JPH09109577A - Card with non-contact memory medium and manufacture thereof - Google Patents
Card with non-contact memory medium and manufacture thereofInfo
- Publication number
- JPH09109577A JPH09109577A JP7265136A JP26513695A JPH09109577A JP H09109577 A JPH09109577 A JP H09109577A JP 7265136 A JP7265136 A JP 7265136A JP 26513695 A JP26513695 A JP 26513695A JP H09109577 A JPH09109577 A JP H09109577A
- Authority
- JP
- Japan
- Prior art keywords
- core
- card
- storage medium
- resin
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＩＣのような記憶媒
体を有するカードおよびその製造方法に関するものであ
り、特に記憶媒体が非接触であるカードおよび製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card having a storage medium such as an IC and a manufacturing method thereof, and more particularly to a card having a non-contact storage medium and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来、ＩＣのような記憶媒体を有するカ
ードは、読み取り機械に記憶媒体を直接接触させるよう
にしたカ−ドが使用されていた。しかし、このようなカ
ードは記憶媒体が外側に面していたために記憶媒体が汚
れたり、傷が付いたりしまっていた。そのため、記憶媒
体を樹脂等により覆うようにした記憶媒体が外側に面し
ていない非接触型のカ−ドが使用されていた。このカー
ドは図４に示されているように、ＩＣ３等の記憶媒体に
コイル４をつなげた状態（剥ぎ出し状態）をエポキシ等
の樹脂により全体を覆うように封止することによりコア
１と呼ばれる部材を成形し、次いで、このコア１をカー
ド基材５に封止し内蔵することにより、記憶媒体が非接
触であるカードが成形されていた。2. Description of the Related Art Heretofore, a card having a storage medium such as an IC has used a card in which the storage medium is brought into direct contact with a reading machine. However, such a card had the storage medium facing outward, and thus the storage medium was dirty or scratched. Therefore, a non-contact type card has been used in which the storage medium is covered with resin or the like and the storage medium does not face the outside. As shown in FIG. 4, this card is called a core 1 by sealing a state in which a coil 4 is connected to a storage medium such as an IC 3 (peeled state) with a resin such as epoxy so as to cover the whole. By molding a member and then sealing and incorporating this core 1 in the card base material 5, a card in which the storage medium is not in contact has been molded.
【０００３】上記のような情報記憶記録媒体を有するコ
アを作成し、このコアをカード基材に封止し内蔵するカ
ードにおいて、コアとカード基材の材質は同一のものが
好ましく使用される。これは、同一の材質であれば基材
の接着、または熱融着が容易であり、また強度も安定す
るためである。しかし、コアまたはカード基材に使用さ
れる樹脂の性質、コアの製造方法、また、カードに施さ
れる模様、印刷、仕様等により、コアとカード基材に異
なった樹脂を用いることが多くなりはじめた。In a card in which a core having the above-mentioned information storage recording medium is prepared, and the core is sealed and built in a card base material, the same material is preferably used for the core and the card base material. This is because if the same material is used, the base material can be easily bonded or heat-sealed, and the strength is stable. However, due to the nature of the resin used for the core or card substrate, the manufacturing method of the core, and the pattern, printing, specifications, etc. applied to the card, different resins are often used for the core and card substrate. began.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、異なっ
た樹脂により製造されたコア１をカード基材５に封止す
ることにより内蔵してカードを形成した場合、コア１と
カード基材５は接着しておらずたんにカード基材５にコ
ア１が封止しされ内蔵されるだけであるので、カードが
使用中等に曲がってしまった場合等に、コア１とカード
基材５の曲がり率が異なるので、図５に示すようにカー
ド基材５に内蔵されているコア１の一部がカード基材５
の封止部を突き破り外側に飛び出す場合が生じた。ま
た、コア１とカード基材５の成形樹脂の膨張率、収縮率
が異なっているので、カード使用状況つまり温度等の変
化により、図６に示すようにコア１が封止されているカ
ード基材５の一部が浮き上がり使用することができなく
なる場合があった。However, when a card 1 is formed by encapsulating a core 1 made of different resins in a card base material 5 to form a card, the core 1 and the card base material 5 do not adhere to each other. Since the core 1 is simply sealed and built in the card base 5, the bending ratio of the core 1 is different from that of the card base 5 when the card is bent during use. Therefore, as shown in FIG. 5, a part of the core 1 built in the card substrate 5 is
There was a case where the seal part of No. 1 broke through and popped out. Further, since the expansion coefficient and the contraction rate of the molding resin of the core 1 and the card base material 5 are different from each other, the card base in which the core 1 is sealed as shown in FIG. In some cases, a part of the material 5 was lifted and could not be used.
【０００５】また、コア１とカード基材５を接着材によ
り強固に接着させたることにより上記課題を解決しよう
としても、異なる樹脂を接着させる接着剤をコア１とカ
ード基材５の樹脂に合わせて選択することは困難であっ
た。Further, even if an attempt is made to solve the above problems by firmly adhering the core 1 and the card base material 5 with an adhesive material, an adhesive agent for adhering different resins is adjusted to the resin of the core 1 and the card base material 5. Was difficult to choose.
【０００６】本発明は、形成樹脂の異なるコアをカード
基材に封止したカードにおいても、カードに折れ曲がり
等の外力がかかったとしてもコアによりカード基材に破
損が生じず、温度変化等の環境変化においてもカード基
材のコアを封止している部分に浮き上がりが生じ無い非
接触性記憶媒体を有するカードを提供する。According to the present invention, even in a card in which cores having different resins formed are sealed in a card base material, even if an external force such as bending is applied to the card base material, the card base material is not damaged by the core and the temperature change or the like is prevented. (EN) Provided is a card having a non-contact storage medium in which a portion of a card base material that seals a core does not float even when the environment changes.
【０００７】[0007]
【課題を解決するための手段】本願考案は上記課題を解
決するためになされたもので、コイルが接続した記憶媒
体の全体を樹脂により覆ってなるコアを基材内部に封止
し記憶媒体を非接触状態に保持するカ−ドにおいて、こ
のコアに一つ以上の穴を設けた非接触記憶媒体を有する
カ−ドである。The present invention has been made in order to solve the above-mentioned problems, and a core formed by covering the entire storage medium to which a coil is connected with a resin is sealed inside a base material to form a storage medium. In a card which is held in a non-contact state, the card has a non-contact storage medium in which one or more holes are provided in the core.
【０００８】また、コイルが接続した記憶媒体の全体を
樹脂により覆うことによりコアを成形し、前記コアに記
憶媒体およびコイルに接触しないように少なくとも一つ
以上の穴を開け、金型内で熱可塑性樹脂により前記コア
の全体を覆うとともに、前記穴に熱可塑性樹脂を流し込
むことにより成形した上記非接触記憶媒体を有するカ−
ドの製造方法である。A core is molded by covering the entire storage medium to which the coil is connected with resin, and at least one hole is formed in the core so as not to contact the storage medium and the coil. A card having the non-contact storage medium formed by casting the thermoplastic resin into the hole while covering the entire core with the plastic resin.
It is a method of manufacturing a cord.
【０００９】コイルが接続した記憶媒体の全体を樹脂に
より覆うことによりコアを成形し、前記コアに記憶媒体
およびコイルに接触しないように少なくとも１以上の穴
を開け、熱可塑性樹脂からなるフィルムを前記コアの全
体を覆うように両側とも積層し、前記穴に熱可塑性樹脂
からなるフィルムを流し込むことにより成形した上記非
接触記憶媒体を有するカ−ドの製造方法である。A core is molded by covering the entire storage medium to which the coil is connected with a resin, and at least one or more holes are formed in the core so as not to contact the storage medium and the coil. This is a method for producing a card having the non-contact storage medium, which is formed by laminating both sides of the core so as to cover the whole core and pouring a film made of a thermoplastic resin into the hole.
【００１０】また、コイルが接続した記憶媒体の全体を
樹脂により覆うことによりコアを成形し、前記コアに記
憶媒体およびびコイルに接触しないように少なくとも一
つ以上の穴を開け、この両側から接着剤からなる層を設
けるとともに、前記穴にも接着剤を流し込み、熱可塑性
樹脂からなるフィルムを前記コアの全体を覆うように両
側とも積層成形した非接触記憶媒体を有するカ−ドの製
造方法である。A core is molded by covering the entire storage medium to which the coil is connected with a resin, and at least one or more holes are formed in the core so as not to contact the storage medium and the coil, and the core is bonded from both sides. A method for producing a card having a non-contact storage medium in which a layer made of an agent is provided, an adhesive is also poured into the hole, and a film made of a thermoplastic resin is laminated and formed on both sides so as to cover the entire core. is there.
【００１１】[0011]
【発明の実施の形態】以下本発明の実施例を図面を用い
て詳しく説明する。本発明においてＩＣ３にコイル４が
接続した記憶媒体が使用される。次いで、このコイル４
に接続したＩＣ３からなる記憶媒体を樹脂により全体を
覆い、記憶媒体の全体を封止したコア１を成形する。こ
のコア１を形成する樹脂は、エポキシ樹脂等が使用され
る。また、上記ＩＣ及びコイルからなる記憶媒体及びコ
ア１は、従来使用されている物を使用することができ
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In the present invention, a storage medium in which the coil 4 is connected to the IC 3 is used. Then this coil 4
The entire storage medium composed of the IC 3 connected to is covered with resin to form the core 1 in which the entire storage medium is sealed. An epoxy resin or the like is used as the resin forming the core 1. As the storage medium including the IC and the coil and the core 1, those conventionally used can be used.
【００１２】上記のように成形したコアに、図１に示す
ように穴２を開ける。この穴２は貫通しており、コアに
少なくとも一つ以上開ける。そして、この穴はコアの面
積に対して１／２程度またはそれ以上の面積となるよう
に設けることが好ましい。また、この穴はコアの表面に
対して均一に分散するように設けることが好ましい。つ
まり、コアの一分にのみ穴を集中して設けると強度が低
くなる。それに対して上記のようにコアに対して穴を設
けることにより、接着と同等の効果が得られ、また、取
り出そうとしてもコア自体が割れやすくなるので取り出
しずらくなり、安全性が向上する。また、その穴２の形
状は図１に示しているものにかぎらず、楕円形状、四角
形状等も使用することができる。A hole 2 is formed in the core molded as described above as shown in FIG. This hole 2 penetrates and at least one or more holes are formed in the core. Then, it is preferable that the hole is provided so as to have an area of about ½ or more of the area of the core. Further, it is preferable that the holes are provided so as to be uniformly dispersed on the surface of the core. That is, if the holes are concentrated and provided only in one part of the core, the strength becomes low. On the other hand, by providing a hole in the core as described above, the same effect as that of bonding can be obtained, and even if the core is attempted to be taken out, the core itself is liable to be cracked, which makes it difficult to take out and improves safety. Further, the shape of the hole 2 is not limited to that shown in FIG. 1, and an elliptical shape, a quadrangular shape or the like can be used.
【００１３】次いで、穴を開けたコア１を金型（図示せ
ず）内に設置し、金型内に熱可塑性樹脂を流し込みカー
ドを形成する。このカード成形用金型内に流し込まれた
熱可塑性樹脂により、コア１はカード基材５内に封止さ
れる。また、上記熱可塑性樹脂はコア１の全体を覆うと
同時にコア１に設けられた穴２の中にも流れ込み図２に
示すようにコア１を挟み込み、穴２を通った樹脂は反対
側の面とつながり、カードはコアを中間層として一体成
形された積層構成で成形される。Next, the core 1 with holes is placed in a mold (not shown), and a thermoplastic resin is poured into the mold to form a card. The core 1 is sealed in the card base material 5 by the thermoplastic resin poured into the card molding die. The thermoplastic resin also covers the entire core 1 and at the same time flows into the hole 2 provided in the core 1 to sandwich the core 1 as shown in FIG. 2, and the resin passing through the hole 2 has the opposite surface. The card is molded in a monolithically laminated structure with the core as the middle layer.
【００１４】また、コアの両側から熱可塑性樹脂からな
るフィルムをラミネートさせ、穴２を覆うようにラミネ
ートさせたフィルムが穴を通って反対側のフィルムまで
流れ込み、上記同様に穴２を通った樹脂は反対側の面と
つながり、カードはコアを中間層として一体成形された
積層構成で成形される。カードの基材として使用される
樹脂は、アクリロニトリル・ブタジエン・スチレン共重
合体（ＡＢＳ）、ポリ塩化ビニル（ＰＶＣ）等の、従来
からカードの基材として使用されている熱可塑性樹脂を
使用することがでる。また、上記の熱可塑性樹脂を中間
層として、他の樹脂を積層して多層構成のカードを製造
することができる。また、最外面に印刷層や模様等を設
けることもできる。Further, a film made of a thermoplastic resin is laminated from both sides of the core, and the film laminated so as to cover the hole 2 flows through the hole to the film on the opposite side, and the resin which has passed through the hole 2 in the same manner as above. Is connected to the opposite surface, and the card is molded in a laminated structure in which the core is an intermediate layer. For the resin used as the base material of the card, use a thermoplastic resin such as acrylonitrile / butadiene / styrene copolymer (ABS) or polyvinyl chloride (PVC) that has been conventionally used as the base material of the card. Get out. Further, a card having a multi-layered structure can be manufactured by stacking other resins with the above thermoplastic resin as an intermediate layer. Further, a printing layer, a pattern, or the like can be provided on the outermost surface.
【００１５】また、上記コアの両側に接着剤により接着
剤層を設ける。この接着剤は上記の熱可塑性樹脂と同様
にコアに設けられた穴２の仲にも流れ込み図６に示すよ
うにコア１を挟み込み、穴２を通った接着剤は反対側の
面とつながり、コア１を中間層として一体成形された積
層構成で成形される。次いで、上記積層体の両側から熱
可塑性樹脂で成形されたフィルムがラミネートされ、カ
ードを形成する。上記接着剤は、カードの基材であり両
側からラミネートされるフィルムと接着性が高い接着剤
が使用される。また、ラミネート成形される熱可塑性樹
脂製フィルムは、上記の熱可塑性樹脂製フィルムと同様
なアクリロニトリル・ブタジエン・スチレン共重合体
（ＡＢＳ）、ポリ塩化ビニル（ＰＶＣ）等の樹脂フィル
ムを使用することができる。An adhesive layer is provided on both sides of the core with an adhesive. This adhesive also flows into the middle of the hole 2 provided in the core like the above-mentioned thermoplastic resin, sandwiches the core 1 as shown in FIG. 6, and the adhesive passing through the hole 2 is connected to the opposite surface, The core 1 is formed in a laminated structure integrally formed with the intermediate layer. Next, a film formed of a thermoplastic resin is laminated from both sides of the above laminated body to form a card. As the above-mentioned adhesive, an adhesive having high adhesiveness to a film which is a base material of a card and laminated from both sides is used. As the thermoplastic resin film to be laminated and formed, a resin film such as acrylonitrile / butadiene / styrene copolymer (ABS) or polyvinyl chloride (PVC) similar to the above thermoplastic resin film may be used. it can.
【００１６】[0016]
【発明の効果】以上、詳しく説明したように、本発明の
非接触記憶媒体を有するカードは、コアとカード基材の
樹脂が異なっても、コアに穴を一つ以上設けているの
で、カードが不自然に折れ曲がっても、コアに設けた穴
により力が分散し、カードがコアとカード基材の伸び率
または折れ曲がり率等の違いにより破損が生じることな
く、また、コアがカード基材を突き破って外側に飛び出
すことがない。As described above in detail, the card having the non-contact storage medium of the present invention has one or more holes in the core even if the resin of the core and the resin of the card substrate are different. Even if it bends unnaturally, the force is dispersed by the holes provided in the core, the card does not break due to the difference in the elongation rate or bending rate of the core and the card base material, and the core It doesn't break through and jump out.
【００１７】また、カード基材を形成している樹脂が穴
を通してつながっているので、コアとカードが強固に一
体化しているので、カードがコアとカード基材の伸び率
または折れ曲がり率等の違いにより破損が生じることな
く、また、コアがカード基材を突き破って外側に飛び出
すことがない。Further, since the resin forming the card base material is connected through the holes, the core and the card are firmly integrated, so that the card has a difference in the elongation rate or bending rate between the core and the card base material. Does not cause breakage, and the core does not break through the card base material and pop out to the outside.
【００１８】また、接着剤を使用せずにコアとカードを
強固に一体化させることができるので、カード製造にお
いてかせられる制約が少なくなり、容易にカードを形成
することができる。Further, since the core and the card can be firmly integrated without using an adhesive, the restrictions imposed in the card manufacturing are reduced, and the card can be easily formed.
【００１９】また、コアをカードに封止すると同時にコ
アに設けた穴にカード基材を形成する樹脂が流れ込むの
で、別に工程を設ける必要がなく、容易に上記穴に樹脂
を流し込むことができるので、容易にカードを形成する
ことができる。Further, since the resin for forming the card base material flows into the hole provided in the core at the same time when the core is sealed in the card, it is possible to easily pour the resin into the hole without the need for a separate step. , The card can be easily formed.
【００２０】[0020]
【図１】本実施例のコアの平面図である。FIG. 1 is a plan view of a core of this embodiment.
【図２】本発明の第１の実施例のカードの断面図であ
る。FIG. 2 is a cross-sectional view of the card according to the first embodiment of the present invention.
【図３】本発明の第２の実施例のカードの断面図であ
る。FIG. 3 is a sectional view of a card according to a second embodiment of the present invention.
【図４】従来のコアの平面図である。FIG. 4 is a plan view of a conventional core.
【図５】従来のカードの破損状態の簡易斜視図である。FIG. 5 is a simplified perspective view of a conventional card in a damaged state.
【図６】従来のカードの破損状態の簡易斜視図である。FIG. 6 is a simplified perspective view of a conventional card in a damaged state.
【符号の説明】 １……コア ２……穴 ３……ＩＣ ４……コイル ５……カード基材 ６……接着剤[Explanation of symbols] 1 ... core 2 ... hole 3 ... IC 4 ... coil 5 ... card base material 6 ... adhesive
Claims (4)
より覆ってなるコアを基材内部に封止し記憶媒体を非接
触状態に保持するカ−ドにおいて、このコアに一つ以上
の穴を設けたことを特徴とする非接触記憶媒体を有する
カ−ド。1. A card for encapsulating a storage medium, to which a coil is connected, which is entirely covered with a resin, inside a base material to hold the storage medium in a non-contact state. And a card having a non-contact storage medium.
より覆うことによりコアを成形し、前記コアに記憶媒体
およびコイルに接触しないように少なくとも一つ以上の
穴を開け、金型内で熱可塑性樹脂により前記コアの全体
を覆うとともに、前記穴に熱可塑性樹脂を流し込むこと
により成形したことを特徴とする非接触記憶媒体を有す
るカ−ドの製造方法。2. A core is formed by covering the entire storage medium to which the coil is connected with a resin, and at least one hole is formed in the core so as not to contact the storage medium and the coil, and heat is applied in a mold. A method for producing a card having a non-contact storage medium, characterized in that the core is entirely covered with a plastic resin and is molded by pouring a thermoplastic resin into the hole.
より覆うことによりコアを成形し、前記コアに記憶媒体
およびコイルに接触しないように少なくとも一つ以上の
穴を開け、熱可塑性樹脂からなるフィルムを前記コアの
全体を覆うように両側とも積層し、前記穴に熱可塑性樹
脂からなるフィルムを流し込むことにより成形したこと
を特徴とする非接触記憶媒体を有するカ−ドの製造方
法。3. A core is formed by covering the entire storage medium to which the coil is connected with a resin, and at least one or more holes are formed in the core so as not to contact the storage medium and the coil, and the core is made of a thermoplastic resin. A method for producing a card having a non-contact storage medium, characterized in that a film is laminated on both sides so as to cover the whole of the core, and is molded by pouring a film made of a thermoplastic resin into the hole.
より覆うことによりコアを成形し、前記コアに記憶媒体
およびコイルに接触しないように少なくとも一つ以上の
穴を開け、前記コアの両側に接着剤からなる接着剤層を
設けるとともに、前記穴にも接着剤を流し込み、熱可塑
性樹脂からなるフィルムを前記コアの全体を覆うように
両側とも成形したことを特徴とする非接触記憶媒体を有
するカ−ドの製造方法。4. A core is molded by covering the entire storage medium to which the coil is connected with a resin, and at least one or more holes are formed in the core so as not to contact the storage medium and the coil, and both sides of the core are formed. The non-contact storage medium is characterized in that an adhesive layer made of an adhesive is provided, the adhesive is also poured into the holes, and a film made of a thermoplastic resin is formed on both sides so as to cover the entire core. Card manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7265136A JPH09109577A (en) | 1995-10-13 | 1995-10-13 | Card with non-contact memory medium and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7265136A JPH09109577A (en) | 1995-10-13 | 1995-10-13 | Card with non-contact memory medium and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09109577A true JPH09109577A (en) | 1997-04-28 |
Family
ID=17413129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7265136A Pending JPH09109577A (en) | 1995-10-13 | 1995-10-13 | Card with non-contact memory medium and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09109577A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004110142A (en) * | 2002-09-13 | 2004-04-08 | Toppan Forms Co Ltd | Recording medium |
| JP2007149117A (en) * | 2007-01-29 | 2007-06-14 | Dainippon Printing Co Ltd | Non-contact data carrier and manufacturing method thereof |
| WO2009035094A1 (en) * | 2007-09-14 | 2009-03-19 | Toppan Printing Co., Ltd. | Antenna sheet, transponder and book form |
| US8973834B2 (en) * | 2004-06-16 | 2015-03-10 | Gemalto Sa | Secured identification document |
-
1995
- 1995-10-13 JP JP7265136A patent/JPH09109577A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004110142A (en) * | 2002-09-13 | 2004-04-08 | Toppan Forms Co Ltd | Recording medium |
| US8973834B2 (en) * | 2004-06-16 | 2015-03-10 | Gemalto Sa | Secured identification document |
| JP2007149117A (en) * | 2007-01-29 | 2007-06-14 | Dainippon Printing Co Ltd | Non-contact data carrier and manufacturing method thereof |
| JP4580944B2 (en) * | 2007-01-29 | 2010-11-17 | 大日本印刷株式会社 | Non-contact data carrier and manufacturing method thereof |
| WO2009035094A1 (en) * | 2007-09-14 | 2009-03-19 | Toppan Printing Co., Ltd. | Antenna sheet, transponder and book form |
| US8519905B2 (en) | 2007-09-14 | 2013-08-27 | Toppan Printing Co., Ltd. | Antenna sheet, transponder, and booklet |
| JP5370154B2 (en) * | 2007-09-14 | 2013-12-18 | 凸版印刷株式会社 | Antenna sheet, transponder and booklet |
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