JPH0241771A - Soldering device - Google Patents

Abstract

PURPOSE:To prevent the generation of a connection defect and the bridges between terminals by providing a head for blasting hot air to the terminals of an integrated circuit package, a pressing member for pressing the package from above and a blast pipe for blowing cold air. CONSTITUTION:A package retaining rod 29 presses the center of the front surface of an IC package 4 and further, the package 4 enters the inside of the cavity par5 20b of a head 20 as a slider descends. The rear surface of the head 20 is then brought into proximity to the front surface of a printed circuit board 2. The hot air comes into contact with the respective terminals 5 and the solder of patterns 3 melts when the hot air A is fed from the blast pipe 17 for hot air. The blast pipe 24 for cold air is further lowered and the respective terminals 5 are pressed by the bottom end 22a of a cup 22 in order to, prevent floating of the terminals 5 of the pattern 4. The hot air 5 brings the molten solder closer to the terminals 5. The bridges and flux by the excess solder between the terminals 5 are removed when the cold air B is supplied from the blast pipe 24 into the terminal retaining cup 22.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" This invention is applicable to, for example, integrated circuits in flat packages (
(hereinafter abbreviated as rc) is attached to the printed wiring board with a semi-annual mark ('l
This invention relates to a soldering device.

[Summary of the Invention] This invention provides a method for soldering an IC package to a printed wiring board.
The soldering device includes a head that sends hot air from an orifice to multiple terminals of an IC package, a pressing member that is placed in the center of the head and presses the IC package from two parts, and a pressing member that sends cold air to the IC package. Equipped with a blower pipe that blows air into the air, it is possible to remove the large number of terminals on the IC package and solder on the printed circuit board.
When applying solder (-1 (J) to the part, it is possible to easily and reliably prevent connection failures due to lifting of the terminals of the integrated circuit package regardless of whether the amount of solder is too much or not. In addition, it is possible to easily and reliably prevent the occurrence of bridging between terminals due to excess solder, etc., at low cost.

[Prior Art] For example, a soldering device for soldering a flat IC package to a printed wiring board is shown in Japanese Patent Application Laid-Open No. 5710086. This is explained in detail with reference to FIG. 30 (J solder now) device, and this soldering device 30 connects the land (solder now) of the printed wiring board 31.
When soldering a large number of terminals 3/I of the IC package 33 to the solder pre-attached to the solder 32, first place the printed wiring on the rotary table 35 movable in the x-y axis direction in the figure. Position the board 31, and land 32F of the printed wiring board 31.
Terminal 34 of IC package 33 to be soldered to
Equipped with From this state, the arm 36 is lowered, and the thermocompression welding block 37 installed at the distal end of the arm 36 is lowered, and the distal end of the thermocompression welding block 37 is brought into contact with the terminals 34 that are aligned in a row. Press.

Then, a heated liquid 38 such as peanut oil is injected from the liquid injection port 39, and the heated liquid 38 flows out around the terminal 34 from the opening at the tip of the thermo-pressure welding block 37. Due to this heat, the terminal 34 and land 3
The solder that had been applied to 2 is melted, and the terminals 34 and runts 32 that are lined up in a row are now separated by half 1:11. Problem] However, in the conventional half-month (-1 device 30),
How many solder strips are needed to connect the terminals 34 and runts 32?
Alternatively, there is a drawback that the terminals 34 may be bridged with each other (between each of these terminals 34), and the occurrence of a bridge cannot be prevented. 'I; Also, in order to bring the thermo-compression welding block 37 into contact with the terminals 34 of the IC package 33, the tip of the thermo-compression welding block 37 must be cleaned each time it is soldered, and furthermore, it must be cleaned with peanut oil or the like. liquid 38
Since post-processing is also essential, there is a disadvantage that the soldering process is complicated and workability is poor, and the run time is very high.

In addition, before melting the solder when soldering a flat IC package to a printed wiring board by IJ, a solder preheating device that does not melt the flux contained in the solder is disclosed in Japanese Patent Application Laid-Open No. 61-14077. (See Figure 10). In this solder preheating device 40, air sent to a hood 41 is heated by an electric heater 42, and is heated to correspond to a large number of terminals 44 protruding from the outer periphery of an IC package 43.
-Printed wiring board 4 from outlet 4.1a of hood 41
Cream half attached to land 46 of No. 5 1-1-14.
By blowing hot air Δ (=t IJ) on 7,
It is possible to do this without melting the flux contained in the cream. And for example”-
The terminals 44 of the IC package 43 are bonded to the printed wiring board 45 by melting the solder with hot air using the solder preheating device 40.
Assuming that solder (t It L) is applied to the solder part 46 of
Since the device 40 simply blows hot air onto the terminals 44 of the IC package 43, there may be excess or deficiency in the amount of solder due to unevenness in the amount of solder, variations in the height, etc. In other words, if there are not enough half-IB claws, the terminals of the integrated circuit package may float, resulting in poor connection, and if there is excess solder, there may be poor connection of bridges between terminals, etc. is likely to occur.

Therefore, the present invention can easily and reliably prevent floating terminals of an integrated circuit package and connection failures of bridges between terminals, etc., at low cost, regardless of whether the amount of solder is excessive or insufficient. The present invention provides a soldering device.

[Means for Solving the Problems] The soldering device of the present invention forms an orifice in a portion facing a large number of terminals of an integrated circuit pancake that is attached to a half-U” portion of a printed wiring board, a head for sending hot air from the orifice to the terminal side; a pressing member disposed at the center of the head for pressing the integrated circuit package toward the claw plate; −
The integrated circuit package is equipped with a blower pipe for blowing cold air onto the integrated circuit package.

[Operation] When the terminals of the integrated circuit package are mounted on the solder holes of the printed wiring board, and the pressure member presses the integrated circuit package from above and hot air is sent from the orifice of the head to the terminals, the hot air causes the solder to melt. The solder on the "A" part melts, and even if the solder amount is insufficient, the terminals of the integrated circuit package do not lift up, resulting in a good semi-IJI (11υ).

In addition, cool air is blown from the air pipe onto the integrated circuit package (
By doing so, bridging between terminals due to excess solder or the like can be easily and reliably prevented.

[Example] Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

In FIG. 2, 1 is a soldering device that connects a large number of terminals 5 adjacent to the pattern (half+n (=1 part) 3) of a printed wiring board 2 with pins of several mm on a flat IC package 4. Soldering (t i-1) is carried out through solder (not shown) applied in advance according to the pattern 3.
It has a head part 10 with a 17-shaped arm 7 attached to one end side of a.
It has a board body Pj frame 8 which is horizontally movable in the X-Y axis directions by manual positioning of the printed wiring board 2 on the surface 6a below -1- of the pedestal 6.

As shown in FIGS. 1 to 3, the head section 10 has a rectangular slide receiving plate 11 extending perpendicularly to the tip end 7a of the arm 7. A flat T-shaped slider 13 is installed between a pair of guide plates 12 and 12 fixed to the left and right sides of one side lea of this slide receiving plate 11.
1. This slider 13 is installed to be able to freely slide downward.
On the lower end surface of the air cylinder 14, a lot 1 of the air cylinder 14 (-1
5 is fixed. The air cylinder I4 allows the slider 13 to freely slide along the downward direction of one side of the slide receiving plate +1.

A bracket 16 in the form of an inverted 17-shaped plate is fixed at a position opposite to the distal end protruding piece 13b of the horizontally protruding protrusion 13a on the second part of the slider 13. A cylindrical hot air blower pipe 17 extending vertically downward is attached to the outside of this bracket 16 (J).
A plurality of electric heaters 18 are arranged inside the heater 7. In addition, an air supply pipe I9 is connected to the end of this blower pipe 17, and a number of terminals of the IC package 4 are soldered to the pattern 3 of the printed wiring board 2 at its lower end. Remove the head 20 that sends hot air to the
It is.

As shown in FIG. 6, the head 20 is formed into a rectangular to-nut shape with an air reservoir 20a inside the pipe-shaped part having a rectangular cross-section. It has a cavity 20b. This cavity 20b
is formed to be larger in circumference than the IC package 4, and has edges in four directions at the bottom, that is, printed wiring board 2.
An orifice 20c is formed in the pattern 3 of the solder (=t) at a portion facing a large number of terminals 5 protruding from the outer peripheral surface of the IC package 4 to be IJed.
When soldering from 0c, hot air A is blown (t t-1) from the hot air blower pipe 17 toward the terminals 5 side.Furthermore, as shown in Fig. 5.6, A shielding plate 21 is disposed horizontally in the air reservoir 2Oa located at the lower end side of the hot air blast pipe 17 where the hot air is directly blown out.

Further, in the cavity 2Ob of the head 20, there is soldered i.
A terminal holding cup 22 for holding down the many terminals 5 of the IC package 4 at the time of -1 is disposed so as to be freely movable downward. This cup 22 is formed into a box shape with an open lower end 22a side, and a cylindrical portion 2 having an inverted conical inner surface on the second side.
2b is provided protrudingly.

The cylindrical portion 22b is screwed onto the lower end of the cold air blower pipe 24, which is movably supported by a cylindrical bushing body 23 fixed between the tip protruding piece +3b of the slider 13 and the bracket 16. It is supported so that it can be freely fitted into a conical guide cylinder 25.

The upper end of the cold air blower pipe 24 is attached to a bracket 16 marked with "-".
It is connected to the rod of the air cylinder 26 fixed to the two halves of the cold air blast pipe 24 and the terminal holding cup 2.
2 is designed to move downward. Further, a cooling air supply pipe 27 is connected to the upper part of the cold air blowing pipe 24. Further, at the lower part of the cold air blower pipe 24, a package holding rod (pressing member) that is constantly biased downward (= 1 force) by a compression coil spring 28 and extends downward from the guide cylinder 25 to the center downward in the terminal holding cup 22. ) 29 are arranged.

An air cylinder 9Δ for backing up the solder portion 3 of the printed wiring board 2 is disposed on the ``-'' surface 6a of the pedestal 6 below the package holding rod 29. A control operation box 9B for controlling each air cylinder 14, 26, electric heater 18, etc. is removed from the U-shaped body.

According to the soldering device 1 of this embodiment, solder (none of which is shown) is passed through a depth (solder) tank in advance (=t).
Use a soldering iron to temporarily fix the printed wiring U' and pattern 2 of the board 2, which have been placed at t1, and apply flux (none of them shown) to When performing IJ, as shown in FIG. 1, the printed wiring board 2 is held by the board holding frame 8, and the I When the slider 13 is lowered from this state via the air cylinder 14, the sixth
As shown in the figure, first, the package holding rod 29 is
Press approximately the center of the top surface of the C package 4 to hold it so that it does not move. Furthermore, the slider 13 is lowered until the TC package 4 enters the cavity 2Ob of the head 20 and the lower surface of the head 20 approaches, for example, approximately 2 mm from the two sides of the printed wiring board 2. From this state, hot air A is sent from the hot air blast pipe 17 as shown by the arrow in FIG.
When sending the IC package 4 of the head 20,
Hot air hits each terminal 5 from orifices 20c formed in four directions surrounding the outer circumferential surface, and the terminal 4 side is locally heated. This hot air A melts the solder of pattern 3 above. At this time, the main body of the IC package 4 is protected by the terminal holding cup 22 from being hit by the hot air A.

Then, in order to prevent each terminal 5 of pattern 4 from floating, the cold air blast pipe 24 is further lowered via the air cylinder 26, and the terminal holding cup 22 is lowered to prevent the lower end of the terminal 5 from floating. 22a to press each terminal 5. At this time, as shown in FIG.
In order to achieve the effect of attracting the terminals 1 to 1, the head 20 is set at a height of 5 m, for example, so that the hot recording air A does not strongly hit each terminal 5.
Get 1 more than m.

The hot air A is blown out slightly diagonally and acts to bring the melted solder to each terminal 5. Also, in order to remove the blister and flux between the terminals 5, the hot air A is blown out from the cold air blowing pipe 24 as shown in Fig. 7. The cold air B is supplied into the sealed terminal holding cup 22 as shown by the arrow in the middle. Bridges and flux caused by excess solder between the terminals 5 are reliably removed. In this way, each terminal 5 is attached to the lower end 2 of the terminal holding cup 22.
Since the IC package 4 is cooled while being held down, even if the amount of solder is insufficient, a good amount of solder can be applied without causing each terminal 5 of the IC package 4 to float.

As shown in Figure 8, one cycle is completed and the next soldering cycle is completed.
Even in the standby state, the hot air A is always sent out to the head 20 side to preheat the terminal holding cup 22.

This prevents, for example, when a cold terminal holding cup 22 is applied to each terminal 5, the solder hardens and the bridge cannot be removed.

Further, in order to protect the spring 28 of the package holding rod 29 and the guide cylinder 25 from heat, cold air B is also supplied during the standby period.

The terminal holding cup 22 (J), as shown in FIG. 8, is suspended from a guide cylinder 25 "in a gripper" and is automatically centered.

In addition, as shown in FIGS. 5 to 8, a shielding plate 2I is installed in the part of the head 20 where hot air is directly output from the hot air blower pipe 17, so that the temperature locally increases. Furthermore, the air reservoir 20a provided in the head 20 distributes the wind pressure of the hot air Δ to the orifices 2 in four directions.
It is made to be constant at all 0c.

Note that the printed wiring board 2 after the above-mentioned depth is warped due to heat, and the positioning flatness becomes extremely unstable.
For example, set a compliance (ratio of strain to external force that does not cause it) of 1 mm for the four directions to be followed.''J''
The terminal holding cup 22 is configured to follow the inclination of the printed wiring board 2 due to warping or the like.

In this way, the solder does not melt and the heat source is non-contact, so there is no need for cleaning, which is advantageous in terms of maintenance, and is inexpensive and easy to use, reducing management, maintenance, and running costs compared to the conventional soldering machine. has the advantage of being very cheap.

In addition, it can be combined with a positioning robot to save labor at a low cost.

According to the above-mentioned embodiment, soldering of a flat IC package having terminals in four directions (as described above, soldering of a flat IC package having terminals in two directions on both sides) is possible. ′, l may be soldered using a device in the above soldering example.

[Effects of the Invention] As described in Part 2 below, the solder side device of the present invention includes a head that sends hot air from an orifice to a terminal of an integrated circuit package, and a head that is disposed at the center of the head to send hot air to a terminal of an integrated circuit package. A pressing member that presses the IC package from above and a blow pipe that blows cold air onto the integrated circuit package (lfl
Therefore, when soldering the terminals of the integrated circuit package to the soldering part of the printed wiring board, regardless of the amount of solder, the terminals of the integrated circuit package may rise, and each of the bridges between the terminals, etc. Connection failures can be easily and reliably prevented at low cost.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the main parts of a soldering side device showing an embodiment of the present invention, and FIG. 2 is a perspective view of the entire device.
Fig. 3 is a schematic side view of the soldering device, Fig. 4 is a view along arrow A-A in Fig. 3, Fig. 5 is a perspective view showing a part of the head in cross section, and Figs. 6 to 8 9 is a perspective view of a conventional soldering machine, and FIG. 1O is a side sectional view of another conventional example. 1 Soldering device, 2 Printed wiring board, 3 Pattern (solder side), 4 Integrated circuit paracane, 5 Terminal, 20
Head, 20c Orifice, 24 Air pipe, 29
Package holding rod (pressing member), A Hot air, B
Cold wind.

Claims (1)

[Claims] (1) A head having an orifice formed in a portion facing a large number of terminals of an integrated circuit package to be soldered to a soldering portion of a printed wiring board, and sending hot air from the orifice to the terminal side; A soldering device comprising: a pressing member disposed to press the integrated circuit package toward the substrate; and a blower pipe disposed at the center of the head to blow cold air onto the integrated circuit package. .