JPH11213874A - Manufacture of barrier for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily manufacture with high accuracy a barrier in a good yield by pressing a female die having a recessed part to the layer of a barrier material formed on a substrate to deform the layer of the barrier material, removing the female die, forming a pattern consisting of the barrier material corresponding to the recessed part of the female die, and baking the pattern. SOLUTION: A barrier material contains an inorganic material, a binder resin, and an organic solvent as essential components. Examples of the inorganic material include glass powder and the like. It desirably has a softening point of 350-1,000 deg.C and a grain size of 0.1-5 μm. As the binder resin, a one having a TG of 0-50 deg.C and a weight average molecular weight of 10,000-180,000 is preferably used, and an acrylic resin is particularly desirable from the point of its satisfactory thermal decomposability in baking. The content of the binder resin is desirably set to 3-30 pts.wt. with respect to 100 pts.wt. of the inorganic material. As the solvent, an aprotic one having a high boiling point T (170-280 deg.C) is preferably used, and desirably added in an amount of 10-100 pts.wt. with respect to 100 pts.wt. of the inorganic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a barrier (rib) for a plasma display panel (hereinafter abbreviated as PDP) used as a display device for character information and video information in a computer terminal, a wall-mounted television, and a ticket vending machine. About.

[0002]

2. Description of the Related Art A PDP has a barrier and a phosphor layer inside two insulating plates (hereinafter abbreviated as a glass plate) having a front plate on which a transparent electrode is formed and a rear plate on which a data electrode and a dielectric layer are formed. Consists of a formed structure. This barrier forms a cell structure that maintains a certain space between the orthogonal transparent electrode group and the data electrode group, and is filled with a rare gas such as Ne or Xe. As a result, a pixel that discharges and emits light from the phosphor is formed, and an image is displayed. FIG. 1 shows a schematic cross-sectional view of an example of an AC type PDP. In FIG. 1, 1 is a substrate, 2 is a transparent electrode, 3 is a data electrode, 4 is a barrier, 5 is a phosphor, 6 is a dielectric layer, and 7 is a protective layer.

The above barrier has a function of preventing erroneous discharge between cells and obtaining a constant discharge section by its height, width and pattern gap.

Conventionally, a thick film printing method has been used as a method for forming the barrier. This method includes printing a paste-like barrier material through a predetermined printing pattern mask using a screen printing machine on an insulating plate on which electrodes are formed, and then performing drying. Here, generally, the height of the barrier is 100 to obtain good discharge and light emission.
Since a thickness of about μm to 200 μm is required, a predetermined barrier height is obtained by repeating the printing and drying steps 5 to 10 times.

However, in recent years, displays have tended to become larger and pixels have become smaller (for example, a screen width of 40 inches or more and a barrier width of 100 μm or less and a height of 100 μm or more). There are problems such as poor printing pattern accuracy due to screen elongation and the like, short life of the screen, difficulty in positioning the printing pattern during the above-mentioned overcoating, and the need for a skilled printing operator. A forming method is being studied.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a barrier for a plasma display, which can easily manufacture a high-precision barrier with a high yield.

[0007]

According to the present invention, a female mold having a concave portion is pressed against a barrier material layer formed on a substrate to deform the barrier material layer, and then the female mold is removed. The present invention relates to a method for manufacturing a barrier for a plasma display, comprising: forming a pattern made of a barrier material corresponding to the female concave portion on a substrate; and firing the pattern.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate used in the present invention is not particularly limited, and may be, for example, a ceramic plate, a plastic plate,
A glass plate or the like is used. An electrode, a dielectric layer, a protective layer, and the like may be formed on this substrate. Gold, silver, copper, chromium, chromium-copper alloy, or the like is used as a material forming the electrode. Examples of the dielectric layer material include lead oxide, silicon oxide, aluminum oxide, calcium oxide, and magnesium oxide. The female mold used in the present invention is
It has a recess corresponding to the shape of the barrier to be created. The material constituting the female mold is not particularly limited, and may be metal, ceramic, plastic, glass, or the like.Preferable is plastic, which is flexible in terms of workability when removing the female mold. . Further, as a high-precision female mold, there is a mold in which a photosensitive material is applied to a sheet-like plastic, dried, irradiated with an actinic ray through a predetermined mask, and an uncured portion is removed by development.

The barrier material in the present invention is a composition comprising an inorganic material, a binder resin and an organic solvent as essential components and, if necessary, additives such as a plasticizer, a dispersant, and an adhesion improver. It is. Examples of the inorganic material used for the barrier material include glass powder, alumina (Al ₂ O ₃ ), titanium oxide, zinc oxide, barium oxide, potassium oxide, sodium oxide, calcium oxide, zirconium oxide, cadmium oxide, copper oxide, and oxide. Metal oxides such as magnesium, manganese oxide and bismuth oxide are used. The glass composition of the above glass powder is PbO.B ₂ O ₃ .SiO
_{2, PbO · B 2 O 3} · ZnO · B 2 O 3 · SiO 2 and the like. The softening point of these inorganic materials is 350 to 1,000.
0 ° C., the particle size is 0.1 to 5 μm,
It is preferable in terms of the strength of the barrier and the like.

As the binder resin used for the barrier material, a known resin can be used without any particular limitation.
Is 0 to 50 ° C and the weight average molecular weight is 10,000 to 18
Preferably it is 000. Weight average molecular weight is 1
If it is less than 000, the strength of the pattern made of the barrier material tends to decrease, while the weight average molecular weight is 1
If it exceeds 80,000, it tends to be hardly soluble in a solvent when adjusting the barrier material, resulting in poor workability. When Tg is less than 0 ° C., the flexibility is too large, and the pattern formed of the barrier material tends to be deformed. On the other hand, when Tg exceeds 50 ° C., the flexibility is reduced and the barrier material is formed. Part of the pattern (especially corners) tends to be missing. The weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve. As the binder resin, an acrylic resin is preferred because of its good thermal decomposability during firing. Further, the binder resin may have a property of being dimerized or polymerized by heat or light and crosslinked.

The content of the binder resin in the barrier material is preferably 3 to 30 parts by weight based on 100 parts by weight of the inorganic material. If the content is less than 3 parts, it does not function as a binder, and the pattern formed of the barrier material tends to be broken. On the other hand, if the amount exceeds 30 parts by weight, the flow of the organic matter in the barrier material is thermally decomposed and eliminated by firing, and the flowability becomes excessive in the melting stage before the thermal decomposition and disappearance, and the shape of the pattern formed of the barrier material tends to be deformed. There is.

Examples of the solvent used for the barrier material include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyl lactone, N-methylpyrrolidone, dimethylformamide, tetramethyl sulfone, and diethylene glycol dimethyl ether. , Diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol, ethyl alcohol, tetralin, n-butylbenzene, P-cymene, methylnaphthalene, cyclohexylbenzene, diethylbenzene, pentylbenzene, dipentylbenzene, P-menthane, bicyclohexyl, dipentene, Decalin, Solvesso, turpentine oil and the like. These are used alone or in combination of two or more. Among these organic solvents, non-polar ones having a high boiling point (170 to 280 ° C.) are preferable because they have good leveling properties of the coating film and do not erode when the female form is made of a resin.

Although the content of the solvent in the barrier material is not particularly limited, it is preferable that the content of the solvent is such that the viscosity of the barrier material is 20 to 200 poise, and this amount is based on 100 parts by weight of the inorganic material. On the other hand, it is about 10 to 100 parts by weight. When the content of the solvent is less than 10 parts by weight, the viscosity of the composition tends to be too large, and the embedding property tends to decrease.
If it exceeds 0 parts by weight, the loss after drying tends to be too large.

It is preferable that the barrier material contains a silane coupling agent from the viewpoint of adhesiveness to the substrate. As the silane coupling agent, for example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, Epoxysilanes such as β- (3,4-epoxycyclohexyl) -ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) -ethyltriethoxysilane and N-β (aminoethyl) γ-aminopropyltri Methoxysilane, N-β (aminoethyl) γ-
Aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N
-Β (aminoethyl) γ-aminopropylmethyldiethoxycin, γ-aminopropyltriethoxysilane, N
Aminophenyl such as -phenyl-γ-aminopropyltrimethoxysilane and chloropropyl such as γ-chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, γ-chloropropylmethyldimethoxysilane, and γ-chloropropylmethyldiethoxysilane Silane.

[0015] The content of the silane coupling agent in the barrier material is preferably 0.1 to 5.0 parts by weight based on 100 parts by weight of the inorganic material. If the amount is less than 0.1 part by weight, the effect of improving the adhesiveness tends to be small, and if it exceeds 5.0 parts, the residue tends to remain during firing.

Hereinafter, an example of manufacturing a barrier for a plasma display according to the present invention will be described with reference to FIGS. FIG. 2A shows a layer 4a of a barrier material formed on the substrate 1, and such a layer can be formed, for example, by applying the barrier material on the substrate and drying it if necessary. As a coating method, a known method can be used, for example,
Dip coating, spin coating, knife coating,
A roll coating method, a spray coating method, a bar coating method, a curtain coating method and the like can be mentioned. FIG. 2B shows a state after the female mold 8 having a concave portion is pressed against the barrier material layer 4a to deform the barrier material layer 4a. A known method can be used as the method for pressure bonding without any particular limitation, and examples thereof include a pressing method and a laminating method. The temperature and the pressure at this time are not particularly limited, and when strongly pressed, the upper surface of the convex portion of the female mold 8 comes into close contact with the substrate 1 and FIG.
Shows this close contact state. FIG. 2 (b)
The female mold 8 of FIG.
(B) shows a cross section taken along a plane perpendicular to the longitudinal direction of the stripe-shaped concave portion, and both ends of the female-shaped strip-shaped concave portion in the longitudinal direction are open.

FIG. 2C shows a state in which the female mold 8 is removed and a pattern 4b made of a barrier material is formed on the substrate 1. FIG. 2D shows a state in which the pattern is baked to form a barrier 4 on the substrate 1. The firing is performed for the purpose of removing organic substances such as a resin binder from the pattern 4b made of the barrier material and improving the strength, gas impermeability, and the like. The firing temperature and time are about 350 to 580 ° C and about 1 to 20 hours. The thickness (height) of the barrier 4 on the substrate 1 thus manufactured is 50 to 250 μm, and the width thereof is 20 μm.
About 150 μm.

FIGS. 3 (a) to 3 (d) show a case where the upper surface of the convex portion of the female die 8 does not come into close contact with the substrate, which is different from the above described with reference to FIG. In this case, the substrate 1 is covered with a barrier material without an exposed surface. In this case, the layer of the barrier material, which is a portion excluding the barrier portion and has a relatively small thickness on the substrate, functions as a dielectric layer after firing, so that the barrier and the dielectric layer are integrated. Can be created at once in one process.

[0019]

The present invention will be described below with reference to examples.

Production Example 1 [Production of Female Die] Methyl methacrylate / ethyl acrylate / methacrylic acid copolymer (weight ratio 53/30/17, weight average molecular weight 1)
000 g) in 41 parts by weight of methyl cellosolve / toluene (weight ratio 8: 2) 137 g (solid content 55 g), 2,2-bis [4- (methacryloxypentaethoxy) phenyl]
34 g of propane, γ-chloro-β-hydroxypropyl-β-methacryloyloxyethyl-o-phthalate 1
1 g, 2,2'-methylenebis (4-ethyl-6-t-
Butylphenol) 0.1 g, tribromomethylphenylsulfone 1.2 g, silicone leveling agent (SH-193, manufactured by Toray Silicon Co., Ltd.) 0.04 g, 1,
0.2 g of 7-bis (9-acridinyl) heptane, 3 g of benzyl methyl ketal, 1.0 g of leuco crystal violet, 0.05 g of malachite green, 7 g of toluene, 13 g of methyl ethyl ketone and 3 g of methanol, and a solution of a photosensitive resin composition I got

The solution of the photosensitive resin composition was uniformly coated on a 50 μm-thick polyethylene terephthalate film (PET) and dried with a hot air convection dryer at 110 ° C. for about 10 minutes to obtain a photosensitive film. The thickness of the photosensitive layer after drying was 75 μm. Next, the two photosensitive layers obtained were laminated together to obtain a photosensitive element in which a 150 μm-thick photosensitive layer was sandwiched between two 50 μm-thick PETs.

A negative mask is placed on one PET of this photosensitive element, and a 3 kW high-pressure mercury lamp (HMW-59) is used.
0, manufactured by Oak Manufacturing Co., Ltd.) at 80 mJ / cm ²
Heated at 80 ° C. for 10 minutes within 5 minutes after exposure. Then
After peeling off the PET on the side opposite to the side on which the negative mask was placed, spray development was performed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. Furthermore, a 1% by weight aqueous citric acid solution (20
C.) for 2 minutes, then washed with water, drained, and
After drying for 5 minutes with a 7kW metal halide lamp (HMW-
680, Ltd. After 2000 mJ / cm ² exposure in oak Seisakusho) and heated 100 minutes at 0.99 ° C., striped resist pattern on PET (line / space = 15
(0 μm / 70 μm, thickness 150 μm) was obtained.

Production Example 2 [Preparation of Barrier Material] The materials shown in Table 1 were put into a Raikai machine and kneaded for 15 minutes to obtain a paste-like barrier material.

[0024]

[Table 1]

Example 1 [(a) Step of Forming Barrier Material Layer on Substrate] The barrier material obtained in Production Example 2 was applied to the entire surface of a 200 mm × 200 mm × 2 mm soda glass substrate using a bar coater. did. Next, after performing degassing under reduced pressure at 5 Torr or less for 3 minutes, the substrate was left at room temperature for 30 minutes to form a barrier material layer on the substrate. The coating thickness was 150 μm.

[(B) Step of deforming the barrier material layer by pressing a female mold having a concave portion] On the soda glass substrate coated with the barrier material composition produced in the above-described step, the production example 1 was carried out. The obtained female mold is arranged so that the layer of the barrier material and the surface of the female strip-shaped void are in contact with each other, and then the linear pressure is 5 × 10 ³ N / so that the laminator roll is perpendicular to the stripe. Then, the soda glass substrate was pressed against the female mold to deform the layer of the barrier material (corresponding to FIG. 2B).

[(C) Step of Removing Female Die] After removing the barrier material that has permeated from the void at the end of the female die, the female die is peeled off from the end of the substrate along the longitudinal direction of the stripe, A soda glass substrate on which a pattern made of a striped barrier material was formed was obtained.

[(D) Firing Step] The soda glass substrate on which the pattern made of the striped barrier material formed in the above-mentioned step (c) is formed is heated at a temperature rising rate from room temperature to 380 ° C. C./min., Hold at 380.degree. C. for 30 minutes, and further increase the temperature up to 550.degree. C. at a rate of 5.degree. C./min.
The soda glass substrate on which the barrier was formed was manufactured by firing by naturally cooling to room temperature. A cross section of the soda glass substrate on which the obtained barrier is formed is observed with an electron microscope (SE).
Observation in (M) confirmed that a striped barrier as shown in FIG. 2D was well formed.

[0029]

According to the method for manufacturing a barrier of a plasma display panel according to the first aspect, the barrier of the plasma display panel can be easily formed while maintaining a highly accurate shape.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of an AC type PDP.

FIG. 2 is a schematic cross-sectional view showing an example of manufacturing a barrier of a plasma display panel according to the present invention.

FIG. 3 is a schematic cross-sectional view showing another example of manufacturing a barrier of the plasma display panel according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Transparent electrode 3 Data electrode 4 Barrier 4a Barrier material layer 4b Barrier material pattern 5 Phosphor 6 Dielectric layer 7 Protective film 8 Female type

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kiyoyoshi Tanno 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside the Hitachi Chemical Co., Ltd. Yamazaki Plant (72) Inventor Tetsuya Sudo 4--13 Higashicho, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Chemical Co., Ltd. Yamazaki Plant (72) Inventor Ikuo Mukai 4-3-1 Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Yamazaki Plant (72) Inventor Tadayoshi Fujieda Hitachi City, Ibaraki Prefecture 4-13-1, Higashicho Hitachi Chemical Co., Ltd. Yamazaki Plant

Claims (1)

[Claims] 1. A female mold having a recess is pressed against a layer of a barrier material formed on a substrate to deform the barrier material layer, and the female mold is removed. A method of manufacturing a barrier for a plasma display, comprising: forming a pattern made of a barrier material on a substrate; and firing the pattern.