JPH07283174A - Dicing device - Google Patents
Dicing deviceInfo
- Publication number
- JPH07283174A JPH07283174A JP10081894A JP10081894A JPH07283174A JP H07283174 A JPH07283174 A JP H07283174A JP 10081894 A JP10081894 A JP 10081894A JP 10081894 A JP10081894 A JP 10081894A JP H07283174 A JPH07283174 A JP H07283174A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- wafer
- dicing
- holding jig
- sheet holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Vacuum Packaging (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばセラミックスや
シリコン等からなるウエーハをチップに分離するための
ダイシング装置、特にそのダイシングテーブルにウエー
ハを保持するための構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for separating a wafer made of, for example, ceramics or silicon into chips, and more particularly to a structure for holding the wafer on a dicing table.
【０００２】[0002]
【従来の技術】従来、セラミックスウエーハやシリコン
ウエーハから多数のチップを得るため、図１に示される
ダイシング装置が用いられている。即ち、図１（ａ）の
ように紫外線を照射しあるいは加熱することにより接着
力が低下する接着剤が片面に塗布されたシート１の接着
面上にはウエーハ２が貼り付けられ、シート１の接着面
の周辺部にはリング状のフレーム３が貼り付けられてい
る。一方、ダイシングテーブル４はポーラスな材料で形
成されており、その下面側は真空吸引装置に接続されて
いる。ダイシングテーブル４の中央部上面は平坦で、周
縁部４ａは一段低くなる形状に形成されている。シート
１をダイシングテーブル４にセットするには、図１
（ｂ）のようにシート１の下面（非粘着面）をダイシン
グテーブル４上に載置し、シート１の周縁部をフレーム
３でダイシングテーブル４の周縁部４ａに押え付ける。
そして、ダイシングテーブル４の下面側から真空吸引す
ることにより、シート１を均一に吸着しながら、ダイサ
ーブレード５を用いてダイシングすることにより、ウエ
ーハ２を細分割している。なお、ダイシングテーブル４
の周縁部４ａを低くしたのは、ダイサーブレード５とフ
レーム３とが干渉するのを防止するためである。2. Description of the Related Art Conventionally, the dicing apparatus shown in FIG. 1 has been used to obtain a large number of chips from a ceramic wafer or a silicon wafer. That is, as shown in FIG. 1A, a wafer 2 is attached on the adhesive surface of a sheet 1 on one side of which an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays or heating is applied, A ring-shaped frame 3 is attached to the periphery of the adhesive surface. On the other hand, the dicing table 4 is made of a porous material, and its lower surface side is connected to a vacuum suction device. The upper surface of the central portion of the dicing table 4 is flat, and the peripheral edge portion 4a is formed in a shape that is lowered by one step. To set the sheet 1 on the dicing table 4, refer to FIG.
As shown in (b), the lower surface (non-adhesive surface) of the sheet 1 is placed on the dicing table 4, and the peripheral edge of the sheet 1 is pressed by the frame 3 against the peripheral edge 4 a of the dicing table 4.
Then, the wafer 2 is subdivided by dicing using the dicer blade 5 while sucking the sheet 1 uniformly by vacuum suction from the lower surface side of the dicing table 4. In addition, the dicing table 4
The reason why the peripheral edge portion 4a is lowered is to prevent the dicer blade 5 and the frame 3 from interfering with each other.
【０００３】上記ダイシング装置の場合、シート１の周
縁部がフレーム３によって押え付けられ、中央部がダイ
シングテーブル４によって吸着されるので、シート１が
ダイシングテーブル４に安定して保持され、ダイシング
時にシート１が位置ずれを起こさないという特徴があ
る。しかしながら、シート１を搬送する際、シート１の
周辺部がフレーム３で支持されているに過ぎないので、
シート１がウエーハ２の重量で弛みやすい。また、シー
ト１をダイシングテーブル４の周縁部４ａに押え付けた
際、シート１が多少引き延ばされる。そのため、ダイシ
ングテーブル４上のウエーハ２の位置が一定せず、高精
度のダイシングが難しいという欠点がある。特に、シー
ト１上に複数のウエーハが貼着されている場合、各ウエ
ーハの位置決めは一層難しい。高精度のダイシングを行
うには、画像認識装置などによってウエーハ２の位置を
１個ずつ読み取る必要があり、作業時間がかかるととも
に、コスト高になっていた。In the case of the above dicing apparatus, the peripheral portion of the sheet 1 is pressed by the frame 3 and the central portion is adsorbed by the dicing table 4, so that the sheet 1 is stably held on the dicing table 4 and is held during dicing. 1 has a feature that it does not cause a position shift. However, since the peripheral portion of the sheet 1 is merely supported by the frame 3 when the sheet 1 is conveyed,
The sheet 1 is easily loosened by the weight of the wafer 2. When the sheet 1 is pressed against the peripheral edge portion 4a of the dicing table 4, the sheet 1 is stretched to some extent. Therefore, there is a drawback that the position of the wafer 2 on the dicing table 4 is not constant, and high-precision dicing is difficult. Particularly, when a plurality of wafers are attached on the sheet 1, it is more difficult to position each wafer. In order to perform highly accurate dicing, it is necessary to read the positions of the wafers 2 one by one with an image recognition device or the like, which requires a long working time and high cost.
【０００４】[0004]
【発明が解決しようとする課題】そこで、シートを平板
状のシート保持治具上に貼り付け、このシート上にウエ
ーハを貼り付けるようにしたものもある。上記シート
は、その上面に加熱により粘着力が低下する発泡剥離性
の第１粘着層が設けられ、下面には加熱により粘着力が
低下しない又は粘着力の低下が第１粘着層より小さい第
２粘着層が設けられた両面粘着シートである。この場合
には、シートの下面がシート保持治具で支持されるの
で、シートに弛みが生じる心配がなく、シート保持治具
をダイシング装置に位置決めすれば、ウエーハも自動的
に位置決めされるため、位置精度が高くなる利点があ
る。Therefore, there is also one in which a sheet is stuck on a flat sheet holding jig, and a wafer is stuck on this sheet. The above-mentioned sheet has a foam-peelable first adhesive layer whose adhesive strength is reduced by heating on its upper surface, and whose adhesive strength is not reduced by heating or whose adhesive strength is lower than that of the first adhesive layer by the second surface. It is a double-sided adhesive sheet provided with an adhesive layer. In this case, since the lower surface of the sheet is supported by the sheet holding jig, there is no concern that the sheet will be loosened, and if the sheet holding jig is positioned in the dicing device, the wafer is also automatically positioned. There is an advantage that the position accuracy becomes high.
【０００５】ところが、上記のように特殊な粘着層を両
面に設けたシートは高価であり、特にシートは１回のダ
イシングが終了すれば廃棄される消耗品であるので、コ
スト上昇を招く欠点がある。そこで、本発明の目的は、
画像認識装置等を必要とせずに、ウエーハをダイシング
テーブルに対して高精度に位置決めできるダイシング装
置を提供することにある。他の目的は、両面粘着シート
のような特殊なシートを使用せずに、ダイシング時にお
けるシートの横ずれを防止できるダイシング装置を提供
することにある。However, the sheet provided with the special adhesive layers on both sides as described above is expensive, and in particular, the sheet is a consumable item that is discarded after one dicing, and thus has a drawback of increasing cost. is there. Therefore, the purpose of the present invention is to
An object of the present invention is to provide a dicing device that can position a wafer with high accuracy on a dicing table without requiring an image recognition device or the like. Another object is to provide a dicing device capable of preventing lateral deviation of a sheet during dicing without using a special sheet such as a double-sided adhesive sheet.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明のダイシング装置は、ウエーハを切断してチ
ップに分離するためのダイシング装置において、上面に
複数のウエーハを所定間隔をあけて貼り付けたウエーハ
固定用シートと、硬質板にて平板状に形成されたベース
板を備え、このベース板の上面に上記シートの下面を粘
着保持するとともに、上記シートに貼り付けられたウエ
ーハと対応するベース板の部位に、ウエーハとほぼ同等
の大きさの複数の貫通穴を有するシート保持治具と、上
面に上記貫通穴と嵌合しかつシート保持治具の厚みとほ
ぼ同一高さの複数の凸部を有し、この凸部の上面に真空
吸引装置と接続されたシート吸着穴を設けたダイシング
テーブルと、を備えたものである。In order to achieve the above object, the dicing apparatus of the present invention is a dicing apparatus for cutting a wafer to separate it into chips, and a plurality of wafers are attached to the upper surface at predetermined intervals. A wafer fixing sheet attached and a base plate formed in a flat plate shape with a hard plate are provided, and the lower surface of the sheet is adhesively held on the upper surface of the base plate and corresponds to the wafer attached to the sheet. A sheet holding jig having a plurality of through holes of approximately the same size as the wafer at the site of the base plate, and a plurality of sheet holding jigs fitted on the upper surface and having the same height as the thickness of the sheet holding jig. And a dicing table having a convex portion and a sheet suction hole connected to a vacuum suction device on the upper surface of the convex portion.
【０００７】[0007]
【作用】シートの下面をシート保持治具の上面に粘着保
持し、シート保持治具の貫通穴に対応するシートの上面
にウエーハを貼り付ける。なお、予め上面にウエーハを
貼り付けたシートをシート保持治具の上面に粘着保持し
てもよい。このシート保持治具をダイシング装置へ搬送
する際、シートは周辺部だけでなくウエーハの隙間の部
分もシート保持治具で支持されるので、シートの撓みを
防止できる。次に、このシート保持治具をダイシングテ
ーブル上に載置すると、ダイシングテーブル上に形成さ
れた複数の凸部がシート保持治具の貫通穴に夫々嵌合す
る。この時、凸部の高さはシート保持治具の厚みとほぼ
等しいので、シートの下面が凸部の上面で支えられ、シ
ートの貫通穴に対応する部分は撓まない。次に、真空吸
引装置によって凸部の上面に形成されたシート吸着穴か
らシートを吸着すると、シートはダイシングテーブルに
対して吸着保持される。この状態でダイシングを行う
と、シートはウエーハ部分が凸部で吸着され、その他の
部分がシート保持治具に粘着保持されるので、シートに
横ずれが発生しない。また、シートが弛まず、かつ引き
延ばされることもないので、ダイシング時における位置
精度が高く、ウエーハを高精度にダイシングできる。ダ
イシング後、真空吸引装置を停止し、シート保持治具を
持ち上げれば、簡単にシート保持治具をダイシングテー
ブルから取り出すことができる。その後、シートからチ
ップを取り出せばよい。Function: The lower surface of the sheet is adhesively held on the upper surface of the sheet holding jig, and the wafer is attached to the upper surface of the sheet corresponding to the through hole of the sheet holding jig. A sheet having a wafer attached in advance on the upper surface thereof may be adhesively held on the upper surface of the sheet holding jig. When the sheet holding jig is conveyed to the dicing device, the sheet is supported not only in the peripheral portion but also in the gap portion of the wafer by the sheet holding jig, so that the bending of the sheet can be prevented. Next, when the sheet holding jig is placed on the dicing table, the plurality of convex portions formed on the dicing table fit into the through holes of the sheet holding jig. At this time, since the height of the convex portion is substantially equal to the thickness of the sheet holding jig, the lower surface of the sheet is supported by the upper surface of the convex portion, and the portion corresponding to the through hole of the sheet does not bend. Next, when the sheet is sucked by the vacuum suction device through the sheet suction hole formed on the upper surface of the convex portion, the sheet is suction-held to the dicing table. When dicing is performed in this state, the wafer portion of the sheet is adsorbed by the convex portions and the other portions are adhesively held by the sheet holding jig, so that the sheet does not laterally shift. Further, since the sheet does not sag and is not stretched, the positional accuracy during dicing is high, and the wafer can be diced with high accuracy. After dicing, the vacuum suction device is stopped and the sheet holding jig is lifted, so that the sheet holding jig can be easily taken out from the dicing table. Then, the chip may be taken out from the sheet.
【０００８】ウエーハを貼着したシートの上面には、紫
外線を照射しあるいは加熱することにより粘着力が低下
する粘着層を設けるのが望ましい。ダイシング後、シー
トからチップを傷付けずに容易に剥離できるからであ
る。シート保持治具にはウエーハに対応する貫通穴が設
けられているので、この貫通穴を介してシートの裏側
（下面側）から紫外線を照射し、あるいは加熱すれば、
シートのチップを貼り付けた部位の粘着力を効率よく低
下させることができる。シート保持治具の上面にシート
を安定して粘着保持するため、ベース板の上面またはシ
ートの下面の双方または一方に粘着性シリコーンゴムや
シリコーンゲル等の粘着層を設けるのが望ましい。この
場合、シートはダイシング工程に１回使用すれば廃棄さ
れるのに対し、シート保持治具は繰り返し使用されるの
で、シート保持治具の上面に粘着層を設ける方がコスト
上望ましい。シートの上面の粘着層が加熱により粘着力
が低下する発泡剥離性粘着剤の場合、加熱温度は約１２
０°Ｃ程度であるため、ベース板の上面に設けられる粘
着層は耐熱性を有するシリコーンゴムが望ましい。ま
た、シート保持治具の素材も鉄，ステンレス（例えばＳ
ＵＳ），ガラス，アルミニウムのような比較的耐熱性を
有する材料を用いるのが望ましい。It is desirable to provide an adhesive layer on the upper surface of the sheet to which the wafer is adhered, the adhesive force of which decreases by irradiating or heating ultraviolet rays. This is because after dicing, the chips can be easily peeled off from the sheet without damaging them. Since the sheet holding jig is provided with a through hole corresponding to the wafer, if ultraviolet rays are irradiated from the back side (lower surface side) of the sheet through this through hole or heating is performed,
It is possible to efficiently reduce the adhesive force of the portion of the sheet to which the chip is attached. In order to stably and adhesively hold the sheet on the upper surface of the sheet holding jig, it is desirable to provide an adhesive layer such as an adhesive silicone rubber or silicone gel on either or both of the upper surface of the base plate and the lower surface of the sheet. In this case, the sheet is discarded if it is used once in the dicing process, whereas the sheet holding jig is repeatedly used. Therefore, it is more cost effective to provide the adhesive layer on the upper surface of the sheet holding jig. When the pressure-sensitive adhesive layer on the upper surface of the sheet is a foam-peelable pressure-sensitive adhesive whose adhesive strength decreases by heating, the heating temperature is about 12
Since the temperature is about 0 ° C., the adhesive layer provided on the upper surface of the base plate is preferably made of heat-resistant silicone rubber. The material of the sheet holding jig is also iron or stainless steel (for example, S
It is desirable to use a material having a relatively high heat resistance such as US), glass and aluminum.
【０００９】[0009]
【実施例】図２，図３は本発明にかかるダイシング装置
の一例を示す。ダイシングテーブル１０はポーラス状の
材料よりなり、上面には一定幅の溝１１によって縦横に
分離された複数の凸部１２が形成されている。凸部１２
の上面は平坦で後述するウエーハＷとほぼ同等な大きさ
に形成され、この上面に微小なシート吸着穴１３が多数
開口している。これら吸着穴１３はダイシングテーブル
１０の下側に配置された真空吸引装置１４にチューブ１
５を介して接続されている。ダイシングテーブル１０の
周辺部の上面には、シート保持治具２０を位置決めする
ための２本の位置決めピン１６，１７が突設されてい
る。なお、ダイシングテーブル１０は、少なくとも凸部
１２の上面に多数の吸着穴１３が開口しておればよく、
必ずしもポーラスな材料で形成する必要はない。2 and 3 show an example of a dicing apparatus according to the present invention. The dicing table 10 is made of a porous material and has a plurality of convex portions 12 vertically and horizontally separated by grooves 11 having a constant width on the upper surface. Convex 12
Has a flat upper surface and is formed to have a size substantially equal to that of a wafer W to be described later, and a large number of small sheet suction holes 13 are formed on the upper surface. These suction holes 13 are attached to the vacuum suction device 14 arranged below the dicing table 10 to form the tube 1
It is connected via 5. Two positioning pins 16 and 17 for positioning the sheet holding jig 20 are projectingly provided on the upper surface of the peripheral portion of the dicing table 10. In the dicing table 10, it is sufficient that a large number of suction holes 13 are opened at least on the upper surface of the convex portion 12,
It does not necessarily have to be formed of a porous material.
【００１０】シート保持治具２０は矩形板状のベース板
２１を備えている。このベース板２１は、鉄，アルミニ
ウムなどの金属材料、セラミックス、ガラス、樹脂等よ
りなる硬質板であり、その上下面は平坦な平滑面となっ
ている。ベース板２１には、上記凸部１２が遊嵌合する
方形の貫通穴２２が複数個設けられている。貫通穴２２
の形状は、後述するウエーハＷよりやや大きめに形成さ
れている。また、ベース板２１の上面には、粘着性シリ
コーンゴムシート等からなる粘着層２３が固着されてお
り、この粘着層２３は少なくとも貫通穴２２を設けたベ
ース板２１の領域の上面を覆っている。粘着層２３を含
むシート保持治具２０の全体の厚みは、上記凸部１２の
突出高さと等しい。The sheet holding jig 20 is provided with a rectangular base plate 21. The base plate 21 is a hard plate made of a metal material such as iron or aluminum, ceramics, glass, resin or the like, and its upper and lower surfaces are flat and smooth. The base plate 21 is provided with a plurality of rectangular through holes 22 into which the protrusions 12 are loosely fitted. Through hole 22
Has a shape slightly larger than a wafer W described later. An adhesive layer 23 made of an adhesive silicone rubber sheet or the like is fixed on the upper surface of the base plate 21, and the adhesive layer 23 covers at least the upper surface of the region of the base plate 21 where the through holes 22 are provided. . The entire thickness of the sheet holding jig 20 including the adhesive layer 23 is equal to the protruding height of the convex portion 12.
【００１１】上記シート保持治具２０の上面にはウエー
ハ固定用シート３０が粘着保持されている。シート３０
は、図４に示すように、ＰＥＴフィルムなどの合成樹脂
フィルムよりなる基材フィルム３１の上面に粘着層３２
を形成したものであり、この粘着層３２上にセラミック
スまたはシリコンからなるウエーハＷが所定間隔を開け
て貼着されている。ウエーハＷの貼着位置は、シート保
持治具２０の貫通穴２２と対応している。粘着層３２
は、加熱により粘着力が低下する発泡剥離性の粘着剤よ
りなり、具体的にはアクリル系粘着剤、イソブタン系発
泡剤などを用いることができる。シート３０の非粘着面
である下面はシート保持治具２０の粘着層２３上に粘着
される。粘着層３２としては、発泡剥離性の粘着剤に代
えて、紫外線により粘着力が低下する粘着剤を用いても
よい。A wafer fixing sheet 30 is adhesively held on the upper surface of the sheet holding jig 20. Seat 30
As shown in FIG. 4, the adhesive layer 32 is formed on the upper surface of the base film 31 made of a synthetic resin film such as a PET film.
A wafer W made of ceramics or silicon is adhered on the adhesive layer 32 with a predetermined gap. The attachment position of the wafer W corresponds to the through hole 22 of the sheet holding jig 20. Adhesive layer 32
Is composed of a foaming and peeling pressure-sensitive adhesive whose adhesive strength is reduced by heating, and specifically, an acrylic pressure-sensitive adhesive, an isobutane-based foaming agent or the like can be used. The lower surface, which is the non-adhesive surface of the sheet 30, is adhered onto the adhesive layer 23 of the sheet holding jig 20. As the adhesive layer 32, an adhesive whose adhesive force is reduced by ultraviolet rays may be used instead of the foam-peelable adhesive.
【００１２】上記ダイシングテーブル１０の上面に載置
されたシート保持治具２０は、空圧または油圧シリン
ダ、リニアアクチュエータなどの駆動装置１８によって
位置決めピン１６，１７に押し付けられることにより、
Ｘ，Ｙ方向に正確に位置決めされる。即ち、ベース板２
１の一辺には位置決めピン１６と係合するＶノッチ２４
が形成されており、図３のように、Ｖノッチ２４と位置
決めピン１６とが２点で接触することによりＸ方向に位
置決めされ、Ｖノッチ２４とピン１６との２点の接触お
よびシート保持治具２０とピン１７との接触によりＹ方
向に位置決めされる。The sheet holding jig 20 placed on the upper surface of the dicing table 10 is pressed against the positioning pins 16 and 17 by a driving device 18 such as a pneumatic or hydraulic cylinder or a linear actuator.
Accurately positioned in the X and Y directions. That is, the base plate 2
V notch 24 engaging with positioning pin 16 on one side
As shown in FIG. 3, the V notch 24 and the positioning pin 16 come into contact with each other at two points to be positioned in the X direction, and the V notch 24 and the pin 16 come into contact with each other at two points and the sheet holding treatment is performed. The tool 20 and the pin 17 are brought into contact with each other to be positioned in the Y direction.
【００１３】つぎに、上記シート保持治具２０を用いて
ウエーハＷをダイシングする動作を説明する。まず、シ
ート３０をシート保持治具２０の粘着層２３上に載置
し、粘着層２３によりシート３０を粘着保持した後、貫
通穴２２と対応するシート３０の上面にウエーハＷを貼
り付ける。次に、シート保持治具２０を適宜の搬送手段
によってダイシングテーブル１０まで搬送し、貫通穴２
２をダイシングテーブル１０の凸部１２に嵌合させる。
そして、シリンダ装置１８によってシート保持治具２０
を位置決めピン１６，１７に押しつけ、位置決めする。
これにより、シート３０に貼着されたウエーハＷもダイ
シングテーブル１０に対して正確に位置決めされる。Next, the operation of dicing the wafer W using the sheet holding jig 20 will be described. First, the sheet 30 is placed on the adhesive layer 23 of the sheet holding jig 20, the sheet 30 is adhesively held by the adhesive layer 23, and then the wafer W is attached to the upper surface of the sheet 30 corresponding to the through holes 22. Next, the sheet holding jig 20 is conveyed to the dicing table 10 by an appropriate conveying means, and the through hole 2
2 is fitted to the convex portion 12 of the dicing table 10.
Then, the sheet holding jig 20 is moved by the cylinder device 18.
Is pressed against the positioning pins 16 and 17 for positioning.
As a result, the wafer W attached to the sheet 30 is also accurately positioned with respect to the dicing table 10.
【００１４】次に、真空吸引装置１４を駆動し、シート
３０を凸部１２の上面に吸着する。このとき、シート３
０の貫通穴２２と対応する部分、即ちウエーハＷを貼着
した部分はダイシングテーブル１０の凸部１２の上面に
密着し、しかも凸部１２の高さは粘着層２３を含むシー
ト保持治具２０の全体の厚みと等しいので、シート３０
を吸着した時にシート３０に撓みが生じない。上記のよ
うにシート３０を吸着した状態で、図５のようにダイサ
ーブレード１９によってウエーハＷをダイシングする。
この時、ウエーハＷと共にシート３０の一部もブレード
１９で削られるが、凸部１２や粘着層２３を傷付けない
ように調整されている。Next, the vacuum suction device 14 is driven to suck the sheet 30 onto the upper surface of the convex portion 12. At this time, sheet 3
The portion corresponding to the through hole 22 of 0, that is, the portion to which the wafer W is adhered is in close contact with the upper surface of the convex portion 12 of the dicing table 10, and the height of the convex portion 12 is the sheet holding jig 20 including the adhesive layer 23. Since it is equal to the total thickness of the sheet 30
When the sheet is adsorbed, the sheet 30 does not bend. With the sheet 30 adsorbed as described above, the wafer W is diced by the dicer blade 19 as shown in FIG.
At this time, a part of the sheet 30 along with the wafer W is also cut by the blade 19, but it is adjusted so as not to damage the convex portion 12 and the adhesive layer 23.
【００１５】ダイシング後、真空吸引装置１４を停止す
るとともに、シリンダ装置１８を開放し、シート保持治
具２０をダイシングテーブル１０から取り出す。図６は
ダイシングテーブル１０から取り出されたシート保持治
具２０を示す。ダイシングテーブル１０からシート３０
を取り出す際、シート３０はシート保持治具２０と同時
に取り出されるので、シート３０に撓みが発生しにく
い。そのため、シート３０に無理な力が作用せず、シー
ト３０が破れる心配がない。After dicing, the vacuum suction device 14 is stopped, the cylinder device 18 is opened, and the sheet holding jig 20 is taken out from the dicing table 10. FIG. 6 shows the sheet holding jig 20 taken out from the dicing table 10. Sheet 30 from dicing table 10
When the sheet is taken out, the sheet 30 is taken out at the same time as the sheet holding jig 20, so that the sheet 30 is less likely to bend. Therefore, no excessive force acts on the seat 30, and there is no concern that the seat 30 will be torn.
【００１６】シート保持治具２０を剥離装置（図示せ
ず）へ搬送し、シート３０からチップＣを剥離する。剥
離方法としては、例えばシート保持治具２０の下側から
熱風を吹きつける方法や、シート保持治具２０をオーブ
ン内に収容し、全体を加熱する方法、ホットプレートを
用いて加熱する方法等がある。この時、シート保持治具
２０のチップＣと対応する部位に貫通穴２２が形成され
ているので、チップＣが貼着されたシート３０の部位を
効率良く加熱できる。加熱によりシート３０の粘着層３
２の粘着力が低下するので、吸引チャック装置等によっ
て個々のチップＣを吸着すれば、チップＣをシート３０
から簡単に取り出すことができ、しかもチップＣに過大
な力を与えない。なお、シート３０の粘着層３２が紫外
線により粘着力が低下する粘着層の場合には、シート保
持治具２０の貫通穴２２を介して下方から紫外線を照射
すれば、チップＣが貼着されたシート３０の部位の粘着
力のみを効率よく低下させることができる。チップＣを
剥離したシート３０はシート保持治具２０から引き剥が
され、廃棄される。シート保持治具２０はダイシング工
程へ運ばれ、再利用される。The sheet holding jig 20 is conveyed to a peeling device (not shown), and the chip C is peeled from the sheet 30. As the peeling method, for example, a method of blowing hot air from the lower side of the sheet holding jig 20, a method of housing the sheet holding jig 20 in an oven and heating the whole, a method of heating using a hot plate, and the like are available. is there. At this time, since the through hole 22 is formed in the portion of the sheet holding jig 20 corresponding to the chip C, the portion of the sheet 30 to which the chip C is attached can be efficiently heated. Adhesive layer 3 of sheet 30 by heating
Since the adhesive strength of No. 2 decreases, if the individual chips C are adsorbed by a suction chuck device or the like, the chips C are attached to the sheet 30.
Can be easily taken out, and the chip C is not given an excessive force. When the adhesive layer 32 of the sheet 30 is an adhesive layer whose adhesive strength is reduced by ultraviolet rays, the chips C are attached by irradiating ultraviolet rays from below through the through holes 22 of the sheet holding jig 20. Only the adhesive force of the site of the sheet 30 can be efficiently reduced. The sheet 30 from which the chips C have been peeled off is peeled off from the sheet holding jig 20 and discarded. The sheet holding jig 20 is transported to the dicing process and reused.
【００１７】なお、本発明は上記実施例に限るものでは
ない。本発明は、シリコンウエーハ、セラミックウエー
ハのほか、他のウエーハのダイシングにも用いることが
できる。また、シート保持治具をダイシングテーブルに
ＸＹ方向に位置決めするための手段としては、実施例の
ようにシート保持治具２０の一辺に設けたＶノッチ２４
と２本のピン１６，１７と駆動装置１８との組み合わせ
に限らない。例えば、シート保持治具の直角な２辺を位
置決めするダイシングテーブルの直角な衝止面と、これ
ら面にシート保持治具をＸＹ方向に押しつける２個の駆
動装置との組み合わせや、シート保持治具に設けた複数
の貫通穴と、ダイシングテーブルの上面に突設した貫通
穴に嵌合する複数のピンとの組み合わせでもよい。た
だ、実施例の場合には１個の駆動装置１８で済むため、
構造を簡素化でき、位置決め作業も早い。また、実施例
のようにウエーハＷやシート，シート保持治具の外径形
状は矩形状である必要はない。ただ、矩形状のウエーハ
Ｗを取り扱う場合、シートを矩形状とすれば、その有効
面積が増加することになり、必要とするシート面積を少
なくできるという利点がある。The present invention is not limited to the above embodiment. The present invention can be used for dicing other wafers in addition to silicon wafers and ceramic wafers. Further, as a means for positioning the sheet holding jig on the dicing table in the XY directions, a V notch 24 provided on one side of the sheet holding jig 20 as in the embodiment.
It is not limited to the combination of the two pins 16 and 17 and the drive device 18. For example, a combination of a right-angled stopping surface of a dicing table that positions two right-angled sides of a sheet holding jig and two driving devices that press the sheet holding jig against these surfaces in the XY directions, or a sheet holding jig. It is also possible to combine a plurality of through holes provided in the above with a plurality of pins that fit into the through holes provided on the upper surface of the dicing table. However, in the case of the embodiment, since only one drive device 18 is required,
The structure can be simplified and positioning work is quick. Further, the outer diameter shape of the wafer W, the sheet, and the sheet holding jig need not be rectangular as in the embodiment. However, in the case of handling a rectangular wafer W, if the sheet is rectangular, the effective area is increased, and there is an advantage that the required sheet area can be reduced.
【００１８】[0018]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、シート保持治具をダイシングテーブル上にセッ
トした際、シートのウエーハ貼着部の下面がダイシング
テーブルの凸部で支えられ、その他の部位はシート保持
治具で支えられるので、シートに撓みや伸びが発生しな
い。しかも、シートはシート保持治具上に粘着保持され
ているため、シート保持治具をダイシングテーブルに位
置決めすれば、シート上のウエーハもダイシングテーブ
ルに対して自動的に位置決めされる。その結果、従来の
ような画像認識装置を用いずにウエーハを高精度にダイ
シングできる。また、ダイシング中、シートには水平方
向の外力がかかるが、シートのウエーハ貼着部分が凸部
によって吸着されるとともに、その隙間の部分がシート
保持治具によって粘着保持されるので、シートの横ずれ
を確実に防止できる。そのため、カットずれを防止でき
る。さらに、シートはシート保持治具によってウエーハ
の隙間の部分が支持されるので、シートの搬送時にシー
トに弛みが発生しにくく、ウエーハおよびチップの位置
決め精度が高くなる。As is apparent from the above description, according to the present invention, when the sheet holding jig is set on the dicing table, the lower surface of the wafer adhering portion of the sheet is supported by the convex portion of the dicing table. Since the other parts are supported by the sheet holding jig, the sheet is not bent or stretched. Moreover, since the sheet is adhesively held on the sheet holding jig, if the sheet holding jig is positioned on the dicing table, the wafer on the sheet is also automatically positioned on the dicing table. As a result, the wafer can be diced with high accuracy without using a conventional image recognition device. Also, a horizontal external force is applied to the sheet during dicing, but the wafer sticking part of the sheet is adsorbed by the convex part and the gap part is adhesively held by the sheet holding jig, so the sheet is laterally displaced. Can be reliably prevented. Therefore, it is possible to prevent cut deviation. Further, since the sheet is supported by the sheet holding jig in the gap portion of the wafer, slack is unlikely to occur in the sheet when the sheet is conveyed, and the positioning accuracy of the wafer and the chip is improved.
【図１】従来のダイシング装置の動作を示す説明図であ
る。FIG. 1 is an explanatory diagram showing an operation of a conventional dicing device.
【図２】本発明にかかるダイシング装置の一例の斜視図
である。FIG. 2 is a perspective view of an example of a dicing apparatus according to the present invention.
【図３】シート保持治具をダイシングテーブルにセット
した状態の平面図である。FIG. 3 is a plan view showing a state where a sheet holding jig is set on a dicing table.
【図４】シートの断面図である。FIG. 4 is a sectional view of a sheet.
【図５】ダイシング動作を示す断面図である。FIG. 5 is a cross-sectional view showing a dicing operation.
【図６】ダイシングテーブルから取り出されたシート保
持治具の断面図である。FIG. 6 is a cross-sectional view of a sheet holding jig taken out from a dicing table.
１０ ダイシングテーブル １２ 凸部 １３ シート吸着穴 １４ 真空吸引装置 ２０ シート保持治具 ２１ ベース板 ２２ 貫通穴 ２３ 粘着層 ３０ ウエーハ固定用シート ３２ 粘着層 Ｗ ウエーハ 10 Dicing table 12 Convex part 13 Sheet suction hole 14 Vacuum suction device 20 Sheet holding jig 21 Base plate 22 Through hole 23 Adhesive layer 30 Wafer fixing sheet 32 Adhesive layer W wafer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/68 Ｐ Ｎ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H01L 21/68 PN
Claims (2)
のダイシング装置において、 上面に複数のウエーハを所定間隔をあけて貼り付けたウ
エーハ固定用シートと、 硬質板にて平板状に形成されたベース板を備え、このベ
ース板の上面に上記シートの下面を粘着保持するととも
に、上記シートに貼り付けられたウエーハと対応するベ
ース板の部位に、ウエーハとほぼ同等の大きさの複数の
貫通穴を有するシート保持治具と、 上面に上記貫通穴と嵌合しかつシート保持治具の厚みと
ほぼ同一高さの複数の凸部を有し、この凸部の上面に真
空吸引装置と接続されたシート吸着穴を設けたダイシン
グテーブルと、を備えたことを特徴とするダイシング装
置。1. A dicing device for cutting a wafer to separate it into chips. A wafer fixing sheet having a plurality of wafers attached to a top surface at predetermined intervals, and a hard plate formed into a flat plate shape. A base plate is provided, the lower surface of the sheet is adhesively held on the upper surface of the base plate, and a plurality of through-holes of approximately the same size as the wafer are formed in the portion of the base plate corresponding to the wafer attached to the sheet. And a sheet holding jig having a plurality of convex portions fitted on the upper surface and having substantially the same height as the thickness of the sheet holding jig. The upper surface of the convex portion is connected to a vacuum suction device. And a dicing table provided with sheet suction holes.
て、 上記シート保持治具のベース板の上面にはシートの下面
を粘着保持する粘着層が設けられていることを特徴とす
るダイシング装置。2. The dicing apparatus according to claim 1, wherein an adhesive layer for adhesively holding the lower surface of the sheet is provided on the upper surface of the base plate of the sheet holding jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10081894A JP3136898B2 (en) | 1994-04-13 | 1994-04-13 | Dicing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10081894A JP3136898B2 (en) | 1994-04-13 | 1994-04-13 | Dicing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07283174A true JPH07283174A (en) | 1995-10-27 |
| JP3136898B2 JP3136898B2 (en) | 2001-02-19 |
Family
ID=14283931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10081894A Expired - Lifetime JP3136898B2 (en) | 1994-04-13 | 1994-04-13 | Dicing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3136898B2 (en) |
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|---|---|---|---|---|
| WO1999039999A1 (en) * | 1998-02-09 | 1999-08-12 | Nikon Corporation | Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same |
| JP2003007650A (en) * | 2001-06-19 | 2003-01-10 | Tokyo Seimitsu Co Ltd | Dicing machine |
| JP2003209071A (en) * | 2002-01-15 | 2003-07-25 | Towa Corp | Jig for cutting resin sealed substrate |
| JP2006041245A (en) * | 2004-07-28 | 2006-02-09 | Murata Mfg Co Ltd | Dicing device and dicing method |
| KR100825691B1 (en) * | 1999-07-26 | 2008-04-29 | 가부시키가이샤 니콘 | Apparatus for supporting substrate and apparatus of processing substrate |
| JP2010153410A (en) * | 2008-11-27 | 2010-07-08 | Shin Etsu Polymer Co Ltd | Substrate holder and method of processing semiconductor wafer |
| CN113118810A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Clamping jig for electronic product parts |
| CN113118812A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Stable CNC machine tool fixture |
| CN113118826A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Processing jig for precise metal piece |
| CN113118813A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | CNC machine station for processing metal shell of electronic product |
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1994
- 1994-04-13 JP JP10081894A patent/JP3136898B2/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100638533B1 (en) * | 1998-02-09 | 2006-10-26 | 가부시키가이샤 니콘 | Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same |
| US6559928B1 (en) | 1998-02-09 | 2003-05-06 | Nikon Corporation | Substrate supporting apparatus, substrate transfer apparatus and the transfer method, method of holding the substrate, exposure apparatus and the method of manufacturing the apparatus |
| WO1999039999A1 (en) * | 1998-02-09 | 1999-08-12 | Nikon Corporation | Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same |
| KR100825691B1 (en) * | 1999-07-26 | 2008-04-29 | 가부시키가이샤 니콘 | Apparatus for supporting substrate and apparatus of processing substrate |
| JP2003007650A (en) * | 2001-06-19 | 2003-01-10 | Tokyo Seimitsu Co Ltd | Dicing machine |
| JP2003209071A (en) * | 2002-01-15 | 2003-07-25 | Towa Corp | Jig for cutting resin sealed substrate |
| JP2006041245A (en) * | 2004-07-28 | 2006-02-09 | Murata Mfg Co Ltd | Dicing device and dicing method |
| JP4517348B2 (en) * | 2004-07-28 | 2010-08-04 | 株式会社村田製作所 | Dicing apparatus and dicing method |
| JP2010153410A (en) * | 2008-11-27 | 2010-07-08 | Shin Etsu Polymer Co Ltd | Substrate holder and method of processing semiconductor wafer |
| CN113118810A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Clamping jig for electronic product parts |
| CN113118812A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Stable CNC machine tool fixture |
| CN113118826A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | Processing jig for precise metal piece |
| CN113118813A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | CNC machine station for processing metal shell of electronic product |
| CN113118811A (en) * | 2019-12-31 | 2021-07-16 | 苏州丰川电子科技有限公司 | CNC equipment of electron product accessory processing |
| CN115410962A (en) * | 2022-11-01 | 2022-11-29 | 四川九华光子通信技术有限公司 | Blue membrane of crystal plate pastes dress device |
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| Publication number | Publication date |
|---|---|
| JP3136898B2 (en) | 2001-02-19 |
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