JP6694162B2 - ハロゲン含有カルボン酸アミド基を有する加水分解性シランを含むリソグラフィー用レジスト下層膜形成組成物 - Google Patents
ハロゲン含有カルボン酸アミド基を有する加水分解性シランを含むリソグラフィー用レジスト下層膜形成組成物 Download PDFInfo
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- JP6694162B2 JP6694162B2 JP2016563655A JP2016563655A JP6694162B2 JP 6694162 B2 JP6694162 B2 JP 6694162B2 JP 2016563655 A JP2016563655 A JP 2016563655A JP 2016563655 A JP2016563655 A JP 2016563655A JP 6694162 B2 JP6694162 B2 JP 6694162B2
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- HHDLJTLPOGOXLR-UHFFFAOYSA-N propan-2-ylphosphane Chemical compound CC(C)P HHDLJTLPOGOXLR-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- JCMFJIHDWDKYIL-UHFFFAOYSA-N propyl 3-methoxypropanoate Chemical compound CCCOC(=O)CCOC JCMFJIHDWDKYIL-UHFFFAOYSA-N 0.000 description 1
- NSFXUCGTDFXHRK-UHFFFAOYSA-N propyl 3-oxohexaneperoxoate;titanium Chemical compound [Ti].CCCOOC(=O)CC(=O)CCC.CCCOOC(=O)CC(=O)CCC NSFXUCGTDFXHRK-UHFFFAOYSA-N 0.000 description 1
- HUAZGNHGCJGYNP-UHFFFAOYSA-N propyl butyrate Chemical compound CCCOC(=O)CCC HUAZGNHGCJGYNP-UHFFFAOYSA-N 0.000 description 1
- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- NNOBHPBYUHDMQF-UHFFFAOYSA-N propylphosphine Chemical compound CCCP NNOBHPBYUHDMQF-UHFFFAOYSA-N 0.000 description 1
- ZDYVRSLAEXCVBX-UHFFFAOYSA-N pyridinium p-toluenesulfonate Chemical compound C1=CC=[NH+]C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 ZDYVRSLAEXCVBX-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
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- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 239000001589 sorbitan tristearate Substances 0.000 description 1
- 235000011078 sorbitan tristearate Nutrition 0.000 description 1
- 229960004129 sorbitan tristearate Drugs 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 125000000565 sulfonamide group Chemical group 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- NVQCTSGVFRPZCZ-UHFFFAOYSA-N tert-butyl 3-oxohexaneperoxoate;zirconium Chemical compound [Zr].CCCC(=O)CC(=O)OOC(C)(C)C.CCCC(=O)CC(=O)OOC(C)(C)C NVQCTSGVFRPZCZ-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- BRGJIIMZXMWMCC-UHFFFAOYSA-N tetradecan-2-ol Chemical compound CCCCCCCCCCCCC(C)O BRGJIIMZXMWMCC-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical compound C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- MRYQZMHVZZSQRT-UHFFFAOYSA-M tetramethylazanium;acetate Chemical compound CC([O-])=O.C[N+](C)(C)C MRYQZMHVZZSQRT-UHFFFAOYSA-M 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
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- FQYWWLSIKWDAEC-UHFFFAOYSA-N tributoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)CCCOCC1CO1 FQYWWLSIKWDAEC-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
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- QDGORAVIRGNDBW-UHFFFAOYSA-N trichloro-(2-ethoxyphenyl)silane Chemical compound CCOC1=CC=CC=C1[Si](Cl)(Cl)Cl QDGORAVIRGNDBW-UHFFFAOYSA-N 0.000 description 1
- PUOCWUHEMWGXIQ-UHFFFAOYSA-N trichloro-(2-methoxy-2-phenylethyl)silane Chemical compound COC(C[Si](Cl)(Cl)Cl)C1=CC=CC=C1 PUOCWUHEMWGXIQ-UHFFFAOYSA-N 0.000 description 1
- WZLYTTRTHVZCNU-UHFFFAOYSA-N trichloro-(2-methoxynaphthalen-1-yl)silane Chemical compound C1=CC=CC2=C([Si](Cl)(Cl)Cl)C(OC)=CC=C21 WZLYTTRTHVZCNU-UHFFFAOYSA-N 0.000 description 1
- YTWFIHFZPSAMFV-UHFFFAOYSA-N trichloro-(2-methoxyphenyl)silane Chemical compound COC1=CC=CC=C1[Si](Cl)(Cl)Cl YTWFIHFZPSAMFV-UHFFFAOYSA-N 0.000 description 1
- SBNVEGJDYHYOSA-UHFFFAOYSA-N trichloro-(2-propan-2-yloxyphenyl)silane Chemical compound CC(C)OC1=CC=CC=C1[Si](Cl)(Cl)Cl SBNVEGJDYHYOSA-UHFFFAOYSA-N 0.000 description 1
- OUMAYXXJSADQBQ-UHFFFAOYSA-N trichloro-[2-[(2-methylpropan-2-yl)oxy]phenyl]silane Chemical compound CC(C)(C)OC1=CC=CC=C1[Si](Cl)(Cl)Cl OUMAYXXJSADQBQ-UHFFFAOYSA-N 0.000 description 1
- ZZARCDHCAFJWJC-UHFFFAOYSA-N trichloro-[ethoxy(phenyl)methyl]silane Chemical compound CCOC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 ZZARCDHCAFJWJC-UHFFFAOYSA-N 0.000 description 1
- SMGOKIYLLQQVJE-UHFFFAOYSA-N trichloro-[methoxy(phenyl)methyl]silane Chemical compound COC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 SMGOKIYLLQQVJE-UHFFFAOYSA-N 0.000 description 1
- UEUXEIHYBASMLX-UHFFFAOYSA-N trichloro-[phenyl(propan-2-yloxy)methyl]silane Chemical compound CC(C)OC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 UEUXEIHYBASMLX-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- UNKMHLWJZHLPPM-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CCO[Si](OCC)(OCC)COCC1CO1 UNKMHLWJZHLPPM-UHFFFAOYSA-N 0.000 description 1
- OHKFEBYBHZXHMM-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)C(CCC)OCC1CO1 OHKFEBYBHZXHMM-UHFFFAOYSA-N 0.000 description 1
- SJQPASOTJGFOMU-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)C(C)OCC1CO1 SJQPASOTJGFOMU-UHFFFAOYSA-N 0.000 description 1
- NFRRMEMOPXUROM-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)C(CC)OCC1CO1 NFRRMEMOPXUROM-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- FVMMYGUCXRZVPJ-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CC(CC)OCC1CO1 FVMMYGUCXRZVPJ-UHFFFAOYSA-N 0.000 description 1
- RWJUTPORTOUFDY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)CCOCC1CO1 RWJUTPORTOUFDY-UHFFFAOYSA-N 0.000 description 1
- CFUDQABJYSJIQY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CC(C)OCC1CO1 CFUDQABJYSJIQY-UHFFFAOYSA-N 0.000 description 1
- NLKPPXKQMJDBFO-UHFFFAOYSA-N triethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OCC)(OCC)OCC)CCC2OC21 NLKPPXKQMJDBFO-UHFFFAOYSA-N 0.000 description 1
- KPNCYSTUWLXFOE-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCC(C)OCC1CO1 KPNCYSTUWLXFOE-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- PSUKBUSXHYKMLU-UHFFFAOYSA-N triethoxy-[4-(7-oxabicyclo[4.1.0]heptan-4-yl)butyl]silane Chemical compound C1C(CCCC[Si](OCC)(OCC)OCC)CCC2OC21 PSUKBUSXHYKMLU-UHFFFAOYSA-N 0.000 description 1
- GSUGNQKJVLXBHC-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCOCC1CO1 GSUGNQKJVLXBHC-UHFFFAOYSA-N 0.000 description 1
- CSDVDSUBFYNSMC-UHFFFAOYSA-N triethoxysilylmethyl acetate Chemical compound CCO[Si](OCC)(OCC)COC(C)=O CSDVDSUBFYNSMC-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 description 1
- 125000005951 trifluoromethanesulfonyloxy group Chemical group 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- LFBULLRGNLZJAF-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CO[Si](OC)(OC)COCC1CO1 LFBULLRGNLZJAF-UHFFFAOYSA-N 0.000 description 1
- FFJVMNHOSKMOSA-UHFFFAOYSA-N trimethoxy-[1-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCCC([Si](OC)(OC)OC)OCC1CO1 FFJVMNHOSKMOSA-UHFFFAOYSA-N 0.000 description 1
- DAVVOFDYOGMLNQ-UHFFFAOYSA-N trimethoxy-[1-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)C(C)OCC1CO1 DAVVOFDYOGMLNQ-UHFFFAOYSA-N 0.000 description 1
- FNBIAJGPJUOAPB-UHFFFAOYSA-N trimethoxy-[1-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)C(CC)OCC1CO1 FNBIAJGPJUOAPB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ZNXDCSVNCSSUNB-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)CCOCC1CO1 ZNXDCSVNCSSUNB-UHFFFAOYSA-N 0.000 description 1
- HTVULPNMIHOVRU-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CC(C)OCC1CO1 HTVULPNMIHOVRU-UHFFFAOYSA-N 0.000 description 1
- DBUFXGVMAMMWSD-UHFFFAOYSA-N trimethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OC)(OC)OC)CCC2OC21 DBUFXGVMAMMWSD-UHFFFAOYSA-N 0.000 description 1
- ZQPNGHDNBNMPON-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CO[Si](OC)(OC)CCC(C)OCC1CO1 ZQPNGHDNBNMPON-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- NBNZEBUNZGWIRJ-UHFFFAOYSA-N triphenylsulfanium;nitrate Chemical compound [O-][N+]([O-])=O.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 NBNZEBUNZGWIRJ-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- 229910052722 tritium Inorganic materials 0.000 description 1
- XMUJIPOFTAHSOK-UHFFFAOYSA-N undecan-2-ol Chemical compound CCCCCCCCCC(C)O XMUJIPOFTAHSOK-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G16/00—Condensation polymers of aldehydes or ketones with monomers not provided for in the groups C08G4/00 - C08G14/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
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Description
また、半導体基板とフォトレジストとの間の下層膜として、シリコンやチタン等の金属元素を含むハードマスクとして知られる膜を使用することが行なわれている。この場合、レジストとハードマスクでは、その構成成分に大きな違いが有るため、それらのドライエッチングによって除去される速度は、ドライエッチングに使用されるガス種に大きく依存する。そして、ガス種を適切に選択することにより、フォトレジストの膜厚の大きな減少を伴うことなく、ハードマスクをドライエッチングによって除去することが可能となる。このように、近年の半導体装置の製造においては、反射防止効果を初め、さまざまな効果を達成するために、半導体基板とフォトレジストの間にレジスト下層膜が配置されるようになってきている。そして、これまでもレジスト下層膜用の組成物の検討が行なわれてきているが、その要求される特性の多様性などから、レジスト下層膜用の新たな材料の開発が望まれている。
また、スルホンアミド構造を有するシランを用いたポリシロキサンを含むレジスト下層膜が提案されている(特許文献2を参照)。
さらに、スルホン構造とアミン構造を有するシランを用いたポリシロキサンを含むレジスト下層膜が提案されている(特許文献3を参照)。
第2観点として、ハロゲン含有カルボン酸アミド基を有する加水分解性シランが式(1):
〔式(1)中、R1は式(2):
(式(2)中、R4はアミド基、アミノ基、エーテル基、スルホニル基を含んでいても良い有機基であり、該有機基は炭素原子数1乃至10のアルキレン基、アリーレン基、又はそれらの組み合わせを示す。R5は水素原子又は炭素原子数1乃至10のアルキル基を示す。R6はハロゲン原子で置換された有機基又はハロゲンイオンを含む有機基であり且つ、該有機基はスルホニル基、チオール基、エーテル基、カルボニル基を含んでいてもよい炭素原子数1乃至10のアルキル基、炭素原子数3乃至20の環状アルキル基、炭素原子数1乃至10のアルキレン基、炭素原子数6乃至40のアリール基、炭素原子数6乃至40のアリーレン基、複素環基、又はそれらの組み合わせを含む有機基を示す。)で示される有機基であり且つSi−C結合によりケイ素原子結合しているものである。R2はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、アミノ基、もしくはシアノ基を有する有機基で且つSi−C結合によりケイ素原子と結合しているものである。R3はアルコキシ基、アシルオキシ基、又はハロゲン基を示す。aは1の整数を示し、bは0乃至2の整数を示し、a+bは1乃至3の整数を示す。〕で示される加水分解性シランである第1観点に記載のレジスト下層膜形成組成物、
第3観点として、該ハロゲン含有カルボン酸アミド基におけるハロゲン原子がフッ素原子である第1観点又は第2観点に記載のレジスト下層膜形成組成物、
第4観点として、該ハロゲン含有カルボン酸アミド基が、トリフルオロアセトアミド基である第1観点又は第2観点に記載のレジスト下層膜形成組成物、
第5観点として、該加水分解性シランが、式(1)で示される加水分解性シランとその他の加水分解性シランとの組み合わせであり、その他の加水分解性シランが式(3):
(式(3)中、R7はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi−C結合によりケイ素原子と結合しているものであり、R8はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、cは0乃至3の整数を示す。)で示される加水分解性シラン、及び式(4):
(式(4)中、R9はアルキル基で且つSi−C結合によりケイ素原子と結合しているものであり、R10はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、Yはアルキレン基又はアリーレン基を示し、dは0又は1の整数を示し、eは0又は1の整数である。)で示される加水分解性シランからなる群より選ばれた少なくとも1種の加水分解性シランである第1観点乃至第4観点のいずれか一つに記載のレジスト下層膜形成組成物、
第6観点として、第2観点に記載の式(1)で示される加水分解性シランと第5観点に記載の式(3)で示される加水分解性シランとの組み合わせからなる加水分解性シランの加水分解縮合物をポリマーとして含む第1観点に記載のレジスト下層膜形成組成物、
第7観点として、更に酸を含む第1観点乃至第6観点のいずれか一つに記載のレジスト下層膜形成組成物、
第8観点として、更に水を含む第1観点乃至第7観点のいずれか一つに記載のレジスト下層膜形成組成物、
第9観点として、第1観点乃至第8観点のいずれか一つに記載のレジスト下層膜形成組成物の硬化物からなる、半導体基板上に形成されたレジスト下層膜、
第10観点として、第1観点乃至第8観点のいずれか一つに記載のレジスト下層膜形成組成物を半導体基板上に塗布し、焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後に該レジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、及びパターン化されたレジスト膜とレジスト下層膜により半導体基板を加工する工程を含む半導体装置の製造方法、及び
第11観点として、半導体基板上に有機下層膜を形成する工程、その上に第1観点乃至第8観点のいずれか一つに記載のレジスト下層膜形成組成物を塗布し焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後に該レジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、パターン化されたレジスト下層膜により有機下層膜をエッチングする工程、及びパターン化された有機下層膜により半導体基板を加工する工程を含む半導体装置の製造方法である。
また、微細なパターンを形成する上で、パターン倒れを防ぐためにレジスト膜厚が薄くなる傾向があり、レジストの薄膜化によりその下層に存在する膜にパターンを転写するためのドライエッチングは、上層の膜よりもエッチング速度が高いことを要する。これに対し、本発明のレジスト下層膜形成組成物はレジストに比較して大きなドライエッチング速度を有するリソグラフィー用レジスト下層膜を提供できる。
さらに、どの世代のリソグラフィーのどの現像プロセスにおいてもレジスト形状をコントロールするには下層膜の酸性度調節が必要である。特に、KrF、ArF、EUV、EB等の各波長の光及び電子線により酸を発生する骨格はよりフォトレジストのコントラストを高めることが出来、有用であると考えられる。
本発明のレジスト下層膜形成組成物はハロゲン含有カルボン酸アミド基、特にトリフルオロアセトアミド基を有する加水分解性シランを含む。従って本発明の組成物は露光により酸を発生する、トリフルオロアセトアミド骨格を含有することで特にArF露光、EUV露光においてパターン解像性を向上させることが出来る。
より具体的には本発明のレジスト下層膜形成組成物は、式(1)で示される加水分解性シラン、又は式(1)で示される加水分解性シランとその他の加水分解性シラン(例えば式(3)で示される加水分解性シラン)、その加水分解物、又はその加水分解縮合物と、溶剤とを含む。そして任意成分として酸、水、アルコール、硬化触媒、酸発生剤、他の有機ポリマー、吸光性化合物、及び界面活性剤等を含むことができる。
固形分中に占める加水分解性シラン、その加水分解物、及びその加水分解縮合物の割合は、20質量%以上であり、例えば50乃至100質量%、60乃至99質量%、70乃至99質量%である。
アリーレン基としては上記アリール基に由来するアリーレン基を挙げることができる。例えばフェニル基であればフェニレン基、ナフチル基であればナフチレン基が挙げられる。
アクリロイル基を有する有機基としては、アクリロイルメチル、アクリロイルエチル、アクリロイルプロピル基等が挙げられる。
メタクリロイル基を有する有機基としては、メタクリロイルメチル、メタクリロイルエチル、メタクリロイルプロピル基等が挙げられる。
アミノ基を有する有機基としては、アミノ基、アミノメチル基、アミノエチル基等が挙げられる。
シアノ基を有する有機基としては、シアノエチル、シアノプロピル基等が挙げられる。
アルコキシアリール基はアルコキシ基により置換したアリール基であり、例えばメトキシフェニル基、エトキシフェニル基が挙げられる。
ハロゲン化アルキル基、ハロゲン化アリール基は例えばハロゲン基で置換された上記に例示したアルキル基、アリール基であり、上記ハロゲン基としてはフッ素、塩素、臭素、ヨウ素等が挙げられる。
式(2)中、R6はハロゲン原子で置換された有機基又はハロゲンイオンを含む有機基であり、ハロゲンとしては、フッ素、塩素、臭素、ヨウ素等が挙げられる。
ハロゲン原子で置換された有機基としては、炭素原子数1乃至10のアルキル基、炭素原子数1乃至10のアルキレン基、炭素原子数6乃至40のアリール基、炭素原子数6乃至40のアリーレン基、複素環基等の水素原子の一部又は全部がハロゲン原子に置換された有機基が挙げられる。
ハロゲンイオンを含む有機基としては複素環構造の一部が塩を形成し、そのアニオン成分としてハロゲンイオンを含有することができる。
ハロゲン原子で置換されたアルキル基としては、例えばパーフルオロメチル基(即ち、トリフルオロメチル基)、パーフルオロエチル基、パーフルオロプロピル基、パーフルオロブチル基等が挙げられる。
下記各式中のTは炭素原子数1乃至10のアルキル基であり、例えばメチル基、エチル基が好ましく用いることができ、Tがメチル基である場合には加水分解性基としてはメトキシ基、Tがエチル基である場合には加水分解性基はエトキシ基である。
上記の加水分解性シランの加水分解縮合物(ポリオルガノシロキサン)は、重量平均分子量1000乃至1000000、又は1000乃至100000の縮合物を得ることができる。これらの分子量はGPC分析によるポリスチレン換算で得られる分子量である。
GPCの測定条件は、例えばGPC装置(商品名HLC−8220GPC、東ソー株式会社製)、GPCカラム(商品名ShodexKF803L、KF802、KF801、昭和電工製)、カラム温度は40℃、溶離液(溶出溶媒)はテトラヒドロフラン、流量(流速)は1.0ml/分、標準試料はポリスチレン(昭和電工株式会社製)を用いて行うことができる。
アルコキシシリル基、アシロキシシリル基、又はハロゲン化シリル基の加水分解には、加水分解性基の1モル当たり、0.5乃至100モル、好ましくは1乃至10モルの水を用いる。
また、加水分解性基の1モル当たり0.001乃至10モル、好ましくは0.001乃至1モルの加水分解触媒を用いることができる。
加水分解は完全に加水分解を行うことも、部分加水分解することでも良い。即ち、加水分解縮合物中に加水分解物やモノマーが残存していても良い。
加水分解触媒としては、金属キレート化合物、有機酸、無機酸、有機塩基、無機塩基を挙げることができる。
加水分解触媒としての無機酸は、例えば塩酸、硝酸、硫酸、フッ酸、リン酸等を挙げることができる。
硬化触媒としては、アンモニウム塩、ホスフィン類、ホスホニウム塩、スルホニウム塩を用いることができる。
(但し、mは2乃至11、nは2乃至3の整数を、R21 はアルキル基又はアリール基を、YA −は陰イオンを示す。)で示される構造を有する第4級アンモニウム塩、式(D−2):
(但し、R22、R23、R24及びR25はアルキル基又はアリール基を、Nは窒素原子を、YA −は陰イオンを示し、且つR22、R23、R24、及びR25はそれぞれC−N結合により窒素原子と結合されているものである)で示される構造を有する第4級アンモニウム塩、
式(D−3):
(但し、R26及びR27はアルキル基又はアリール基を、YA −は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D−4):
(但し、R28はアルキル基又はアリール基を、YA −は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D−5):
(但し、R29及びR30はアルキル基又はアリール基を、YA −は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D−6):
(但し、mは2乃至11、nは2乃至3の整数を、Hは水素原子を、YA −は陰イオンを示す)で示される構造を有する第3級アンモニウム塩が挙げられる。
(但し、R31、R32、R33、及びR34はアルキル基又はアリール基を、Pはリン原子を、YA −は陰イオンを示し、且つR31、R32、R33、及びR34はそれぞれC−P結合によりリン原子と結合されているものである)で示される第4級ホスホニウム塩が挙げられる。
(但し、R35、R36、及びR37はアルキル基又はアリール基を、Sは硫黄原子を、YA −は陰イオンを示し、且つR35、R36、及びR37はそれぞれC−S結合により硫黄原子と結合されているものである)で示される第3級スルホニウム塩が挙げられる。
そして本発明のリソグラフィー用レジスト下層膜形成組成物では、その加水分解縮合物を含むレジスト下層膜形成組成物は安定化のために有機酸、水、アルコール、又はそれらの組み合わせを添加することができる。
また加えるアルコールとしては塗布後の加熱により飛散しやすいものが好ましく、例えばメタノール、エタノール、プロパノール、イソプロパノール、ブタノール等が挙げられる。加えるアルコールはレジスト下層膜形成組成物100質量部に対して1乃至20質量部とすることができる。
有機ポリマー化合物にヒドロキシル基が含有されている場合は、このヒドロキシル基はポリオルガノシロキサンと架橋反応を形成することができる。
有機ポリマー化合物は一種のみを使用することができ、または二種以上を組み合わせて使用することができる。
酸発生剤としては、熱酸発生剤や光酸発生剤が挙げられる。
光酸発生剤は、レジストの露光時に酸を生ずる。そのため、下層膜の酸性度の調整ができる。これは、下層膜の酸性度を上層のレジストとの酸性度に合わせるための一方法である。また、下層膜の酸性度の調整によって、上層に形成されるレジストのパターン形状の調整ができる。
光酸発生剤が使用される場合、その割合としては、縮合物(ポリオルガノシロキサン)100質量部に対して、0.01乃至15質量部、または0.1乃至10質量部、または0.5乃至1質量部である。
本発明のレジスト下層膜形成組成物に含まれる界面活性剤としては、例えば、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンオレイルエーテル等のポリオキシエチレンアルキルエーテル類、ポリオキシエチレンオクチルフエノールエーテル、ポリオキシエチレンノニルフエノールエーテル等のポリオキシエチレンアルキルアリルエーテル類、ポリオキシエチレン・ポリオキシプロピレンブロツクコポリマー類、ソルビタンモノラウレート、ソルビタンモノパルミテート、ソルビタンモノステアレート、ソルビタンモノオレエート、ソルビタントリオレエート、ソルビタントリステアレート等のソルビタン脂肪酸エステル類、ポリオキシエチレンソルビタンモノラウレート、ポリオキシエチレンソルビタンモノパルミテート、ポリオキシエチレンソルビタンモノステアレート、ポリオキシエチレンソルビタントリオレエート、ポリオキシエチレンソルビタントリステアレート等のポリオキシエチレンソルビタン脂肪酸エステル類等のノニオン系界面活性剤、商品名エフトップEF301、EF303、EF352((株)トーケムプロダクツ製)、商品名メガファックF171、F173、R−08、R−30、R−30N、R−40LM(DIC(株)製)、フロラードFC430、FC431(住友スリーエム(株)製)、商品名アサヒガードAG710,サーフロンS−382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子(株)製)等のフッ素系界面活性剤、及びオルガノシロキサンポリマ−KP341(信越化学工業(株)製)等を挙げることができる。これらの界面活性剤は単独で使用してもよいし、また二種以上の組み合わせで使用することもできる。界面活性剤が使用される場合、その割合としては、縮合物(ポリオルガノシロキサン)100質量部に対して0.0001乃至5質量部、または0.001乃至1質量部、または0.01乃至1質量部である。
本発明では基板上に有機下層膜を介するか、又は有機下層膜を介さず、その上に本発明によるレジスト下層膜(無機系シリコン系化合物を含有する)を被覆し、その上にレジスト膜(有機レジスト膜)の順で被覆される。
一般に有機系成分の膜と無機系成分の膜はエッチングガスの選択によりドライエッチング速度が大きく異なり、有機系成分の膜は酸素系ガスでドライエッチング速度が高くなり、無機系成分の膜はハロゲン含有ガスでドライエッチング速度が高くなる。
従って例えばレジストパターンが形成され、その下層に存在している本発明によるレジスト下層膜をハロゲン含有ガスでドライエッチングしてレジスト下層膜にパターンを転写し、そのレジスト下層膜に転写されたパターンによりハロゲン含有ガスを用いて基板加工を行う。あるいは、パターン転写されたレジスト下層膜を用いて、その下層の有機下層膜を酸素系ガスでドライエッチングして有機下層膜にパターン転写を行って、そのパターン転写された有機下層膜により、ハロゲン含有ガスを用いて基板加工を行う。
半導体装置の製造に使用される基板(例えば、シリコンウエハ基板、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、ガラス基板、ITO基板、ポリイミド基板、及び低誘電率材料(low−k材料)被覆基板等)の上に、スピナー、コーター等の適当な塗布方法により本発明のレジスト下層膜形成組成物が塗布され、その後、焼成することによりレジスト下層膜が形成される。焼成する条件としては、焼成温度80℃乃至250℃、焼成時間0.3乃至60分間の中から適宜、選択される。好ましくは、焼成温度150℃乃至250℃、焼成時間0.5乃至2分間である。ここで、形成される下層膜の膜厚としては、例えば、10乃至1000nmであり、または20乃至500nmであり、または50乃至300nmであり、または100乃至200nmである。
現像液としては、水酸化カリウム、水酸化ナトリウムなどのアルカリ金属水酸化物の水溶液、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、コリンなどの水酸化四級アンモニウムの水溶液、エタノールアミン、プロピルアミン、エチレンジアミンなどのアミン水溶液等のアルカリ性水溶液を例として挙げることができる。さらに、これらの現像液に界面活性剤などを加えることもできる。現像の条件としては、温度5乃至50℃、時間10乃至600秒から適宜選択される。
また、本発明では現像液として有機溶剤を用いることができる。露光後に現像液(溶剤)によって現像が行なわれる。これにより、例えばポジ型フォトレジストが使用された場合は、露光されない部分のフォトレジストが除去され、フォトレジストのパターンが形成される。
レジスト下層膜のドライエッチングはフッ素系ガスによることが好ましく、フッ素系ガスとしては、例えば、テトラフルオロメタン(CF4)、トリフルオロメタン(CHF3)、パーフルオロシクロブタン(C4F8)、パーフルオロプロパン(C3F8)、トリフルオロメタン、及びジフルオロメタン(CH2F2)等が挙げられる。
フッ素系ガスとしては、例えば、テトラフルオロメタン(CF4)、トリフルオロメタン(CHF3)、パーフルオロシクロブタン(C4F8)、パーフルオロプロパン(C3F8)、トリフルオロメタン、及びジフルオロメタン(CH2F2)等が挙げられる。
最後に、半導体基板の加工が行なわれる。上記のとおり半導体基板の加工はフッ素系ガスによるドライエッチングによって行なわれることが好ましい。
また、EUVレジストの下層膜としてはハードマスクとしての機能以外に以下の目的にも使用できる。EUVレジストとインターミキシングすることなく、EUV露光(波長13.5nm)に際して好ましくない露光光、例えば上述のUVやDUV(ArF光、KrF光)の基板又は界面からの反射を防止することができるEUVレジストの下層反射防止膜として、上記レジスト下層膜形成組成物を用いることができる。EUVレジストの下層で効率的に反射を防止することができる。EUVレジスト下層膜として用いた場合は、プロセスはフォトレジスト用下層膜と同様に行うことができる。
テトラエトキシシラン24.93g(70mol%)、フェニルトリメトキシシラン1.70g(5mol%)、トリエトキシメチルシラン6.10g(20mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.71g(5mol%)、アセトン53.16gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.40gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−1)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン26.04g(70mol%)、トリエトキシメチルシラン6.37g(20mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.83g(5mol%)、4−メトキシベンジルトリメトキシシラン2.16g(5mol%)、アセトン52.86gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.90gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−2)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1600であった。
テトラエトキシシラン24.43g(70mol%)、フェニルトリメトキシシラン1.66g(5mol%)、トリエトキシメチルシラン3.88g(13mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.66g(5mol%)、4−メトキシベンジルトリメトキシシラン0.81g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.90g(5mol%)、アセトン53.30gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.17gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−3)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン23.68g(70mol%)、フェニルトリメトキシシラン1.61g(5mol%)、トリエトキシメチルシラン2.31g(8mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.58g(5mol%)、4−メトキシベンジルトリメトキシシラン0.79g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.81g(5mol%)、5−(トリエトキシシリル)ヘキサヒドロ‐4,7−メタノイソベンゾフラン‐1,3−ジオン2.67g(5mol%)、アセトン53.50gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.83gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−4)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1700であった。
テトラエトキシシラン23.36g(70mol%)、フェニルトリメトキシシラン1.59g(5mol%)、アセトキシメチルトリエトキシシラン2.82g(8mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.54g(5mol%)、4−メトキシベンジルトリメトキシシラン0.78g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.78g(5mol%)、5−(トリエトキシシリル)ヘキサヒドロ‐4,7−メタノイソベンゾフラン‐1,3−ジオン2.63g(5mol%)、アセトン53.59gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.68gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−5)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw2100であった。
テトラエトキシシラン23.84g(70mol%)、トリエトキシシリルプロピルジアリルイソシアヌレート3.38g(5mol%)、メチルトリエトキシシラン5.83g(20mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.59g(5mol%)、アセトン53.46gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.90gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−6)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン24.74g(70mol%)、フェニルトリメトキシシラン1.68g(5mol%)、メチルトリエトキシシラン5.75g(19.9mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.69g(5mol%)、ベンゼンスルホンアミドプロピルトリエトキシラン0.61g(0.1mol%)、アセトン53.21gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.31gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−7)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
(合成例8)
テトラエトキシシラン25.04g(70mol%)、メチルトリエトキシシラン7.65g(25mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン2.72g(5mol%)、アセトン53.13gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら1mol/lの塩酸11.45gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−8)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン21.79g(70mol%)、トリフルオロアセトアミドプロピルトリエトキシシラン14.23g(30mol%)、アセトン54.02gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら1mol/lの塩酸9.96gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(2−9)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン25.81g(70mol%)、メチルトリエトキシシラン9.47g(30mol%)、アセトン52.92gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.80gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(3−1)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1700であった。
テトラエトキシシラン25.22g(70mol%)、メチルトリエトキシシラン7.71g(25mol%)、アセトアミドプロピルトリエトキシシラン2.28g(5mol%)、アセトン52.81gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.53gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20質量パーセントとなるように調整した。得られたポリマーは式(3−2)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
上記合成例1乃至合成例9並びに比較例合成例1及び比較合成例2で得られたケイ素含有ポリマー、酸、硬化触媒、添加剤、溶媒、水を表1に示す割合で混合し、0.1μmのフッ素樹脂製のフィルターで濾過することによって、レジスト下層膜形成用組成物の溶液をそれぞれ調製した。表1中のポリマーの添加割合はポリマー溶液の添加量ではなく、ポリマー自体の添加量を示した。
表1中でマレイン酸はMA、ベンジルトリエチルアンモニウムクロリドはBTEAC、N−(3−トリエトキシシリルプロピル)−4,5−ジヒドロイミダゾールはIMIDTEOS、トリフェニルスルホニウム硝酸塩はTPSNO3、マレイン酸モノトリフェニルスルフォニウムはTPSMA、トリフェニルスルホニウムトリフルオロ酢酸塩はTPSTFA、トリフェニルスルホニウムクロリドはTPSCl、トリフェニルスルホニウムカンファースルホン酸塩はTPSCS、トリフェニルスルホニウムトリフルオロメタンスルホン酸塩はTPSTf、トリフェニルスルホニウムアダマンタンカルボキシ-1,1,2-トリフルオロブタンスルホン酸塩はTPSAdTF、ジヒドロキシフェニルフェニルスルホニウムpトルエンスルホン酸塩はDHPPSpTS、ビスフェニルスルホンはBPS、プロピレングリコールモノメチルエーテルアセテートはPGMEA、プロピレングリコールモノエチルエーテルはPGEE、プロピレングリコールモノメチルエーテルはPGMEと略した。水は超純水を用いた。各添加量は質量部で示した。
窒素下、100mL四口フラスコにカルバゾール(6.69g、0.040mol、東京化成工業(株)製)、9−フルオレノン(7.28g、0.040mol、東京化成工業(株)製)、パラトルエンスルホン酸一水和物(0.76g、0.0040mol、東京化成工業(株)製)を加え、1,4−ジオキサン(6.69g、関東化学(株)製)を仕込み撹拌し、100℃まで昇温し溶解させ重合を開始した。24時間後60℃まで放冷後、クロロホルム(34g、関東化学(株)製)を加え希釈し、メタノール(168g、関東化学(株)製)へ再沈殿させた。得られた沈殿物をろ過し、減圧乾燥機で80℃、24時間乾燥し、目的とするポリマー(式(4−1)、以下PCzFLと略す)9.37gを得た。
PCzFLの1H−NMRの測定結果は以下の通りであった。
1H−NMR(400MHz,DMSO−d6):δ7.03−7.55(br,12H),δ7.61−8.10(br,4H),δ11.18(br,1H)
PCzFLのGPCによるポリスチレン換算で測定される重量平均分子量Mwは2800、多分散度Mw/Mnは1.77であった。
得られた樹脂20gに、架橋剤としてテトラメトキシメチルグリコールウリル(三井サイテック(株)製、商品名パウダーリンク1174)3.0g、触媒としてピリジニウムパラトルエンスルホネート0.30g、界面活性剤としてメガファックR−30N(大日本インキ化学(株)製、商品名)0.06gを混合し、プロピレングリコールモノメチルエーテルアセテート88gに溶解させ溶液とした。その後、孔径0.10μmのポリエチレン製ミクロフィルターを用いて濾過し、更に、孔径0.05μmのポリエチレン製ミクロフィルターを用いて濾過して、多層膜によるリソグラフィープロセスに用いる有機下層膜形成組成物の溶液を調製した。
実施例1乃至9並びに、比較例1及び2で調製したSi含有レジスト下層膜形成組成物をスピナーを用い、シリコンウエハ上にそれぞれ塗布した。ホットプレート上で200℃1分間加熱し、Si含有レジスト下層膜(膜厚0.05μm)を形成した。そして、これらのレジスト下層膜を分光エリプソメーター(J.A.Woollam社製、VUV−VASEVU−302)を用い、波長193nmでの屈折率(n値)及び光学吸光係数(k値、減衰係数とも呼ぶ)を測定した。
ドライエッチング速度の測定に用いたエッチャー及びエッチングガスは以下のものを用いた。
ES401(日本サイエンティフィック製):CF4
RIE−10NR(サムコ製):O2
実施例1乃至9並びに、比較例1及び2で調製したSi含有レジスト下層膜形成組成物の溶液を、スピナーを用い、シリコンウエハ上に塗布した。ホットプレート上で240℃1分間加熱し、Si含有レジスト下層膜(膜厚0.08μm(CF4ガスでのエッチング速度測定用))、(膜厚0.05μm(O2ガスでのエッチング速度測定用))をそれぞれ形成した。また、同様に有機下層膜形成組成物(式(4−1)で示されるポリマーを含有する組成物)についても、スピナーを用い、シリコンウエハ上に塗膜を形成(膜厚0.20μm)した。
エッチングガスとしてCF4ガスを使用してドライエッチング速度を測定し、実施例1乃至9並びに、比較例1及び2のSi含有レジスト下層膜のドライエッチング速度との比較を行った。フッ素系ガスエッチレート試験結果の単位はオングストローム/分である。
エッチングガスとしてO2ガスを使用してドライエッチング速度を測定し、実施例1乃至9並びに、比較例1及び2のSi含有レジスト下層膜のドライエッチング速度との比較を行った。酸素系ガス耐性試験結果の単位はオングストローム/分である。
上記式で得られた有機下層膜(A層)形成組成物をシリコンウエハ上に塗布し、ホットプレート上で240℃で60秒間ベークし、膜厚200nmの有機下層膜(A層)を得た。その上に、実施例1乃至9並びに、比較例1及び2で得られたSi含有レジスト下層膜(B層)形成組成物を塗布し、ホットプレート上で240℃で60秒間ベークし、Si含有レジスト下層膜(B層)を得た。Si含有レジスト下層膜(B層)の膜厚は30nmであった。
B層の上に市販のフォトレジスト溶液(富士フイルム(株)製、商品名FAiRS−9521NT05)をスピナーによりそれぞれ塗布し、ホットプレート上で100℃にて1分間加熱し、膜厚85nmのフォトレジスト膜(C層)を形成した。
(株)ニコン製NSR−S307Eスキャナー(波長193nm、NA、σ:0.85、0.93/0.85)を用い、現像後にフォトレジストのライン幅及びそのライン間の幅が0.060μm、すなわち0.060μmのラインアンドスペース(L/S)=1/2のデンスラインが形成されるように設定されたマスク、また現像後にフォトレジストのライン幅及びそのライン間の幅が0.058μm、すなわち0.058μmのラインアンドスペース(L/S)=1/1のデンスラインが形成されるように設定されたマスクにそれぞれを通して露光を行った。その後、ホットプレート上100℃で60秒間ベークし、冷却後、酢酸ブチル(溶剤現像液)を用いて60秒現像し、レジスト下層膜(B層)上にネガ型のパターンを形成した。得られたフォトレジストパターンについて、大きなパターン剥がれやアンダーカット、ライン底部の太り(フッティング)が発生しないものを良好として評価した。
上記有機下層膜(A層)形成組成物をシリコンウエハ上に塗布し、ホットプレート上、215℃で60秒間ベークし、膜厚90nmの有機下層膜(A層)を得た。その上に、本発明の実施例1、6,7、8及び9、並びに比較例1及び2で調製されたレジスト下層膜形成組成物溶液をスピンコートし、215℃で1分間加熱することにより、レジスト下層膜(B層)(20nm)を形成した。そのハードマスク上に、EUV用レジスト溶液(メタクリレート樹脂系レジスト)をスピンコートし加熱を行い、EUVレジスト層(C層)を形成し、EUV露光装置(Micro Exposure Tool 略称MET)を用い、NA=0.30、σ=0.36/0.93 Quadropoleの条件で露光した。露光後、PEB(露光後加熱)を行い、クーリングプレート上で室温まで冷却し、現像及びリンス処理をし、レジストパターンを形成した。得られたレジストパターンについて、26nmのラインアンドスペースの形成可否、パターン断面観察によるパターン形状を評価した。
表3で良好とはフッティングからアンダーカットの間の矩形な形状であり、かつスペース部に著しい残渣がないという状態を示し、倒れとはレジストパターンが剥がれ倒壊しているという好ましくない状態を示し、ブリッジとはレジストパターンの上部もしくは下部同士が接触しているという好ましくない状態を示す。
Claims (9)
- シランとして加水分解性シラン、その加水分解物、その加水分解縮合物、又はそれらの組み合わせを含み、該加水分解性シランがトリフルオロアセトアミド基を有する加水分解性シランを含むリソグラフィー用レジスト下層膜形成組成物。
- トリフルオロアセトアミド基を有する加水分解性シランが式(1):
成物。 - 該加水分解性シランが、式(1)で示される加水分解性シランとその他の加水分解性シランとの組み合わせであり、その他の加水分解性シランが式(3):
- 請求項2に記載の式(1)で示される加水分解性シランと請求項3に記載の式(3)で示される加水分解性シランとの組み合わせからなる加水分解性シランの加水分解縮合物をポリマーとして含む請求項1に記載のレジスト下層膜形成組成物。
- 更に酸を含む請求項1乃至請求項4のいずれか1項に記載のレジスト下層膜形成組成物。
- 更に水を含む請求項1乃至請求項5のいずれか1項に記載のレジスト下層膜形成組成物。
- 請求項1乃至請求項6のいずれか1項に記載のレジスト下層膜形成組成物の硬化物からなる、半導体基板上に形成されたレジスト下層膜。
- 請求項1乃至請求項6のいずれか1項に記載のレジスト下層膜形成組成物を半導体基板上に塗布し、焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後に該レジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、及びパターン化されたレジスト膜とレジスト下層膜により半導体基板を加工する工程を含む半導体装置の製造方法。
- 半導体基板上に有機下層膜を形成する工程、その上に請求項1乃至請求項6のいずれか1項に記載のレジスト下層膜形成組成物を塗布し焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後に該レジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、パターン化されたレジスト下層膜により有機下層膜をエッチングする工程、及びパターン化された有機下層膜により半導体基板を加工する工程を含む半導体装置の製造方法。
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