state, the first substrate 10, the second substrate 12, and the spacer assembly 22 are disposed in the vacuum chamber to evacuate the vacuum chamber, and then the first substrate is passed through the side wall 14 to the second substrate. Bond to the substrate. Thereby, the SED provided with the spacer assembly 22 is manufactured.

According to the SED configured as described above, as shown in FIG. 3, the electron beam B emitted from the electron emission element 18 located near the second spacer 30b constitutes the front end of the second spacer 30b. It repulses by the electric field which the electroconductivity provision part 31b forms, and it goes to the electron beam passage hole 26, orbiting in the direction away from a 2nd spacer. Thereafter, the electron beam B is then attracted to the charged second spacer 30b and the first spacer 30a, and orbits in a direction approaching these spacers. In addition, the electron beam B is repelled by an electric field formed by the conductivity providing portion 31a constituting the tip of the first spacer 30a, and traverses the phosphor screen 16 while orbiting in a direction away from the first spacer. Headed. This repulsion and suction cancel out of the orbit of the electron beam B, and the electron beam B emitted from the electron emission element 18 finally reaches the phosphor layer targeted by the phosphor screen 16.

The smaller the distance between the electron-emitting device 18 and the spacer is, the larger the amount the electron beam moves toward the spacer side. On the contrary, when the distance between the electron-emitting device and the spacer is sufficiently large, the amount that the electron beam moves toward the spacer side becomes negligible. The movement phenomenon of the electron beam occurs when secondary electrons and reflected electrons generated at the fluorescent surface collide with the spacers and the spacers are charged. In the case of the acceleration voltage used in the SED, the secondary electron emission coefficient at the spacer surface becomes 1 or more, and the spacer sidewalls are positively charged to attract the electron beam to the spacer side.

In the present SED, the charging of the spacers is not avoided, and the conductivity providing portions are respectively provided at the distal end portion of the first substrate 10 side of the first spacer 30a and the distal end portion of the second substrate 12 side of the second spacer 30b. By providing 31a and 31b, an electric field for repelling the electron beam in a direction away from the spacer is formed. By controlling the heights of the conductivity providing portions 31a and 31b, the amount of repulsion can be controlled by changing the strength of the electric field.

Therefore, according to the present SED, even when the first and second spacers 30a and 30b are charged and the electron beam B is pulled by these spacers, the deviation of the trajectory of the electron beam can be prevented. Thereby, the SED can be obtained by preventing the mis-landing of the electron beam B, reducing the deterioration of color purity, and improving the image quality.

Of the conductivity providing portions provided in the spacer, the conductivity providing portion 31b on the second substrate 12 side is close to the emission side of the electron beam, so that the electric field formed by the conductivity providing portion 31b is large in the trajectory of the electron beam. affect. That is, the electron beam has high sensitivity to the electric field formed by the conductivity providing portion 31b. Therefore, if the height from the 2nd board | substrate 12 of the electroconductive provision part 31b changes a little, the trajectory of an electron beam will change large. For this reason, when the trajectory of the electron beam is to be controlled only by the conductivity providing portion 31b on the second substrate side, electrons emitted from the plurality of electron emitting elements are generated when a variation occurs in the height of the conductivity providing portion 31b in the manufacturing process. Differences in the amount of movement between the beams occur, making it difficult to accurately control the electron beam trajectory.

However, according to the SED according to the present embodiment, the conductive provision portions 31a and 31b are provided at the front end portions of both the spacers of the first spacer 30a and the second spacer 30b, and the electron beam of the conductivity provision portion 31b is provided. As a tendency to suppress the action on the track, the shortage of the track correction is corrected by the electroconductive provision part 31a having low sensitivity. This makes it possible to easily and accurately control the electron beam trajectory.

Thereby, manufacturing precision of electroconductivity provision part 31a, 31b can be lowered, and it becomes possible to manufacture electroconductivity provision part 31a, 31b easily. That is, by providing the electroconductive provision part at the front-end | tip of both the 1st and 2nd spacers 30a and 30b, the effect similar to the case where the electroconductivity provision part is provided with the high precision provided only by the 2nd board | substrate 12 side can be acquired easily.

When conducting the entire first and second spacers 30a and 30b, the reactive current flowing from the first substrate 10 to the second substrate 12 through the spacer increases to increase the temperature and the power consumption. Causes an increase. In addition, during the operation of the SED, this conductive processing portion may be a source of gas generation, causing an ion bombardment of the electron-emitting device disposed in the vicinity of the spacer.

On the other hand, according to this embodiment, the electroconductive provision part 31a, 31b is formed in the front-end | tip of 1st and 2nd spacer 30a, 30b, and the spacer has the 3-stage structure of the electroconductive part-insulation part-electroconductive part. . This makes it possible to easily and accurately control the trajectory of the electron beam by changing the electric field around the spacer by the conductive provision parts 31a and 31b without causing an increase in reactive current, an increase in temperature, an increase in power consumption, or ion collision. can do.

The SED concerning this embodiment and the SED provided with the spacer which does not have the electroconductive provision part 31a, 31b mentioned above were prepared, and the movement amount of the electron beam was compared. As a result, in the SED in which the conductivity providing portions 31a and 31b are not provided, the electron beam is attracted to the spacer side by about 120 µm, whereas in the SED according to the present embodiment, the amount of movement of the electron beam becomes ± 20 µm, thereby displaying a display image. The color purity of the was also improved.

According to the present SED, the grid 24 is disposed between the first substrate 10 and the second substrate 12, and the height of the first spacer 30a is lower than that of the second spacer 30b. have. As a result, the grid 24 is located closer to the first substrate 10 side than the second substrate 12. Therefore, even when discharge is generated from the first substrate 10 side, the breakage of the discharge of the electron emission element 18 provided on the second substrate 12 by the grid 24 can be suppressed. Therefore, it is possible to obtain an SED having excellent pressure resistance against discharge and improved image quality.

According to the SED of the above structure, when the height of the first spacer 30a is made lower than the second spacer 30b, the voltage applied to the grid 24 is made larger than the voltage applied to the first substrate 10. Even if the electrons generated from the electron emission element 18 can be reliably reached to the phosphor screen side.

Next, the manufacturing method of the spacer which concerns on 2nd Embodiment of this invention is demonstrated. The grid 24 of predetermined dimensions is formed by the same method as the above-described first embodiment, and the first and second molds 36a and 36b are prepared. Subsequently, similarly to the case shown in FIG. 4, the first surface 24a of the grid with the first mold 36a positioned so that each of the through holes 38a is aligned with the spacer opening 28 of the grid 24. In close contact. Similarly, the second die 36b is brought into close contact with the second surface 24b of the grid with the respective through holes 38b positioned to align with the spacer openings 28 of the grid 24. And the 1st metal mold | die 36a, the grid 24, and the 2nd metal mold | die 36b are mutually fixed using the clamper etc. which are not shown in figure.

Next, for example, the paste-shaped spacer forming material 40 is supplied from the outer surface side of the first mold 36a, and the perforation holes 38a of the first mold, the spacer opening 28 of the grid 24, and The spacer forming material 40 is filled into the permeation hole 38b of the second mold 36b. As the spacer forming material 40, an insulating glass paste containing a UV curable binder (organic component) and a glass filler is used.

Subsequently, the filled spacer forming material 40 is irradiated with UV from the outer surface sides of the first and second molds 36a and 36b to cure the spacer forming material. Then, you may thermoset as needed. Next, the resin applied to each of the transmission holes 38a and 38b of the first and second molds 36a and 36b is thermally decomposed by heat treatment, and as shown in FIG. 7, the spacer forming material 40 and the transmission hole are shown. Make a gap in between. Thereafter, the first and second molds 36a and 36b are released from the grid 24.

Subsequently, the grid 24 in which the first and second spacers 30a and 30b are formed by the spacer forming material 40 is heat-treated in a heating furnace, and the binder is scattered from the spacer forming material to remove the binder. Do it. Then, as shown in Fig. 8, in the porous state before the sintering of the spacer forming material 40, the ultrafine particles of silver only by the tip of the first spacer 30a and the tip of the second spacer 30b, for example, by inkjet. And a solution consisting of etadecane solution. The attached solution penetrates about 0.2 mm into the tip portions of the first and second spacers 30a and 30b by capillary action.

Next, the grid 24 in which the first and second spacers 30a and 30b are formed is placed in a heating furnace, and main baking is performed at about 500 to 550 ° C. for 30 minutes to 1 hour. By the main baking, the glass particles constituting the spacer forming material are integrated to obtain a spacer assembly 22 in which the first and second spacers 30a and 30b are formed on the grid 24. At the same time, the first and second spacers 30a and 30b each having the conductivity-providing portions 31a and 31b containing silver as a bulk at the distal end can be obtained.

Then, the SED provided with the spacer assembly 22 can be obtained by assembling the first substrate 10, the spacer assembly 22, and the second substrate in the same manner as in the first embodiment.

The SED concerning this embodiment and the SED provided with the spacer which does not have the electroconductive provision part 31a, 31b mentioned above were prepared, and the movement amount of the electron beam was compared. As a result, in the SED in which the conductivity providing portions 31a and 31b are not provided, the electron beam is attracted to the spacer side by about 120 µm, whereas in the SED according to the present embodiment, the amount of movement of the electron beam becomes ± 20 µm, thereby displaying a display image. The color purity of the was also improved.

In addition, another structure is the same as that of 1st Embodiment mentioned above, the same code | symbol is attached | subjected to the same part, and the detailed description is abbreviate | omitted. Also in SED provided with the spacer manufactured by the manufacturing method which concerns on 2nd Embodiment, the effect similar to 1st Embodiment can be acquired.

Next, the manufacturing method of the spacer which concerns on 3rd Embodiment of this invention is demonstrated. By the method similar to 1st Embodiment, the grid 24 is formed and the 1st and 2nd metal mold | die 36a, 36b is prepared. Subsequently, as shown in Fig. 9, the first die 36a is positioned on the first surface 24a of the grid in a state where each of the transmission holes 38a is aligned with the spacer opening 28 of the grid 24. Close contact Similarly, the second die 36b is brought into close contact with the second surface 24b of the grid with the respective through holes 38b positioned to align with the spacer openings 28 of the grid 24. And the 1st metal mold | die 36a, the grid 24, and the 2nd metal mold | die 36b are mutually fixed using the clamper etc. which are not shown in figure.

Next, for example, the first paste 40a is supplied as the spacer forming material from the outer surface side of the first mold 36a, and the perforation holes 38a of the first mold and the spacer openings 28 of the grid 24 are then supplied. ) And the through hole 38b of the second mold 36b are filled with the spacer forming material 40. At this time, a space is left at the end of the permeation hole 38a and at the end of the permeation hole 38b without filling the first paste 40a. As the 1st paste 40a, it is set as the paste which does not contain the component which has electroconductivity using the insulating glass paste containing a UV curable binder and a glass filler.

Subsequently, the second paste 40b is supplied as the spacer forming material from the outer surface sides of the first mold 36a and the second mold 36b, and is superposed on the first paste and injected into the end portions of the through holes 38a and 38b. do. As the second paste 40b, a glass paste containing Au curable binder (organic component) and a glass filler and having Au particles diffused as a conductive component is used.

Subsequently, UV is irradiated to the filled first and second pastes 40a and 40b from the outer surface side of the first and second molds 36a and 36b to cure the first and second pastes. Then, you may thermoset as needed. Next, the resin applied to each of the transmission holes 38a and 38b of the first and second molds 36a and 36b is thermally decomposed by heat treatment, and is formed between the first and second pastes 40a and 40b and the transmission holes. Create a gap Thereafter, the first and second molds 36a and 36b are released from the grid 24.

After releasing, the grid 24 formed with the first and second spacers 30a and 30b by the first and second pastes 40a and 40b is heat-treated in a heating furnace, and then removed from the first and second pastes. The binder is scattered to remove the binder. In addition, the first and second pastes 40a and 40b are baked at about 500 to 550 ° C. for 30 minutes to 1 hour. Thereby, as shown in FIG. 11, the spacer assembly 22 in which the 1st and 2nd spacers 30a and 30b were formed on the grid 24 can be obtained. At the same time, the first and second spacers 30a and 30b each having the conductivity providing portions 31a and 31b in which Au is dispersed at the distal ends as a bulk can be obtained.

Then, the SED provided with the spacer assembly 22 can be obtained by assembling the first substrate 10, the spacer assembly 22, and the second substrate by the same method as in the first embodiment.

The SED concerning this embodiment and the SED provided with the spacer which does not have the electroconductive provision part 31a, 31b mentioned above were prepared, and the movement amount of the electron beam was compared. As a result, in the SED in which the conductivity providing portions 31a and 31b are not provided, the electron beam is attracted to the spacer side by about 120 µm, whereas in the SED according to the present embodiment, the amount of movement of the electron beam becomes ± 20 µm, thereby displaying a display image. The color purity of the was also improved.

In addition, in 3rd Embodiment, the other structure is the same as that of 1st Embodiment mentioned above, The same code | symbol is attached | subjected to the same part, and the detailed description is abbreviate | omitted. And also in the SED provided with the spacer manufactured by the manufacturing method which concerns on 3rd Embodiment, the effect similar to 1st Embodiment can be acquired.

The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the present invention. For example, the present invention is not limited to an image display apparatus having a grid, but is also applicable to an image display apparatus having no grid. In this case, by using the columnar or plate-shaped spacers formed integrally with each other, the electroconductive provision portions are integrally provided at the tip end portion on the first substrate side and the tip end portion on the second substrate side of each spacer to obtain the same effects as described above. Can be.

In addition, in this invention, the diameter and height of a spacer, the dimension, material, etc. of other components can be suitably selected as needed. In the above-mentioned embodiment, although the edge part of the side of the 2nd board | substrate side of a spacer was provided on the wiring of a 2nd board | substrate, it is not limited to a wiring, Even if it is provided on the 2nd board | substrate in the position which avoided the electron emission element. good. The opening of the spacer of the grid may be omitted.

When the potential of the grid 24 and the potential of the first substrate are set to the same potential, the entirety of the first spacer may be impregnated with the conductive material to form the entirety of the first spacer as the conductivity providing portion.

In addition, in the above-described embodiment, the conductive provision portion is formed at the tip ends of the first and second spacers, but the conductivity provision portion is formed only at the tip end portion of the second spacer, that is, the tip end portion on the second substrate side of the spacer by the manufacturing method described above. You may form and comprise an SED using this spacer.

The electron source is not limited to the surface conduction electron emission device, and any type can be applied as long as it is an FED using an electron source in which electrons are emitted in a vacuum such as a field emission type and a carbon nanotube.

According to the present invention, an image display device having an improved image quality by easily controlling the trajectory of an electron beam without causing an increase in temperature, an increase in power consumption, or an increase in manufacturing cost, and manufacture of a spacer for use in the image display device. The image display apparatus provided with the method and the spacer manufactured by the said manufacturing method can be provided.

Claims (18)

A first substrate having a fluorescent surface, A second substrate disposed to face the first substrate with a gap therebetween and provided with a plurality of electron sources releasing electrons to excite the fluorescent surface; A plurality of spacers each formed of an insulating material and disposed between the first substrate and the second substrate and supporting atmospheric loads acting on the first and second substrates, The tip portion on the first substrate side and the tip portion on the second substrate side of each of the spacers are impregnated with a conductive material to form conductivity provision portions, respectively. The image display apparatus of the said electroconductive material containing density in each said electroconductive provision part is decreasing toward the intermediate part from the front-end | tip part of the said spacer. delete The method of claim 1, wherein the spacer is formed of an insulating material including glass, Each said electroconductive provision part contains the metal particle which has electroconductivity dispersed in the glass component which forms the said spacer. The method of claim 1, wherein the spacer is formed of an insulating material including glass, The electroconductive provision part contains the metal component which has electroconductivity spread | diffused in the glass component which forms the said spacer. 4. An image display device according to claim 3, wherein the metal particles contain at least one of Ni, In, Ag, Au, Pt, Ir, Ru, and W. 2. The apparatus of claim 1, further comprising: a plurality of potential supply wirings provided on the second substrate; An end portion on the second substrate side of each of the spacers is disposed on the potential supply wiring. The image display device according to claim 6, wherein the electron source is a surface conduction electron source. 8. The image display device according to claim 7, wherein the potential supply wiring is a wiring for supplying a potential to the electron source. The plate-like grid according to claim 1, further comprising a plate-shaped grid which is provided between the first and second substrates and has a plurality of electron beam passing holes corresponding to the electron source, respectively. And each of the spacers is fixed to the grid. An image display apparatus comprising: a first substrate having a fluorescent surface; and a second substrate provided with a gap between the first substrate and a plurality of electron sources for emitting electrons to excite the fluorescent surface, wherein the second substrate is provided. In the manufacturing method of the spacer which manufactures the some spacer arrange | positioned between a 1st board | substrate and a 2nd board | substrate, and supports the atmospheric load which acts on a 1st and 2nd board | substrate, The spacer is molded by an insulating material, Attaching a paste or solution containing a conductive component to the tip of the shaped spacer, infiltrating the paste or solution into the tip of the spacer by capillary action, And a spacer having the paste or solution impregnated therein and forming a spacer having a conductive end portion impregnated with a conductive material at its tip. The method of manufacturing a spacer according to claim 10, wherein the paste is attached to both ends of the molded spacer, and a spacer having both ends of the imparting conductivity impregnated with a conductive material is formed. Between a first substrate having a fluorescent surface, a second substrate provided with a gap between the first substrate and a plurality of electron sources releasing electrons to excite the fluorescent surface, and between the first substrate and the second substrate; In the manufacturing method of the spacer which manufactures the said spacer used for the image display apparatus provided with the some spacer arrange | positioned at and supporting the atmospheric pressure load which acts on a 1st and 2nd board | substrate, The spacer is molded by an insulating material, Attaching a paste containing a conductive component to a distal end of the molded spacer, A method for producing a spacer, wherein the paste-attached spacer is heat treated to thermally diffuse a conductive component into the tip of the spacer, and to form a spacer having the conductive end impregnated with the conductive material at the tip. The method for manufacturing a spacer according to claim 12, wherein the paste is attached to both ends of the molded spacer, and a spacer having both ends of the imparting conductivity impregnated with a conductive material is formed. Between a first substrate having a fluorescent surface, a second substrate provided with a gap between the first substrate and a plurality of electron sources releasing electrons to excite the fluorescent surface, and between the first substrate and the second substrate; In the manufacturing method of the spacer used for the image display apparatus provided with the some spacer arrange | positioned at and supporting the atmospheric pressure load which acts on a 1st and 2nd board | substrate, Preparing a mold having a plurality of transmission holes for molding the spacer, Injecting a first paste that does not contain a conductive component into the through hole, A second paste having a conductive component dispersed therein is superposed on the first paste and injected into the transmission hole; A method for producing a spacer, wherein the first and second pastes are subjected to heat treatment to form a spacer provided at the distal end with an electroconductive provision part in which conductive components are dispersed. 15. The method according to claim 14, wherein after injecting the first paste into the through holes, the second paste is injected from both ends of each through hole onto both ends of the first paste, and the conductive components are dispersed. A spacer having the electroconductive provision part at both ends is formed. A first substrate having a fluorescent surface, A second substrate disposed to face the first substrate with a gap therebetween and provided with a plurality of electron sources releasing electrons to excite the fluorescent surface; A plurality of spacers manufactured by the manufacturing method according to any one of claims 10 to 15 and disposed between the first substrate and the second substrate to support atmospheric loads acting on the first and second substrates. Image display device provided. The plate-shaped grid according to claim 16, further comprising a plate-shaped grid which is provided between the first and second substrates and has a plurality of electron beam through holes respectively corresponding to the electron source. And the spacers are fixed to the grid. A first substrate having a fluorescent surface, A second substrate disposed to face the first substrate with a gap therebetween and provided with a plurality of electron sources releasing electrons to excite the fluorescent surface; A plate-shaped grid provided between the first and second substrates and having a plurality of electron beam through holes respectively corresponding to the electron source; The said conductive part manufactured by the manufacturing method in any one of Claims 10, 12, or 14, and arrange | positioned between the said 1st board | substrate and a 2nd board | substrate, and located respectively in the said 2nd board | substrate side, The said electroconductivity An image display apparatus having a provision portion and comprising a plurality of spacers for supporting atmospheric loads acting on the first and second substrates.