KR100474000B1 - Dual Panel Type Organic Electroluminescent Device and Method for Fabricating the same - Google Patents

Abstract

According to the dual panel type organic light emitting display device according to the present invention, first, since the array device and the organic light emitting diode device are formed on different substrates, the production yield and production management efficiency can be improved, and the product life can be increased. Second, because of the top emission method, it is easy to design thin film transistors and realize high opening ratio / high resolution. Third, the direct contact between the organic light emitting diode and the electrical connection pattern is blocked by a protective electrode, and thus a more stable bonding process can be performed. Fourth, by filling the moisture absorbing layer made of a moisture-proof liquid between the array element and the organic light emitting diode element connected by the electrical connection pattern, it is not necessary to insert a separate absorbent, thereby facilitating the bonding process. Encapsulation process does not require glass improvement, encapsulation It can improve the yield by simplifying the migration process, and it is possible to realize a more compact display because it does not need to add a moisture absorbent to the outer part of the device, and can effectively block moisture penetrating from the outside. It has the advantage of improving reliability.

Description

Dual Panel Type Organic Electroluminescent Device and Method for Fabricating the same

The present invention relates to an organic electroluminescent device, and more particularly to a dual panel type organic electroluminescent device.

One of the new flat panel displays (FPDs), the organic light emitting display device is self-luminous and thus has a better viewing angle and contrast than the liquid crystal display device. Is also advantageous. In addition, since it is possible to drive DC low voltage, fast response speed, and all solid, it is strong against external shock, wide use temperature range, and especially inexpensive in terms of manufacturing cost.

In particular, unlike the liquid crystal display device or the plasma display panel (PDP), the deposition and encapsulation equipments can be referred to in the manufacturing process of the organic light emitting device, and the process is very simple.

In the related art, a passive matrix having no separate switching device has been mainly used as a driving method of the organic light emitting device.

However, in the passive matrix method, since the scan lines and the signal lines are configured to form a device in a matrix form, the scanning lines are sequentially driven over time in order to drive each pixel, thereby requiring the average luminance. In order to indicate, the instantaneous luminance is equal to the average luminance multiplied by the number of lines.

However, in the active matrix method, a thin film transistor, which is a switching element for turning on / off a pixel, is positioned for each subpixel, and the first electrode connected to the thin film transistor is The second electrode, which is turned on / off in subpixel units and faces the first electrode, becomes a common electrode.

In the active matrix method, a voltage applied to a pixel is charged in a storage capacitor (C _ST ), so that power is applied until the next frame signal is applied, thereby relating to the number of scan lines. Run continuously for one screen without

Therefore, according to the active matrix method, since the same luminance is applied even when a low current is applied, it has the advantage of low power consumption, high definition, and large size.

Hereinafter, the basic structure and operation characteristics of the active matrix organic electroluminescent device will be described in detail with reference to the accompanying drawings.

1 is a view showing a basic pixel structure of a general active matrix organic electroluminescent device.

As shown, a scanning line is formed in a first direction, and a signal line and a power supply line are formed in a second direction crossing the first direction and spaced apart from each other by a predetermined distance. Define the subpixel area.

A switching TFT, which is an addressing element, is formed at the intersection of the scan line and the signal line, and is connected to the switching thin film transistor and the power supply line to form a storage capacitor C _ST . A driving thin film transistor, which is connected to the storage capacitor C _ST and a power supply line, is formed, and the driving thin film transistor is connected to the driving thin film transistor to form an organic electroluminescent diode.

When the organic light emitting diode is supplied with a current in the forward direction, the organic light emitting diode has a positive (N) junction between the anode electrode, which is a hole providing layer, and the cathode electrode, which is an electron providing layer. Electrons and holes recombine with each other as they move through the part, and thus have a smaller energy than when the electrons and holes are separated, thereby utilizing the principle of emitting light due to the energy difference generated.

The organic light emitting device is classified into a top emission type and a bottom emission type according to a transmission direction of light emitted through the organic light emitting diode.

Hereinafter, FIG. 2 is a schematic cross-sectional view of a conventional bottom emission type organic light emitting display device, and is illustrated based on one pixel area including red, green, and blue subpixels.

As illustrated, the first and second substrates 10 and 30 are disposed to face each other, and the edge portions of the first and second substrates 10 and 30 are sealed by a seal pattern 40. The thin film transistor T is formed on the transparent substrate 1 of the first substrate 10 for each subpixel, and is connected to the thin film transistor T to form the first electrode 12. Red, green, and blue colors are disposed on the transistor T and the first electrode 12 to be connected to the thin film transistor T so as to correspond to the first electrode 12. An organic light emitting layer 14 including a light emitting material is formed, and a second electrode 16 is formed on the organic light emitting layer 14.

The first and second electrodes 12 and 16 serve to apply an electric field to the organic light emitting layer 14.

The second electrode 16 and the second substrate 30 are spaced apart from each other by the seal pattern 40 described above, and although not shown in the drawing, the inner surface of the second substrate 30 may be moved outwardly. A moisture absorbent for blocking moisture of the semi-permeable tape for adhesion between the moisture absorbent and the second substrate 30 is included.

For example, when the first electrode 12 is an anode and the second electrode 16 is a cathode in a bottom emission structure, the first electrode 12 is selected from a transparent conductive material, and the second electrode 16 is formed. ) Is selected from a metal material having a low work function, and under these conditions, the organic light emitting layer 14 is formed from a layer in contact with the first electrode 12, a hole injection layer 14a, a hole transport layer 14b; A transporting layer), an emission layer 14c, and an electron transporting layer 14d are formed in this order.

In this case, the light emitting layer 14c has a structure in which light emitting materials for implementing red, green, and blue colors are sequentially disposed for each subpixel.

FIG. 3 is an enlarged cross-sectional view of one subpixel area of the FIG. 2 bottom emission type organic electroluminescent device.

As illustrated, the semiconductor layer 62, the gate electrode 68, the source and drain electrodes 80 and 82 are sequentially formed on the transparent substrate 1 to form a thin film transistor region, and the source and drain electrodes 80, The power electrode 72 and the organic light emitting diode E formed in the power supply line (not shown) are respectively connected to 82.

In addition, a capacitor electrode 64 made of the same material as the semiconductor layer 62 is disposed under an insulator interposed between the power electrode 72 and the corresponding region forms a storage capacitor region.

Elements formed in the thin film transistor region and the storage capacitor region other than the organic light emitting diode E form the array element A.

The organic light emitting diode E includes a first electrode 12 and a second electrode 16 facing each other with the organic light emitting layer 14 interposed therebetween. The organic light emitting diode E is positioned in a light emitting area for emitting self-emitting light to the outside.

As described above, the conventional organic light emitting display device has a structure in which the array device A and the organic light emitting diode E are stacked on the same substrate.

 4 is a flowchart illustrating a manufacturing process of a conventional organic light emitting display device.

st1 is a step of forming an array element on a first substrate, wherein the first substrate refers to a transparent substrate, a scan line on the first substrate, a signal line and a power supply line crossing the scan line and spaced apart from each other; And forming an array element including a switching thin film transistor formed at a point where the scan line and the signal line intersect, and a driving thin film transistor formed at the point where the scan line and the power supply line intersect.

st2 is a step of forming a first electrode which is a first component of the organic light emitting diode, and the first electrode is connected to the driving thin film transistor and patterned for each subpixel.

st3 is a step of forming an organic light emitting layer which is a second component of the organic light emitting diode on the first electrode, and when the first electrode is composed of an anode, the organic light emitting layer is a hole injection layer, a hole transport layer The light emitting layer, the electron transport layer may be laminated in order.

In st4, the second electrode, which is a third component of the organic light emitting diode, is formed on the organic light emitting layer, and the second electrode is formed on the entire surface of the substrate as a common electrode.

At st5, the first substrate is encapsulated using a second substrate, which is another substrate. In this step, the first substrate is protected from an external impact and the organic light emitting layer is exposed to the inflow of external air. Encapsulating the outer periphery of the first substrate to a second substrate to prevent damage, wherein a moisture absorbent is encapsulated in the inner surface of the second substrate, the first and second substrates are typically filled with an inert gas It is encapsulated.

As described above, the conventional bottom emission type organic light emitting diode device is manufactured by bonding an array device and a substrate on which an organic light emitting diode is formed and a separate substrate for encapsulation. In this case, since the product of the yield of the array device and the yield of the organic light emitting diode determines the yield of the organic light emitting diode, the overall organic process of the organic light emitting diode structure yields the overall process yield by the organic electroluminescent diode process. There was a problem that is greatly limited. For example, even if the array element is well formed, when the organic electroluminescent layer using the thin film of about 1000 mW is defective by foreign matter or other factors, the organic electroluminescent element is determined to be a poor grade. .

This results in a loss of overall costs and material costs that were required to manufacture the array device of good quality, there was a problem that the production yield is lowered.

In addition, the bottom emission method has a high degree of freedom and stability due to the encapsulation process, and has a problem in that it is difficult to be applied to a high resolution product due to the limitation of the aperture ratio, and the top emission method is easy to design a thin film transistor and improves the aperture ratio. It is advantageous in terms of product life, but in the conventional top emission type structure, since the material selection range is narrow as the cathode is normally positioned on the organic light emitting layer, the transmittance is limited and the light efficiency is reduced, and the light transmittance is minimized. In order to configure a thin film type protective film, there was a problem in that it does not sufficiently block outside air.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a high-resolution / high-throughput structure active matrix type organic electroluminescent device having improved production yield.

To this end, the present invention is to provide a dual panel type organic electroluminescent device for forming an array device and an organic light emitting diode device on a different substrate, and connecting the two devices through a separate electrical connection pattern. do.

In another aspect of the present invention, in order to prevent contact failure between the electrical connection pattern and the organic light emitting diode device, a portion of the second electrode of the organic light emitting diode device is partially disposed in an area covering the organic light emitting diode device. An object of the present invention is to provide a structure including a passivation layer having an exposed contact hole and a protection electrode connected to the second electrode through the contact hole and substantially connected to an electrical connection pattern.

In order to achieve the above object, in the first aspect of the present invention, there is defined a subpixel area, which is a minimum unit for implementing a screen, and includes: first and second substrates disposed to face each other at a predetermined interval; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A passivation layer on a region covering the organic light emitting diode device including the first electrode, the organic light emitting layer, and the second electrode, the protective layer having a contact hole partially exposing the second electrode; A protective electrode connected to the second electrode through the contact hole under the protective layer and formed in a subpixel unit to correspond to the second electrode; And a seal pattern encapsulating edge portions of the first and second substrates, wherein the electrical connection pattern electrically connects the first and second substrates. The first and second electrodes are formed through an evaporator, the protective electrode is formed using a sputter, the protective film is patterned using a shadow mask, and the protective film Silver is characterized in that it is formed in a laminating (laminating) method using a dry film. According to a second aspect of the present invention, there is provided a sub-pixel region, which is a minimum unit that implements a screen, and includes first and second substrates disposed to face each other at a predetermined interval; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A seal pattern encapsulating edge portions of the first and second substrates; And a moisture absorbing layer made of a moisture proof liquid filled in a section between the array element layer and the organic light emitting diode element, wherein the electrical connection pattern is configured to electrically connect the first and second substrates. An organic electroluminescent device is provided. In the section between the organic light emitting diode device and the moisture absorbing layer, a protective film covering the organic light emitting diode device and having a contact hole partially exposing the second electrode in subpixel units, and a contact hole below the protective film. A protective electrode connected to a second electrode and formed in a subpixel unit corresponding to the second electrode, wherein the first and second electrodes are formed through an evaporator, and the protective electrode forms a sputter. The protective layer may be formed using a shadow mask. The protective layer may be patterned using a shadow mask. The protective film is formed by a laminating method using a dry film. According to a third aspect of the present invention, a subpixel area, which is a minimum unit for implementing a screen, is defined, and includes first and second substrates disposed to face each other at a predetermined distance from each other; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A passivation layer on a region covering the organic light emitting diode device including the first electrode, the organic light emitting layer, and the second electrode, the protective layer having a contact hole partially exposing the second electrode; A protective electrode connected to the second electrode through the contact hole under the protective layer and formed in a subpixel unit to correspond to the second electrode; A seal pattern encapsulating edge portions of the first and second substrates; And a moisture absorbing layer made of a moisture proof liquid filled in a section between the array element layer and the organic light emitting diode element, wherein an uppermost surface of the electrical connection pattern is connected to a lower surface of the protective electrode. Provided is an element. Between the electrical connection pattern and the thin film transistor according to the first and second aspects of the present invention, a further connection electrode for connecting the electrical connection pattern and the thin film transistor further comprises, the thin film transistor, the switching thin film transistor and the driving A thin film transistor comprising a thin film transistor, and connected to the organic light emitting diode device, corresponds to a driving thin film transistor, and the organic light emitting device is configured to emit light emitted from the organic light emitting layer toward a first electrode. It is characterized by implementing the screen. The organic light emitting layer is repeated in subpixel units in a section between a first charge transfer layer in contact with the first electrode, a second charge transfer layer in contact with the second electrode, and the first and second charge transfer layers. Comprising an array of red, green, and blue light emitting layers arranged, wherein the first electrode is an anode, the second electrode is a cathode, the first charge transfer layer in turn to form a hole injection layer, a hole transport layer, the second charge The transport layer is characterized in that to form an electron transport layer, an electron injection layer in sequence. The uppermost surface of the electrical connection pattern is in contact with the lower surface of the protective electrode. The first electrode, the organic light emitting layer, and the second electrode according to the second aspect of the present invention form an organic light emitting diode device, and in the region covering the organic light emitting diode device, the second electrode is partially included in subpixel units. A protective film having a contact hole to be exposed; The protective electrode may further include a protective electrode connected to the second electrode through the contact hole in the lower portion of the passivation layer and formed in a subpixel unit to correspond to the second electrode.

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Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

Example 1

This embodiment is an embodiment of a dual panel type organic electroluminescent device in which an array device and an organic light emitting diode device are formed on different substrates, and the array device and the organic light emitting diode device are connected through separate electrical connection patterns. .

5 is a cross-sectional view of a dual panel organic light emitting display device according to a first embodiment of the present invention.

As shown in the drawing, the first and second substrates 110 and 150 are disposed to face each other at a predetermined interval in subpixel units, which are the minimum units for implementing the screen.

An array element layer 140 including a plurality of thin film transistors T formed in units of subpixels is formed on the inner surfaces of the first substrates 110 and 150, and a thin film transistor is formed on the array element layer 140. A connection electrode 142 is formed in connection with T), and a columnar electrical connection pattern 144 is formed in contact with an upper portion of the connection electrode 142.

The connection electrode 142 and the electrical connection pattern 144 may be selected from a conductive material, and the electrical connection pattern 144 may be formed of a multilayer including an insulating material in order to have a thickness. 142 may be omitted, and the electrical connection pattern 144 may be directly connected to the thin film transistor T.

In addition, the thin film transistor T includes a semiconductor layer 112, a gate electrode 114, a source electrode 116, and a drain electrode 118, and the aforementioned connection electrode 142 is substantially a drain electrode 118. )

The first electrode 152 is formed on the entire inner surface of the second substrate 150, and the red, green, and blue light emitting layers 156a, 156b, and 156c are repeatedly arranged in subpixel units below the first electrode 152. ) Is formed, and the second electrode 162 is formed in the subpixel unit below the organic light emitting layer 160.

In more detail, the organic light emitting layer 160 may include a first charge transfer layer 154 in contact with the bottom surface of the first electrode 152 and a lower portion of the red, green, and blue light emitting layers 156a, 156b, and 156c. And a second charge transfer layer 158 in contact with the top surface of the second electrode 162.

For example, when the first electrode 152 corresponds to an anode and the second electrode 162 corresponds to a cathode, the first charge transfer layer 154 sequentially corresponds to a hole injection layer and a hole transport layer, and a second charge The transport layer 158 corresponds to an electron transport layer and an electron injection layer in order.

The organic light emitting layer 160 interposed between the first and second electrodes 152 and 162 and the first and second electrodes 152 and 162 corresponds to the organic light emitting diode device E.

In the present invention, the top surface of the electrical connection pattern 144 is connected to the lower surface of the second electrode 162, the current supplied from the thin film transistor (T) is connected to the connection electrode 142 and the electrical connection pattern 144. It is characterized in that it is delivered to the second electrode 162 through.

The edges of the first and second substrates 110 and 150 are encapsulated by the seal pattern 170.

Although not shown in detail in the drawings, the organic light emitting display device according to the present invention includes at least one switching thin film transistor and at least one driving thin film transistor for supplying current to the organic light emitting diode device in subpixel units. The transistor corresponds to a driving thin film transistor.

However, since the organic light emitting diode elements are formed through an evaporator, there is a disadvantage that they are easily peeled off or damaged even with a slight force.

In order to improve this disadvantage, in the second embodiment of the present invention to present a structure including a protective electrode having an improved film quality than the second electrode in the interval between the second electrode and the organic connection pattern for the organic light emitting diode device. do.

Example 2

This embodiment is an embodiment of the structure further comprising a protective electrode in the section between the electrical connection pattern and the second electrode of the dual panel type organic electroluminescent device presented in the first embodiment.

FIG. 6 is a cross-sectional view of a dual panel type organic light emitting display device according to a second exemplary embodiment of the present invention, and descriptions of parts overlapping with FIG. 5 will be omitted.

As illustrated, the first and second substrates 210 and 250 having the subpixel regions are disposed to face each other, and a plurality of thin film transistors T formed in subpixel units on the inner surface of the first substrate 210. The array element layer 240 including a) is formed, and a connection electrode 242 connected to the thin film transistor T is formed on the array element layer 240, and an upper portion connected to the connection electrode 242. The pillar-shaped electrical connection pattern 244 is formed.

In addition, an organic light emitting diode device E having a structure in which a first electrode 252, an organic light emitting layer 254, and a second electrode 256 are sequentially stacked is formed on an inner surface of the second substrate 250. And a protective film 260 formed in a region covering the organic light emitting diode device E and having a contact hole 258 exposing a part of the second electrode 256 formed in subpixel units. Under the passivation layer 260, a passivation electrode 262 connected to the second electrode 256 through the contact hole 258 is formed in subpixel units so as to correspond to the second electrode 256.

The lower surface of the protective electrode 262 is in contact with the aforementioned electrical connection pattern 244.

The edges of the first and second substrates 210 and 250 are encapsulated by the seal pattern 270.

The material constituting the passivation layer 260 is selected from an insulating material, preferably an organic insulating material, and is separately patterned to selectively form the passivation layer 260 only in an area covering the organic light emitting diode device E. The process is required, for example, by patterning using a shadow mask method, and by laminating a dry film and then exposure and dry etching.

In this embodiment, by connecting the second electrode 256 and the electrical connection pattern 244 through a separate protective electrode 262, it is characterized in that the second electrode 256 is prevented from being damaged by the bonding force For this purpose, it is important that the protective electrode 262 is formed by a sputter as an example other than a deposition method.

In general, since the film formed by the deposition method is inferior in film quality to the film formed by the sputtering, the connection between the second electrode 256 and the electrical connection pattern 244 through the protective electrode 262 formed using the sputtering. If it is induced, damage to the second electrode 256 can be effectively prevented.

Example 3

In the present embodiment, the dual panel type organic light emitting display device is an embodiment of a structure in which a moisture proof liquid is filled in a section between an array device and an organic light emitting diode device connected by an electrical connection pattern.

7 is a cross-sectional view of an organic light emitting diode device according to a third exemplary embodiment of the present invention.

As illustrated, the first substrate 310 on which the array element layer 340 is formed and the second substrate 350 on which the organic light emitting diode element E is formed are disposed to be spaced apart from each other by a predetermined distance. The organic light emitting diode device (E) 340 and the organic light emitting diode device (E) are connected to each other by a columnar electrical connection pattern (344). The organic light emitting diode device (E) is positioned in an area covering the organic light emitting diode device (E). A passivation layer 362 having a contact hole 364 exposing a portion of the second electrode 360, which is the outermost electrode of the light emitting diode element E, is formed, and a contact hole 364 is formed below the passivation layer 362. The protective electrode 366 connecting the second electrode 360 and the electrical connection pattern 344 is formed.

Edge portions of the first and second substrates 310 and 350 are sealed by a seal pattern 370. In particular, in the present embodiment, in the dual panel type organic light emitting display device having the above-described structure, the electrical connection pattern 344 An interval between the array element layer 340 and the organic light emitting diode element E connected by the main element is filled with a moisture absorption layer 380 made of a moisture proof liquid.

According to the structure filled with the moisture absorbing layer 380 according to the present embodiment, it is not necessary to insert a separate absorbent may facilitate the bonding process, the improvement of the glass constituting the encapsulation substrate during the encapsulation process (for example For example, it is possible to secure a space for absorbent insertion), thereby simplifying the encapsulation process to improve the yield, and it is possible to implement a more compact display since it is not necessary to add a moisture absorbent to the outer portion of the substrate. In addition, it has the effect of blocking moisture penetrating from the outside can improve the life of the organic light emitting device, it is possible to improve the driving life and reliability of the display.

Further, since the protective film 362 and the protective electrode 366 according to the present exemplary embodiment have a role of blocking direct contact between the moisture absorbing layer 380 made of a moisture proof liquid and the organic light emitting diode device E, Can provide a stable product.

However, in the present invention, in providing the structure in which the moisture absorbing layer 380 is filled, an example may be applied to the structure in which the protective layer 362 and the protective electrode 366 are omitted.

In the method of filling the moisture-proof liquid, an injection hole may be formed in the seal pattern 370 described above to fill an inner region of the seal pattern by capillary action or may be filled by a dispensing method.

The dual panel type organic light emitting display device according to the above-described embodiments 1 to 3 is characterized in that the screen is implemented by an upper light emitting method for emitting light emitted from the organic light emitting layer toward the first electrode.

However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

As described above, the dual panel type organic light emitting display device according to the present invention has the following effects.

First, since the array device and the organic light emitting diode device are formed on different substrates, production yield and production management efficiency can be improved, and product life can be increased.

Second, because of the top emission method, it is easy to design a thin film transistor and high aperture ratio / high resolution can be realized.

Third, direct contact between the organic light emitting display device and the electrical connection pattern is blocked by a protective electrode, and thus a more stable bonding process may be performed.

Fourth, by filling the moisture absorbing layer made of a moisture-proof liquid between the array element and the organic light emitting diode element connected by the electrical connection pattern, it is not necessary to insert a separate absorbent, it is possible to facilitate the bonding process, In the encapsulation process, the glass does not need to be improved, the encapsulation process can be simplified, and the yield can be improved. Also, since a moisture absorbent is not added to the outside of the device, a more compact display can be realized. Moisture can effectively block moisture, thereby improving the driving life and reliability of the display.

1 is a view showing a basic pixel structure of a general active matrix organic electroluminescent device.

 Figure 2 is a schematic cross-sectional view of a conventional bottom emission organic electroluminescent device.

3 is an enlarged cross-sectional view of one subpixel area of the organic light emitting diode of FIG. 2;

Figure 4 is a process flow diagram for the manufacturing process of the conventional organic electroluminescent device.

 5 is a cross-sectional view of a dual panel type organic light emitting display device according to a first exemplary embodiment of the present invention.

6 is a cross-sectional view of a dual panel type organic light emitting display device according to a second exemplary embodiment of the present invention.

7 is a cross-sectional view of an organic light emitting diode device according to a third embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

210: first substrate 240: array element layer

242: connecting electrode 244: electrical connection pattern

250: second substrate 252: first electrode

254: organic light emitting layer 256: second electrode

258: contact hole 260: protective film

262: protective electrode 270: seal pattern

E: organic light emitting diode device T: thin film transistor

Claims (20)

First and second substrates each having a subpixel area defined as a minimum unit for realizing a screen and disposed to face each other at a predetermined distance from each other; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A passivation layer on a region covering the organic light emitting diode device including the first electrode, the organic light emitting layer, and the second electrode, the protective layer having a contact hole partially exposing the second electrode; A protective electrode connected to the second electrode through the contact hole under the protective layer and formed in a subpixel unit to correspond to the second electrode; Seal patterns encapsulating edge portions of the first and second substrates And a top surface of the electrical connection pattern is connected to a lower surface of the protective electrode. The method of claim 1, The first and second electrodes are formed through an evaporator, and the protective electrode is formed using a sputter. The method of claim 1, The protective layer is patterned (patterned) using a shadow mask (shadow mask) dual panel type organic light emitting device. The method of claim 1, The protective film is a dual panel type organic electroluminescent device formed by a laminating method using a dry film (dry film). First and second substrates each having a subpixel area defined as a minimum unit for realizing a screen and disposed to face each other at a predetermined distance from each other; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A seal pattern encapsulating edge portions of the first and second substrates; A moisture absorption layer made of a moisture-proof liquid filled in a section between the array element layer and the organic light emitting diode element in the seal pattern region. And a top surface of the electrical connection pattern is connected to a bottom surface of the second electrode. delete delete delete delete First and second substrates each having a subpixel area defined as a minimum unit for realizing a screen and disposed to face each other at a predetermined distance from each other; An array element layer including a plurality of thin film transistors formed in subpixel units on an inner surface of the first substrate; A columnar electrical connection pattern connected to the thin film transistor on the array element layer; A first electrode formed on an inner front surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a subpixel unit below the organic light emitting layer; A passivation layer on a region covering the organic light emitting diode device including the first electrode, the organic light emitting layer, and the second electrode, the protective layer having a contact hole partially exposing the second electrode; A protective electrode connected to the second electrode through the contact hole under the protective layer and formed in a subpixel unit to correspond to the second electrode; A seal pattern encapsulating edge portions of the first and second substrates; A moisture absorption layer made of a moisture-proof liquid filled in a section between the array element layer and the organic light emitting diode element in the seal pattern region. And a top surface of the electrical connection pattern is connected to a lower surface of the protective electrode. The method according to any one of claims 1 to 5 and 10, Dual panel type organic electroluminescent device further comprising a separate connection electrode connecting the electrical connection pattern and the thin film transistor between the electrical connection pattern and the thin film transistor. The method according to any one of claims 1 to 5 and 10, The thin film transistor includes a switching thin film transistor and a driving thin film transistor, and the thin film transistor connected to the organic light emitting diode device is a dual panel type organic light emitting device corresponding to the driving thin film transistor. The method according to any one of claims 1 to 5 and 10, The organic light emitting device is a dual panel type organic light emitting device for implementing a screen in a top light emitting method for emitting light emitted from the organic light emitting layer toward the first electrode. The method according to any one of claims 1 to 5 and 10, The organic light emitting layer is repeated in subpixel units in a section between a first charge transfer layer in contact with the first electrode, a second charge transfer layer in contact with the second electrode, and the first and second charge transfer layers. Dual panel type organic electroluminescent device comprising red, green and blue light emitting layers arranged. The method of claim 14, The first electrode is an anode, the second electrode is a cathode, the first carrier transport layer in turn constitutes a hole injection layer, a hole transport layer, the second carrier transport layer in turn an electron transport layer, an electron injection layer Dual panel type organic light emitting device. delete delete The method of claim 10, The first and second electrodes are formed through an evaporator, and the protective electrode is formed using a sputter. The method of claim 10, The protective layer is patterned (patterned) using a shadow mask (shadow mask) dual panel type organic light emitting device. The method of claim 10, The protective film is a dual panel type organic electroluminescent device formed by a laminating method using a dry film (dry film).