JPS6018899A - Semiconductor memory - Google Patents
Semiconductor memoryInfo
- Publication number
- JPS6018899A JPS6018899A JP58126233A JP12623383A JPS6018899A JP S6018899 A JPS6018899 A JP S6018899A JP 58126233 A JP58126233 A JP 58126233A JP 12623383 A JP12623383 A JP 12623383A JP S6018899 A JPS6018899 A JP S6018899A
- Authority
- JP
- Japan
- Prior art keywords
- selection
- memory cell
- circuit
- normal
- fuse element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/84—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/83—Masking faults in memories by using spares or by reconfiguring using programmable devices with reduced power consumption
- G11C29/832—Masking faults in memories by using spares or by reconfiguring using programmable devices with reduced power consumption with disconnection of faulty elements
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は半導体基板上に設けられ不良救済用冗長回路を
有した半導体メモリに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor memory provided on a semiconductor substrate and having a redundant circuit for relieving defects.
半導体基板上に設けられた半導体メモリにおいて、一つ
のチップ上にメモリセルを高集積化した大容量メモリが
開発されるにつれ、半導体基板中の欠陥や製造工程上発
生する不良によ択製造歩留が低下するということが問題
になってきている。そこで上記不良を救済するため、不
良個所を同一チップ上に備えた冗長回路に置き替えると
いう手法がとられている。In semiconductor memories provided on semiconductor substrates, as large-capacity memories with highly integrated memory cells on a single chip are developed, manufacturing yields are decreasing due to defects in the semiconductor substrate and defects that occur during the manufacturing process. It is becoming a problem that the Therefore, in order to remedy the above-mentioned defects, a method has been adopted in which the defective parts are replaced with redundant circuits provided on the same chip.
第1図は不良救済の手法の従来例を示す回路図である。FIG. 1 is a circuit diagram showing a conventional example of a defect relief method.
通常のメモリセル14〜24’ 中に不良がない場合に
は、図示していない冗長制御回路によシ、冗長用のメモ
リセル12〜19が選択されないような信号1〜2が、
冗長用選択回路8(ナンド回路82、 インバータ8.
よりなる)〜9(ナンド回路911 インバータ9.よ
シなる)に与えられる。それとともに冗長用メモリセル
が選択されたかどうかを検知する回路10(ナンド回路
101、インバータ10.よりなる)及び検知信号4と
通常の選択信号3〜3′が通常の選択回路xl(ナンド
回路111、インバータxx、よシなる)〜J2’(ナ
ンド回路11.’、 インバータII!’ よりなる)
に与えられ、通常のメモリセルI4〜J 4’のどれか
一つが選択される。メモリセルI4−21’中に不良が
発見された場合には、その不良セルの選択信号3あるい
は3′ に相当する信号が冗長制御回路より選択信号i
〜2として選択回路8〜9に与えられ、その結果冗長用
選択線5〜6を用いてメモリセル12〜13の一つが選
択される。それと同時に冗長用メモリセルが選択された
ことを示す信号4が検知回路10(ナンド回路ZOいイ
ンバータ1θ!よりなる)から通常の選択回路1l−F
l’に与えられ、通常のメモリセルを非選択とする。If there is no defect in the normal memory cells 14-24', a redundancy control circuit (not shown) generates signals 1-2 that do not select the redundant memory cells 12-19.
Redundant selection circuit 8 (NAND circuit 82, inverter 8.
9 (NAND circuit 911, inverter 9.) to 9 (NAND circuit 911, inverter 9. At the same time, a circuit 10 (consisting of a NAND circuit 101 and an inverter 10. , inverter xx, good) ~ J2' (consisting of NAND circuit 11.', inverter II!')
and one of the normal memory cells I4 to J4' is selected. If a defect is found in the memory cell I4-21', a signal corresponding to the selection signal 3 or 3' of the defective cell is sent to the selection signal i by the redundant control circuit.
.about.2 to the selection circuits 8-9, and as a result, one of the memory cells 12-13 is selected using the redundancy selection lines 5-6. At the same time, a signal 4 indicating that the redundant memory cell has been selected is transmitted from the detection circuit 10 (consisting of a NAND circuit ZO and an inverter 1θ!) to the normal selection circuit 1l-F.
l' to deselect normal memory cells.
このようKして、たとえ通常のメモリセルに不良が発見
されても、冗長制御回路を用いて冗長用のメモリセルに
置き替えることによシ、不良を救済することができる。In this way, even if a defect is found in a normal memory cell, the defect can be repaired by replacing it with a redundant memory cell using a redundancy control circuit.
しかしながら上記従来の冗長回路では不良メモリセルを
、冗長用のメモリセルを選択することによ如置き替える
場合、冗長用メモリセルが選択されたことを検知し、て
その検知信号を用いて通常のメモリセルを非選択とする
ため、通常のメモリセルと冗長用メモリセルの二重選択
の危険性がある。それを避けるには冗長用の選択線に時
間的遅れを導入する必要があり、高速化に難点がある。However, in the conventional redundancy circuit described above, when replacing a defective memory cell by selecting a redundant memory cell, it detects that the redundant memory cell has been selected and uses the detection signal to replace the defective memory cell with a normal one. Since memory cells are not selected, there is a risk of double selection of normal memory cells and redundant memory cells. To avoid this, it is necessary to introduce a time delay into the redundant selection line, which poses a problem in speeding up the process.
また通常の選択回路も上記検知信号で非選択とするため
の回路が必要となシ、回路が曳雑になるとともに回路の
遅れのため高速化に1ifP点がある。In addition, a normal selection circuit also requires a circuit for non-selection by the above-mentioned detection signal, which makes the circuit complicated and has a 1ifP point in speeding up due to circuit delay.
本発明は上記実情に鑑みてなされたもので、通常用及び
冗長用の選択回路を簡素化できると共に1回路の高速化
が図れる半導体メモリを提供1〜ようとするものである
。The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a semiconductor memory in which the normal and redundant selection circuits can be simplified and the speed of one circuit can be increased.
本発明は、通常の選択回路と通常のメモリセルを選択す
る選択線の間にヒユーズ素子を介挿L %通常のメモリ
セルに不良が発見された場合には、そのメモリセルの選
択線に接続されているヒユーズ素子を切断して不良メモ
リセルを非選択とすることにより、冗長回路が選択され
たことを検知する回路及びその検知信号を省き、更に通
常の選択回路を簡素化するとともに回路の高速化を達成
するようにしたものである。The present invention inserts a fuse element between a normal selection circuit and a selection line that selects a normal memory cell.If a defect is found in a normal memory cell, it is connected to the selection line of that memory cell. By disconnecting the fuse element that has been selected and making the defective memory cell non-selectable, the circuit for detecting that a redundant circuit has been selected and its detection signal can be omitted, and the normal selection circuit can be simplified and the circuit can be simplified. This is to achieve high speed.
以下図面を参照して本発明の一実施例を説明する。第2
図は同実施例を示すものであるが、これは第1図のもの
と対応させた場合の例であるから、対応個所には同一符
号を用いる。第2図において1〜2は通常のメモリセル
14〜14’中に不良が発見されたときに冗長用のメモ
リセル12〜I3を選択するだめの選択信号であり、図
示していない冗長制御回路によりつくられ冗長用選択回
路8〜9に与えられる。5〜6は冗長用の選択線、7〜
7′は通常のメモリセル用の選択線である。8−1’は
通常のメモリセルZ4〜I(’を選択する選択回路11
〜11’ の入力となる選択信号である。15〜15’
はメモリセル14〜ZJ’ に不良が発見された時に
、そのメモリセルが選択回路により選択されても選択線
に信号が伝わらないように切断するヒユーズ素子であり
、これは回路を構成しているトランジスタのゲート電極
を形成するときに同一工程でつくられる多結晶シリコン
で形成される。An embodiment of the present invention will be described below with reference to the drawings. Second
Although the figure shows the same embodiment, since this is an example in which it corresponds to that of FIG. 1, the same reference numerals are used for corresponding parts. In FIG. 2, 1 to 2 are selection signals for selecting redundant memory cells 12 to I3 when a defect is found in the normal memory cells 14 to 14', and a redundancy control circuit (not shown) The redundant selection circuits 8 and 9 are provided with redundancy selection circuits 8 to 9. 5-6 are selection lines for redundancy, 7-
7' is a selection line for normal memory cells. 8-1' is a selection circuit 11 that selects normal memory cells Z4 to I('
This is the selection signal that becomes the input of ~11'. 15~15'
is a fuse element that disconnects when a defective memory cell 14 to ZJ' is found so that no signal is transmitted to the selection line even if the memory cell is selected by the selection circuit, and this is a fuse element that makes up the circuit. It is made of polycrystalline silicon, which is made in the same process as forming the gate electrode of a transistor.
第2図において通常の動作では、選択信号3〜3′が選
択回路tr−1r’に与えられ、その内容によりメモリ
セル14〜14’ のうちの1本が選択される。この時
冗長制御回路によシメモリセル12〜13が選択されな
いような選択信号I〜2が選択回路8〜9に与えられる
。今ここでメモリセル14〜14’ 内に不良が発見さ
れた場合には、ぞのメモリセルを選択する選択線に接続
されているヒユーズ素子をレーザ等で切断することによ
り、たとえ選択信号により不良メモリセルが選択されて
も選択線に信号が伝わらないようにしてその不良メモリ
セルを非選択にする。それと同時に不良メモリセルの選
択信号に相当する信号を冗長制御回路によシ冗長用メモ
リセル12〜1.9のうちの1体が選択されるように選
択信号l〜2として選択回路8〜9に与える。こうする
ことによシ、不良メモリセルが選択されても替シに冗長
用メモリセルに置き替えて選択することができる。In normal operation in FIG. 2, selection signals 3-3' are applied to the selection circuit tr-1r', and one of the memory cells 14-14' is selected depending on the contents of the selection signals 3-3'. At this time, selection signals I-2 are applied to selection circuits 8-9 so that memory cells 12-13 are not selected by the redundancy control circuit. If a defect is found in the memory cells 14 to 14', the fuse element connected to the selection line that selects that memory cell can be cut with a laser or the like, even if the selection signal indicates that the defect is detected. To deselect a defective memory cell by preventing a signal from being transmitted to a selection line even if the memory cell is selected. At the same time, the redundancy control circuit sends a signal corresponding to the selection signal of the defective memory cell to the selection circuits 8 to 9 as selection signals l to 2 so that one of the redundancy memory cells 12 to 1.9 is selected. give to By doing so, even if a defective memory cell is selected, it can be replaced with a redundant memory cell.
なお本発明は実施例のみに限られること彦く種々の応用
が可能である。例えば実施例ではヒユーズ素子の形成を
、ゲート形成と同一工程でできる多結晶シリコンで行な
っているが、これに限ることなくモリブデンシリサイド
等のゲート材料となるものは何でもよく、またゲート材
料でない多結晶シリコン、モリブデンシリサイド或いは
AA’等の配線材料を用いて配線を形成する同一工程で
形成し、でもよい。It should be noted that the present invention is not limited to the examples only, and various applications are possible. For example, in the embodiment, the fuse element is formed using polycrystalline silicon that can be formed in the same process as the gate formation, but this is not limited to this, and any gate material such as molybdenum silicide may be used, and polycrystalline silicon that is not the gate material may be used. They may be formed in the same process of forming wiring using a wiring material such as silicon, molybdenum silicide, or AA'.
以上説明した如く本発明によれば、不良メモリセルの非
選択を、選択線に接続されているヒユーズ素子を切断す
ることで行なうため、冗長メモリセルが選択されたこと
を検知する回路が不要となり、またその検知信号によシ
通常の選択回路を制御する必要もないので、その選択回
路が簡素化でき、更に回路の高速化が図れる。As explained above, according to the present invention, a defective memory cell is deselected by cutting the fuse element connected to the selection line, so there is no need for a circuit to detect that a redundant memory cell has been selected. Moreover, since there is no need to control a normal selection circuit based on the detection signal, the selection circuit can be simplified and the speed of the circuit can be further increased.
また冗長メモリセル選択検知回路による信号の遅れもな
いため、メモリセルの二重選択といった問題も彦く、高
速化が図れるものである。Furthermore, since there is no signal delay caused by the redundant memory cell selection detection circuit, the problem of double selection of memory cells is eliminated, and high speed operation can be achieved.
第1図は従来の半導体メモリ回路図、第2図は本発明の
一実施例の回路図である。
5〜6・・・冗長用選択線
7〜7′・・・通常選択線
B〜9・・・冗長用選択回路
1l−II’・・・通常選択回路
12〜13・・・冗長用メモリセル
14〜14’・・・通常用メモリセル
+ + −h 、−L、、 −−A飴丁出願人代理人
弁理士 鈴 江 武 彦−〜
−〜 の の
第1頁の続き
0発 明 者 青野明
川崎市幸区小向東芝町1番地東
芝マイコンエンジニアリンク株
式会社内
■出 願 人 東芝マイコンエンジニアリング株式会社
川崎市幸区小向東芝町1番地FIG. 1 is a conventional semiconductor memory circuit diagram, and FIG. 2 is a circuit diagram of an embodiment of the present invention. 5-6...Redundancy selection lines 7-7'...Normal selection lines B-9...Redundancy selection circuits 1l-II'...Normal selection circuits 12-13...Redundancy memory cells 14-14'... Normal memory cell + + -h, -L,, --A Ameto Applicant's agent
Patent Attorney Takehiko Suzue - - - Continued from page 1 of 0 Inventor Akira Aono Toshiba Microcomputer Engineering Link Co., Ltd., 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki City Applicant Toshiba Microcomputer Engineering Co., Ltd. Kawasaki 1 Komukai Toshiba-cho, Ichisaiwai-ku
Claims (3)
モリセルと、該メモリセルを選択する通常の選択回路と
、前記メモリセル及び前記選択回路とは別に設けられ前
記メモリセルに不良が発生した場合不良を救済するため
の冗長用の不良救済用メモリセルと、該不良救済用メモ
リセルを選択する不良救済用選択回路と、前記通常のメ
モリセルを選択する選択線と前記通常の選択回路との間
に介挿されたヒユーズ素子とを具備したことを特徴とす
る半導体メモリ。(1) A normal memory cell for storing information formed on a semiconductor substrate, a normal selection circuit that selects the memory cell, and a normal selection circuit that is provided separately from the memory cell and the selection circuit to prevent defects in the memory cell. A redundant defect relief memory cell for relieving a defect when it occurs, a defect relief selection circuit for selecting the defect relief memory cell, a selection line for selecting the normal memory cell, and the normal selection. A semiconductor memory characterized by comprising a fuse element inserted between a circuit and a fuse element.
れたトランジスタのゲート電極と同一材質、同一工程で
形成されたものであることを特徴とする特許請求の範囲
第1項に記載の半導体メモリ。(2) The semiconductor memory according to claim 1, wherein the fuse element is formed of the same material and in the same process as the gate electrode of the transistor formed on the semiconductor substrate.
れた配線材料と同一材質、同一工程で形成されたもので
あることを特徴とする特許請求の範囲第1項に記載の半
導体メモリ。(3) The semiconductor memory according to claim 1, wherein the fuse element is formed of the same material and in the same process as the wiring material formed on the semiconductor substrate.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58126233A JPS6018899A (en) | 1983-07-13 | 1983-07-13 | Semiconductor memory |
KR1019840003760A KR850001610A (en) | 1983-07-13 | 1984-06-29 | Semiconductor memory |
US06/630,115 US4587638A (en) | 1983-07-13 | 1984-07-12 | Semiconductor memory device |
DE8484108240T DE3485734D1 (en) | 1983-07-13 | 1984-07-13 | SEMICONDUCTOR STORAGE DEVICE. |
EP84108240A EP0131930B1 (en) | 1983-07-13 | 1984-07-13 | Semiconductor memory device |
KR2019890021522U KR900002517Y1 (en) | 1983-07-13 | 1989-12-28 | The semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58126233A JPS6018899A (en) | 1983-07-13 | 1983-07-13 | Semiconductor memory |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6018899A true JPS6018899A (en) | 1985-01-30 |
Family
ID=14930075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58126233A Pending JPS6018899A (en) | 1983-07-13 | 1983-07-13 | Semiconductor memory |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6018899A (en) |
KR (1) | KR850001610A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61185114A (en) * | 1985-02-13 | 1986-08-18 | 三菱農機株式会社 | Fertilizer feeder in fertilizing machine |
US4752914A (en) * | 1984-05-31 | 1988-06-21 | Fujitsu Limited | Semiconductor integrated circuit with redundant circuit replacement |
JPH02297646A (en) * | 1989-05-12 | 1990-12-10 | Matsushita Electric Ind Co Ltd | Memory device |
US5263335A (en) * | 1991-07-12 | 1993-11-23 | Mitsubishi Denki Kabushiki Kaisha | Operation controller for air conditioner |
US7130931B2 (en) * | 2003-06-18 | 2006-10-31 | International Business Machines Corporation | Method, system, and article of manufacture for selecting replication volumes |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671900A (en) * | 1979-11-12 | 1981-06-15 | Mitsubishi Electric Corp | Random access memory |
JPS57210500A (en) * | 1981-06-19 | 1982-12-24 | Mitsubishi Electric Corp | Semiconductor storage device |
JPS58105496A (en) * | 1981-12-17 | 1983-06-23 | Toshiba Corp | Semiconductor integrated circuit |
-
1983
- 1983-07-13 JP JP58126233A patent/JPS6018899A/en active Pending
-
1984
- 1984-06-29 KR KR1019840003760A patent/KR850001610A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671900A (en) * | 1979-11-12 | 1981-06-15 | Mitsubishi Electric Corp | Random access memory |
JPS57210500A (en) * | 1981-06-19 | 1982-12-24 | Mitsubishi Electric Corp | Semiconductor storage device |
JPS58105496A (en) * | 1981-12-17 | 1983-06-23 | Toshiba Corp | Semiconductor integrated circuit |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4752914A (en) * | 1984-05-31 | 1988-06-21 | Fujitsu Limited | Semiconductor integrated circuit with redundant circuit replacement |
JPS61185114A (en) * | 1985-02-13 | 1986-08-18 | 三菱農機株式会社 | Fertilizer feeder in fertilizing machine |
JPH0412084B2 (en) * | 1985-02-13 | 1992-03-03 | Mitsubishi Agricult Mach | |
JPH02297646A (en) * | 1989-05-12 | 1990-12-10 | Matsushita Electric Ind Co Ltd | Memory device |
US5263335A (en) * | 1991-07-12 | 1993-11-23 | Mitsubishi Denki Kabushiki Kaisha | Operation controller for air conditioner |
US7130931B2 (en) * | 2003-06-18 | 2006-10-31 | International Business Machines Corporation | Method, system, and article of manufacture for selecting replication volumes |
Also Published As
Publication number | Publication date |
---|---|
KR850001610A (en) | 1985-03-30 |
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