JPH11204303A - Resistor and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor, the mounting area of which can be reduced when the resistor is mounted on a mounting substrate. SOLUTION: A resistor is provided with a pair of first upper electrode layers 32, formed from the side sections of the upper surface of a substrate 31 to parts of the side faces of the substrate 31 and a resistance layer 33 connected electrically to the electrode layers 32. The resistor is also provided with second upper electrode layers 35 formed on the upper surfaces of the first upper electrode layers 32 and solder layers 36, which are formed to cover the exposed surfaces of the first and second upper electrode layers 32 and 35.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a method for manufacturing the same.

[0002]

2. Description of the Related Art The prior art is disclosed in Japanese Patent Laid-Open No. 4-102302.
The one disclosed in Japanese Patent Application Laid-Open Publication No. H10-260, 1993 is known.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 8 is a sectional view of a conventional resistor. In the figure, reference numeral 1 denotes an insulating substrate. Reference numeral 2 denotes a first upper electrode layer provided on both left and right ends of the upper surface of the insulating substrate 1. Reference numeral 3 denotes a resistance layer provided so as to partially overlap the first upper electrode layer 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a second electrode provided on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1.
Of the upper electrode layer. 8 is a side electrode layer provided on the side surface of the insulating substrate 1. Reference numerals 9 and 10 denote nickel plating layers and solder plating layers provided on the surfaces of the second upper electrode layer 7 and the side electrode layers 8, respectively. At this time, the solder plating layer 1
0 is provided lower than the second protective layer 6. That is, in the conventional resistor, the second protective layer 6 is provided highest.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

FIG. 9 is a process chart showing a conventional method for manufacturing a resistor. First, as shown in FIG.
The first upper surface electrode layer 2 is formed by coating on both left and right ends of the upper surface of the substrate.

[0009] Next, as shown in FIG. 9 (b), a resistive layer 3 is applied on the upper surface of the insulating substrate 1 so as to partially overlap the first upper electrode layer 2.

[0008] Next, as shown in FIG.
After forming the first protective layer 4 by coating so as to cover only the entire surface of the resistive layer 3, the resistive layer 3 and the first protective layer 4 are protected by a laser or the like so that the total resistance value of the resistance layer 3 falls within a predetermined resistance value range. The layer 4 is provided with a trimming groove 5.

Next, as shown in FIG. 9D, a second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 9E, a second upper electrode layer 7 is formed on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1.

Next, as shown in FIG. 9F, the first and second upper electrode layers 2 and 7 are electrically connected to the first upper electrode layer 2 and the left and right side surfaces of the insulating substrate. The side electrode layer 8 is formed by coating as described above.

Finally, after nickel plating is applied to the surfaces of the second upper electrode layer 7 and the side electrode layer 8, a nickel plating layer 9 and a solder plating layer 10 are formed by applying solder plating. Was manufacturing resistors.

[0013]

However, in the resistor according to the above-described conventional configuration and manufacturing method, when the conventional resistor shown in FIG. As shown in the cross-sectional view of FIG. 10, a fillet mounting structure in which a fillet 23 is formed by soldering both a side electrode layer (not shown) and a lower electrode layer (not shown) is shown in FIG. As shown in the top view for explaining a mounting state in which the conventional resistor is mounted on a mounting board, an area 25 for soldering a side surface is required in addition to a component area 24, and a mounting area 26 obtained by combining these is required. Required. Moreover, to improve the mounting density,
As the external dimensions of the component become smaller, the ratio of the soldering area to the mounting area becomes larger, and there is a problem in that there is a limit in improving the mounting density for downsizing the electronic device.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resistor capable of reducing a soldering area occupying a mounting area when mounted on a mounting board and a method of manufacturing the same. is there.

[0015]

In order to achieve the above object, the present invention provides a substrate, a pair of first upper electrode layers provided on the side and part of the side surface of the upper surface of the substrate, A resistance layer provided to be electrically connected to the upper electrode layer of
At least a second upper electrode layer provided on the upper surface of the first upper electrode layer, a protective layer provided so as to cover at least the upper surface of the resistive layer, and a solder covering at least the exposed upper surface of the second upper electrode layer And a layer.

Further, in order to achieve the above object, the present invention is directed to a method for forming a first or second upper electrode layer that straddles the upper surface of a sheet substrate having a dividing groove and the upper surface of the dividing groove, and in which an electrode paste is poured into the dividing groove. Providing, providing a resistive layer so as to electrically connect the first upper electrode layer, providing a protective layer so as to cover at least the upper surfaces of the upper electrode layer and the resistive layer, and forming the upper electrode layer A step of dividing the sheet substrate into strips by dividing grooves of the sheet substrate, a step of dividing the strip substrate into individual pieces, and a step of forming a solder layer covering at least an upper electrode layer. is there.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a substrate, a pair of first upper electrode layers provided on a side and a part of a side surface of the upper surface of the substrate, and A resistance layer provided so as to be electrically connected to the first upper electrode layer;
At least a second upper electrode layer provided on the upper surface of the first upper electrode layer, a protective layer provided so as to cover at least the resistive layer, and a solder covering at least the exposed upper surface of the second upper electrode layer And layers.

[0018] Further, the invention according to claim 2 includes a substrate,
A pair of first upper electrode layers provided on side portions of an upper surface of the substrate, a resistive layer provided to be electrically connected to the first upper electrode layer, and at least the first upper electrode A second layer provided on the upper surface of the layer and a part of the side surface of the substrate;
, A protective layer provided so as to cover at least the resistance layer, and a solder layer covering at least the exposed upper surface of the second upper electrode layer.

Further, the invention described in claim 3 is the first invention.
The first or second upper electrode layer provided on a part of the side surface of the substrate according to the second aspect, is provided on the resistance layer side in the height direction of the substrate.

The invention described in claim 4 is the third invention.
The area of the first or second upper electrode layer on the side surface of the substrate described in (1) is not more than half the area of the side surface of the substrate.

The invention described in claim 5 is the first invention.
The solder layer and the protective layer according to (2) are flush with each other or the solder layer is higher than the protective layer.

The invention according to claim 6 is the first invention.
Or the first upper surface electrode layer described in 2 is made of either silver or gold based conductive powder containing glass or a gold based organometallic compound fired. .

The invention described in claim 7 is the same as the claim 6.
The second upper electrode layer described in (1) is made of a conductive powder of copper, silver, palladium or nickel containing glass, and the protective layer is made of glass.

The invention according to claim 8 is the same as the invention according to claim 6.
The second upper electrode layer described in (1) above is made of a copper-based or nickel-based conductive powder containing a resin, and the protective layer is made of a resin-based powder.

The invention according to claim 9 is the same as the claim 6.
The second upper electrode layer described in (1) above is made of a mixed powder of a copper-based and nickel-based conductive powder containing a resin, and the protective layer is made of a resin-based.

According to a tenth aspect of the present invention, the second upper surface electrode layer according to the sixth aspect includes a copper-nickel alloy powder containing a resin, and the protective layer is made of a resin-based material. Things.

According to an eleventh aspect of the present invention, the first upper surface electrode layer is formed by straddling the side of the upper surface of the sheet substrate having the dividing groove and the upper surface of the dividing groove and pouring the electrode paste into the dividing groove. Providing, and providing a resistive layer so as to electrically connect the first upper electrode layer,
Providing a protective layer so as to cover at least the upper surfaces of the first upper electrode layer and the resistance layer; and providing a second upper electrode layer electrically connected to at least the first upper electrode layer; A step of dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper electrode layer, and a step of dividing the strip-shaped substrate into individual pieces;
Forming a solder layer covering the second upper electrode layer.

Further, according to a twelfth aspect of the present invention, a step of providing a first upper surface electrode layer on a side portion of an upper surface of a sheet substrate having a dividing groove without straddling the upper surface of the dividing groove; Providing a resistive layer so as to electrically connect the electrode layers; providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Forming a second upper surface electrode layer by electrically connecting the second upper surface electrode layer by straddling the upper surface of the division groove of the sheet substrate and pouring the electrode paste into the division groove. A step of dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate, a step of dividing the strip-shaped substrate into individual pieces, and a step of forming a solder layer covering the second upper surface electrode layer It becomes.

According to a thirteenth aspect of the present invention, the step of forming a solder layer according to the eleventh or twelfth aspect is a step of dipping and forming in a molten solder bath at 200 ° C. to 250 ° C. Things.

According to a fourteenth aspect of the present invention, the step of forming the solder layer according to the eleventh or twelfth aspect is a step of forming the solder layer by an electroplating method.

According to a fifteenth aspect of the present invention, in the step of forming the solder layer according to the eleventh or twelfth aspect, the step of forming the solder layer is performed by using a paste material containing tin or solder as a main component. Is formed by dip or transfer printing so as to cover the substrate and heat-treating in an atmosphere at 200 ° C. to 280 ° C.

The structure and the manufacturing method have an effect that the soldering area occupying the mounting area when mounted on the mounting board can be reduced.

(Embodiment 1) A resistor and a method of manufacturing the resistor according to Embodiment 1 of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of the resistor according to the first embodiment of the present invention. In the figure, 31 is a substrate containing 96% alumina. Reference numeral 32 denotes a pair of first upper electrode layers formed by adding a glass to a silver-based conductive powder provided over a side portion and a part of a side surface of the upper surface of the substrate 31. The area of the upper electrode layer 32 is not more than half the area of the side surface of the substrate 31. Reference numeral 33 denotes a resistance layer mainly composed of ruthenium oxide provided so as to be electrically connected to the pair of first upper electrode layers 32.
Reference numeral 34 denotes a protective layer mainly composed of glass provided so as to cover at least the upper surface of the resistance layer 33. Reference numeral 35 denotes a second upper electrode layer made of a copper-based conductive powder provided on the upper surface of the first upper electrode layer 32 and containing glass.
The ridge line of the upper surface electrode layer 35 is rounded. Reference numeral 36 denotes a solder layer provided by an electroplating method so as to cover at least the exposed upper surface of the second upper electrode layer 35.

The method of manufacturing the resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 2 and 3 are process diagrams showing a method of manufacturing the resistor according to the first embodiment of the present invention.

First, as shown in FIG. 2 (a), a plurality of vertical and horizontal dividing grooves 38 and 39 provided on the surface for dividing into strips and individual pieces in a later step are provided. An electrode paste containing a silver-based conductive powder and glass is printed so as to flow over the lateral dividing grooves 39 of the sheet-like substrate 31 containing 96% alumina having excellent insulating properties. Then, baking is performed at a temperature of about 850 ° C. to form a stable film to form the first upper electrode layer 32. At this time, the electrode paste enters the dividing groove 39 in the lateral direction, and the first upper electrode layer 32 can be formed to the depth of the dividing groove. The depth of the dividing grooves 38 and 39 with respect to the thickness of the substrate 31 is:
In general, the substrate 31 is formed to have a thickness equal to or less than half the thickness of the substrate 31 so as not to be broken during handling in a manufacturing process.

Next, as shown in FIG. 2B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first upper electrode layer 32 to form a stable film. For this purpose, baking is performed at a temperature of about 850 ° C. to form the resistance layer 33.

Next, as shown in FIG.
In order to correct the resistance value of No. 3 to a predetermined value, trimming is performed by forming a trimming groove 40 using a YAG laser or the like. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 32 to perform trimming.

Next, as shown in FIG. 3A, a paste containing glass as a main component is printed in order to protect the resistance layer 33 whose resistance has been corrected, and about 600 mm is printed in order to form a stable film.
The protective layer 34 is formed by baking at a temperature of ° C. On this occasion,
The print pattern of the protective layer 34 may be formed so as to continuously cover the plurality of resistance layers 33 arranged in the horizontal direction across the division grooves 38 in the vertical direction.

Next, as shown in FIG. 3B, the upper surface of the first upper electrode layer 32 contains copper-based conductive powder and glass without straddling the lateral division grooves 39. The electrode paste is printed and about 6 in a nitrogen atmosphere to obtain a stable film.
Baking is performed at a temperature of 00 ° C. to form a second upper electrode layer 35. At this time, the plurality of first upper surface electrode layers 3
The print pattern of the second upper electrode layer 35 may be formed so as to straddle the vertical division groove 38 on the second substrate 2.

Next, as shown in FIG. 3C, a sheet-like substrate on which the first upper electrode layer 32, the resistance layer 33, the trimming groove 40, the protective layer 34, and the second upper electrode layer 35 have been formed. 31 along the horizontal dividing groove 39 of the strip substrate 4
Divide into 1. At this time, the first upper electrode layer 32 previously formed is formed on the side surface in the longitudinal direction of the strip substrate 41 to the depth of the lateral division groove 39.

Finally, as shown in FIG. 3D, the exposed first upper electrode layer 32 and second upper electrode layer 3 are exposed.
5 as a preparation process for plating.
Along the vertical dividing groove 38, and is divided into individual substrates 42. Then, the exposed first upper surface electrode layer 3
In order to secure the reliability of the second and second upper electrode layers 35 at the time of soldering, a resistor is manufactured by forming a solder layer (not shown) by electroplating.

The resistor constructed and manufactured in the first embodiment of the present invention was soldered to a mounting board.

FIG. 4A is a cross-sectional view for explaining a mounting state in which the resistor according to the first embodiment of the present invention is mounted on a mounting board, and the mounting is performed with the surface on which the protective layer 34 is formed facing downward. Then, both the upper electrode layer (not shown) and the resistance layer (not shown) on the side surface of the substrate 31 are soldered, but the area where the side electrode (not shown) is formed is small. Therefore, only the fillet 43 is formed slightly. Therefore, as shown in a top view illustrating a mounting state in which the resistor according to the first embodiment of the present invention is mounted on a mounting board in FIG. 4B, it is necessary to solder the component area 44 and the side surface. The area obtained by adding the area 45 is the mounting area 46. Comparing the mounting area with a product of the conventional structure with a square chip resistor of 0.6 x 0.3 mm size, it is about 20
% Could be reduced.

Therefore, according to the structure of the first embodiment of the present invention, since the area of the side electrode of the resistor is small, the area for forming the solder fillet on the mounting substrate can be small, and the mounting area can be reduced. Can be reduced.

In the first embodiment of the present invention, when the solder layer 36 and the protective layer 34 are flush with each other or the height of the solder layer 36 is increased, a gap between the solder layer 36 and the land pattern 45 at the time of mounting hardly occurs. The mounting quality can be further improved.

In the first embodiment of the present invention, the first
When the upper surface electrode layer 32, the protective layer 34, and the second upper surface electrode layer 35 are formed as combinations shown in (Table 1) and (Table 2),
Other characteristics (described in (Table 1) and (Table 2)) can be improved.

[0049]

[Table 1]

[0050]

[Table 2]

In the first embodiment of the present invention, it can be easily considered that the mounting area can be further reduced by not forming the side electrode. However, in the current manufacturing process of electronic devices, soldering inspection after mounting is actually performed by image recognition. If side electrodes are not formed, fillets are not formed at all and automatic inspection by image recognition is performed. Will be impossible.

(Embodiment 2) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 2 of the present invention will be described with reference to the drawings.

FIG. 5 is a sectional view of a resistor according to the second embodiment of the present invention. In the figure, reference numeral 71 denotes a substrate containing 96% alumina. Reference numeral 72 denotes a pair of first upper electrode layers formed of a silver-based conductive powder provided on the upper side of the substrate and containing glass. 73 is the first upper electrode layer 7
2 is a resistance layer containing ruthenium oxide as a main component and provided so as to be electrically connected to No. 2. Reference numeral 74 denotes a protective layer mainly composed of glass provided so as to cover the upper surface of the resistance layer 73. 75 is the upper surface of the first upper electrode layer 72 and the substrate 7
The second upper electrode layer 75 is a second upper electrode layer formed by adding glass to a copper-based conductive powder provided on a part of the first side surface, and the area of the second upper electrode layer 75 on the side surface of the substrate 71 is 71 is less than half the area of the side surface. The ridge line of the second upper electrode layer 75 is rounded. Reference numeral 76 denotes a solder layer provided so as to cover the second upper electrode layer 75 that is exposed for securing reliability and the like during soldering.

The method of manufacturing the resistor according to the second embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 6 and 7 are process diagrams showing a method of manufacturing a resistor according to the second embodiment of the present invention.

First, as shown in FIG. 6 (a), a heat-resistant surface having a plurality of vertical and horizontal dividing grooves 78, 79 provided on the surface for dividing into strips and individual pieces in a later step. An electrode paste containing a silver-based conductive powder and glass is printed without straddling a horizontal dividing groove 79 of a sheet-like substrate 71 containing 96% alumina having excellent insulating properties and stable. The first upper electrode layer 72 is formed by baking at a temperature of about 850 ° C. in order to form a thin film. The depth of the dividing grooves 78 and 79 with respect to the thickness of the substrate 71 is generally set so that the dividing grooves 78 and 79 do not break during handling in the manufacturing process.
Is formed so as to be less than half of the thickness.

Next, as shown in FIG. 6B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first upper electrode layer 72 to form a stable film. For this purpose, baking is performed at a temperature of about 850 ° C. to form the resistance layer 73.

Next, as shown in FIG.
In order to correct the resistance value of No. 3 to a predetermined value, trimming is performed by forming a trimming groove 80 using a YAG laser or the like. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 72 to perform trimming.

Next, as shown in FIG. 7A, a paste containing glass as a main component is printed in order to protect the resistance layer 73 whose resistance has been corrected, and about 600 mm is printed in order to form a stable film.
The protective layer 74 is formed by baking at a temperature of ° C. On this occasion,
The print pattern of the protection layer 74 may be formed so as to continuously cover the plurality of resistance layers 73 arranged in the horizontal direction across the division grooves 78 in the vertical direction.

Next, as shown in FIG. 7B, a copper-based conductive powder is formed on the upper surface of the first upper electrode layer 72 so as to cross the lateral dividing grooves 79 of the sheet-like substrate 71. An electrode paste containing glass is printed and baked at a temperature of about 600 ° C. in a nitrogen atmosphere to form a stable film to form a second upper electrode layer 75. At this time, the electrode paste enters the dividing groove 79 in the lateral direction, and the second upper electrode layer 75 can be formed to the depth of the dividing groove. At this time, a print pattern of the second upper electrode layer 75 may be formed on the plurality of first upper electrode layers 72 arranged in the horizontal direction so as to be continuous over the vertical division grooves 78.

Next, as shown in FIG. 7C, a sheet-like substrate on which a first upper electrode layer 72, a resistance layer 73, a trimming groove 80, a protective layer 74, and a second upper electrode layer 75 have been formed. 71 along the horizontal dividing groove 79, and the strip substrate 8
Divide into 1. At this time, the second upper surface electrode layer 75 formed previously is formed on the side surface in the longitudinal direction of the strip substrate 81 to the depth of the horizontal dividing groove 79.

Finally, as shown in FIG. 7D, as a preparation step for plating the exposed second upper surface electrode layer 75, along the vertical dividing groove 78 of the strip substrate 81, The substrate is divided into individual substrates 82. Then, a solder layer (not shown) is formed by electroplating to prevent electrode erosion at the time of soldering of the exposed second upper surface electrode layer 75 and to secure reliability at the time of soldering. ,
It is used to manufacture resistors.

The effect of soldering the resistor constructed and manufactured as described above in the second embodiment of the present invention to a mounting board is the same as that in the first embodiment, and will not be described. Omitted.

In Embodiment 2 of the present invention, the first
When the upper electrode layer 72, the protective layer 74, and the second upper electrode layer 75 are formed as shown in (Table 3) and (Table 4),
Other characteristics (described in (Table 3) and (Table 4)) can be improved.

[0065]

[Table 3]

[0066]

[Table 4]

In the embodiment of the present invention, the solder layer is formed by electroplating.
Dipping and forming in a molten solder bath or a paste material containing tin or solder as a main component
May be formed by dip or transfer printing so as to cover the upper surface electrode layer of the above and heat-treated in an atmosphere of 200 ° C. to 280 ° C.

[0068]

As described above, according to the present invention, since the upper surface electrode and the side electrode provided on a part of the side surface of the upper surface of the substrate are soldered, the area for forming the soldered fillet is reduced. It is possible to provide a resistor capable of reducing the mounting area including a soldered portion on a mounting board and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a sectional view of a resistor according to a first embodiment of the present invention.

FIG. 2 is a process chart showing the manufacturing method.

FIG. 3 is a process chart showing the manufacturing method.

FIG. 4A is a cross-sectional view illustrating a state of being mounted on the mounting board. FIG. 4B is a top view illustrating a state of mounting on the mounting board.

FIG. 5 is a sectional view of a resistor according to a second embodiment of the present invention.

FIG. 6 is a process chart showing the manufacturing method.

FIG. 7 is a process chart showing the manufacturing method.

FIG. 8 is a sectional view of a conventional resistor.

FIG. 9 is a process chart showing the manufacturing method.

10A is a cross-sectional view illustrating a state of being mounted on the mounting board. FIG. 10B is a top view illustrating a state of mounting on the mounting board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 31 Substrate 32 1st upper surface electrode layer 33 Resistive layer 34 Protective layer 35 2nd upper surface electrode layer 36 Solder layer

Claims (15)

[Claims] 1. A substrate, a pair of first upper electrode layers provided on side portions and a part of a side surface of an upper surface of the substrate, and a pair of first upper electrode layers provided to be electrically connected to the first upper electrode layer. Resistive layer, at least a second upper electrode layer provided on the upper surface of the first upper electrode layer, a protective layer provided so as to cover at least the resistive layer, and at least an exposed second upper electrode A resistor consisting of a solder layer covering the upper surface of the layer. 2. A substrate, a pair of first upper electrode layers provided on side portions of an upper surface of the substrate, and a resistance layer provided to be electrically connected to the first upper electrode layer. A second upper electrode layer provided on at least a top surface of the first upper electrode layer and a part of a side surface of the substrate; a protective layer provided so as to cover at least the resistance layer; A resistor comprising a solder layer covering an upper surface of the second upper electrode layer. 3. The resistor according to claim 1, wherein the first or second upper electrode layer provided on a part of the side surface of the substrate is provided on the resistance layer side in the height direction of the substrate. 4. The resistor according to claim 3, wherein the area of the first or second upper electrode layer on a part of the side surface of the substrate is equal to or less than half the area of the side surface of the substrate. 5. The resistor according to claim 1, wherein the solder layer and the protective layer are flush with each other or the solder layer is higher than the protective layer. 6. The first upper electrode layer is made of either silver or gold-based conductive powder containing glass or a gold-based organometallic compound fired. Or the resistor according to 2. 7. The resistor according to claim 6, wherein the second upper electrode layer is made of a conductive powder of copper, silver, palladium or nickel containing glass, and the protective layer is made of glass. 8. The resistor according to claim 6, wherein the second upper electrode layer is made of a copper-based or nickel-based conductive powder containing a resin, and the protective layer is made of a resin. 9. The resistor according to claim 6, wherein the second upper electrode layer is made of a mixed powder of a copper-based and nickel-based conductive powder containing a resin, and the protective layer is made of a resin. 10. The resistor according to claim 6, wherein the second upper electrode layer is made of an alloy powder of copper and nickel containing a resin, and the protective layer is made of a resin. 11. A step of straddling a side portion of an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and pouring an electrode paste into the dividing groove to provide a first upper surface electrode layer; Providing a resistive layer so as to electrically connect the electrode layers; providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Providing a second upper electrode layer electrically connected to the substrate substrate; dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper electrode layer; A method for manufacturing a resistor, comprising: a step of dividing a strip-shaped substrate into individual pieces; and a step of forming a solder layer covering the second upper electrode layer. 12. A step of providing a first upper surface electrode layer on a side of an upper surface of a sheet substrate having a division groove without straddling an upper surface of the division groove, and electrically connecting the first upper surface electrode layer. Providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; electrically connecting at least the first upper electrode layer to the sheet substrate; Providing a second upper surface electrode layer by pouring an electrode paste into the divided groove while straddling the upper surface of the divided groove, and forming the sheet by the divided groove of the sheet substrate formed with the second upper surface electrode layer. A method for manufacturing a resistor, comprising: a step of dividing a substrate into strip-shaped substrates; a step of dividing the strip-shaped substrate into individual pieces; and a step of forming a solder layer covering the second upper electrode layer. 13. The step of forming a solder layer is performed at 200 ° C.
The method for manufacturing a resistor according to claim 11 or 12, wherein the method is a step of dipping and forming in a molten solder bath at -250 ° C. 14. The method for manufacturing a resistor according to claim 11, wherein the step of forming the solder layer is a step of forming the solder layer by an electroplating method. 15. The step of forming a solder layer includes dip or transfer printing a paste material containing tin or solder as a main component so as to cover the second upper electrode layer.
The method for manufacturing a resistor according to claim 11 or 12, wherein the resistor is formed by performing a heat treatment in an atmosphere at 0 ° C to 280 ° C.