JPH10321404A - Resistor and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the soldering area occupying the mounting area, by providing a pair of first or second upper electrode layers at lateral parts of the main surface and parts of the lateral surfaces of a substrate, then providing a resistance layer so as to be electrically connected with the upper electrode layers, and providing a protection layer so as to cover the upper surface of the resistance layer. SOLUTION: First upper electrode layers 32 made of silver conductive powder containing glass are provided at lateral parts of the main surface and parts of the lateral surfaces of a substrate 31. The area of the first upper electrode layer 32 on the lateral surface of the substrate 31 is not greater than half the area of the lateral surface of the substrate 31. A resistance layer 33 containing ruthenium oxide as a principal component is provided, which is to be electrically connected with the first upper electrode layers 32. A protection layer (34 containing glass as a principal component is provided on the upper surface of the resistance layer 33. Second upper electrode layers 35 made of silver conductive powder containing glass are provided on the upper surfaces of the first upper electrode layers 32. The second upper electrode layers 35 have round contours.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a method for manufacturing the same.

[0002]

2. Description of the Related Art The prior art is disclosed in Japanese Patent Laid-Open No. 4-102302.
Is disclosed in US Pat.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 14 is a sectional view of a conventional resistor. In the figure, reference numeral 1 denotes an insulating substrate. Reference numeral 2 denotes a first upper electrode layer provided on both left and right ends of the upper surface of the insulating substrate 1. 3
Is a resistance layer provided so as to partially overlap the first upper electrode layer 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a second upper electrode layer provided on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1. Reference numeral 8 denotes a side surface electrode layer provided on the side surface of the insulating substrate 1. 9 and 10 are the second upper electrode layers 7
And a nickel plating layer and a solder plating layer provided on the surface of the side electrode layer 8. At this time, the solder plating layer 1
0 is provided lower than the second protective layer 6. That is, in the conventional resistor, the second protective layer 6 is provided highest.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

FIG. 15 is a process chart showing a conventional method for manufacturing a resistor. First, as shown in FIG. 15A, a first upper electrode layer 2 is formed on both sides of the upper surface of the insulating substrate 1 by coating.

Next, as shown in FIG. 15B, a resistive film 3 is applied on the upper surface of the insulating substrate 1 so as to partially overlap the first upper electrode layer 2.

Next, as shown in FIG. 15C, after a first protective layer 4 is formed by coating so as to cover only the entire resistive layer 3, the total resistance of the resistive layer 3 is reduced to a predetermined value. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to fall within the range of the value.

Next, as shown in FIG. 15D, a second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 15E, a second upper electrode layer 7 is formed on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1.

Next, as shown in FIG. 15 (f), the first upper electrode layer 2 and the first, left and right side surfaces of the insulating substrate
The side electrode layer 8 is formed by coating so as to be electrically connected to the second upper electrode layers 2 and 7.

Finally, nickel plating is applied to the surfaces of the second upper electrode layer 7 and the side electrode layer 8 and then solder plating is applied to form a nickel plating layer 9 and a solder plating layer 10. Was manufacturing resistors.

[0013]

However, in the resistor according to the above-mentioned conventional configuration and manufacturing method, when soldered to a mounting board, as shown in the cross-sectional view of the mounted state in FIG. (Not shown) and the lower electrode layer (not shown) are both soldered and fillet 2
FIG. 16 shows a fillet mounting structure in which No. 3 is formed.
As shown in the top view of the mounting state shown in FIG. 3B, an area 25 for soldering the side surface is required in addition to the component area 24, and a mounting area 26 in which these are combined is required. In addition, as the external dimensions of the component become smaller, the proportion of the soldering area to the mounting area increases in order to increase the mounting density, and there is a limit in improving the mounting density for miniaturizing electronic devices. Had.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resistor capable of reducing a soldering area occupying a mounting area when mounted on a mounting board and a method of manufacturing the same. is there.

[0015]

In order to achieve the above object, the present invention comprises a pair of first or second upper electrode layers provided on the side and part of the side of the main surface of the substrate, It has a resistance layer provided so as to be electrically connected to the upper electrode layer, and a protection layer provided so as to cover at least the upper surface of the resistance layer.

Further, in order to achieve the above object, the present invention is directed to a first or a second step which straddles an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and pours electrode paste into the dividing groove or sputters. Providing an upper electrode layer, providing a resistive layer to electrically connect the first upper electrode layer, and providing a protective layer to cover at least the upper surfaces of the upper electrode layer and the resistive layer; A step of dividing the sheet substrate into strips by division grooves of the sheet substrate formed with the upper electrode layer; and a step of dividing the strip substrate into individual pieces.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a substrate, a pair of first upper electrode layers provided on a side and a part of a side surface of the upper surface of the substrate, and A resistance layer provided so as to be electrically connected to the first upper electrode layer;
At least a second upper electrode layer provided on the upper surface of the first upper electrode layer and a protective layer provided so as to cover at least the upper surface of the resistance layer.

[0018] Further, the invention according to claim 2 includes a substrate,
A pair of first upper electrode layers provided on the upper surface of the substrate, a resistive layer provided to be electrically connected to the first upper electrode layer, and at least an upper surface of the first upper electrode layer And a second upper electrode layer provided on a part of the side surface of the substrate, and a protective layer provided so as to cover at least the resistance layer.

Further, the invention described in claim 3 is the first invention.
Or the first or second upper electrode layer provided on the side surface of the substrate according to Item 2 is provided on the resistance layer side in the height direction of the substrate.

The invention described in claim 4 is the third invention.
The area of the first or second upper electrode layer provided on the side surface of the substrate is not more than half the area of the side surface of the substrate.

The invention described in claim 5 is the first invention.
Or the first or second upper electrode layer described above is covered with a plating layer, and the plating layer and the protective layer are flush with each other or the plating layer is high.

The invention according to claim 6 is the first invention.
Or the first upper electrode layer described in 2 is made of either silver or gold based conductive powder containing glass or a gold based organometallic compound fired.

The invention described in claim 7 is the first invention.
Alternatively, the first upper electrode layer described in 2 is formed by nickel-based or gold-based sputtering.

The invention according to claim 8 is the same as the invention according to claim 6.
The second upper electrode layer described above is made of silver or gold-based conductive powder containing glass, and the protective layer is made of glass.

The invention according to claim 9 is the same as the claim 6.
The second upper electrode layer described above is made of silver or nickel-based conductive powder containing resin, and the protective layer is made of resin.

According to a tenth aspect of the present invention, the first upper electrode layer is formed by nickel or gold based sputtering, and the second upper electrode layer is formed of silver or nickel. The resin is contained in the conductive powder of the system, and the protective layer is made of a resin.

According to the eleventh aspect of the present invention, the ridge line of the second upper electrode layer according to the first or second aspect is rounded.

According to a twelfth aspect of the present invention, the second upper electrode layer according to the sixth aspect is formed by nickel-based or gold-based sputtering, and the protective layer is made of a resin-based material.

According to a thirteenth aspect of the present invention, the first upper surface electrode layer is formed by straddling the side of the upper surface of the sheet substrate having the dividing groove and the upper surface of the dividing groove and pouring the electrode paste into the dividing groove. Providing, and providing a resistive layer so as to electrically connect the first upper electrode layer,
Providing a protective layer so as to cover at least the upper surfaces of the first upper electrode layer and the resistance layer; and providing a second upper electrode layer electrically connected to at least the first upper electrode layer; The method includes a step of dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper electrode layer, and a step of dividing the strip-shaped substrate into individual pieces.

According to a fourteenth aspect of the present invention, a step of straddling a side portion of an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and providing a first upper surface electrode layer in the dividing groove by sputtering. Providing a resistive layer so as to electrically connect the first upper electrode layer, and providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Providing a second upper electrode layer electrically connected to the first upper electrode layer;
The method includes a step of dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper electrode layer, and a step of dividing the strip-shaped substrate into individual pieces.

Further, according to the present invention, a step of providing a first upper surface electrode layer on a side portion of an upper surface of a sheet substrate having a dividing groove without straddling the upper surface of the dividing groove; Providing a resistive layer so as to electrically connect the electrode layers; providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Forming a second upper surface electrode layer by electrically connecting the second upper surface electrode layer by straddling the upper surface of the division groove of the sheet substrate and pouring the electrode paste into the division groove. The method includes a step of dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate, and a step of dividing the strip-shaped substrate into individual pieces.

Further, according to the present invention, a step of providing a first upper surface electrode layer on a side portion of an upper surface of a sheet substrate having a dividing groove without straddling the upper surface of the dividing groove; Providing a resistive layer so as to electrically connect the electrode layers; providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Providing a second upper electrode layer over the upper surface of the dividing groove of the sheet substrate by sputtering and providing a second upper electrode layer by sputtering in the dividing groove; and forming the second upper electrode layer on the sheet substrate. And a step of dividing the sheet substrate into strip-shaped substrates by the dividing groove, and a step of dividing the strip substrate into individual pieces.

With this configuration and the manufacturing method, it is possible to provide a resistor and a method for manufacturing the same, which can reduce the soldering area occupying the mounting area when mounted on a mounting board.

(Embodiment 1) A resistor and a method of manufacturing the resistor according to Embodiment 1 of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of the resistor according to the first embodiment of the present invention. In the figure, 31 is a substrate containing 96% alumina. Reference numeral 32 denotes a first upper electrode layer made of a silver-based conductive powder containing glass and provided on a part of a side surface and a side surface of the main surface of the substrate. The area of the electrode layer 32 is equal to or less than half the area of the side surface of the substrate 31. Reference numeral 33 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the first upper electrode layer 32. Reference numeral 34 denotes a protective layer mainly composed of glass provided on the upper surface of the resistance layer 33. 35 is the first upper electrode layer 3
The second upper electrode layer 35 is a second upper electrode layer made of a silver-based conductive powder containing glass and provided on the upper surface of the second upper electrode layer 2, and the ridge line of the second upper electrode layer 35 is rounded. Reference numerals 36 and 37 denote a nickel plating layer and a solder plating layer provided as necessary to ensure reliability and the like at the time of soldering.

With reference to the drawings, a description will be given below of a method of manufacturing the resistor having the above-described configuration according to an embodiment of the present invention.

2 to 3 are process diagrams showing a method for manufacturing a resistor according to the first embodiment of the present invention.

First, as shown in FIG. 2 (a), the surface has a plurality of vertical and horizontal dividing grooves 38, 39 provided on the surface for dividing into strips and individual pieces in a later step. And a sheet-like substrate 31 containing 96% alumina having excellent insulating properties so as to straddle the lateral dividing grooves 39,
The first upper electrode layer 32 is formed by printing an electrode paste containing silver-based conductive powder and glass. Then this first
Is fired at a temperature of about 850 ° C. in order to make the upper surface electrode layer 32 of a stable film. At this time, the electrode paste enters the dividing groove 39 in the horizontal direction, and the first upper electrode layer 32 can be formed to the depth of the dividing groove. The substrate 3 of the dividing grooves 38 and 39
The thickness of the substrate 31 is generally less than half the thickness of the substrate 31 so as not to crack during handling in the manufacturing process.

Next, as shown in FIG. 2B, a resistance paste containing ruthenium oxide as a main component is printed to form a resistance layer 33 so as to be electrically connected to the first upper electrode layer 32. . Next, firing is performed at a temperature of about 850 ° C. in order to make the resistance layer 33 a stable film.

Next, as shown in FIG.
In order to correct the resistance value of No. 3 to a predetermined value, trimming is performed by forming a trimming groove 40 with a YAG laser. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 32 to perform trimming.

Next, as shown in FIG. 3A, a paste containing glass as a main component is printed to protect the resistance layer 33 whose resistance value has been corrected, and a protection layer 34 is formed. At this time, the plurality of resistance layers 33 arranged in the horizontal direction are divided into the vertical dividing grooves 3.
The printed pattern of the protective layer 34 may be formed so as to cover the layer 8 continuously. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 34 a stable film.

Next, as shown in FIG. 3B, the upper surface of the first upper electrode layer 32 contains silver-based conductive powder and glass without straddling the lateral dividing groove 39. The electrode paste is printed to form the second upper electrode layer 35. On this occasion,
The print pattern of the second upper electrode layer 35 may be formed so as to straddle the vertical division grooves 38 on the plurality of first upper electrode layers 32 arranged in the horizontal direction. Next, baking is performed at a temperature of about 600 ° C. in order to make the second upper electrode layer 35 a stable film.

Next, as shown in FIG. 3C, a sheet-like substrate on which the first upper electrode layer 32, the resistance layer 33, the trimming groove 40, the protective layer 34, and the second upper electrode layer 35 have been formed. 31 along the horizontal dividing groove 39 of the strip substrate 4
Divide into 1. At this time, on the longitudinal side surface of the strip substrate 41, the upper electrode layer 32 formed earlier is formed with the horizontal dividing grooves 3
It is in a state formed to a depth of 9.

Finally, as shown in FIG. 3D, the exposed first upper electrode layer 32 and second upper electrode layer 3 are exposed.
5 as a preparation process for plating.
Along the vertical dividing groove 38, and is divided into individual substrates 42. Then, the exposed first upper surface electrode layer 3
In order to prevent electrode erosion during soldering of the second and second upper electrode layers 35 and to ensure reliability during soldering,
A resistor is manufactured by forming a nickel plating layer (not shown) as an intermediate layer and a solder plating layer (not shown) as an outermost layer by electroplating.

The resistor constructed and manufactured in the first embodiment of the present invention was soldered to a mounting board. As shown in the cross-sectional view of the mounting state in FIG. 4A, the mounting is performed with the surface on which the protective layer is formed facing downward, and both the upper electrode layer (not shown) and the resistance layer on the side surface of the substrate are used. Although soldering is performed, the fillet 43 is only slightly formed because the area where the side electrode is formed is small.
Therefore, as shown in the top view of the mounting state of FIG.
The combined area of the component area 44 and the area 45 required for soldering the side surfaces is the mounting area 46. 0.
When the mounting area of a square chip resistor of 6 × 0.3 mm size is compared with that of a product having a conventional structure, the size can be reduced by about 20%.

Therefore, according to the structure of the present invention, since the area of the side electrode of the resistor is small, the area for forming the soldering fillet on the mounting board can be small, and the mounting area can be reduced. Can be.

In the first embodiment of the present invention, the gap between the solder plating layer 37 and the land pattern 45 at the time of mounting is improved by flushing the solder plating layer 37 and the protective layer 34 or making the solder plating layer 37 higher. Is less likely to occur, and the mounting quality can be further improved.

In the first embodiment of the present invention, the first
When the upper electrode layer 32, the protective layer 34, and the second upper electrode layer 35 are combined as shown in (Table 1), other characteristics (described in Table 1) can be improved.

[0049]

[Table 1]

In the first embodiment of the present invention, it can be easily considered that the mounting area can be further reduced by not forming the side electrode. However, in the current manufacturing process of electronic devices, soldering inspection after mounting is actually performed by image recognition. If side electrodes are not formed, fillets are not formed at all and automatic inspection by image recognition is performed. Will be impossible.

(Embodiment 2) A resistor and a method of manufacturing the resistor according to Embodiment 2 of the present invention will be described below with reference to the drawings.

FIG. 5 is a sectional view of a resistor according to the second embodiment of the present invention. In the figure, reference numeral 51 denotes a substrate containing 96% alumina. Reference numeral 52 denotes a first upper surface electrode layer provided on a side portion and a part of a side surface of the main surface of the substrate, which is provided by gold-based sputtering.
The area of the upper electrode layer 52 is not more than half the area of the side surface of the substrate 51. Reference numeral 53 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the first upper electrode layer 52.
Reference numeral 54 denotes a protective layer mainly composed of glass provided on the upper surface of the resistance layer 53. Reference numeral 55 denotes a second upper surface electrode layer provided on the upper surface of the first upper surface electrode layer 52 and made of a silver-based conductive powder containing glass, and the ridge line of the second upper surface electrode layer 55 is rounded. Have. Reference numerals 56 and 57 denote a nickel plating layer and a solder plating layer provided as necessary to ensure reliability and the like at the time of soldering.

The method of manufacturing the resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

6 and 7 are process diagrams showing a method for manufacturing a resistor according to the second embodiment of the present invention.

First, as shown in FIG. 6A, a heat-resistant surface having a plurality of vertical and horizontal dividing grooves 58, 59 provided on the surface for dividing into strips and individual pieces in a later step. Then, gold is deposited on the entire upper surface of the sheet-like substrate 51 containing 96% alumina having excellent insulating properties by a sputtering method, and a desired electrode pattern is formed by a photolithography method generally used in LSIs and the like. Is formed, and heat treatment is performed at a temperature of about 300 to 400 ° C. in order to make the first upper electrode layer 52 a stable film. At this time, the first upper electrode layer 52 can enter the lateral dividing groove 59 and form the first upper electrode layer 52 to the depth of the dividing groove. The depth of the dividing grooves 58 and 59 with respect to the thickness of the substrate 51 is generally formed to be half or less of the thickness of the substrate 51 so as not to be broken during handling in a manufacturing process.

Next, as shown in FIG. 6B, a resistance paste mainly containing ruthenium oxide is printed to form a resistance layer 53 so as to be electrically connected to the first upper electrode layer 52. . Next, firing is performed at a temperature of about 850 ° C. in order to make the resistance layer 53 a stable film.

Next, as shown in FIG.
In order to correct the resistance value of No. 3 to a predetermined value, trimming is performed by forming a trimming groove 60 with a YAG laser. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 52 to perform trimming.

Next, as shown in FIG. 7A, a paste containing glass as a main component is printed to protect the resistance layer 53 having the corrected resistance value, and a protection layer 54 is formed. At this time, the plurality of resistance layers 53 arranged in the horizontal direction are divided into the vertical dividing grooves 5.
The print pattern of the protective layer 54 may be formed so as to continuously cover the layer 8. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 54 a stable film.

Next, as shown in FIG. 7B, the upper surface of the first upper electrode layer 52 contains silver-based conductive powder and glass without straddling the horizontal dividing groove 59. The electrode paste is printed to form the second upper electrode layer 55. Next, in order to make the second upper electrode layer 55 a stable film, about 600
The firing is performed at a temperature of ° C.

Next, as shown in FIG. 7C, the upper electrode layer 52, the resistance layer 53, the trimming groove 60, the protection layer 54,
The second upper electrode layer 55 is divided along the horizontal dividing grooves 59 of the formed sheet-like substrate 51, and is divided into strip substrates 61. At this time, on the longitudinal side surface of the strip substrate 61,
The upper electrode layer 52 formed earlier is formed to the depth of the horizontal dividing groove 59.

Finally, as shown in FIG. 7 (d), as a preparation step for plating the exposed upper electrode layer 52, the strip substrate 61 is divided along the vertical dividing grooves 58, The individual substrate 62 is divided. Then, in order to prevent electrode erosion at the time of soldering of the exposed upper surface electrode layer 52 and to secure reliability at the time of soldering, a nickel plating layer (not shown) is used as an intermediate layer by electroplating. A resistor is manufactured by forming a plating layer (not shown) as an outermost layer.

The effect of soldering the resistor constructed and manufactured as described above in the second embodiment of the present invention to a mounting board is the same as that in the first embodiment, and will not be described. Omitted.

In the second embodiment of the present invention, when the upper electrode layer 52, the protective layer 54 and the upper electrode layer 55 are combined as shown in (Table 2), other characteristics (Table 2)
) Can be improved.

[0064]

[Table 2]

(Embodiment 3) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 3 of the present invention will be described with reference to the drawings.

FIG. 8 is a sectional view of a resistor according to the third embodiment of the present invention. In the figure, reference numeral 71 denotes a substrate containing 96% alumina. Numeral 72 denotes a first silver-based conductive powder provided on the side of the main surface of the substrate and containing glass.
Of the upper electrode layer. Reference numeral 73 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the first upper electrode layer 72. 74 is a protective layer mainly composed of glass provided on the upper surface of the resistance layer 33. 75 is the first upper electrode layer 32
Of the second upper electrode layer 75 on the side surface of the substrate 71 is a second upper electrode layer made of a silver-based conductive powder containing glass and provided on a part of the side surface of the substrate 72. The area is not more than half the area of the side surface of the substrate 71. This second
The ridge line of the upper electrode layer 75 is rounded. 76,7
Reference numeral 7 denotes a nickel plating layer and a solder plating layer provided as necessary to ensure reliability and the like during soldering.

The method of manufacturing the resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 9 to 10 are process diagrams showing a method of manufacturing a resistor according to the third embodiment of the present invention.

First, as shown in FIG. 9 (a), a plurality of vertical and horizontal dividing grooves 78 and 79 provided on the surface for dividing into strips and individual pieces in a later step are provided. An electrode paste containing silver-based conductive powder and glass is printed without straddling the horizontal dividing groove 79 of the sheet-like substrate 71 containing 96% alumina having excellent insulating properties. Of the upper electrode layer 72 is formed. Next, in order to make the first upper electrode layer 72 a stable film, about 850
The firing is performed at a temperature of ° C. The substrate 7 of the dividing grooves 78 and 79
The thickness of the substrate 71 is generally less than half the thickness of the substrate 71 so as not to break during handling in the manufacturing process.

Next, as shown in FIG. 9B, a resistance paste containing ruthenium oxide as a main component is printed to form a resistance layer 73 so as to be electrically connected to the first upper electrode layer 72. . Next, baking is performed at a temperature of about 850 ° C. in order to make the resistance layer 73 a stable film.

Next, as shown in FIG.
In order to correct the resistance value of No. 3 to a predetermined value, trimming is performed by forming a trimming groove 80 with a YAG laser. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 72 to perform trimming.

Next, as shown in FIG. 10A, a paste containing glass as a main component is printed to protect the resistance layer 73 whose resistance value has been corrected, and a protection layer 74 is formed. At this time, the plurality of resistance layers 73 arranged in the horizontal direction are divided into the vertical dividing grooves 7.
The print pattern of the protective layer 74 may be formed so as to continuously cover step 8. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 74 a stable film.

Next, as shown in FIG. 10B, a silver-based conductive powder is formed on the upper surface of the first upper electrode layer 72 so as to cross the lateral dividing grooves 79 of the sheet-like substrate 71. The second upper electrode layer 75 is printed by printing an electrode paste containing glass.
To form At this time, the electrode paste enters the dividing groove 79 in the horizontal direction and extends to the depth of the dividing groove so as to reach the second upper electrode layer 7.
5 can be formed. At this time, a print pattern of the second upper electrode layer 75 may be formed on the plurality of first upper electrode layers 72 arranged in the horizontal direction so as to be continuous over the vertical division grooves 78. Next, baking is performed at a temperature of about 600 ° C. in order to make the second upper electrode layer 75 a stable film.

Next, as shown in FIG. 10C, a sheet-like substrate on which a first upper electrode layer 72, a resistance layer 73, a trimming groove 80, a protective layer 74, and a second upper electrode layer 75 have been formed. The substrate is divided along the horizontal dividing groove 79 of FIG. At this time, the second upper surface electrode layer 75 formed previously is formed on the side surface in the longitudinal direction of the strip substrate 81 to the depth of the horizontal dividing groove 79.

Finally, as shown in FIG. 10D, as a preparation step for plating the exposed second upper surface electrode layer 75, along the vertical dividing groove 78 of the strip substrate 81, The substrate is divided into individual substrates 82. Then, in order to prevent electrode erosion during soldering of the exposed second upper surface electrode layer 75 and to ensure reliability during soldering,
A resistor is manufactured by forming a nickel plating layer (not shown) as an intermediate layer and a solder plating layer (not shown) as an outermost layer by electroplating.

The effect of soldering the resistor constructed and manufactured as described above in the third embodiment of the present invention to a mounting board is the same as that in the first embodiment, and will not be described. Omitted.

In Embodiment 3 of the present invention, the first
When the upper electrode layer 72, the protective layer 74, and the second upper electrode layer 75 are combined as shown in (Table 3), other characteristics (described in Table 3) can be improved.

[0078]

[Table 3]

(Embodiment 4) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 4 of the present invention will be described with reference to the drawings.

FIG. 11 is a sectional view of a resistor according to the fourth embodiment of the present invention. In the figure, reference numeral 91 denotes a substrate containing 96% alumina. Reference numeral 92 denotes a first upper electrode layer formed of a silver-based conductive powder provided on the side of the main surface of the substrate and containing glass. Reference numeral 93 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the first upper electrode layer 92. Reference numeral 94 denotes a protective layer mainly composed of glass provided on the upper surface of the resistance layer 93. 95 is the first upper electrode layer 9
2 is a second upper electrode layer formed by using gold-based sputtering provided on a part of the upper surface and side surfaces of the substrate 91.
The area of the second upper electrode layer 95 on the side surface of the substrate 91 is not more than half the area of the side surface of the substrate 91. This second upper electrode layer 9
The ridge line 5 is rounded. Reference numerals 96 and 97 denote a nickel plating layer and a solder plating layer provided for ensuring reliability and the like at the time of soldering as necessary.

The method of manufacturing the resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 12 and 13 are process diagrams showing a method of manufacturing a resistor according to the fourth embodiment of the present invention.

First, as shown in FIG. 12 (a), the surface has a plurality of vertical and horizontal dividing grooves 98, 99 provided for dividing into strips and individual pieces in a post-process. An electrode paste containing silver-based conductive powder and glass is printed without straddling the horizontal dividing groove 99 of the sheet-like substrate 91 containing 96% alumina having excellent insulating properties, and the first paste is printed. Of the upper electrode layer 92 is formed.

Next, as shown in FIG. 12B, a resistance paste containing ruthenium oxide as a main component is printed to form a resistance layer 93 so as to be electrically connected to the first upper electrode layer 92. . Next, firing is performed at a temperature of about 850 ° C. in order to make the resistance layer 93 a stable film.

Next, as shown in FIG. 12C, in order to correct the resistance value of the resistance layer 93 to a predetermined value, trimming is performed by applying a trimming groove 100 using a YAG laser.
At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 92 to perform trimming.

Next, as shown in FIG. 13A, a paste containing glass as a main component is printed to protect the resistance layer 93 whose resistance value has been corrected, thereby forming a protection layer 94. At this time, the plurality of resistance layers 93 arranged in the horizontal direction are divided into the vertical dividing grooves 9.
The printed pattern of the protective layer 94 may be formed so as to continuously cover the layer 8. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 94 a stable film.

Next, as shown in FIG.
A resist material made of a resin is applied to the entire upper surface of the substrate 1, and a hole of a desired film formation pattern of the second upper electrode layer 95 is formed in the resist material by a photolithography method. Further, gold is deposited on the entire upper surface of the substrate by a sputtering method, and the resist material in a portion other than a desired film formation pattern of the second upper electrode layer 95 is removed. By this step, the second upper electrode layer 9 is formed.
5 is formed. At this time, the second upper electrode layer 95 can enter the lateral dividing groove 99 and form the second upper electrode layer 95 to the depth of the dividing groove.

The depth of the dividing grooves 98 and 99 with respect to the thickness of the substrate 91 is generally formed to be half or less of the thickness of the substrate 91 so as not to be broken during handling in the manufacturing process.

Next, as shown in FIG. 13C, a sheet-like substrate on which a first upper electrode layer 92, a resistance layer 93, a trimming groove 100, a protective layer 94, and a second upper electrode layer 95 have been formed. The substrate is divided along a horizontal dividing groove 99 in the direction 91 and divided into strip substrates 101. At this time, the second upper surface electrode layer 95 formed earlier is formed on the side surface in the longitudinal direction of the strip substrate 101 to the depth of the horizontal dividing groove 99.

Finally, as shown in FIG. 13D, as a preparation step for plating the exposed second upper surface electrode layer 95, along the vertical dividing groove 98 of the strip substrate 101, The substrate is divided into individual substrates 102. Then, in order to prevent electrode erosion during soldering of the exposed second upper surface electrode layer 95 and secure reliability during soldering, a nickel plating layer (not shown) is formed by electroplating. Then, a resistor plating layer (not shown) is formed as an outermost layer to manufacture a resistor.

The effect of soldering the resistor constructed and manufactured as described above in the fourth embodiment of the present invention to a mounting substrate is the same as that in the first embodiment, and will not be described. Omitted.

Further, in Embodiment 4 of the present invention, the first
When the upper electrode layer 92, the protective layer 94, and the second upper electrode layer 95 are combined as shown in (Table 4), other characteristics (described in Table 4) can be improved.

[0093]

[Table 4]

[0094]

As described above, according to the present invention, since the upper surface electrode and the side electrode provided on a part of the side surface of the upper surface of the substrate are soldered, the area for forming the soldered fillet is reduced. It is possible to provide a resistor capable of reducing the mounting area including a soldered portion on a mounting board and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a sectional view of a resistor according to a first embodiment of the present invention.

FIG. 2 is a process chart showing a method for manufacturing the resistor.

FIG. 3 is a process chart showing the manufacturing method.

FIG. 4A is a cross-sectional view when the resistor is mounted, and FIG.

FIG. 5 is a sectional view of a resistor according to a second embodiment of the present invention.

FIG. 6 is a process chart showing a method for manufacturing the resistor.

FIG. 7 is a process chart showing the manufacturing method.

FIG. 8 is a sectional view of a resistor according to a third embodiment of the present invention.

FIG. 9 is a process chart showing a method for manufacturing the resistor.

FIG. 10 is a process chart showing the same manufacturing method.

FIG. 11 is a sectional view of a resistor according to a fourth embodiment of the present invention.

FIG. 12 is a process chart showing a method for manufacturing the resistor.

FIG. 13 is a process chart showing the same manufacturing method.

FIG. 14 is a sectional view of a conventional resistor.

FIG. 15 is a process chart showing a method for manufacturing the resistor.

FIG. 16A is a cross-sectional view when the resistor is mounted, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 31 Substrate 32 1st upper surface electrode layer 33 Resistance layer 34 Protective layer 35 2nd upper surface electrode layer 36 Nickel plating layer 37 Solder plating layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // H01C 1/034 H01C 17/12

Claims (16)

[Claims] 1. A substrate, a pair of first upper electrode layers provided on side portions and a part of a side surface of an upper surface of the substrate, and a pair of first upper electrode layers provided to be electrically connected to the first upper electrode layer. And a protective layer provided so as to cover at least the upper surface of the resistance layer, a second upper electrode layer provided on at least the upper surface of the first upper electrode layer, and a protection layer provided so as to cover at least the upper surface of the resistance layer. 2. A substrate, a pair of first upper electrode layers provided on an upper surface of the substrate, and a resistive layer provided to be electrically connected to the first upper electrode layer; A resistor comprising: a second upper electrode layer provided on an upper surface of a first upper electrode layer and a part of a side surface of the substrate; and a protective layer provided so as to cover at least the resistance layer. 3. The resistor according to claim 1, wherein the first or second upper electrode layer provided on the side surface of the substrate is provided on the resistance layer side in the height direction of the substrate. 4. The resistor according to claim 3, wherein the area of the first or second upper electrode layer on the side surface of the substrate is less than half the area of the side surface of the substrate. 5. The resistor according to claim 1, wherein the first or second upper electrode layer is covered with a plating layer, and the plating layer and the protective layer are flush with each other or the plating layer is high. 6. The first upper electrode layer is made of either silver or gold-based conductive powder containing glass or a gold-based organometallic compound fired. Or the resistor according to 2. 7. The resistor according to claim 1, wherein the first upper electrode layer is formed by nickel-based or gold-based sputtering. 8. The resistor according to claim 6, wherein the second upper electrode layer is made of silver or gold-based conductive powder containing glass, and the protective layer is made of glass. 9. The resistor according to claim 6, wherein the second upper electrode layer is made of silver or nickel based conductive powder containing resin, and the protective layer is made of resin. 10. The first upper electrode layer is formed by nickel or gold based sputtering, and the second upper electrode layer is made of silver or nickel based conductive powder containing resin. 3. The resistor according to claim 1, wherein the resistor is made of a resin. 11. The resistor according to claim 1, wherein a ridge line of the second upper electrode layer has a rounded shape. 12. The resistor according to claim 6, wherein the second upper electrode layer is formed by nickel-based or gold-based sputtering, and the protective layer is made of a resin. 13. A step of straddling a side portion of an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and pouring an electrode paste into the dividing groove to provide a first upper surface electrode layer; Providing a resistive layer so as to electrically connect the electrode layers; providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; Providing a second upper electrode layer electrically connected to the substrate substrate; dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper electrode layer; Dividing the strip substrate into individual pieces. 14. A step of straddling a side portion of an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and providing a first upper surface electrode layer in the dividing groove by sputtering; Providing a resistive layer so as to be electrically connected; providing a protective layer so as to cover at least an upper surface of the first upper surface electrode layer and the resistive layer; Providing a second upper surface electrode layer connected to the substrate, dividing the sheet substrate into strip-shaped substrates by dividing grooves of the sheet substrate formed with the second upper surface electrode layer, And dividing the resistor into individual pieces. 15. A step of providing a first upper surface electrode layer on a side of an upper surface of a sheet substrate having a division groove without straddling the upper surface of the division groove, and electrically connecting the first upper surface electrode layer. Providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; electrically connecting at least the first upper electrode layer to the sheet substrate; Providing a second upper surface electrode layer by pouring an electrode paste into the divided groove while straddling the upper surface of the divided groove, and forming the sheet by the divided groove of the sheet substrate formed with the second upper surface electrode layer. A method of manufacturing a resistor, comprising: a step of dividing a substrate into strip-shaped substrates; and a step of dividing the strip-shaped substrate into individual pieces. 16. A step of providing a first upper electrode layer on the side of the upper surface of a sheet substrate having a dividing groove without straddling the upper surface of the dividing groove, and electrically connecting the first upper electrode layer. Providing a protective layer so as to cover at least an upper surface of the first upper electrode layer and the resistive layer; electrically connecting at least the first upper electrode layer to the sheet substrate; Providing a second upper surface electrode layer by sputtering in the divided groove while straddling the upper surface of the divided groove, and stripping the sheet substrate by the divided groove of the sheet substrate formed with the second upper surface electrode layer. A method for manufacturing a resistor, comprising: a step of dividing the strip-shaped substrate into individual pieces; and a step of dividing the strip-shaped substrate into individual pieces.