JP4580944B2 - Non-contact data carrier and manufacturing method thereof - Google Patents

Description

  The present invention relates to a non-contact data carrier and a manufacturing method thereof. Specifically, the present invention relates to a non-contact data carrier in which a protective film is laminated on both surfaces, and a non-contact data carrier using a base for a non-contact data carrier having a through-hole in a center layer base material, and a manufacturing method thereof.

  "Non-contact data carrier" that can record and read information without contact (generally expressed as "non-contact IC tag", "wireless IC tag", "non-contact IC", "non-contact IC label", etc. In some cases, however, it is widely used for information management of goods and products, logistics management, and the like. This non-contact data carrier is generally in a form in which an antenna coil is formed on the surface of a film or paper substrate and an IC chip is mounted. However, when high durability is required or for outdoor use, an antenna is used. A form in which a protective film is laminated on the surface is preferable.

Various embodiments of such a non-contact data carrier are known, but the following are considered to be mainstream in the form of laminated films.
(1) A non-contact data carrier in which an IC chip is connected to a coil antenna produced using a copper wire as a winding, and sandwiched between protective films on both sides. In this case, winding is expensive, and a complicated process is required for connecting the IC chip. In addition, the thickness of the winding portion is inevitably increased, and it is impossible to manufacture a thin product with a protective film attached thereto.
(2) A non-contact data carrier in which a planar coil antenna is formed on a flat film substrate and an IC chip is connected to the end of the antenna, and the front and back are bonded with a protective film. In this case, it is necessary to select one having good adhesion between the film substrate and the protective film, and there is a problem that the material selection is restricted. Further, there is a problem that residual air is easily generated in a portion surrounded by the coil antenna, and a high quality product cannot be obtained.

  FIG. 3 is a diagram illustrating a conventional non-contact data carrier. The embodiment of (2) above is shown. 3A is a plan view, and FIGS. 3B and 3C are cross-sectional views taken along line AA in FIG. 3A, but FIG. 3B is not in contact with the protective film. FIG. 3C shows an embodiment in which the data carrier base material is heat-sealed, and FIG. 3C shows an embodiment in which the protective film and the non-contact data carrier base material are bonded with an adhesive. The non-contact data carrier base 41 is a portion that becomes a central layer material of the non-contact data carrier 40. In the plan view of FIG. It appears in the same shape.

  As shown in FIG. 3A, in the non-contact data carrier 40 of the conventional example, the planar coil antenna 42 is formed on the base film 4b, and the IC chip 45 is attached to both connection end portions 42e of the coil antenna 42. ing. In the embodiment of FIG. 3, a jumping circuit is formed on the back surface of the base film 4 b by the conductive member 43 in a part of the coil. The conducting member 43 is an integral body of a caulking metal fitting 44 and the like, and can be easily connected to the coil by a mechanical operation.

  In the case of FIG. 3B, the protective films 51 and 52 serving as oversheets are bonded to the base film 4b by thermal fusion. Therefore, in this case, the three-layer film must be heat-sealable and have the same material, or different materials must be heat-sealed to each other, which limits the choice of materials. Become. In the case of FIG. 3C, the protective films 51 and 52 are laminated on the non-contact data carrier base film 4b via the adhesives 46 and 47, thereby constituting the non-contact data carrier 40. In this case as well, there are problems such as selection of the adhesives 46 and 47. In either case, residual air is generated in the inner peripheral region of the coil during the manufacturing process, resulting in quality problems. Accordingly, the present invention has been completed by researching the non-contact data carrier in the laminated form as described in the above (2) so as to produce it at low cost, high strength adhesion, and high quality. In addition, there exists patent document 1 as related prior art.

JP 2000-231615 A

The first of the gist of the present invention to solve the above problems is a non-contact data carrier substrate having an antenna formed on at least one surface side of the film substrate and an IC chip connected to an end of the antenna. Is a rectangular non-contact data carrier having a protective layer laminated on the front and back, and at least a part between the front and back protective films is heat-sealed through a through-hole punched out from the non-contact data carrier substrate , and In the non-contact data carrier, the edge portion has a continuous adhesive portion where the front and back protective films are heat-sealed through grooves punched out except for the diagonal portion .
Since it is this non-contact data carrier base material, the adhesiveness of the protective film of the front and back can be made high, and durability of a non-contact data carrier becomes high.

The second aspect of the present invention for solving the above problems is a step of forming a coil antenna by etching a base film laminated with a metal foil. A rectangular antenna is formed by mounting an IC chip on the coil antenna of the base film. A step of creating a non-contact data carrier base material having a multi-sided non-contact data carrier having a shape; providing a through-hole inside the coil antenna of the multi-side non-contact data carrier base material; and a unit of the base material A step of forming groove-shaped punched portions between the data carriers serving as the edge portions of the data carrier , leaving the diagonal portions for each data carrier , and the multi-sided non-contact data carrier substrate. the center layer, the step of hot pressing by laminating protective films on both sides, so as to pass through the center of the groove-like punched part, the non-contact data carrier A method of manufacturing a non-contact data carrier characterized by having a step, of performing dimension cut in. Since it is this manufacturing method of a non-contact data carrier, the adhesiveness of the protective film of front and back can be made high, and durability of a non-contact data carrier becomes high.

  The non-contact data carrier of the present invention can be formed thin and has excellent quality with no residual air. Moreover, since there are few restrictions on material selection, there is a merit in terms of cost. The method for producing a non-contact data carrier of the present invention can strengthen the adhesion of the protective film laminated on the front and back.

  Hereinafter, the non-contact data carrier of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an example of a non-contact data carrier and a non-contact data carrier substrate of the present invention. 1A is a plan view, and FIG. 1B shows a cross section taken along line AA in FIG. 1A. The substrate 11 for non-contact data carrier has a coil antenna 12 formed on at least one surface side of the substrate film 1b, and an IC chip 15 attached to both connection end portions 12e of the antenna. The IC chip 15 is fixed to the both connection end portions 12e of the antenna by an adhesive (not shown), and spike-like bumps 23 and 24 bite into the both connection end portions 12e of the antenna. A part of the coil forms a jumping circuit on the back surface of the base film 1b by the conductive member 13, but the use of the conductive member 13 is not essential and may be through holes. Various configurations of non-contact data carriers that do not use the conductive member 13 and the like are also known.

  The base film 1b is provided with through holes 18a, 18b, 18c,..., 18n for adhering protective films laminated on the front and back of the base. The shape of the through hole is not particularly limited, and may be circular, elliptical, or square, and it is not necessary that all the through holes have the same shape and size. The size of the through hole is set to a size that fits in the inner peripheral region of the coil or in the outer peripheral region of the coil. Usually, it is a preferable aspect to provide a circular or square hole having a diameter of about several mm to several tens of mm or a span. The number of through holes provided is not particularly limited. In handling the non-contact data carrier base material, it is not appropriate to provide a large number of through holes or enlarge the through holes to such an extent that the base material cannot maintain a flat original shape.

  The through-hole 18 can be provided in the inner peripheral area of the coil antenna 12, the outer peripheral area of the coil, or both. When a wide space can be formed in the inner peripheral area of the coil antenna, it is appropriate to provide a through hole in the part in order to increase the adhesion of the center part of the carrier. Thereby, the effect which makes it easy to deaerate the air which remains in the inner peripheral area of a coil also arises. If the shape of the base film 1b for the non-contact data carrier is made smaller than the shape of the protective films 21 and 22 and fits within the area of the protective film, the edge portion 11e of the protective film does not depend on the through hole. A continuous adhesive portion can be formed. In the case of hot-pressing, the non-contact data carrier is introduced into the press in a multi-faceted state, but at the same time as the through hole, the non-contact data carrier is punched in a straight line so as to leave a connecting portion between adjacent edges. Thus, such an adhesive portion can be formed. As described above, the present invention is characterized in that at least one or more through holes are provided in the non-contact data carrier substrate 11.

  The protective film is not necessarily intended to protect the non-contact data carrier, but may be a case where the protective film itself constitutes an essential substrate. For example, even when a card-shaped non-contact data carrier is constructed by inserting a thin non-contact data carrier base material in the center and covering both sides with a hard vinyl chloride base material. This corresponds to an embodiment of the present invention. Accordingly, the protective film includes a sheet. Such a protective film (or sheet) needs to be heat-fusible, but the non-contact data carrier substrate 11 itself is not limited to heat-fusible. Even if the heat-fusibility between the protective film and the non-contact data carrier substrate is poor, the protective film can be bonded by the self-heat-bonding property through the through-holes of the non-contact data carrier substrate 1b. It is.

  As shown in the cross-sectional view of FIG. 1B, the protective films 21 and 22 are in direct contact with each other through the through holes 18a, 18b, 18c,. If the protective films 21 and 22 are laminated and hot-pressed, the self-heat-bonding protective films can be obtained as an integral laminate regardless of the adhesion to the base film 1b. . Therefore, it is not necessary to consider the adhesiveness between the protective film (or sheet) and the base film 1b, and the material selection is less likely to be restricted. In the case of FIG. 1, the coil antenna 12 is formed only on one side of the base film 1b, but may be formed on both sides of the base film. In this case, the front and back coils are wound in the same winding direction, and the front and back coil antennas are connected by a conductive member or a through hole.

  FIG. 2 is a diagram showing a process of manufacturing the non-contact data carrier of the present invention. FIG. 2A is a process of preparing a non-contact data carrier substrate. In general, the coil antenna 12 is formed by a photoetching process in which a photosensitive solution is applied to the base film 1b on which a copper foil or an aluminum foil is laminated, and etching is performed by performing resist printing. The coil antenna 12 may also be formed by a printed wiring technique using conductive ink. An IC chip 15 is mounted by applying an adhesive (not shown) to both connection end portions 12e of the coil antenna. At this time, the spiked bumps of the IC chip bite into both connection end portions 12e of the coil antenna to ensure the connection. The bumps may bite down to the base film 1b. However, since the bump is not limited to such a spike shape, for example, in the case of a planar bump, it may be fixed with an anisotropic conductive adhesive to conduct in a specific direction.

While functioning as a non-contact data carrier with the IC chip mounted, the non-contact data carrier of the present invention is further provided with a through hole 18 in the base material and laminated with a protective film.
Formation of the through-hole 18 can be performed by a continuous process using a punching device, or may be punched in a cut sheet state. As long as the area and size of the through hole are not deformed while maintaining the form of the base film 1b, the larger the area, the greater the effect of strength.

  Next, protective films 21 and 22 are laminated in the step of FIG. In the case of finishing in a hard card state, generally, the non-contact data carrier base material 11 is sandwiched between materials of a heat-fusible material such as a hard vinyl chloride sheet, and is further hot-pressed through a mirror plate. By doing so, a card-like non-contact data carrier is obtained. Even if a difference in thickness occurs between the through-hole portion and the non-through-hole portion, there is an effect that it can be forced to a uniform thickness in the case of hot press using a mirror plate. When it is not limited to a card shape but a flexible sheet state, a protective film may be laminated in a continuous thermal lamination process.

  FIG. 2C shows a state after the protective film is adhered. Through the through hole, a heat-bonding portion 30 is formed between the protective films 21 and 22, and a non-contact data carrier in which the film layers are firmly bonded is obtained. In the case of FIG. 2, the width of the non-contact data carrier substrate 11 is narrower than that of the protective films 21 and 22. Part 30e is configured. When such an adhesive portion is formed, it is preferable to prevent peeling from the edge of the non-contact data carrier.

  Next, materials used in the present invention will be described. Various materials such as paper, PET, polypropylene, polyethylene, vinyl chloride, acrylic, non-crystalline polyester, polyurethane, ABS resin, polystyrene, and nylon are used as the base film 1b used for the non-contact data carrier base material 11. However, it is necessary to select in consideration of the process of forming the coil antenna. In the case of paper, a paper that has been subjected to water resistance treatment and the like and has high insulation properties is preferable. Although a thickness of 15 to 300 μm can be used, it is preferable to use a thin film substrate so that the non-contact data carrier after lamination has a uniform thickness. Generally, 20-100 micrometers is more preferable from points, such as intensity | strength, workability | operativity, and cost.

  For the films (or sheets) used for the protective films 21 and 22, a heat-sealable material can be used. Specifically, acrylic, amorphous polyester, polyurethane, polypropylene, polyethylene, vinyl chloride, vinylidene chloride, ABS resin, etc., and composites thereof can be used. A thickness of about 15 to 500 μm is selected according to the purpose.

  An IC chip (semiconductor device) is an integrated circuit or memory formed on a silicon substrate, and for non-contact data carriers, the size is about 2 mm × 2 mm, and the thickness is 0.5 mm or less. Things are used. For communication with the reader / writer, generally, frequency bands of 125 kHz, 13.56 MHz, 800 MHz, 2.45 GHz, and 5.8 GHz (microwave) are used. Non-contact IC tags often use 13.56 MHz, and various reader / writers are commercially available.

(Embodiment) An embodiment of the present invention will be described with reference to FIGS. A carrier film 1b was prepared by dry laminating a 50 μm thick aluminum foil on a 25 μm thick polyethylene terephthalate (PET) film. After the photosensitive resist (made by The Inktec Co., Ltd.) made of vinyl chloride resin is applied on the aluminum foil surface so that the thickness after drying becomes 1 μm, the coil antenna pattern is exposed and developed. Then, the aluminum exposed portion was etched with an aqueous ferric chloride solution to obtain a sheet having a six-sided (2 × 3 surface) coil antenna 12.

  Next, an IC chip 15 having spike-like bumps 23 and 24 having a thickness of 200 μm and a height of 70 μm is prepared, and an epoxy-based thermosetting adhesive is applied to the IC chip mounting portion. In the down state, the coil antenna 12 was placed in alignment with both connection ends 12e. Furthermore, the IC chip was mounted by applying heat pressure at 150 ° C. and 1.2 MPa from the IC chip 15 side to complete the non-contact data carrier substrate 11. Next, one circular through hole with a diameter of 20 mm was provided at the center of the inner peripheral area of the coil antenna of the substrate film 1b, and six small through holes 18 with a diameter of 6 mm were provided on both sides of the substrate. In addition, a groove-shaped punched portion having a width of 4 mm was formed so as to form a continuous adhesive portion when the diagonal portions between the impositions were left connected and the other edge portions were cut out.

  The above-mentioned non-contact data carrier substrate 11 is used as a central layer, and a white hard vinyl chloride sheet having a thickness of 360 μm is laminated on both sides of the substrate, sandwiched between mirror surface stainless steel plates, and then introduced into a press machine at 135 ° C., 0 ° The laminate was pressed under conditions of 5 MPa for 120 seconds. Thereafter, the cut position was passed through the center of the groove having a width of 4 mm, and the outer size was cut into a predetermined card shape, thereby completing the non-contact data carrier 10.

  The completed non-contact data carrier had a thickness of 0.745 mm, and the hard vinyl chloride sheets on the front and back sides were firmly bonded. There was no generation of bubbles or the like in the non-contact data carrier, and the flatness was good. In addition, after recording predetermined data on a non-contact data carrier, an information reading test was performed using a Motorola BiStatix reader “WAVE” as a reading device. confirmed.

It is a figure which shows the example of the non-contact data carrier of this invention, and the base material for non-contact data carriers. It is a figure which shows the process of manufacturing the non-contact data carrier of this invention. It is a figure which shows the non-contact data carrier of a prior art example.

Explanation of symbols

1b, 4b Base film 10, 40 Non-contact data carrier 11, 41 Non-contact data carrier base 12, 42 Coil antennas 12e, 42e Both antenna connection ends 13, 43 Conductive members 15, 45 IC chips 18, 18a , 18b, 18c,..., 18n Through holes 21, 22, 51, 52 Protective films 23, 24 Bumps 30 Heat-sealed portions 46, 47 Adhesive

Claims (4)

A non-contact data carrier substrate having an antenna formed on at least one side of the film substrate and an IC chip connected to the end of the antenna as a central layer, and a rectangular shape in which a protective film is laminated on the front and back In the non-contact data carrier, at least a part between the front and back protective films is heat-sealed through a through-hole punched out from the non-contact data carrier base material , and the edge is through a groove punched out except for the diagonal part. A non-contact data carrier having a continuous adhesive portion in which the front and back protective films are heat-sealed . The antenna has a flat coil shape and is formed on one side of the film substrate, and a part of the antenna is connected on the other side of the non-contact data carrier substrate via a conductive member or through hole. contactless data carrier of claim 1 Symbol mounting characterized.
The antenna has a planar coil shape and is formed on both surfaces of the film substrate, and the antenna is connected to the antenna on the other surface of the film substrate through a conductive member or a through hole. The non-contact data carrier according to claim 1 or 2. Etching a base film laminated with a metal foil to form a coil antenna;
A step of creating a non-contact data carrier base material in which an IC chip is attached to the coil antenna of the base film and a rectangular non-contact data carrier is multifaceted;
Provided with a through-hole in the interior of the coil antenna of the multi with contactless data carrier base material, leaving the diagonal section to the data for each carrier unit of the substrate is to be connected, the edge portion of the data carrier Forming groove-shaped punched portions between the data carriers ,
The multi-sided non-contact data carrier base material is a center layer, a protective film is laminated on both sides and hot-pressed,
So as to pass through the center of the groove-like stamping unit, the step of performing external dimensions cut contactless data carrier,
A method for manufacturing a non-contact data carrier, comprising: