JP2002353610A - Apparatus and method for repairing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To separate a semiconductor device from a board with substantially no residue left on the board. SOLUTION: A semiconductor device 41 is held in position by a suction nozzle 2, and further hot air supplied to the air path 21 of an air nozzle 1 is sprayed through a spout 10a to heat and melt solder 44 connecting the semiconductor device 41 and a board 42. Further, hot air 32 supplied to the air path 21 of the air nozzle 1 is sprayed through a spout 10b to blow off and remove the melted solder 44. Thus, the semiconductor device 41 and the board 42 are separated from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for repairing a semiconductor device and a repair device, and more particularly, to heat and melt the solder connecting the semiconductor device and the substrate to separate the semiconductor device and the substrate. The present invention relates to a repair method and a repair device. The present invention relates to, for example, BGA (Ball Grid Arra).
It is suitably used for a semiconductor device having a y) type structure.

[0002]

2. Description of the Related Art Generally, when a semiconductor device mounted on a substrate such as a printed circuit board has a defect, the semiconductor device is replaced with a substitute semiconductor device, that is, "repair" is performed. In the repair, a step of heating and melting the solder connecting the substrate and the semiconductor device to remove the semiconductor device from the substrate,
Soldering and attaching the alternative semiconductor device to the substrate.

In recent years, in order to realize high-density mounting, BG
A-type semiconductor devices are widely used. As a conventional method of repairing this BGA type semiconductor device, a repair device having a suction nozzle for sucking the semiconductor device and an air nozzle for injecting hot air is used, and the semiconductor device is heated and melted by hot air. There is a thing which removes and attaches.

That is, in the step of removing the semiconductor device, the semiconductor device to be repaired and its solder connection are heated by injecting hot air from the air nozzle of the repair device to heat and melt the solder at the connection. Then, the semiconductor device is pulled up while being sucked by the suction nozzle in a state where the solder is melted, so that the semiconductor device and the substrate are separated, and the semiconductor device is removed.

In the removal step, when the semiconductor device and the substrate are separated from each other, the solder at the connection portion is divided while being adhered to each of the semiconductor device and the substrate, and the solder is placed on the substrate after the semiconductor device is removed. Is partially left. That is, a solder residue is generated on the separated semiconductor substrate.

In mounting an alternative semiconductor device,
It is necessary to apply cream solder on the substrate by a method such as screen printing. If there is a solder residue on the substrate, the thickness of the applied cream solder becomes uneven.

Therefore, before the replacement semiconductor device is mounted, the substrate is taken out of the repair device, and the solder residue on the substrate is almost completely removed. Then, after applying the cream solder on the substrate from which the solder residue has been removed, a replacement semiconductor device is attached to the substrate using a repair device.

[0008] There are various methods for removing the solder residue on the substrate. Conventionally, all of the methods remove the solidified solder residue after heating and melting it again.

As a well-known method for removing solder residue, for example, there is a method using a solder desoldering wire and a soldering iron. In this method, a soldering iron maintained at a heating temperature required for melting the solder is pressed from above the solder blotting line while the solder blotting line is placed on the solder residue, and the solder blotting line and the solder residue are brought into contact. As a result, the molten solder residue is adsorbed on the desoldering wire, and the solder residue is removed.

As another method of removing the solder residue, there is a method using a solder sucking apparatus having a means for heating and melting the solder and a means for sucking the solder for sucking the molten solder.

[0011]

The above-described conventional method for repairing a semiconductor device has a problem that after the semiconductor device is separated from the substrate and the semiconductor device is removed, a solder residue is generated on the substrate. Since the solder residue on the substrate is left at room temperature and solidified, a step of removing the solder residue while heating and melting the semiconductor device after removing the semiconductor device is required, resulting in a problem that the number of work steps increases.

Further, when removing the solder residue, since the solder is removed by bringing the solder suction line or the solder suction means into contact with the solder residue, mechanical stress is applied to the electrode pads and wiring formed on the substrate. Has the disadvantage of adding
Therefore, there arises a problem that the electrode pad and the wiring are peeled off and the substrate is damaged. In particular, on a substrate on which a copper wiring having a low adhesion strength is formed, the copper wiring is extremely easily peeled, and thus the peeling is more likely to occur.

Further, there is a problem that when the solder residue is heated and melted, thermal stress is applied to the substrate, which leads to deterioration of the substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and apparatus for repairing a semiconductor device in which solder residue hardly occurs on the substrate when the semiconductor device is separated from the substrate.

It is another object of the present invention to provide a semiconductor device repair method and a repair device which can reduce the number of repair work steps.

Still another object of the present invention is to provide a repair method and a repair device for a semiconductor device which can reduce mechanical stress applied to an electrode pad and a wiring.

Still another object of the present invention is to provide a method and apparatus for repairing a semiconductor device, which can reduce thermal stress applied to a substrate.

Still another object of the present invention is to provide a semiconductor device repair method and a repair device which can prevent breakage and deterioration of a substrate.

[0019]

(1) A method for repairing a semiconductor device according to the present invention is a method for repairing a semiconductor device connected to a substrate via solder, in the method for repairing a semiconductor device at a predetermined position with respect to the substrate. The semiconductor device is separated from the substrate by heating and melting the solder while blowing the molten solder, and blowing off the melted solder by spraying a first hot gas to remove the solder.

(2) In the method for repairing a semiconductor device according to the present invention, the semiconductor device and the substrate are separated by blowing away the melted solder by jetting the first hot gas.

Therefore, when the semiconductor device is separated from the substrate, little solder residue is left on the substrate. Therefore, there is no need to provide a step of removing the solder residue while heating and melting the solder after removing the semiconductor device as in the above-described related art.
Repair work is reduced.

Further, since it is not necessary to remove the solder residue, the mechanical stress applied to the electrode pads and wirings and the thermal stress applied to the substrate can be reduced as compared with the above-mentioned conventional technology. Therefore, breakage and deterioration of the substrate can be prevented.

(3) In a preferred example of the method for repairing a semiconductor device according to the present invention, the first hot gas has a temperature equal to or higher than the melting point of the solder.

In another preferred embodiment of the method for repairing a semiconductor device according to the present invention, the first hot gas is injected between the semiconductor device and the substrate from one side of the semiconductor device.

In still another preferred example of the method for repairing a semiconductor device according to the present invention, the solder is heated and melted by injecting a second hot gas between the semiconductor device and the substrate.

In still another preferred example of the method for repairing a semiconductor device according to the present invention, by radiating thermal infrared rays,
The solder is heated and melted.

In still another preferred example of the method for repairing a semiconductor device according to the present invention, the blown-out solder is moved to a predetermined position by the flow of the first hot gas.

(4) A repair device for a semiconductor device according to the present invention is a repair device for a semiconductor device connected to a substrate via solder, comprising: holding means for holding the semiconductor device at a predetermined position with respect to the substrate. A heating means for heating and melting the solder, and a hot gas injection means for injecting a first hot gas, while holding the semiconductor device by the holding means, melting the solder by the heating means, The method is characterized in that the molten solder is blown away and removed by the first hot gas injected from the hot gas injection means, thereby separating the semiconductor device and the substrate.

(5) In the repair device for a semiconductor device according to the present invention, the molten solder is blown off and removed by the first hot gas injected from the hot gas injection means, so that the semiconductor device and the substrate can be removed. Are separated.

Therefore, as in the semiconductor device repair method of the present invention, when the semiconductor device is separated from the substrate, little solder residue is generated on the substrate. Therefore, it is not necessary to provide a step of removing the solder residue while heating and melting the solder after removing the semiconductor device as in the above-described related art, so that the number of repair work is reduced.

Further, since it is not necessary to remove the solder residue, the mechanical stress applied to the electrode pads and the wiring and the thermal stress applied to the substrate can be reduced as compared with the above-mentioned conventional technology. Therefore, breakage and deterioration of the substrate can be prevented.

(6) In a preferred example of the repair device for a semiconductor device according to the present invention, the first hot gas has a temperature equal to or higher than the melting point of the solder.

In another preferred embodiment of the repair device for a semiconductor device according to the present invention, the hot gas injection means injects the first hot gas between the semiconductor device and the substrate from one side of the semiconductor device. A first outlet to be used.

In still another preferred example of the repair device for a semiconductor device according to the present invention, the heating means has a second outlet for injecting a second hot gas between the semiconductor device and the substrate.

In still another preferred embodiment of the repair device for a semiconductor device according to the present invention, a valve body for preventing the solder blown off by the first hot gas from entering is provided near the second outlet.

In still another preferred embodiment of the semiconductor device repair device of the present invention, the heating means emits thermal infrared rays.

In still another preferred embodiment of the repair device for a semiconductor device according to the present invention, the device further comprises means for moving and accommodating the solder blown off by the flow of the first hot gas.

[0038]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

(First Embodiment) FIG. 1 shows a repair device for a semiconductor device according to a first embodiment of the present invention. FIG. 1A is a schematic plan view of a main part, and FIG.
FIG. 2 is a schematic cross-sectional view along the line A.

The repair apparatus shown in FIG. 1 includes an air nozzle 1 having two air paths 21 and 22 for injecting hot air (ie, heated air). The air nozzle 1 is composed of three substantially rectangular cylindrical members 11, 12, and 13 extending in a direction perpendicular to the surface of a base 8 on which a printed circuit board (not shown) is mounted.

The cylindrical member 11 has substantially the same inner dimensions as the outer dimensions of the semiconductor device (not shown) to be repaired.

The cylindrical member 12 has an inner dimension larger than the outer dimension of the cylindrical member 11. The tubular member 12 is arranged outside the tubular member 11 so as to be concentric with the tubular member 11.

The cylindrical member 13 is formed by four portions 13a, 13b, 13c and 13d connected in order and has an inner dimension larger than the outer dimension of the cylindrical member 12. The cylindrical member 13 is arranged so as to surround the cylindrical member 12.
2 outside.

The air path 21 is formed between the outer peripheral surface of the cylindrical member 11 and the inner peripheral surface of the cylindrical member 12. Air path 2
1 extends along the entire outer peripheral surface of the tubular member 11. The air path 21 is provided with an air supply device 4 through a heater 5.
Are connected, and hot air 31 having a predetermined flow rate and temperature is supplied.

The lower ends of the cylindrical members 11 and 12 are
Outlet 10 for injecting hot air 31 supplied to
a. The outlet 10 a extends along the entire periphery of the lower end of the tubular member 11. Four check valves 14 are provided near the outlet 10a.

The check valve 14 is, as shown in FIG.
It is supported by a rotating shaft 18 that penetrates the cylindrical member 12 so that it can be opened and closed. A helical spring 19 is attached to the rotating shaft 18, and the check valve 14 is urged by the spring 19 in the direction of arrow b1. The opening and closing operation of the check valve 14 is controlled by the pressure of the hot air 31.

That is, the hot air 31 flows through the air path 21.
6 is not supplied, the check valve 14 is closed and the outlet 10a is closed by the urging force of the spring 19, as shown in FIG. On the other hand, when the hot air 31 is supplied to the air path 21, the hot air 31
, A force opposite to the urging force of the spring 19 acts on the check valve 14. When the force exceeding the urging force of the spring 19 acts on the check valve 14, the check valve 14 opens in the direction of arrow b2 as shown in FIG. 6B, and the hot air 31 is discharged from the outlet 10a. It is injected.

When the hot air 31 is injected, the direction in which the hot air 31 flows is changed by the check valve 14, so that the hot air 31 is injected toward the inside of the cylindrical member 11. The jetted hot air 31 heats solder (not shown) connecting the semiconductor device and the printed circuit board.
Used to melt.

The air path 22 is formed by the portion 13a of the cylindrical member 13.
Are formed between the inner surface of the cylindrical member 12 and the outer surface of the tubular member 12. The air path 22 extends along the entire inner surface of the portion 13 a of the tubular member 13. The air supply 22 is connected to the air path 22 via the heater 7, and hot air 32 having a predetermined flow rate and temperature is supplied.

The lower end of the portion forming the air path 22 of the cylindrical member 12 and the lower end of the portion 13a of the cylindrical member 13
Outlet 1 for injecting hot air 32 supplied to 2
0b. The outlet 10b is connected to the cylindrical member 13
Extend along the lower end of the portion 13a. The hot air 32 injected from the outlet 10b is hot air 3
1 to blow away the molten solder.

The lower end of the cylindrical member 13 projects downward with respect to the lower ends of the cylindrical members 11 and 12. The height h from the lower end of the cylindrical member 13 to the lower ends of the cylindrical members 11 and 12 is set to be substantially the same as the distance between the semiconductor device to be repaired and the printed circuit board.

The air nozzle 1 is supported by an air nozzle vertical movement mechanism (not shown), and is movable in the direction of arrow a1.

Inside the cylindrical member 11 of the air nozzle 1, a suction nozzle 2 having a through hole 23 is arranged.
The air suction device 3 is connected to the through hole 23.

The suction nozzle 2 is used to hold the semiconductor device to be repaired at a predetermined position. That is,
While the bottom 2a of the suction nozzle 2 is in contact with the upper surface of the semiconductor device to be repaired, the air inside the through-hole 23 is sucked by the air suction device 3 to thereby form the bottom 2a of the suction nozzle 2.
The semiconductor device is sucked. The adsorbed semiconductor device is
It is held at a predetermined position by the suction nozzle 2.

The suction nozzle 2 is supported by a suction nozzle vertical movement mechanism (not shown), and is movable in the direction of arrow a2.

Outside the cylindrical member 13 of the air nozzle 1, there is provided a solder accommodating portion 9 for accommodating the solder (not shown) blown off by the hot air 31. The solder container 9 has a main body 15 in which an internal space 24 having a substantially inverted J-shaped cross section is formed.

The main body 15 of the solder container 9 is
And has a hot air outlet 15a and a solder outlet 15b. A filter 16 through which hot air 32 can pass is provided at the hot air outlet 15a. Solder outlet 1
5b is provided with a lid 17 for taking out the contained solder.

Next, a repair method using the repair device of FIG. 1 will be described.

FIGS. 2, 3, 4 and 5 are schematic sectional views showing the operation of the repair device of FIG.

First, as shown in FIG. 2, the printed circuit board 42 is placed and fixed at a predetermined position on the base 8. An electrode pad 43 and a wiring (not shown) are formed on the surface of the printed board 42, and a solder 44 is attached to the electrode pad 43.
Is connected to the semiconductor device 41 to be repaired. A gap 25 is formed between the semiconductor device 41 and the printed board 42.

Next, the air nozzle 1 is moved downward until the tip of the air nozzle 1 (that is, the lower end of the cylindrical member 13) contacts the surface of the printed circuit board 42, and the semiconductor device 41 is placed inside the cylindrical member 11 of the air nozzle 1. Insert At this time, the gap 2 between the semiconductor device 41 and the printed circuit board 42
5 is surrounded by the cylindrical member 13 of the air nozzle 1 and
It communicates with the air path 22 of the air nozzle 1 and the internal space 24 of the solder container 9.

Subsequently, the suction nozzle 2 is moved downward until the bottom 2 a of the suction nozzle 2 contacts the upper surface of the semiconductor device 41, and then the through-hole 26 of the suction nozzle 2 is moved by the air suction device 3.
The semiconductor device 41 is sucked by the suction nozzle 2 by sucking the inside of the device. Thus, the position of the semiconductor device 41 is maintained. The state at this time is as shown in FIG.

Next, as shown in FIG. 3, the air supply device 4 and the heater 5 are operated to operate the air path 2 of the air nozzle 1.
1 is supplied with hot air 31. The check valve 14 is opened by the pressure of the supplied hot air 31, and the hot air 31
Is ejected from the outlet 10 a of the air nozzle 1.

As described above, the outlet 10a extends along the entire circumference of the lower end of the cylindrical member 11 into which the semiconductor device 41 is inserted. Hot air 31 is jetted toward gap 25 between printed circuit board 42. Furthermore, since the gap 25 is surrounded by the cylindrical member 13, the temperature inside the gap 25 from which the hot air 31 has been injected sharply rises. As a result, the solder 44 is efficiently heated and melted.

At this time, the position of the semiconductor device 41 is held by the suction nozzle 2. Therefore, even if the solder 44 is melted, the gap 25 between the semiconductor device 41 and the printed circuit board 42 is reduced.
Is secured.

The temperature and flow rate of the hot air 31 to be sprayed are set so that the solder 44 can be easily melted.

Subsequently, as shown in FIG.
The supply of hot air 31 to the air path 21 of the air nozzle 1 is stopped by stopping the operation of the heater 5 and the hot air 32 is supplied to the air path 22 of the air nozzle 1 by operating the air supply device 6 and the heater 7. I do. The hot air 32 supplied to the air path 22 is
It is injected from the outlet 10b of the air nozzle 1.

As described above, the outlet 10b extends along the lower end of the portion 13a of the tubular member 13. Therefore, the semiconductor device 41 is
The hot air 32 is jetted toward the gap 25 between the substrate and the printed board 42. Further, the gap 25 is formed in the cylindrical member 13.
, And communicates with the air path 22 and the internal space 24 of the solder accommodating portion 9. Therefore, as shown in FIG. 4, the hot air 32 injected from the outlet 10b
Is introduced into the internal space 24 of the solder container 9 through the gap 25 and is discharged from the hot air outlet 15 a of the solder container 9. By forming such a path of the hot air 32, the hot air 32 does not stay in the gap 25, and convection of the hot air 32 is prevented.

When the hot air 32 passes through the gap 25,
The melted solder 44 is blown off and removed. Thus, the semiconductor device 41 connected to the printed board 42 via the solder 44 is separated from the printed board 42 while being held at a predetermined position by the suction nozzle 2.

The blown solder 44 moves as indicated by an arrow 33 in FIG. 4 according to the flow of the hot air 32 and passes through the internal space 24 of the solder accommodating section 9 toward the hot air discharge port 15a. The solder 4 whose discharge from the hot air discharge port 15a is prevented by the filter 16
4 is deposited on the lid 17 of the solder container 9. Thus, the solder 44 accumulates inside the solder accommodating portion 9.

The temperature of the hot air 32 injected from the outlet 10 b of the air nozzle 1 is set to be equal to or higher than the melting point of the solder 44. For example, when SnPb eutectic solder is used for the solder 44, the temperature is set to 183 ° C. or higher,
When SnAgCu-based lead-free solder is used, the temperature is set to 220 ° C. or higher. Thereby, without solidifying the solder 44 melted by the injection of the hot air 31,
The hot air 32 can be easily blown off.

The flow rate of the hot air 32 is set to such an extent that the solder 44 in the molten state can be easily blown off.

As described above, when the hot air 32 is supplied to the air path 22 of the air nozzle 1, the supply of the hot air 31 is stopped, the check valve 14 is closed, and the outlet 10a of the air nozzle 1 is closed. Have been. Therefore, the hot air 32 injected from the outlet 1 b of the air nozzle 1 does not flow into the air path 21 of the air nozzle 1. Further, the solder 44 blown off by the hot air 32 does not enter the air path 21 of the air nozzle 1.

Next, as shown in FIG. 5, when the solder 44 is almost completely removed, the operation of the air supply device 6 and the heater 7 is stopped, and the supply of the hot air 32 to the air path 22 is stopped. . Then, the semiconductor device 4 is sucked by the suction nozzle 2.
The semiconductor device 41 is removed from the printed circuit board 42 by moving the suction nozzle 2 upward while holding the device 1.

The solder 44 accumulated in the solder housing 9 is taken out by opening the lid 17 of the solder housing 9 at any time.

After the semiconductor device 41 is removed in this way, the replacement semiconductor device is mounted on the printed circuit board 42 using the repair device of FIG.

That is, after a cream solder is applied on the electrode pads 43 of the printed circuit board 42 by screen printing or the like, an alternative semiconductor device is mounted on the printed circuit board 42. Then, by injecting hot air 31 from the outlet 10a of the air nozzle 1, the cream solder is heated and melted to replace the alternative semiconductor device with the printed circuit board 42.
Connect to

As described above, in the semiconductor device repair apparatus and the repair method according to the first embodiment of the present invention, while the semiconductor device 41 is held at a predetermined position by the suction nozzle 2, the outlet of the air nozzle 1 is opened. The hot air 31 is injected from 10a, and the semiconductor device 41 and the printed circuit board 4 are injected.
Immediately after heating and melting the solder 44 connecting the hot air 3 and the hot air 3 through the outlet 10 b of the air nozzle 1.
2 is blown to blow off the solder 44 in the molten state. Thus, the molten solder 44 is removed without solidifying, and the semiconductor device 41 and the printed circuit board 42 are separated.

Therefore, when the semiconductor device 41 and the printed board 42 are separated, little solder residue is generated on the printed board 42. Therefore, it is not necessary to provide a step of removing the solder residue while heating and melting the solder after removing the semiconductor device as in the above-described related art, so that the number of repair work is reduced.

Further, since it is not necessary to remove the solder residue, it is possible to reduce the mechanical stress applied to the electrode pads 43 and the wiring of the printed circuit board 42 and the thermal stress applied to the substrate, as compared with the above-described conventional technology. it can. Therefore, breakage and deterioration of the substrate can be prevented.

Further, the solder 44 blown off by the hot air 32 is moved to and accommodated in the solder accommodating portion 9. Therefore, it is possible to prevent the blown solder 44 from adhering to the printed circuit board 42.

(Second Embodiment) FIG. 7 is a schematic sectional view showing a main part of a repair device according to a second embodiment of the present invention. FIG. 7 also shows a printed circuit board 42 to which the semiconductor device 41 to be repaired is connected.

The repair device shown in FIG. 7 uses an air nozzle 1A in which the air path 22 is not formed, omits the air supply device 4 and the heater 5, and uses an infrared heater 51 as a means for heating and melting the solder 44. It differs from the repair device of the first embodiment in that it is used. The rest of the configuration is the same as that of the repair device of the first embodiment. Therefore, in FIG. 7, the same or corresponding components in FIG. 7 are denoted by the same reference numerals as in FIG. 1, and the description of the same components will be omitted.

In the repair device shown in FIG. 7, the air nozzle 1A is composed of cylindrical members 11 and 13. And the cylindrical member 11
An air path 22 is formed between the outer surface of the cylindrical member 13 and the inner surface of the cylindrical member 13. A lower end of each of the cylindrical members 11 and 13 has an outlet 10 b for injecting the hot air 32 supplied to the air path 22.
Is formed.

At the upper end of the cylindrical member 11 of the air nozzle 1A,
An infrared heater 51 is provided. Infrared heater 51
Radiates heat to the inside of the cylindrical member 11 of the air nozzle 1A.

In the repair device shown in FIG.
Heat radiated from the semiconductor device 41 through the solder 44
And the solder 44 is heated and melted. Then, similarly to the first embodiment, the outlet 10 of the air nozzle 1A
The melted solder 44 is blown off and removed by the hot air 32 injected from b.

In the second embodiment of the present invention, the same effects as in the first embodiment can be obtained.

That is, when the semiconductor device 41 and the printed circuit board 42 are separated, little solder residue is generated on the printed circuit board 42. Therefore, the number of repair man-hours is reduced.

The electrode pads 43 on the printed circuit board 42
Stress on wiring and wiring, and printed circuit board 4
2 can be reduced. Therefore, breakage and deterioration of the printed circuit board 42 can be prevented.

Further, the structure of the air nozzle 1A is simpler than that of the repair device of the first embodiment, and
Further, since the heater 5 is not required, the configuration of the repair device as a whole can be simplified.

(Modifications) The first and second embodiments show preferred examples of the present invention. The present invention is not limited to these embodiments, and it goes without saying that various modifications are possible.

For example, in the first and second embodiments, a heating means disposed below the base 8 can be added, and a mechanism for suppressing the warpage of the substrate 42 can be added.

Further, instead of the hot air 31, 32,
Of course, it is also possible to use a heated inert gas such as nitrogen.

In the first embodiment, the opening / closing operation of the check valve 14 is controlled by the pressing force of the hot air 31. For example, the opening / closing operation of the check valve 14 is controlled by an electric control mechanism using a solenoid and a sensor. The opening and closing operation of the stop valve 14 may be controlled.

[0095]

As described above, according to the method and apparatus for repairing a semiconductor device of the present invention, when the semiconductor device is separated from the substrate, little solder residue is generated on the substrate. Therefore, the number of repair man-hours is reduced.

Further, the mechanical stress applied to the electrode pads and wirings and the thermal stress applied to the substrate can be reduced. Therefore, breakage and deterioration of the substrate can be prevented.

[Brief description of the drawings]

FIG. 1A is a schematic plan view of a main part of a repair device according to a first embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view of the main part along line AA.

FIG. 2 is a schematic cross-sectional view of a main part showing an operation of the repair device according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a main part showing an operation of the repair device according to the first embodiment of the present invention, which is a continuation of FIG. 2;

FIG. 4 is a schematic cross-sectional view of a main part showing an operation of the repair device of the first embodiment of the present invention, which is a continuation of FIG.

FIG. 5 is a schematic cross-sectional view of a main part showing an operation of the repair device of the first embodiment of the present invention, which is a continuation of FIG. 4;

6 (a) is a partially enlarged cross-sectional view of FIG. 1 (b) showing a state where the check valve is closed in the repair device according to the first embodiment of the present invention, and FIG. 6 (b) is a state where the check valve is open FIG. 1 (b) showing
It is the elements on larger scale sectional view.

FIG. 7 is a schematic sectional view of a main part showing a repair device according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1A Air nozzle 2 Suction nozzle 2a Bottom of suction nozzle 3 Air suction unit 4, 6 Air supply unit 5, 7 Heater 8 Base 9 Solder storage unit 10a, 10b Hot air outlet 11, 12, 13 Air nozzle tube member 13a The first part 13b of the cylindrical member 13b The second part 13c of the cylindrical member 13c The third part 13d of the cylindrical member 13d The fourth part of the cylindrical member 13 The check valve 15 The main body of the solder accommodating part 15a The outlet of hot air 15b Take-out port 16 Filter 17 Lid 18 Rotating shaft 19 Hanging spring 21, 22 Air path 23 Through-hole of suction nozzle 24 Internal space of solder storage part 25 Gap between semiconductor device and printed board 31, 32 Hot air 33 Solder movement path 41 Semiconductor device 42 Printed circuit board 43 Electrode pad 44 Solder 51 Infrared heater

Claims (13)

[Claims] 1. A method of repairing a semiconductor device connected to a substrate via solder, wherein the solder is heated and melted while holding the semiconductor device at a predetermined position with respect to the substrate. A method for repairing a semiconductor device, wherein the semiconductor device is separated from the substrate by blowing off and removing the solder by spraying a first hot gas. 2. The method according to claim 1, wherein the first hot gas has a temperature equal to or higher than a melting point of the solder. 3. The repair method for a semiconductor device according to claim 1, wherein the first hot gas is injected between the semiconductor device and the substrate from one side surface of the semiconductor device. 4. A second device between the semiconductor device and the substrate.
The method for repairing a semiconductor device according to claim 1, wherein the solder is heated and melted by injecting a hot gas. 5. The semiconductor device repair method according to claim 1, wherein the solder is heated and melted by radiating thermal infrared rays. 6. The blown solder is moved to a predetermined position by the flow of the first hot gas.
6. The method for repairing a semiconductor device according to any one of items 1 to 5. 7. A repair device for a semiconductor device connected to a substrate via solder, wherein the holding device holds the semiconductor device at a predetermined position with respect to the substrate, and the heating device heats and melts the solder. And a hot gas injecting means for injecting a first hot gas, wherein the solder is melted by the heating means while the semiconductor device is held by the holding means, and the molten solder is discharged from the hot gas injecting means. A semiconductor device repair apparatus, characterized in that the semiconductor device and the substrate are separated by blowing away the first hot gas to be blown away. 8. The repair device according to claim 7, wherein the first hot gas has a temperature equal to or higher than a melting point of the solder. 9. The semiconductor device according to claim 7, wherein said hot gas injection means has a first outlet for injecting said first hot gas from between said semiconductor device and said substrate from one side of said semiconductor device.
Or a repair device for a semiconductor device according to item 8. 10. The repair device for a semiconductor device according to claim 7, wherein said heating means has a second outlet for injecting a second hot gas between said semiconductor device and said substrate. 11. The repair device for a semiconductor device according to claim 10, wherein a valve body for preventing the solder blown off by the first hot gas from entering is provided near the second outlet. 12. The repair device for a semiconductor device according to claim 7, wherein said heating means emits thermal infrared rays. 13. The repair device for a semiconductor device according to claim 7, further comprising: means for moving and accommodating the solder blown off by the flow of the first hot gas.