JP2001085360A - Pasting method for electronic part and formation method for ditching on adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately, easily, and efficiently form, from one surface side of an adhesive tape, a ditch by engraving ditches which are orthogonal each other and are not cut through to the other surface side on the supplied adhesive tape using a ditching means. SOLUTION: Ditch pitches P1 and P2 are formed on an adhesive tape by moving a slider along a guide rail in Y direction by a moving amount P3 between chips 12a of an electronic part 12 while moving it along the guide rail in X direction. Thus, a cutting blade is moved in X-Y direction based on a pre-input data. When the cutting blade is moved in Y direction, a cutting-blade rotary mechanism provided in a cutter holder rotates the cutting blade by 90 deg., cutting the adhesive tape in Y direction as well. Thus, ditches 30a are formed for die (square) or strip (rectangular) in the specified region of the adhesive tape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching an electronic component such as a semiconductor chip and a method for forming a cut in an adhesive tape having a release material on both sides or one side thereof.

[0002]

2. Description of the Related Art Conventionally, for example, a semiconductor wafer of silicon or the like is manufactured in a large-diameter disk shape, and after a circuit pattern is formed on the surface thereof, a protective tape is adhered on the surface side to protect the circuit pattern. After that, the back side is generally cut to reduce the thickness.

[0003] In order to form a semiconductor chip from the semiconductor wafer thus processed, first, a semiconductor wafer manufactured in a large-diameter disk shape is attached to a ring frame via an adhesive tape. After that, a large number of chips are cut and separated (diced) into a dice shape (square) or a strip shape (rectangle). Then, as shown in FIG. 13, the chips 65 are pushed up one by one with the push-up pins 63 from the back side of the adhesive tape 62, and the pushed-up chips 65 are sucked from the other side by the suction collet 64 and separated from the adhesive tape 62. The separated individual chips 65 are sequentially bonded to, for example, inner leads of device holes of an IC mounting substrate. In this case, a large number of chips cut and separated by a dicing cutter are generally mounted without being stored.

In recent years, semiconductor chips used in IC cards and the like have recently been required to be thinner and thinner, and the thickness has been reduced from 400 μm to 300 μm to 100 μm today. It is necessary to reduce the thickness to about 50 μm. In order to dice a semiconductor wafer in this way, it is necessary to fix the semiconductor wafer together with a ring frame to a dicing table or the like, and for that purpose, the above-mentioned adhesive sheet is used. Usually, an adhesive sheet in which an adhesive is applied on a soft base material is used.

However, when such a soft adhesive sheet is used to scrape a wafer to a thickness of about 50 μm, the tension applied when attaching the adhesive sheet accumulates as residual stress, and the wafer is ground to an extremely thin thickness. And if
The residual stress of the pressure-sensitive adhesive sheet is superior to the strength of the wafer, and a warp occurs in the wafer due to a force for eliminating the residual stress.

In addition, since the wafer is brittle after grinding, in the case of a soft base material, especially in the case of a large-diameter and ultra-thin wafer chip, the wafer bends due to the weight and the like and comes into contact with the wafer, so that the wafer is broken during transportation. May be done. In order to solve such a problem, in order to fix the semiconductor wafer on a hard material, a heat-shrinkable base material, comprising at least a pressure-sensitive adhesive layer provided on both surfaces of the heat-shrinkable base material, A double-sided pressure-sensitive adhesive tape in which one pressure-sensitive adhesive layer is composed of an energy ray-curable pressure-sensitive adhesive has been disclosed by the present applicant in Japanese Patent Application No. 11-1098.
No. 06.

In such a double-sided pressure-sensitive adhesive sheet, various kinds of workpieces are adhered through one pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape, and temporarily held on a hard plate through the other pressure-sensitive adhesive layer. By doing so, fixing or protection can be performed during the processing. Further, after performing the necessary processing and protection, the work can be easily peeled off from the adhesive sheet by a simple operation such as heating and irradiating an energy ray.

[0008] Therefore, such a double-sided pressure-sensitive adhesive sheet,
For example, even when used for grinding the back surface of an ultra-thin or large-diameter semiconductor wafer, the semiconductor wafer can be fixed on a hard material, so that the thickness accuracy of the wafer is improved and no warpage occurs due to residual stress. In addition, since it is fixed on a hard material, breakage during transportation can be prevented.

[0009]

By the way, such a double-sided pressure-sensitive adhesive sheet is formed by dicing one wafer by dicing.
After dividing into the desired chips, it is easy to heat and shrink the heat-shrinkable base material and to irradiate energy rays to cure the adhesive and to peel off all the chips at once. However, it is difficult to remove only an arbitrary chip by such processing.

[0010] Therefore, there is a demand for an apparatus that once peels all chips from the double-sided pressure-sensitive adhesive sheet and then replaces the chips with a transfer tape from which only arbitrary chips can be taken out. In this case, as the transfer tape to be used, an adhesive sheet for producing a chip body comprising at least one heat-shrinkable heat-shrinkable film, an extensible film, and an adhesive for attaching a cut object, is used as an extensible film. If the shrinkable film and the pressure-sensitive adhesive layer are cut without cutting, the chip can be easily peeled off by heating. Therefore, the extremely thin chip can be peeled off without damage.

However, transfer tapes (adhesive tapes) useful as described above have been proposed. However, a cut at a predetermined depth can be accurately formed from the adhesive layer side without cutting an extensible film on one side. It is extremely difficult to put in well. Further, it is also difficult to accurately and precisely cut a dicing or strip-shaped cut line of the adhesive tape into such an adhesive tape so as to match the dicing line of the semiconductor chip.

Accordingly, a cut of a predetermined depth is formed on the pressure-sensitive adhesive layer on the pressure-sensitive adhesive layer side so as to conform to the dicing line of the semiconductor chip and without cutting the extensible film on one side. Therefore, it would be advantageous if a cut made of a dice-shaped or strip-shaped cut line could be accurately and accurately made. However,
Conventionally, a cutting method and a cutting device suitable for this have not been provided, and a dicing line of a semiconductor chip and a dice-shaped or strip-shaped cut line of the adhesive tape are formed on an adhesive sheet for manufacturing a semiconductor chip chip body. The actual situation is that a sticking device for exactly matching and sticking is not provided.

The present invention has been made in view of such a conventional situation,
Electronic components suitable for using adhesive tape as a transfer tape,
In particular, an object of the present invention is to provide a method of attaching a semiconductor chip, and furthermore, a tape-shaped or strip-shaped cut in an adhesive tape for that purpose can be formed accurately and easily, and further efficiently. It is an object to provide a notch forming method.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems and objects, and a method of attaching an electronic component according to the present invention is applicable to a supplied adhesive tape. From one surface side of the adhesive tape, by using a notch means, by engraving a cut line that is orthogonal to each other and does not reach the other surface side, a dice pattern or a strip is formed on one surface of the adhesive tape. A step of forming a cut in a shape of a letter, and a step of attaching an electronic component to an adhesive layer of the pressure-sensitive adhesive tape having the cut formed therein.

In the method for attaching an electronic component according to the present invention, the pressure-sensitive adhesive tape is bonded to a heat-shrinkable base film that contracts upon heating to exhibit a peeling effect, and is bonded to both sides or one side thereof via a pressure-sensitive adhesive layer. It is an adhesive tape having a detached material attached thereto. Further, in the method of attaching the electronic component of the present invention, the step of peeling off one of the release materials on the side of the pressure-sensitive adhesive tape facing the cut means, and the cut by the cut means from the adhesive layer side exposed thereby, And a forming step.

Further, in the method of attaching an electronic component according to the present invention, the step of forming the cut in a state in which one of the release materials on the side of the adhesive tape facing the cut means is attached; Peeling off the formed release material.

Further, in the method of attaching an electronic component according to the present invention, the electronic component is a semiconductor chip which is diced and divided into a dice or a strip, and a dicing line of the semiconductor chip is used in the attaching step. And the electronic component is attached to the adhesive tape such that the cut line of the adhesive tape matches the cut line of the adhesive tape. Further, the method for forming a cut of an adhesive tape according to the present invention includes disposing a notch means which is provided to face one side of the supplied adhesive tape and which can approach and separate from the adhesive tape, and In the stopped state, it is brought into contact with one surface side of the adhesive tape, and cut lines are formed at right angles to each other that do not reach the other surface side of the adhesive tape, and are cut on one surface of the adhesive tape. It is characterized in that it is configured to form a dice-shaped or strip-shaped cut.

[0018] Such a method of attaching the electronic component of the present invention,
According to the method for forming the cut of the pressure-sensitive adhesive tape, for the pressure-sensitive adhesive tape, a cut line that is orthogonal to each other from one surface side and does not reach the other surface side is formed by engraving a cut line or Strip-shaped cuts can be formed accurately and efficiently. In this cut line,
If the semiconductor chip is aligned with the dicing line and is adhered via the adhesive layer, if necessary, only heating any part of the adhesive sheet, any part of the part surrounded by this cut line When the heat-shrinkable film thermally shrinks, the contact area with the semiconductor chip decreases, and only the semiconductor chip can be peeled off.

Therefore, by simply heating any part of the pressure-sensitive adhesive sheet, the heat-shrinkable film at any part surrounded by the cut lines thermally contracts, so that the contact area with the semiconductor chip is reduced. Only the thinned semiconductor chip can be peeled off without cracking. Also, for the sake of production, even if a large number of chips are manufactured, they can be stored with the ring frame as they are, and after peeling off the required number of chips, the remaining semiconductor chips are removed together with the ring frame. It can be stored temporarily, and the stored chips can be easily peeled off the required number of wafer chips from this tape later by heating the remaining predetermined part of the adhesive tape Therefore, it is extremely convenient from the viewpoint of production management for performing planned production.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for forming a cut in an adhesive tape and a cut forming apparatus therefor, and a method for attaching an electronic component and a sticking apparatus therefor will be described below with reference to the drawings. FIG. 1 shows a method for forming a cut in an adhesive tape 3 according to a first embodiment of the present invention and a device for attaching an electronic component to which the device is employed.

In the sticking apparatus 1, a feeding roll (not shown) in which a large amount of a band-shaped adhesive tape 3 (hereinafter referred to as "adhesive tape 3") is wound on the left side of FIG.
A take-up roll (not shown) for taking up the release material 5a and the tape chip 2 is disposed on the right side of FIG. Then, the adhesive tape 3 is supplied from left to right in FIG. As shown in FIG. 2A, the pressure-sensitive adhesive tape 3 has a heat-shrinkable substrate 4 as a base material, and has ultraviolet-curable pressure-sensitive adhesive layers 4a and 4b on both surfaces thereof.
a and 5b are used.

Although not shown, the release material 5 is provided only on one side.
Those having a can also be used. In any case, the cut line 30a is formed from one side and the other release material 5 is formed.
a is not cut. The attaching device 1 includes a peeling device 7 that performs a peeling step of peeling off one of the release materials 5b, a cutting device 8 that performs a cutting process of inserting a cutting line 30a into the adhesive tape 3 from which the peeling material 5b has been peeled off,
A bonding device 9 for performing a bonding step of bonding the electronic component 12 to the cut adhesive tape 3. The peeling device 7 is provided with a peel plate 6 for sharply bending one peeling material 5b, and the peeling material 5b on the lower surface is peeled off by the peel plate 6. The cutting device 8 includes a cutting means 11.
As shown in FIG. 1, it is attached to a vertically movable shaft 14 by a drive mechanism (not shown) such as a piston cylinder and a motor, and is configured to be vertically movable with respect to the adhesive tape 3. ing.

This cutting means 11 is used for supporting frame 1
5 on the supporting frame 15 as shown in FIG.
As shown in FIGS. 3 and 4, the two guide rails 1
6a is attached parallel to the Y direction. Each of the guide rails 16a has a guide rail 16a.
A slider 17a slidable in the Y direction along a is mounted. A guide rail 16b is mounted on these sliders 17a.
A slider 17b slidable in the X-direction along b is attached. A cutter holder 18 is mounted on the upper surface of the slider 17b, and the cutting blade 13 is installed via the cutter holder 18.

Therefore, with this configuration, the slider 17a on which the guide rail 16b is mounted moves in the Y direction along the guide rail 16a by a driving device such as a motor (not shown), and the slider 17b It moves in the X direction along the rail 16b. Thus, the cutting blade 13 attached to the cutter holder 18 on the slider 17b can freely move linearly and freely in the directions indicated by arrows XY. Note that this position movement in the X-Y direction is performed by a chip 12a of the electronic component 12 input in advance to a control device (not shown).
(The dicing line pitches P3 and P4), the position movement is controlled.

On the other hand, in FIG. 1, the shaft 14 supporting the support frame 15 can be moved up and down, and when the supply of the adhesive tape 3 which is intermittently fed is temporarily stopped by the attaching device 9, In synchronization with this, the ascending position is raised to the ascending position, and the cut line 30a is cut in the adhesive tape 3. Also, a vacuum chamber 27 located above the support frame 15
Is designed so that the adhesive tape 3 is continuously sucked and held, so that the cutting position does not shift when the adhesive tape 3 is cut by the cutting blade 13, so that the adhesive tape 3 can be cut at an accurate predetermined position. I have. The operation of the vacuum chamber 27 is connected to a vacuum generator (not shown) by a connection pipe 27a, and is controlled by a vacuum control valve so that vacuum suction can be performed.

In the case of this embodiment, the cutting means 1
1, one linear cutting blade 1 as shown in FIG.
3. Specifically, a cutter blade having a sharpened tip is provided. In the cutting device 8, by using one cutting blade 13 shown in FIG. 3, a cutting line 30 a (FIG. 2) is formed one by one on the adhesive tape 3, and further, the sliders 17 a, 17 b (in the XY directions) are formed. By setting the feed amount in advance, the cut pitches P1 and P2 can be arbitrarily formed on the adhesive tape 3. That is, as shown in FIG.
1, P2 is the slider 17a moving in the Y direction along the guide rail 16a, that is, the movement amount of P3 between the chips 12a of the electronic component 12, and the slider 17b is moving the guide rail 1
6b in the X direction, that is, P4 of the electronic component 12a.
By moving the cutting blade 13 in the X-Y direction based on the data input in advance and cutting, the cutting pitches P1 and P2 are arbitrarily and efficiently formed on the adhesive tape 3. Can be.

In FIG. 3, when the cutting blade 13 moves in the Y direction, the cutting blade 13 is rotated by 90 ° by a cutting blade rotating mechanism (not shown) provided in the cutter holder 18. The adhesive tape 3 can be cut also in the Y direction. As described above,
In the cutting device 8, as shown in FIGS.
A dice-like (square) or strip-like (rectangular) cut line 30a can be formed in a predetermined area of the adhesive tape 3.

In the sticking device 9, as shown in FIG. 1, a ring frame holder 25 is installed below the traveling path of the adhesive tape 3. In addition, this sticking device 9
Is provided with a transfer slider 60, so that the ring frame holder 25 can be moved up and down in a direction approaching and separating from the adhesive tape 3, and can be transferred to the next step such as a cutting step.

The ring frame holder 25 is provided with positioning pins 34 for positioning the ring frame 26. In the center of the ring frame holder 25, a shaft 33 that can be moved up and down by a not-shown cylinder or the like is inserted, and a table 28 is arranged on the upper surface thereof. Thereby, the table 28
Can be moved up and down with respect to the ring frame holder 25.

A large number of small holes 28a are formed on the upper surface of the table 28, and a vacuum chamber 29 is formed in the table 28.
Reference numeral 9 is connected to a vacuum generator (not shown) via a connection pipe 29a. Thus, when the electronic component 12 is placed on the table 28 in a disk shape, the vacuum generator is operated to make the inside of the vacuum chamber 29 a negative pressure. The chip 12a is sucked onto the table 28, and is sucked and held immovably.

The electronic component 12 can be, for example, a semiconductor wafer such as a silicon wafer. The electronic component 12 is previously diced into a dice or a strip by a dicing device (not shown). The cut pitches P1 and P2 of the adhesive tape 3 cut in the X and Y directions by the cut means 11 are set to be the same (FIG. 5A).

As shown in FIG. 1, the bonding device 9 includes a dicing line position confirmation camera 50 which is a detection device for confirming the position between the chips 12a (hereinafter referred to as "dicing line"). A cutting position confirmation camera 5 which is a detecting device for confirming the positions of the cutting pitches P1, P2 of the cutting lines 30a of the adhesive tape 3.
5 is provided. Then, the alignment position is measured by these detecting devices, and the supplied adhesive tape 3 is supplied to a predetermined position of the attaching device 9 such that the dicing line and the cutting pitches P1, P2 of the adhesive tape 3 exactly match. However, the movement can be stopped.

Further, in a state where the apparatus is stopped for a predetermined time in this step, the bonding apparatus 9 is provided with a press roll 10 at a position above the adhesive tape 3, and the press roll 10 is lowered to move in the direction of arrow F. , The chip 12a of the electronic component 12 is attached to the pressure-sensitive adhesive layer 4b of the pressure-sensitive adhesive tape 3 together with the ring frame 26.

Next, the operation of the sticking device 1 according to the present invention configured as described above will be described below. In this case, the electronic component 12 is a chip 12a obtained by cutting a semiconductor wafer into a dice or a strip, and these chips 12a are suction-fixed by the vacuum chamber 29 of the table 28 as described above. .

First, the adhesive tape 3 is separated from a feeding roll not shown in FIG.
It is guided and set on a winding roll (not shown) via the attaching device 9. After the completion, the start push button (not shown) is pressed, and the adhesive tape 3 is fed out from the left to the right in FIG. 1 by driving the feeding roll 51 and the like. 5 b is peeled off by the peel plate 6.

In the cutting device 8 in a state where the adhesive tape 3 is stopped, the cutting means 11 waiting below moves the shaft 14 upward by driving a not-shown cylinder or the like, whereby the adhesive The cutting blade 13 cuts into the adhesive layer 4b, the heat-shrinkable base material 4, and the other adhesive layer 4a with respect to the adhesive tape 3 from which the layer 4b is exposed. In this case, the cutting depth of the cutting blade 13 with respect to the adhesive tape 3 can be adjusted as appropriate, but in the embodiment, it is set so as not to reach the release material 5a on one side.

In the state where the cutting means 11 has been moved upward as described above, in FIG.
b is moved in the X direction along the guide rail 16b, whereby the cutting blade 13 attached to the cutter holder 18 on the upper surface of the slider 17b is moved in the arrow X direction. Is formed.

Thereafter, the cutting means 11 is moved downward by moving the shaft 14 downward, and the cutting blade 1 is moved.
3 is separated from the adhesive tape 3. Then, the slider 17a is moved along the guide rail 16a in the Y direction, that is, the dicing line pitch P3 based on the data of the dicing line pitch P3 (FIG. 5) input in advance.
The cutting blade 13 attached to the cutter holder 18 on the upper surface of the slider 17b is rotated by 180 degrees by setting it to a pitch P3 of the dicing line by moving the cutting blade 13 by a predetermined amount so as to coincide with both the moving directions.

In this state, the cutting means 11 is moved upward by moving the shaft 14 upward again, so that the cutting blade 13 of the adhesive tape 3 is moved by the adhesive layer 4b, the heat-shrinkable base material 4 and It is made to bite into the other pressure-sensitive adhesive layer 4a. Then, as described above, in this state, the cutting blade 13
Is moved in the arrow X direction to form a cutting pitch P1 in the X direction on the adhesive tape 3 by the cutting blade 13.

At this time, the adhesive tape 3 is in a state of being sucked and held in the vacuum chamber 27. By repeating this operation sequentially from one end side in the width direction of the adhesive tape 3, a plurality of parallel X-directions corresponding to the pitch P3 of the dicing line at fixed intervals in the supply direction (X-direction) of the adhesive tape 3. The cut pitch P1 of the cut line 30a is formed on the adhesive tape 3.

A plurality of parallel cutting pitches P corresponding to the dicing line pitch P3 (FIG. 5) are thus provided in the direction of supply of the adhesive tape 3 (X direction).
After forming 1 on the adhesive tape 3, a plurality of notch pitches P2 parallel to the dicing line pitch P4 are formed on the adhesive tape 3 in a direction perpendicular to the adhesive tape 3 (Y direction). .

That is, by moving the shaft 14 downward, the cutting means 11 is moved downward to separate the cutting blade 13 from the adhesive tape 3 and rotate the cutting blade (not shown) provided in the cutter holder 18. The mechanism rotates the cutting blade 13 by 90 °. And axis 1
By moving the cutting means 11 upward by moving the cutting tape 4 upward, the cutting blade 13 of the cutting tape 13 is moved to the pressure-sensitive adhesive layer 4b, the heat-shrinkable base material 4, and the other pressure-sensitive adhesive layer 4a.
Let go inside. Then, by moving the slider 17a in the Y direction along the guide rail 16a,
A cutting line 30a serving as a reference in the Y direction by the cutting blade 13
Is formed on the adhesive tape 3.

Thereafter, by moving the shaft 14 downward, the cutting means 11 is moved downward, and the cutting blade 1 is moved.
3 is separated from the adhesive tape 3. Then, based on the data of the pitch P4 of the dicing line input in advance, the slider 17b is moved along the guide rail 16b by X.
The cutting blade 13 attached to the cutter holder 18 on the upper surface of the slider 17b is set to the dicing line pitch P4 by moving a predetermined amount (dicing line pitch P4) in the direction.

In this state, after returning the slider 17a to the home position, the cutting means 11 is moved upward by moving the shaft 14 upward again, so that the cutting blade 13 The layer 4b, the heat-shrinkable base material 4, and the other pressure-sensitive adhesive layer 4a are cut into the inside. Then, as described above, in this state, the cutting blade 13 is moved in the arrow Y direction, so that the cutting blade 13 moves the cutting line 3 in the Y direction.
A cut pitch P2 (FIG. 5A) of 0a is formed on the adhesive tape 3.

By repeating this operation, the cutting pitch P of the plurality of cutting lines 30a in the Y direction corresponding to the pitch P4 of the dicing line at a constant interval, that is, in the feeding direction (X direction) of the adhesive tape 3.
2 (FIG. 5A) is formed on the adhesive tape 3. Therefore, in the cutting device 8, as shown in FIG. 5A, a dice-shaped or strip-shaped cutting line 30a in two directions (both X and Y directions) orthogonal to each other is provided (see FIGS. 2 and 11).
(B)) can be formed on the adhesive tape 3.

Next, in the bonding device 9, the chips 12a which have been diced in advance by the operation of the vacuum chamber 29 are formed.
The ring slider 26 is positioned at a predetermined standby position below the adhesive tape 3 by the transfer slider 60 in a state in which the ring frame 26 is positioned and the ring frame 26 is positioned while being sucked and held on the table 28 in a disk shape. Therefore,
When the cutting pitches P1 and P2 are formed in the adhesive tape 3 by the cutting device 8 so as to match the size of the dicing line, the adhesive tape 3 is sent to the attaching device 9 and the dicing of the chip 12a sucked and held on the table 28 is performed. A dicing line position confirmation camera 50 for confirming the position of the line (FIG. 5A), and a cut position confirmation camera 55 for confirming the position of the cut line 30a of the adhesive tape 3.
According to the position data, the table 28 is cut by the cut line 30a of the adhesive tape 3 (see FIG.
(A) The alignment measurement of the dicing line is performed at a position that matches the dicing line based on the confirmation data of both cameras, and the cutting pitches P1 and P2 of the cutting line 30a of the adhesive tape 3 are set in the dicing line 9 in the attaching device 9. The supply of the adhesive tape 3 is stopped so as to match the pitches P3 and P4.

Then, the table 28 on the transfer slider 60 is raised by driving a cylinder or the like (not shown), and the positioning pins 34 and 3 of the ring frame holder 25 are moved.
The upper surface of the ring frame 26 fixed to the adhesive tape 4 is brought into contact with the adhesive layer 4 b on the lower surface of the adhesive tape 3, and the upper surface of the chip 12 a sucked and held on the table 28 is attached to the adhesive layer on the lower surface of the adhesive tape 3. 4b.

In this state, by moving the pressing roll 10 in the direction of arrow F, the chips 12a placed in a dice or strip shape are transferred to the adhesive layer 4b of the adhesive tape 3, and furthermore, the ring frame 26. In such a case, the adhesive tape 3 functions as a transfer tape. Then, in the next cutting step of the pasting device 9, for example, as shown in FIGS.
The outer circumference of the adhesive tape 3 is cut by a cutter 35 on the ring frame 26 in accordance with the size of the ring frame 26.

Thereafter, as shown in FIG. 7, if the reversing arm (not shown) is turned upside down on the carrier table 37 so that the peeling material 5a is lower, the ring frame 26 and the ring frame 26 are stored in a cassette or the like in this state. I can put it. In this way, since production control is possible, a large number of products can be produced, and a necessary number can be taken out and mounted on a substrate or the like when necessary.

On the other hand, in the ring frame holder 25 and the table 28, the next dicing and disk-mounted chip 12a is sucked and held by the movement of the transfer slider 60, and the ring frame 26 is sucked and fixed. After that, the adhesive tape 3 is transferred to the attaching device 9,
It stops at a predetermined position, waits, and returns to the initial state as shown in FIG.

The remaining portion of the adhesive tape 3 cut by the cutter 35 as described above, that is, the release material 5a
The tape waste 2 is sequentially wound around a winding roll (not shown). As described above, in the sticking apparatus 1 according to the present embodiment, the chip 1 of the electronic component 12 is used.
When it is necessary to temporarily store 2a due to the amount of shipment, in particular, a cut is made in the adhesive tape 3, and the adhesive tape 3 is stored in a ring frame 26 to which the chip 12a of the electronic component 12 is attached. FIG. 12 if necessary
The extremely thin chip 12a can be peeled off from the adhesive tape 3 by the heating means or the like without damaging the crack.

That is, as described above, the pressure-sensitive adhesive tape 3 is made of a heat-shrinkable base material 4 exhibiting a peeling effect when heated.
11A and 11B, the adhesive tape 3 is first irradiated with ultraviolet rays and energy rays from the state shown in FIG. 400 μm ~
Not only the chip 12a having a thickness of about 300 μm but also 1
Even an extremely thin chip 12a of about 00 μm to 50 μm can be easily peeled off from the adhesive tape 3 without being damaged.

Therefore, from the state shown in FIG. 12, only the chip 12a desired to be taken out can be heated by the heating means, the required number can be taken out using the suction collet 61, and the chip 12a can be mounted on an IC mounting board or the like. Also, if all chips 1
When the 2a is not mounted, the chip 12a can be stored in a state where the remaining chip 12a is stuck on the adhesive tape 3 by separating it for use. Therefore, it is extremely effective in production control.

In this case, if a tape that transfers to the chip 12a is used instead of the UV-curable pressure-sensitive adhesive, the chip 12a taken out using the suction collet 61 is used.
Can be conveniently mounted on an IC mounting substrate or the like as it is. In the embodiment described above, the size of one chip 12a (dicing line pitches P3, P4) and the cutting pitches P1, P2 of the adhesive tape 3 cut by the cutting means 11 are set to be the same ( As shown in FIG. 5 (A), the adhesive tape 3 can be cut more finely into 1/4 or 1/8 with respect to one chip 12a (FIG. 5 (B), FIG. 11).
(C)). In this way, when the heat-shrinkable base material 4 shrinks, the contact area with the lower surface of the chip 12a is further reduced, so that the chip 12a is more easily peeled off and the chip 1
2a can be further suppressed.

In the above embodiment, the adhesive tape 3
Is cut in the Y direction by a cutting blade rotating mechanism (not shown) provided in the cutter holder 18.
Is rotated by 90 °. Alternatively, after forming a plurality of cut lines 30a in the X direction, the support frame 15 and the support frame 15 are inverted by 90 ° by the inverting device 30 and then cut in the Y direction by the slider 17b. By running the blade 13, the cut pitches P <b> 1 and P <b> 2 can be formed on the adhesive tape 3 in a dice shape or a strip shape.

Further, in this embodiment, as shown in FIG. 3, one linear cutting blade 13 is provided. However, as shown in FIG. By operation, the cutting pitch P1 can be formed on the adhesive tape 3 in multiple rows simultaneously in the X direction. When such a plurality of cutting blades 13 are used, the cutting blades 13 are moved in the X direction so that the plurality of cutting pitches P1 are
After that, the support frame 15 and the support frame 15 are rotated by 90 degrees by the reversing device 30, and from that state, the cutting blade 13 is rotated in the Y direction.
Is moved, the cut pitch P2 is formed in the adhesive tape 3, and a dice-shaped cut can be formed. The cut line 30a thus formed (FIG. 5A)
(B), FIGS. 11B and 11C) show the amount of movement (dicing line pitch P3) of the slider 17a on which the guide rail 16b is mounted moving in the Y direction along the guide rail 16a in FIG. , The amount of movement of the slider 17b in the X direction along the guide rail 16b (the pitch P4 of the dicing line) is determined so that the pitch A of the cutting blade 13 (FIG. 4) is equally divided into dice. P1, P2 (FIGS. 5A and 5B, FIG. 11)
(B) and (C)) can also be formed. Also, by replacing the cutter holder 18 or the like, the cutting pitch P1,
P2 can also be adjusted.

FIG. 8 shows an adhesive tape cutting device according to a second embodiment of the present invention. In this embodiment, since it is basically the same as the above-described first embodiment, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted. In this embodiment, as shown in FIG. 8, instead of using a sharp cutter blade as the cutting blade 13 of the cutting means 11 as in the first embodiment, as shown in FIG. It consists of.

Using such a blade 40, X is adjusted in accordance with the dicing line pitch P3 (FIG. 5A).
While moving the Y table 65 in the Y direction, the cutting means 41 is lifted upward by a driving device such as a cylinder (not shown), so that a plurality of parallel cutting pitches P1 corresponding to the dicing line pitch P3 direction.
Is formed. Further, by rotating the cutting means 41 by 90 degrees, similarly, by moving the XY table in the X direction corresponding to the pitch P4 of the dicing line, and raising the cutting means 41, the pitch P4 of the dicing line is reduced. A plurality of corresponding parallel cutting pitches P2 are formed in the adhesive tape 3. Thereby, a predetermined cut pitch P1, P2 can be formed in the adhesive tape 3 in the form of a dice or a strip.

In this case, a plurality of blades 40 may be arranged at predetermined intervals. In this way, a plurality of parallel cut lines 30a in one direction can be formed at the same time, and by further rotating the cut lines 90a, a dice-shaped cut line 30a can be formed on the adhesive tape 3. FIG. 9 shows a device for cutting the adhesive tape 3 according to the third embodiment of the present invention.

This embodiment is basically the same as the above-described first embodiment, so that the same components are denoted by the same reference numerals and detailed description thereof will be omitted. In this embodiment, as in the first embodiment, the cutting means 1
This shows an embodiment in which a rotary blade 43 is used as one cutting blade. That is, in this embodiment, the first cutting device 8a provided with the rotary blade 43 on the peripheral surface of the die roll 42 is rotated in the supply direction of the adhesive tape 3 (X direction).
Are placed on an XY table (not shown) such that the second cutting device 8b is parallel to the second cutting device 8b. Are arranged so as to be movable at a right angle (Y direction) with respect to.

Therefore, in this embodiment, the rotary blade 43 is moved in the XY direction in accordance with the dicing line pitch P3.
The first cutting device 8 is moved by a table, and the rotary blade 43 is cut into the adhesive tape 3 by a predetermined amount in the same manner as described above.
a, the rotary blade 43 is moved in the X direction by a slider (not shown) to form a cut line 30a in the X direction, and by repeating this, a plurality of parallel cut lines 30a having a cut pitch P1 are formed.
Formed.

Further, an XY table (not shown) is moved in accordance with the dicing line pitch P4, and the second cutting device is arranged such that the rotary blade 43 is perpendicular to the supply direction of the adhesive tape 3 (Y direction). By moving the rotary blade 43 in the Y direction by a slider (not shown), a plurality of cuts with a cut pitch P2 parallel to the Y direction are formed in the adhesive tape 3 by 8b.

In this manner, by rotating the rotary blade 43, as in the above-described embodiment, a dice-shaped or strip-shaped cut can be formed. When using such a rotary blade 43,
A base roll 4 for holding down the other side of the adhesive tape 3
It is preferable that 4 or the plate material 45 be arranged.

FIG. 10 shows an adhesive tape peeling apparatus according to a fourth embodiment of the present invention. In this embodiment, since it is basically the same as the third embodiment described above, the same components are denoted by the same reference numerals and detailed description thereof will be omitted. In the first to third embodiments, one of the release materials 5b is peeled off before making a cut in the adhesive tape 3, but in this embodiment, as shown in FIG. It is arranged after 8.

In the peeling device 7 shown in FIG. 10, a peeling tape 47 wound around a pressing roll 46 is provided below the adhesive tape 3. At this time, since the adhesive of the peeling tape 47 has a stronger adhesive force than the adhesive layer 4b of the adhesive tape 3, the peeling material 5b is peeled off and adhered to the tape 47 side, and the peeling material 5b having this cut is removed. Can be peeled off. As described above, after the cut line 30a is formed, one release material 5b can be peeled off.

The method of peeling the release material 5b having the cut line 30a in this manner is not limited to the embodiment, but may be any other method as long as similar peeling is possible, and is not particularly limited. Further, in the embodiment of FIG. 10, an example is shown in which the rotary blade of the third embodiment is used as the cutting means 11, but the cutting means shown in the first and second embodiments as described above is used. It is of course possible to use it.

Further, in this embodiment, the belt-shaped pressure-sensitive adhesive sheet supplied from the raw roll has been described. However, it is also possible to perform a peeling, cutting and sticking step while adsorbing a sheet-like sheet. Good. As mentioned above, although one Example of this invention was described, this invention is not limited to the said Example at all.

For example, in the above embodiment, a semiconductor chip is exemplified as an electronic component, but the present invention is not limited to this. For example, an undivided semiconductor wafer may be used.

[0069]

As described above, according to the present invention,
By forming cut lines that are orthogonal to each other from one surface side of the adhesive tape and do not reach the other surface side, dice-shaped or strip-shaped cuts can be formed accurately and efficiently. Therefore, if the dicing line of the semiconductor chip which has been diced in advance is matched with the cut line and the chip is adhered via the adhesive layer, the cut line of the adhesive sheet is formed as necessary, and the semiconductor chip is attached. Just heat any part of the adhered body,
When the heat-shrinkable film at an arbitrary chip location surrounded by the cut lines thermally shrinks, the contact area with the semiconductor chip is reduced, and only the semiconductor chip at an arbitrary location can be easily peeled off. . Also, on account of production,
Even if a large number of chips are manufactured, they can be stored with the ring frame as they are, and after peeling off the required number of chips, temporarily store the remaining semiconductor chips together with the ring frame. The planned number of semiconductor chips can be easily peeled off from the adhesive tape by heating the remaining predetermined portion of the adhesive tape later, so that planned production is performed. It is extremely convenient from the viewpoint of production management.

Further, only by heating an arbitrary portion of the pressure-sensitive adhesive sheet at which the cut line is formed, the heat-shrinkable film at an arbitrary chip portion surrounded by the cut line thermally contracts, so that the contact area with the semiconductor chip is increased. And the extremely thin semiconductor chip can be peeled off without causing cracks, scratches and the like.

[Brief description of the drawings]

FIG. 1 is a schematic side view of an electronic component sticking apparatus employing an adhesive tape cut forming apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of the pressure-sensitive adhesive tape employed in one embodiment of the present invention.

FIG. 3 is a plan view of a cutting means employed in the cutting device according to one embodiment of the present invention.

FIG. 4 is a plan view showing another example of the cutting means.

FIG. 5 is a plan view when a chip is attached to an adhesive tape in which a cut line is formed in the adhesive tape by a cutting means, and FIG. 5 (A) has the same size as the cut line of the adhesive tape; FIG. 5B is a plan view when the cut line of the adhesive tape is smaller than the size of the chip.

FIG. 6 is a cross-sectional view showing a work flow after a sticking step according to one embodiment of the present invention.

FIG. 7 is a cross-sectional view when the electronic component attached to the ring frame is inverted and placed on a mounting table.

FIG. 8 is a schematic side view of another embodiment of the cutting device when a long blade is used as the cutting means.

FIG. 9 is a schematic side view of another embodiment of the cutting device when a rotary blade is used as the cutting means.

FIG. 10 is a schematic sectional view of an embodiment in which a cutting step is arranged before a peeling step.

FIG. 11A is a perspective view showing a state in which a chip transferred to an adhesive tape with a cut line according to the present embodiment is attached to a ring frame.
FIG. 11B is a cross-sectional view of FIG. 5A, and FIG.
It is sectional drawing of (B).

FIG. 12 is a schematic diagram showing a state in which a chip transferred according to an embodiment of the present invention is heated and picked up by a heating unit in chip units.

FIG. 13 is a cross-sectional view showing a conventional pick-up type electronic component pickup using a needle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhering device 3 Adhesive tape (belt-shaped adhesive tape) 4 Heat-shrinkable base material (shrink film) 4a, 4b Adhesive layer 5a, 5b Release material 7 Peeling device 8 Cutting device 9 Pasting device 11 Cutting device 12 Electronic parts 12a chip 12a dicing line 13 cutting blade 30a cutting line P1, P2 cutting pitch P3, P4 dicing line pitch

Claims (6)

[Claims] 1. A cut line is formed in a supplied adhesive tape from one surface side of the adhesive tape by using a cutting means, the cut lines being orthogonal to each other and not reaching the other surface side. A step of forming a dice-shaped or strip-shaped cut on one surface of the adhesive tape; and a step of attaching an electronic component to an adhesive layer of the adhesive tape having the cut formed therein. Characteristic method of attaching electronic components. 2. The pressure-sensitive adhesive tape has a heat-shrinkable base film that contracts by heating to exhibit a peeling effect, and a release material adhered to both or one surface of the film via a pressure-sensitive adhesive layer. 2. The method according to claim 1, wherein the electronic component is an adhesive tape. 3. A step of peeling off one release material on the side of the pressure-sensitive adhesive tape facing the cut means, and a step of forming the cut by the cut means from the exposed adhesive layer side. The method according to claim 2, further comprising: 4. a step of forming the cut in a state where one release material on the side of the pressure-sensitive adhesive tape facing the cut means is attached; and a step of peeling the release material having the cut formed therein. The method for attaching an electronic component according to claim 2, comprising: 5. The electronic component is a semiconductor chip divided into a dice or a strip, and a dicing line of the semiconductor chip coincides with a cut line of the adhesive tape in the attaching step. The method according to claim 1, wherein the electronic component is attached to an adhesive tape. 6. A pressure-sensitive adhesive tape which is disposed opposite to one side of the supplied adhesive tape, and which is capable of approaching / separating from the adhesive tape, in a state where the supply of the adhesive tape is stopped. Abutting on one surface side of the adhesive tape, engraving mutually perpendicular cutting lines that do not reach the other surface side of the adhesive tape, and forming a dice-shaped or strip-shaped cut on one surface of the adhesive tape. A method for forming a cut in an adhesive tape, wherein the cut is formed.