JPH0824892B2 - Resist coating method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for applying a resist to a substrate such as glass.

2. Description of the Related Art The conventional general resist coating method is spin coating using a spinner as shown in FIG. In FIG. 3, a base material 3 such as glass is placed on the turntable 2 in the main body 1.
Is placed. Then, the resist extruded from the resist container 4 under pressure by the pressurizing tube 5 is dropped onto the base material 3 through the tube 6 and the nozzle 7. Then the motor 8
In this method, the turntable 2 is rotated and the resist is diffused and coated on the base material 3 by centrifugal force.
Incidentally, 9 is a support base.

Problems to be Solved by the Invention However, in the case of a resist having a large surface tension, there is a problem that the resist shrinks on the substrate and a uniform film thickness cannot be obtained. Also, as a countermeasure against this, a method of dropping a large amount of resist on the base material is used. Even in this case, although the center of rotation of the base material can be applied relatively uniformly, the peripheral portion remains as an uneven film thickness, and There was a problem in that most of the resist in some parts had to be removed.

In view of this point, the present invention provides a method for uniformly applying a resist on a substrate.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention, when applying a resist on a substrate, applies the solvent used for the resist and then drops the resist on the substrate. Is applied by rotating.

Action According to the above coating method, the solvent is first coated on the substrate prior to the coating of the resist. Next, when a resist containing the same solvent as this solvent is applied, the resist is easily mixed with the previously applied solvent, and as a result, the resist can have a uniform film thickness over the entire surface of the substrate. Become.

Example Hereinafter, a resist coating method according to an example of the present invention will be described with reference to the drawings.

In FIG. 1, on the turntable 11 in the main body 10,
Barium borosilicate glass (Corning 7059, hereinafter simply referred to as glass) 12 having a diameter of 10 cm was placed as a substrate. Then, from the solvent container 13 on the glass 12, the solvent (2-butoxyethanol) pressurized and extruded from the solvent pressurizing pipe 14 through the tube 15, 2c.c.
Turntable 11 driven by motor 17 at 500 rpm
It was rotated for 10 seconds. Then, the resist (novolak resin + diazo photosensitizer + 2-butoxyethanol) extruded from the resist container 18 on the glass 12 coated with the solvent is extruded from the resist container 18 through the tube 20 for resist. 3 c.c. was dropped from the nozzle 21, and the turntable 11 was rotated at 1000 rpm for 10 seconds. As a result, the resist could be applied uniformly with a film thickness of about 1 μm. 22,23
Is a support base.

Next, the operation of the above embodiment will be described with reference to FIG. The resist is composed of a solvent, a resin and a photosensitizer, and among them, the solvent affects the permeability of the resist. As shown in FIG. 2A, even if the solvent 25 is applied on the glass 24, the surface tension is large and the penetrability is poor, so that it is not applied uniformly on the glass 24 and is partially applied. Becomes Next, when a resist 26 is applied, as shown in FIG.
As shown in (4), the resist 26 enters the portion not wet with the solvent 25. In this state, the solvent in the resist 26 is mixed with the solvent 25 previously applied to form a resist 27 having a uniform film thickness as shown in FIG. 2c.

Effect of the Invention According to the present invention, although the step of solvent coating is increased, without using a large amount of resist as in the conventional case,
A uniform film thickness can be achieved. Further, the film thickness is uniform even at the peripheral portion of the base material, which is extremely useful in practice.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of a resist coating apparatus for realizing a resist coating method according to an embodiment of the present invention, FIG. 2 is a schematic diagram for explaining the resist coating method of the present invention, and FIG. 3 is a conventional resist coating apparatus. It is a figure which shows the structure of. 11 …… turntable, 12 …… glass, 13 …… solvent container, 16 …… solvent nozzle, 18 …… resist container, 21 ……
Resist nozzle, 25 …… solvent, 26 …… resist.

Claims (1)

[Claims] 1. When applying a resist on a substrate, the solvent used for the resist is dropped onto the substrate, the substrate is rotated, and the substrate is stopped after a predetermined time,
A resist coating method comprising: dropping a resist on the base material coated with a solvent, rotating the base material, and stopping the base material after a predetermined time.