JPH09116286A - Cooling device for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool scattered elements generating large quantities of heat without increasing the noise produced from a fan. SOLUTION: Cooling air sent from an axial or cross flow fan producing relatively low noise is sent to an electronic circuit board 15,... through columnar members 20 and, at the same time, the cooling air is shaped into a thin laminar flow when the cooling air passes through the group of the members 20 so that the laminar flow can come into collide with the elements of the circuit board 15, such as a CPU 16, memory, etc., in an accelerated state. Since the cooling air from the fan is directly brought into collision with the high-temperature heat generating elements without pressure loss, the elements can be cooled efficiently and the circuit board 15 which is positioned perpendicularly to the laminar flow can also be cooled well.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device, and more particularly, it uses a low noise fan such as an axial flow fan or a cross flow fan to generate a thin layered cooling air for an element having a large heat generation amount. It relates to a cooling device configured to be sprayed.

[0002]

2. Description of the Related Art In a conventional electronic device, for example, as disclosed in Japanese Utility Model Publication No. 6-42387, the electronic device is installed at an inlet or an outlet of a housing for accommodating a power supply device and many electronic circuit boards. A method of collectively cooling the inside of the housing by using a cooling fan (mainly an axial fan) is used. However, when using such a cooling method,
In order to cool some of the elements that generate a large amount of heat,
Since it is necessary to use a fan having a large capacity, the cooling efficiency is deteriorated in a portion where the cooling air is not guided well, and there is a problem of noise generated from the large fan.
Therefore, in order to solve the above-mentioned problems, it has been attempted to perform jet cooling for cooling the element that generates heat, as disclosed in Japanese Patent Publication No. 57-25980. In the case of this conventional example, a small hole opened in the chamber is used in order to generate a jet flow in the flow of the cooling air, but in response to the large pressure loss of the cooling air, a blower type high pressure fan is used. Is used.

[0003]

However, in the above-mentioned conventional example, when a blower type high pressure fan is used to cool an electronic device, there is a problem that noise generated from the fan becomes large. Further, in a conventional electronic device, for example, as disclosed in Japanese Patent Publication No. 3-62039, an electronic circuit board is mounted on a plate so as to be parallel to the flow direction of cooling air. However, it is considered to arrange the electronic circuit boards on the front side and the back side of the plate to transmit electric signals efficiently. In that case, the electronic circuit boards mounted on one surface of the plate should be It is arranged so as to be perpendicular to the flow of. However, when the electronic circuit board is arranged perpendicular to the flow direction of the cooling air,
There is a problem in that air does not sufficiently flow between the electronic circuit boards and stagnation occurs, so that the elements arranged on the electronic circuit boards are not sufficiently cooled. Therefore, in order to prevent such stagnation of air, it is possible to arrange a dedicated fan, but increasing the number of fans causes a problem that noise generated from the fans increases. In addition, reliability also has a problem in terms of cooling efficiency due to the flow of cooling air.

The present invention solves the problems of the conventional cooling device for an electronic device as described above. For the elements having a large heat generation scattered inside the device without increasing the noise of the fan, An object of the present invention is to provide a cooling device for an electronic device, which guides the accelerated cooling air through a cooling air guide member to efficiently cool the electronic device.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a cooling device for an electronic device in which a large number of electronic circuit boards, a power supply device, and fans for cooling them are arranged inside a housing. In the invention according to claim 1 of the present invention, a CPU and a plurality of memories are mounted on an electronic circuit board arranged in parallel to the flow of cooling air inside the housing, and the CPU has In an electronic device to which a heat sink is attached and a fan is arranged on the upstream side and / or the downstream side of the flow of cooling air with respect to the electronic circuit board group, the electronic device is provided on the upstream and downstream sides of the cooling air for each electronic circuit board. Columnar guides are arranged parallel to the circuit board and sandwich the electronic circuit board. In the second aspect of the present invention, the cross-sectional shape of the columnar guide described in the first aspect is streamlined. Also. In the invention according to claim 3 of the present invention, the columnar guide is formed integrally with a metal plate for holding a guide rail for fixing the electronic circuit board.

According to a fourth aspect of the present invention, a CPU and a plurality of memories are mounted on an electronic circuit board arranged in parallel with the flow of cooling air inside the housing, and the CPU is provided. The present invention relates to an electronic device in which a heat sink is attached, and an axial fan for cooling the electronic circuit board group and the power supply device is arranged on the upstream side or the downstream side or both of the flow of the cooling air. A cross-flow fan is disposed on a side surface of the electronic circuit board group, a discharge port of the cross-flow fan is provided toward the electronic circuit board, and a longitudinal direction of the discharge port of the fan covers the electronic circuit board group. There is. According to a fifth aspect of the present invention, in addition to the fourth aspect, the CP arranged on the electronic circuit board
A large number of flat plate fin groups are arranged at a constant interval on the heat sink provided for U, and the directions of the flat plate fin groups of the heat sink are parallel to the discharge air flow from the cross flow fan. Furthermore, in the invention described in claim 6,
A large number of flat plate fin groups are arranged at a constant interval on a heat sink provided for the CPU arranged on the electronic circuit board, and the direction of the flat plate fin groups of the heat sink is set to the direction of the cooling air passing between the fin groups. It is provided so as to be inclined with respect to the electronic circuit board so that the flow is directed obliquely to the upstream side. In addition to the above configuration, in the invention according to claim 7 of the present invention, a threshold plate is disposed between the cross flow fan and the electronic circuit board group, and the threshold plate is provided on the opposite side of the discharge port of the cross flow fan. A cover having an opening on the air supply side is provided so as to face with.

Since the invention according to claim 8 of the present invention relates to a rack-mounted casing in which a large number of electronic circuit boards and power supply devices and a unit provided with a fan for cooling them are stacked, a crossflow fan is provided. Is installed on the most downstream side of the unit, and the discharge port of the fan is arranged upward. In addition, in the invention described in claim 9, in addition to claim 8, in addition to the electronic circuit board in the unit, in the upstream and downstream parts of the flow of the cooling air, in parallel with the electronic circuit board, and the electronic circuit board. A columnar guide is provided so as to sandwich.

According to the invention of claim 10 of the present invention,
A large number of electronic circuit boards and plates, a power supply device, and a fan for cooling them are arranged inside a housing, and an axial fan for cooling the electronic circuit board group and the power supply device is provided inside the housing. The present invention relates to an electronic device arranged on the upstream side or the downstream side or both of the flow of cooling air, and the electronic circuit board group is connected to one surface of the plate so as to be parallel and perpendicular to the flow direction of the cooling air. , An electronic circuit board group is connected to the other surface of the plate so as to be parallel and parallel to the flow of the cooling air, and the upstream side of the flow of the cooling air with respect to the electronic circuit board group arranged on one surface of the plate. A threshold plate is provided in the vicinity, and a duct extending downstream of the threshold plate and covering a part of the electronic circuit board group is provided.

With the above-described structure, in the present invention, a fan having low noise, such as an axial flow fan or a cross flow fan, but having a characteristic of rapidly reducing the flow rate in a flow path system with a large pressure loss is provided. It can be used to configure a cooling device. Then, by using a fan having such characteristics to blow cooling air directly to the high heat generating element, it is possible to secure an air volume necessary for cooling without causing a pressure loss in the middle of the flow path system. It is possible to configure a cooling device for an electronic device capable of performing the above. Further, claim 1 of the present invention
According to the invention described in any one of claims 1 to 3, the electronic circuit boards arranged in multiple stages inside the housing can be formed into a thin layer through a row of columnar guides, and a cooling air flow in an accelerated state can be blown. . As the columnar member, those having an arbitrary cross-sectional shape can be arranged at a predetermined interval, or can be formed integrally with a metal plate for holding a guide rail for fixing the electronic circuit board.

In the invention according to claims 4 to 6 of the present invention, a CPU and a plurality of memories are mounted on an electronic circuit board arranged in parallel to the flow of cooling air inside the housing, and A cooling operation is performed by disposing a cross-flow fan on a side surface of the electronic circuit board group and providing a discharge port of the cross-flow fan toward the electronic circuit board with respect to a device having a heat sink attached to the CPU. Is configured to do. The heat sink provided for the CPU arranged on the electronic circuit board is provided with a large number of flat plate fin groups at regular intervals so that the flat plate fin groups of the CPU are horizontally oriented or inclined. By arranging in such a manner, the flow of the cooling air can be guided and the cooling effect can be improved.

In the inventions set forth in claims 8 and 9 of the present invention, there is provided a rack mount case in which a large number of electronic circuit boards and power supply devices and a unit provided with a fan for cooling them are stacked. When configuring, a fan is arranged in the cooling air discharge part for each unit, and a columnar guide is arranged inside the unit, so that a good cooling effect can be achieved for the heating elements arranged inside. Be able to do it. Further, in the invention described in claim 10 of the present invention, in a device in which boards are arranged on both front and back surfaces of a plate and a large number of electronic circuit boards are provided, the electronic circuit board group is parallel to one surface of the plate and is provided with cooling air. By providing a means for guiding the flow of the cooling air sideways to those connected so as to be perpendicular to the flow direction, the cooling action for each electronic circuit board can be achieved by using a separate fan. I am trying to do without.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION A cooling device for an electronic device according to the present invention will be described with reference to the illustrated example. FIG. 1 shows one embodiment of the present invention.
1 is a cross-sectional view showing an embodiment, in which an electronic device 1 has a large number of electronic circuit boards 15 ... Inside a housing 2 via a plate 11 and a power supply device having a large amount of heat generation below the housing 2. 10, 10a, etc. are arranged. Further, an upper opening 3 is formed in the upper part of the housing 2 and a lower opening 4 is formed in the lower part thereof, and a large number of fans 5 corresponding to the upper opening 3 ...
Are arranged to form a system for exhausting heat inside the housing, a fan 7 is provided in the lower portion of the housing corresponding to a member such as an electronic circuit board, and a plurality of fans 6, 6a are provided at arbitrary positions in the middle. Are arranged. Then, inside the housing 2, the air sucked from the lower opening 4 by the fans 6, 7 ... Is passed between the elements to be cooled and discharged from the upper opening 3 by the fan 5.

The electronic components arranged in the electronic device 1 include a board 13 through a connector 12 with respect to a plate 11.
Are arranged, and the electronic circuit boards 15 are arranged on the board 13 via the connectors 14. In the embodiment of the present invention, a large number of electronic circuit boards are arranged in parallel in the depth direction of the drawing, and each electronic circuit board 15 ...
A CPU 16 and a plurality of memories 18 are mounted on the ... And a heat sink 17 is attached because the CPU 16 has a large amount of heat generation. The CPU 16 mounted on the electronic circuit board 15 has a heat generation amount of several tens to one.
Since it is as large as 00 W, the heat sink 17 is configured by mounting a plurality of flat plate fins via a heat pipe to improve the heat radiation efficiency.

In the embodiment of the present invention, the heat sink 17 attached to the CPU can be constructed by arranging a large number of flat plate fins with respect to the heat pipe. Further, a metal plate member having a wall thickness of 0.15 to 0.5 mm is used as the flat plate fin arranged on the heat sink 17 in a range of 0.5 to 0.5 mm.
It is possible to use a structure in which they are arranged in parallel at intervals of 2.0 mm. Further, as the heat sink 17, a pin fin may be used, but in addition, a disc made of a metal having a large heat transfer coefficient may be integrally attached to the heat pipe at a predetermined interval. .

In addition to the CPU, in the memory 18 as well, it is necessary to attach a heat sink to radiate heat for a large amount of heat generation. As the heat sink, there is a pin fin or a heat sink arranged in the CPU. Similar ones can be used. With the recent increase in the speed of information processing in the memory 18,
The amount of heat generated from the memory tends to increase. For example, when the amount of heat generated by one memory is about 2 W, cooling air of 2 m / sec is required near the memory. Further, when the heat generation amount of the memory is 2.7 W, it is necessary to set the cooling air to about 5 m / sec. In order to perform a sufficient cooling action on the memory, it is necessary to blow the cooling air directly. In addition, it is often necessary to dissipate heat via a heat sink. In the electronic device 1 shown in FIG. 1, the fan 6 may be omitted depending on conditions such as the size of the housing 2 and the number of heat generating members such as elements housed therein. It is also possible to omit the fans 6a, 7 and the like arranged in the middle, and configure a device that performs the function of exhausting heat inside the housing 2 only by the upper fan 5.

Further, in the present embodiment, the heat generated from the CPU 16 is generated by the plate member at the tip of the heat sink 17 via the heat pipe, so that it is mounted on the electronic circuit board 15 in the illustrated state. The heat that is warmed up by the heat sink is not applied to the memory or the like that operates, and the cooling condition for the memory is relaxed. However, the present invention is not limited to heat radiation from the CPU by a heat sink using a heat pipe, and in addition, heat radiation from the heating element can be performed using any heat radiation member. Further, in addition to the case where the flow of the cooling air inside the housing is set in the vertical direction, when the flow of the cooling air is directed in the horizontal direction, the heat sink is arranged for the CPU to radiate heat. It is possible to apply the means, and in that case, as will be described later, it is also solved by additionally providing means for setting the flow of the cooling air in the housing in correspondence with the heat radiating member of the heat sink. can do.

A large number of columnar members 20 ... Are arranged in parallel in the depth direction between the electronic circuit boards and the like arranged inside the housing so as to correspond to the heat radiation to each heat generating element as described above. The relationship between the electronic circuit board and the columnar member shown in FIG. 1 is configured as shown in FIG. 2, and a large number of electronic circuit boards 1 are arranged in parallel in the depth direction of FIG.
In the state where the cooling air is squeezed between the columnar members, the group of guide members constituted by the columnar members 20 and the groups of 20A and 20B are respectively arranged in the upstream and downstream portions of the cooling air with respect to the group 15A of No. 5. The speed of the flow is accelerated to form an AF of high-speed cooling air for the elements such as the CPU 16 provided on the electronic circuit board 15. Further, for another electronic circuit board group 15B arranged upstream of the electronic circuit board group 15A, a columnar member group 20C is arranged upstream of the cooling air to accelerate the cooling air. The cooling air flow AF1 is blown.
In the example shown in FIG. 2, in the group for narrowing the cooling air formed by the columnar members, the cross-sectional shape of each columnar member is formed in a streamline shape, and the cooling air is cooled from the upstream side to the downstream side. It is configured to guide in a state where the wind is squeezed. Then, the flow of the cooling air passing between the columns of the columnar member is guided along the periphery of the member having the streamlined cross section, so that the pressure loss due to the resistance of the columnar member is set to be small. The cooling air passing between the groups of (1) and (2) contacts the electronic circuit board in a state of being accelerated, and the function of removing heat from the heat generating element can be performed in a good state.

As the columnar member, the cross-sectional shape of each individual member can be configured to have a cross-sectional shape as shown in each of the columnar members 21 to 27 shown in FIG. It can be made of any material. In the example shown in FIG. 3, the columnar member indicated by reference numeral 21 is a plate-shaped member having a narrow width. By arranging the plate-shaped columnar members 21 in a row at a predetermined interval, cooling air is generated. It can be narrowed to form a narrow laminar flow, and high-speed cooling air can be blown to the electronic circuit board. Further, the columnar member indicated by the reference numeral 22 is configured to have a substantially triangular cross section, and the corner portions are positioned on the upstream side of the flow of the cooling air so that the slope portions on both sides guide the cooling air. Deploy. The cooling air can be accelerated by performing a throttling action on the cooling air passing between the columnar members 22 arranged in a large number in the lateral direction at the slopes between the columnar members. Further, the columnar member indicated by reference numeral 23 is configured to have a substantially V-shaped cross section, and similarly to the case of the columnar member 22, the corner portion is arranged toward the upstream side of the flow of the cooling air, It accelerates and guides the laminar flow of cooling air.

In addition to the above-mentioned columnar members, the columnar members used in the present invention have a prismatic shape like the columnar member indicated by reference numeral 24, or a columnar shape like the columnar member 25. The columnar member 26 may have an elliptical shape, or the columnar member 27 may have a semicircular cross section. Further, in the columnar member 24, in addition to arranging the plane portion at a right angle to the upstream portion with respect to the cooling air flow AF and arranging both side surfaces in parallel to the cooling air flow AF, It is also possible to position the corner portion on the upstream side of the flow of the cooling air and perform the action of restricting the flow of the cooling air by the slope portion. In addition, the columnar member 24 may be formed in a rhombic cross section so that the inclined surface portion guides the cooling air flow while narrowing it.

In the case where the columnar member has a circular cross section in addition to the prismatic structure as described above, the arc surface is positioned upstream of the flow of the cooling air to guide the cooling air. And the function of the diaphragm can be exhibited well. Further, when the columnar member 26 is configured to have an elliptical cross-section, the columnar member may be arranged in any direction in addition to positioning and positioning the major axis parallel to the flow AF of the cooling air. By positioning 26, the degree of throttling with respect to the flow of cooling air can be appropriately set. Then, by disposing the columnar members having the above-described configuration so as to correspond to the group of electronic circuit boards as shown in FIG. 2, the flow of the cooling air passing between the columnar members is narrowed to a thin layer, and The accelerated cooling air flow is blown onto the circuit board. Therefore, the air having a sufficient speed to dissipate the heat can be circulated to the heat generating elements such as the CPU and the memory arranged on the electronic circuit board, and the heat generation can be achieved without improving the performance of the fan. It is possible to perform the cooling action on the element that operates in a good state.

As shown in FIGS. 2 and 3, in addition to the columnar member having a columnar member having an arbitrary cross section, in the present invention, as shown in FIG. 4, a columnar member as a columnar guide is used. The member may be integrated with the metal plate 30 for holding the guide rails 31 for fixing the electronic circuit boards 15 ... An opening 32 is formed in the sheet metal 30 except for a portion where the guide rail 31 is attached, and columnar members 33 are attached to the opening at arbitrary intervals to form a cooling air flow in layers. The electronic circuit board 15
To be able to blow a flow of cooling air against. In addition to forming the columnar member integrally with the sheet metal, by mounting the columnar member 34 as a separate body in the opening 32 of the sheet metal 30, the flow of the cooling air can be reduced. , Can be set to accelerate.

The example shown in FIG. 5 shows the structure of another embodiment of the device of the present invention. In the lower part of the housing 2, power supply devices 10 and 10a, etc., which generate a large amount of heat, are arranged, and in the upper part. A large number of electronic circuit boards 15 ... Are arranged via the plate 11 to constitute the electronic device 1a. In the electronic device 1a, an upper opening 3 is formed in the upper part of the housing 2 and a lower opening 4 is formed in the lower part, and a plurality of fans 5 as axial fans corresponding to the upper opening 3 are provided. Arranged to form a system for exhausting heat inside the housing, inside the housing 2, the air sucked from the lower opening 4 is passed between the elements to be cooled,
A fan 5 is used to discharge from the upper opening 3. The electronic components arranged in the electronic device 1a are arranged on the plate 11 via the connectors 12 and the boards 13 ... And on the board 13 via the connectors 14 and the electronic circuit boards 15. However, a large number of the electronic circuit boards 15 are arranged in parallel on the back side of the drawing. And each electronic circuit board 15 ... has a CPU
16 and a plurality of memories 18 ...
Since the PU 16 generates a large amount of heat, a heat sink is attached to the PU 16 so that the PU 16 can radiate heat. In the illustrated example, the heat sink is arranged with respect to the CPU, but in the illustrated state, the CPU and the heat sink are arranged in an overlapping state, and therefore the reference numeral is C.
Only PU 16 is shown.

In the electronic device 1a shown in FIG. 5, a cross flow fan 42 is arranged for each of the electronic circuit boards 15 ... And a threshold plate 41 is arranged on the discharge port side of the cross flow fan 42. A cover 40 is arranged on the opposite side to form a duct for each fan 42. Further, the opening of the discharge port formed on the threshold plate 41 of the fan 42 is formed to have a width that covers an area corresponding to a group of a large number of electronic circuit boards 15 ... There is. One or both of the threshold plate 41 and the cover 40, which are arranged corresponding to the cross-flow fan, can favorably perform the action of blowing the cooling air to the electronic circuit board or when the fan noise is not so noticeable. There is no need to provide it.

In the electronic device constructed as described above, the cooling air discharged in layers from the cross flow fan 42 is blown directly onto the electronic circuit board from the discharge port of the fan, so that the cooling air discharged from the fan is shielded. There is no pressure loss due to the members. Then, the cooling air blown to the electronic circuit board 15 then flows along the board 13 and is sucked by the fan 5 on the upper part of the housing, and the buoyancy of the heated air causes the cooling air to flow from the upper opening of the housing 2. It is discharged outside the aircraft. The cooling air discharged from the fan and hitting the electronic circuit board is, for example, 5 to 6 m / sec.
When the speed is set to the above speed, the wind speed is sufficient for cooling the elements such as the CPU 16 and the memory 18 mounted on the electronic circuit board 15. Therefore, when a large number of fans as shown in FIG. 5 are used, it is not necessary to attach a heat pipe to the heat sink, which makes it possible to reduce the manufacturing cost of the electronic circuit board, It is also advantageous in terms of obtaining reliability of heat release of.

In this embodiment, since the cross-flow fan is arranged at a position separated from the electronic circuit board via the threshold plate, the air heated by passing through the electronic circuit board is returned to the fan. It is possible to prevent a decrease in cooling efficiency without causing a problem such as suction. Also, when omitting the threshold plate or cover for the fan, make sure that no inconvenient phenomenon such as short path occurs in the flow of the cooling air, and the heated air is sucked into the fan again. It is necessary to prevent it from passing through the cooling path.
Furthermore, in this embodiment, since the cover is arranged for the fan, the noise of the fan does not directly leak to the outside, and it is possible to obtain an electronic device with low noise and high cooling efficiency. . In addition, when configuring a device of the type that blows cooling air from the side of the electronic circuit board, the CPU
Since the memory is not located on the downstream side of, the deterioration of the cooling condition for the memory is solved.

The example shown in FIG. 6 is a modification of the example shown in FIG. 5, in which the heat sink 17 is arranged in an inclined state with respect to the CPU 16 arranged on the electronic circuit board 15, and the cooling air flow AF is obtained. Allows the fins of the heat sink 17 to have a good cooling effect. In the example shown in FIG. 6, the cross-flow fans 42 are arranged so as to correspond to the electronic circuit boards 15, but the electronic circuit boards 15 are arranged in a state of being arranged in parallel in the depth direction of the drawing. One fan 42 is configured to perform a cooling action on a group of electronic circuit boards. In the electronic device, the board 13 is attached to the plate 11 via the connector 12, and the electronic circuit board 15 is attached to the board 13 via the connector 14.
The mounting of is similar to that of each of the embodiments of the present invention. Further, the fan 42 is provided so as to be covered with the threshold plate 41 and the cover 40.
It is also possible to arrange a separate cover 43 as a cover member for the fan itself to guide the flow of cooling air.

As described above, when the fans are combined and arranged beside the group of electronic circuit boards, the cooling air is blown toward the electronic circuit boards from the opening provided in the threshold plate 41. Then, the flow AF of the cooling air blown out from the fan 42 hits a fin as a heat radiating plate of the heat sink 17 and is then turned obliquely upward along the board 13 to be discharged from the upper opening of the housing by the fan 5. To be done. Further, since the fins of the heat sink 17 are inclined with respect to the discharge port of the fan 42,
The flow of the cooling air becomes turbulent in the fins, and the cooling efficiency can be improved. Further, the flow of the cooling air that has passed through the heat sink is guided obliquely upward, so that it can be easily discharged by the fan arranged in the upper part of the housing.

The example shown in FIG. 7 is another embodiment of the present invention, in which the electronic device 1b has a plurality of units 50, 50a, 50.
b ... are stacked in the height direction to form a so-called rack mount system. In each unit, as shown in the unit 50, the electronic circuit boards 15 ... Are arranged laterally with respect to the board 13, and the columnar members 20 are provided at the upstream and downstream portions of the flow of the cooling air with respect to each electronic circuit board. Two
The groups 0a ... Are arranged so that they can act as guides for the flow of cooling air. Further, disposing the CPU 16 provided with the heat sink 17 and a plurality of memories and the like on each of the electronic circuit boards 15 ... Is constructed in the same manner as in each of the embodiments. Further, in the unit 50, the opening 51 is arranged on one side and the cross flow fan 42 is arranged on the other side, and the opening 5 is formed.
The air sucked from No. 1 is discharged upward by the fan 42. Inside the housing 2 of the electronic device 1b, an upper opening 53 is arranged in the upper part and an opening 52 is arranged in the lower part so as to correspond to the fans arranged in the respective units, and the flow of the cooling air of the entire device. A space 54 for guiding the vehicle is provided.

As described above, in the electronic device 1b constructed by stacking a plurality of units, inside each unit, the cooling air is sucked from the side opening 51 by the action of the fan 42, and the cooling air is sucked to each electronic circuit board. A columnar member 2 that performs cooling action on the upstream side of the electronic circuit board.
When passing through the zero portion, the flow of the cooling air is formed into a thin layer and contacts the electronic circuit board in an accelerated state.
Further, for the next group of electronic circuit boards, the cooling air is formed again in layers by the group of pillars of the two columnar members 20a and 20b on the upstream side thereof, so that the cooling effect on the heat sink and the memory is good. It can be done in any condition. Inside each unit, the electronic circuit boards arranged side by side are cooled and then discharged by the fan 42. Since it is exhausted toward 53, the air that has passed through each unit and has been warmed can be easily exhausted. As shown in FIG. 7, when the electronic device is configured as a device in which a plurality of units are stacked, the electronic circuit board can be individually cooled inside each unit, and the electronic device can be cooled. It is also possible to apply means such as adding a unit arbitrarily when expanding the function of.

The examples shown in FIGS. 8 and 9 show still another embodiment of the present invention, in which openings 3 and 4 are formed at the top and bottom of the housing 2, and the axial fan 5 is made to correspond to the openings. , 6 are arranged, and a large number of boards 13, 13A are arranged on the front and back sides of the plate 11 inside the housing to form the electronic device 1c. A threshold plate 62 is provided on the front side of the plate 11.
Horizontal boards 13 are arranged via a plurality of boards, and a large number of boards 13A are arranged in the vertical direction on the back surface side, and a large number of electronic circuits are arranged on each board in the same manner as in the above embodiments. The board is attached via a connector. The plate 1
In the board 13A arranged on the back side of 1 ..., a large number of boards are arranged in parallel in the vertical direction, and therefore, between the fan 6 arranged in the lower part and the fan 5 arranged in the upper part. The flow of cooling air flowing through the boards flows upward between the boards. Furthermore, the board 13A ...
When an auxiliary means such as arranging a member for accelerating the cooling air flow AF1 such as a columnar member to form a layered structure is provided between the ... Between, the cooling effect by the fan should be exhibited in a good state. Will be possible.

Apart from the vertical board 13A ...
In the horizontal board 13 arranged on the front surface side of the plate, it is necessary to provide auxiliary means as described below in order to guide the flow of the cooling air above the threshold plate 62. Therefore, in the example shown in FIGS. 8 and 9, with respect to the group of boards 13 arranged on the front surface side of the plate 11, the lower part is fixed to the inside of the housing or any supporting member, and the upper part is directed to the plate. A swash plate 60 that is inclined is arranged. And, the swash plate 60 and the electronic circuit board arranged on the front surface side of the plate constitute a duct 61,
It constitutes a means for guiding the flow AF of the cooling air on the back surface side of the plate. Therefore, for the group of the boards 13 ..., The flow of the cooling air guided in the duct 61 in the ascending direction enters between the horizontal boards and moves laterally as it is, without the swash plate 60. As the fan rises from the position toward the fan 5, the same cooling action as when the fan is directly arranged on each horizontal board can be exerted.

In this embodiment, the position where the swash plate is provided is not limited to the position corresponding to the end portion of the board, as shown in FIG. Arrangement positions of arbitrary swash plates can be set such that swash plates are arranged corresponding to the end portions. As described above, the number of fans can be increased by guiding the flow of the cooling air with the swash plate without using a separate fan for a number of boards arranged vertically in the horizontal state. It is possible to prevent the noise problem from occurring and increase the cooling effect on the electronic circuit board in a good state without increasing the noise. In this embodiment,
A device in which the flow of cooling air inside the housing is set up and down, and a means for guiding the flow of cooling air to each board when the boards are arranged perpendicularly to the direction of the cooling air flow is explained. However, the guidance of the cooling air flow by the swash plate is applied in the same manner when the board is arranged in the vertical direction in a device in which the cooling air flow is set in the lateral direction of the housing. Is possible.

Further, in the above-described embodiment, the swash plate may be arranged such that two or more swash plates having an arbitrary width are arranged above the threshold plate with an arbitrary interval. And, if the cooling air flow is guided upward from the side portion of the swash plate and the cooling action for the elements of the electronic circuit boards arranged on a large number of boards can be exhibited in a good state, the shape of the threshold plate The inclination state and the arrangement interval can be arbitrarily selected.

[0034]

Since the device of the present invention is constructed as described above, it can be used like an axial fan or a cross fan.
A cooling device can be configured by using a fan that has low noise but has a characteristic of rapidly reducing the flow rate in a flow path system with a large pressure loss. Then, the cooling air is blown directly to the high heat generating element by using the fan having the characteristics as described above, so that the amount of air required for cooling is secured without generating a pressure loss in the middle of the flow path system. It is possible to configure a cooling device for an electronic device that can perform the above. Further, in the present invention, a large number of columnar members are arranged upstream of the flow of the cooling air with respect to the elements that generate a large amount of heat and are scattered inside the housing to form the flow of the cooling air in a thin layered form. Along with
It is possible to accelerate and cool the element, and it is possible to efficiently perform the cooling action without providing a large number of fans.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of an electronic device of the invention.

FIG. 2 is an explanatory diagram showing a relationship between a columnar member arranged in the apparatus of FIG. 1 and an electronic circuit board.

FIG. 3 is an explanatory diagram showing a configuration of a columnar member applicable to the present invention.

FIG. 4 is an explanatory view of a modified example of the columnar member of the present invention.

FIG. 5 is an explanatory diagram showing a configuration of a second exemplary embodiment of the present invention.

6 is an explanatory diagram of a modified example of the example shown in FIG.

FIG. 7 is an explanatory diagram of a third embodiment of the present invention.

FIG. 8 is an explanatory diagram of a fourth embodiment of the present invention.

9 is an explanatory view of the device of FIG. 8 as viewed from the side.

[Explanation of symbols]

 1 Electronic Device 2 Housing 5-7 Fan 10 Power Supply Device 11 Plate 13 Board 15 Electronic Circuit Board 16 CPU 17 Heat Sink 18 Memory 20-27 Columnar Member 31 Guide Rail 40 Cover 41 Threshold Plate 50 Unit 60 Swash Plate 61 Duct

Claims (10)

[Claims] 1. An electronic circuit board in which a large number of electronic circuit boards, a power supply device, and a fan for cooling these are arranged inside a housing, and arranged in parallel to the flow of cooling air inside the housing. An electronic device in which a CPU and a plurality of memories are mounted on the CPU, a heat sink is attached to the CPU, and a fan is arranged on the upstream side or the downstream side or both of the flow of cooling air with respect to the electronic circuit board group. 2. A cooling device for an electronic device, wherein columnar guides are arranged in the upstream and downstream portions of the cooling air for each electronic circuit board in parallel to the electronic circuit board and so as to sandwich the electronic circuit board. 2. The cooling device for an electronic device according to claim 1, wherein the cross-sectional shape of the columnar guide is streamlined. 3. The cooling device for an electronic device according to claim 1, wherein the columnar guide is formed integrally with a metal plate for holding a guide rail for fixing the electronic circuit board. 4. An electronic circuit board in which a large number of electronic circuit boards, a power supply device, and a fan for cooling them are arranged inside a housing, and arranged in parallel to the flow of cooling air inside the housing. A CPU and a plurality of memories are mounted on the CPU, and a heat sink is attached to the CPU. An axial fan for cooling the electronic circuit board group and the power supply device is provided on the upstream side of the flow of cooling air. Alternatively, in an electronic device arranged on the downstream side or both, a cross flow fan is arranged on a side surface of the electronic circuit board group, and a discharge port of the cross flow fan is provided toward the electronic circuit board.
A cooling device for an electronic device, wherein a longitudinal direction of a discharge port of the fan covers the electronic circuit board group. 5. A heat sink provided for a CPU arranged on the electronic circuit board is provided with a large number of flat plate fin groups arranged at regular intervals, and the direction of the flat plate fin group of the heat sink is the air discharged from the cross flow fan. The cooling device for an electronic device according to claim 4, wherein the cooling device is parallel to the flow. 6. A heat sink provided for a CPU arranged on the electronic circuit board has a large number of flat plate fin groups arranged at regular intervals, and the flat plate fin groups of the heat sink are oriented between the fin groups. The cooling device for an electronic device according to claim 4, wherein the flow of the cooling air passing therethrough is inclined with respect to the electronic circuit board so as to be directed obliquely toward the upstream side. 7. A cover having a threshold plate disposed between the cross flow fan and the electronic circuit board group, and a cover having an air supply side opening on the opposite side of the discharge port of the cross flow fan so as to face the threshold plate. The cooling device for an electronic device according to claim 4, wherein the cooling device is provided. 8. A number of electronic circuit boards and power supplies,
In a rack-mounted housing in which units provided with fans for cooling these are stacked, a cross-flow fan is installed on the most downstream side of the unit, and the discharge port of the fan is arranged upward. Characteristic electronic device cooling device. 9. A columnar guide is provided in the upstream and downstream portions of the flow of cooling air with respect to the electronic circuit board in the unit, in parallel with the electronic circuit board and so as to sandwich the electronic circuit board. The cooling device for an electronic device according to claim 8. 10. A large number of electronic circuit boards, plates, a power supply device, and a fan for cooling them are arranged inside a housing, and the electronic circuit board group and the power supply device are cooled inside the housing. In an electronic device in which the axial fan is arranged on the upstream side or the downstream side or both of the cooling air flow, the electronic circuit board group is parallel to one surface of the plate and is perpendicular to the cooling air flow direction. The electronic circuit board group is connected to the other surface of the plate so as to be parallel and parallel to the flow of the cooling air, and the flow of the cooling air with respect to the electronic circuit board group arranged on one side of the plate. A cooling device for an electronic device, wherein a threshold plate is provided in the vicinity of the upstream side of, and a duct that extends to the downstream side of the threshold plate and covers a part of the electronic circuit board group is provided.