KR100505279B1 - Cooling device of thin plate type for preventing dry-out - Google Patents

Abstract

The present invention is a thin plate-shaped housing in which the circulation loop of the fluid is built in to prevent the dry-out phenomenon in the evaporator; And a refrigerant circulating in the circulation loop in the housing, wherein the circulation loop in the housing is formed at one end thereof, and the liquid refrigerant is at least partially filled by capillary action. And an evaporator in which the filled liquid refrigerant is evaporated by heat transferred from an external heat source; A gaseous refrigerant moving unit which is formed adjacent to the evaporation unit and is a passage through which the vaporized refrigerant moves toward the branch portion and includes at least one first cavity in which an uncondensed gaseous refrigerant may be accommodated; A condenser formed in an area adjacent to the gaseous refrigerant moving part and configured to condense the gaseous refrigerant into a liquid phase; A liquid refrigerant moving part formed in an area adjacent to the condensation part as an area of at least a portion of the branch part, and insulated from the evaporation part, and the refrigerant condensed in the liquid phase moves toward the evaporation part; And it discloses a thin plate-type cooling device comprising a heat insulating portion for insulating the evaporator and at least a portion of the liquid refrigerant moving part.

Description

Cooling device of thin plate type for preventing dry-out}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin plate type cooling device for cooling heat in a semiconductor integrated circuit device, and the like, and more particularly, to a thin plate type cooling device which can prevent a dry out phenomenon of a refrigerant as a cooling device using a cooling method by a phase change of a working fluid. It is about.

As the trend toward higher integration of semiconductor devices reduces design rules, and as line widths of electronic circuits forming semiconductor devices decrease, the number of transistors per unit area increases, resulting in miniaturization and high performance of electronic equipment. However, with this, the heat dissipation rate per unit area of the semiconductor device is further increased. The increase in heat dissipation rate degrades the performance and shortens the life of the semiconductor device, and ultimately reduces the reliability of the system employing the semiconductor device. In particular, in the semiconductor device, various parameter values are sensitively changed depending on the operating temperature, thereby deteriorating the characteristics of the integrated circuit.

In response to such an increase in heat dissipation rate, cooling technologies for cooling them have been developed. Conventional known cooling technologies include fin-fan cooling, thermoelectric cooling, and liquid injection. (water-jet) cooling, immersion cooling, heat pipe cooling.

The fin-fan cooling method has been widely used for decades as a method of forced cooling using fins and / or fans, but has a problem of low cooling efficiency compared to noise, vibration, and a large volume. In addition, the thermoelectric element cooling method has a problem that there is no noise and vibration, but the efficiency is low, so a large operating power is required, and an excessive heat dissipation device is required on the high heat side.

The liquid spray cooling method has a high efficiency, making the mainstream of the research of the cooler, but the use of a thin film pump using an external power source, such as the structure is complicated and subject to a lot of gravity, there is a limit of application, especially personal portable electronics When applied to equipment, there is a problem that robust design is difficult.

In addition, in a cooling apparatus using a heat pipe, the flow direction of the gas in the tube and the liquid are opposite to each other, so that the flow of gas from the evaporator to the condenser is acted as a flow resistance to the fluid condensed in the condenser and returned to the evaporator. . Therefore, if a high calorific value is applied to the heat pipe, the liquid returning to the high velocity gas does not return to the evaporator, and a dry-out phenomenon in which the liquid refrigerant is depleted occurs in the evaporator. In addition, the vaporized refrigerant moves inside the pipe depending on the buoyancy and pressure difference, and inside the heat pipe, the liquefied refrigerant is dependent on gravity due to the structure and size of the return medium, so that there are many restrictions on the installation location. There is a problem that follows.

In order to solve this problem, the applicant of the present invention, in the patent application No. 2001-52584 "Thin-plate cooling device", the cooling performance is hardly affected by gravity and the small size of the natural circulation of the refrigerant without the supply of external power A thin plate cooling device has been disclosed. The disclosed thin plate cooling device includes a thin plate-shaped housing in which a circulation loop of a fluid is embedded and a refrigerant circulating through the circulation loop in the housing, wherein the circulation loop in the housing includes one end inside the housing. Is formed in, the refrigerant storage unit for storing a liquid refrigerant; And at least one first microchannel connected to one end of the refrigerant storage unit, wherein the liquid phase refrigerant flows from the refrigerant storage unit by surface tension with an inner wall of the first microchannel in the first microchannel. The liquid refrigerant partially filled to a predetermined portion of the first microchannel, the surface tension in the first microchannel being greater than gravity, and filled in the first microchannel by heat absorbed from a heat source. Evaporation unit capable of vaporizing; At least one second microchannel spaced apart from the first microchannel in the longitudinal direction by a predetermined distance in the longitudinal direction and capable of condensing the refrigerant in the vaporized and moved gas in the first microchannel, A condenser configured to have a surface tension between the inner wall of the second microchannel and the condensed refrigerant greater than gravity; A gas phase refrigerant moving unit positioned between the first microchannel of the evaporator and the second microchannel of the condenser; And a liquid refrigerant moving part which transfers the liquid refrigerant condensed in the condensation part to the refrigerant storage part and is separated from the gas phase refrigerant moving part.

According to the disclosed thin plate cooling device, as the refrigerant circulating in the circulation loop inside the housing causes a phase change between the liquid phase and the gaseous phase, it uses the latent heat during the phase change to heat the external heat source in contact with the cooling device. Cool.

However, according to the disclosed thin plate cooling device, the refrigerant in the gas phase is not completely condensed in the condensation unit, but is included in the form of bubbles (bubbles) in the condensed refrigerant to reach the evaporation unit through the liquid refrigerant moving unit and / or the refrigerant storage unit. There may be cases. When bubbles are included in the liquid refrigerant to reach the evaporator, a dryout phenomenon in which the liquid refrigerant is depleted may occur in the evaporator.

SUMMARY OF THE INVENTION An object of the present invention is to improve the above problems, and an object of the present invention is to provide a thin plate cooling device capable of preventing a dry out phenomenon in an evaporator.

It is also an object of the present invention to provide a thin plate type cooling device in which the cooling efficiency is increased by improving the flow of the refrigerant.

In order to achieve the above object, the present invention includes a thin-plate housing and a phase change in which the circulation loop of the fluid is built, and includes a refrigerant circulating in the circulation loop in the housing, and circulation in the housing. The loop is formed at one end thereof, and the liquid phase refrigerant is filled in at least a part by a capillary phenomenon, and the vaporized portion in which the filled liquid refrigerant is vaporized by heat transferred from an external heat source; A gaseous refrigerant moving unit which is formed adjacent to the evaporation unit and is a passage through which the vaporized refrigerant moves toward the branch portion and includes at least one first cavity in which an uncondensed gaseous refrigerant may be accommodated; A condenser formed in an area adjacent to the gaseous refrigerant moving part and configured to condense the gaseous refrigerant into a liquid phase; A liquid refrigerant moving part formed in an area adjacent to the condensation part as an area of at least a portion of the branch part, and insulated from the evaporation part, and the refrigerant condensed in the liquid phase moves toward the evaporation part; And it provides a thin plate cooling device including a heat insulating part for insulating the evaporator and at least a portion of the liquid refrigerant moving part.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, referring to FIG. 1A, FIG. 1A is a perspective view schematically showing an outer appearance of a thin plate cooling apparatus 100 according to a first embodiment of the present invention. It is preferable that the thin plate-shaped cooling apparatus 100 of this invention has the external shape which consists of a substantially rectangular parallelepiped, and is formed by adhering the board | substrate 100a and the upper board 100b with which the internal component was formed, respectively.

For convenience of understanding and explanation, as shown in FIG. 1A, the longitudinal direction (direction from the left side to the right side of the drawing) of the thin plate cooling apparatus 100 of the present invention is defined as the "X-axis direction", and the thin plate type The width direction (direction of entry toward the drawing) of the cooling device 100 is defined as the “Y-axis direction”, and the height direction (direction from the lower side of the drawing toward the upper side) of the thin plate-shaped cooling device 100 is “Z”. Axial direction ". In addition, the cross section viewed from the negative Z axis direction (ie, the direction from the bottom side to the upper side of the drawing) is referred to as the "section viewed from the 'ga' direction", and the positive Z axis direction (that is, from the top side to the bottom side of the drawing) The cross section seen from the direction toward the cross section "

Referring to FIG. 1B, FIG. 1B is a schematic cross-sectional view of the thin plate cooling apparatus 100 according to the first embodiment of the present invention when viewed in the 'XY' section. As shown, the substrate 100a of the thin plate type cooling device 100 is configured to form a circulation loop of the refrigerant by being combined with the upper plate 100b in the housing 112 having a generally rectangular shape. The coolant is circulated in the direction of the arrow and cools the heat of the external heat source in contact with the cooling device 100 by using latent heat during phase change between the liquid phase and the gas phase.

The housing 112 may include a semiconductor material such as silicon or gallium, a new material laminated material such as a self-assembled monolayer (SAM), a metal material such as copper or aluminum having excellent thermal conductivity and / or an alloy material thereof, It may be made of various materials such as a ceramic material, a polymer material such as plastic, or a crystalline material such as diamond. In particular, when the external heat source is a semiconductor chip, the thermal shock may be minimized by forming the same material as the surface material of the external heat source. In addition, when the thin plate cooling apparatus 100 is made of a semiconductor material, in the manufacturing process of the semiconductor chip, it may be formed to be integral with the surface material of the external heat source to minimize the contact thermal resistance.

Next, the refrigerant injected into the thin plate cooling apparatus 100 may be selected from those capable of causing a phase change between the liquid phase and the gas phase by external heat. According to this embodiment, it is preferable to use water having a high latent heat and surface tension as the refrigerant, because it is preferable not to use a Freon (CFC) -based refrigerant in consideration of environmental pollution.

In addition, since the magnitude of the surface tension between the inner wall and the refrigerant varies depending on the material of the thin plate-shaped cooling device 100, in the implementation of the present invention, a suitable refrigerant should be selected. For example, in addition to water, alcohol type refrigerant | coolants, such as methanol or ethanol, can also be used. In the case of the water or alcohol-based refrigerant as described above, the heat capacity is large, and the contact angle due to the surface tension with the inner wall of the semiconductor material is small, so that the flow rate of the refrigerant is increased, which is advantageous to transfer a large amount of heat. In addition, in the case of water or alcohol-based refrigerant, unlike the freon-based refrigerant, even if leaked from the thin-plate cooling apparatus 100 for some reason, there is no problem of environmental pollution.

The selection of such refrigerants is merely a design option for the practice of the present invention and thus is not intended to limit the technical scope of the present invention.

As shown, the thin plate cooling device 100 is formed at one end of the inside, the liquid refrigerant is at least partly filled by the capillary phenomenon, the filled liquid refrigerant is an external heat source (not shown) An evaporator 104 vaporized by heat transferred from the upper surface of the evaporator 104, a vapor phase refrigerant moving unit 106 formed adjacent to the evaporator 104, and moving the vaporized refrigerant in a predetermined direction by the pressure difference; It is formed adjacent to the gas phase refrigerant moving unit 106, and the condensation unit 108 and the condensation unit 108 is formed adjacent to the condensation unit 108 is condensed into the liquid phase of the gas phase, and is insulated from the evaporator 104, The refrigerant condensed into the liquid phase includes the liquid refrigerant moving parts 102 and 110 moving toward the evaporator 104.

The evaporation unit 104, the gaseous phase refrigerant moving unit 106, the condensation unit 108, and the liquid phase refrigerant moving units 102 and 110 may be formed only on the substrate 100a of the thin plate cooling apparatus 100. In addition, the upper plate 100b of the thin plate cooling device 100 may include only a cavity formed in a predetermined region. The configuration of the upper plate 100b will be described later with reference to FIGS. 2 to 5.

In the thin plate cooling apparatus 100, the refrigerant forms a circulation loop in the direction of the arrow in the drawing. In other words, the evaporator 10, the gas phase refrigerant moving unit 106, the condensation unit 108, the condensation unit side liquid refrigerant moving unit 110 and the evaporator side liquid refrigerant moving unit 102 to be circulated in turn. Consists of.

According to an exemplary embodiment of the present invention, the liquid refrigerant moving unit 102 may further include a refrigerant storage unit (not shown) having an appropriate volume so that a predetermined amount of liquid refrigerant may be stored in a predetermined region of the liquid refrigerant moving units 102 and 110. have. For example, an area of the liquid refrigerant moving part 102 on the evaporation part side may be formed and used as the refrigerant storage part. In addition, a plurality of cold storage portions may be formed.

The evaporator 104 is formed adjacent to one end (“outlet side”) of the liquid refrigerant moving part 102 on the evaporator side, and the evaporator 104 has a plurality of microchannels formed by capillary action. At least some or all of the microchannels are filled with the refrigerant stored in the liquid phase refrigerant moving part 102 on the evaporation part side. In addition, the evaporator 104 is installed to be adjacent to an external heat source (not shown). Accordingly, the liquid refrigerant charged in the microchannels is vaporized by the heat transferred from the heat source to phase change into a gaseous refrigerant. Will cause. Therefore, the heat from the heat source is absorbed by the refrigerant as much as the latent heat due to the phase change of the refrigerant, and as described later, the heat of the heat source is removed by dissipating heat while condensing again in the condensation unit 108. Done.

The surface tension in the microchannel is preferably formed to be greater than gravity. The smaller the contact angle of the meniscus of the liquid refrigerant filled in the microchannel is, the more preferable. For this purpose, the inner wall of the microchannel is preferably formed of a hydrophilic material or subjected to hydrophilic treatment on the surface of the microchannel. Do. Examples of such hydrophilic treatments include plating treatment, coating treatment, coating treatment, coloring treatment, anodizing treatment, plasma treatment, laser treatment, and the like. In addition, the surface roughness of the inner wall of the microchannel can be adjusted to improve the heat transfer rate.

Meanwhile, not only the microchannels of the evaporator 104 but also the liquid phase refrigerant movers 110 and 102 and the evaporator 104 are hydrophilic on their surfaces, and the vapor phase refrigerant mover 106 and the condenser 108 The surface is hydrophobicly treated, thereby improving the flow of refrigerant to increase the cooling efficiency.

Further, the cross section of the microchannel may be formed to have various shapes such as a circle, an oval, a rectangle, a square, and a polygon, in addition to a rectangle. In particular, it is possible to control the magnitude of the surface tension with the refrigerant by increasing or decreasing the cross-sectional area along the length direction (that is, the X-axis direction) of the microchannel, and moving the refrigerant by installing a plurality of grooves or nodes on the inner wall thereof. It is also possible to determine the direction or to control the moving speed of the refrigerant.

Next, the refrigerant evaporated in the evaporator 104 is moved in the opposite direction of the liquid refrigerant mover 102 on the evaporator side, and thus the gaseous refrigerant mover that serves as a passage through which the refrigerant in the gas phase may move. 106 is formed adjacent to the evaporator 104. As shown, the gaseous phase refrigerant moving part 106 has a plurality of vaporized refrigerants to move in a predetermined direction (i.e., opposite to the evaporation part side liquid refrigerant moving part 102 used as the refrigerant storage part). May include second guides 118. The second guides 118 also have a function of increasing the mechanical strength of the thin plate cooling device 100. Therefore, when there is no problem in mechanical strength, the second guide 118 may not be included.

Next, the condensation unit 108 is an area where the refrigerant in the gas phase that has moved through the gas phase refrigerant moving unit 106 is condensed again and liquefied. According to the present embodiment, the condensation unit 108 is formed at a position spaced by a predetermined distance on the same plane as the evaporation unit 104.

Meanwhile, the condensation unit 108 may include a plurality of microchannels (not shown) similar to the microchannels formed in the evaporator 104. The microchannel of the condensation unit 108 may be formed to extend to the liquid refrigerant moving part 110 as described below, and may also be formed to extend to the liquid refrigerant moving part 102 of the evaporation part side. . The microchannels of the condensation unit 108 further facilitate condensation of the gaseous refrigerant, and provide a surface tension for allowing the condensed liquid refrigerant to move in the direction of the liquid refrigerant moving part 102 on the evaporation side. Promote the completion of the loop.

Depth of the microchannel of the condensation unit 108 is preferably formed deeper than the depth of the microchannel of the evaporator 104, but is not limited thereto. In addition, since all matters related to the microchannel of the evaporator 104 may be equally applied to the microchannel of the condensation unit 108 regarding the shape of the cross section, the change of the cross-sectional area, the formation of the groove or the node, and the like, The details are omitted.

In addition, in order to further improve the effect of heat dissipation, a plurality of fins may be formed in the thin plate cooling device 100 outside the condensation unit 108. The fins may be radially formed outside the condensation unit 108 or may be formed in other predetermined shapes. The ambient air contacts between these fins to maximize the heat dissipation effect.

In addition, when the fin is formed to include a micro actuator, the fins may be driven to circulate the surrounding air by recycling heat emitted from the condenser 108 to the outside. In addition, when the fin is formed in a microstructure including a thermoelectric element, the heat emitted from the condenser 108 may be converted into electrical energy and used as energy for fine driving.

In addition, by forming the volume of the condensation unit 108 larger than the volume of the evaporation unit 104, it is possible to easily condense the gaseous refrigerant in the condensation unit 108 only by convection of ambient air.

Next, the liquid phase refrigerant moving part 110 forms a passage through which the liquid refrigerant condensed in the condensation part 108 moves to the liquid phase refrigerant moving part 102 on the evaporation part side. As shown, the liquid refrigerant moving part 110 is insulated from the gas phase refrigerant moving part 106, the condensation part 108, and the evaporation part 104 by the heat insulating part 116.

The heat insulating part 116 may be configured in the form of an internal partition formed at a predetermined position in the thin plate cooling apparatus 100 or in the form of a separate inner space sealed at a predetermined position in the thin plate cooling apparatus 100 or the thin plate shape. It can be configured in a form that is open to penetrate the upper and lower sides of the cooling device (100). When formed in the form of an inner space sealed in the thin plate cooling apparatus 100, the heat insulating part 116 may be maintained in a vacuum state or filled with a heat insulating material such as air.

As shown, the liquid refrigerant moving part 110 is preferably formed to be symmetrical along both side surfaces of the thin plate cooling device (100). The refrigerant circulation loop symmetrically formed along the outer circumference of the thin plate-shaped cooling device 100 is a structure that is very advantageous for heat dissipation to the surroundings when the shape of the thin plate, that is, the aspect ratio of the cross section is large, radiates heat transferred from the heat source By spreading in the direction, a large area can be utilized and released to the surroundings.

In addition, such a bidirectional refrigerant circulation loop is affected by gravity depending on the installation position of the cooling device 100, even when the refrigerant circulation in one of the liquid refrigerant moving parts 110 is not smooth. The refrigerant may be circulated through the refrigerant moving unit 110.

Of course, as described above, the liquid refrigerant moving part 110 may also include a microchannel so as to be hardly affected by gravity, and in the microchannel, the liquid phase on the evaporator side used as the refrigerant storage part. A method such as forming a plurality of grooves (not shown) in the direction toward the refrigerant moving part 102 can be used. Further, the cross-sectional areas of the microchannels formed in the evaporator 104 or the liquid refrigerant moving parts 110 and 102 may be in contact with the gaseous phase refrigerant moving part 106 from the liquid refrigerant moving part 110 in contact with the condensation part 108. It is preferable to gradually decrease until the evaporation part 104.

On the other hand, the moving direction of the liquid refrigerant at the boundary between the liquid refrigerant moving part 102 and the liquid refrigerant moving part 110 and the condensing part 108 and the liquid refrigerant moving part 110 at the evaporation part side. It is also possible to form a plurality of guides (not shown) for defining the resistance, so as to reduce the resistance of the refrigerant circulation caused by the rapid turning of the flow path of the refrigerant.

On the other hand, in order to reduce the contact thermal resistance, it is preferable to directly fix the evaporator 104 to a heat source (not shown) adjacent to the evaporator 104 without placing a heat conductor in the middle. To this end, in the present embodiment, a fixing means 114 for fixing the cooling device 100 to an external heat source is installed adjacent to the evaporation unit 104, and is capable of being fastened by bolts or rivets. Of course, the fixing means 114 is not related to the circulation of the refrigerant and may not include it.

Next, referring to FIGS. 2A to 2C, the upper plate 100b of the thin plate cooling apparatus 100 according to the first embodiment of the present invention will be described in detail. FIG. 2A is a schematic cross-sectional view of the thin plate cooling apparatus 100 according to the first embodiment of the present invention when viewed in an 'XY' cross section, and FIG. 2B is a thin plate cooling apparatus according to the first embodiment of the present invention. 2A is a schematic cross-sectional view taken along the line AA ′ of FIG. 2A, and FIG. 2C is a cross-sectional view taken along the YZ plane of the thin plate cooling apparatus 100 according to the first embodiment of the present invention. Schematic cross section seen along the BB 'line. According to the present embodiment, the cross-sectional view seen in the direction of FIG. 2A is a bottom view of the top plate 100b of the thin plate cooling apparatus 100.

As shown, according to the present embodiment, the upper plate 100b of the thin plate type cooling device 100 is formed of a gaseous phase that is not condensed in a region corresponding to the gaseous phase refrigerant moving unit 106 of the substrate 100a. And a first cavity 124 for providing a free space in which the refrigerant can be accommodated. In addition, the top plate 100b may include a heat insulating part 116 corresponding to the heat insulating part 116 of the substrate 100a. The upper plate 100b may be formed of the same material as the housing 112 of the substrate 100a. Alternatively, the upper plate 100b may be formed using a material such as glass.

Referring to FIG. 2C, the first cavity 124 is formed to have a semi-elliptical cross section in a direction parallel to the Y axis on the YZ plane. The first cavity 124 provides a free space for accommodating the refrigerant in the gas phase, thereby preventing the gaseous refrigerant not condensed in the condensation part 108 from being contained in the condensed liquid refrigerant and becoming a bubble.

3A to 3C, the upper plate 100b of the thin plate cooling apparatus 100 according to the second embodiment of the present invention will be described in detail. FIG. 3A is a schematic cross-sectional view of the thin plate cooling apparatus 100 according to the second embodiment of the present invention, viewed in an 'XY' direction, and FIG. 3B is a thin plate cooling apparatus according to the second embodiment of the present invention. 3A is a schematic cross-sectional view taken along the line AA ′ of FIG. 3A, and FIG. 3C is a cross-sectional view taken along the YZ plane of the thin plate cooling apparatus 100 according to the second embodiment of the present invention. This is a schematic cross-sectional view taken along line BB 'of. According to the present embodiment, the cross-sectional view seen in the direction of 'ga' shown in FIG. 3A is a bottom view of the upper plate 100b of the thin plate-shaped cooling device 100.

As shown, according to the present embodiment, the upper plate 100b of the region corresponding to the gaseous phase refrigerant moving part 106 includes a plurality of second guides 118 formed by the second guide 118 of the gaseous phase refrigerant moving part 106. Each of the moving paths of the gaseous refrigerant includes a plurality of first cavities 124 each having a semi-elliptical cross section on a YZ plane. The first cavity 124 of the second embodiment is different from that of the first cavity 124 of the first embodiment, which is separated to correspond to the second guide 118 of the substrate 100a. Note that the function, the shape and the like are the same as those in the first embodiment.

4A to 4C, the upper plate 100b of the thin plate cooling apparatus 100 according to the third embodiment of the present invention will be described in detail. 4A is a schematic cross-sectional view of the thin plate cooling apparatus 100 according to the third embodiment of the present invention, viewed in an 'XY' cross section, and FIG. 4B is a thin plate cooling apparatus according to the third embodiment of the present invention. 4A is a schematic cross-sectional view taken along the line AA ′ of FIG. 4A, and FIG. 4C is a cross-sectional view taken along the YZ plane of the thin plate cooling apparatus 100 according to the third embodiment of the present invention. This is a schematic cross-sectional view taken along line BB 'of. According to the present embodiment, the cross-sectional view seen in the direction of 'ga' shown in FIG. 4A is a bottom view of the upper plate 100b of the thin plate-shaped cooling device 100.

As shown, the thin plate cooling apparatus 100 according to the third embodiment of the present invention further includes a plurality of second cavities 126 formed in an area corresponding to the condensation unit 108 of the substrate 100a. do. That is, the top plate 100b includes a plurality of first cavities 124 formed in a region corresponding to the gaseous phase refrigerant moving unit 106 of the substrate 100a and the condensation unit 108 of the substrate 100a. And a plurality of second cavities 126 formed in an area corresponding to the cavities, wherein each of the first and second cavities 124 and 126 is formed to be connected to each other.

In addition, as shown in the drawings, each of the second cavities 126 is preferably formed such that its width becomes narrower toward an area corresponding to the liquid refrigerant moving part 110. By doing so, when the substrate 100a and the top plate 100b are combined, the cross-sectional area of the second cavity 126 gradually decreases toward the liquid refrigerant moving part 110, and thus the surface of the condensed refrigerant As the tension is gradually increased, the refrigerant in the gaseous phase, which has not yet been condensed in the condensation unit 108, returns to the first cavity 124 in the region corresponding to the gaseous phase refrigerant moving unit 106. Therefore, it is possible to more effectively prevent the non-condensed gaseous refrigerant from reaching the evaporator 104 by being included in the liquid refrigerant in a bubble form.

Next, with reference to FIGS. 5A to 5D, the upper plate 100b of the thin plate cooling apparatus 100 according to the fourth embodiment of the present invention will be described in detail. FIG. 5A is a schematic cross-sectional view of the thin plate cooling apparatus 100 according to the fourth embodiment of the present invention, viewed in an 'XY' direction, and FIG. 5B is a thin plate cooling apparatus according to the fourth embodiment of the present invention. 5A is a schematic cross-sectional view taken along the line AA ′ of FIG. 5A, and FIG. 5C is a cross-sectional view taken along the YZ plane of the thin plate cooling apparatus 100 according to the fourth embodiment of the present invention. FIG. 5D is a schematic cross-sectional view taken along the line CC ′ of FIG. 5A of the thin-film cooling apparatus 100 according to the fourth embodiment of the present invention. According to the present embodiment, the cross-sectional view seen in the direction of FIG. 5A is a bottom view of the upper plate 100b of the thin plate cooling apparatus 100.

As shown, according to the present embodiment, the upper plate 100b further includes a plurality of third cavities 128 formed in an area corresponding to the liquid refrigerant moving part 110 of the substrate 100a. Each of the third cavities 128 is preferably formed in a hemispherical shape. In addition, the plurality of third cavities 128 may be formed to form a plurality of rows along the liquid refrigerant moving part 110.

According to the present exemplary embodiment, when the refrigerant of the gaseous phase that is not condensed in the condenser 108 is moved to the liquid refrigerant moving part 110 while being included in the liquid refrigerant in the form of a bubble, the plurality of agents The gaseous refrigerant in a bubble form may be captured by the three cavity 128. Therefore, it is possible to more effectively prevent the non-condensed gaseous refrigerant from reaching the evaporator 104 by being included in the liquid refrigerant in a bubble form.

The method of manufacturing the cooling apparatus 100 of each embodiment of the present invention described above may be manufactured by various methods that are widely known at present, for example, MEMS (Micro Electro Mechanical System) method using a semiconductor device manufacturing process or Self-embedded monolayer (SAM) can be manufactured by applying the method. 1B and 2A, the manufacturing method thereof will be briefly described.

That is, first, the surface of the substrate 100a of the cooling apparatus 100 is etched, and the liquid refrigerant moving part 102 of the evaporation part side used as the refrigerant storage part, the first microchannel 120 of the evaporation part 104, and condensation are used. The first guide 122 of the unit 108, the second guide 118 of the gas phase refrigerant moving unit 106, and the liquid phase refrigerant moving unit 110 are formed.

Next, as described with respect to the above-described embodiments, the surface of the top plate 100b is etched to form the cavities 124, 126 and / or 128 and / or the thermal insulation 116.

The substrate 100a and the upper plate 100b having the above structure are contacted with each other, and then a voltage is applied to the substrate 100a and the upper plate 100b to perform anodic bonding to integrate the housing 112, and to separately store the refrigerant. Through a refrigerant injection hole (not shown) formed to be connected to the liquid refrigerant moving part 102 on the evaporation side, which is used as a vacuum, the refrigerant is injected into the refrigerant loop after the pressure is reduced to substantially vacuum. Seal it.

Although the present invention has been described in detail with respect to the above embodiments, it is not limited thereto, and various modifications can be made by those skilled in the art. For example, in the configuration of the first embodiment, the cavity corresponding to the condensation unit 108 is modified into the shape described above with respect to the third embodiment, or the cavity corresponding to the liquid phase refrigerant moving unit 110 is changed. It can be implemented by deforming to the above-described shape with respect to the fourth embodiment. In addition, according to the exemplary embodiment, the same structure as that of the substrate 100a may be formed in a region other than the region in which the cavity of the upper plate 100b is formed.

According to the present invention, in the thin plate type cooling device, a cavity having a predetermined shape is formed above the vapor phase refrigerant moving unit, the condensation unit, and / or the liquid phase refrigerant moving unit, so that the refrigerant in the gas phase that is not condensed in the condensation unit is accommodated or captured. In addition, the non-condensed gaseous refrigerant resides in the channel leading to the evaporator, thereby preventing a dry out phenomenon caused by insufficient cooling of the refrigerant condensed in the liquid phase to the evaporator.

In addition, according to the present invention, by controlling the surface tension of the liquid refrigerant by modifying the depth and width or the shape of the lower channel, the liquid refrigerant is driven into the evaporator by no force, so that the dry out phenomenon does not occur in the evaporator. The liquid refrigerant can always be sufficiently supplied to the evaporation unit.

In addition, according to the present invention, the upper and lower channels are partially surface treated to improve the flow of the refrigerant, thereby increasing the cooling efficiency.

Figure 1a is a perspective view schematically showing the outer appearance of the thin plate cooling apparatus according to the first embodiment of the present invention.

FIG. 1B is a schematic cross-sectional view of a thin plate cooling apparatus according to a first embodiment of the present invention, viewed in a 'b' direction from a XY plane; FIG.

FIG. 2A is a schematic cross-sectional view of the thin plate cooling apparatus according to the first embodiment of the present invention, viewed in an 'XY' cross section from the XY plane; FIG.

FIG. 2B is a schematic cross-sectional view of the thin plate cooling apparatus according to the first embodiment of the present invention, taken along the line AA ′ of FIG. 2A;

FIG. 2C is a schematic sectional view of the thin plate cooling apparatus according to the first embodiment of the present invention, taken along the line BB ′ of FIG. 2A; FIG.

3A is a schematic cross-sectional view of the thin plate cooling apparatus according to the second embodiment of the present invention, viewed in an 'an' direction from a XY plane;

3B is a schematic cross-sectional view of the thin plate cooling apparatus according to the second embodiment of the present invention, taken along the line AA ′ of FIG. 3A;

FIG. 3C is a schematic sectional view of the thin plate cooling apparatus according to the second embodiment of the present invention, taken along the line BB ′ of FIG. 3A; FIG.

4A is a schematic cross-sectional view of a thin plate cooling apparatus according to a third exemplary embodiment of the present invention in a XY plane, viewed from the side direction.

4B is a schematic cross-sectional view of the thin plate cooling apparatus according to the third embodiment of the present invention, taken along the line AA ′ of FIG. 4A;

4C is a schematic cross-sectional view of the thin plate cooling apparatus according to the third embodiment of the present invention, taken along the line BB ′ of FIG. 4A;

Fig. 5A is a schematic cross-sectional view of the thin plate cooling apparatus according to the fourth embodiment of the present invention in the XY plane, viewed from the direction of "

5B is a schematic cross-sectional view of the thin plate cooling apparatus according to the fourth embodiment of the present invention, taken along the line AA ′ of FIG. 5A;

FIG. 5C is a schematic cross-sectional view of the thin plate cooling apparatus according to the fourth embodiment of the present invention, taken along the line BB ′ of FIG. 5A; FIG.

5D is a schematic cross-sectional view of the thin plate cooling apparatus according to the fourth embodiment of the present invention, taken along the line CC ′ of FIG. 5A.

Claims (8)

A thin plate-shaped housing having a circulation loop of the fluid inside; And It may cause a phase change, and comprises a refrigerant circulating in the circulation loop in the housing, The circulation loop in the housing, Is formed in one end of the inside, the liquid refrigerant is filled in part by the capillary phenomenon, the filled liquid refrigerant is evaporated by vaporized by heat transferred from an external heat source; A gaseous refrigerant moving unit which is formed adjacent to the evaporation unit and is a passage through which the vaporized refrigerant moves toward the branch portion and includes at least one first cavity in which uncondensed gaseous refrigerant can be accommodated; A condenser formed in an area adjacent to the gaseous refrigerant moving part and configured to condense the gaseous refrigerant into a liquid phase; A liquid refrigerant moving part which is formed in an area adjacent to the condensation part as a part of the branch part, is insulated from the evaporation part, and the refrigerant condensed in the liquid phase moves toward the evaporation part; And Thin plate cooling device including a heat insulating part to insulate a portion of the evaporator and the liquid refrigerant moving part. The method of claim 1, A portion of the liquid refrigerant moving part is a thin plate type cooling device including a liquid refrigerant storage unit for storing the liquid refrigerant. The method of claim 2, Thin plate cooling device having a plurality of liquid refrigerant storage. The method of claim 2, And the liquid refrigerant storage part comprises a microchannel set to have a surface tension greater than gravity. The method of claim 1, And a cross-sectional area of the fine channel of the evaporator and / or the liquid coolant moving part gradually decreases from the coolant moving part in contact with the condensation part to the evaporation part in contact with the vapor phase refrigerant moving part. The method of claim 1, And said condensation portion comprises at least one second cavity. The method of claim 1, Thin plate cooling device wherein the liquid refrigerant moving part comprises at least one third cavity. The method of claim 1, The surface of the liquid refrigerant moving unit and the evaporator is a hydrophilic treatment surface, the gas phase refrigerant moving unit and the condensation unit is a thin plate-type cooling device.