JPS62201972U - - Google Patents
Info
- Publication number
- JPS62201972U JPS62201972U JP9073186U JP9073186U JPS62201972U JP S62201972 U JPS62201972 U JP S62201972U JP 9073186 U JP9073186 U JP 9073186U JP 9073186 U JP9073186 U JP 9073186U JP S62201972 U JPS62201972 U JP S62201972U
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- electric circuit
- circuit board
- printed circuit
- soldered portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂは、この考案にかかるフレキシブ
ルプリント基板の外観斜視図、第２図は、第１図
ａの状態におけるフレキシブルプリント基板を破
断してあらわした側面図、第３図ａ，ｂは、従来
のフレキシブルプリント基板の外観斜視図、第４
図は、第３図ａの状態におけるフレキシブルプリ
ント基板を破断してあらわした側面図である。
１…基材、２…電路パターン、３…半田付部、
４…半田付パターン、５ａ…取付端子（端子）。
Figures 1a and b are external perspective views of the flexible printed circuit board according to the invention, Figure 2 is a side view of the flexible printed circuit board in the state shown in Figure 1a, and Figures 3a and b. 4 is a perspective view of the external appearance of a conventional flexible printed circuit board.
The figure is a side view of the flexible printed circuit board in the state shown in FIG. 3a, cut away. 1...Base material, 2...Electric circuit pattern, 3...Soldering part,
4...Soldering pattern, 5a...Mounting terminal (terminal).
Claims (1)
付部を備えているフレキシブルプリント基板にお
いて、前記電路パターンにおける半田付部から非
半田付部にかけての部分の側方には、前記電路パ
ターンとは独立の半田付パターンが形成されてい
ることを特徴とするフレキシブルプリント基板。 In a flexible printed circuit board in which an electric circuit pattern is formed and a part of which is provided with a soldered portion of a terminal, on the side of the portion of the electric circuit pattern from the soldered portion to the non-soldered portion, there is a wire that is independent of the electric circuit pattern. A flexible printed circuit board characterized by having a soldering pattern formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9073186U JPS62201972U (en) | 1986-06-14 | 1986-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9073186U JPS62201972U (en) | 1986-06-14 | 1986-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201972U true JPS62201972U (en) | 1987-12-23 |
Family
ID=30950862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9073186U Pending JPS62201972U (en) | 1986-06-14 | 1986-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62201972U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262771U (en) * | 1988-10-31 | 1990-05-10 |
-
1986
- 1986-06-14 JP JP9073186U patent/JPS62201972U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262771U (en) * | 1988-10-31 | 1990-05-10 |