JPS63205993A - Apparatus for repairing component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a component repair device, that is, a device for replacing defective components soldered to a board, and in particular, to a device for replacing defective components soldered to a board, and in particular for removing defective components from a board and removing the defective components from the board. The present invention relates to a component repair device suitable for removing solder in through-holes of a board.

[Conventional technology]

Conventional techniques for heating circuit boards and solder during parts replacement work include: (1) A technique using a heating iron, as described in Japanese Utility Model Publication No. 57-40551.

(2) As described in Japanese Utility Model Publication No. 57-58795, a technique in which hot air is blown with a nozzle to heat the solder connection portion of a removed component on a board.

(3) Technology that heats the solder by floating it on a molten bath.

There is.

Also, as a conventional technique for removing solder in through holes provided in a board.

(1) A technique of blowing away the solder by blowing hot air into the through-hole with a nozzle, (jj) As shown in Publication No. 14623/1983, a solder eyelid device attached to a soldering iron blows the solder together with the surrounding air. The eyelid tightening technique is known and widely used.

[Problem that the invention seeks to solve]

In the above-mentioned conventional technology, if the heat conduction and heat transfer inside and outside the surface of the substrate itself are large, the heating temperature is below the allowable heating temperature of the substrate.

Even if the area around the board of the defective part to be replaced is locally heated, the solder at the connection part of the defective part will not melt, and the defective part may not be removed or the solder in the through-holes may not be removed. In particular, hot air has a lower heat transfer coefficient to the substrate than molten solder liquid, and even if the heating area is increased, high-temperature heating is still required, causing burning and other problems, which can damage the substrate.

Furthermore, even if molten solder liquid is used as a heating medium, if heat escapes to the surroundings of the board, it is still necessary to increase the heating area. In this case, by reheating other solder connections within the board, excess solder may adhere after heating, causing solder bridges and icicles, which can lead to failures in the solder connections of components. There was a problem.Furthermore, when removing solder from inside a through hole and using molten solder liquid as a heating medium, it is necessary to lower the liquid level. For this reason, in the conventional technology, if the temperature of the board drops during the solder removal process, the solder in the through hole will harden, making it impossible to remove the solder, or making it impossible to try bonding to prevent defective solder removal. Ta.

An object of the present invention is to solve the problems of the prior art described above, and to make it possible to retry failures in removing solder in through-holes without damaging the board due to overheating or causing defects in solder connections. Moreover, it is an object of the present invention to provide a component repair device that can continuously perform the work of pulling out defective components and removing solder in through-holes with a single device.

[Means for solving problems]

The above object is to arrange a jet-type heating tank including a tank body, a heater, and a pump for circulating an organic heat medium, to house an organic heat medium in the tank body, and to maintain a constant temperature inside the tank body. A holding frame for the board is installed at the position, and above the holding frame in the heating tank, means for pulling out the defective component and means for removing solder in the through hole provided in the board are arranged, and This is achieved by attaching the pulling means and the solder removing means so that they can approach and separate from the substrate installed in the tank body.

[Effect]

In the present invention, a board having a defective part to be replaced is attached to a holding frame, and this holding frame is installed at a predetermined position inside the tank body.

In addition, an organic heating medium such as a fluorine thread inert liquid or silicone oil stored inside the tank body is heated by a heater, and the heated organic heating medium is jetted by a pump to raise the liquid level of the organic heating medium. let

As a result, the heating liquid of the organic heating medium comes into contact with the substrate.

The solder joints of the components are heated together with the board, and the solder melts.

After melting the solder at the solder joint of the component, the defective component extraction means is moved to the location of the defective component, and the defective component is pulled out and removed from the board.

Next, the solder removing means is moved to the position of the through hole from which the defective part was pulled out, and the solder in the through hole is removed.

If the solder removal means is, for example, an air blowing type, the pump for circulating the organic heat medium may be stopped, the liquid level of the organic heat medium may be lowered, and then air may be blown into the through holes. In addition, if the solder removal means is, for example, a suction type, the solder in the through hole is sucked without lowering the liquid level of the organic heating medium, and the organic heating medium that is sucked in at the same time is separated. It may be returned to the main body.

As mentioned above, in the present invention, by using an organic heating medium such as a fluorine thread inert liquid or silicone oil as a heating medium, the heating area can be expanded to a level where the heating temperature can be suppressed to a level that does not damage the substrate. Moreover, the solder in the solder joints of defective parts can be completely melted.

In addition, when heating the board with the organic heating medium, other soldered parts on the board are also reheated, but since no excess solder is attached during this reheating, the solder joints of other parts are heated. No bad accidents will occur.

Furthermore, in the present invention, if a defective solder removal part occurs in a through-hole, the residual solder can be easily reheated by jetting an organic heating medium using a pump and bringing the heated liquid into contact with the board. Even if there is a defective part of the solder to be removed, it is possible to try to remove it.

Moreover, the present invention is equipped with a means for extracting defective parts and a means for removing solder in the through-hole, and these are attached so that they can be approached and separated from the board installed in the tank main body. The device can continuously perform the work of pulling out defective parts and the work of removing solder in the through holes after pulling out.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a longitudinal sectional view showing the same operating state, and FIG. 3 is an enlarged longitudinal sectional view of a part showing an example of a component mounting board targeted by the present invention. It is a front view.

The present invention is directed to a component mounting board in which a pin 4 of a component 3 is inserted into a through hole 2 provided in a board 1, and the pin 4 is connected by solder 5, as shown in FIG.

The parts repair apparatus of the embodiment shown in FIGS. 1 and 2 of the present invention is equipped with a jet type heating tank.

The heating tank includes a tank main body 6, a heater 7, a pump 9,
The structure includes a weir 11.

The tank body 6 accommodates an organic heat medium 10 such as a fluorine thread inert liquid or silicone oil.

The heater 7 is configured to heat the organic heat medium 10 via the tank body 6.

The pump 9 is rotationally driven by a motor 8 to circulate and jet the organic heat medium 1o.

A slit portion 12 is provided in the upper part of the base 11 to allow the organic heat medium 10 to flow out and to define the liquid level of the organic heat medium 10. Further, a holding frame 14 is detachably installed above the weir 1.

A board 1 on which parts 3 and defective parts 3' are mounted is attached to the bottom surface of the holding frame 14. A cover 13 is attached to the upper surface of the holding frame 14.

Furthermore, a screw shaft 16 is supported at the upper part of the tank body 6. This screw shaft 16 is rotationally driven by a motor 15.

A slider 19 having a nut inside is attached to the screw shaft 16. The slider 19 is operated to move in the X direction shown by the arrow in FIG. 1 within a horizontal plane as the screw shaft 16 is rotated in the forward or reverse direction.

The slider 19 is provided with a chuck 17 as a means for pulling out the defective component 3', and an air blowing nozzle 18 constituting a means for removing the solder 5 in the through hole 2 after pulling out the defective component 3'. It is being

The chuck 17 is operated to close by a spring 21 in a direction to grip the defective part 3', and is operated to open by an internal mechanism (not shown) using a hinge 20 as a fulcrum. Further, the chuck 17 is supported by the slider 19 via a cylinder 22 for vertical operation, and can approach and move away from the defective parts 3' mounted on the substrate 1. Further, this chuck 17 is operated to move in the Y direction within a horizontal plane by another cylinder (not shown).

The air blowing nozzle 18 is connected to an air supply source (not shown) through an air intake port 23 and blows air into the through hole 2 through an air blowing port 24 . This air blowing nozzle 18 is supported by the slider 19 via a cylinder 25 for vertical operation.

It is designed so that it can approach and separate from the through hole 2 of the substrate 1. Further, this air blowing nozzle 18 is provided so as to be movable in the Y direction within a horizontal plane by another cylinder (not shown).

The parts repair device of the above embodiment is used as follows,
act.

That is, the organic heat medium 10 in the tank body 6 of the heating tank is heated to a predetermined temperature by the heater 7.

On the other hand, the board 1 on which one component is mounted is fixed to the holding frame 14, and the board 1, the holding frame 14, and the cover 13 are installed on the upper part of the weir 11.

1 Rotate pump 9 and heater No. 7 2
'The heated organic heating medium 10 is made to flow upstream.

As a result, the organic heat medium 10 comes into contact with the bottom surface of the substrate 1 installed on the weir 11, and the slit portion 1 provided on the weir 11
2 and heats the substrate 1 while circulating.

During this time, the chuck 17 is moved to the position of the defective part 3', brought close to the defective part 3' by the cylinder 22, and the defective part 3' is gripped by the chuck 17 as shown in FIG.

When the substrate 1 is heated by the organic heating medium 10 and the solder 5 is melted, the chuck 1 that has previously gripped the defective part 3'
7 is pulled up by the cylinder 22, the pin 4 is inserted into the through hole 2 of the board 1, and the defective part 3' connected with the solder 5 is pulled out and taken out from the board 1.

After taking out the defective part 3' from the board 1, the air blowing nozzle 18 is moved to the position of the through hole 2 from which the defective part 3' was taken out, and then the cylinder 25 is brought close to the through hole 2.

Meanwhile, in the case of the solder removal means using the air blowing nozzle 18, the rotation of the pump 9 is stopped and the liquid level of the organic heat medium 10 is lowered to ensure safety during air blowing.

Then, as shown in FIG.
After the defective part 3' has been pulled out, air is blown into the through hole 2 through the air blowing port 24 to remove the molten solder 5 inside the through hole 2.

When the solder 5 in the through-hole 2 cannot be completely removed by one air blowing, the air blowing is temporarily stopped, and the organic heat medium 10 is again jetted by the pump 9. is reheated to melt the solder 5, the rotation of the pump 9 is stopped, and air is blown again to try to remove the remaining solder 5.

By the above-mentioned operation, after pulling out the defective component 3' and removing the solder 5 in the through hole 2 for one board, that board 1 is removed and a new board 1 with the defective component 3' is inserted. It is installed at the top of the weir 11, and the above-mentioned operation is repeated.

In this embodiment, hot air may be blown to prevent the temperature of the substrate 1 from dropping rapidly1.Furthermore, in this embodiment, the cover 13 prevents scattered solder from adhering to the substrate 1, and temperature can be maintained.

According to the embodiment described above, since the substrate 1 is widely heated by the organic heating medium 1o, damage caused by local overheating of the substrate 1 is avoided, and the solder 5 in the through hole 2 is can be completely melted and the defective part 3' can be pulled out.

In addition, in this embodiment, the solder joints of other components within the board 1 are also reheated, but since excess solder is not applied to the solder joints, it is possible to prevent the occurrence of defective solder joints. It can be prevented.

Furthermore, in this embodiment, air is blown from the air blowing nozzle 18 into the through hole 2 to blow off the solder 5, but during this process the temperature of the board 1 decreases and the solder 5 inside the through hole 2 is not removed properly. Even if the heating occurs, the pump 9 can be rotated again, the organic heating medium 10 can be jetted, and the substrate 1 can be brought into contact with the substrate 1 to easily reheat it.
You can easily try out solder removal glue.

Moreover, in this embodiment, the work of pulling out the defective part 3' by the chuck 17 and the work of removing the solder 5 in the through-hole 2 by the blowing nozzle 18 can be performed continuously with a single device.

Next, FIG. 4 is a partial vertical sectional view showing another embodiment of the present invention.

In the embodiment shown in FIG. 4, a suction nozzle 27 is used as the solder 5 removing means.

The suction nozzle 27 is supported by the slider 19 via a cylinder 26 for vertical operation. Further, the suction nozzle 27 is adapted to suction the solder 5 in a molten state through a suction port 28 .

A solder separator 29 is attached to the suction nozzle 27 . This solder separator 29 transfers the mixture of the organic heat medium 10 and the solder 5 sucked by the suction nozzle 27 to the organic heat medium 1
0 and solder 5. A vacuum pump (not shown) is connected to the solder separator 29 through a hose 30, and the separated organic heat medium 10
I try to suck it out only.

In the embodiment shown in FIG. 4, the substrate 1 is
While heating with 0, the solder 5 in the through hole 2 after pulling out the defective part 3' is sucked together with the organic heating medium 10 from the suction port 28 of the suction nozzle 27, and the solder 5 is separated by the solder separator 29. Only the organic heat medium 10 is sucked through the hose 30 by a vacuum pump.

Then, the sucked organic heat medium 10 may be returned to the tank body 6 of the heating tank from the vacuum pump and reused.

In the embodiment shown in FIG. 4, the substrate 1 is heated by the organic heating medium 10 without stopping the rotation of the pump 9, and the defective parts 3' are pulled out and the inside of the through hole 2 is removed after being pulled out. It is possible to perform the removal work of solder 5,
These operations can be performed even more efficiently.

In the embodiment shown in FIG. 4, the molten solder hardly scatters and the substrate 1 is kept heated by the organic heating medium 10, so the cover for the substrate 1 may be omitted.

The other structures and functions shown in FIG. 4 are the same as those in the embodiment shown in FIGS. 1 and 2, and the same members are denoted by the same reference numerals.

〔Effect of the invention〕

According to the present invention described above, a jet type heating tank including a tank main body, a heater, and a pump for circulating an organic heat medium is installed, an organic heat medium is accommodated in the tank main body, and the tank A holding frame for the board is installed at a fixed position inside the main body, and a means for extracting defective parts and a means for removing solder in a through hole provided in the board are arranged above the holding frame in the heating tank. At the same time, the means for pulling out the defective parts and the means for removing the solder are attached so as to be able to approach and separate from the board installed in the tank main body. By using a medium, the heating temperature can be spread over a heating area that can be suppressed to a level that does not damage the board, and the solder in the solder joints of defective components can be completely melted and the defective components can be pulled out. There is.

Further, according to one aspect of the present invention, when heating the substrate with an organic heating medium,
Other soldering parts within the board will also be reheated, but since no excess solder will be attached during this reheating, there is an effect of preventing the occurrence of defects in the soldered joints of other parts.

Furthermore, according to the present invention, if a defective solder removal part occurs in a through hole, the organic heating medium is jetted by a pump to bring the heated liquid into contact with the board, and the remaining solder can be easily reheated. Therefore, even if there is a defective portion of solder to be removed, it is possible to easily try to remove it.

Moreover, in the present invention, there is provided a means for extracting the defective part.

It is equipped with a means for removing the solder in the through hole, and is attached so that it can approach and separate from the board installed in the tank body, so a single device can perform the work of pulling out defective parts and the removal of the solder after pulling out. This has the effect that the solder removal work in the through hole can be performed continuously.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a longitudinal sectional view showing the same operating state, and FIG. 3 is an enlarged longitudinal sectional view of a part showing an example of a component mounting board targeted by the present invention. Front view, 4th
The figure is a partial vertical sectional view showing another embodiment of the present invention. 1... Board, 2... Through hole, 3... Parts,
3'...Defective part, 4...Pin, 5...Solder, 6...
...Tank body of heating tank, 7...Heater, 9.Pump, 1
0...Organic heating medium, 11...Weir, 12...Slit portion, 14...Substrate holding frame, 16...Screw shaft, 17...Constituting means for extracting defective parts chuck, 18... air blowing nozzle constituting solder removal means, 19... slider, 27...
・Suction nozzle, 29, constituting the solder removal means.
・Solder separator.

Claims (1)

[Scope of Claims] 1. A jet-type heating tank including a tank body, a heater, and a pump for circulating an organic heating medium is installed, an organic heating medium is housed in the tank body, and the tank body A holding frame for the board is installed at a fixed position inside the heating tank, and above the holding frame in the heating tank, a means for extracting defective parts and a means for removing solder in a through hole provided in the board are arranged. . A component repair device, characterized in that the defective component pulling means and the solder removing means are attached so as to be able to approach and separate from a board installed in a tank main body. 2. The component repair device according to claim 1, wherein the solder removing means includes an air blowing nozzle that blows air into the through holes from the upper surface side of the board. 3. The component repair device according to claim 1, wherein the solder removing means includes a suction nozzle that sucks the solder in the through hole.