JP2004110142A - Recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the possibility of a plurality of layers being separated from each other when external force is applied in a recording medium formed by laminating the plurality of layers. <P>SOLUTION: This recording medium is formed by holding a resin sheet 15 formed with an antenna 12 and mounted with an IC module 11, by core materials 20a, 20b and surface sheets 30a, 30b through adhesive layers 41a, 41b, 42a, 42b, and bonding these layers to one another in this state. Recessed parts 17 allowing the adhesive layers 41a, 41b, 42a, 42b to get in, are formed in the regions, coming in contact with the adhesive layers 41, 41b, 42a, 42b, of the resin sheet 15, core materials 20a, 20b and surface sheets 30a, 30b. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a recording medium such as a card on which information is written, and more particularly, to a recording medium in which a plurality of layers are stacked.
[0002]
[Prior art]
In recent years, with the progress of the information society, information is recorded on a card, and information management, settlement, and the like using the card are performed.
[0003]
Cards used for such information management and settlement include IC cards with built-in IC chips and magnetic cards on which information is written by magnetism. Information can be written and read using a dedicated device. Is
[0004]
Further, in the IC card, a contact type IC card which performs writing and reading of information by contacting with a dedicated device, and a non-contact type IC which can perform writing and reading of information only by approaching the dedicated device. There is a card. These IC cards have higher security and a larger amount of writable information than magnetic cards, and one card can be used for a variety of purposes, so that its popularity in the market is ever increasing. . Among them, a non-contact type IC card is convenient for handling because it is not necessary to take out the card and insert it into a dedicated device when writing or reading information. The device for reading the information is rapidly spreading.
[0005]
FIGS. 5A and 5B are views showing an example of the structure of a conventional non-contact type IC card. FIG. 5A is a view showing the internal structure, and FIG. 5B is a sectional view.
[0006]
As shown in FIG. 5, in the non-contact type IC card according to the conventional example, an IC module 111 capable of externally writing and reading information is mounted on a resin sheet 115, and connection terminals 114 of the IC module 111 are connected. Is supplied to the IC module 111 through electromagnetic induction from an externally provided information writing / reading device (not shown) to write and read information to and from the IC module 111. The inlet 110 in which the conductive antenna 112 for performing the contact state is formed is laminated and sandwiched between the core materials 120a and 120b and the topsheets 130a and 130b. The inlet 110, the core members 120a and 120b, and the topsheets 130a and 130b are bonded to each other by a lamination process.
[0007]
In the non-contact type IC card configured as described above, the antenna 112 is connected to the IC module 111 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. An electric current is supplied, whereby information is written from the information writing / reading device to the IC module 111 in the non-contact state, or information written to the IC module 111 is read by the information writing / reading device. Or
[0008]
Here, in the non-contact type IC card as described above, since the IC module 111 is mounted on the base material 115, the region where the IC module 111 is mounted rises when they are bonded to each other by lamination. The flatness of the surface may be impaired.
[0009]
Therefore, a technique of bonding the inlet 110, the core members 120a and 120b, and the topsheets 130a and 130b to each other with a hot melt resin is used. When the inlet 110, the core members 120a and 120b, and the topsheets 130a and 130b are bonded to each other using a hot melt resin, the thickness of the hot melt resin for bonding the inlet 110 and the core member 120a is determined by the thickness of the IC module 111. If the thickness is set to be larger than that, the IC module 111 is buried in the hot melt resin, whereby the flatness of the surface of the non-contact type IC card can be ensured (for example, see Patent Document 1).
[0010]
[Patent Document 1]
JP-A-10-147087
[Problems to be solved by the invention]
In most cases, the non-contact type IC card described above is used in a portable manner, so that an external force is likely to be applied in a direction in which the IC card is bent. In such a case, the hot melt resin includes an inlet, a core material, There is a possibility that the inlet, the core material, and the topsheet may be separated from each other due to peeling from the topsheet. Although the inlet, the core material and the topsheet are subjected to an easy-adhesion treatment in order to increase the adhesive strength, the flatness of the surface is excellent, so that the compatibility of the inlet, the core material and the topsheet with the hot melt resin. If it is not good, the above-mentioned problem is likely to occur. Therefore, what can be used as the hot melt resin is limited, and in some cases, the cost is increased.
[0012]
The present invention has been made in view of the above-described problems of the related art, and in a recording medium in which a plurality of layers are stacked, a plurality of layers are separated from each other when an external force is applied. It is an object to provide a recording medium capable of reducing the possibility.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
A recording medium in which a plurality of layers are adhered to each other via an adhesive unit exhibiting an adhesive effect by changing from an uncured state to a cured state,
The plurality of layers may have a concave portion in a region in contact with the bonding unit.
[0014]
Further, the concave portion is formed in a groove shape.
[0015]
Further, the recess is formed in a hole shape.
[0016]
Further, the concave portion is formed so that a depth direction is oblique to a surface of the layer.
[0017]
Further, the recess is formed so as to penetrate the layer.
[0018]
Further, the recess is formed along four sides of the layer.
[0019]
Further, the concave portions are formed at four corners of the layer.
[0020]
An antenna having conductivity is formed in one of the plurality of layers, and an IC module capable of writing and reading information in a non-contact state through the antenna is mounted on the antenna. It is characterized by having.
[0021]
(Action)
In the present invention configured as described above, when the plurality of layers constituting the recording medium are stacked via an adhesive unit that exhibits an adhesive effect by changing from an uncured state to a cured state, the uncured state is obtained. The bonding means enters the concave portions formed in the plurality of layers, and is cured in that state to bond the plurality of layers to each other. Thereby, the contact area between the bonding unit and the plurality of layers is increased, and the bonding unit and the plurality of layers are bonded in a state where a wedge effect is generated between the bonding unit and the plurality of layers. This increases the adhesive strength between the recording medium and the plurality of layers, and reduces the possibility that the plurality of layers will peel off when an external force is applied to the recording medium.
[0022]
Further, when the concave portion is formed so that its depth direction is oblique to the surface of the plurality of layers, when an external force is applied to the recording medium in a bending direction, the adhesive means Has a greater resistance to the force of peeling off from the plurality of layers, thereby making it more difficult for the plurality of layers to peel off.
[0023]
Further, when the concave portion is formed so as to penetrate a plurality of layers, the bonding means will adhere to each other through the concave portion, so that when an external force is applied to the recording medium, the plurality of layers are formed. The possibility of exfoliation between each other is further reduced.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0025]
FIGS. 1A and 1B are diagrams showing a configuration example of a non-contact type IC card which is an embodiment of a recording medium according to the present invention. FIG. 1A is a diagram showing an internal structure, and FIG.
[0026]
As shown in FIG. 1, the non-contact type IC card according to the present embodiment has an IC module 11 capable of externally writing and reading information on a resin sheet 15 and connecting terminals 14 of the IC module 11. A current is supplied to the IC module 11 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and writing and reading of information to and from the IC module 11 are performed in a non-contact manner. The core material 20a, 20b is formed by the adhesive layers 41a, 41b, 42a, 42b made of an adhesive having an adhesive effect by curing the uncured state of the inlet 10 having the conductive antenna 12 to be performed in the state. These are stacked so as to be sandwiched between the top sheets 30a and 30b. Note that the resin sheet 15, the core members 20a and 20b, and the top sheets 30a and 30b each have a recess 17 in a region that comes into contact with the adhesive layers 41a, 41b, 42a, and 42b.
[0027]
In the non-contact type IC card configured as described above, the antenna 12 is moved from the antenna 12 to the IC module 11 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. An electric current is supplied, whereby information is written to the IC module 11 from the information writing / reading device in the non-contact state, or information written to the IC module 11 is read by the information writing / reading device. Or
[0028]
Hereinafter, a method for manufacturing the above-mentioned non-contact type IC card will be described.
[0029]
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC card shown in FIG.
[0030]
First, the coil-shaped antenna 12 is formed on the resin sheet 15 by etching, vapor deposition, silk printing, or the like (FIG. 2A).
[0031]
Next, in a predetermined area on both surfaces of the resin sheet 15, a laser beam is irradiated so as to avoid the antenna 12 to form a plurality of concave portions 17 (FIG. 2B).
[0032]
Next, an adhesive 16 is dropped onto a region of the resin sheet 15 where the IC module 11 is to be mounted by a method such as a potting method using a dispenser or a silk screen printing method (FIG. 2C).
[0033]
Next, the IC module 11 is mounted on the area of the resin sheet 15 where the adhesive 16 has been dropped, and the connection terminals 14 of the IC module 11 and the antenna 12 are connected. Is applied while applying heat, thereby bonding the IC module 11 and the resin sheet 15 to complete the inlet 10 (FIG. 2D). Here, as the adhesive 16, a thermosetting resin that is cured by applying heat, an ultraviolet curable resin that is cured by irradiating ultraviolet rays, or the like is used. When a thermosetting resin is used as the adhesive 16, heat is applied while applying pressure to the IC module 11, whereby the adhesive 16 is cured, and when an ultraviolet curable resin is used as the adhesive 16. Irradiates ultraviolet rays while applying pressure to the IC module 11, thereby curing the adhesive 16.
[0034]
Thereafter, the core members 20a, 20b and the surface sheets 30a, 30b are sandwiched between the inlets 10 as shown in FIG. 2D by an adhesive layer made of an uncured adhesive such as a hot melt resin. Performed through 41a, 41b, 42a, 42b. Here, as in the case of the resin sheet 15, the plurality of recesses 17 are formed in a predetermined region of the surface of the core materials 20 a, 20 b and the surface sheets 30 a, 30 b in contact with the adhesive layers 41 a, 41 b, 42 a, 42 b, similarly to the resin sheet 15. It is formed in advance. As a result, when the core members 20a, 20b and the top sheets 30a, 30b are stacked via the adhesive layers 41a, 41b, 42a, 42b so as to sandwich the inlet 10, the uncured adhesive becomes the resin sheet 15, The core material 20a, 20b and the recesses 17 formed in the topsheets 30a, 30b are penetrated. By curing the adhesive layers 41a, 41b, 42a, 42b in this state, a non-contact type IC card in which the resin sheet 15, the core members 20a, 20b and the top sheets 30a, 30b are bonded to each other is completed (FIG. 2 ( e)).
[0035]
In the non-contact type IC card manufactured by the above-described process, the plurality of resin sheets 15, the core members 20a and 20b, and the surface sheets 30a and 30b are provided in a predetermined area on the surface thereof in contact with the adhesive layers 41a, 41b, 42a and 42b. Are formed, and the adhesive constituting the adhesive layers 41a, 41b, 42a, and 42b enters into the concave portions 17 and is hardened. Therefore, the resin sheet 15, the core members 20a and 20b, and the topsheet are formed. The contact area between 30a, 30b and the adhesive layers 41a, 41b, 42a, 42b is increased, and the contact area between the resin sheet 15, the core materials 20a, 20b and the top sheets 30a, 30b and the adhesive layers 41a, 41b, 42a, 42b is increased. A wedge effect is produced, whereby the resin sheet 15, the core members 20a, 20b and the top sheets 30a, 30b The adhesive layer 41a, 41b, 42a, adhesive force between the 42b increases. Thus, when an external force is applied, the possibility that the resin sheet 15, the core members 20a and 20b, and the top sheets 30a and 30b are separated from each other is reduced.
[0036]
Hereinafter, the shape of the concave portion 17 formed on the resin sheet 15 and the effect thereof will be described.
[0037]
3A and 3B are diagrams for explaining an example of the shape of the concave portion 17 shown in FIG. 1, wherein FIG. 3A is a diagram of the resin sheet 15 viewed from the surface, and FIG. 3B is a region where the IC module 11 is mounted. 1 is a cross-sectional view of the entire non-contact type IC card.
[0038]
As shown in FIG. 3A, the concave portion 17 in this example is formed in a groove shape outside the antenna 12 along four sides of the resin sheet 15 on both sides of the resin sheet 15. Further, since the concave portion 17 in this example is formed by irradiating a laser beam from an oblique direction so as to have a predetermined angle with respect to the surface of the resin sheet 15, as shown in FIG. The depth direction is formed so as to be inclined at a predetermined angle with respect to the surface of the resin sheet 15. Also, in the recesses 17 formed in the core members 20a and 20b, similarly to the recesses 17 formed in the resin sheet 15, on both sides of the core members 20a and 20b, along the four sides of the core members 20a and 20b. Further, it is formed in a groove shape so as to be inclined at a predetermined angle with respect to the surfaces of the core members 20a and 20b. Also in the recesses 17 formed in the topsheets 30a, 30b, similarly to the recesses 17 formed in the resin sheet 15, the topsheets 30a, 30b are in contact with the adhesive layers 42a, 42b of the topsheets 30a, 30b. The groove is formed along the four sides and at a predetermined angle to the surface of the top sheets 30a and 30b.
[0039]
In the non-contact type IC card in which the recess 17 as shown in FIG. 3 is formed in the resin sheet 15, the core members 20a and 20b and the top sheets 30a and 30b, respectively, the resin sheet 15, the core members 20a and 20b and the top sheet 30a are used. , 30b are formed at a predetermined angle with respect to the surface thereof, so that the resin sheet 15, the core members 20a, 20b and the surface sheets 30a, 30b have the recesses 17, respectively. When an external force is applied to the card in the direction in which the card is bent, the adhesive layer 41a, 41b, 42a, 42b is resistant to the force of peeling off the resin sheet 15, the core members 20a, 20b and the top sheets 30a, 30b. And the resin sheet 15, the core members 20a and 20b, and the top sheets 30a and 30b are further alternated. It can be difficult to peel off.
[0040]
4A and 4B are diagrams for explaining another example of the shape of the concave portion 17 shown in FIG. 1, wherein FIG. 4A is a diagram of the resin sheet 15 viewed from the surface, and FIG. 4B is a diagram in which the concave portion 17 is formed. It is sectional drawing of the whole non-contact type IC card in an area | region.
[0041]
As shown in FIG. 4A, the recesses 17 in the present example are formed in four corners of the resin sheet 15 so as to penetrate the resin sheet 15. Also, in the recesses 17 formed in the core members 20a and 20b, similarly to the recesses 17 formed in the resin sheet 15, hole shapes penetrating the core members 20a and 20b at the four corners of the core members 20a and 20b. Is formed. In the concave portions 17 formed in the topsheets 30a and 30b, holes having a predetermined depth are formed at four corners of the topsheets 30a and 30b on the surfaces of the topsheets 30a and 30b that are in contact with the adhesive layers 42a and 42b. Is formed.
[0042]
In the non-contact type IC card in which the recess 17 as shown in FIG. 4 is formed on the resin sheet 15, the core members 20a and 20b, and the top sheets 30a and 30b, the adhesive layers 41a, 41b, 42a and 42b are formed on the resin sheet. 15 and the core members 20a, 20b are bonded to each other via the recessed portions 17, so that the resin sheet 15 and the core members 20a, 20b can be made harder to peel off from each other. In the core members 20a, 20b and the topsheets 30a, 30b, the recesses 17 formed in the core members 20a, 20b make it difficult for the core members 20a, 20b and the adhesive layers 42a, 42b to be peeled off, and the topsheet 30a. , 30b, the topsheets 30a, 30b and the adhesive layers 42a, 42b are hardly peeled off from each other, so that the topsheets 30a, 30b are hardly peeled off from each other.
[0043]
It is also possible to combine the shapes of the recesses 17 shown in FIGS. For example, the groove-shaped recess 17 as shown in FIG. 3A may be formed so as to penetrate the resin sheet 15 and the core members 20a and 20b as shown in FIG. It is conceivable to form the plurality of hole-shaped concave portions 17 shown in FIG. 3A so that the depth direction is oblique as shown in FIG. Further, as shown in FIG. 4B, a concave portion 17 penetrating the resin sheet 15 and the core members 20a and 20b is formed so that its depth direction is oblique as shown in FIG. 3B. Is also conceivable. It is also conceivable to form a combination of the groove shape shown in FIG. 3 and the hole shape shown in FIG. 4 with the resin sheet 15, the core members 20a and 20b, and the top sheets 30a and 30b.
[0044]
In addition, when the recesses 17 formed in the resin sheet 15, the core members 20a and 20b, and the topsheets 30a and 30b are too large, the recesses 17 are formed on the surface of the topsheet 30a when they are stacked together. Since a dent is generated in the set area, a groove shape as shown in FIG. 3 or a hole shape as shown in FIG. 4 is preferable.
[0045]
Further, in the present embodiment, a non-contact type IC card capable of writing and reading information in a non-contact state as a recording medium has been described as an example. However, a non-contact type IC tag, a non-contact type IC label, or Also, in a contact type IC card or the like in which information is written and read in a contact state, a plurality of layers are adhered through an adhesive layer made of an adhesive having an adhesive effect by being cured from an uncured state. If this is the case, the present invention can be applied.
[0046]
In addition, the present invention is not limited to an information recording medium on which an IC module capable of writing and reading information is mounted, but a non-contact recognition medium such as a resonance tag in which an antenna pattern is formed and the presence or absence of a tag is recognized based on a difference in resonance point. For example, the present invention can also be applied to a recording medium in which a plurality of layers are bonded through an adhesive layer made of an adhesive that exhibits an adhesive effect by being cured from an uncured state.
[0047]
【The invention's effect】
As described above, in the present invention, in a recording medium in which a plurality of layers are adhered to each other via an adhesive means that exhibits an adhesive effect by changing from an uncured state to a cured state, Since a concave portion is formed in a region in contact with, when a plurality of layers are stacked through this bonding means, the uncured bonding means enters the concave portions formed in the plurality of layers, and in that state, When cured, the layers are bonded to each other, thereby increasing the adhesive force between the bonding means and the layers. When an external force is applied to the recording medium, the layers are bonded to each other. The possibility of peeling can be reduced.
[0048]
In the case where the concave portion is formed so that its depth direction is oblique to the surface of the plurality of layers, the concave portion is bonded to the recording medium when an external force is applied in a bending direction. The resistance to the force by which the means tends to peel off from the plurality of layers is increased, thereby making it more difficult for the plurality of layers to peel off.
[0049]
Further, in the case where the concave portion is formed so as to penetrate a plurality of layers, the adhesive means adheres via the concave portion, so that when an external force is applied to the recording medium, a plurality of concave portions are formed. The possibility of peeling between layers can be further reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration example of a non-contact type IC card which is an embodiment of a recording medium according to the present invention, wherein (a) is a diagram showing an internal structure, and (b) is a sectional view.
FIG. 2 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG.
3A and 3B are diagrams for explaining an example of the shape of a concave portion shown in FIG. 1, wherein FIG. 3A is a diagram of a resin sheet viewed from the surface, and FIG. 3B is a non-contact diagram in a region where an IC module is mounted; It is sectional drawing of the whole type | mold IC card.
FIGS. 4A and 4B are diagrams for explaining another example of the shape of the recess shown in FIG. 1, wherein FIG. 4A is a view of the resin sheet viewed from the surface, and FIG. It is sectional drawing of the whole contact type IC card.
5A and 5B are diagrams illustrating an example of the structure of a conventional non-contact type IC card, in which FIG. 5A illustrates an internal structure, and FIG. 5B is a cross-sectional view.
[Explanation of symbols]
Reference Signs List 10 inlet 11 IC module 12 antenna 14 connection terminal 15 resin sheet 16 adhesive 17 recess 20a, 20b core material 30a, 30b surface sheet 41a, 41b, 42a, 42b adhesive layer

Claims (8)

A recording medium in which a plurality of layers are adhered to each other via an adhesive unit exhibiting an adhesive effect by changing from an uncured state to a cured state,
The recording medium according to claim 1, wherein the plurality of layers have a concave portion in a region in contact with the bonding unit. The recording medium according to claim 1,
The recording medium, wherein the concave portion is formed in a groove shape. The recording medium according to claim 1,
The recording medium, wherein the recess is formed in a hole shape. The recording medium according to any one of claims 1 to 3,
The recording medium, wherein the concave portion is formed so that a depth direction is oblique to a surface of the layer. The recording medium according to any one of claims 1 to 4,
The recording medium, wherein the recess is formed so as to penetrate the layer. The recording medium according to any one of claims 1 to 5,
The recording medium, wherein the concave portion is formed along four sides of the layer. The recording medium according to any one of claims 1 to 5,
The recording medium according to claim 1, wherein the concave portions are formed at four corners of the layer. The recording medium according to any one of claims 1 to 7,
An antenna having conductivity is formed in one of the plurality of layers, and an IC module capable of writing and reading information in a non-contact state through the antenna is mounted on the antenna. A recording medium characterized by the above-mentioned.

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