JP2002141392A - Pickup method and equipment for semiconductor chip and die bonding equipment provided therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide pickup equipment of a semiconductor chip capable of reducing mechanical impacts to be added to the semiconductor chip at the time of picking it up, preventing cracking and chipping and efficiently separating the semiconductor chip from an adhesive tape. SOLUTION: This pickup equipment 10 of the semiconductor chip is composed of a preliminary irradiation means 32 for irradiating the entire surface with ultraviolet rays from the back surface side of a UV adhesive sheet 1 to which a plurality of the semiconductor chips 2a are adhered, a positioning means 34 for positioning the semiconductor chip to be picked up at a prescribed position, an ultraviolet ray irradiation means 38 for irradiating the back surface of the UV adhesive sheet to which the semiconductor chip is adhered with the ultraviolet rays, and a pickup means 40 for picking up the semiconductor chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor chip pickup apparatus and method. In particular, the present invention relates to an apparatus and a method for picking up individualized semiconductor chips from a dicing process of a semiconductor wafer to a bonding process.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor chip, each semiconductor chip is cut out from a semiconductor wafer adhered on an adhesive sheet by dicing and individualized. The individualized semiconductor chip is peeled off from the adhesive sheet, picked up, transferred to a bonding device and bonded. In this case, when picking up the semiconductor chip sticking on the pressure-sensitive adhesive sheet, a large mechanical impact is applied to the semiconductor chip in the conventional method, and damage is generated.

A conventional semiconductor chip pickup device will be described below. FIG. 4 shows a conventional semiconductor chip 12.
It is a vertical sectional view of the pick-up device of a. In the semiconductor chip 12a pickup device, the semiconductor chip 12a is pushed up from the back surface of the adhesive sheet 11 to which the plurality of semiconductor chips 12a are adhered with the push-up needle 21, and is peeled off from the adhesive sheet 11. Therefore, the semiconductor chip 12
a large mechanical shock is applied to the
Damage such as c may occur.

The pickup device for the semiconductor chip 12a is composed of a suction table 14 for holding a plurality of semiconductor chips 12a by sticking an adhesive sheet 11, and a back surface of the adhesive sheet 11 for sticking the semiconductor chips 12a. Push-up needle 21 for pushing up semiconductor chip 12a, and suction nozzle 1 for vacuum-suctioning and picking up semiconductor chip 12a.
3 The push-up needle 21 pushes up the semiconductor chip sticking on the adhesive sheet 11 by a predetermined amount, thereby reducing the adhesive area on the adhesive sheet 11 and reducing the adhesive strength. Next, the semiconductor chip 1 is sucked by the suction nozzle 13.
The semiconductor chip 12a is completely peeled off from the adhesive sheet 11 by vacuum suction of 2a, and is picked up. In this case, when each semiconductor chip 12a is diced from a semiconductor wafer, the width of the cut groove is slightly 30 to 50 μm.
only about m. Therefore, the semiconductor chip pushed up by the push-up needle 21 collides with an adjacent semiconductor chip and may have a corner 12c. In recent years, the thickness of semiconductor chips has been reduced in thickness, and is currently 15
About 0 to 300 μm, but eventually 50 to 100 μm
It is considered to be thinned to the extent. Therefore, the semiconductor chip 12a is easily cracked 12b by the impact of the push-up needle 21.

[0005] In addition, the impact of the push-up needle 21 at the time of pushing up may break the vacuum seal, leak the vacuum, and separate the pressure-sensitive adhesive sheet from the suction table. When the pressure-sensitive adhesive sheet 11 is separated from the suction table, the corners of the semiconductor chips 12a held on the pressure-sensitive adhesive sheet 11 may collide with each other and cause serious defects such as chipping. Further, depending on the positional relationship between the push-up needle 21 and the semiconductor chip 12a, the sticking force alone may not be able to sufficiently reduce the adhesive force between the semiconductor chip 12a and the adhesive sheet 11. For this reason, the semiconductor chip 12a cannot be peeled off from the adhesive sheet 11, and there may be a case where the operation rate of the apparatus is reduced such as a stop of the apparatus.

On the other hand, there are some techniques which have become publicly known in recent years, which use an adhesive sheet whose adhesive force can be reduced by ultraviolet irradiation or the like as the adhesive sheet.
A method for picking up chip-shaped components described in JP-A-4-92450, a method for separating semiconductors described in JP-A-3-206664, and a method for partially reducing adhesion due to radiation described in JP-A-6-218879. A self-adhesive tape and a chip-like component pickup device described in JP-A-4-2144. The respective technologies will be described below.

In the method of picking up chip-shaped components described in Japanese Patent Application Laid-Open No. 4-92450, an energy beam is irradiated from the non-adhesive surface side of the chip fixing tape to reduce the adhesive force of the fixing tape. Next, the fixing tape to which the chip-shaped components are adhered is vacuum-suctioned downward to separate the chip-shaped components from the fixing tape, and the chip-shaped components are picked up.

In the semiconductor separation method described in Japanese Patent Application Laid-Open No. Hei 3-2066643, ultraviolet light is irradiated from the lower surface of the semiconductor element completely cut on the ultraviolet-curable adhesive tape, and the upper and lower portions of the push-up bar and the suction collet are irradiated. The semiconductor element is peeled off from the tape by operation and is taken out. In this semiconductor separation method, the ultraviolet irradiation range is set to 100 to 150 μm from the outer periphery of the semiconductor element.

Further, the self-adhesive tape capable of partially reducing the tackiness by radiation described in JP-A-6-218879 contains a copolymerized radiation sensitizer in an adhesive component,
The radiation can partially reduce the tackiness. It also describes that the self-adhesive tape is used for temporarily fixing a wafer.

Further, a pickup device for a chip-shaped component described in Japanese Patent Application Laid-Open No. 4-2144 discloses a means for irradiating a chip fixing tape with an energy beam from a back surface, a push-up pin for pushing up the chip-shaped component from the back surface side. It has. In this pickup device, at the time of picking up the chip-shaped component, the energy-ray irradiating means irradiates the energy beam and the push-up pin is inserted to pick up the chip-shaped component.

[0011]

In the above prior art, when a semiconductor chip is picked up, a mechanical shock may be applied to the semiconductor chip. For example, JP-A-4-92
In the method of picking up chip-shaped components described in Japanese Patent Publication No. 450, after irradiating ultraviolet rays, the fixing tape to which the chip-shaped components are adhered is vacuum-suctioned downward to separate the chip-shaped components from the fixing tape. Therefore, it is considered that stress is applied to the chip-shaped component due to the deformation of the adhesive tape. Further, in the semiconductor separation method described in JP-A-3-206664 and the chip-shaped component pickup device described in JP-A-4-2144, a push-up bar and a push-up pin are used in combination. It is considered that a mechanical impact is applied to the semiconductor chip as in the conventional case. Further, in the self-adhesive tape capable of partially reducing the adhesiveness by radiation described in JP-A-6-218879, no specific use form is described.

In the above prior art, not only ultraviolet irradiation but also, for example, vacuum suction of a fixing tape to which a chip-shaped component is adhered or a push-up bar or push-up pin is used in combination. This means that the adhesive force of the adhesive sheet cannot be sufficiently reduced only by ultraviolet irradiation, or the amount of ultraviolet irradiation required to reduce the adhesive force is large, and the required irradiation time cannot be sufficient. Is probably the cause. For this reason, it is considered that the semiconductor chips are separated by using a push-up rod or the like after the adhesive force is reduced by irradiating ultraviolet rays to some extent. On the other hand,
It is considered that when the adhesive force was almost reduced only by the ultraviolet irradiation, the irradiation time of the ultraviolet light became long, and the semiconductor chip could not be efficiently picked up.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor chip pickup device in which a mechanical shock applied to a semiconductor chip during pickup is reduced and serious defects such as cracking or chipping of the semiconductor chip are prevented. is there. It is another object of the present invention to provide a semiconductor chip pickup device in which the operation rate is improved by reliably peeling the semiconductor chip from the adhesive sheet. Still another object of the present invention is to provide a semiconductor chip pickup device capable of efficiently separating a semiconductor chip from an adhesive tape.

[0014]

SUMMARY OF THE INVENTION A semiconductor chip pickup device according to the present invention comprises: a pre-irradiation means for irradiating the entire surface of a UV adhesive sheet to which a plurality of semiconductor chips are adhered from the back side with ultraviolet rays; Positioning means for positioning the chip at a predetermined position, ultraviolet light irradiating means for irradiating ultraviolet light on the back surface of the UV adhesive sheet to which the semiconductor chip is adhered, and pickup means for picking up the semiconductor chip. .

A semiconductor chip pick-up device according to the present invention comprises: a preliminary ultraviolet irradiator for irradiating the entire surface of a UV adhesive sheet to which a plurality of semiconductor chips are adhered with ultraviolet light from the back side; and a semiconductor chip to be picked up at a predetermined position. A positioning device for positioning, a suction unit for sucking and holding the UV adhesive sheet adhering the plurality of semiconductor chips by vacuum suction, and a chamber that supports the suction unit and is vacuum-sucked together with the suction unit. And a UV-sensitive adhesive sheet that is provided in the chamber formed inside the support table and adheres the semiconductor chip through a window provided in the suction unit. It is characterized by comprising an ultraviolet irradiator for irradiating ultraviolet rays on the back surface, and a suction nozzle for sucking the semiconductor chip by vacuum suction from above.

According to the present invention, there is provided a semiconductor chip pickup device, comprising: a positioning device for positioning a semiconductor chip to be picked up from a plurality of semiconductor chips adhered to a UV adhesive sheet at a predetermined position; A suction unit that sucks and holds the UV adhesive sheet by vacuum suction from a back surface side with a plurality of suction grooves, and a support unit that supports the suction unit and forms a chamber that is vacuum-sucked with the suction unit. A support base and ultraviolet light provided in the chamber formed inside the support base and irradiating ultraviolet light to the back surface of the UV adhesive sheet to which the semiconductor chip is adhered through a window provided in the suction unit. An irradiator; and a suction nozzle for suctioning the semiconductor chip by vacuum suction from above, and the ultraviolet irradiator includes a suction nozzle provided in the suction unit. Ultraviolet light through the grooves, characterized in that it provided a mask to prevent the leaking UV adhesive sheet.

Further, the semiconductor chip pickup device according to the present invention is the semiconductor chip pickup device, wherein a preliminary ultraviolet ray for irradiating the entire surface from the back surface side of the UV adhesive sheet to which the plurality of semiconductor chips are adhered. An irradiator is further provided.

According to the semiconductor chip pickup method of the present invention, there is provided a pre-irradiation step of irradiating the entire surface of a UV adhesive sheet to which a plurality of semiconductor chips are adhered from the back side with ultraviolet rays, and positioning the semiconductor chip to be picked up at a predetermined position. Positioning step, a UV irradiation step of irradiating the back surface of the UV adhesive sheet to which the semiconductor chip is adhered with ultraviolet rays, and a pickup step of picking up the semiconductor chip.

A semiconductor chip die bonding apparatus according to the present invention comprises the semiconductor chip pickup apparatus and die bonding means for die bonding to the semiconductor chip.

[0020]

Embodiments of the present invention will be described below with reference to the accompanying drawings. A semiconductor chip pickup device according to the present invention includes a preliminary ultraviolet irradiation unit, a semiconductor chip positioning unit, an ultraviolet irradiation unit, and a semiconductor chip pickup unit. To explain each component, in this preliminary ultraviolet irradiation means,
The entire surface of the UV adhesive sheet to which a plurality of semiconductor chips are adhered is irradiated with ultraviolet rays from the back side to reduce the adhesive force of the UV adhesive sheet as a whole. In the positioning means, in order to position the semiconductor chip to be picked up at a predetermined position, the semiconductor chip is moved together with the UV adhesive sheet to which the semiconductor chip is adhered. Further, in the ultraviolet irradiation means, ultraviolet light is irradiated from the back surface of the UV adhesive sheet to which the semiconductor chip moved to a predetermined position is adhered, so that the adhesive force of the UV adhesive sheet is almost reduced. Further, the semiconductor chip pickup means picks up the semiconductor chip from the UV adhesive tape. In this way, when transferring individual semiconductor chips from the dicing process to the die bonding process,
The mechanical shock applied to the semiconductor chip can be suppressed. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet rays, the amount of ultraviolet rays irradiated at the time of semiconductor chip pickup can be reduced, and semiconductor chips can be picked up quickly.

Embodiment 1 In the semiconductor chip pickup device according to the first embodiment of the present invention, when picking up the semiconductor chip, the UV adhesive sheet to which the semiconductor chip is adhered is preliminarily irradiated with ultraviolet light, and further irradiated with ultraviolet light before pickup. I do. By performing this preliminary ultraviolet irradiation, the amount of ultraviolet irradiation before pickup can be reduced, the irradiation time can be shortened, and pickup can be performed efficiently. Also, in this case, in order to almost reduce the adhesive strength of the UV adhesive sheet, the semiconductor chip is picked up without giving any mechanical shock such as a push-up needle, since it is performed only by two irradiations of ultraviolet rays. Can be.

The operation of the semiconductor chip pickup device will be described below. First, the entire surface is irradiated with ultraviolet rays from the back side of the UV adhesive sheet to which the plurality of semiconductor chips are adhered by the preliminary ultraviolet irradiation means, so that the adhesive strength of the UV adhesive sheet is reduced as a whole. Next, the UV adhesive sheet to which the semiconductor chip to be picked up is moved is moved by the semiconductor chip positioning means. Next, the UV adhesive sheet is adhered to the semiconductor chip by the suction support means, and the UV adhesive sheet is sucked and held by vacuum suction. Further, the ultraviolet irradiation means irradiates ultraviolet rays from the back surface of the UV adhesive sheet to which the predetermined semiconductor chip moved to the predetermined position is adhered, thereby almost reducing the adhesive force of the UV adhesive sheet. Finally, the semiconductor chip pickup means,
The semiconductor chip is picked up from the adhesive tape. Thus, the push-up needle is not used, so that the semiconductor chip can be picked up while suppressing the mechanical shock applied to the semiconductor chip. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet rays, the amount of ultraviolet rays irradiated at the time of semiconductor chip pickup can be reduced, and semiconductor chips can be picked up quickly. This semiconductor chip pickup device includes a preliminary ultraviolet ray irradiator, a semiconductor chip positioning device, a support base for sucking and holding a UV adhesive sheet to which the semiconductor chip is adhered, an ultraviolet ray irradiator, and a semiconductor chip attractor. Consists of

FIG. 1 shows a block diagram of the semiconductor chip pickup device 10. As shown in FIG. The semiconductor chip pickup device 10 includes a preliminary ultraviolet irradiation unit 32 that irradiates the entire surface of the UV adhesive sheet with a plurality of semiconductor chips with ultraviolet light from the back surface side, and a target semiconductor chip 2.
positioning means 34 for moving the semiconductor chip 2a to a predetermined position, suction holding means 36 for sucking and holding the UV adhesive tape 1 adhering to the semiconductor chip 2a by vacuum suction, and UV adhesive adhering to the semiconductor chip 2a. Ultraviolet irradiation means 38 for irradiating the adhesive tape with ultraviolet light from the back surface of the tape 1,
And a semiconductor chip pickup means 40 for picking up the semiconductor chip 2a from above.

Each component will be described below. FIG. 2 is a vertical sectional view showing a part of the semiconductor chip pickup device 10. As shown in FIG. First, in the preliminary ultraviolet irradiation means 32, a plurality of semiconductor chips 2a are
Ultraviolet rays are preliminarily irradiated on the entire back surface of the V adhesive sheet 1. The position at which the preliminary ultraviolet irradiation means 32 is provided is not particularly limited, but is provided at a position where the entire surface of the UV adhesive sheet 1 on which the plurality of semiconductor chips 2a are adhered can be irradiated with ultraviolet light from the back side. Thereby, the adhesive force of the UV adhesive sheet is reduced as a whole. By preliminarily irradiating ultraviolet rays, the amount of ultraviolet rays radiated before pickup can be reduced. That is, the irradiation time of the ultraviolet light before the pickup can be reduced, and the semiconductor chip can be efficiently picked up.

The positioning means 34 moves the target semiconductor chip 2a to the pickup position. Further, as shown in FIG. 3, the positioning means 34 includes a transfer positioning means for the wafer ring 9 to which the UV adhesive sheet 1 to which the plurality of semiconductor chips 2a are adhered, a recognition positioning means for the semiconductor chip 2a, Consists of In the transfer positioning means of the wafer ring 9, the wafer ring 9 on which the UV adhesive tape 1 to which the semiconductor chip 2a is adhered is moved onto the suction section 4 of the support base. In the recognition and positioning means of the semiconductor chip 2a,
The wafer ring 9 is finely adjusted and moved so as to be at a position where the semiconductor chip 2a to be picked up is picked up.

Further, in the suction holding means 36, the UV adhesive tape 1 to which the semiconductor chip 2a is adhered is placed on the suction section 4 provided with a plurality of suction grooves 4b, and the UV adhesive sheet is placed on the back surface through the suction grooves. Vacuum suction from the side and hold by suction. The lower part of the suction part 4 is supported by the support part 7,
The suction section 4 and the support section 7 constitute a chamber capable of vacuum suction inside. When the vacuum evacuation 8 is performed through the exhaust port 7b and the vacuum suction is performed, the UV adhesive tape 1 is suction-held through the suction groove 4a.

Further, in the ultraviolet irradiating means 38, before picking up the semiconductor chip 2a, ultraviolet light generated by the ultraviolet irradiator 6 is applied to the back surface of the UV adhesive tape 1 to which the semiconductor chip 2a is adhered. further,
The ultraviolet irradiating means 38 includes an ultraviolet irradiator 6 provided in a chamber constituted by the adsorption section 4 and the support section 7, and an ultraviolet ray generated from the ultraviolet irradiator 6 for the target semiconductor chip 2.
a) an ultraviolet ray introduction path leading to the UV adhesive tape 1 of FIG. This ultraviolet ray introduction path is based on the mask 5 of the ultraviolet irradiator 6
And a small window 4a provided on the suction table.
The small window 4a provided in the suction section 4 is made of a material having ultraviolet transmittance. The small window 4a has a flat surface on the side of the UV adhesive sheet 1 and does not give a mechanical impact to the UV adhesive sheet 1. Further, ultraviolet rays are blocked by the mask 5 to prevent the ultraviolet rays from leaking to the UV adhesive sheet 1 through the suction grooves 4b provided in the suction section 4.

In the pickup means 40 for picking up the semiconductor chip 2a, the semiconductor chip 2
a is suctioned from above by vacuum. This suction nozzle 3
A peripheral holding collet or the like that does not apply a mechanical impact to the semiconductor chip 2a is preferable.

Next, this semiconductor chip pickup method includes a preliminary ultraviolet irradiation step of irradiating the entire surface of the UV adhesive sheet, on which a plurality of semiconductor chips are adhered, with ultraviolet light from the back side, and a step of irradiating the target semiconductor chip 2a with a predetermined amount. A positioning step of moving the semiconductor chip 2a, a suction holding step of sucking and holding the UV adhesive tape 1 adhering the semiconductor chip 2a by vacuum suction, and a UV adhering the semiconductor chip 2a.
The method includes an ultraviolet irradiation step of irradiating the adhesive tape 1 with ultraviolet light from the back surface of the adhesive tape 1, and a semiconductor chip pickup step of picking up the semiconductor chip 2a from above.

In the method of picking up the semiconductor chip 2a, first, in a preliminary ultraviolet irradiation step, ultraviolet light is irradiated from the back side of the UV adhesive sheet to which a plurality of semiconductor chips are adhered to the entire surface to reduce the adhesive force of the UV adhesive sheet. Decrease as a whole. Next, in a semiconductor chip positioning step, the UV adhesive sheet to which the semiconductor chip to be picked up is adhered is moved. Next, in the adsorption support step of the UV adhesive sheet to which the semiconductor chip is adhered, the UV adhesive sheet is sucked and held by vacuum suction. In the UV irradiation step,
UV sticking the semiconductor chip moved to a predetermined position
Irradiation of ultraviolet rays from the back surface of the adhesive sheet almost reduces the adhesive strength of the UV adhesive sheet. Finally, in a semiconductor chip pickup step, the semiconductor chip is picked up from the adhesive tape.

When picking up the second and subsequent semiconductor chips 2a on the same adhesive sheet 1 after picking up one semiconductor chip 2a, the preliminary ultraviolet irradiation step is not performed, and the subsequent steps from the positioning step are performed. The process is repeated. Specifically, in order to position the next semiconductor chip 2a, the vacuum suction is stopped so that the UV adhesive sheet 1 can move, and the suction holding of the UV adhesive sheet 1 is released. Thereafter, for the next semiconductor chip 2a, the semiconductor chip 2a is positioned in a positioning step, irradiated with ultraviolet rays in an ultraviolet irradiation step, and picked up in a pickup step. Thereafter, the pickup of another semiconductor chip 2a on the UV adhesive sheet 1 stuck on the same wafer ring 9 is repeated in a similar procedure.

The UV adhesive sheet 1 used here is
A material that reduces the adhesive strength of the UV adhesive 1a on the upper surface due to ultraviolet irradiation is used. By reducing the adhesive strength, the semiconductor chip 2a that has adhered can be picked up. In the UV adhesive sheet 1, the thickness of the UV adhesive 1a on the upper surface is preferably set to 10 μm or less in order to improve the response at the time of UV ultraviolet irradiation. Also,
The adhesive strength of this UV adhesive 1a is 50 before UV irradiation.
５００500 g / 20 mm, and after ultraviolet irradiation, 1
g / 20 mm or less. Further, as the UV adhesive 1a, an acrylic polymer, a urethane-based oligomer of a UV resin, and a polyisocyanate as a curing agent may be blended and used in a predetermined ratio. The thickness of the UV adhesive sheet 1 is preferably 38 μm or less.

Further, the amount of ultraviolet light to be applied to the UV adhesive sheet 1 by the preliminary ultraviolet irradiator and the ultraviolet irradiator is preferably 460 mJ / cm ² or more in order to obtain a high-speed response. The irradiation time of the ultraviolet rays by the ultraviolet irradiation device before the pickup is preferably about 0.1 second or less. Note that the ratio between the amount of ultraviolet irradiation by the preliminary ultraviolet irradiator and the amount of ultraviolet irradiation by the ultraviolet irradiator before pickup can be appropriately selected. Further, the wavelength of the ultraviolet light irradiated by the preliminary ultraviolet light irradiator may be different from the wavelength of the ultraviolet light irradiated by the ultraviolet light irradiator before the pickup. For example, the wavelength of the latter ultraviolet ray may be shorter than that of the former ultraviolet ray to shorten the ultraviolet irradiation time before pickup.

Embodiment 2 The die bonding apparatus according to the second embodiment of the present invention has a semiconductor chip pickup device including the above-mentioned preliminary irradiation means. In the semiconductor chip pickup device, as described above, the adhesive force of the UV adhesive sheet to which a plurality of semiconductor chips have been previously adhered by the preliminary irradiation means can be reduced as a whole. As a result, the amount of ultraviolet light radiated at the time of pickup can be reduced, so that pickup can be performed efficiently. Therefore, the semiconductor chip can be efficiently transferred to the die bonding apparatus. In addition, since the semiconductor chip can be picked up without giving a mechanical shock, it is possible to reduce the occurrence of defects during die bonding.

This semiconductor chip die bonding apparatus includes the above-described semiconductor chip pickup apparatus and die bonding means for die-bonding the picked-up semiconductor chip.

In the die bonding apparatus for a semiconductor chip, a die bonding means that can be used usually can be used. Further, the semiconductor chip pickup device and the die bonding means may be integrally formed.

[0037]

As described above in detail, according to the semiconductor chip pickup device of the present invention, ultraviolet rays are applied from the back side of the UV adhesive sheet to which a plurality of semiconductor chips are previously adhered by the preliminary ultraviolet irradiation means. Irradiate the entire surface,
The adhesive strength of the UV adhesive sheet is reduced as a whole.
Next, ultraviolet rays are irradiated from the back surface of the UV adhesive sheet to which the semiconductor chip is adhered by ultraviolet irradiation means, so that the adhesive force of the UV adhesive sheet is almost reduced. As a result, the semiconductor chip can be picked up from the adhesive tape by a pickup means such as vacuum suction instead of a mechanical means such as a push-up needle. For this reason, since the push-up needle is not used, the semiconductor chip can be picked up while suppressing the mechanical shock applied to the semiconductor chip. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet light, the amount of ultraviolet light to be irradiated before picking up the semiconductor chip can be reduced, and the semiconductor chip can be picked up quickly.

According to the semiconductor chip pickup device of the present invention, since the push-up needle is not used, the semiconductor chip can be picked up while suppressing the mechanical shock applied to the semiconductor chip. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet rays, the amount of ultraviolet rays irradiated at the time of semiconductor chip pickup can be reduced, and semiconductor chips can be picked up quickly.

According to the semiconductor chip pickup device of the present invention, since the push-up needle is not used, the semiconductor chip can be picked up while suppressing the mechanical shock applied to the semiconductor chip. Further, a mask is provided in the ultraviolet irradiator so that ultraviolet light is irradiated only to a portion of the UV adhesive sheet to which a predetermined semiconductor chip is adhered only through a window. This prevents ultraviolet rays from leaking into the UV adhesive sheet through the suction groove, so that semiconductor chips other than the predetermined semiconductor chip can be prevented from separating from the UV adhesive sheet.

According to the semiconductor chip pickup device of the present invention, the ultraviolet irradiator is provided with a mask to prevent ultraviolet rays from leaking into the UV adhesive sheet through the suction groove. Thereby, it is possible to prevent semiconductor chips other than the predetermined semiconductor chip from separating from the UV adhesive sheet. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet rays, the amount of ultraviolet rays irradiated at the time of semiconductor chip pickup can be reduced, and semiconductor chips can be picked up quickly.

According to the method of picking up a semiconductor chip according to the present invention, since a push-up needle is not used, the semiconductor chip can be picked up while suppressing a mechanical shock applied to the semiconductor chip. In addition, since the entire surface of the UV adhesive sheet is preliminarily irradiated with ultraviolet light, the amount of ultraviolet light irradiated at the time of picking up the semiconductor chip can be reduced, and the semiconductor chip can be picked up quickly.

According to the die bonding apparatus for a semiconductor chip of the present invention, the semiconductor chip can be picked up and transferred to the die bonding means while suppressing the mechanical shock applied to the semiconductor chip. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram of a semiconductor chip pickup device according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional view of a part of the semiconductor chip pickup device according to the first embodiment of the present invention;

FIG. 3 is a perspective view showing a semiconductor chip diced as it is on a wafer adhered on an adhesive tape placed on a wafer ring.

FIG. 4 is a vertical sectional view of a conventionally used semiconductor chip pickup device.

[Explanation of symbols]

1 UV adhesive sheet, 1a UV adhesive, 2, 12
Semiconductor wafer, 2a, 12a semiconductor chip,
3, 13 suction nozzle, 4, 14 suction table, 4a, 1
4a small window, 4b, 14b suction groove, 5 mask,
5a window, 6 UV irradiator, 7, 17 support base,
7a, 17a seal, 7b, 17b exhaust port,
8, 18 Evacuation, 9, 19 Wafering, 1
0 Pickup device, 11 Adhesive sheet, 11a
Adhesive, 20 pickup device, 21 push-up table, 21a push-up needle, 32 preliminary ultraviolet irradiation means 34 positioning means, 36 suction holding means, 38
UV irradiation means, 40 pickup means

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shinji Toyosaki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 5F031 CA13 DA15 FA05 FA07 GA23 HA78 MA39 MA40 5F047 CA01 FA01 FA08

Claims (6)

[Claims] 1. A UV sticking a plurality of semiconductor chips.
Pre-irradiation means for irradiating ultraviolet rays to the entire surface from the back side of the adhesive sheet, positioning means for positioning semiconductor chips to be picked up at predetermined positions, and ultraviolet light for irradiating ultraviolet rays to the back side of the UV adhesive sheet to which the semiconductor chips are adhered A pickup device for a semiconductor chip, comprising: an irradiation unit; and a pickup unit for picking up the semiconductor chip. 2. UV bonding a plurality of semiconductor chips
A preliminary ultraviolet ray irradiator for irradiating ultraviolet rays to the entire surface from the back side of the adhesive sheet, a positioning device for positioning a semiconductor chip to be picked up at a predetermined position, and a vacuum suction of the UV adhesive sheet to which the plurality of semiconductor chips are adhered. A support base comprising a suction part for holding the suction part, a support part that supports the suction part, and forms a chamber that is vacuum-sucked together with the suction part; and in the chamber formed inside the support base, A UV irradiator provided to irradiate the back surface of the UV adhesive sheet that adheres the semiconductor chip through a window provided in the suction unit with ultraviolet light; and a suction device that suctions the semiconductor chip by vacuum suction from above. A pickup device for a semiconductor chip, comprising a nozzle. 3. A positioning device for positioning a semiconductor chip to be picked up from a plurality of semiconductor chips adhered to a UV adhesive sheet at a predetermined position, and a plurality of UV adhesive sheets adhering the plurality of semiconductor chips from a back side. A support unit comprising: a suction unit that suctions and holds by vacuum suction in the suction groove; a support unit that supports the suction unit and forms a chamber that is vacuum-sucked together with the suction unit; An ultraviolet irradiator that irradiates ultraviolet light to the back surface of a UV adhesive sheet that adheres the semiconductor chip through a window provided in the suction unit, which is provided in the chamber, The ultraviolet irradiator is configured such that the ultraviolet irradiator leaks ultraviolet light to the UV adhesive sheet through an absorption groove provided in the absorption section. The semiconductor chip pick-up apparatus which is characterized in that is provided with a mask to prevent the. 4. UV bonding a plurality of semiconductor chips
4. The semiconductor chip pickup device according to claim 3, further comprising a preliminary ultraviolet light irradiator for irradiating ultraviolet light to the entire surface from the back side of the adhesive sheet. 5. A UV sticking a plurality of semiconductor chips.
A pre-irradiation step of irradiating ultraviolet rays to the entire surface from the back side of the adhesive sheet; a positioning step of positioning semiconductor chips to be picked up at predetermined positions; and an ultraviolet ray of irradiating ultraviolet rays to the back side of the UV adhesive sheet to which the semiconductor chips are adhered. A method for picking up a semiconductor chip, comprising an irradiation step and a pickup step for picking up the semiconductor chip. 6. A die bonding apparatus for a semiconductor chip, comprising: the semiconductor chip pickup apparatus according to claim 1; and die bonding means for die bonding to the semiconductor chip.