JPH0241474U - - Google Patents
Info
- Publication number
- JPH0241474U JPH0241474U JP12031788U JP12031788U JPH0241474U JP H0241474 U JPH0241474 U JP H0241474U JP 12031788 U JP12031788 U JP 12031788U JP 12031788 U JP12031788 U JP 12031788U JP H0241474 U JPH0241474 U JP H0241474U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hard resin
- resin sheet
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係るストレート実
装部品保持シートを示す部分斜視図、第２図は部
品実装状態を示す部分平面図、第３図はその縦断
面図である。
１：リード線、２：ストレート実装部品保持シ
ート、３：切割り部、３ａ：切割り、４：プリン
ト基板、５：部品取付孔、６：実装部品。
FIG. 1 is a partial perspective view showing a straight mounted component holding sheet according to an embodiment of the present invention, FIG. 2 is a partial plan view showing a component mounted state, and FIG. 3 is a longitudinal sectional view thereof. 1: Lead wire, 2: Straight mounted component holding sheet, 3: Cutout, 3a: Cutout, 4: Printed circuit board, 5: Component mounting hole, 6: Mounted component.
Claims (1)
部品取付孔対応位置に部品リード線の挿入仮止め
用の切割り部を形成すると共に、上記硬質樹脂シ
ートの裏面にプリント基板に貼付するための粘着
面を形成したことを特徴とするストレート実装部
品保持シート。 A cutout for temporary insertion of component lead wires is formed at the position corresponding to the printed circuit board component mounting hole of the heat-resistant and insulating hard resin sheet, and an adhesive surface for pasting to the printed circuit board is formed on the back side of the hard resin sheet. A straight mounting component holding sheet characterized by forming a straight mounting component holding sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031788U JPH0241474U (en) | 1988-09-13 | 1988-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031788U JPH0241474U (en) | 1988-09-13 | 1988-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241474U true JPH0241474U (en) | 1990-03-22 |
Family
ID=31366315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12031788U Pending JPH0241474U (en) | 1988-09-13 | 1988-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241474U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033297A1 (en) * | 2004-09-21 | 2006-03-30 | Intellectual Property Bank Corp. | Method for manufacturing unit on which led is mounted, led socket, and electronic circuit substrate for mounting led |
-
1988
- 1988-09-13 JP JP12031788U patent/JPH0241474U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033297A1 (en) * | 2004-09-21 | 2006-03-30 | Intellectual Property Bank Corp. | Method for manufacturing unit on which led is mounted, led socket, and electronic circuit substrate for mounting led |