JPH1116491A - Forming method for thick-film pattern for use in plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thick-film pattern forming method wherein a barrier rib layer, an electrode, and a dielectric layer can be formed with defects lessened and flatly, in the case of manufacture of a plasma display panel. SOLUTION: A thick-film pattern forming material 20, containing an inorganic constituent having at least glass frit and a binder resin, is applied to or printed on a substrate 11, over the whole surface or in a pattern-like manner, and thereafter flattening is conducted, whereby a less defective and flat thick-film pattern can be formed. The flattening can be conducted by pressing a barrier rib layer, an electrode, and a dielectric layer, with or without an exfoliative film 23 interposed therebetween, by using a press roll 21 or a surface table 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a thick film pattern for a plasma display panel, and more particularly to a method for forming a thick film pattern such as a barrier, an electrode and a dielectric layer in the production of a plasma display panel (PDP). It is. According to the thick film pattern forming method of the present invention, a barrier, an electrode, a dielectric layer, and the like for forming a discharge space can be easily formed flat.

[0002]

2. Description of the Related Art Conventionally, barriers, electrodes, dielectric layers, and the like of PDPs are patterned by screen printing or the like, or barrier materials or the like are applied to the entire surface of a substrate, and a resist film is formed and etched by sandblasting or the like. However, in the case of screen printing, meshes of the screen remain on the surface of a barrier or the like, which causes problems such as chipping of the barrier and uneven discharge of electrodes.

In general, a PDP has a structure in which a pair of electrodes arranged regularly on two opposing glass substrates are provided, and a gas mainly composed of neon, xenon, or the like is sealed between the electrodes. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed.
In particular, in order to display information, regularly arranged cells are selectively discharged to emit light. There are two types of PDPs, a direct current type (DC type) in which electrodes are exposed to the discharge space, and an alternating current type (AC type) in which electrodes are covered with an insulating layer. And a refresh driving method and a memory driving method.

[0004]

FIG. 6 and FIG.
1 shows a general configuration of a C-type PDP. The AC PDP is a surface discharge PDP having a three-electrode structure. FIG.
Is a perspective view thereof, and FIG. 7 is a sectional view taken along a plane parallel to the barrier. These figures show a state in which a glass substrate 12 serving as a front plate and a glass substrate 11 serving as a back plate are separated from each other. As shown in the drawings, the glass substrates 12 and 11 are arranged in parallel and opposed to each other. A barrier 8 erected on the front side of the glass substrate 11 is fixed to the glass substrate 11, and the barrier 8 holds the glass substrate 11 and the glass substrate 12 in a fixed space. On the back side of the glass substrate 12, an electrode 14 made of a transparent conductive film and a display electrode X made up of a bus electrode 15 overlapping the electrode 14 are formed in parallel with each other, and a dielectric layer 16 and an MgO layer 17 covering the display electrode X are formed. Is formed.

On the front side of the glass substrate 11, an address electrode Y and a dielectric layer 3 covering the address electrode are provided so as to be orthogonal to the display electrode X. Further, stripe-shaped barriers 8 are formed parallel to the address electrodes Y, and a phosphor layer 19 of a predetermined emission color is provided so as to cover the wall surfaces of the barriers 8 and the bottom surfaces of the cells. The barrier is disposed between the address electrodes Y so as to divide the discharge space in the line direction for each unit light emitting region.

In this AC type PDP, an electric field is formed by applying a predetermined voltage from an AC power source between composite electrodes on a glass substrate 12 as a front plate, thereby forming a glass substrate 12 and a glass substrate 11 as a back plate. Discharge is performed in each cell as a display element partitioned by the barrier and the barrier 8. Then, the phosphor layer 19 is caused to emit light by the ultraviolet light generated by the discharge, and the light transmitted through the glass substrate 12 is visually recognized by an observer.

Conventionally, regarding a barrier forming technique used in this PDP, printing is repeated once or plural times by a screen printing method so as to correspond to a barrier pattern shape formed using a barrier forming material on a substrate. Then, there is known a method of stacking to a required height and coating and drying. Further, a barrier-forming material is applied to the entire surface of the substrate, and a resist having sandblast resistance is patterned on the application surface in a predetermined shape. Then, portions not protected by the resist are removed by a sandblast method. Is also known (see Japanese Patent Publication No. 4-58438).

Hereinafter, formation of a barrier by a sandblast method will be described with reference to the drawings. FIG. 5 is an example showing a manufacturing process of a plasma display panel by a sandblast method. First, an underlayer 1 of a thin film made of low-melting glass is formed on a glass substrate 11 as necessary.
(A)). The underlayer is preferably formed in order to prevent diffusion of an alkali component or the like caused by the glass substrate or to improve adhesion to the substrate when forming an electrode, a dielectric, and a barrier.

On top of that, a screen printing method, a photolithography method, and an electrode paste material obtained by dispersing metals such as Ag, Ni and Cu and their alloys in a low melting glass frit and a binder resin which can be fired at a low temperature are used. The address electrode 2 is formed by a filling method, a sand blast method or the like, and a dielectric layer 3 made of a low melting point glass is formed by a screen printing method or the like as necessary (FIG. 5B). The dielectric layer is preferably formed for stability at the time of driving or for preventing the electrodes from being exposed, and for preventing the electrodes from being damaged when the barrier is formed by the sandblast method. As the material of the dielectric layer, a low-melting glass mainly containing lead oxide glass or bismuth oxide is preferably used.

Next, a barrier forming layer 4 is formed by applying a plurality of times by screen printing using a barrier forming material, laminating and drying. After the panel thus obtained is kept in an oven to remove the plasticizer, a negative dry film resist 5 having a protective film is laminated on the barrier forming layer with a hot roll (FIG. 5C )). Then, after exposing the dry film resist 5 with an ultraviolet light source 10 through a predetermined photomask 9 (FIG. 5).
(D)), the protective film on the dry film resist is removed, and development with an aqueous solution of sodium carbonate is performed. If the resist is dried, a resist pattern 7 corresponding to the line pattern mask is obtained (FIG. 5E). Using the resist pattern 7 thus formed as a cutting mask, the barrier forming layer 4 is cut by sandblasting (FIG. 5).
(F)).

The resist pattern 7 is sprayed off using an aqueous sodium hydroxide solution, washed with water, and dried. Finally, the PDP panel member is fired in a firing furnace to simultaneously form a dielectric layer, an electrode layer, and a barrier layer.

[0012]

However, even when the barrier is formed by the above-described steps, the surface of the barrier, the address electrode or the dielectric layer before or after firing is formed by screen printing. However, there is a problem that screen meshes inevitably appear on the surface and remain, resulting in chipping of a barrier or uneven discharge of electrodes. Further, even with a blade coating, roll coating, or other various coating methods other than screen printing, it is extremely difficult to completely and completely flatten the surface of a barrier or the like without defects. Therefore, in the present invention, studies have been made on flattening the surface of each coating layer after coating by a simple method, and the present invention has been completed.

[0013]

Means for Solving the Problems According to the first aspect of the present invention, there is provided a method for forming a thick film pattern comprising at least an inorganic component having glass frit and a binder resin on a substrate. Alternatively, there is provided a method of forming a thick film pattern for a plasma display panel, which comprises applying or printing a pattern and then performing a flattening process. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat, defect-free thick film pattern can be formed.

[0014] The present invention for solving the above-mentioned problems.
According to the invention, in the method for forming a thick film pattern for a plasma display panel according to the first aspect, the flattening treatment is performed by pressing a pattern forming material applied or printed in a pattern form with a press roll. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat, defect-free thick film pattern can be easily formed.

[0015] The present invention for solving the above-mentioned problems.
According to the invention, in the method of forming a thick film pattern for a plasma display panel according to the first aspect, the flattening treatment is performed by pressing a pattern forming material applied or printed in a pattern form on a platen. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat, defect-free thick film pattern can be easily formed.

[0016] The present invention for solving the above-mentioned problems is provided by claim 4 of the present invention.
According to a third aspect of the present invention, in the method for forming a thick film pattern for a plasma display panel according to any one of the first to third aspects, the flattening treatment is performed by pressing a pattern forming material applied or printed in a pattern form via a peelable film. It is characterized by the following. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat, defect-free thick film pattern can be easily formed.

According to the present invention, there is provided a method for solving the above-mentioned problems.
The present invention provides a method for forming a thick film pattern for a plasma display panel according to any one of claims 1 to 3, wherein a flattening treatment is performed by laminating a peelable film on a pattern forming material which is applied or printed in a pattern and then pressed. It is characterized by performing by doing. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat, defect-free thick film pattern can be easily formed.

According to the present invention, there is provided a method for solving the above problems.
According to the invention, in the method for forming a thick film pattern for a plasma display panel according to any one of claims 4 to 5, the material for forming the thick film pattern is a photocurable resin, and after a flattening process, via a peelable film. The method is characterized in that the pattern forming material is cured by exposure. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat film pattern having no defect can be easily formed and cured.

According to the present invention, there is provided an image processing apparatus comprising:
According to the invention, in the method of forming a thick film pattern for a plasma display panel according to any one of claims 1 to 6, the thick film pattern forming material is a barrier forming material, an electrode forming material, or a dielectric layer forming material. And
Since the thick film pattern for a plasma display panel is formed by such a forming method, the barrier layer, the electrode, and the dielectric layer can be formed into a flat, defect-free thick film pattern.

According to the present invention, there is provided an image forming apparatus comprising:
According to the invention, in the method for forming a thick film pattern for a plasma display panel according to any one of claims 1 to 7, the substrate is a temporary support of a thick film pattern forming material, and the thick film pattern formed on the temporary support is provided. Is transferred to a glass substrate. Since the thick film pattern for a plasma display panel is formed by such a forming method, a flat and defect-free thick film pattern of a barrier layer, an electrode, and a dielectric layer can be formed by a transfer method.

[0021]

FIG. 1 is a view for explaining a first embodiment of a method for forming a thick film pattern for a plasma display panel according to the present invention. FIG. 1A shows a case using a press roll, and FIG. 1B shows a case using a surface plate. In the case of this embodiment, as shown in FIG. 1A, a pattern forming material 20 is applied or printed on the entire surface or in a pattern on a substrate 11 such as glass to form a thick film pattern. The substrate 11 may be accurately maintained at a constant height and rotated with a uniform force, or as shown in FIG. The method of uniformly pressing the platen 22 having the same makes it possible to flatten the pattern surface and make the pattern uniform. FIG.
In the case of (A), the substrate 11 may be on a support (not shown) and move the support in parallel. First
In the case of the embodiment, since a peelable film is not used,
The surfaces of the press roll 21 and the surface plate 22 need to be selected from materials having no tackiness or adhesion to the pattern forming material. Specific preferred materials include polytetrafluoroethylene (Teflon), poly3
Use a fluoroethylene-based material, or polydimethyl silicone rubber, phenyl-modified silicone rubber, epoxy-modified silicone rubber, urethane-modified silicone rubber, etc., or make a uniform surface with a roll or board coated with these materials. It is preferable to use it.

FIG. 2 is a view for explaining a second embodiment of the method for forming a thick film pattern for a plasma display panel according to the present invention. In the case of this embodiment, as shown in FIG. 2, after forming or printing a pattern forming material 20 on the entire surface or in a pattern of the substrate 11 to form a thick film pattern, the press roll 21 is placed on the substrate 11 at a constant height. By rotating with a uniform force through the peelable film 23 in a state where the pattern is accurately maintained, the pattern surface can be flattened and the pattern can have a uniform height. In the case of this embodiment, the peelable film 23 only comes into contact with the pattern forming material as the press roll moves, and is not laminated on the pattern forming material.

In this case, the peelable film is made of a material that is not tacky or adhesive to the pattern forming material,
Generally, it is necessary to select and use a material having a small surface tension. Specifically preferred materials include polyethylene, polypropylene, polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride,
A film that is releasable with respect to a pattern forming material such as polytetrafluoroethylene, polytrifluoroethylene, silicone rubber, or silicone polymer is preferable. Further, the releasable film may be a resin film having a small thermal expansion / contraction rate which is subjected to a release treatment. As the release treatment, a film obtained by forming a polytetrafluoroethylene, polytrifluoroethylene, dimethyl silicone, phenyl-modified silicone, epoxy-modified silicone, or the like on a film into a thin film of 1 μm to 10 μm can be used.

The releasable film preferably has a thickness that does not cause wrinkles, specifically, a thickness of about 10 μm to 500 μm, preferably about 20 μm to 200 μm.
Further, within one screen of the PDP, it is preferable that the thickness unevenness of the film is in a range of ± 10% and there is no thickness unevenness. The releasable film can be used repeatedly as long as there is no fouling, but it is preferable to use a different film each time a pattern is formed.

FIG. 3 is a view for explaining a third embodiment of the method for forming a thick film pattern for a plasma display panel according to the present invention. In the case of this embodiment, first, as shown in FIG. 3, a pattern forming material 20 is applied or printed on the entire surface or in a pattern on the substrate 11 to form a thick film pattern. Thereafter, a peelable film having good flatness is laid on the pattern forming material at the same time as the rotation of the press roll, and laminated. The first rotation of the press roll laminates the release film to the patterning material, after which the press roll can be rotated repeatedly if necessary. Lamination is temporary,
It is premised that the film is separated after the flattening process. The press roll 21 is formed on the substrate 11 in the same manner as in the first and second embodiments.
It is necessary to maintain a precisely constant height and rotate with a uniform force. Then, after performing a photocuring treatment as needed, the peelable film is peeled off, so that the pattern surface can be flattened and the pattern can have a uniform height.
In this case, the same material as that of the second embodiment can be used as the material of the peelable film 23.

FIG. 4 is a view for explaining a fourth embodiment of the method for forming a thick film pattern for a plasma display panel according to the present invention. FIG. 4A shows the case using the press roll 21, and FIG. 4B shows the case using the surface plate 22. In the case of this embodiment, first, as shown in FIG.
A thick film pattern is formed by applying or printing the pattern forming material 20 on the entire surface or in a pattern. Then, after placing the peelable film 23 having good flatness on the pattern made of the pattern forming material, the press roll is rotated on the peelable film with a uniform force as shown in FIG. By the method of pressing uniformly on the platen 22 as shown in B), the surface of the pattern forming material is flattened and the film is laminated on the pattern forming material at the same time. The laminate is temporary and presupposes that it is peeled off after the flattening process. Press roll 21 is the first
As in the case of the first embodiment, it is necessary to rotate the substrate 11 while maintaining it accurately at a constant height. Then, after performing a photocuring treatment as needed, the peelable film is peeled off, so that the pattern surface can be flattened and the pattern can have a uniform height. In this case, the same material as that of the second embodiment can be used as the material of the peelable film 23.

In any of the above embodiments, the flattening process can be performed while heating the pattern forming material. For the heating, a heated press roll may be used, but the entire support table supporting the substrate 11 may be heated. By heating the pattern forming material, there is an effect that it can be made flatter. However, the heating needs to be at a temperature that does not affect the flatness or workability of the peelable film.
About 150 ° C. When a photosensitive material is used as the pattern forming material, it is preferable to perform exposure in a state where a peelable film is laminated on the pattern surface. Exposure in such a state can promote curing by light.

When a press roll is used in the above-mentioned flattening treatment, the flatness of the surface formed by the lowermost surface of the roll that rotates and moves is required. In addition, when a peelable film is used, a combined effect appears due to unevenness in the film thickness, so that a higher precision is required for the press roll. For this reason, the straightness of the press roll shaft core, the correct circular shape of the roll rubber surface without eccentricity, and the parallelism of the surface on which the roll shaft folds are required.
Even when the flattening process is performed on the surface plate, the flatness of the lower surface of the surface plate with respect to the pattern substrate is similarly required.

In the above-mentioned planarization treatment, the substrate can be used as a temporary support for the thick film pattern forming material in any of the embodiments. The thick film pattern can be formed in a state in which the temporary support is placed on a support having a good flatness or a glass plate, and the temporary support on which the thick film pattern is formed can be formed on the support or glass. A flattening process can also be performed by mounting on a plate. The thick film pattern formed on the temporary support is intended to be transferred onto a substrate such as glass as a final product, and is peeled off after being transferred onto the final product substrate. Such a flattening process, when transferring the thick film pattern from the temporary support to the glass substrate, after integrally laminating so that the thick film pattern forming material side is in contact with the glass substrate, as described above from the temporary support surface side It is also possible to perform a flattening process.

The temporary support is required not to be affected by the solvent in the coating liquid for forming a dielectric layer, and not to be stretched by heat treatment in the drying and transferring steps of the solvent. 4-polycyclohexylene dimethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polystyrene, polypropylene, polysulfone, aramid, polycarbonate, polyvinyl alcohol, cellophane, cellulose derivatives such as cellulose acetate, polyethylene, polyvinyl chloride, nylon, polyimide, ionomer, etc. Each film, each sheet, and a metal foil such as aluminum and copper are exemplified, and the film thickness is 4 μm to 400 μm, preferably 4.5 μm.
m to 200 μm can be used.

A thick film pattern may be formed directly on these temporary supports, or a thick film pattern may be formed after a release process in which a thin film made of a releasable resin material is formed on silicon or another support. You can also. The release treatment can be formed using polydimethyl silicone, phenyl-modified silicone, epoxy-modified silicone, urethane-modified silicone, or the like, and a release material such as a nitrified cotton-based resin is used for polyethylene terefucolate. Can be selected and used. The thickness of the release treatment is 1 to 10 μm
Is appropriate.

(Embodiment Regarding Material of Pattern Forming Material) The dielectric layer forming material and the barrier forming material include at least an inorganic component having a glass frit and a thermoplastic resin. As glass frit, its softening point is 350 ° C
At ~ 650 ° C, the coefficient of thermal expansion α ₃₀₀ is 60 × 10 ^-7 / °
C-100 × 10 ^-7 / ° C. If the softening point of the glass frit exceeds 650 ° C., it is necessary to raise the firing temperature, and it is not preferable because the laminating object is thermally deformed. If the softening point is lower than 350 ° C., the thermoplastic resin is decomposed and volatilized. Before this, the glass frit is fused, and voids and the like are generated in the layer, which is not preferable.
The thermal expansion coefficient is 60 × 10 ⁻⁷ / ° C. to 100 × 10
^If the temperature is outside the range of ^-7 / ° C, the difference from the coefficient of thermal expansion of the glass substrate is large, and distortion or the like is generated, which is not preferable.

As the inorganic component, two or more kinds of inorganic powders and inorganic pigments may be mixed and used in addition to the glass frit.

The inorganic powder is to be used as an aggregate, and may be added as needed. The inorganic powder is intended to prevent casting during firing and to improve the compactness, and has a softening point higher than that of the glass frit, such as aluminum oxide, boron oxide, silica, titanium oxide, magnesium oxide, and oxide. Inorganic powders such as calcium, strontium oxide, barium oxide, and calcium carbonate can be used, and examples thereof include those having an average particle size of 0.1 μm to 20 μm. The usage ratio of the inorganic powder is preferably 0 to 30 parts by weight of the inorganic powder with respect to 100 parts by weight of the glass frit.

Inorganic pigments are added as needed to reduce external light reflection and improve practical contrast, and when darkened, they are used as fire-resistant black pigments. , Co-Cr-Fe, Co-Mn-
Fe, Co-Fe-Mn-Al, Co-Ni-Cr-F
e, Co-Ni-Mn-Cr-Fe, Co-Ni-Al
—Cr—Fe, Co—Mn—Al—Cr—Fe─Si and the like. Examples of the fire-resistant white pigment include titanium oxide, aluminum oxide, silica, and calcium carbonate.

The resin component removed by firing in the dielectric layer forming material and the barrier forming material is a thermoplastic resin, which is contained as a binder of an inorganic component and for the purpose of improving transferability. Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, n-
Butyl methacrylate, n-butyl acrylate, isobutyl acrylate, isobutyl methacrylate, te
rt-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, 2-ethylhexyl acrylate, 2
-Ethylhexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, n-decyl acrylate, n-decyl methacrylate, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, styrene, α-methylstyrene, N-vinyl And polymers or copolymers of one or more kinds such as -2-pyrrolidone, cellulose derivatives such as ethyl cellulose, and the like.

Particularly, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, n-butyl acrylate, n-butyl acrylate Butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate,
Preferred is a polymer or copolymer of at least one of tert-butyl methacrylate, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate and the like, and ethyl cellulose.

The proportion of the inorganic component to the resin component is 3 to 50 parts by weight, preferably 5 to 30 parts by weight, based on 100 parts by weight of the inorganic component.
When the resin component is less than 3 parts by weight in the dielectric layer forming layer, the holding property of the dielectric layer forming layer is low, and in particular, there is a problem in storage stability and handleability in a wound state, and the transfer sheet In the case of cutting (slitting) into an appropriate shape, the inorganic component becomes dust, which causes a problem that it hinders the production of PDP. On the other hand, if the amount exceeds 50 parts by weight, carbon remains in the film after sintering, and the quality is undesirably deteriorated.

Further, a plasticizer, a dispersant, an antisettling agent, an antifoaming agent, a release agent, a leveling agent and the like are added to the dielectric layer forming material and the barrier forming material as required.

The plasticizer is added for the purpose of improving the transferability and the fluidity of the ink. For example, normal alkyl phthalates such as dimethyl phthalate, dibutyl phthalate and di-n-octyl phthalate, and di-2-ethylhexyl phthalate Phthalic acid esters such as diisodecyl phthalate, butyl benzyl phthalate, diisononyl phthalate, ethyl phthalethyl glycolate and butyl phthalyl butyl glycolate, tri-2-ethylhexyl trimellitate, tri-n-alkyl trimellitate, triiso Trimellitic esters such as nonyl trimellitate and triisodecyl trimellitate, dimethyl adipate, dibutyl adipate, di-2-ethylhexyl adipate, diisodecyl adipate, dibutyl diglycol adipate , Di-2-ethylhexyl acetate, dimethyl sebacate, dibutyl sebacate, di-2-ethylhexyl sebacate, di-2-ethylhexyl malate, acetyl-tri- (2-ethylhexyl) citrate, acetyl-tri- aliphatic dibasic acid esters such as n-butyl citrate and acetyl tributyl citrate, glycol derivatives such as polyethylene glycol benzoate, triethylene glycol di- (2-ethylhexoate) and polyglycol ether;
Glycerol derivatives such as glycerol triacetate and glycerol diacetyl monolaurate; polyesters composed of sebacic acid, adipic acid, azelaic acid, phthalic acid, etc .; low molecular weight polyethers having a molecular weight of 300 to 3,000; low molecular weight poly-α-styrene The same low molecular weight polystyrene, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl Phosphate,
Orthophosphates such as 2-ethylhexyldiphenyl phosphate, ricinoleates such as methylacetyl ricinoleate, poly-1,3-butanediol adipate, polyester epoxidized esters such as epoxidized soybean oil, glycerin triacetate, Esters such as 2-ethylhexyl acetate are exemplified.

The dispersant and the anti-settling agent are intended to improve the dispersibility of the inorganic component and the anti-settling property, and examples thereof include a phosphate ester type, a silicone type, a castor oil ester type and various surfactants. Examples of the antifoaming agent include silicones, acrylics, various surfactants, and the like.Examples of the release agent include silicones, fluorine oils, paraffins, fatty acids, fatty acid esters, castor oils, and the like. Examples of the wax type and the compound type, and examples of the leveling agent include a fluorine type, a silicone type, various surfactants and the like, each of which is added in an appropriate amount.

The above dielectric layer forming material and barrier forming material include anones such as methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, toluene, xylene, cyclohexanone, methylene chloride, 3-methoxybutyl acetate, ethylene glycol monoalkyl ether. , Ethylene glycol alkyl ether acetates, diethylene glycol monoalkyl ethers, diethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, dipropylene glycol monoalkyl Dissolved in ether acetates, terpenes such as α- or β-terpioneol, or It is dispersed, applied on a base film by screen printing, die coating, blade coating, comma coating, roll coating, gravure reverse coating, gravure direct method, slit reverse method, or the like, and dried to a predetermined film thickness.

The electrode forming layer forming paste suitable for the electrode forming layer forming method comprises at least an inorganic component composed of glass frit, a thermoplastic resin, a conductive powder, and if necessary, a thickener.

As the inorganic component, the glass frit, the inorganic powder and the inorganic pigment described as the inorganic component in the dielectric layer forming material and the barrier forming material described above can be used. 3 μm to 10
μm, preferably 0.5 μm to 5 μm, and the inorganic powder is preferably 0 to 10 parts by weight based on 100 parts by weight of the glass frit.

The resin component is contained as a binder for the inorganic component and for the purpose of improving transferability. Like the thermoplastic resin in the dielectric layer forming material and the barrier forming material, the resin component is used for firing. It does not leave carbides in the pattern by volatilization / decomposition, and the materials described above for the dielectric layer forming material and the barrier forming material can be used. Particularly, cellulose resins such as ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose butyrate, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, isopropyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl acrylate, Polyacrylic acid esters or polymethacrylic acid esters, which are polymers or copolymers of hydroxyethyl acrylate or methacrylates thereof, poly-α-styrene, polyvinyl alcohol, and polybutene resins are preferable, and polybutene resins are particularly preferable.

The content of the resin component in the electrode forming layer forming paste is 3 to 50% by weight, preferably 5 to 30% by weight.

Examples of the conductive powder include metal powders such as gold, silver, copper, nickel, and aluminum. Spherical metal powder having an average particle diameter of 0.1 μm to 5 μm is preferable. The ratio of the conductive powder and the glass frit used is as follows.
The glass frit is 2 to 20 parts by weight with respect to 0 parts by weight.

The thickener is added as needed for the purpose of increasing the viscosity of the paste for forming the electrode forming layer and suppressing the penetration into the lower layer, and known ones can be used. For example, hydroxyethyl cellulose, methyl cellulose, carboxymethyl cellulose,
Sodium alginate, casein, sodium caseinate, xanthan gum, polyvinyl alcohol, modified polyether urethane, polyacrylate, polymethacrylate, montmoronite, aluminum stearate, zinc stearate, aluminum octylate, castor oil with water, Castor oil ester, fatty acid amide, polyethylene oxide, dextrin fatty acid ester, dibenzylidene sorbitol, vegetable oil-based polymerized oil, surface-treated calcium carbonate, organic bentonite, silica, titania, zirconia, fine powders of alumina and the like. The content of the thickener is 0.1 parts by weight with respect to 100 parts by weight of the conductive powder.
Parts by weight to 20 parts by weight, preferably 0.1 part by weight to 10 parts by weight
When the amount is less than 0.1 part by weight, there is no thickening effect, and when the amount is more than 20 parts by weight, an adverse effect such as disconnection is caused on the characteristics of the electrode.

The electrode forming layer forming paste may be added with a plasticizer, a dispersant, an antisettling agent, an antifoaming agent, a release agent, and a leveling agent in order to improve the applicability and the like. In any case, those described above for the dielectric layer forming material and the barrier forming material are similarly mixed with a solvent and kneaded by a roll mill to form a paste-like coating liquid, or kneaded by a ball mill or the like to form a slurry. It is a coating liquid. The electrode forming layer forming paste has a dynamic viscosity of 500 to 7000 poise and a loss tangent tan.
δ is in the range of 5 to 12. When the dynamic viscosity exceeds 7000 poise, transfer from an intaglio becomes difficult, which is not preferable. When the loss tangent tan δ exceeds 12, the pattern formed by transfer is undesirably sagged. The dynamic viscosity and the loss tangent tan δ are measured by a Calimed CS rheometer at a temperature of 23 ° C, a frequency of 10 Hz, and a strain of 3%.

The curable resin is one that is decomposed and removed after firing after curing, and a known ionizing radiation curable resin or a thermosetting resin can be used.
As the ionizing radiation curable resin, an ultraviolet ray or electron beam curable resin can be used, and a prepolymer, oligomer and / or a polymer having a polymerizable unsaturated bond or an epoxy group in a molecule can be used.
Alternatively, a composition in which monomers are appropriately mixed can be used. Examples of the prepolymer and oligomer include unsaturated polyesters such as a condensate of an unsaturated dicarboxylic acid and a polyhydric alcohol, epoxy resins, methacrylates such as polyester methacrylate, polyether methacrylate, and polyol methacrylate, polyester acrylate, and polyether acrylate. And acrylates such as polyol acrylate.

Examples of the monomer include a compound having at least one polymerizable carbon-carbon unsaturated bond. For example, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate,
Dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, 2-
Hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isobonyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate, diethylene glycol Diacrylate, 1,4-butanediol diacrylate,
1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol diacrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate, glycerol diacrylate, Tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyl trimethylolpropane triacrylate , Propylene oxide-modified trimethylolpropane triacrylate, butylene glycol dia Relate, 1,2,4-butanetriol triacrylate, 2,2,4-trimethyl -
1,3-pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, dipentaerythritol hexaacrylate, and those obtained by changing the acrylate to a methacrylate, γ-methacryloxypropyltrimethoxysilane,
One kind or a mixture of two or more kinds such as 1-vinyl-2-pyrrolidone is exemplified.

In particular, in the case of an ultraviolet curing type, benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, and 4,4-bis (diethylamino) are used as photoinitiators in the composition. Benzophenone, α-aminoacetophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,2-
Diethoxyacetophenone, 2,2-dimethoxy-2-
Phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketal, benzylmethoxyethylacetal , Benzoin methyl ether, benzoin butyl ether,
2,2-dimethoxy-1,2-diphenylethane-1-
On, 2-benzyl-2-dimethylamino-1- (4-
Morpholinophenyl) -butanone-1,2,4-diethylthioxanthone, isoamyl p-dimethylaminobenzoate, ethyl p-dimethylaminobenzoate, anthraquinone, 2-tert-butylanthraquinone, 2-amylanthraquinone, β- Chloroanthraquinone, anthrone, benzanthrone, dibensuberone, methyleneanthrone, 4-azidobenzylacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexane, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, -Phenyl-1,2-butadione-2- (o-methoxycarbonyl) oxime, 1-phenyl-propanedione-2-
(O-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2 -Methyl- [4- (methylthio) phenyl]
-2-morpholino-1-propane, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, n-
Light such as phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzothiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenylsulfone, benzoyl peroxide, eosin, and methylene blue Examples include a combination of a reducing dye and a reducing agent such as ascorbic acid or triethanolamine, and one or more of these photoinitiators may be used in combination.
The content of the curable resin in the paste for forming the electrode forming layer is 5%.
It is about 95% by weight, preferably 10% to 50% by weight.

[0053]

【Example】

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. <Formation of Dielectric Layer> After mixing and dispersing a dielectric layer forming material of the following [composition] using three rolls, after forming an address electrode 2 on a glass substrate 11 with an underlayer 1 interposed therebetween. A dielectric layer 3 having a thickness of 20 ± 2 μm was formed by screen printing, and dried at 100 ° C. (FIG. 5B). [Composition] Glass frit [Main component: Bi ₂ O ₃ , ZnO ₂ , B ₂ O ₃ (alkali-free) Average particle size 3 μm] 70 parts by weight ・ TiO ₂ 3 parts by weight ・ Al ₂ O ₃ 7 parts by weight (above Softening point 570 ° C, Tg 485 ° C, coefficient of thermal expansion α ₃₀₀ = 80 × 10 ^-7 / ° C) of ethyl cellulose 7 parts by weight terpineol 15 parts by weight butyl cellosolve acetate 15 parts by weight

Then, a PET film (“T-60” manufactured by Toray Industries, Inc.), thickness: 50 μm (accuracy of in-plane thickness;
(± 2 μm) is spread on the surface on which the dielectric layer 3 is formed, and then the press roll 21 is rotated on the PET film along the stripe direction of the electrode pattern to perform the flattening process of the dielectric layer. (FIG. 4A). Hard rubber having a rubber hardness of 70 degrees was used for the press roll, and the roll surface diameter was 100 mm.

<Formation of Barrier Forming Layer> After the barrier forming layer of the following [composition] is mixed and dispersed using three rolls,
The barrier forming layer 4 was applied on the substrate on which the electrode 2 and the dielectric layer 3 were formed by die coating, and dried at 170 ° C. [Composition] Glass frit [MB-008, manufactured by Matsunami Glass Industry Co., Ltd.] 65 parts by weight • α-alumina RA-40 (Iwatani Chemical Industry) 10 parts by weight 10 parts by weight ・ Ethyl cellulose 2 parts by weight ・ Terpionaire 15 parts by weight ・ Butyl cellosolve acetate 15 parts by weight

Then, a silicon-treated PET film (“SP-PET-03-50- manufactured by Tosello Co., Ltd.)
C "), thickness; 50 μm (accuracy of in-plane thickness; ± 2 μm)
m) is spread and placed on the barrier forming layer,
The press roll was rotated on the T film along the stripe direction of the electrode pattern to perform a flattening process of the barrier forming layer. In addition, a hard rubber having a rubber hardness of 90 degrees was used for the press roll, and the roll surface diameter was 100 mm.
The thickness of the barrier formation layer after the planarization treatment is 170 μm ± 3 μm.
m.

The PDP panel member thus obtained is peeled from the silicon-treated PET film, and then a negative dry film resist having a protective film on the barrier forming layer (“NPC22” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).
5 ") Thickness: 25 μm was laminated with a hot roll at 120 ° C. (FIG. 5C).

Next, a line pattern mask having a line width of 80 μm and a pitch of 220 μm is positioned and arranged on the dry film resist 5 having a protective film, and irradiated with ultraviolet rays (364 nm, intensity 200 μW / cm ² , irradiation amount 120).
mJ / cm ² ) (FIG. 5D), the protective film on the photoresist layer was peeled off, and spray development was performed using a 1% by weight aqueous solution of sodium carbonate at a liquid temperature of 30 ° C. A resist pattern corresponding to the line pattern mask was obtained (FIG. 5).
(E)).

Next, using the resist pattern as a mask, a sandblasting device was used to sandblast the barrier forming layer at the opening of the resist pattern. After the sandblasting, the dielectric layer forming layer was observed. The dielectric layer forming layer was hardly scraped by sandblasting, had no electrode exposure, and had a film thickness (FIG. 5).
(F)).

Next, the resist pattern was heated at a liquid temperature of 30 ° C.
Was sprayed off, washed with water, and dried in an oven at 80 ° C. for 15 minutes. Finally, the PDP panel member was heated to a peak temperature of 570.
The resultant was baked at ° C. to simultaneously form a dielectric layer and a barrier layer.

(Comparative Example) A dielectric layer forming material having the same [composition] as that of the embodiment was used, and a glass substrate having the same undercoat treatment was applied to a glass substrate having a thickness of 20 ± 2 μm under the same conditions as the embodiment. A dielectric layer was formed. However, a flattening process using a PET film was not performed. Then, using the same [composition] barrier forming layer as in the example, on the substrate on which the electrode was formed,
Under the same conditions as in the example, a barrier forming layer having a film thickness of 170 μm ± 10 μm was formed by die coating. However, the flattening treatment with the silicone-treated PET film was not performed. Negative dry film resist having a protective film on the barrier forming layer (“NP” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
C225 ") Thickness: 25 µm was laminated with a hot roll at 120 ° C.

Next, a line pattern mask having a line width of 80 μm and a pitch of 220 μm is aligned and arranged on the dry film resist 5 having a protective film, and irradiated with ultraviolet rays (364 nm, intensity 200 μW / cm ² , irradiation amount 120).
After mJ / cm ² ), the protective film on the photoresist layer was peeled off and spray-developed using a 1% by weight aqueous solution of sodium carbonate at a liquid temperature of 30 ° C. A resist pattern corresponding to the line pattern mask was obtained.

Next, using the resist pattern as a mask, a sand blasting device was used to sand blast the barrier forming layer at the opening of the resist pattern. Then, the resist pattern was spray-peeled using a 2% by weight aqueous solution of sodium hydroxide at a liquid temperature of 30 ° C., washed with water, and dried in an oven at 80 ° C. for 15 minutes. Finally, the PDP panel member was fired at a peak temperature of 570 ° C. to simultaneously form a dielectric layer and a barrier layer.

The (Example) and (Comparative Example)
The thickness of both dielectric layers and the line width and height of the barrier layer were measured. Further, the number of defects in the barrier layer was measured. The film thickness of the dielectric layer of the embodiment is 14 μm ± 1 μm, and the barrier layer has a line width of 5 μm.
The height was 0 μm ± 5 μm and the height was 120 μm ± 2 μm. The height of the barrier layers was uniform, the surface was excellent in smoothness, and no defects were observed in any of the barrier layers. The thickness of the dielectric layer of Comparative Example was 14 μm ± 3 μm, and the barrier layer had a line width of 5 μm.
0 μm ± 5 μm, height is 120 μm ± 8 μm,
Compared to the example, the comparative example has a large variation in the thickness of the dielectric layer and the height of the barrier layer, and
The number of barrier layer defects was also high. In order to measure the height of the barrier or the like, a stylus type surface roughness meter (Veeco Instrument)
mentes Inc. , Sloan Technology
gy Division "DEKTAK") was used.

[0065]

According to the method for forming a thick film pattern of a plasma display panel according to the present invention, the thick film pattern forming layer can be easily flattened, so that the surface is flattened and a barrier having a uniform height is obtained. Electrodes and dielectric layers can be easily obtained. In addition, defects such as chipping of a barrier, which are inevitably generated in the case of screen printing or the like, are reduced, so that it is possible to eliminate uneven discharge of the electrodes based on the defects.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of a method for forming a thick film for a plasma display panel according to the present invention.

FIG. 2 is a view illustrating a second embodiment of a method for forming a thick film for a plasma display panel according to the present invention. FIG. 6 is a view showing another embodiment of the method for forming a thick film according to the present invention.

FIG. 3 is a view showing a third embodiment of the method for forming a thick film for a plasma display panel according to the present invention.

FIG. 4 is a view showing a fourth embodiment of the method for forming a thick film for a plasma display panel according to the present invention.

FIG. 5 is an example showing a manufacturing process of a plasma display panel by a sandblast method.

FIG. 6 is a perspective view showing a general configuration of an AC type PDP.

FIG. 7 is a cross-sectional view showing a general configuration of an AC type PDP.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 base layer 2 address electrode 3, 16 dielectric layer 4 barrier forming layer 5 dry film resist 7 resist pattern 8 barrier 9 photomask 10 ultraviolet light source 11, 12 glass substrate 14 electrode made of transparent conductive film 15 bus electrode 17 MgO layer 19 Phosphor layer 20 Pattern forming material 21 Press roll 22 Surface plate 23 Peelable film X Display electrode Y Address electrode

Claims (8)

[Claims] The present invention is characterized in that a thick film pattern forming material containing at least an inorganic component having a glass frit and a binder resin is applied or printed on the entire surface or in a pattern, and then subjected to a flattening treatment. For forming a thick film pattern for a plasma display panel. 2. The method for forming a thick film pattern for a plasma display panel according to claim 1, wherein the flattening treatment is performed by pressing a pattern forming material applied or printed in a pattern form with a press roll. 3. The method for forming a thick film pattern for a plasma display panel according to claim 1, wherein the flattening treatment is performed by pressing a pattern forming material coated or printed in a pattern form on a platen. 4. The plasma display panel according to claim 1, wherein the flattening process is performed by pressing a pattern forming material applied or printed in a pattern form through a peelable film. A method for forming a thick film pattern. 5. The plasma display according to claim 1, wherein the flattening treatment is performed by laminating a peelable film on a pattern forming material applied or printed in a pattern and then pressing. A method for forming a thick film pattern for a panel. 6. The method according to claim 4, wherein the thick film pattern forming material is a photocurable resin, and after the flattening process, the pattern forming material is cured by exposing through a peelable film. A method for forming a thick film pattern for a plasma display panel according to claim 5. 7. A thick film pattern for a plasma display panel according to claim 1, wherein the thick film pattern forming material is a barrier forming material, an electrode forming material, or a dielectric layer forming material. Method. 8. The method according to claim 1, wherein the substrate is a temporary support of a thick film pattern forming material, and the thick film pattern formed on the temporary support is transferred to a glass substrate.
The method for forming a thick film pattern for a plasma display panel according to any one of claims 1 to 7.