JPH0215978A - Grinding tool - Google Patents
Grinding toolInfo
- Publication number
- JPH0215978A JPH0215978A JP63164683A JP16468388A JPH0215978A JP H0215978 A JPH0215978 A JP H0215978A JP 63164683 A JP63164683 A JP 63164683A JP 16468388 A JP16468388 A JP 16468388A JP H0215978 A JPH0215978 A JP H0215978A
- Authority
- JP
- Japan
- Prior art keywords
- phosphorus
- abrasive particles
- plating
- grinding
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 15
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 239000011574 phosphorus Substances 0.000 claims abstract description 7
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 6
- 239000010432 diamond Substances 0.000 claims abstract description 6
- SIBIBHIFKSKVRR-UHFFFAOYSA-N phosphanylidynecobalt Chemical compound [Co]#P SIBIBHIFKSKVRR-UHFFFAOYSA-N 0.000 claims abstract description 3
- IGOJDKCIHXGPTI-UHFFFAOYSA-N [P].[Co].[Ni] Chemical compound [P].[Co].[Ni] IGOJDKCIHXGPTI-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000006061 abrasive grain Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 3
- 229910001096 P alloy Inorganic materials 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 229910052759 nickel Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
Landscapes
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は金属、セラミックス等の硬質材料を高速度かつ
高精度で研磨、切断等の加工を行なう際に使用する研削
工具龜簡子るものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention is a grinding tool used when processing hard materials such as metals and ceramics at high speed and with high precision, such as cutting. It is.
（従来の技術および課題）
硬質材料の研磨、切断等の加工に用いる研削工具の中で
砥石を電着金属によって固定した電着砥石がよく知られ
、いろいろな形状の研削工具として実用化されているり
電着金属としてはニッケルあるいは銅がよく知られ、各
種の改善により作業性の良い砥石が得られるようになっ
た。しかし、元来、この方式の砥石は砥粒層がほぼ一層
しかないので長時間良好な研削性能を有しておらず、近
年、超硬合金、セラミックス等の硬質材料の適用分野が
増し、このような材料を更に高能率で研磨、切断等の加
工のｔきる研削工具が要請されている。(Conventional technology and issues) Among the grinding tools used for processing hard materials such as polishing and cutting, electrocoated grindstones, in which the grindstone is fixed with electrocoated metal, are well known and have been put into practical use as grinding tools of various shapes. Nickel and copper are well known as electroplated metals, and various improvements have made it possible to obtain grindstones with good workability. However, this type of grindstone originally has only one layer of abrasive grains, so it does not have good grinding performance for a long time.In recent years, the field of application of hard materials such as cemented carbide and ceramics has increased, and this There is a need for a grinding tool that can grind, cut, and process such materials with even higher efficiency.
（課題を解決するための手段）
本発明は従来の電着砥石が有する上記問題点を解決し、
研削速度が大゛きく、かつ長寿命の研削工具を提供する
ためのものである。(Means for Solving the Problems) The present invention solves the above-mentioned problems of conventional electrodeposited grindstones,
The object is to provide a grinding tool with a high grinding speed and a long life.
本発明の研削工具は、円筒、帯、板状の金属基板にまず
、公知の方法例えば複合めっき法によりニッケル、銅等
のめっき金属中に５ｉＣＳＣＢＮ、ダイヤモンド等の砥
粒を分散、結着させる。次いでこのめっき金属の表面を
ニッケル−リン、コバルト−リン等のリンを５〜１５％
含有する合金めっきで被覆し、砥粒を固定したものであ
る。逆にニッケル−リンと砥粒との複合めっきを行った
後、ニッケル、銅等のめっきで表面を被・覆してもよい
し、金属めっき層全体がリンを５〜１５％含有する合金
めっき層のみであってもよい。In the grinding tool of the present invention, abrasive grains such as 5iCSCBN or diamond are first dispersed and bound in a plated metal such as nickel or copper by a known method such as a composite plating method on a cylindrical, band, or plate-shaped metal substrate. Next, the surface of this plated metal is coated with 5 to 15% phosphorus such as nickel-phosphorus or cobalt-phosphorus.
It is coated with alloy plating containing abrasive grains. Conversely, after performing composite plating of nickel-phosphorus and abrasive grains, the surface may be coated with nickel, copper, etc., or an alloy plating layer in which the entire metal plating layer contains 5 to 15% phosphorus. It may be only.
砥粒を固定するめっき金属層の厚さは使用する砥粒の粒
径によって異なるが、砥粒平均粒径の５０〜１５０％の
厚さが適当で特に砥粒平均粒径の７０〜１２０％の厚さ
で良好な研削性能を示す。５０％以下の厚さでは砥粒の
保持力が小さいため、砥粒が脱落しやすい。又１５０％
を超えるとめっき金属で埋込まれる砥粒が多くなり、研
削能力が低下する。The thickness of the plating metal layer that fixes the abrasive grains varies depending on the grain size of the abrasive grains used, but a thickness of 50 to 150% of the average grain size of the abrasive grains is appropriate, particularly 70 to 120% of the average grain size of the abrasive grains. Shows good grinding performance at thicknesses of . If the thickness is less than 50%, the holding power of the abrasive grains is small, so the abrasive grains are likely to fall off. Also 150%
If it exceeds , more abrasive grains will be embedded in the plated metal, reducing the grinding ability.
ニッケル−リン合金めっきは電気めっき、無電解めっき
のいづれのめっき法でも形成でき、従来の電気めっきに
よるニッケル又は銅めっきに比べ、高硬度で平滑なめっ
き皮膜ができるという特長があり、この合金めっきで砥
粒を固定することにより、砥粒保持力が強くなり、研削
時の砥粒の脱落が減少する。Nickel-phosphorus alloy plating can be formed using either electroplating or electroless plating, and has the advantage of producing a harder and smoother plating film than conventional nickel or copper plating using electroplating. By fixing the abrasive grains, the abrasive grain holding power becomes stronger and the dropout of the abrasive grains during grinding is reduced.
そのため研削速度が向上すると同時に研削能力の劣化も
少なくなり、長寿命の研削工具が得られるという効果が
ある。Therefore, the grinding speed is improved and at the same time deterioration of the grinding ability is reduced, resulting in a long-life grinding tool.
ニッケル−リン合金めっき中のリン含有量が５〜１５％
の範囲ではめっき状態で非晶質となり、高硬度の皮膜が
得られる。Phosphorus content in nickel-phosphorus alloy plating is 5-15%
In the range of , the plating state becomes amorphous and a highly hard coating can be obtained.
従ってリンが５％以下では硬度は非常に低くなり砥石の
性能向上は期待できない。Therefore, if the phosphorus content is less than 5%, the hardness will be extremely low and no improvement in the performance of the grindstone can be expected.
このリンを５〜１５％含有する合金めっき層の厚さが大
になる程研削能力は向上するが、めっき金属層の全厚さ
の１０％以下の厚さではニッケル−リン合金の特徴が出
す、ニッケル、銅等の電着砥石と変わらない。従ってニ
ッケル−リン合金めっき層のめっき厚さは全めっき厚さ
の１０％以上が必要である。又ニッケル−リン合金めっ
きは、めっき後３００〜４００℃に加熱することにより
Ｈｖ＝ ８００〜１０００まで硬度が上昇する特性を有
しており、めっきによって砥粒を固定した後、３００〜
４００℃に加熱することにより更に砥粒の保持力を向上
させることも可能である。The grinding ability improves as the thickness of the alloy plating layer containing 5 to 15% phosphorus increases, but when the thickness is less than 10% of the total thickness of the plating metal layer, the characteristics of a nickel-phosphorus alloy appear. , nickel, copper, etc. are the same as electrodeposited grindstones. Therefore, the plating thickness of the nickel-phosphorous alloy plating layer needs to be 10% or more of the total plating thickness. Nickel-phosphorus alloy plating has the property that its hardness increases to Hv=800-1000 by heating it to 300-400℃ after plating, and after fixing the abrasive grains by plating, the hardness increases to Hv=300-1000.
It is also possible to further improve the holding power of the abrasive grains by heating to 400°C.
（実施例１）
以下、本発明研削工具の１実施例を図面に基づいて説明
する。第１図に示すように軟鋼製の基板（ｌ）（直径５
抛−φ、幅１０ＲＩ１１）の円周上に全周に亘って、無
電解ニッケル−リン中に平均粒径が２５μｍの砥粒（２
）（ＳｉＣおよびダイヤモンド）を分散させた複合めっ
き層を形成した。ニッケル−リンめっき層（３）のめっ
き厚さは５μｍで、ＳｉＣおよびダイヤモンド粒子のめ
っき液中への添加量は３０ｇ／ｌであった０次にこのめ
っき層の表面を無電解ニッケル−リンめっきにより、各
種厚さの上部めっき層（４）を形成して本発明の研削工
具を構成する。(Example 1) Hereinafter, one example of the grinding tool of the present invention will be described based on the drawings. As shown in Figure 1, a mild steel substrate (l) (diameter 5
Abrasive grains with an average particle diameter of 25 μm (2
) (SiC and diamond) was dispersed therein to form a composite plating layer. The plating thickness of the nickel-phosphorus plating layer (3) was 5 μm, and the amount of SiC and diamond particles added to the plating solution was 30 g/l. Next, the surface of this plating layer was electroless nickel-phosphorus plated. By forming the upper plating layer (4) of various thicknesses, the grinding tool of the present invention is constructed.
又比較例として、電気めっきによる各種厚さの銅および
ニッケルめっきを施した研削工具を用いた。As a comparative example, grinding tools electroplated with various thicknesses of copper and nickel were used.
これらのめっき条件を次表に示す。These plating conditions are shown in the table below.
得られた円筒状砥石を第２図に示すようにガラス（６）
に２ｋｇの力で押付はノズル（７）から研削液を供給し
ながらガラスを往復させると同時に砥石を回転させるこ
とにより砥粒固定層（５）をガラスと摺動させ２．００
０往復後のガラスの重量減を研削量とした。摺動長は３
２ａ＋ｓ、摺動速度は６０往復／■ｉｎであった。めっ
きによる砥粒固定状況を次式の砥粒埋込率で表わし、研
削量との関係を求めた。その結果を第３図（イ）（ロ）
に示す。The obtained cylindrical grindstone is heated to a glass (6) as shown in Figure 2.
Pressing with a force of 2 kg is performed by reciprocating the glass while supplying grinding fluid from the nozzle (7) and at the same time rotating the grindstone to slide the abrasive grain fixed layer (5) against the glass.
The weight loss of the glass after 0 reciprocations was defined as the amount of grinding. Sliding length is 3
2a+s, and the sliding speed was 60 reciprocations/inch. The state of abrasive grain fixation by plating was expressed by the abrasive grain embedding ratio of the following formula, and the relationship with the amount of grinding was determined. The results are shown in Figure 3 (a) and (b).
Shown below.
ニッケル−リンめっきで砥粒を固定した場合研削量は砥
粒埋込率によって異なるがその最大値はＳｉＣ、ダイヤ
モンドのいづれの砥粒においても銅およびニッケルめっ
きの１．９〜３倍の研削量が得られた。When abrasive grains are fixed with nickel-phosphorus plating, the amount of grinding varies depending on the abrasive grain embedding ratio, but the maximum value is 1.9 to 3 times as much as copper and nickel plating for both SiC and diamond abrasive grains. was gotten.
（実施例２）
実施例１と同様の基材を用い、電気ニッケルめっき浴に
粒径２５μｍのＳｉＣを３０ｇ／ １２添加してニッケ
ルめっき層の厚さが１０μｍの複合めっきを行った０次
いでこのめっき層の表面を更に厚さ１０μｍの無電解ニ
ッケル−リンめっきで被覆した後研削試験を行った。２
．０００往復後の研削量は２１０ｍｇであった。なおめ
っき条件、研削方法は実施例１と同様である。(Example 2) Using the same base material as in Example 1, 30 g/12 of SiC with a particle size of 25 μm was added to the electrolytic nickel plating bath to perform composite plating with a nickel plating layer thickness of 10 μm. After the surface of the plating layer was further coated with electroless nickel-phosphorus plating with a thickness of 10 μm, a grinding test was conducted. 2
．． The amount of grinding after 000 reciprocations was 210 mg. Note that the plating conditions and grinding method are the same as in Example 1.
上記のように本発明の研削工具は従来の電着によるニッ
ケルあるいは銅で砥粒を固定した場合にくらべ研削速度
の大きい高能率の研削工具が得られる。As described above, the grinding tool of the present invention provides a highly efficient grinding tool with a higher grinding speed than the conventional case in which abrasive grains are fixed with nickel or copper by electrodeposition.
（発明の効果）
本発明の研削工具は砥粒を固定するめっき金属層の全厚
さの１０％以上の部分を高硬度で平滑な被膜の得られる
ニッケル−リン合金で被覆することにより、砥粒保持力
が向上し、砥粒の脱落が少ない研削工具が得られる。そ
のためニッケルあるいは銅で砥粒を固定した砥石にくら
゛べ研削速度が向上すると同時に寿命の長い研削工具を
得ることができるという優れた効果を有する発明である
。(Effects of the Invention) The grinding tool of the present invention is capable of sharpening abrasive particles by coating 10% or more of the total thickness of the plated metal layer that fixes the abrasive grains with a nickel-phosphorus alloy that provides a highly hard and smooth coating. A grinding tool with improved grain retention and less dropout of abrasive grains can be obtained. Therefore, this invention has the excellent effect of improving the grinding speed compared to a grindstone with abrasive grains fixed with nickel or copper, and at the same time, making it possible to obtain a grinding tool with a long life.
第１図は本発明の研削工具の実施例を示す要部断面図、
第２図は研削工具の研削試験を示す説明図、第３図＜４
）（！Ｉ）は各々研削量と砥粒埋込率の関係を示す曲線
図である。FIG. 1 is a sectional view of main parts showing an embodiment of the grinding tool of the present invention,
Figure 2 is an explanatory diagram showing the grinding test of the grinding tool, Figure 3 <4
)(!I) is a curve diagram showing the relationship between the amount of grinding and the abrasive grain embedding ratio.
Claims (1)
表面にＳｉＣ、ＣＢＮ、ダイヤモンド等の砥粒を固定し
た研削工具において、砥粒をめっき金属で固定し、全め
っき厚さが砥粒平均粒径の５０〜１５０％であり、かつ
全めっき厚さの１０％以上の部分はニッケル−リン、コ
バルト−リン、ニッケル−コバルト−リン等のリンを５
〜１５％含有する合金めっき層からなることを特徴とす
る研削工具。In grinding tools, the abrasive grains of SiC, CBN, diamond, etc. are fixed to the surface of a substrate formed by forming metal into a band, plate, cylinder, rod shape, etc., and the abrasive grains are fixed with plating metal, so that the total plating thickness is The portion that is 50 to 150% of the average particle diameter of the abrasive grains and 10% or more of the total plating thickness is coated with phosphorus such as nickel-phosphorus, cobalt-phosphorus, nickel-cobalt-phosphorus, etc.
A grinding tool comprising an alloy plating layer containing ~15%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164683A JPH0215978A (en) | 1988-06-30 | 1988-06-30 | Grinding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164683A JPH0215978A (en) | 1988-06-30 | 1988-06-30 | Grinding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215978A true JPH0215978A (en) | 1990-01-19 |
Family
ID=15797871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63164683A Pending JPH0215978A (en) | 1988-06-30 | 1988-06-30 | Grinding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215978A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551205U (en) * | 1991-12-26 | 1993-07-09 | 有限会社三河産業 | Adhesive metal sheet for polishing and grinding nails or keratin |
| JP2001054872A (en) * | 1999-08-19 | 2001-02-27 | Nikon Corp | Cylindrical surface polishing grinding wheel |
| JP2013517161A (en) * | 2010-01-20 | 2013-05-16 | デートワイラー・スイステック・アーゲー | Doctor blade |
| CN107214632A (en) * | 2017-06-15 | 2017-09-29 | 泉州众志金刚石工具有限公司 | A kind of artificial stone metal Bradley material |
-
1988
- 1988-06-30 JP JP63164683A patent/JPH0215978A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551205U (en) * | 1991-12-26 | 1993-07-09 | 有限会社三河産業 | Adhesive metal sheet for polishing and grinding nails or keratin |
| JP2001054872A (en) * | 1999-08-19 | 2001-02-27 | Nikon Corp | Cylindrical surface polishing grinding wheel |
| JP2013517161A (en) * | 2010-01-20 | 2013-05-16 | デートワイラー・スイステック・アーゲー | Doctor blade |
| US9132687B2 (en) | 2010-01-20 | 2015-09-15 | Daetwyler Swisstec Ag | Doctor blade |
| CN107214632A (en) * | 2017-06-15 | 2017-09-29 | 泉州众志金刚石工具有限公司 | A kind of artificial stone metal Bradley material |
| CN107214632B (en) * | 2017-06-15 | 2019-12-10 | 泉州众志金刚石工具有限公司 | Artificial stone metal cloth-pulling material |
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