JPH11260250A - Transfer sheet for manufacturing plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a transfer sheet for manufacturing a plasma display panel, by which very detailed pattern forming of an electrode, a dielectric or the like and very precise thick-film pattern forming of a barrier or the like are made possible. SOLUTION: A transfer layer 13, which contains at least an inorganic component containing a glass frit and an organic component which is removable by firing, is installed exfoliatably on a base film 12. A stress absorbing layer 14, whose complex elastic modulus is smaller than that of the transfer layer 13, is installed on the transfer layer 13, and a protective film 15 is installed on the stress absorbing layer 14, in a state in which the transfer layer 13 is formed exfoliatably from the stress absorbing layer 14 or the stress absorbing layer 14 is formed exfoliatably from the protective film 15, to thereby obtain the subject transfer sheet 11 for manufacturing a plasma display panel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer sheet for producing a plasma display panel for forming an electrode pattern, a dielectric layer, a barrier, and the like in a plasma display panel with high precision.

[0002]

2. Description of the Related Art In recent years, plasma display panels (P
DP) Fine pattern formation of electrodes, dielectrics, etc.
Alternatively, it is required that the formation of the barrier can be performed with higher accuracy and at low manufacturing cost.

Conventionally, a pattern formation in a PDP is performed by forming a predetermined pattern by a printing method such as screen printing or offset printing using a pattern forming paste having desired characteristics, and drying and baking to form a pattern. And so on.

[0004]

The above-mentioned printing method is expected to have a simple process and reduce the manufacturing cost. However, the screen printing method has a limitation in printing accuracy due to elongation of a mesh material constituting a screen printing plate. In addition, there is a problem that the formed pattern has meshes or bleeds of the pattern, and the edge accuracy of the pattern is low.
Further, in the offset printing method, as the number of printings advances, the pattern forming paste is not completely transferred to the substrate and remains on the blanket, so that the pattern accuracy is reduced.
Therefore, it is necessary to replace the blanket at any time in order to maintain the pattern accuracy, and there has been a problem that the operation is complicated.

On the other hand, as a thick film pattern having a high aspect ratio such as a PDP barrier, a barrier having a predetermined pattern has been conventionally formed by a screen printing method. In the screen printing method, since the limit of the film thickness that can be formed by one printing is several tens of μm, it is necessary to repeat printing and drying many times, generally ten times or more.
However, generally, the coating film formed by the screen printing method has a convex shape in which the peripheral portion is lowered, and when performing multiple overprinting as described above, dripping of the coating liquid in the pattern peripheral portion is accumulated. There has been a problem that the bottom has a wide cross-sectional shape.

The present invention has been made in view of the above circumstances, and is a plasma display capable of forming a high-definition pattern such as an electrode and a dielectric and a high-precision thick film pattern such as a barrier. An object of the present invention is to provide a transfer sheet for manufacturing a panel.

[0007]

In order to achieve the above object, a transfer sheet for producing a plasma display panel according to the present invention comprises a base film and a transfer layer provided releasably on the base film. A stress absorbing layer provided on the transfer layer, wherein the transfer layer contains at least an inorganic component containing glass frit and an organic component that can be removed by firing, and the complex elastic modulus of the stress absorbing layer is the transfer layer. The configuration was such that it was smaller than the complex modulus of elasticity.

The transfer sheet for producing a plasma display panel according to the present invention comprises a base film, a transfer layer releasably provided on the base film, and a stress absorbing member releasably provided on the transfer layer. A layer and a protective film provided on the stress absorbing layer, wherein the transfer layer contains at least an inorganic component including a glass frit, and an organic component that can be removed by firing. The configuration was such that it was smaller than the complex elastic modulus of the layer.

Further, the transfer sheet for producing a plasma display panel of the present invention comprises a base film, a transfer layer provided on the base film in a releasable manner, a stress absorbing layer provided on the transfer layer, A protective film releasably provided on the stress absorbing layer, wherein the transfer layer contains at least an inorganic component containing glass frit and an organic component that can be removed by firing, and the complex elastic modulus of the stress absorbing layer is The configuration was such that it was smaller than the complex elastic modulus of the layer.

Further, the transfer sheet for producing a plasma display panel of the present invention has a structure in which the organic component has photosensitivity.

Further, the transfer sheet for producing a plasma display panel of the present invention is configured such that the transfer layer contains conductive powder as an inorganic component.

According to the present invention as described above, the stress applied to the transfer layer by the external force applied to the transfer sheet is absorbed by the stress absorption layer having a complex elastic modulus smaller than that of the transfer layer, and cracks or the like are generated in the transfer layer. It acts to prevent.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an embodiment of a transfer sheet for producing a plasma display panel according to the present invention. In FIG. 1, a transfer sheet 1 for producing a plasma display panel includes a transfer layer 3 and a stress absorbing layer 4 on a base film 2. The transfer layer 3 is provided so as to be peelable from the base film 2 and contains at least an inorganic component including a glass frit and an organic component that can be removed by firing. The stress absorbing layer 4
Has a complex elastic modulus smaller than that of the transfer layer 3. For example, the value of the complex elastic modulus of the stress absorbing layer 4 is in the range of 1 to 1/10 ² of the value of the complex elastic modulus of the transfer layer 3, preferably 1/1
It is set to be in the range of 0 to 1/10 ² .

FIG. 2 is a schematic sectional view showing another embodiment of the transfer sheet for producing a plasma display panel of the present invention. In FIG. 2, a transfer sheet 11 for producing a plasma display panel includes a transfer layer 13, a stress absorbing layer 14, and a protective film 15 on a base film 12.
It has. The transfer layer 13 is provided releasably from the base film 12 and contains at least an inorganic component including glass frit and an organic component that can be removed by firing. The stress absorption layer 14 has a complex elastic modulus smaller than that of the transfer layer 13. For example, the value of the complex elastic modulus of the stress absorption layer 14 is 1 to 1/10 of the value of the complex elastic modulus of the transfer layer 13. ² range, preferably 1/10 to 1
It is set to be in the range of / 10 ² . This stress absorbing layer 14 is preferably provided so as to be peelable from the transfer layer 13, but may be peelable from the protective film 15.

It is desirable that the absolute value of the complex elastic modulus of the stress absorbing layers 4 and 14 is not less than 1 × 10 ⁴ dyne / cm ² . If the absolute value of the complex elastic modulus is equal to or less than the above value, when the transfer sheets 1 and 11 are stored in a roll state, the stress absorbing layers 4 and 14 run off from the rolls, and the transfer sheets 1 and 11 are stored. The possible period becomes short, which is not preferable. Also, ta of the stress absorbing layers 4 and 14
By setting the value of nδ larger than the value of tanδ of the transfer layers 3 and 13, stress absorption due to plastic deformation of the stress absorbing layers 4 and 14 during storage of the transfer sheets 1 and 11 in a roll state is more effective. Is made.

In the present invention, the complex elastic modulus of the transfer layer and the stress absorbing layer is a value measured by a rheometer RDA-II (manufactured by Rheometric Scientific).

The transfer sheets 1 and 11 for producing such a plasma display panel may be in the form of a sheet or a long sheet. In the case of the long sheet, the transfer sheet may be in the form of a roll wound around a core. it can. The core used is preferably a core formed of an ABS resin, a vinyl chloride resin, bakelite, or the like in order to prevent generation of dust and paper dust, and a paper tube impregnated with the resin.

Next, the structure of the transfer sheets 1 and 11 for producing the plasma display panel will be described. Base Film Base films 2 and 12 constituting transfer sheets 1 and 11 for producing a plasma display panel of the present invention are stable with respect to the ink composition when forming transfer layers 3 and 13 and have flexibility. And a material that does not cause significant deformation under tension or pressure.

As a material to be used, first, a resin film can be used. Specific examples of the resin film include a polyethylene film, an ethylene-vinyl acetate copolymer film, an ethylene-vinyl alcohol copolymer film, a polypropylene film, a polystyrene film, a polymethacrylate film, a polyvinyl chloride film, a polyvinyl alcohol film, and a polyvinyl film. Butyral film, nylon film, polyetherketone film, polyphenylene sulfide film, polysulfone film, polyethersulfone film, polytetrafluoroethylene-perfluoroalkylvinyl ether film, polyvinyl fluoride film, tetrafluoroethylene-ethylene film, tetrafluoroethylene -Hexafluoropropylene film, polychlorotrifluoroethylene Film, polyvinylidene fluoride film, polyethylene terephthalate film, 1,4-polycyclohexylene dimethylene terephthalate film, polyethylene naphthalate film, polyester film, cellulose triacetate film, polycarbonate film, polyurethane film, polyimide film, polyetherimide Films, films in which fillers are blended with these resin materials, and films using these resin materials
Axial stretching or biaxial stretching, a biaxially stretched film using these resin materials to increase the stretching ratio in the width direction from the flow direction, and using these resin materials to increase the stretching ratio in the flow direction from the width direction Biaxially stretched films, composites formed by laminating the same or different films of these films, and composites formed by co-extruding the same or different resins selected from the raw resin used for these films Films and the like can be mentioned. In addition, those obtained by treating the above resin film,
For example, silicon-treated polyethylene terephthalate, corona-treated polyethylene terephthalate, or the like can be used.

Further, metal foils or metal steel strips can be used as the base films 2 and 12. Specific examples of such a metal foil or metal steel strip include copper foil, copper steel strip, aluminum foil, aluminum steel strip, SUS430, SUS30.
1, SUS304, SUS420J2 and SUS63
And stainless steel strips such as No. 1 and beryllium steel strips. Further, the above-mentioned metal foil or metal steel strip bonded to the above-mentioned resin film may be used.

The thickness of the base films 2 and 12 as described above can be set in the range of 4 to 400 μm, preferably 10 to 150 μm. Transfer Layers The transfer layers 3 and 13 are provided with an ink composition containing at least an inorganic component including a glass frit and an organic component that can be removed by baking, on the base films 2 and 12, a direct gravure coating method, a gravure reverse coating method, and a reverse roll. It can be formed by coating and drying by a known coating method such as a coating method, a slide die coating method, a slit die coating method, a comma coating method, a slit reverse coating method and the like. (1) Inorganic component As the above glass frit, for example, the softening temperature is 3
50 to 650 ° C., and the coefficient of thermal expansion α ₃₀₀ is 60 × 10
^A glass frit having a temperature of ^{−7 to} 100 × 10 ⁻⁷ / ° C. can be used. Glass frit softening temperature 650 ℃
If the temperature exceeds the above, it is necessary to increase the firing temperature. For example, if the heat resistance of the pattern formation target is low, thermal deformation occurs in the firing step, which is not preferable. On the other hand, if the softening temperature of the glass frit is lower than 350 ° C., the glass frit is fused before the organic components are completely decomposed, volatilized and removed by baking, which is not preferable because voids are easily formed. Furthermore, the coefficient of thermal expansion α ₃₀₀ of the glass frit is 60 × 10
^{If it is} less than ^-7 / ° C or more than 100 × ^10-7 / ° C, the difference from the coefficient of thermal expansion of the pattern-formed body may become too large, causing distortion and the like, which is not preferable. The average particle size of such a glass frit is 0.1 to
A range of 10 μm is preferred.

When a photosensitive resin composition as described below is used as the organic component that can be removed by baking, it is preferable to use a bismuth-based glass frit from the viewpoint of resistance to a polymer and the like.

The transfer layers 3 and 13 are made of an inorganic powder such as aluminum oxide, boron oxide, silica, titanium oxide, magnesium oxide, calcium oxide, strontium oxide, barium oxide, or calcium carbonate as the inorganic powder. It can be contained in a range of 30 parts by weight or less based on parts by weight. Such an inorganic powder preferably has an average particle size in the range of 0.1 to 20 μm, and functions as an aggregate to prevent pattern casting during firing and to control the reflectance and the dielectric constant. Things.

The transfer sheets 1 and 11 provided with the transfer layers 3 and 13 containing at least the above glass frit as an inorganic component can be used for forming a dielectric layer of a plasma display panel.

When the transfer sheets 1 and 11 for producing a plasma display panel of the present invention are used for forming a barrier, reflection of external light of the formed barrier pattern is reduced.
In order to improve the practical contrast, a refractory black or white pigment is used as the inorganic powder in the transfer layers 3 and 1.
3 can be contained. Co-Cr-Fe, Co-Mn-Fe, Co-Fe
-Mn-Al, Co-Ni-Cr-Fe, Co-Ni-
Mn-Cr-Fe, Co-Ni-Al-Cr-Fe, C
o-Mn-Al-Cr-Fe-Si and the like. In addition, as a fire-resistant white pigment, titanium oxide,
Examples include aluminum oxide, silica, and calcium carbonate.

Further, when the transfer sheets 1 and 11 for producing a plasma display panel of the present invention are used for forming an electrode pattern, conductive powders are contained in the transfer layers 3 and 13 as inorganic powders.

As the conductive powder, Au powder, A powder
One or more of g powder, Cu powder, Ni powder, Al powder, Ag-Pd powder and the like can be used. The shape of the conductive powder may be various shapes such as a sphere, a plate, a lump, a cone, and a rod, but a spherical conductive powder having good dispersibility without cohesion is preferable. The average particle size is preferably in the range of 0.05 to 10 μm. Transfer layer 3, 13
Can be in the range of 2 to 20 parts by weight, preferably 2 to 10 parts by weight of the glass frit with respect to 100 parts by weight of the conductive powder. (2) Organic Component A thermoplastic resin can be used as the organic component contained in the transfer layers 3 and 13 which can be removed by firing.

The thermoplastic resin is contained as a binder for the above-mentioned inorganic component and for the purpose of improving transferability. Examples thereof include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, and the like. n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl Acrylate, n-
Hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, n-decyl acrylate, n-decyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate ,
2-hydroxypropyl methacrylate, styrene, α
1 such as methylstyrene, N-vinyl-2-pyrrolidone, etc.
Examples thereof include polymers or copolymers composed of at least two or more species, and cellulose derivatives such as ethyl cellulose.

In particular, methyl acrylate,
Methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-
Butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, te
rt-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-
Preferred is a polymer or copolymer of at least one of hydroxypropyl acrylate and 2-hydroxypropyl methacrylate, and ethyl cellulose.

The above thermoplastic resin has a molecular weight of 10,000.
A range from 0 to 500,000 is preferred.

As the organic component contained in the transfer layers 3 and 13 which can be removed by firing, a photosensitive resin composition can be used.

The photosensitive resin composition contains at least a polymer, a monomer and an initiator, and does not volatilize and decompose by firing and does not leave carbides in the fired film.

As the polymer, methyl acrylate,
Methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-
Butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, te
rt-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, n-decyl acrylate, n-decyl methacrylate, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, styrene, α
-Methylstyrene, one or more of N-vinyl-2-pyrrolidone, acrylic acid, methacrylic acid, dimer of acrylic acid (for example, M-5600 manufactured by Toa Gosei Co., Ltd.), 2-methacryloyloxyethyl succinate 2-acryloyloxyethyl succinate, 2-methacryloyloxyethyl phthalate, 2-acryloyloxyethyl phthalate, 2-methacryloyloxyethyl hexahydrophthalate, 2-acryloyloxyethyl hexahydrophthalate, itaconic acid, crotonic acid , Maleic acid, fumaric acid, vinyl acetic acid, polymers or copolymers of one or more of these acid anhydrides, and cellulose derivatives such as ethyl cellulose.

Further, a polymer obtained by adding an ethylenically unsaturated compound having a glycidyl group or a hydroxyl group to the above-mentioned copolymer may be mentioned, but it is not limited thereto.

The molecular weight of the above polymer is 5,000 to 3
00,000, preferably 30,000 to 150,000
A range of 0 is preferred.

As the reactive monomer constituting the photosensitive resin composition, a compound having at least one polymerizable carbon-carbon unsaturated bond can be used. Specifically, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl Acrylate, isobonyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate,
Phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3
-Propanediol acrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate, glycerol diacrylate,
Tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethylene oxide-modified pentaerythritol triacrylate, ethylene oxide-modified pentaerythritol tetra Acrylate, propylene oxide-modified pentaerythritol triacrylate, propylene oxide-modified pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyltrimethylolpropane triacrylate, butylene glycol diacrylate, 1,2,4-butanetriol triacrylate , 2,2,4-trimethyl-1,3
-Pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate,
Pentaerythritol hexaacrylate, and the above acrylate changed to methacrylate, γ-
Methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, and the like. In the present invention, the above-mentioned reactive monomers can be used as one kind or a mixture of two or more kinds, or as a mixture with other compounds.

As the photopolymerization initiator constituting the photosensitive resin composition, benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamine) benzophenone,
α-amino acetophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,2-diethoxyacetophonone, 2,2-dimethoxy-2-phenylacetophenone, -Hydroxy-2-methylpropiophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-
Chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketal, benzylmethoxyethylacetal, benzoinmethylether, benzoinbutylether, anthraquinone, 2-tert-butylanthraquinone, 2-amylanthraquinone, β-chloranthraquinone, anthrone, benzantrone , Dibenzsuberone, methyleneanthrone, 4-azidobenzylacetophenone, 2,6
-Bis (p-azidobenzylidene) cyclohexane,
2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2- (o-methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o-ethoxy Carbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl-
[4- (methylthio) phenyl] -2-morpholino-
1-propane, naphthalene sulfonyl chloride, quinoline sulfonyl chloride, n-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzothiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide,
Examples include a combination of a photoreducing dye such as tribromophenyl sulfone, benzoin peroxide, eosin, and methylene blue with a reducing agent such as ascorbic acid and triethanolamine. In the present invention, these photopolymerization initiators are
Species or two or more can be used.

The content of the thermoplastic resin or the photosensitive resin composition in the transfer layers 3 and 13 is 3 to 50 parts by weight, preferably 5 to 30 parts by weight based on 100 parts by weight of the above-mentioned inorganic component. Can be set in a range. When the content of the thermoplastic resin or the photosensitive resin composition is less than 3 parts by weight, the shape retention of the transfer layers 3 and 13 is low, and in particular, there is a problem in storage stability and handling in a roll state, and When the transfer sheets 1 and 11 are cut (slit) into a desired shape, inorganic components are generated as dust, which may hinder plasma display panel production. On the other hand, when the content of the thermoplastic resin or the photosensitive resin composition exceeds 50 parts by weight, the organic components cannot be completely removed by firing, and carbides remain in the film after firing, resulting in deterioration in quality. Not preferred.

Further, the above-mentioned thermoplastic resin and photosensitive resin composition may contain, as additives, sensitizers, polymerization terminators, chain transfer agents, leveling agents, dispersants, transferability-imparting agents, stabilizers, A foaming agent, a thickener, a suspending agent, a release agent and the like can be contained as required.

The transferability-imparting agent is added for the purpose of improving the transferability and the fluidity of the ink composition. Examples thereof include dimethyl phthalate, dibutyl phthalate, and di-n.
Normal alkyl phthalates such as octyl phthalate, phthalic acid esters such as di-2-ethylhexyl phthalate, diisodecyl phthalate, butyl benzyl phthalate, diisononyl phthalate, ethyl phthalyl ethyl glycolate, and butyl phthalyl butyl glycolate; tri-2 -Ethylhexyl trimellitate, tri-
trimellitate such as n-alkyl trimellitate, triisononyl trimellitate, triisodecyl trimellitate, dimethyl adipate, dibutyl adipate, di-2-ethylhexyl adipate, diisodecyl adipate, dibutyl diglycol adipate, di- 2
-Ethylhexyl acetate, dimethyl sebacate, dibutyl sebacate, di-2-ethylhexyl sebacate, di-2-ethylhexyl malate, acetyl-tri- (2-ethylhexyl) citrate, acetyl-tri-n-butyl citrate, Aliphatic dibasic acid esters such as acetyl tributyl citrate, polyethylene glycol benzoate, triethylene glycol di- (2
-Ethylhexoate), glycol derivatives such as polyglycol ether, glycerin derivatives such as glycerol triacetate and glycerol diacetyl monolaurate, polyesters composed of sebacic acid, adipic acid, azelaic acid, phthalic acid, etc., having a molecular weight of 300 to 3,000. Low molecular weight polyether, the same low molecular weight poly-α-styrene, the same low molecular weight polystyrene, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, triphenyl phosphate,
Orthophosphates such as tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xyenyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, ricinoleates such as methyl acetyl ricinoleate, poly-1,3
-Polyester / epoxidized esters such as butanediol adipate and epoxidized soybean oil; and acetates such as glycerin triacetate and 2-ethylhexyl acetate.

The dispersant and the anti-settling agent are intended to improve the dispersibility and anti-settling property of the above-mentioned inorganic powder, and include, for example, phosphate ester type, silicone type, castor oil ester type and various types. Surfactants and the like, examples of the antifoaming agent include silicone-based, acrylic-based, various surfactants and the like, and examples of the release agent include silicone-based, fluorine oil-based, paraffin-based, and fatty acid-based , Fatty acid ester type, castor oil type, wax type, compound type and the like, and as the leveling agent, for example, fluorine type, silicone type, various surfactants and the like,
Each can be added in an appropriate amount.

Examples of the solvent used together with the thermoplastic resin or the photosensitive resin composition for forming the transfer layers 3 and 13 include, for example, alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol and propylene glycol. , Α- or β-
Terpene such as terpineol, etc., ketones such as acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, diethyl ketone, 2-heptanone and 4-heptanone, and aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene , Cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene Glycol ethers such as glycol monomethyl ether and triethylene glycol monoethyl ether, ethyl acetate, butyl acetate,
Cellosolve acetate, ethyl cellosolve acetate,
Butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 2-methoxyethyl acetate, cyclohexyl acetate, 2-ethoxyethyl acetate,
Examples thereof include acetates such as 3-methoxybutyl acetate, diethylene glycol dialkyl ether, dipropylene glycol dialkyl ether, ethyl 3-ethoxypropionate, methyl benzoate, N, N-dimethylacetamide, N, N-dimethylformamide and the like.

When the above-mentioned photosensitive resin composition is used as the organic component which can be removed by baking, the solubility of the photopolymerization initiator is improved, the stability of the ink composition is improved, and the gelation of the glass frit is prevented. , And from the viewpoint of developability when a polymerized polymer is used, N-methyl-
Preferably, 2-pyrrolidone is used. Stress absorbing layer stress absorbing layer 4, 14 is formed by forming a transfer layer 3 and 13 on the base film 2, 12, it can be formed on the transfer layer 3, 13. In the case of the stress absorbing layer 14,
The protective film 15 on which the stress absorbing layer 14 has been formed in advance can also be formed by laminating the transfer layer 13 formed on the base film 12.

The stress absorbing layers 4 and 14 are made of an acrylate resin such as n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, a cellulose resin, and ethylene-vinyl acetate. Polymer, polyvinyl alcohol, butyral resin, polyester resin, polyethylene resin, polybutadiene resin,
Butadiene / styrene copolymer resin and natural rubber, styrene butadiene rubber, butadiene rubber, isoprene rubber, chloroprene rubber, nitrile butadiene rubber, isobutylene isoprene rubber, ethylene propylene rubber, silicone rubber, fluorine rubber, urethane rubber, propylene oxide rubber Or a combination of two or more resins such as a rubber-based resin such as a polysulfide elastomer. In addition, a plasticizer, an antiblocking agent, a leveling agent, an antifoaming agent, a thickener, and the like may be contained in the above-described resin as necessary. However, in the transfer sheet 11 shown in FIG. 2, when the stress absorbing layer 14 can be peeled off from the protective film 15 and is transferred together with the transfer layer 13 to an object to be transferred, the stress absorbing layer 14 is a resin which can be removed by firing. Must be formed by In this case, the transferability-imparting agent described in the description of the transfer layer can be contained in the stress absorbing layer 14.

The formation of the stress-absorbing layers 4 and 14 is carried out by applying the ink composition containing the above resin material or the like onto the transfer layers 3 and 13 or the protective film 15 by a direct gravure coating method, a gravure reverse coating method, or a reverse gravure coating method. It can be formed by applying and drying by a known application means such as a roll coating method, a slide die coating method, a slit die coating method, a comma coating method, a slit reverse coating method and the like. As the solvent used in the ink composition for forming the stress absorbing layer, the solvents described in the description of the transfer layer are preferable.

The stress absorbing layers 4 and 14 are set so that the complex elastic modulus is smaller than that of the transfer layers 3 and 13, and have a thickness of 0.1 to 20 μm, preferably 1 to 10 μm.
Can be set in the range.

The stress absorbing layer 14 may be peelable from the transfer layer 13 or peelable from the protective film 15, and these adjustments constitute the stress absorbing layer 14. Material, a method of forming the stress absorbing layer 14, and the like. Protective Film The protective film 14 constituting the transfer sheet 11 for producing a plasma display panel according to the present invention includes a stress absorbing layer 14.
It is possible to use a material which is stable with respect to the ink composition at the time of forming, has flexibility, and does not cause significant deformation by tension or pressure. Specifically, polyethylene film, ethylene-vinyl acetate copolymer film, ethylene-vinyl alcohol copolymer film, polypropylene film, polystyrene film, polymethacrylic acid film, polyvinyl chloride film, polyvinyl alcohol film, polyvinyl butyral film, Nylon film, polyetheretherketone film, polysulfone film, polyethersulfone film, polytetrafluoroethylene-perfluoroalkylvinylether film, polyvinyl fluoride film, tetrafluoroethylene-ethylene film, tetrafluoroethylene-hexafluoropropylene film, Polychlorotrifluoroethylene film, polyvinylidene fluoride film, poly Chi terephthalate film, polyethylene naphthalate film, a polyester film, a cellulose triacetate film, polycarbonate film,
Polyurethane film, polyimide film, polyetherimide film, film in which filler is blended with these resin materials, uniaxially or biaxially stretched film using these resin materials, flow direction using these resin materials A biaxially stretched film with a higher stretching ratio in the width direction, a biaxially stretched film with a higher stretching ratio in the flow direction than the width direction using these resin materials, and a film of the same or different type among these films Examples thereof include a combined film and a composite film formed by co-extruding the same or different resins selected from the raw material resins used for these films. Among these films, it is particularly preferable to use a biaxially stretched polyester film. Further, those obtained by treating the above resin film, for example, silicon-treated polyethylene terephthalate, corona-treated polyethylene terephthalate, melamine-treated polyethylene terephthalate, corona-treated polyethylene, corona-treated polypropylene, and the like can also be used.

The thickness of the protective film 14 as described above is
It can be set in the range of 4 to 400 μm, preferably 6 to 150 μm.

Next, an example of forming an electrode pattern of a plasma display panel (PDP) using the above-described transfer sheet for producing a plasma display panel of the present invention will be described.

Here, before describing the formation of the electrode pattern and the formation of the dielectric layer, an AC type PDP will be described.

FIG. 3 is a schematic structural view showing an AC type PDP, showing a state in which a front plate and a back plate are separated.
In FIG. 3, the PDP 51 has a front plate 61 and a rear plate 71 arranged in parallel and facing each other, and a barrier 76 is formed on the front side of the rear plate 71 so as to stand upright. The front plate 61 and the back plate 71 are held at regular intervals by the barrier 76. The front plate 61 has a front glass substrate 62, and composite electrodes composed of a sustain electrode 63, which is a transparent electrode, and a bus electrode 64, which is a metal electrode, are formed in parallel on the back side of the front glass substrate 62. And a dielectric layer 65 is formed over the
An O layer 66 is formed. The back plate 71 has a back glass substrate 72. On the front side of the back glass substrate 72, an address electrode 74 is located between barriers 76 so as to be orthogonal to the composite electrode via a base layer 73. Are formed in parallel with each other, a dielectric layer 75 is formed so as to cover them, and a phosphor layer 77 is provided so as to cover the wall surface of the barrier 76 and the bottom surface of the cell. In the AC type PDP, a predetermined voltage is applied from an AC power source between composite electrodes on the front glass substrate 62 to form an electric field, whereby the front glass substrate 62, the rear glass substrate 72, and the barrier 7 are formed.
Discharge is performed in each cell as a display element defined by the cells 6 and 6. Then, the phosphor layer 77 is caused to emit light by the ultraviolet light generated by the discharge, and the light transmitted through the front glass substrate 62 is visually recognized by the observer.

Next, the formation of the address electrode 74 on the back plate 71 of the PDP will be described.

FIG. 4 is a process chart for explaining the pattern formation of the address electrodes 74 using the transfer sheet 11 for producing a plasma display panel according to the present invention. In this case, the transfer layer 13 of the transfer sheet 11 for producing a plasma display panel contains a negative photosensitive resin composition as an organic component that can be removed by firing.

In FIG. 4, first, the protective film 15 is peeled off together with the stress absorbing layer 14 from the transfer sheet 11, and then the back glass substrate 7 provided with the underlayer 73 is provided.
2, the transfer layer 13 side of the transfer sheet 11 is pressed, the base film 12 is peeled off, and the transfer layer 13 is transferred (FIG. 4).
(A)). In the transfer sheet 11 of the present invention, since the external stress is absorbed by the stress absorbing layer 14 having a smaller complex elastic modulus than the transfer layer 13, the transfer layer 13 is kept in a good state without cracks or the like. In the transfer step, the transfer layer 13 can be transferred to the rear glass substrate 72 in a good state.

If heating is required for the transfer of the transfer layer 13, the back glass substrate 72 may be heated, or may be heated by a pressure roll or the like.

Next, the transfer layer 13 is placed via the photomask M.
Is exposed (FIG. 4B). When a light-transmitting film is used as the base film 12, exposure may be performed before the base film 12 is peeled off.

Next, by developing the transfer layer 13, a pattern 13 ′ made of a conductive photosensitive resin layer is formed on the underlayer 73 (FIG. 4 (C)). By removing the organic components, an address electrode pattern 74 is formed (FIG. 4D).

In the above example, the transfer sheet for producing a plasma display panel of the present invention as shown in FIG. 2 is used, but the transfer sheet without a protective film as shown in FIG. 1 is used. If so, the underlayer 73
The transfer layer of the transfer sheet can be directly pressure-bonded to the back glass substrate 72 provided with, and the pattern can be formed by the same operation as in FIG. When using a transfer sheet for producing a plasma display panel according to the present invention as shown in FIG. 2, in which the stress absorbing layer remains on the transfer layer when the protective film is peeled off, the protective film is used. After the peeling, the transfer layer is transferred to the rear glass substrate 72 via the stress absorbing layer, and thereafter, the pattern can be formed by the same operation as in FIG. In this case, the stress absorbing layer will be removed at the firing stage.

In the case where the dielectric layer 75 is formed entirely of solid, the organic component can be removed by baking immediately after the transfer layer is transferred.

[0061]

Next, the present invention will be described in more detail with reference to examples. Example 1 First, a conductive photosensitive resin composition having the following composition was prepared as an ink composition for forming a transfer layer.

Composition of photosensitive resin composition: silver powder (spherical, average particle size: 1 μm): 96 parts by weight; glass frit: 4 parts by weight (main components: Bi ₂ O ₃ , SiO ₂ , B ₂ O ₃ (none) (Alkali) Softening point = 500 ° C., Thermal expansion coefficient α ₃₀₀ = 80 × 10 ⁻⁷ / ° C.) n-butyl methacrylate / hydroxyethyl methacrylate / methacrylic acid copolymer: 13 parts by weight (molecular weight = 70,000, acid value) = 140 mgKOH / g) Pentaerythritol triacrylate 11 parts by weight (M-305 manufactured by Toagosei Co., Ltd.) Photopolymerization initiator (Irgacure 369 manufactured by Ciba-Geigy Co., Ltd.) 1 part by weight 3-methoxybutyl acetate 20 weights Part Next, as a base film, a polyethylene terephthalate film (T-60 manufactured by Toray Industries, Inc. (thickness: 50 μm))
Is prepared, and the above ink composition is coated on the base film by a blade coating method and dried (100 ° C., 10 ° C.).
Min) to form a transfer layer having a thickness of 17 μm. The complex elastic modulus of the formed transfer layer was measured under the following conditions.
It was 0 ⁷ dyne / cm ^2. When the complex elastic modulus of the base film was measured in the same manner, it was 8 × 10 ¹¹ dyn.
e / cm ² .

(Conditions for Measuring Complex Elastic Modulus) Sample Size: 1 mm (Thickness of 1 mm is obtained by laminating a film (transfer layer) made of 17 μm) Width = 10 mm Length = 20 mm Measurement device: Rheometer RDA-II (manufactured by Rheometric Scientific)-Measurement conditions: temperature = 23 ° C ω = 10 ^-1 rad / sec strain = 0.01% On the other hand, styrene / A butadiene copolymer latex (emulsion) polymer (solid content ratio = 50%, solvent = water) was prepared.

Next, a 25 μm-thick polyethylene terephthalate film (manufactured by Toray Industries, Inc.) as a protective film
Is prepared, and the above ink composition is coated on this protective film by a blade coating method and dried (80 ° C., 2 minutes)
Thus, a stress absorbing layer having a thickness of 3 μm was formed. When the complex elastic modulus of the formed stress absorption layer was measured under the same conditions as above, it was 1 × 10 ⁶ dyne / cm ² .

Next, a protective film was laminated on the transfer layer so that the stress absorbing layer overlapped therewith to form a transfer sheet (sample 1) for producing a plasma display panel as shown in FIG. In this transfer sheet for producing a plasma display panel, the stress absorption layer was made to be peelable from the transfer layer.

FIG. 2 shows the same manner as in Sample 1 except that a silicon-treated polyethylene terephthalate film having a thickness of 25 μm (SP-PET-03-25-C manufactured by Tosello Co., Ltd.) was used as the protective film. A transfer sheet (sample 2) for producing such a plasma display panel was formed. In this transfer sheet for producing a plasma display panel, the complex elastic modulus of the stress absorbing layer is 1 × 10 ⁶ dyne / cm ² as described above. When the complex elastic modulus of the protective film was measured in the same manner, 8 × 10
^{It was 11} dyne / cm ² . In addition, the stress absorption layer was made releasable from the protective film.

For comparison, a transfer sheet (sample 3) for producing a plasma display panel as shown in FIG. 2 was prepared in the same manner as in sample 2 except that an ink composition for forming a stress absorbing layer having the following composition was used. ) Formed. In this transfer sheet for producing a plasma display panel, the complex elastic modulus of the stress absorption layer was measured under the same conditions as described above, and was 2 × 10 ⁸ dyne / cm ² . Further, the stress absorbing layer was made to be peelable between the protective film and the protective film.

Ink composition for forming stress absorbing layer : n-butyl methacrylate / 2-hydroxyethyl methacrylate copolymer: 50 parts by weight N-methyl-2-pyrrolidone: 50 parts by weight Further, for comparison, stress absorbing layer A transfer sheet (sample 4) for producing a plasma display panel was formed in the same manner as in sample 2, except that no sample was formed.

Next, the above-mentioned transfer sheets (samples 1 to 4) for producing each plasma display panel were slit to a predetermined width, wound around an ABS resin core, and stored in a roll state at 25 ° C. for 7 days. did. Thereafter, the protective film was peeled off (the stress absorbing layer was peeled off together with the protective film in Sample 1), the state of the transfer layer was observed, and the results are shown in Table 1 below.

With respect to the transfer tape after storage, the protective film was peeled off and pressed on a glass substrate heated to 50 ° C. with a hot roll at 50 ° C. using an auto cut laminator. Next, after cooling to room temperature, the base film was peeled off and the transfer layer was transferred to a glass substrate.

Next, an ultraviolet ray (light source: ultrahigh pressure mercury lamp) was irradiated (700 mJ) through a negative pattern mask (opening line width 70 μm) of the electrodes of the plasma display panel.
/ Cm ² ) to expose the transfer layer. Thereafter, development was performed using a 0.5% aqueous sodium carbonate solution to obtain a predetermined pattern. Next, the glass substrate was fired at 600 ° C. to form an electrode pattern.

The thickness and line width of the thus formed electrode pattern were measured and are shown in Table 1 below.

[0073]

[Table 1] As shown in Table 1, the transfer sheet (samples 1 and 2) for producing a plasma display panel according to the present invention has a good transfer layer state after storage in a roll state, a low storage defect density, and a low transfer defect density. It was confirmed that the fired electrode pattern formed using the tape had extremely few disconnections due to storage defects, and a practical disconnection rate was obtained.

On the other hand, a transfer sheet (sample 3) for producing a plasma display panel provided with a stress absorbing layer having a higher complex elastic modulus than the transfer layer, and a transfer sheet for producing a plasma display panel having no stress absorbing layer. In the transfer sheet (Sample 4), when a stress was applied to the transfer layer during storage in a roll state, the transfer layer was broken, and storage defects of the transfer layer occurred. The fired electrode patterns formed by using these transfer tapes were frequently broken, far exceeding the practically usable breakage rate. In particular, there is no stress absorption layer, and the complex elastic modulus of the transfer layer (2 × 10 ⁷ dyne /
cm ² ) of 40,000 times higher complex modulus (8 × 10
^In Sample 4 in which the transfer layer was directly interposed between the protective film having a thickness of ¹¹ dyne / cm ² ) and the base film, the occurrence rate of storage defects was extremely high. Example 2 First, an ink composition for forming a dielectric having the following composition was prepared.

Composition of ink composition : Glass frit: 70 parts by weight (main component: Bi ₂ O ₃ , ZnO, B ₂ O ₃ (alkali-free) average particle size = 3 μm) TiO ₂ : 7 parts by weight Al ₂ O ₃ : 5 parts by weight (softening point of the above-mentioned inorganic component mixture = 570 ° C., Tg = 485 ° C. thermal expansion coefficient α ₃₀₀ = 80 × 10 ⁻⁷ / ° C.) n-butyl methacrylate / 2-hydroxyethyl methacrylate Polymer (8/2 (molar ratio)) 20 parts by weight (molecular weight = 300,000) Adipic ester-based transferability imparting agent 12 parts by weight (Adeka Kaiser RS107 manufactured by Asahi Denka Kogyo KK) Propylene Glycol monomethyl ether ... 50 parts by weight Next, a polyethylene terephthalate film (T-60 manufactured by Toray Industries, Inc.) is prepared as a base film, and Coating and drying (100 ° C., 2 minutes) the serial ink composition by blade coating method to a thickness 25
A transfer layer having a thickness of μm was formed. When the complex elastic modulus of the formed transfer layer was measured under the same conditions as in Example 1, it was 7 × 10 ⁷ d.
yne / cm ² .

On the other hand, a styrene / butadiene copolymer latex (emulsion) polymer (solid content ratio = 50%, solvent = water) was prepared as an ink composition for forming a stress absorbing layer.

Next, a 25 μm-thick polyethylene terephthalate film (manufactured by Toray Industries, Inc.) as a protective film
Is prepared, and the above ink composition is coated on this protective film by a blade coating method and dried (80 ° C., 2 minutes)
Thus, a stress absorbing layer having a thickness of 3 μm was formed. The complex elastic modulus of the formed stress absorption layer was measured under the same conditions as in Example 1 and was 1 × 10 ⁶ dyne / cm ² .

Next, a protective film was laminated on the transfer layer so that the stress absorbing layer overlapped therewith to form a transfer sheet (sample A) for producing a plasma display panel as shown in FIG. In this transfer sheet for producing a plasma display panel, the stress absorption layer was made to be peelable from the transfer layer.

The same procedure as in the above sample A was carried out as shown in FIG. 2 except that a silicon-treated polyethylene terephthalate film (SP-PET-03-25-C manufactured by Tosello Co., Ltd.) having a thickness of 25 μm was used as the protective film. A transfer sheet (sample B) for producing a plasma display panel as described above was formed. In this transfer sheet for producing a plasma display panel, the complex elastic modulus of the stress absorbing layer is 1 × 10 ⁶ dyne / cm ² as in the case of the sample A. Further, the stress absorbing layer was made to be peelable between the protective film and the protective film.

For comparison, a transfer sheet (sample C) for producing a plasma display panel as shown in FIG. 2 was prepared in the same manner as in sample B except that an ink composition for forming a stress absorbing layer having the following composition was used. ) Formed. In this transfer sheet for producing a plasma display panel, the complex elastic modulus of the stress absorbing layer was measured under the same conditions as in Example 1 and was 2 × 10 ⁸ dyne / cm ² . Further, the stress absorbing layer was made to be peelable between the protective film and the protective film.

Ink composition for forming stress absorbing layer : n-butyl methacrylate / 2-hydroxyethyl methacrylate copolymer: 50 parts by weight N-methyl-2-pyrrolidone: 50 parts by weight Further, as a comparison, stress absorbing layer Was formed in the same manner as in Sample B except that no transfer sheet was formed.

Next, the transfer sheets (samples A to D) for preparing each of the above plasma display panels were slit to a predetermined width, wound around an ABS resin core, and rolled at 25 ° C. for 7 days. saved. Thereafter, the protective film was peeled off (the stress absorbing layer was peeled off together with the protective film in Samples A and C), the state of the transfer layer was observed, and the results are shown in Table 2 below.

Further, with respect to the transfer tape after the above storage, the protective film was peeled off, and a 100 ° C. heat was applied on a glass substrate (one on which an electrode pattern had already been formed) heated to 50 ° C. using an auto-cut laminator. It was crimped with a roll. Next, after cooling to room temperature, the base film was peeled off and the transfer layer was transferred to a glass substrate.

Next, the glass substrate was fired at 570 ° C. to form a dielectric layer.

The thickness and surface condition of the thus formed dielectric layer are shown in Table 2 below.

[0086]

[Table 2] As shown in Table 2, the transfer sheets (samples A and B) for producing a plasma display panel of the present invention had good transfer layer conditions after storage in a roll state, high storage stability, and storage defects. It was confirmed that the density was 0 / m ² (no defect was confirmed in the measurement area) and the density was good.

On the other hand, a transfer sheet (sample C) for preparing a plasma display panel provided with a stress absorbing layer having a higher complex elastic modulus than the transfer layer, and a transfer sheet for preparing a plasma display panel not provided with a stress absorbing layer. In the transfer sheet (Sample D), cracks were observed in the transfer layer after storage in a roll state, and in the dielectric layer formed using these transfer tapes, the portion where the transfer sheet had a storage defect was fired. Later, the electrode was exposed, resulting in a defective product, resulting in a lower non-defective product ratio.

[0088]

As described in detail above, the transfer stress such as a winding stress acting over time in a state where the transfer sheet is wound in a roll shape and a stress received from a roller or the like when the transfer sheet is conveyed in the apparatus. When a force is applied to the sheet from the outside, there occurs a problem that stress is concentrated on a transfer layer having a much smaller complex elastic modulus than a base film or a protective film as a material and cracks are generated, but in the present invention, The stress applied to the transfer sheet is absorbed by the stress absorbing layer having a smaller complex elastic modulus than the transfer layer, so that the transfer layer is prevented from cracking, has high storage stability, and is covered in a good condition. It can be transferred to a transcript. In addition, when the organic component has photosensitivity, it is possible to significantly suppress disconnection due to storage defects in the firing pattern,
The yield of non-defective products such as dielectrics is greatly improved, and it is possible to contribute to the improvement of the yield of high-precision thick film patterns such as barriers.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing one embodiment of a transfer sheet for producing a plasma display panel of the present invention.

FIG. 2 is a schematic sectional view showing another embodiment of the transfer sheet for producing a plasma display panel of the present invention.

FIG. 3 is a schematic configuration diagram illustrating an example of a plasma display panel.

FIG. 4 is a process diagram illustrating an example of forming an electrode pattern using a transfer sheet for producing a plasma display panel according to the present invention.

[Explanation of symbols]

Reference Signs List 1,11: Transfer sheet for producing a plasma display panel 2,12: Base film 3,13 ... Transfer layer 4,14 ... Stress absorbing layer 15 ... Protective film M: Photomask

Claims (5)

[Claims] 1. A base film, comprising: a transfer layer releasably provided on the base film; and a stress absorbing layer provided on the transfer layer, wherein the transfer layer is an inorganic component containing glass frit; A transfer sheet for producing a plasma display panel, comprising at least an organic component which can be removed by baking, wherein the complex elastic modulus of the stress absorbing layer is smaller than the complex elastic modulus of the transfer layer. 2. A base film, a transfer layer releasably provided on the base film, a stress absorbing layer releasably provided on the transfer layer, and a protective film provided on the stress absorbing layer. Wherein the transfer layer contains at least an inorganic component containing glass frit and an organic component that can be removed by firing, and the complex elastic modulus of the stress absorption layer is smaller than the complex elastic modulus of the transfer layer. Transfer sheet for plasma display panel production. 3. A base film, a transfer layer releasably provided on the base film, a stress absorbing layer provided on the transfer layer, and a protective film releasably provided on the stress absorbing layer. Wherein the transfer layer contains at least an inorganic component containing glass frit and an organic component that can be removed by firing, and the complex elastic modulus of the stress absorption layer is smaller than the complex elastic modulus of the transfer layer. Transfer sheet for plasma display panel production. 4. The transfer sheet according to claim 1, wherein the organic component has photosensitivity. 5. The transfer sheet according to claim 1, wherein the transfer layer contains a conductive powder as an inorganic component.