JPH05191036A - Device for removing part mounted on board - Google Patents

Abstract

PURPOSE:To avoid the separation of wiring pattern from the board and the shortage in the residusl solder amount by a method wherein a hole is perforated in the position corresponding to the part mounted on a board so that the mounted part may be lift up by pushing up a push up pin through the intermediary of the hole in the direction separating from the board in the case of melting down a soldering member. CONSTITUTION:A hot blast feeder 23 is mounted on a board 14 so as to cover a mounted part 15 and then a pump is driven. At this time, the hot blast starts running into a path 26 and a hot blast feeding pipe so that the blown out hot blast may melt down a solder 17 fixing the lead 15a of the mounted part 15. Next, when a tack-bonding material 16 is peeled off, a suction pad 22 is lowered in the arrow C direction to hold the mounted part 15 and simultaneously a cylinder 19 is actuated to push up a push up pin 20 through the intermediary of a release 21 for lifting the mounted part 15 upward. Through these procedures, the mounted part 15 can be easily removed from the board 14. Accordingly, the deformation, etc., of the lead 15a can be avoided imposing no excessive stress on the mounted part 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board mounted component removing device for removing a component such as an IC mounted on a substrate from the board.

[0002]

2. Description of the Related Art FIG. 5 is a sectional view showing a structure of a conventional board mounted component removing apparatus disclosed in, for example, Japanese Utility Model Publication No. 3-16298. In the figure, 1 is a substrate, 2 is a mounting component such as an IC mounted on the substrate 1, 3 is a surrounding cylinder formed so as to surround the mounting component 2, and 4 is connected to the surrounding cylinder 3. An outer cylinder 5 extending upward is a suction pad arranged above the mounting component 2, and a reference numeral 6 is connected to the suction pad 5 and is arranged concentrically with the outer cylinder 4 with a predetermined gap. It is a cylinder.

Reference numeral 7 is a branch pipe branched from above the inner cylinder 6 and drawn outside the outer cylinder, 8 is a suction pump connected to the branch pipe 7, and 9 is a valve connected to a branch portion of the branch pipe 7. Reference numeral 10 is a heater disposed in a gap formed between the outer cylinder 4 and the inner cylinder 6, 11 is an operating rod coupled to the upper end of the inner cylinder 6 and operated by an operation source (not shown), and 12 is this operation. It is a spring member that constantly urges the rod 11 upward and holds the suction pad 5 at a predetermined position above the substrate 1.

Next, the operation of the conventional board-mounted component removing apparatus configured as described above will be described. First,
When the surrounding cylinder 3 is covered on the upper surface of the substrate 1 so as to cover the mounting component 2 to be removed, the valve 9 is opened and the suction pump 8 is driven to form a space between the outer cylinder 4 and the inner cylinder 6. Air is sucked in from above the gap, and this air is heated by the heater 10.
It is heated by and is sprayed on the mounted component 2
After heating and melting the soldered portion to which is adhered, it is sucked into the suction pad 5, sent through the cylinder 6 and discharged to the outside of the apparatus through the branch pipe 7. On the other hand, when the solder portion to which the mounting component 2 is fixed becomes molten, an operation source (not shown) is driven to overcome the biasing force of the spring member 12 and move the operation rod 11 downward. Due to this movement, the suction pad 5 approaches the mounting component 2, and the mounting component 2 is sucked by the suction force of the air and instantly removed from the substrate 1.

[0005]

The conventional board mounting component removing device is constructed as described above, and since the mounting component 2 is detached by the melting of the soldered portion and the vacuum suction force in the vertical direction, the fine lead is removed. When temporarily fixing with an adhesive that also serves as reinforcement, such as pitch surface mounting LSI, it is necessary to peel off this adhesive by reheating, but this peeling is quite difficult with vacuum suction, If the vacuum suction force is strengthened and peeled off, there are problems such as deformation of the leads after detachment, peeling of the pad surface of the substrate 1 and shortage of the remaining amount of solder in the soldered portion. In the case of an IC or the like having low heat resistance, there is a problem in that temperature control is difficult and thermal damage occurs, resulting in reduced reliability.

The present invention has been made in order to solve the above-mentioned problems, and eliminates deformation of leads after removal of mounted parts, peeling of the pad surface of the board and shortage of solder remaining in the soldering portion, It is another object of the present invention to provide a board mounted component removing device that can be used even when the mounted component has low heat resistance.

[0007]

[Means for Solving the Problems] Claim 1 according to the present invention
The board mounted component removing device is one in which a hole is pre-drilled at a position corresponding to the mounted component on the board and the mounted component is pushed up through the hole in the direction of separating the mounted member from the substrate when the welding member is melted. According to a second aspect of the present invention, there is provided the board mounted component removing device according to the first aspect, wherein the passage is formed in the double pipe arranged so as to surround the suction pad, and the spherical member filled in the passage. The heating air is supplied to the welding agent temporary fixing portion of the mounted component via the temperature control passage consisting of the above. Further, the board mounted component removing device according to claim 3 is the welding member according to claim 1. The push-up pin is pushed up when the melting temperature of reaches a predetermined value.

[0008]

The push-up pin of the board mounted component removing device according to the present invention pushes the mounted component away from the board, that is, in the suction direction of the suction pad to facilitate the removal of the mounted component and to heat the temperature control passage. It prevents the temperature of the wind from rising excessively and prevents thermal damage to the mounted components.

[0009]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. 1 is a diagram showing a schematic configuration of a board mounted component removing device according to a first embodiment of the present invention, and FIGS. 2 to 4 are diagrams showing details of essential parts of the board mounted component removing device shown in FIG. In FIG. 1, 12 is a base plate, 13
Is a plurality of columns upright on the base plate 12, 14 is a substrate supported by these columns 13, 15 is fixed on the substrate 14 with an adhesive 16 for temporary fixing, and the lead portion 15a is soldered. A mounting component such as an IC welded at 17 is provided, and 18 is a hole formed at a position corresponding to the mounting component 15 on the substrate 14.
19 is a cylinder fixed on the base plate 12, 20 is a hole 18
A push-up pin 21 is provided so as to penetrate therethrough. Reference numeral 21 is a release for transmitting the operation of the cylinder 19 indicated by the arrow A in the figure as the operation of the push-up pin 20 indicated by the arrow B in the figure.

Reference numeral 22 is a suction pad for sucking the mounting component 15 and moves in the direction indicated by arrow C in the figure. Reference numeral 23 denotes a heating air supply unit which is arranged so as to surround the suction pad 22 and which blows and heats the mounting component 15 to be removed on the substrate 14 and the lead portion 15a thereof to heat it. 2 to 4 are configured. In each drawing, 24 and 25 are an inner cylinder and an outer cylinder arranged so as to surround the suction pad 22, 26 is a passage formed between the inner cylinder 24 and the outer cylinder 25, and 27 is inside the passage 26. A spherical member such as an iron ball or stone to be filled, 28 is a passage 26
The temperature control passage 29 is constituted by a mesh member arranged to cover the open end of the spherical member 27 and holding the spherical member 27, and the passage 26, the spherical member 27 and the mesh member 28. Three
Reference numeral 0 denotes a plurality of heating air supply pipes arranged so as to surround the temperature control passage 29, and 31 denotes a shield that blocks the heating air supplied from the heating air supply pipe 30 from flowing to the temperature control passage 29 side. It is a plate.

Next, the operation of the board mounted component removing apparatus according to the first embodiment configured as described above will be described. First, when the pump (not shown) is operated by covering the upper surface of the substrate 14 with the heated air supply unit 23 so as to cover the mounted component 15 to be removed, the heated air is supplied to the passage 26 and the heated air supply pipe 30. Begins to flow, heating air supply pipe 3
The heated air blown from 0 is the lead 15 of the mounting component 15.
The solder 17 fixing a is heated and melted. on the other hand,
Part of the heat of the heated air flowing in the passage 26 is taken by the spherical member 27, and the temperature becomes an appropriate temperature, passes through the mesh member 28, and the mounting component 15
The adhesive 16 which is sprayed on and temporarily fixed is heated and peeled off.

In this way, the lead 15a of the mounting component 15 is
The solder 17 fixing the
When is peeled off, the suction pad 22 descends in the direction of the arrow C in the figure to adsorb the mounting component 15. At the same time, the cylinder 19 operates and the push-up pin 20 is pushed up via the release 21 to push the mounting component 15 upward, so that the mounting component 15 can be easily removed from the substrate 14. Therefore, the mounting component 15 is not subjected to an unreasonable force, so that the deformation of the lead 15a, the peeling of the pad surface of the substrate 14, the shortage of the remaining amount of the solder 17 and the like are eliminated.

Further, since the heating air having an appropriate temperature in the temperature control passage 29 is blown onto the mounting component 15 and the adhesive 16 is peeled off, the mounting component 15 is not thermally damaged and reliability is improved. improves. Further, since the shielding plate 31 is provided, the high-temperature heating air blown from the heating-air supply pipe 30 does not flow to the mounting component 15 side and exert a thermal influence.

Example 2. In addition, although the heating air in the above-mentioned Example 1 was explained using air as an example, if an inert gas is used,
Oxidation of the solder joint surface is prevented and problems such as poor connection are eliminated.

Example 3. Although not shown, a thermocouple for temperature measurement is installed at a position corresponding to the adhesive 16 and the solder 17, and, for example, after confirming that the temperature of the solder 17 is higher than the melting temperature, the cylinder By activating 19 to push up the mounted component 15, it is possible to remove the mounted component accurately and quickly at a proper timing.

[0016]

As described above, according to the present invention, a hole is preliminarily formed at a position corresponding to a mounting component on a substrate, and the mounting component is pushed through the hole in a direction of separating the mounting component from the substrate when the welding member is melted. Since it is pushed up with, it prevents the deformation of the lead after the mounting parts are removed, the peeling of the pad surface of the board and the shortage of the remaining amount of solder in the soldering part, and it is arranged so as to surround the suction pad. The heating air is supplied to the adhesive temporary fixing portion of the mounted component through the temperature control passage consisting of the passage formed in the double pipe and the spherical member filled in the passage. Even if the heat resistance is low, and the push-up pin is pushed up when the melting temperature of the welding member reaches a predetermined value, so that it can be removed accurately and with good timing. It is possible to provide a.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a board mounted component removing device according to a first embodiment of the present invention.

FIG. 2 is a front view showing a heated air supply unit that constitutes a main part of the board mounted component removing device in FIG.

FIG. 3 is a plan view showing a heated air supply unit in FIG.

4 is a cross-sectional view showing a temperature control passage forming a main part of the heated air supply unit in FIG.

FIG. 5 is a cross-sectional view showing a configuration of a conventional board-mounted component removing device.

[Explanation of symbols]

 14 board 15 mounted component 15a lead 16 adhesive 17 solder 18 hole 20 push-up pin 22 suction pad 23 heated air supply section 24 inner cylinder 25 outer cylinder 26 passage 27 spherical member 28 mesh member 29 temperature control passage 30 heated air supply pipe

Claims (3)

[Claims] 1. Removal of the mounted component from the substrate by supplying heated air onto the substrate to melt a welding member fixing the lead of the mounted component and sucking the fused member with a suction pad. In the apparatus, a hole is preliminarily formed at a position corresponding to the mounting component on the substrate, and the mounting component is pushed up through the hole in a direction away from the substrate when the welding member is melted. Board mounted component removal device. 2. The heating air is passed through a temperature control passage consisting of a passage formed in a double pipe arranged so as to surround the suction pad and a spherical member filled in the passage. 2. The board mounted component removing device according to claim 1, wherein the adhesive is temporarily supplied. 3. The board mounted component removing device according to claim 1, wherein the push-up pin is pushed up when the melting temperature of the welding member reaches a predetermined value.