JPH10160759A - Contact probe and probing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a contact probe in which high pin counts and narrow pitches can be achieved by a method wherein a contact probe body and a contact-probe branch part are molded integrally and a part of a main pattern interconnection is branched in the contact probe branch part so as to form branch pattern interconnections. SOLUTION: A contact probe 30 is constituted of a contact probe body 33 on which a main pattern interconnection is formed and of contact probe branch parts 34 which are branched from the probe body 33 so as to be molded integrally. Since the probe branch parts 34 comprise two branch pattern interconnections which are formed in such a way that a part of the main pattern interconnection is branched, the pattern of the main pattern interconnection is divided into the branch pattern interconnections, and the branch pattern interconnections can be connected to two sides on both sides of a place which is different from the main pattern interconnection. When the probing test of an IC chip is made by using a probing apparatus 41, the probing apparatus 41 is connected to a tester, signals are transmitted respectively to the main pattern interconnection and the branch pattern interconnections via branch-side pattern interconnections on respective sides of a printed-circuit board 45.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe for performing an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device or the like, and a probe device using the same.

[0002]

2. Description of the Related Art In general, a contact pin is used to make an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
Japanese Patent Publication No. 27 proposes a technique in which a plurality of pattern wirings are formed on a resin film, and the tips of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technology example, by using the tip of a plurality of pattern wiring as a contact pin,
This aims to reduce the pitch of the pins and to eliminate the need for a large number of complicated components.

As shown in FIG. 15, a conventional contact probe 1 has a Ni
(Nickel) or Ni alloy, and has a structure in which a pattern wiring 3 is attached.
The tip of the pattern wiring 3 protrudes from the end of the pattern wiring 3 to form a contact pin 3a. Reference numeral 4 denotes an alignment hole described later.

[0005] For example, Japanese Patent Application Laid-Open No. 6-324081 proposes a probe device (probe card) using the above-mentioned contact probe (flexible substrate in the publication) having a contact pin at the tip of a pattern wiring. In this probe device, matching is applied to a difference in pin pitch between an IC chip or the like and a tester, and the probe device is suitable for a probe test of an IC chip or the like having a narrow pin pitch.

A configuration in which the above-described conventional contact probe 1 is incorporated into a mechanical part 10 to form the above-described conventional probe device 11 will be described with reference to FIGS.

The mechanical part 10 includes a mounting base 12, a top clamp 13, and a bottom clamp 14. First, the top clamp 13 is mounted on the printed circuit board 15, and then the mounting base 12 to which the contact probe 1 is mounted is mounted on the top clamp 13 by screwing a bolt 17 into a bolt hole 16 (see FIG. 17). Then, by holding down the contact probe 1 with the bottom clamp 14,
The pattern wiring 3 is kept in a certain inclined state, and the pattern wiring 3 is pressed against the IC chip.

FIG. 17 shows the probe device 11 after the assembly is completed.
Is shown. FIG. 18 is a sectional view taken along line EE of FIG. As shown in FIG. 18, the tip of the pattern wiring 3 is in contact with the IC chip I by the mounting base 12. The mounting base 12 is provided with a positioning pin 18 for adjusting the position of the contact probe 1. By inserting the positioning pin 18 into the positioning hole 4 of the contact probe 1,
The pattern wiring 3 and the IC chip I can be accurately positioned. The elastic body 20 of the bottom clamp 14 is pressed against the pattern wiring 3 in the portion of the window 19 provided in the contact probe 1 to
The pattern wiring 3 of No. 9 is brought into contact with the electrode 21 of the printed circuit board 15, and a signal obtained from the pattern wiring 3 can be transmitted to the outside through the electrode 21 of the printed circuit board 15.

[0009]

However, the above-mentioned conventional contact probe 1 and the probe device 11 using the same have the following problems. IC
Since the connection from the electrode of the chip I to the electrode 21 of the printed board 15 is performed by the pattern wiring 3 integrated on the resin film 2, there is no flexibility in the arrangement of the pads of the electrode 21 on the printed board 15 side. No particular problem arises when the electrodes are uniformly arranged on the four sides, but it is difficult to cope with the case where the electrodes are unevenly arranged on the four sides. That is, for example, in the case of a driver IC for LCD (having several hundred pins formed on the long side of 3 mm × 1 mm size) where the electrodes are concentrated on one side,
The space for arranging the pads of the electrodes 21 on the printed board 15 is not enough, and the printed circuit board 1
Connection to 5 was difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a contact probe which can be narrowed in the number of pins and can be applied to a semiconductor chip or the like in which electrodes are arranged unequally on four sides. It is an object to provide a probe device.

[0011]

The present invention has the following features to attain the object mentioned above. That is, in the contact probe according to claim 1, a plurality of pattern wirings are formed on the film, and each tip of these pattern wirings is arranged in a protruding state from the film to be a contact pin, and A contact probe main body having a plurality of main pattern wirings each having a distal end portion is formed, and a contact probe branch portion branched from the contact probe main body and integrally formed, and the contact probe branch portion is formed by the main probe. A technique having a branch pattern wiring formed by branching or dividing a part of the pattern wiring is employed.

This contact probe comprises a contact probe main body on which a main pattern wiring is formed, and a contact probe branch portion branched from the contact probe main body and integrally formed. Since a part of the main pattern wiring has a branch pattern wiring formed by branching, a part of the main pattern wiring is distributed to the branch pattern wiring. Therefore, the branch pattern wiring is separated from the main pattern wiring. It is possible to connect to a place. That is, even if the electrodes are concentrated on one side of the semiconductor chip or the like, the main pattern wiring connected to the electrodes on the one side is branched and divided by the branch pattern wiring and distributed to other places. In addition, since the contact probe main body and the contact probe branch portion are integrally formed, they can be formed with the same high dimensional accuracy as each other, and there is an advantage that the main pattern wiring and the branch pattern wiring are unlikely to be displaced. .

[0013] In the contact probe according to the second aspect,
2. The contact probe according to claim 1, wherein a technique of directly attaching a metal film to the film of the contact probe body is employed.

In this contact probe, even if the film is, for example, a resin film which easily absorbs moisture and stretches, a metal film is directly attached to the film. Is suppressed. In other words, the distance between the contact pins is less likely to be shifted, and the tip portion is accurately and accurately contacted with the object to be measured. Furthermore, the metal film can be used as a ground, thereby enabling impedance matching to be performed near the tip of the contact probe and preventing adverse effects due to reflected noise even when performing a test in a high frequency range. it can. That is, if the characteristic impedance between the board wiring side and the contact pin does not match in the middle of the transmission line from the tester called a prober, reflected noise will occur. In this case, the longer the transmission line with a different characteristic impedance is, the larger the reflected noise will be. There is a problem that occurs. Reflected noise causes signal distortion, and tends to cause malfunction at higher frequencies. In the present contact probe, by using the metal film as the ground, the deviation of the characteristic impedance from the substrate wiring side can be minimized to the vicinity of the contact pin tip, and the malfunction due to the reflection noise can be suppressed.

According to a third aspect of the present invention, the contact probe according to the first or second aspect and a plurality of substrate sides connected to the middle and rear ends of the main pattern wiring and the branch pattern wiring in a contact state, respectively. A technique including a wiring substrate having a pattern wiring and a supporting member for supporting each end portion is adopted.

In this probe device, since the board-side pattern wirings respectively connected to the main pattern wiring and the branch pattern wiring in the contact probe according to claim 1 or 2 are formed on the wiring board, the main pattern wiring is formed by the branch pattern wiring. Since the wiring is divided by the wirings, the substrate-side pattern wirings connected to these wirings are also divided and formed at different places, and the arrangement space is set with a large degree of freedom.

According to a fourth aspect of the present invention, in the probe device of the third aspect, the wiring substrate has a rectangular opening for disposing the contact probe, and a plurality of tips of the contact probe are The contact probe main body and the contact probe branch portion are arranged along two diagonal lines of the rectangular opening, and are respectively distributed to two sides of the rectangular opening facing the diagonal line, and the main pattern wiring and the branch are provided. The pattern wiring employs a technique in which each of the divided pattern wirings is connected to the substrate-side pattern wiring in a contact state.

In this probe device, since the tips of the contact probes are arranged along the diagonal line of the rectangular opening, the object to be measured, such as an IC, in which the electrodes are concentrated on one side, is placed on one side of the diagonal line. By arranging them along, the front end portion comes into contact with the electrode on one side.
Since the main body of the contact probe and the branch portion of the contact probe are distributed to the two sides of the rectangular opening to the left and right, and the main pattern wiring and the branch pattern wiring are separately connected to the substrate-side pattern wiring at the two sides. Since the pattern wiring concentrated on the electrode on one side of an IC or the like is distributed to the left and right, a large number of wirings can be divided into two sides without being concentrated on one side of the rectangular opening.

According to a fifth aspect of the present invention, in the probe device according to the third or fourth aspect, the wiring substrate has the substrate-side pattern wirings formed on a front surface and a rear surface, respectively, of the contact probe main body and the contact. The probe branching portion is arranged such that one of the portions is folded back and distributed on the front and back surfaces of the wiring substrate, and the main pattern wiring and the branch pattern wiring are disposed on the substrate-side pattern wiring to which the wiring is distributed. A technique in which each is connected in a contact state is employed.

In this probe apparatus, the main pattern wiring and the branch pattern wiring are distributed to the front and back surfaces of the wiring substrate by bending the contact probe main body and the contact probe branch portion, which are integrally formed in a film shape, for example. Since the wiring can be separately connected to the substrate-side pattern wiring on the two surfaces of the front and back surfaces of the wiring substrate, the wiring is not concentrated on one surface of the wiring substrate, and connection is facilitated by the doubled space for arranging the substrate-side pattern wiring.

According to a sixth aspect of the present invention, in the probe device according to any one of the third to fifth aspects, the strength is provided on the film of the contact probe main body and protrudes from the film shorter than the tip portion. A technology having an elastic film is employed.

In this probe device, the ferroelastic film is provided, and the ferroelastic film presses the front end side of the contact probe body from above. And a uniform contact pressure can be obtained for each pin, thereby eliminating measurement errors due to poor contact.
Further, since the contact probe of such a probe device is composed of the contact probe main body and the contact probe branch portion, it is possible to obtain an operational effect of improving the reliability of measured data.

According to a seventh aspect of the present invention, in the probe device of the sixth aspect, the film of the contact probe main body is so strong that the ferroelastic film serves as a buffer when the contact probe main body is pressed. A technology that is formed longer on the distal end side than the elastic film is employed.

In this probe device, the film is formed longer on the distal end side than the ferroelastic film, and the ferroelastic film acts as a buffer when pressing the contact probe main body. The tip of the contact pin is not distorted and curved due to friction with the elastic film, and stable contact with the object to be measured can be maintained. Further, since the contact probe of such a probe device is composed of the contact probe main body and the contact probe branch portion, not only the reliability of the measured data is improved, but also the life of the probe device as a whole is extended. It is possible to obtain the operational effect of

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a contact probe according to the present invention will be described with reference to FIGS. In these figures, reference numeral 30 denotes a contact probe, 31 denotes a resin film, 32 denotes a main pattern wiring, 33 denotes a contact probe main body, 34 denotes a contact probe branch portion, 35 denotes a branch pattern wiring, and 36 denotes a contact pin. I have.

The contact probe 30 of the first embodiment
Is for making electrical measurements by contacting the long-side electrodes of a rectangular IC chip on a wafer. As shown in FIGS. 1 and 2, one side of a polyimide resin film 31 is Ni or Ni alloy. Probe main body 33 on which a plurality of main pattern wirings 32 formed by
And a contact probe branching portion 34 which branches right and left from an intermediate portion of the contact probe main body 33 and is integrally formed. The contact probe branch portion 34 has a branch pattern wiring 35 formed by dividing a part of the main pattern wiring 32 (in the present embodiment, left and right portions) into right and left parts.

The main pattern wiring 32 has a contact pin 36 formed by projecting the tip from the end of the resin film 31. The main pattern wiring 3
In No. 2, the surface of the contact pin 36 is coated with Au (gold) to prevent oxidation of Ni.

Next, the steps of manufacturing the contact probe 30 will be described in the order of steps with reference to FIG.

[Base Metal Layer Forming Step] First, as shown in FIG. 3A, a base metal layer 38 is formed on a supporting metal plate 37 made of stainless steel by Cu (copper) plating.

[Pattern Forming Step] After a photoresist layer 39 is formed on the base metal layer 38, as shown in FIG. 3B, a predetermined pattern of photoresist is formed on the photoresist layer 39 by photolithography. The photoresist 40 is exposed by applying a mask 40, and as shown in FIG. 3C, the photoresist layer 39 is developed to remove the portions to be the main pattern wirings 32 and the branch pattern wirings 35, and to leave the remaining photoresist layer 39. An opening 39a is formed in the opening.

In the present embodiment, the photoresist layer 39 is formed of a negative type photoresist, but the desired opening 3 is formed by employing a positive type photoresist.
9a may be formed.

In the present embodiment, the photoresist layer 39 corresponds to a “mask” in the present invention. However, the “mask” in the claims of the present application is not limited to the one in which the opening 39a is formed through the exposure and development steps using the photomask 40, such as the photoresist layer 39 of the present embodiment. Absent. For example, a hole is formed in advance in a portion to be plated (that is, FIG.
(C) formed in a state indicated by reference numeral 39). In the present invention, when such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Electroplating Step] Then, FIG.
As shown in FIG. 3, Ni or Ni which becomes the main pattern wiring 32 and the branch pattern wiring 35 is formed in the opening 39a.
After the alloy layer N is formed by plating, FIG.
As shown in FIG. 7, the photoresist layer 39 is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 5, the resin film 31 is bonded to the Ni or Ni alloy layer N by an adhesive 31a except for the tip of the main pattern wiring 32 shown in FIG. Glue. This resin film 31 is a two-layer tape in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film attaching step, the metal film 500 of the two-layer tape is subjected to copper etching using a photoengraving technique to form a ground plane. Polyimide resin PI in tape
Is adhered to the Ni-Mn alloy layer N via an adhesive 31a. In addition, the metal film 500, in addition to the copper foil,
Ni or a Ni alloy may be used.

[Separation Step] Then, as shown in FIG. 3 (g), the portion composed of the resin film 31 and the main pattern wiring 32 and the branch pattern wiring 35 and the base metal layer 38 is separated from the supporting metal plate 37. Then, only the main pattern wiring 32 and the branch pattern wiring 35 are bonded to the resin film 31 via Cu etching.

[Gold coating step] Then, the exposed main pattern wiring 32 and branch pattern wiring 35 are
As shown in FIG. 3H, Au plating is performed to form an Au layer AU on the surface. At this time, the Au layer AU is formed on the entire surface of the contact pins 36 projecting from the resin film 31 over the entire circumference. Thereafter, the contact probe 30 is cut into a predetermined shape as an IC probe, whereby the contact probe main body 33 and the contact probe branch portion 34 are integrally formed.

Next, an IC chip to be measured (object to be measured)
A configuration in which the contact probe 30 corresponding to the long side of the above is assembled into a mechanical part to form a probe device (probe card) 41 will be described with reference to FIG. Since the main pattern wiring 32 and the branch pattern wiring 35 are formed on the thin resin film 31, the contact probe 30 according to the present invention is flexible and easy to bend, so that it can be easily incorporated into a probe device or the like.

As shown in FIG. 1, the mechanical parts include a mounting base (supporting member) 42, a top clamp 43, and a bottom clamp 44. First, the contact probe 30 is arranged in a central window (rectangular opening) 45a formed in the printed circuit board 45, and then a top clamp 43 in which the mounting base 42 is attached to the lower surface with bolts (not shown) is printed. The end portion of the contact probe 30 is fixed on the substrate 45 with bolts (not shown) in a state of being held therebetween. Then, the bottom clamp 44 is attached to the bottom of the printed circuit board 45 with bolts.

The contact probe body 33 of the contact probe 30 and the contact probe branch 3
4 is a top clamp 43 and a contact probe 3
Positioning is performed by bolts (not shown) that are screwed into the printed circuit board 45 through the 0 positioning holes 30a. The contact pin 36 of the contact probe 30 has two tip positioning holes 30b formed in the vicinity thereof, and is positioned by pins (not shown) that pass through the tip positioning holes 30b and are attached to the mounting base 42. Have been.

Further, the contact probe body 33
The rear end portion is disposed on one side of the printed circuit board 45 facing the contact pin 36, and both contact probe branch portions 3
Reference numeral 4 denotes rear ends disposed on both sides of one side on which the contact probe main body 33 is disposed. The main pattern wiring 32 and the branch pattern wiring 35 are connected in contact with the board-side pattern wiring (not shown) formed on each side of the printed circuit board 45.

The lower surface of the mounting base 42 is an inclined surface. By holding down the contact probe 30 with the lower surface, the contact pins 36 are maintained at a constant inclined state, and the contact pins 36 are pressed against the IC chip. ing.

In the probe device 41 constructed by the above-described assembly, each tip portion of the contact probe 30 is inclined by the mounting base 42 so that the contact pins 36 are concentrated at a predetermined angle on one side of the IC chip. Set to touch.

The probe device 41 configured as described above
When performing a probe test or the like of an IC chip by using a probe device, the probe device 41 is inserted into a prober and electrically connected to a tester, and a predetermined electric signal (input signal) is applied to a substrate on each side of the printed circuit board 45. The main pattern wiring 32 and the branch pattern wiring 35 via the side pattern wiring
Respectively. The input signals of the main pattern wiring 32 and the branch pattern wiring 35 are sent from the contact pins 36 to the IC chips on the wafer.

On the other hand, the output signal output from the IC chip to the contact pin 36 is
The signal is transmitted to the branch pattern wiring 35 and is transmitted to the board-side pattern wiring arranged on each side of the central window 45a of the printed circuit board 45. In this way, the output signal is transmitted to the tester via the board-side pattern wiring, and the electrical characteristics of the IC chip are measured.

In the contact probe 30, the contact probe main body 33 on which the main pattern wiring 32 is formed
And two contact probe branch portions 34 branched from the contact probe main body 33 and integrally formed. The contact probe branch portion 34 is formed by branching a part of the main pattern wiring 32. Since it has two branch pattern wirings 35, the main pattern wiring 32
Are distributed to the branch pattern wiring 35, so that the branch pattern wiring 35 is located at a location different from the main pattern wiring 32, that is, not on one side of the central window portion 45a where the main pattern wiring 32 is disposed, but on both sides thereof. It is possible to connect to two sides. That is, even if the electrodes are concentrated on one side of the IC chip, the main pattern wiring 32 connected to the electrodes on the one side is branched and divided by the branch pattern wiring 35 and distributed to other places.

Further, since the contact probe main body 33 and the contact probe branch portion 34 are integrally formed, they can be formed with the same high dimensional accuracy, and the main pattern wiring 32 and the branch pattern wiring 35 are misaligned. Is less likely to occur.

Therefore, the contact probe 30
In the probe device 41 incorporating the
The contact probe main body 33 and the two contact probe branch portions 34 are distributed to a plurality of sides of the central window 45a, and the main pattern wiring 32 and the two branch pattern wirings 35 are separately provided on the three sides of the central window 45a. Since it can be connected to the side pattern wiring, even in an IC chip in which a large number of electrodes are concentrated on one side, the wiring does not concentrate on one side of the central window portion 45a, and can be widened without reducing the pitch of the substrate side pattern wiring (electrode). The reduced arrangement space facilitates connection.

Next, a second embodiment will be described with reference to FIG. In this figure, reference numeral 50 denotes a contact probe, 51 denotes a contact pin, 52 denotes a contact probe main body, and 53 denotes a contact probe branch portion.

The difference between the second embodiment and the first embodiment is that, in the first embodiment, each contact pin 36 is arranged in parallel to two opposing sides of a central window 45a opened in a rectangular shape. On the other hand, in the second embodiment, the contact pin 51 of the contact probe 50 is
Are arranged along the diagonal line T.

In the first embodiment, the contact probe branches 34 are formed on the left and right sides of the contact probe main body 33, respectively, and are separately provided on the three sides of the central window 45a. One contact probe branching portion 53 is formed by being branched from one side of the contact probe main body 52, and is arranged on two sides of the central window portion 45 a facing the diagonal line T to form a main pattern wiring 54.
The difference is that the branch pattern wiring 55 and the branch pattern wiring 55 are respectively connected to the board-side pattern wiring to which the wiring pattern 55 has been distributed.

That is, in the probe device according to the second embodiment, the contact pins 5 of the contact probe 50
1 are arranged along the diagonal line T of the central window portion 45a, which is a rectangular opening, so that the IC chip I in which the electrodes are concentrated on one side can be arranged by arranging one side along the diagonal line T so that the contact can be made. The pin 51 contacts one side of the electrode.

Then, the contact probe main body 52 and the contact probe branch portion 53 are distributed to the left and right sides of the central window portion 45a, and the main pattern wiring 54 and the branch pattern wiring 55 are separately separated from the substrate side pattern at the two sides. Since it is connected to the wiring, the pattern wiring concentrated on the electrode on one side of the IC chip I is distributed to the left and right, so that a large number of wirings are divided into two sides without being concentrated on one side of the central window 45a. Can be arranged.

Next, a third embodiment will be described with reference to FIGS. In this figure, reference numeral 60 denotes a probe device, 61 denotes a contact probe, 62 denotes a contact probe main body, 63 denotes a contact probe branch, 6
Reference numeral 4 denotes a bent intermediate portion.

The difference between the third embodiment and the second embodiment is that the contact probe 50 according to the second embodiment is divided into a contact probe main body 52 and a contact probe branching portion 53 symmetrically about a contact pin 51. In contrast, the probe device 6 of the third embodiment
5, the contact probe 61 has a contact probe branching portion 63 which is branched at one side of the contact probe main body 62 via a bent intermediate portion 64, as shown in FIG.

In the probe device according to the second embodiment, the contact probe main body 52 and the contact probe branch portion 53 are arranged on two sides of the central window 45a, respectively. The probe device 60 includes a contact probe main body 62 and a contact probe branch portion 63 in the contact probe 61,
As shown in FIG. 6, the printed circuit board (wiring board) 65 is folded back at a bent intermediate portion 64 and arranged above and below a central window portion 65 a of a printed circuit board (wiring board) 65.

That is, in the probe device 60, the rear end of the contact probe main body 62 and the rear end of the contact probe branching section 63 are respectively connected to the top clamp 66.
And the bottom clamp 67 are sandwiched between the printed circuit board 65 and the rear end of the main pattern wiring 68 and the rear end of the branch pattern wiring 69 are securely connected to the substrate-side pattern wirings 70, 70 on the front and back surfaces, respectively. Is in contact with and fixed. The contact pin 7 of the contact probe 61
1 and a contact pin 71 is formed in the mounting base 73 attached to the lower surface of the top clamp 66.
2 is positioned by a pin 74 attached in a penetrating state.

Therefore, in this probe device 60,
The printed circuit board 6 is formed by folding a contact probe main body 62 and a contact probe branching portion 63 which are integrally formed in a film shape at the intermediate portion 64.
5, the main pattern wiring 68 and the branch pattern wiring 69 can be separately connected to the board-side pattern wirings 70, 70 on the two front and back surfaces of the printed board 65. Connection is facilitated by the doubled arrangement space of the board-side pattern wirings 70, 70.

Next, a fourth embodiment will be described with reference to FIGS. As shown in FIG. 7, the contact pin 36 of the contact probe 30 described in the first embodiment has a tip S1 having a normal tip, a tip S1 curved upward and a tip S2 curved downward.
Sometimes occurred. In this case, as shown in FIG.
Even if the resin film 31 is arranged on the lower surface of the mounting base 42 and the contact pins 36 are pressed against the terminals of the IC chip I, the normal end S1 and the downwardly curved end S2 come into contact with the terminals of the IC chip I. In some cases, the tip S1 curved upward may not be able to obtain a sufficient contact pressure even if it makes contact. For this reason, a contact failure of the contact pin 36 with the IC chip I occurs, and there is a problem that an accurate electrical test cannot be performed.

Therefore, in the probe device 110A according to the fourth embodiment, as shown in FIG.
The tip S1 curved upward and the tip S2 curved downward
To align with the normal tip S, the resin film 20
A ferroelastic film 400 made of an organic or inorganic material is adhered on the upper part of the contact pin 1 by an adhesive or fixing means (not shown) so that the tip of the contact pin 36 projects from the resin film 201 so as to project shorter than the contact pin 36. Together, the contact probe 200A is configured,
In this state, the ferroelastic film 400 is arranged on the lower surface of the mounting base 42, and the contact probe 200A is attached. The ferroelastic film 400 is preferably made of ceramics or polyethylene terephthalate if it is an organic material, and preferably made of ceramics, especially an alumina film if it is an inorganic material.

When the contact pins 36 are pressed against the terminals of the IC chip I, the ferroelastic film 400 presses the contact pins 36 from above, and even if the tip S1 is curved upward, the ferroelastic film 400 contacts the terminals of the IC chip I. Make reliable contact. Thereby, a uniform contact pressure is obtained for each contact pin 36.

That is, since the contact pins 36 can be reliably brought into contact with the terminals of the IC chip I, measurement errors due to poor contact can be eliminated. Further, since the contact probe 200A of such a probe device 110A is composed of the contact probe main body 33 and the contact probe branching section 34, the effect of improving the reliability of the measured data can be obtained.

Further, by changing the amount of protrusion of the contact pin 36 from the ferroelastic film 400, the contact pin 36 is pressed when the contact pin 36 is pressed.
Can be changed from above, and a desired contact pressure can be obtained with a desired pressing amount.

Next, a fifth embodiment will be described with reference to FIGS. As shown in FIG. 10, the contact probe 2 described in the fourth embodiment
Since the resin film 201 of 00A is made of, for example, a polyimide resin, it absorbs moisture and elongates, so that the interval t between the contact pins 36 may change. This makes it impossible for the contact pins 36 to come into contact with the predetermined positions of the terminals of the IC chip I, so that an accurate electrical test cannot be performed.

Therefore, in the contact probe 200B according to the fifth embodiment, as shown in FIG. 11, a metal film 500 is attached on the resin film 201,
Even if the humidity changes, the interval t between the contact pins 36, 36
Of the contact pin 36 is thereby surely brought into contact with a predetermined position of the terminal of the IC chip I.

That is, the gap between the contact pins 36 is less likely to be shifted, and the contact pins 36 are accurately and accurately contacted with the object to be measured. Note that the metal film 500 is preferably one of Ni, a Ni alloy, Cu, and a Cu alloy.

Next, a probe device 110B according to a sixth embodiment will be described with reference to FIG. That is, the contact probe 200C to be incorporated has the metal film 500 adhered on the resin film 201 as in the fifth embodiment, and the contact probe 200C is strong on the metal film 500 as in the fourth embodiment. The elastic film 400 is provided by bonding or fixing means (not shown).
A uniform contact pressure can be obtained irrespective of the curvature of the tip, and a change in the interval t between the contact pins 36, 36 can be minimized so that the electrical test can be performed accurately.

Next, a probe device 110D according to a seventh embodiment will be described with reference to FIGS. In the fourth and sixth embodiments, the ferroelastic film 400 is in press contact with the contact pins 36 during use, and the friction between the ferroelastic film 400 and the contact pins 36 is repeated by repeated use, resulting in distortion. Accumulates, the contact pin 36 bends left and right, and the contact point may shift.

Therefore, in the seventh embodiment, as shown in FIG. 13, the resin film 201 is made wider than the conventional resin film 201a and the contact pins 3
Assuming that the length of the metal film 500 protruding from the metal film 500 is X1 and the length of the wide resin film 201a protruding from the metal film 500 is X2, the contact probe 200E having the configuration of X1> X2 was employed. Then, as shown in FIG. 14, the ferroelastic film 400 is
01a, the ferroelastic film 400 is used as the soft wide resin film 20.
1a, but not directly with the contact pins 36, the contact pins 36 can be prevented from bending left and right.

Furthermore, in the probe device 110D according to the seventh embodiment, the wide resin film 201a is formed longer on the distal end side than the ferroelastic film 400, so that when the ferroelastic film 400 presses the contact pin 36, the buffer material is used. Therefore, even if the contact pin 36 is repeatedly used, the contact pin 36 is not distorted and bent due to friction with the ferroelastic film 400, and stable contact with the terminal of the IC chip I can be maintained.

Further, since the contact probe 200E of the probe device 110D is composed of the contact probe main body 33 and the contact probe branching portion 34, it is possible to obtain the effect of improving the reliability of measured data. Can be.

Note that the present invention also includes the following embodiments. (1) In each of the above embodiments, the contact probe is applied to the probe device which is a probe card.
It may be used for other measuring jigs and the like. For example, IC
The chip may be held inside for protection, and may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like.

Further, the contact probe may be cut into a predetermined shape for an LCD and incorporated into a probe device for an LCD. For example, the LCD probe device has a structure including a contact probe holding body that holds a contact probe and a frame-shaped frame that fixes the contact probe holding body, and a tip of a contact pin of the contact probe is contacted from the contact probe holding body. The measurement may be performed by projecting the tip and bringing the tip into contact with a terminal of the LCD.

(2) Although the contact probe branch portion is branched from the contact probe main body, a contact probe portion branched from the contact probe branch portion may be formed integrally.

(3) Although the contact pins of the contact probe are arranged only on one side of the IC chip to be measured, the contact probe may be arranged on other sides in the same manner. A contact probe integrally formed such that a plurality of contact pins are simultaneously arranged on the side of may be adopted. Thereby, the number of members of the probe device can be reduced.

[0075]

According to the present invention, the following effects can be obtained. (1) According to the contact probe of the first aspect, a contact probe main body on which a main pattern wiring is formed;
A contact probe branch portion that is branched from the contact probe main body and integrally formed, and the contact probe branch portion has a branch pattern wiring formed by branching a part of the main pattern wiring. Because
The branch pattern wiring can be connected to a place different from the main pattern wiring. Even if the electrodes are concentrated on one side of the semiconductor chip or the like, the main pattern wiring connected to the electrode on one side is divided by the branch pattern wiring. Can be connected to other places, and the arrangement space for the board-side pattern wiring in the wiring board can be widened. Therefore, the multi-pin narrow pitch can be achieved, and the present invention can be easily applied to a semiconductor chip or the like having various electrode arrangements in which electrodes are arranged unevenly on four sides. In addition, since the contact probe main body and the contact probe branch portion are integrally formed, they can be formed with the same high dimensional accuracy as each other, and there is an advantage that the main pattern wiring and the branch pattern wiring are unlikely to be displaced. At the same time, the assembly process and the number of parts can be reduced.

(2) According to the contact probe of the second aspect, even if the film is, for example, a resin film which easily expands by absorbing moisture, a metal film is directly attached to the film. Therefore, the elongation of the film can be suppressed by the metal film. In other words, the distance between the contact pins is less likely to be shifted, and the tip can accurately and accurately contact the object to be measured. Furthermore, in this contact probe, by using the metal film as the ground, the characteristic impedance can be matched by the substrate wiring side to the vicinity of the contact pin tip, and malfunction due to reflected noise can be suppressed.

(3) According to the probe device of the third aspect, the substrate side pattern wiring connected to the main pattern wiring and the branch pattern wiring of the contact probe of the first or second aspect is formed on the wiring substrate. Since the main pattern wiring is divided by the branch pattern wiring, the substrate-side pattern wiring connected to these is also divided and formed in separate places, and the number of the substrate-side pattern wiring in one place of the wiring substrate is reduced. And the arrangement space can be set wide and with a high degree of freedom. Therefore, the present invention can be easily applied to a semiconductor chip or the like in which a large number of electrodes are concentrated on one side without reducing the pitch of the substrate-side pattern wiring.

(4) According to the probe device of the fourth aspect, the distal ends of the contact probes are arranged along the diagonal line of the rectangular opening, and the contact probe main body and the contact probe branching portion are divided into two sides of the rectangular opening. Since the object to be measured is arranged along one side of the electrode along the diagonal line, the tip that abuts the electrode on one side is divided into left and right main pattern wiring and branch pattern wiring. Therefore, a large number of wirings can be divided and arranged on two sides without being concentrated on one side of the rectangular opening. In particular, efficient wiring corresponding to an object to be measured in which electrodes are concentrated on one side becomes possible. .

(5) According to the probe device of the fifth aspect, the contact probe main body and the contact probe branch portion are allocated to the front and back surfaces of the wiring board, and the main pattern wiring and the branch pattern wiring are separately provided for wiring. Since the wiring is connected to the substrate-side pattern wiring on the two surfaces on the front and back surfaces of the substrate, even in a semiconductor chip or the like in which a large number of electrodes are concentrated on one side, the wiring is not concentrated on one surface of the wiring substrate and the size of the wiring substrate is changed. The space for arranging the pattern wiring on the substrate side can be doubled without connection, and the connection becomes easy.

(6) According to the probe device of the sixth aspect, the ferroelastic film is provided, and the ferroelastic film presses the distal end side of the contact probe body from above, so that the distal end is curved upward. Can be reliably brought into contact with the object to be measured, and a uniform contact pressure can be obtained for each pin, so that measurement errors due to poor contact can be eliminated. Further, since the contact probe of such a probe device is composed of the contact probe main body and the contact probe branch portion, it is possible to obtain an operational effect of improving the reliability of measured data.

(7) According to the probe device of the seventh aspect, the film is formed longer on the distal end side than the ferroelastic film, and the ferroelastic film becomes a buffer when the contact probe body is pressed. Therefore, even when repeatedly used, the tip portion, which is a contact pin, is not distorted and curved due to friction with the ferroelastic film, and stable contact with the object to be measured can be maintained. further,
Since the contact probe of such a probe device is composed of the contact probe main body and the contact probe branch portion, not only the reliability of the measured data is improved, but also the life of the entire probe device is extended. The operation and effect can be obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a probe device incorporating a first embodiment of a contact probe according to the present invention.

FIG. 2 is a plan view showing a connection between a main pattern wiring and a branch pattern wiring in the first embodiment of the contact probe according to the present invention.

FIG. 3 is a fragmentary cross-sectional view showing a method of manufacturing the contact probe according to the first embodiment of the present invention in the order of steps.

FIG. 4 is a schematic plan view showing a probe device incorporating a second embodiment of the contact probe according to the present invention.

FIG. 5 is a plan view showing a third embodiment of the contact probe according to the present invention.

FIG. 6 is a sectional view of a main part showing a probe device incorporating a third embodiment of the contact probe according to the present invention.

FIG. 7 is a step view showing the conventional disadvantages of a contact probe with respect to the fourth embodiment of the probe device according to the present invention.

FIG. 8 is a step view showing the conventional disadvantages of the probe device with respect to the fourth embodiment of the probe device according to the present invention.

FIG. 9 is a step view showing a fourth embodiment of the probe device according to the present invention.

FIG. 10 is a sectional view of a fourth embodiment of the contact probe according to the present invention, taken in a direction perpendicular to the contact pins.

FIG. 11 is a sectional view showing a fifth embodiment of the contact probe according to the present invention.

FIG. 12 is a step view showing a probe device in a sixth embodiment of the probe device according to the present invention.

FIG. 13 is a step view showing a contact probe in a probe device according to a seventh embodiment of the present invention.

FIG. 14 is a step view showing a seventh embodiment of the probe device according to the present invention.

FIG. 15 is a perspective view of a main part showing a conventional example of a contact probe according to the present invention.

FIG. 16 is an exploded perspective view showing an example of a probe device incorporating a conventional example of a contact probe according to the present invention.

FIG. 17 is a perspective view of an essential part showing an example of a probe device incorporating a conventional example of a contact probe according to the present invention.

FIG. 18 is a sectional view taken along line EE of FIG. 17;

[Explanation of symbols]

30, 50, 61 Contact probe 31 Resin film 32, 54 Main pattern wiring 33, 52, 62 Contact probe body 34, 53, 63 Contact probe branch section 35, 55 Branch pattern wiring 36, 51 Contact pin (tip) 41, Reference Signs List 60 Probe device 42 Mounting base (supporting member) 45, 65 Printed circuit board (wiring substrate) 45a, 65a Central window (rectangular opening) 64 Bending intermediate portion 70 Board-side pattern wiring 110A, 110B, 110D Probe device 200A, 200B , 200C, 200E Contact probe 201 Resin film 201a Resin film (wide resin film) 400 Strong elastic film 500 Metal film T Diagonal line

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Noriyoshi Tachikawa, 12th Techno Park, Mita City, Hyogo Prefecture Sanritsu Materials Co., Ltd.Mita Plant (72) Inventor Hideaki Yoshida 12th Techno Park, Mita City, Hyogo Prefecture Noroku Sanritsu Material Co., Ltd. Mita Plant

Claims (7)

[Claims] 1. A contact probe in which a plurality of pattern wirings are formed on a film, and each tip of the pattern wiring is arranged in a protruding state from the film to be a contact pin, and the plurality of pattern wirings each having the respective tip end. And a contact probe branch portion branched from the contact probe body and integrally formed. The contact probe branch portion has a part of the main pattern wiring. A contact probe having a branch pattern wiring formed by being branched or divided. 2. The contact probe according to claim 1, wherein a metal film is directly attached to a film of the contact probe main body. 3. A wiring board, comprising: the contact probe according to claim 1; and a plurality of board-side pattern wirings respectively connected to a middle or a rear end of the main pattern wiring and the branch pattern wiring in a contact state. And a support member for supporting each of the distal end portions. 4. The probe device according to claim 3, wherein the wiring substrate has a rectangular opening for disposing the contact probe, and a plurality of tips of the contact probe are formed on a diagonal line of the rectangular opening. The contact probe main body and the contact probe branch portion are respectively distributed and arranged on two sides of the rectangular opening facing the diagonal line, and the main pattern wiring and the branch pattern wiring are distributed. A probe device, wherein each of the probe devices is connected to the substrate-side pattern wiring in a contact state. 5. The probe device according to claim 3, wherein the wiring substrate has the substrate-side pattern wiring formed on a front surface and a rear surface, respectively. One part is folded back and distributed on each of the front and back surfaces of the wiring substrate, and the main pattern wiring and the branch pattern wiring are connected to the allocated substrate-side pattern wiring in a contact state, respectively. A probe device. 6. The probe device according to claim 3, further comprising a ferroelastic film disposed on a film of the contact probe main body and protruding from the film shorter than the tip portion. A probe device characterized by the above-mentioned. 7. The probe device according to claim 6, wherein the film of the contact probe main body is located closer to the distal end than the ferroelastic film so as to serve as a buffer when the ferroelastic film presses the contact probe main body. A probe device characterized by being formed long.