CN110440619A - Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer - Google Patents
Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer Download PDFInfo
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- CN110440619A CN110440619A CN201810419554.3A CN201810419554A CN110440619A CN 110440619 A CN110440619 A CN 110440619A CN 201810419554 A CN201810419554 A CN 201810419554A CN 110440619 A CN110440619 A CN 110440619A
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- groove
- capillary layer
- uniforming
- capillary
- temperature
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of to be communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, an enclosure space is vacuum state and filled with working fluid in temperature-uniforming plate, it includes: a pedestal has the first groove, the second groove, fluid course and the steam flow channel being connected；One upper cover combines the pedestal and forms the enclosure space, which includes first groove, second groove, the fluid course and the steam flow channel；One capillary structure is located in the enclosure space, and corresponding first groove and second groove；One extension capillary layer is formed in the fluid course, the part of the fluid course is filled up by the extension capillary layer makes steam that can not circulate via the fluid course in first groove and second groove, which simultaneously exceeds that the fluid course is outer to be contacted with the capillary structure.
Description
Technical field
It is the present invention relates to radiator, in particular to a kind of to be communicated the joint temperature-uniforming plates of multiple temperature-uniforming plates with extending capillary layer
Assembly.
Background technique
Existing loop type temperature-uniforming plate, such as U.S. US 2016/01282341 " cooling device and electronic equipment " patent
Case, the case mainly disclose two temperature-uniforming plates, wherein a plate is heated sheet, another plate is heat sink, will by a steam pipe and a liquid pipe
Heated sheet is connected with two plate of heat sink, forms the circuit temperature-uniforming plate an of liquid, vapour separation, steam pipe and liquid pipe are with welding
Mode connects heated sheet and heat sink.
The problem of welding processing is relatively not easily controlled quality, has product yield decline, and the structure of weld
It is more fragile, it is easy to cause the reduced service life of product in being collided or using for a long time and be damaged.
Summary of the invention
The main purpose of the present invention is to provide it is a kind of with extend capillary layer communicate multiple temperature-uniforming plates joint temperature-uniforming plate it is total
At with preferable heat radiation function.
In order to reach foregoing purpose, according to the present invention provided by a kind of communicated the connection of multiple temperature-uniforming plates with extending capillary layer
Temperature-uniforming plate assembly is closed, the enclosure space inside temperature-uniforming plate is vacuum state and is filled with working fluid, include: a pedestal,
It is formed with one first groove, one second groove, a fluid course and a steam flow channel, first groove, second groove, the liquid
Circulation road and the steam flow channel are connected；One upper cover in conjunction with the pedestal and forms the enclosure space, which includes should
First groove, second groove, the fluid course and the steam flow channel；One capillary structure is located in the enclosure space, and right
It should the first groove and second groove；And one extend capillary layer, be formed in the fluid course, the local quilt of the fluid course
The extension capillary layer, which fills up, makes steam that can not circulate via the fluid course in first groove and second groove, this prolongs
It stretches two end of capillary layer and exceeds and contacted outside the fluid course with the capillary structure.
Whereby, it is of the invention it is a kind of communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, can be rapid
The reflux of liquid working solution is guided, and reaches preferable heat dissipation effect.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
The three-dimensional appearance schematic diagram of Fig. 1 the first preferred embodiment of the present invention；
Fig. 2 is schematic cross-sectional view of the Fig. 1 along the direction 2-2；
Fig. 3 is schematic cross-sectional view of the Fig. 1 along the direction 3-3；
Fig. 4 is the perspective exploded view of Fig. 1；
Fig. 5 is that Fig. 4 takes away the schematic top plan view after upper cover and the first capillary layer；
The perspective exploded view of Fig. 6 the second preferred embodiment of the present invention；
Fig. 7 is that Fig. 6 takes away the schematic top plan view after upper cover and the first capillary layer；
The perspective exploded view of Fig. 8 third preferred embodiment of the present invention；
Fig. 9 is that Fig. 8 takes away the schematic top plan view after upper cover and the first capillary layer；
The perspective exploded view of Figure 10 the 4th preferred embodiment of the present invention；
Figure 11 is that Figure 10 takes away the schematic top plan view after upper cover and the first capillary layer；
The perspective exploded view of Figure 12 the 5th preferred embodiment of the present invention.
Wherein, appended drawing reference
10 are communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer
11 pedestal, 111 first groove
112 second groove, 113 fluid course
114 steam flow channel, 115 enclosure space
12 upper cover, 13 first capillary layer
131 protrusion, 14 second capillary layer
141 protrusion, 15 third capillary layer
The 4th capillary layer of 151 protrusion 16
161 protrusions 17 extend capillary layer
171,172 extended segment
20 are communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer
21 pedestal, 211 first groove
212 second groove, 213 fluid course
214 steam flow channel, 22 upper cover
27 extend capillary layer 271,272 extended segments
30 are communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer
311 first groove, 313 fluid course
314 steam flow channels 37 extend capillary layer
371 extended segment, 3711 principal piece portion
3712 section portions
40 are communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer
41 pedestal, 411 first groove
412 second groove, 413 fluid course
414 steam flow channels 47 extend capillary layer
471 extended segment, 48 link slot
481 partitions
50 are communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer
51 pedestal, 511 first groove
512 second groove, 513 fluid course
514 steam flow channel, 52 upper cover
54 second capillary layer, 55 third capillary layer
57 extend capillary layer 571,572 extended segments
Specific embodiment
For the technical characterstic place that the present invention will be described in detail, hereby lifts preferred embodiment below and cooperate Detailed description of the invention such as
Afterwards, in which:
As shown in Figures 1 to 5, one kind provided by the first preferred embodiment of the invention is multiple to extend capillary layer communication
The joint temperature-uniforming plate assembly 10 of warm plate, the enclosure space 115 inside temperature-uniforming plate are vacuum states and filled with working fluid,
Capillary layer 17 and a capillary structure are mainly extended by a pedestal 11, a upper cover 12, one.The capillary structure of the present embodiment includes one
First capillary layer 13, one second capillary layer 14, third capillary layer 15, one the 4th capillary layer 16, but in other embodiments, capillary knot
Structure can have more or less layers of structure, and configuration in the enclosed space described in the present embodiment also not to be limited.Wherein:
The pedestal 11 is formed with one first groove 111, one second groove 112, a fluid course 113 and a steam flow channel
114, first groove 111, second groove 112, the fluid course 113 and the steam flow channel 114 are generally aligned in the same plane, and should
First groove 111, second groove 112, the fluid course 113 and the steam flow channel 114 are connected.
First groove 111, the second groove 112, fluid course 113 and steam flow channel 114 are positions in same level, but its
In his embodiment, four also can be situated in different level or part position in same horizontal plane and part position in different level
Face.In other embodiments, first groove 111, the second groove 112, fluid course 113 and the bottom surface in steam flow channel 114 can be with
It is different horizontal plane.
The upper cover 12 and corresponding first groove 111, second groove 112, the fluid course 113 and the steam flow channel
114 profile setting combines the pedestal 11, and in first groove 111, second groove 112, the fluid course 113 and is somebody's turn to do
Steam flow channel 114 forms an enclosure space 115.
In this embodiment, pedestal 11 and upper cover 12 are to form integrally formed structure by CNC or etching means respectively,
In other embodiments, being formed for structure can also use different manufacturing process by other manufacturing process, or both.
First capillary layer 13 can be sintered for gauze fabric or copper powder, and the present embodiment is copper powder sintering, be formed in the upper cover
12 and face first groove 111
Second capillary layer 14 can be sintered for gauze fabric or copper powder, and the present embodiment is copper powder sintering, be formed in the upper cover
12 and face second groove 112.
The third capillary layer 15 can be sintered for gauze fabric or copper powder, and the present embodiment is copper powder sintering, be formed in the pedestal
11 and position in first groove 111.
4th capillary layer 16 can be sintered for gauze fabric or copper powder, and the present embodiment is copper powder sintering, be formed in the pedestal
11 and position in second groove 112.
First capillary layer 13, the second capillary layer 14, third capillary layer 15 are respectively provided with multiple convex with the 4th capillary layer 16
Portion 131,141,151,161, the protrusion 131,141,151,161 can be the capillary layer of solid copper block or copper powder sintering,
And contact is distinguished between first capillary layer 13 and third capillary layer 15, and, second capillary layer 14 and the 4th capillary
Between layer 16.
The extension capillary layer 17 is copper powder sintering, is formed in the fluid course 113, the local quilt of the fluid course 113
The extension capillary layer 17 fills up, and makes steam can not be via the fluid course 113 and in first groove 111 and second groove
Circulation in 112, two ends of the extension capillary layer 17 and all exceeds the outer preset distance of fluid course 113 and is equipped with two extensions
Section 171,172, two extended segment 171,172 put in respectively in first groove 111 and second groove 112, by its end
Toward identical side definite length extended.
Working fluid by taking pure water as an example (in schema not in addition indicate) in the present embodiment, be adsorbed in first capillary layer 13,
Second capillary layer 14, the third capillary layer 15, the 4th capillary layer 16 and the extension capillary layer 17, and it is filled in the closing
In space 115, and, the steam, which refers to, is changed into steam state working solution after liquid working solution absorbs thermal energy.
In this present embodiment, which extends toward the direction close to the steam flow channel 114, but, this two prolongs
It stretches section 171,172 and spacing appropriate is not contacted and maintained with the trough rim wall of first groove 111 and second groove 112, it should
Two extended segments 171,172 can at least be contacted with one of the third capillary layer 15 or the 4th capillary layer 16, two extended segment
171,172 also (as shown in Figure 4) can be contacted with the third capillary layer 15 and the 4th capillary layer 16 simultaneously.
Foregoing describe the structure kenels of first embodiment of the invention, next propose the explanation of use state.
By above structure, in actual operating process, in which: in the upper cover 12 corresponding to first groove 111
Surface as heat affected zone, heat affected zone receives the thermal energy of heat source to contact a heat source.Heat source can be microprocessor, collection
At circuit, RF component or other can generate the element or module of thermal energy, module be comprising one or more said elements and its
Electronic circuit composed by his electronic component.
The surface of the upper cover 12 corresponding to second groove 112 is scattered directly or indirectly to contact as radiating area
Thermal modules.Directly contact refers to that radiating module directly touches radiating area, and to cool down to radiating area, directly contact is usually logical
Cross the combination of radiating fin or radiating fin and fan.Mediate contact is that radiating module does not touch radiating area, but passes through stream
Body is cooling to radiating area, and fluid for example passes through the air-flow of fan.Multiple heat radiating fins can be used in other embodiments, radiating module
Piece, multiple fans or other elements, so, the composition of radiating module is not limited with above-mentioned.
As shown in figure 5, heat is transferred in first groove 111 down from the upper cover 12, is made after heat affected zone receives thermal energy
Liquid makees hydrodynamic and evaporates because of heat absorption to become steam state and make hydrodynamic, steam state make hydrodynamic can be entered by the steam flow channel 114 it is scattered
The cooling of second groove 112 corresponding to hot-zone, the steam state after cooling make hydrodynamic and can be re-condensed into liquid to make hydrodynamic, and pass through
The contact of the 161 phase contact of multiple protrusions of multiple protrusions 141 of second capillary layer 14 and the 4th capillary layer 16, along with having
The extension capillary layer 17 is located at the guidance of the extended segment 172 in second groove 112, so that condensed liquid is made hydrodynamic rapid
Ground advances via the extended segment 171 of the extension capillary layer 17, past 17 other end of extension capillary layer in the fluid course 113,
Into in first groove 111, adsorb it is molten be dipped in the third capillary layer 15, liquid above-mentioned make hydrodynamic can again by this
The extension capillary layer 17 in one groove 111 is contacted with the third capillary layer 15 and first capillary layer 13, and liquid is made to make hydrodynamic
Heat affected zone is returned to, the thermal energy of heat source can be exported constantly, reach good heat dissipation effect by such ringing.
From the foregoing, it will be observed that the present invention contacts the 4th capillary layer 16 and the third capillary layer by the extension capillary layer 17
15, and because between second capillary layer 14 and the 4th capillary layer 16 and the third capillary layer 15 and first capillary layer 13 it
Between be equipped with multiple protrusions 141,161 and 151,131, two extended segments 171,172 having along with the extension capillary layer 17 are drawn
It leads and is acted on transmitting, liquid is made, and hydrodynamic is smooth to be back in first groove 111 being correspondingly arranged for pyrotoxin, can be added
Speed heat dissipation circulation, can be with improving radiating effect.
Referring again to shown in Fig. 6 to Fig. 7, one kind provided by the second preferred embodiment of the invention is to extend capillary layer communication
The joint temperature-uniforming plate assembly 20 of multiple temperature-uniforming plates, takes off the first preferred embodiment before being mainly generally same as, the difference is that:
There is the pedestal 21 Second Automobile Works's circulation road 214 to be divided into first groove 211 and 212 2 side of the second groove, the liquid
Circulation road 213 is set between first groove 211 and second groove 212, and certainly, which sets in corresponding to the pedestal 21
Profile, two ends of the extension capillary layer 27 and all exceed the outer preset distance of fluid course 213 and be equipped with two extended segments
271,272, which puts in respectively in first groove 211 and second groove 212 and by its end
Predetermined length is each extended over toward two different sides.
Remaining step of this second embodiment and the effect of capable of reaching, take off first embodiment before being generally same as, and Rong Buzai gives
It repeats.
Referring again to shown in Fig. 8 to Fig. 9, one kind provided by third preferred embodiment of the present invention is to extend capillary layer communication
The joint temperature-uniforming plate assembly 30 of multiple temperature-uniforming plates, takes off the first preferred embodiment before being mainly generally same as, the difference is that:
It is another that one end of the extension capillary layer 37 exceeds the outer preset distance of fluid course 313, the extension capillary layer 37
End has an extended segment 371, which is inserted into first groove 311 but the sky of unfilled first groove 311
Between, which has a principal piece portion 3711 and multiple section portions 3712, and the principal piece portion 3711 is rectangular, multiple
Branch section portion 3712 is set in distance from 3711 side of principal piece portion and is extended toward the direction close to the steam flow channel 314.
Remaining step of this third embodiment and the effect of capable of reaching, take off first embodiment before being generally same as, and Rong Buzai gives
It repeats.
Referring again to shown in Figure 10 to Figure 11, one kind provided by the 4th preferred embodiment of the invention is to extend capillary layer company
The joint temperature-uniforming plate assembly 40 of the multiple temperature-uniforming plates of network, takes off the first preferred embodiment before being mainly generally same as, the difference is that:
The pedestal 41 has two fluid courses 413 and Second Automobile Works's circulation road 414, and with two, the extension capillary layer 47 is respectively arranged at
Exceed a distance after two fluid course 413, two ends of the two extension capillary layers 47 exceed predetermined outside the fluid course 413
It after distance and is respectively protruding into first groove 411 and second groove 412, and each other by the connection of extended segment 471.
Wherein, which is connected to second groove 412 by two link slots 48, in the respectively link slot 48 simultaneously
It is respectively provided with a partition 481 separation, and forms two fluid course 413 and Second Automobile Works's circulation road 414.
Remaining step of this fourth embodiment and the effect of capable of reaching, take off first embodiment before being generally same as, and Rong Buzai gives
It repeats.
The preferred embodiment of the present invention the 5th shown in Figure 12 is please referred to, the first preferred embodiment, difference are taken off before being mainly generally same as
Place is that capillary structure is the first capillary layer 13 and the 4th capillary layer 16 for omitting Fig. 4.One provided by this fifth embodiment
Kind communicated the joint temperature-uniforming plate assemblies 50 of multiple temperature-uniforming plates with extending capillary layer, there is the first groove being connected including pedestal 51
511, the second groove 512, fluid course 513, steam flow channel 514, upper cover 52, extension capillary layer 57 and capillary structure, extend hair
There are two extended segments 571,572 put in respectively in first groove 511 and second groove 512 at sub-layers 57 2 end, capillary knot
Structure then includes the second capillary layer 54, third capillary layer 55, and to take off first real before remaining step and the effect of capable of reaching generally are same as
Example is applied, Rong Buzai, which gives, to be repeated.
The embodiment of Figure 12 is the capillary structure that embodiment compared with Fig. 4 has small layers, but the capillary structure of small layers can also
To be other configurations, not to be limited described in this.Each capillary layer can then be distinguished to the structure of more layers compared with the capillary structure of multilayer.
From the foregoing, it will be observed that by least first capillary layer 13 of the extension capillary layer 17 and capillary structure, second capillary
Layer 14, the third capillary layer 15, the contact of the 4th capillary layer 16, the extended segment 171 having along with the extension capillary layer 17,
172 structure design, provides guidance and transmitting acts on, and liquid can be made to be back to corresponding first groove in heat affected zone as hydrodynamic
Can be more smoothly in 111, constantly the thermal conductivity of pyrotoxin can be gone out, the present invention can accelerate heat dissipation to recycle, and have and reach good dissipate
The function of thermal effect.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (12)
1. a kind of communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, the enclosure space inside temperature-uniforming plate is
Vacuum state and be filled with working fluid, which is characterized in that include:
One pedestal, is formed with one first groove, one second groove, a fluid course and a steam flow channel, first groove, this
Two grooves, the fluid course and the steam flow channel are connected；
One upper cover in conjunction with the pedestal and forms the enclosure space, which includes first groove, second groove, is somebody's turn to do
Fluid course and the steam flow channel；
One capillary structure is located in the enclosure space, and corresponding first groove and second groove；And
One extends capillary layer, is formed in the fluid course, the part of the fluid course is filled up by the extension capillary layer, makes steam
It can not circulate via the fluid course in first groove and second groove, which simultaneously exceeds this
Fluid course is outer to be contacted with the capillary structure.
2. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: the extension capillary layer fills up inside the fluid course.
3. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: two ends of the extension capillary layer are respectively provided with an extended segment, two extended segment put in respectively in first groove and this second
Predetermined length in groove, and do not contacted with the trough rim wall of first groove and second groove and maintain spacing appropriate.
4. according to claim 3 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: two extended segment is extended to form from two ends of the extension capillary layer toward identical side.
5. according to claim 3 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: two extended segment each extends over from two ends of the extension capillary layer toward two different sides and is formed.
6. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: the extension capillary layer one end has an extended segment, which is inserted into first groove but unfilled first groove
Space, which has a principal piece portion and multiple section portions, and the principal piece portion is rectangular, multiple section portion is by this
Principal piece portion side is set in distance and extends toward the direction close to the steam flow channel.
7. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
There are two fluid courses and Second Automobile Works's circulation road in: the pedestal, with the two extension capillary layers be respectively formed in two fluid course and
Make all at least partially to be filled up by the respectively extension capillary layer in the respectively fluid course and blocked the steam state sent out from steam flow channel to make
Hydrodynamic cannot be introduced into two fluid courses, and two ends of the two extension capillary layers all exceed pre- spacing outside two fluid courses
From and be respectively protruding into first groove and second groove, and separately connect the two of the two extension capillary layers by two extended segments
End.
8. according to claim 7 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: first groove of the pedestal is connected to second groove by two link slots, will be connected in the respectively link slot and by a partition
Access slot is separated out a fluid course and a steam flow channel, and two fluid courses are set to the relative inner of the two link slot groove bodies, two
The steam flow channel is then set to the opposite exterior lateral sides of the two link slot groove bodies.
9. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: first groove, second groove, the fluid course and the steam flow channel are generally aligned in the same plane.
10. according to claim 1 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature exists
In: the capillary structure includes one first capillary layer, one second capillary layer, a third capillary layer and one the 4th capillary layer, this first
Capillary layer is formed in the upper cover, and faces first groove, which is formed in the upper cover, and second recessed in face of this
Slot, which is formed in the pedestal, and position, in first groove, the 4th capillary layer is formed in the pedestal, and position
In second groove.
11. according to claim 10 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature
It is: is equipped with multiple protrusions between first capillary layer, the second capillary layer, third capillary layer and the 4th capillary layer, respectively this is convex
Portion is solid copper billet.
12. according to claim 10 communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer, feature
It is: is equipped with multiple protrusions between first capillary layer, the second capillary layer, third capillary layer and the 4th capillary layer, respectively this is convex
Portion is the capillary layer of copper powder sintering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419554.3A CN110440619A (en) | 2018-05-04 | 2018-05-04 | Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419554.3A CN110440619A (en) | 2018-05-04 | 2018-05-04 | Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer |
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| Publication Number | Publication Date |
|---|---|
| CN110440619A true CN110440619A (en) | 2019-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810419554.3A Pending CN110440619A (en) | 2018-05-04 | 2018-05-04 | Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196778A (en) * | 1999-11-08 | 2001-07-19 | Samsung Electronics Co Ltd | Cooling device by cpl |
| CN1781007A (en) * | 2003-05-31 | 2006-05-31 | 伊库瑞莱伯控股有限公司 | Cooling device of thin plate type for preventing dry-out |
| CN1296671C (en) * | 2002-12-12 | 2007-01-24 | 索尼株式会社 | Heat-transfer apparatus and electronic apparatus |
| CN201593938U (en) * | 2010-01-13 | 2010-09-29 | 苏州聚力电机有限公司 | Novel flat heat conductance part structure |
| CN205580271U (en) * | 2016-04-21 | 2016-09-14 | 广州华钻电子科技有限公司 | Gas -liquid separation formula temperature -uniforming plate |
| CN106017174A (en) * | 2016-06-17 | 2016-10-12 | 浙江工业大学 | Micro cooler capable of condensing steam into drops and automatically collecting water, and manufacturing method of micro cooler |
| CN205878974U (en) * | 2016-06-08 | 2017-01-11 | 泰硕电子股份有限公司 | Temperature -uniforming plate with liquid vapour isolating construction |
-
2018
- 2018-05-04 CN CN201810419554.3A patent/CN110440619A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196778A (en) * | 1999-11-08 | 2001-07-19 | Samsung Electronics Co Ltd | Cooling device by cpl |
| CN1296671C (en) * | 2002-12-12 | 2007-01-24 | 索尼株式会社 | Heat-transfer apparatus and electronic apparatus |
| CN1781007A (en) * | 2003-05-31 | 2006-05-31 | 伊库瑞莱伯控股有限公司 | Cooling device of thin plate type for preventing dry-out |
| CN201593938U (en) * | 2010-01-13 | 2010-09-29 | 苏州聚力电机有限公司 | Novel flat heat conductance part structure |
| CN205580271U (en) * | 2016-04-21 | 2016-09-14 | 广州华钻电子科技有限公司 | Gas -liquid separation formula temperature -uniforming plate |
| CN205878974U (en) * | 2016-06-08 | 2017-01-11 | 泰硕电子股份有限公司 | Temperature -uniforming plate with liquid vapour isolating construction |
| CN106017174A (en) * | 2016-06-17 | 2016-10-12 | 浙江工业大学 | Micro cooler capable of condensing steam into drops and automatically collecting water, and manufacturing method of micro cooler |
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Application publication date: 20191112 |
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| WD01 | Invention patent application deemed withdrawn after publication |