JP6076856B2 - Peeling device, peeling system and peeling method - Google Patents

Description

  The disclosed embodiments relate to a peeling apparatus, a peeling system, and a peeling method.

  In recent years, for example, in the semiconductor device manufacturing process, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport or polishing process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed.

  For example, in Patent Document 1, the outer periphery of the second holding unit is moved in the vertical direction while the semiconductor substrate is sucked and held by the first holding unit and the support substrate is sucked and held by the second holding unit. Thus, a technique for peeling the support substrate from the semiconductor substrate is disclosed.

JP2012-69914A

  However, the above-described conventional technology has room for further improvement in terms of increasing the efficiency of the peeling process. Such a problem is a problem that may also occur in a manufacturing process such as SOI (Silicon On Insulator) that involves peeling of the substrate.

  An object of one embodiment is to provide a peeling apparatus, a peeling system, and a peeling method that can improve the efficiency of a peeling process.

The peeling apparatus according to an aspect of the embodiment includes a first holding unit, a second holding unit, a moving unit, and one or more additional moving units . The first holding unit holds the first substrate among the superposed substrates obtained by bonding the first substrate and the second substrate. The second holding unit holds the second substrate among the superposed substrates. The moving unit moves a part of the outer periphery of the first holding unit in a direction away from the second holding unit. The additional moving unit moves a part of the first holding unit in a direction away from the second holding unit. In addition, the first holding portion has flexibility and is provided in the contact portion that is not divided and contacts the substantially entire surface of the first substrate, and the contact portion on the first substrate. A suction part for sucking the surface, and a thin plate-like elastic member provided on the surface of the contact part opposite to the contact surface with the first substrate . Further, the elastic member is divided into a plurality of elastic member pieces arranged along the direction of separation, and the moving part corresponds to the elastic member piece arranged on the most starting side of the separation among the plurality of elastic member pieces. The additional moving part is provided on at least one of the elastic member pieces other than the elastic member piece arranged on the most starting side of the peeling .

  According to one aspect of the embodiment, the efficiency of the peeling process can be improved.

FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of a superposed substrate held by a dicing frame. FIG. 3 is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 4 is a schematic side view showing the configuration of the peeling apparatus according to this embodiment. FIG. 5 is a schematic side view illustrating configurations of the first holding unit, the moving unit, the first additional moving unit, and the second additional moving unit. FIG. 6 is a schematic bottom view of the contact portion. FIG. 7A is a schematic bottom view showing the shape of grooves formed in individual regions. FIG. 7B is a schematic bottom view showing the shape of the groove formed in the individual region. FIG. 8 is a schematic plan view of the elastic member. FIG. 9 is a flowchart showing a processing procedure of the peeling process. FIG. 10A is an explanatory diagram of the peeling operation. FIG. 10B is an explanatory diagram of the peeling operation. FIG. 10C is an explanatory diagram of the peeling operation. FIG. 10D is an explanatory diagram of the peeling operation. FIG. 10E is an explanatory diagram of the peeling operation. FIG. 10F is an explanatory diagram of the peeling operation. FIG. 10G is an explanatory diagram of the peeling operation. FIG. 11A is an operation explanatory diagram of the peeling attraction process. FIG. 11B is an operation explanatory diagram of the peeling attraction process. FIG. 11C is an operation explanatory diagram of the peeling attraction process. FIG. 12A is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 12B is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 12C is a schematic plan view illustrating a shape example of a cutting edge of a sharp member. FIG. 13 is a schematic bottom view illustrating the configuration of the contact portion according to the first modification. FIG. 14 is a schematic bottom view showing the configuration of the contact portion according to the second modification. FIG. 15A is a schematic diagram illustrating a manufacturing process of an SOI substrate. FIG. 15B is a schematic diagram illustrating a manufacturing process of the SOI substrate.

  Hereinafter, embodiments of a peeling device, a peeling system, and a peeling method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<1. Peeling system>
First, the structure of the peeling system which concerns on 1st Embodiment is demonstrated with reference to FIGS. 1-3. FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of the superposed substrate held on the dicing frame, and FIG. 3 is a schematic plan view of the superposed substrate.

  In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  The peeling system 1 according to the present embodiment shown in FIG. 1 includes a polymerization substrate T (see FIG. 2) in which a substrate to be processed W and a support substrate S are bonded with an adhesive G, a substrate to be processed W and a support substrate S. Peel off.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is defined as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the target substrate W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 50 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. Moreover, the thickness of the adhesive G which joins these to-be-processed substrate W and the support substrate S is about 40-150 micrometers.

  Further, as shown in FIG. 2, the superposed substrate T is fixed to a dicing frame F. The dicing frame F is a substantially annular member having an opening Fa having a diameter larger than that of the superposed substrate T at the center, and is formed of a metal such as stainless steel. The thickness of the dicing frame F is, for example, about 1 mm.

  The superposed substrate T is fixed to the dicing frame F via the dicing tape P. Specifically, the superposed substrate T is disposed in the opening Fa of the dicing frame F, and the dicing tape P is pasted on the non-joint surface Wn of the substrate W to be processed and the back surface of the dicing frame F so as to close the opening Fa from the back surface. wear. As a result, the superposed substrate T is fixed to the dicing frame F.

  As shown in FIG. 1, the peeling system 1 includes two processing blocks, a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged adjacent to each other.

  In the first processing block 10, the superposed substrate T is carried in, the superposed substrate T is peeled off, and the substrate W to be processed is peeled off and carried out. The first processing block 10 includes a carry-in / out station 11, a first transfer area 12, a standby station 13, an edge cut station 14, a peeling station 15, and a first cleaning station 16.

  The carry-in / out station 11, the standby station 13, the edge cut station 14, the peeling station 15, and the first cleaning station 16 are disposed adjacent to the first transfer region 12. Specifically, the carry-in / out station 11 and the standby station 13 are arranged side by side on the Y axis negative direction side of the first transfer region 12, and the peeling station 15 and the first cleaning station 16 are arranged in the first transfer region 12. They are arranged side by side on the Y axis positive direction side. In addition, the edge cut station 14 is disposed on the X axis positive direction side of the first transfer region 12.

  The loading / unloading station 11 is provided with a plurality of cassette mounting tables, and each cassette mounting table is loaded with a cassette Ct in which the superposed substrate T is stored or a cassette Cw in which the substrate to be processed W after peeling is stored. Placed.

  In the first transfer region 12, a first transfer device 121 that transfers the superposed substrate T or the substrate to be processed W after peeling is arranged. The first transfer device 121 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the first transfer region 12, the first transfer device 121 transfers the overlapped substrate T to the standby station 13, the edge cut station 14, and the peeling station 15, and the substrate W after being peeled off to the first cleaning station 16. And the process which conveys to the carrying in / out station 11 is performed.

  For example, an ID reader that reads an ID (Identification) of the dicing frame F is disposed in the standby station 13, and the overlapped substrate T being processed can be identified by the ID reader. In the standby station 13, in addition to the ID reading process, a standby process for temporarily waiting for the superposed substrate T waiting to be processed is performed as necessary. The standby station 13 is provided with a mounting table on which the superposed substrate T transferred by the first transfer device 121 is placed. The ID reading device and the temporary standby unit are placed on the mounting table. .

  The edge cut station 14 is provided with an edge cut device. The edge cut device performs an edge cut process in which the peripheral edge of the adhesive G (see FIG. 2) is dissolved and removed with a solvent. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S can be easily separated in the peeling process described later. Note that the edge cutting device dissolves the peripheral edge of the adhesive G with the solvent, for example, by immersing the polymerization substrate T in the solvent of the adhesive G.

  A peeling device is arranged in the peeling station 15, and a peeling process for peeling the superposed substrate T into the substrate to be processed W and the support substrate S is performed by the peeling device. The specific configuration and operation of the peeling apparatus will be described later.

  In the first cleaning station 16, the substrate to be processed W after being peeled is cleaned. The first cleaning station 16 is provided with a first cleaning device for cleaning the substrate to be processed W after being peeled off while being held by the dicing frame F. As a 1st washing | cleaning apparatus, the washing | cleaning apparatus of Unexamined-Japanese-Patent No. 2013-033925 can be used, for example.

  In the second processing block 20, the support substrate S after being peeled is cleaned and carried out. The second processing block 20 includes a delivery station 21, a second cleaning station 22, a second transfer area 23, and a carry-out station 24.

  The delivery station 21, the second cleaning station 22, and the carry-out station 24 are disposed adjacent to the second transfer area 23. Specifically, the delivery station 21 and the second cleaning station 22 are arranged side by side on the Y axis positive direction side of the second transfer area 23, and the unloading station 24 is on the Y axis negative direction side of the second transfer area 23. Arranged side by side.

  The delivery station 21 is disposed adjacent to the peeling station 15 of the first processing block 10. In the delivery station 21, a delivery process for receiving the peeled support substrate S from the peeling station 15 and delivering it to the second cleaning station 22 is performed.

  In the delivery station 21, a second transfer device 211 is arranged. The second transport device 211 has a non-contact holding unit such as a Bernoulli chuck, for example, and the peeled support substrate S is transported in a non-contact manner by the second transport device 211.

  In the second cleaning station 22, a second cleaning process for cleaning the support substrate S after peeling is performed. In the second cleaning station 22, a second cleaning device for cleaning the support substrate S after being peeled is disposed. As a 2nd washing | cleaning apparatus, the washing | cleaning apparatus of Unexamined-Japanese-Patent No. 2013-033925 can be used, for example.

  In the second transport region 23, a third transport device 231 that transports the support substrate S after peeling is disposed. The third transfer device 231 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the second transfer region 23, the third transfer device 231 performs a process of transferring the peeled support substrate S to the carry-out station 24.

  The unloading station 24 is provided with a plurality of cassette mounting tables. On each cassette mounting table, a cassette Cs in which the support substrate S after peeling is stored is mounted.

  Further, the peeling system 1 includes a control device 30. The control device 30 is a device that controls the operation of the peeling system 1. The control device 30 is a computer, for example, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 by reading and executing the program stored in the storage unit.

  Note that such a program may be recorded on a computer-readable recording medium and may be installed in the storage unit of the control device 30 from the recording medium. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the peeling system 1 configured as described above, first, the first transport device 121 of the first processing block 10 takes out the superposed substrate T from the cassette Ct placed on the carry-in / out station 11 and takes out the superposed substrate T taken out. Is carried into the standby station 13.

  Subsequently, in the standby station 13, the ID reading device performs an ID reading process for reading the ID of the dicing frame F. The ID read by the ID reading device is transmitted to the control device 30. Thereafter, the superposed substrate T is taken out from the standby station 13 by the first transfer device 121 and carried into the edge cut station 14.

  In the edge cut station 14, the edge cut device performs an edge cut process on the superposed substrate T. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S are easily separated in the subsequent peeling process. Therefore, the time required for the peeling process can be shortened.

  Thus, in the peeling system 1 according to the present embodiment, since the edge cut station 14 is incorporated in the first processing block 10, the superposed substrate T carried into the first processing block 10 is transferred to the first transfer device 121. And can be directly carried into the edge cut station 14. Accordingly, the throughput of a series of substrate processing can be improved. Moreover, the time from the edge cut process to the peeling process can be easily managed, and the peeling performance can be stabilized.

  Note that, for example, when a superposed substrate T waiting for processing is generated due to a difference in processing time between apparatuses, the superposed substrate T can be temporarily kept in a standby state using a temporary standby unit provided in the standby station 13, Loss time between a series of steps can be shortened.

  Subsequently, the superposed substrate T after the edge cut processing is taken out from the edge cut station 14 by the first transfer device 121 and is carried into the peeling station 15. And the peeling apparatus arrange | positioned in the peeling station 15 performs the peeling process with respect to the superposition | polymerization board | substrate T. FIG. By the peeling process, the superposed substrate T is separated into the substrate to be processed W and the support substrate S.

  The substrate to be processed W after peeling is taken out from the peeling station 15 by the first transfer device 121 and is carried into the first cleaning station 16. In the first cleaning station 16, the first cleaning device performs a first cleaning process on the substrate W after being peeled. By the first cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed.

  The substrate W to be processed after the first cleaning process is taken out from the first cleaning station 16 by the first transfer device 121 and stored in the cassette Cw placed on the carry-in / out station 11. Thereafter, the cassette Cw is taken out from the carry-in / out station 11 and collected. Thus, the process for the substrate to be processed W is completed.

  On the other hand, in the 2nd processing block 20, the process with respect to the support substrate S after peeling is performed in parallel with the process in the 1st processing block 10 mentioned above.

  In the second processing block 20, first, the second transfer device 211 disposed at the delivery station 21 takes out the support substrate S after peeling from the peeling station 15 and carries it into the second cleaning station 22.

  Here, the support substrate S after peeling is in a state in which the upper surface side, that is, the non-joint surface Sn side is held by the peeling device, and the second transport device 211 does not move the joint surface Sj side of the support substrate S from below. Hold in contact. Thereafter, the second transfer device 211 inverts the held support substrate S and places it on the second cleaning device of the second cleaning station 22. As a result, the support substrate S is placed on the second cleaning device with the bonding surface Sj where the adhesive G remains remaining facing upward. Then, the second cleaning device performs a second cleaning process for cleaning the bonding surface Sj of the support substrate S. By the second cleaning process, the adhesive G remaining on the bonding surface Sj of the support substrate S is removed.

  The support substrate S after the second cleaning process is taken out from the second cleaning station 22 by the third transfer device 231 disposed in the second transfer region 23 and accommodated in the cassette Cs placed on the carry-out station 24. . Thereafter, the cassette Cs is taken out from the carry-out station 24 and collected. Thus, the process for the support substrate S is also completed.

  As described above, the peeling system 1 according to the present embodiment has a front end (the carry-in / out station 11 and the first transfer device 121) for the substrate (the superposed substrate T and the target substrate W after being peeled) fixed to the dicing frame F. ) And a front end (unloading station 24 and third transfer device 231) for a substrate (support substrate S after peeling) that is not held by the dicing frame F. This makes it possible to perform in parallel the process of transporting the substrate to be processed W to the carry-in / out station 11 and the process of transporting the support substrate S to the carry-out station 24. Therefore, a series of substrate processing is performed efficiently. be able to.

  In the peeling system 1 according to the present embodiment, the peeling station 15 and the second cleaning station 22 are connected via the delivery station 21. As a result, it is possible to directly carry the peeled support substrate S from the peeling station 15 to the second cleaning station 22 without going through the first transfer area 12 and the second transfer area 23. The support substrate S can be transported smoothly.

  The first processing block 10 may include a mount device for attaching the dicing frame F to the superposed substrate T. In such a case, the superposed substrate T to which the dicing frame F is not attached is taken out from the cassette Ct and loaded into the mounting device. After the dicing frame F is attached to the superposed substrate T in the mounting device, the superposed substrate fixed to the dicing frame F is used. T is sequentially transferred to the edge cut station 14 and the peeling station 15. Note that the mounting device may be arranged, for example, by moving the edge cut station 14 to the second processing block 20 and placing it at the place where the edge cut station 14 was provided.

<2. Configuration of peeling apparatus>
Next, the structure of the peeling apparatus installed in the peeling station 15 will be described with reference to FIG. FIG. 4 is a schematic side view showing the configuration of the peeling apparatus according to this embodiment.

  As shown in FIG. 4, the peeling device 5 includes a processing chamber 100. A loading / unloading port (not shown) is provided on the side surface of the processing chamber 100. The carry-in / out port is provided on each of the first transfer area 12 side and the delivery station 21 side.

  The peeling apparatus 5 includes a first holding unit 50, a moving unit 61, a first additional moving unit 62, a second additional moving unit 63, a second holding unit 70, a frame holding unit 80, and a peeling attraction unit 90. These are disposed inside the processing chamber 100.

  The peeling device 5 sucks and holds the support substrate S side of the superposed substrate T from above by the first holding unit 50 and holds the target substrate W side of the superposed substrate T by sucking and holding from below by the second holding unit 70. Then, the peeling apparatus 5 sequentially moves the moving unit 61, the first additional moving unit 62, and the second additional moving unit 63 to move the support substrate S in the direction away from the plate surface of the substrate W to be processed. Thereby, the support substrate S held by the first holding unit is continuously peeled from the substrate W to be processed from one end to the other end. Hereinafter, each component will be specifically described.

  The first holding part 50 includes a contact part 51, an elastic member 52, a first suction part 53, a second suction part 54, and a third suction part 55.

  The contact portion 51 is a member having a disk shape having substantially the same diameter as the support substrate S, and contacts the non-joint surface Sn of the support substrate S. A plurality of suction ports (not shown here) are formed on the contact surface of the contact portion 51 with the support substrate S.

  The elastic member 52 is a thin plate-like member having a disk shape having substantially the same diameter as the contact portion 51, and is provided on the surface of the contact portion 51 opposite to the contact surface with the support substrate S.

  The first suction part 53, the second suction part 54, and the third suction part 55 are connected to each suction port of the contact part 51 via the elastic member 52. The first suction unit 53, the second suction unit 54, and the third suction unit 55 are connected to suction devices 532, 542, and 552 such as a vacuum pump via suction pipes 531, 541, and 551.

  The first holding unit 50 sucks the non-joint surface Sn (see FIG. 2) of the support substrate S from each suction port of the contact unit 51 using the suction force generated by the suction devices 532, 542, and 552. The support substrate S side of the superposition substrate T is sucked and held.

  The moving part 61, the first additional moving part 62, and the second additional moving part 63 are connected to the first suction part 53, the second suction part 54, and the third suction part 55 of the first holding part 50, respectively. The moving unit 61 moves the first suction unit 53, the first additional moving unit 62 moves the second suction unit 54, and the second additional moving unit 63 moves the third suction unit 55 vertically upward.

  The moving unit 61, the first additional moving unit 62, and the second additional moving unit 63 are supported by the upper base unit 103, and the first holding unit 50 is configured by the moving unit 61, the first additional moving unit 62, and the second additional moving unit 63. It is supported by the upper base part 103 via the moving part 63. Further, the upper base portion 103 is supported by the fixing member 101 attached to the ceiling portion of the processing chamber 100 via the support column 102.

  Here, specific configurations of the first holding unit 50, the moving unit 61, the first additional moving unit 62, and the second additional moving unit 63 described above will be described with reference to FIGS. FIG. 5 is a schematic side view showing configurations of the first holding unit 50, the moving unit 61, the first additional moving unit 62, and the second additional moving unit 63. FIG. 6 is a schematic bottom view of the contact portion 51.

  As shown in FIG. 5, the contact portion 51 includes a plurality of suction ports 511, 512, and 513 on the contact surface with the support substrate S.

  The suction ports 511, 512, and 513 are arranged side by side along the peeling progress direction (here, the X-axis positive direction). Specifically, the suction port 511 is provided at a position corresponding to an outer peripheral portion (a portion where a later-described peeling start site M is formed) serving as a starting point of peeling in the outer peripheral portion of the contact portion 51. In addition, the suction port 512 and the suction port 513 are arranged on the end point side of peeling (X-axis positive direction side) from the suction port 511, and are arranged in the order of the suction port 512 and the suction port 513 along the progressing direction of peeling. Be placed.

  A first suction portion 53, a second suction portion 54, and a third suction portion 55 are connected to the suction ports 511, 512, and 513, respectively.

  Further, as shown in FIG. 6, the suction region 510 included in the contact portion 51 is partitioned into a plurality of individual regions 514, 515, and 516. The individual regions 514 to 516 are arranged in the order of the individual region 514, the individual region 515, and the individual region 516 along the peeling progress direction (X-axis positive direction). The individual region 514 is provided with a suction port 511, the individual region 515 is provided with a suction port 512, and the individual region 516 is provided with a suction port 513.

  As described above, in the first holding unit 50 according to the present embodiment, the suction region 510 of the contact unit 51 is partitioned into the plurality of individual regions 514 to 516, and the first suction unit 53, the second suction unit 54, and the third The suction part 55 is provided corresponding to the individual areas 514 to 516.

  Thereby, the 1st holding | maintenance part 50 can adsorb-hold the support substrate S for every separate area | region 514-516. Therefore, for example, even if a suction leak occurs in any of the individual regions 514 to 516, the support substrate S can be held in the other individual regions 514 to 516.

  The suction region 510 included in the contact portion 51 is partitioned into individual regions 514 to 516 by arcs a1 and a2 that swell in the peeling progress direction (X-axis positive direction).

  The separation of the support substrate S from the target substrate W proceeds in an arc shape in plan view. Therefore, by partitioning the suction region 510 with the arcs a1 and a2 that swell in the peeling progress direction (X-axis positive direction), the support substrate S in the middle of peeling can be more appropriately sucked and held. It is possible to prevent the support substrate S from being detached from the first holding unit 50.

  The boundary line of the separation between the support substrate S and the substrate to be processed W is arcuate as described above in the initial stage of peeling, but as the peeling progresses, the direction perpendicular to the progressing direction of the peeling (Y It gradually changes to a straight line extending in the axial direction.

  For this reason, it is preferable that the arcs a1 and a2 that define the adsorption region 510 have a smaller curvature (that is, closer to a straight line) as they approach the end point of peeling. In the case of this example, it is preferable that the curvature of the arc a2 on the peeling end point side is smaller than the curvature of the arc a1 on the peeling start side.

  Further, grooves for spreading the suction force from the suction port 512 and the suction port 513 are formed in the individual region 515 and the individual region 516, respectively. Here, the shape of the grooves formed in the individual region 515 and the individual region 516 will be described with reference to FIGS. 7A and 7B. 7A is a schematic bottom view showing the shape of the groove formed in the individual region 515, and FIG. 7B is a schematic bottom view showing the shape of the groove formed in the individual region 516.

  As shown in FIG. 7A, a plurality of arc-shaped grooves 517 swelled in the peeling progress direction are formed in the individual region 515 arranged on the separation start side with respect to the individual region 516. On the other hand, as shown in FIG. 7B, a linear groove 518 extending in a direction (Y-axis direction) perpendicular to the peeling progress direction is formed in the individual region 516 arranged on the end point side of the peeling from the individual region 515. A plurality of are formed.

  As described above, the boundary line between the support substrate S and the substrate to be processed W changes from an arc shape to a linear shape as the separation progresses. Therefore, by forming the grooves of the individual regions 515 and the individual regions 516 in accordance with the shape of the separation boundary line that changes depending on the progress stage of the separation, the support substrate S in the middle of the separation can be more appropriately attracted and held. It is possible to prevent the support substrate S from being detached from the first holding unit 50 during the peeling process.

  The individual region 514 is not formed with a groove because the suction region is relatively narrow. However, in the case where a groove is also formed in the individual region 514, the individual region 514 swells in the direction of separation in the same manner as the individual region 515. An arcuate groove may be formed.

  Here, arc-shaped grooves are formed in the individual regions 515, and linear grooves are formed in the individual regions 516. However, peeling is performed on the individual regions 515 and the individual regions 516 or on the entire suction region 510. An arc-shaped groove that swells in the traveling direction may be formed.

  Further, the contact portion 51 is flexible so that its shape can be changed flexibly when pulled by the moving portion 61, the first additional moving portion 62, and the second additional moving portion 63 described later. It is formed with the member which has. Specifically, the contact portion 51 is formed of a resin such as rubber.

  That is, the first holding unit 50 sucks and holds the substantially entire surface of the support substrate S by bringing the contact portion 51 having flexibility into contact with the substantially entire surface of the support substrate S. For this reason, it is possible to peel the support substrate S from the substrate to be processed W without applying a large load to the substrate to be processed W in the peeling processing described later.

  Returning to FIG. 5, the elastic member 52 will be described. The elastic member 52 is formed by, for example, a leaf spring. By providing the elastic member 52 in the abutting portion 51 having flexibility, it is possible to force the advancing direction of peeling, and it is possible to more appropriately peel the substrate to be processed W and the support substrate S.

  As shown in FIG. 5, the elastic member 52 is divided into a plurality of (here, three) elastic member pieces 521, 522, and 523 corresponding to the individual regions 514 to 516 of the contact portion 51.

  FIG. 8 is a schematic plan view of the elastic member 52. As shown in FIG. 8, the elastic member 52 is divided into three elastic member pieces 521, 522, and 523 by a straight line extending in a direction (Y-axis direction) orthogonal to the peeling progress direction (X-axis direction). These elastic member pieces 521, 522, and 523 are arranged in the order of the elastic member piece 521, the elastic member piece 522, and the elastic member piece 523 along the advancing direction of peeling.

  The moving unit 61 includes a horizontal member 611, a support member 612, a moving mechanism 613, and a load cell 614.

  The horizontal member 611 is a plate-like member extending along the peeling progress direction (X-axis direction), and one end portion on the X-axis positive direction side is fixed to the upper portion of the first suction portion 53.

  The column member 612 is a member extending in the vertical direction (Z-axis direction), one end is connected to the other end of the horizontal member 611, and the other end is connected to the moving mechanism 613 via the upper base portion 103. Is done.

  The moving mechanism 613 is fixed to the upper part of the upper base part 103, and moves the column member 612 connected to the lower part in the vertical direction.

  The moving unit 61 moves the support member 612 and the horizontal member 611 vertically upward by the moving mechanism 613, so that a part of the outer periphery of the first holding unit 50, specifically, the individual region of the contact unit 51 is used. 514 (see FIG. 6) is pulled up via the elastic member piece 521 and the first suction part 53.

  As shown in FIG. 5, the column member 612 serving as a lifting force point is disposed on the opposite side of the peeling progress direction from the first suction portion 53 serving as a lifting support point. For this reason, a clockwise rotational force (moment) in FIG. 5 is generated at the outer edge portion (the peeling start position, which corresponds to a “peeling start site M” to be described later) of the superposed substrate T, which serves as a pulling action point. To do. Thereby, since the moving part 61 can pull the support substrate S so as to be turned up from the outer edge part, the support substrate S can be efficiently peeled from the substrate W to be processed.

  In addition, the moving unit 61 can detect the load applied to the column member 612 by the load cell 614. Therefore, the moving part 61 can pull the individual area 514 of the contact part 51 while controlling the force applied to the support substrate S based on the detection result by the load cell 614.

  The first additional moving unit 62 and the second additional moving unit 63 also have substantially the same configuration as the moving unit 61. Specifically, the first additional moving unit 62 includes a horizontal member 621, a support member 622, a moving mechanism 623, and a load cell 624. The first additional moving unit 62 moves the support member 622 and the horizontal member 621 vertically upward by the moving mechanism 623, thereby moving the individual region 515 (see FIG. 6) of the contact portion 51 to the elastic member piece 522 and the second member 522. Pull up through the suction part 54.

  The second additional moving unit 63 includes a horizontal member 631, a support member 632, a moving mechanism 633, and a load cell 634. The second additional moving unit 63 moves the support member 632 and the horizontal member 631 vertically upward by the moving mechanism 633, thereby moving the individual region 516 (see FIG. 6) of the contact unit 51 to the elastic member piece 523 and the third member 63. Pull up through the suction part 55.

  Similarly to the moving unit 61, the first additional moving unit 62 and the second additional moving unit 63 also have the second suction unit 54 and the third suction unit in which the column members 622 and 632 serving as lifting force points serve as lifting points. It is arranged closer to the starting point of peeling than 55. Therefore, the first additional moving unit 62 and the second additional moving unit 63 can pull the second suction unit 54 and the third suction unit 55 so as to turn up the second suction unit 54 and the third suction unit 55, respectively. It can be made to peel efficiently.

  When the support substrate S is peeled from the substrate W, the greatest force is required to peel the outermost part of the support substrate S corresponding to the peeling start site M, which will be described later, that is, the region on the most starting point side of peeling. . Therefore, it is preferable that the horizontal members 611, 621, and 631 have the longest horizontal member 611 disposed on the starting side.

  Returning to FIG. 4, the other structure of the peeling apparatus 5 is demonstrated. The second holding unit 70 is disposed below the first holding unit 50.

  The second holding unit 70 holds the target substrate W side of the superposed substrate T by suction through the dicing tape P. The second holding unit 70 includes a disc-shaped main body 71 and a support member 72 that supports the main body 71.

  The main body 71 is made of a metal member such as aluminum. An adsorption surface 73 is provided on the upper surface of the main body 71. The adsorption surface 73 is a porous body, and is formed of a resin member such as PCTFE (polychlorotrifluoroethylene).

  A suction space 74 that communicates with the outside through the suction surface 73 is formed inside the main body 71. The suction space 74 is connected to an intake device 712 such as a vacuum pump via an intake pipe 711. The second holding unit 70 uses the negative pressure generated by the intake air of the intake device 712, and adsorbs the non-joint surface Wn of the substrate W to be processed to the adsorption surface 73 via the dicing tape P. Adsorb and hold.

  The suction surface 73 of the main body 71 is formed to have a slightly larger diameter than the substrate W to be processed. Thereby, since the suction leakage at the peripheral edge of the substrate to be processed W can be prevented, the superposed substrate T can be more securely attracted and held.

  In addition, if a non-adsorption portion such as a groove is formed on the adsorption surface with the substrate W to be processed, there is a possibility that a crack may occur in the substrate W to be processed in the non-adsorption portion. Therefore, the suction surface 73 of the main body 71 is a flat surface having no non-suction part such as a groove. Thereby, it is possible to prevent the generation of cracks in the substrate W to be processed. Furthermore, since the adsorption surface 73 is formed of a resin member such as PCTFE, damage to the substrate W to be processed can be further suppressed.

  A frame holding unit 80 that holds the dicing frame F from below is disposed outside the second holding unit 70. The frame holding unit 80 includes a plurality of suction pads 81 that suck and hold the dicing frame F, a support member 82 that supports the suction pad 81, and a moving mechanism 83 that moves the support member 82 in the vertical direction.

  The suction pads 81 are formed of an elastic member such as rubber, and are provided at positions corresponding to, for example, the four corners of the dicing frame F shown in FIG. The suction pad 81 is formed with a suction port (not shown), and an intake device 822 such as a vacuum pump is connected to the suction port via a support member 82 and an intake pipe 821.

  The frame holding unit 80 holds the dicing frame F by adsorbing the dicing frame F using the negative pressure generated by the intake air of the intake device 822. The frame holding unit 80 moves the dicing frame F sucked and held by the suction pad 81 in the vertical direction by moving the support member 82 and the suction pad 81 in the vertical direction by the moving mechanism 83.

  The second holding part 70 and the frame holding part 80 are supported from below by the lower base part 104. Further, the lower base portion 104 is supported by a rotary lifting mechanism 105 fixed to the floor surface of the processing chamber 100.

  The rotation raising / lowering mechanism 105 rotates the lower base part 104 around the vertical axis to integrally rotate the second holding part 70 and the frame holding part 80 supported by the lower base part 104. Further, the rotary lifting mechanism 105 moves the lower base portion 104 in the vertical direction, thereby lifting and lowering the second holding portion 70 and the frame holding portion 80 supported by the lower base portion 104 integrally.

  A peeling inducement 90 is disposed outside the second holding unit 70. The peeling attraction part 90 forms a part on the side surface of the superposed substrate T that causes the support substrate S to be peeled off from the substrate W to be processed.

  The peeling attraction unit 90 includes a sharp member 91, a moving mechanism 92, and an elevating mechanism 93. The sharp member 91 is, for example, a flat blade, and is supported by the moving mechanism 92 such that the blade edge protrudes toward the superposed substrate T.

  The moving mechanism 92 moves the sharp member 91 along a rail extending in the X-axis direction. The elevating mechanism 93 is fixed to the upper base portion 103, for example, and moves the moving mechanism 92 in the vertical direction. Thereby, the height position of the sharp member 91, that is, the contact position with the side surface of the superposed substrate T is adjusted.

  The peeling attraction portion 90 adjusts the height position of the sharp member 91 using the lifting mechanism 93 and then moves the sharp member 91 in the horizontal direction (here, the X-axis positive direction) using the moving mechanism 92. Thus, the sharp member 91 is brought into contact with the side surface of the support substrate S near the adhesive G. As a result, a portion (hereinafter referred to as a “peeling start portion”) that causes the support substrate S to be peeled off from the substrate W is formed on the superposed substrate T.

<3. Operation of peeling device>
Next, a specific operation of the peeling apparatus 5 will be described with reference to FIGS. 9 and 10A to 10G. FIG. 9 is a flowchart showing a processing procedure of the peeling process. 10A to 10G are explanatory diagrams of the peeling operation. Note that the peeling device 5 executes each processing procedure shown in FIG. 9 based on the control of the control device 30.

  When the superposed substrate T fixed to the dicing frame F is carried into the processing chamber 100, the peeling device 5 first connects the second substrate 70 and the dicing frame F to the second substrate 70 and the dicing frame F, respectively. The frame holding unit 80 is used to suck and hold from below (step S101). At this time, as shown in FIG. 10A, the target substrate W and the dicing frame F are held by the second holding unit 70 and the frame holding unit 80 in a state where the dicing tape P is stretched horizontally.

  Subsequently, the peeling device 5 lowers the frame holding unit 80 by using the moving mechanism 83 (see FIG. 4) of the frame holding unit 80, and lowers the dicing frame F held by the frame holding unit 80 (step S102). ). Thereby, the space for making the sharp member 91 of the peeling induction part 90 advance toward the superposition | polymerization board | substrate T is ensured (refer FIG. 10B).

  Subsequently, the peeling device 5 performs a peeling attraction process using the peeling attraction unit 90 (step S103). In the peeling attraction process, a part (peeling start part) that causes the support substrate S to peel from the target substrate W is formed on the superposed substrate T (see FIG. 10C).

  Here, the content of the peeling attraction process will be specifically described with reference to FIGS. 11A to 11C. FIG. 11A to FIG. 11C are operation explanatory diagrams of the peeling attraction process.

  In this peeling attraction process, the substrate W to be processed among the superposed substrates T is held by the second holding unit 70, the dicing frame F is held by the frame holding unit 80, and This is performed before the support substrate S is held by the first holding unit 50. That is, the peeling attraction process is performed in a state where the support substrate S is free.

  The peeling apparatus 5 adjusts the height position of the sharp member 91 using the lifting mechanism 93 (see FIG. 4), and then moves the sharp member 91 toward the side surface of the superposed substrate T using the moving mechanism 92. Specifically, as shown in FIG. 11A, the sharp member 91 is moved substantially horizontally toward the side surface of the support substrate S near the adhesive G among the side surfaces of the superposed substrate T.

  Here, the “side surface of the support substrate S near the adhesive G” is the side surface of the support substrate S that is closer to the bonding surface Sj than the position h that is half the thickness of the support substrate S. Specifically, the side surface of the support substrate S is formed in a substantially arc shape in a sectional view, and the “side surface of the support substrate S near the adhesive G” is an angle formed with the inclined surface 91 a of the cutting edge of the sharp member 91. It is a side surface where θ is 0 degree or more and less than 90 degrees.

  The sharp member 91 is a single flat blade, and is supported by the moving mechanism 92 with the inclined surface 91a facing upward. As described above, when the single flat blade with the inclined surface 91a facing the support substrate S side is used as the sharp member 91, the sharp member 91 enters the superposed substrate T as compared with the case where both flat blades are used. The load received by the substrate to be processed W can be suppressed.

  The peeling apparatus 5 first advances the sharp member 91 to a predetermined position (preliminary advance). Thereafter, the peeling device 5 further advances the sharp member 91 to bring the sharp member 91 into contact with the side surface of the support substrate S near the adhesive G. For example, a load cell (not shown) is provided in the peeling attraction unit 90, and the peeling device 5 detects the load applied to the sharp member 91 using the load cell, so that the sharp member 91 is supported by the support substrate. Detecting contact with S.

  As described above, the side surface of the support substrate S is formed in a substantially arc shape in a sectional view. Therefore, when the sharp member 91 contacts the side surface of the support substrate S near the adhesive G, an upward force is applied to the support substrate S.

  Subsequently, as illustrated in FIG. 11B, the peeling device 5 further advances the sharp member 91. Thereby, the support substrate S is pushed upward along the curvature of the side surface. As a result, a part of the support substrate S is peeled off from the adhesive G, and a peeling start site M is formed.

  Since the support substrate S is not yet held by the first holding unit 50 and is in a free state, the upward movement of the support substrate S is not hindered. In the process shown in FIG. 11B, the distance d1 for moving the sharp member 91 forward is, for example, about 2 mm.

  The peeling apparatus 5 may include a confirmation device that confirms that the peeling start site M has been formed. For example, an IR (Infrared) camera installed above the support substrate S can be used as the confirmation device.

  The reflectance of infrared rays varies depending on whether the support substrate S is peeled off from the substrate W to be processed or not. Therefore, by first imaging the support substrate S with an IR camera, image data showing the difference in the reflectance of infrared rays on the support substrate S is obtained. Such image data is transmitted to the control device 30, and the control device 30 can detect a part of the support substrate S peeled from the substrate W to be processed, that is, a peeling start part M.

  When the peeling start site M is detected, the peeling device 5 proceeds to the next process described later. On the other hand, when the peeling start site M is not detected in the control device 30, the peeling device 5 further advances the sharp member 91, for example, or retracts the sharp member 91 once to separate it from the support substrate S, and thereafter, FIG. The operation shown in FIG. 11B is performed again to form the separation start site M. Thus, the peeling start part M can be reliably formed by providing the confirmation apparatus which confirms the peeling state of the support substrate S, and operating the peeling apparatus 5 according to a peeling state.

  When the peeling start site M is formed, the peeling device 5 sharpens while lowering the second holding unit 70 and the frame holding unit 80 using the rotary lifting mechanism 105 (see FIG. 4) as shown in FIG. 11C. The member 91 is further advanced. As a result, a downward force is applied to the substrate W and the adhesive G, and an upward force is applied to the support substrate S supported by the sharp member 91. Thereby, the peeling start site | part M expands.

  In the process shown in FIG. 11C, the distance d2 for moving the sharp member 91 forward is, for example, about 1 mm.

  In this way, the peeling device 5 makes the peeling start site M that causes the support substrate S to be peeled off from the substrate W to be processed by overlapping the sharp substrate 91 against the side surface of the support substrate S near the adhesive G. It can be formed on the side surface.

  The support substrate S has a thickness of about 5 to 15 times that of the adhesive G. Therefore, compared with the case where the sharp member 91 is brought into contact with the adhesive G to form the peeling start portion, the vertical position control of the sharp member 91 is easy.

  Further, the sharp member 91 is brought into contact with the side surface of the support substrate S near the adhesive G, whereby a force in the direction of peeling the support substrate S from the substrate W to be processed (that is, an upward force) is applied to the support substrate S. be able to. In addition, since the portion near the outermost edge portion of the support substrate S is lifted, a force in the direction of peeling the support substrate S from the substrate W can be efficiently applied to the support substrate S.

  Further, as compared with the case where the sharp member 91 is abutted against the adhesive G, the possibility that the sharp member 91 contacts the substrate W to be processed can be reduced. Therefore, damage to the substrate W to be processed by the sharp member 91 can be prevented.

  The “side surface of the support substrate S near the adhesive G” is more preferably the side surface from the bonding surface Sj of the support substrate S to the position of ¼ of the thickness of the support substrate S, that is, the sharp member 91. It is preferable that the angle θ to be formed is a side face of 0 ° to 45 °. This is because as the angle θ formed with the sharp member 91 is smaller, the force for lifting the support substrate S can be increased.

  Further, when the adhesive force between the support substrate S and the adhesive G is relatively weak, as shown in FIG. 11A, the peeling is started simply by bringing the sharp member 91 into contact with the side surface of the support substrate S near the adhesive G. The site M can be formed. In this case, the operation shown in FIGS. 11B and 11C can be omitted.

  Further, when the adhesive force between the support substrate S and the adhesive G is relatively strong, the peeling device 5 further rotates the superposed substrate T around the vertical axis by using the rotary lifting mechanism 105 from the state shown in FIG. 11C, for example. You may let them. Thereby, since the peeling start site | part M expands in the circumferential direction of the superposition | polymerization board | substrate T, it can make it easy to peel the support substrate S from the to-be-processed substrate W. FIG.

  Here, the shape of the cutting edge of the sharp member 91 will be described with reference to FIGS. 12A to 12C. 12A to 12C are schematic plan views illustrating examples of the shape of the cutting edge of the sharp member 91.

  As shown in FIG. 12A, the cutting edge 911 of the sharp member 91 may be formed in a straight line in a plan view. However, as shown to FIG. 12A, the peripheral part of the support substrate S (superposition | polymerization board | substrate T) is circular arc shape. For this reason, when the cutting edge of the sharp member 91 is linearly formed in a plan view, the load is likely to concentrate on two points (P1 and P2 in FIG. 12A) of the cutting edge that intersect with the support substrate S in a plan view. Blade spillage may occur.

  Therefore, for example, as shown in FIG. 12B, the cutting edge 911 of the sharp member 91 may have a shape recessed in an arc along the shape of the outer peripheral portion of the support substrate S. Thereby, since the whole blade edge | tip 911 contacts the support substrate S equally, it can prevent that load concentrates on the specific location of the blade edge | tip 911. FIG.

  Further, as shown in FIG. 12C, the cutting edge 911 of the sharp member 91 may have a shape in which the center portion protrudes in an arc shape toward the support substrate S. Thereby, compared with the case where the blade edge 911 is formed in a straight line shape, a larger portion of the blade edge 911 can enter the superposed substrate T. Therefore, when an upward force is applied to the support substrate S, The load applied to the sharp member 91 can be received in a wider area, and concentration of the load can be prevented.

  In addition, when the shape of the blade edge | tip 911 is made into the shape shown to FIG. 12B, the support substrate S receives the force of an equal direction from the sharp member 91. FIG. On the other hand, when the shape of the blade edge 911 is the shape shown in FIG. 12C, the support substrate S receives a force in the direction of diffusion starting from the center of the blade edge 911 of the sharp member 91.

  When the peeling attraction process in step S103 is completed, the peeling device 5 raises the second holding unit 70 and the frame holding unit 80 by using the rotary elevating mechanism 105 (see FIG. 4), so that the superposed substrate T side of the support substrate S side. Is brought into contact with the contact portion 51 of the first holding portion 50 (see FIG. 10D). Then, the peeling device 5 starts the suction operation by the suction devices 532, 542, and 552, and holds the support substrate S by suction with the first holding unit 50 (step S104).

  Subsequently, the peeling device 5 operates the moving unit 61 (see FIG. 4) (step S105), and a part of the outer peripheral portion of the first holding unit 50 corresponding to the peeling start site M, that is, the individual region 514 ( 6) is moved away from the second holding part 70. Thereby, a part of outer peripheral part of the support substrate S peels from the to-be-processed substrate W (refer FIG. 10E).

  At this time, since the first additional moving unit 62 and the second additional moving unit 63 are not yet operated, the support substrate S is pressed from above by the first additional moving unit 62 and the second additional moving unit 63. Thus, a part of the outer peripheral portion is pulled by the moving portion 61. Therefore, a part of the outer periphery of the support substrate S can be efficiently peeled from the substrate to be processed W.

  In addition, since the elastic member 52 is divided into elastic member pieces 521 to 523, even when the elastic member piece 521 is pulled by the moving unit 61, an upward force is applied to the elastic member piece 522 and the elastic member piece 523. It's hard to take. Therefore, since it is easy to maintain the state where the support substrate S is pressed by the first additional movement unit 62 and the second additional movement unit 63, a part of the outer peripheral portion of the support substrate S is more efficiently separated from the substrate W to be processed. Can be made.

  Moreover, since the contact part 51 of the 1st holding | maintenance part 50 is formed with the resin member which has a softness | flexibility, when the moving part 61 pulls the 1st holding | maintenance part 50, it deform | transforms flexibly with this tension | pulling. . For this reason, the supporting substrate S can be peeled from the substrate to be processed W without applying a large load to the substrate to be processed W. In addition, since the contact portion 51 has flexibility, it is possible to apply “stickiness” to the force for peeling the support substrate S from the substrate W, so that the support substrate S can be efficiently peeled from the substrate W. be able to.

  Subsequently, the peeling device 5 operates the first additional moving unit 62 (see FIG. 4) (step S106), and separates the individual region 515 (see FIG. 6) of the first holding unit 50 from the second holding unit 70. Move in the direction. Thereby, the part adsorbed and held in the individual region 515 in the support substrate S is peeled off from the substrate to be processed W, following the outer peripheral portion of the support substrate S peeled off from the substrate W to be processed by the moving unit 61 (see FIG. 10F). .

  At this time, since the second additional moving unit 63 is not yet operated, the support substrate S is pulled by the first additional moving unit 62 while being pressed from above by the second additional moving unit 63. . Therefore, the portion of the support substrate S that is attracted and held in the individual region 515 can be efficiently peeled from the substrate W to be processed.

  As described above, since the elastic member 52 is divided into the elastic member pieces 521 to 523, even when the elastic member piece 522 is pulled by the first additional moving unit 62, the elastic member piece 523 faces upward. It is difficult to apply power. Therefore, since it is easy to maintain the state in which the support substrate S is pressed by the second additional moving unit 63, the portion of the support substrate S that is sucked and held in the individual region 515 can be more efficiently separated from the target substrate W. it can.

  Subsequently, the peeling device 5 operates the second additional moving unit 63 (see FIG. 4) (step S107) to separate the individual region 516 (see FIG. 6) of the first holding unit 50 from the second holding unit 70. Move in the direction. As a result, following the portion of the support substrate S that has been separated from the substrate W to be processed by the first additional moving unit 62, the portion of the support substrate S that is attracted and held in the individual region 516 is separated from the substrate W to be processed.

  As described above, after the separation unit 5 operates the moving unit 61, the first additional movement unit 62 and the second additional movement unit 63 are operated stepwise in order from the first additional movement unit 62 close to the separation starting side. Let Thereby, the support substrate S can be continuously peeled from the substrate W to be processed from one end to the other end.

  Thereafter, the peeling device 5 raises the individual regions 515 and 516 of the first holding unit 50 using the first additional moving unit 62 and the second additional moving unit 63, or the moving unit 61 and the first additional moving unit 62. Is used to lower the individual regions 514 and 515 to level the support substrate S, and the peeling process is completed (see FIG. 10G).

  As described above, the peeling device 5 according to this embodiment includes the first holding unit 50, the second holding unit 70, and the moving unit 61. The first holding unit 50 holds the support substrate S in the superposed substrate T in which the support substrate S (corresponding to an example of the first substrate) and the target substrate W (corresponding to an example of the second substrate) are bonded. The second holding unit 70 holds the substrate W to be processed among the superposed substrates T. The moving unit 61 moves a part of the outer periphery of the first holding unit 50 in a direction away from the second holding unit 70. In addition, the first holding unit 50 is flexible and is provided on the contact portion 51 that contacts substantially the entire surface of the support substrate S and the contact portion 51 on the support substrate S. And a first suction part 53 (corresponding to an example of a suction part) for sucking the surface. Therefore, according to the peeling apparatus 5 which concerns on this embodiment, efficiency improvement of a peeling process can be achieved.

<4. Other Embodiments>
In the embodiment described above, the elastic member 52 is divided to facilitate maintaining the state where the support substrate S is pressed by the first additional moving unit 62 and the second additional moving unit 63. Further, the contact portion 51 itself may be divided. FIG. 13 is a schematic bottom view illustrating the configuration of the contact portion according to the first modification. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  As shown in FIG. 13, in the contact portion 51 </ b> A according to the first modification, a part corresponding to the individual region 514 is divided from other parts.

  Here, as described above, when the support substrate S is peeled from the target substrate W, the greatest force is required to peel the region on the most starting point side of the peeling. Therefore, when the individual region 514 is pulled using the moving unit 61 by dividing the portion of the contact portion 51A corresponding to the individual region 514 provided on the most starting point side of peeling, the first additional moving unit 62 and The state in which the individual regions 515 and 516 are pressed down by the second additional moving unit 63 can be more reliably maintained, and a part of the outer peripheral portion of the support substrate S can be more reliably separated from the substrate W to be processed. it can.

  In the contact portion 51 </ b> A, a part corresponding to the individual area 515 may be further divided from a part corresponding to the individual area 516. That is, the contact portion 51A may be divided for each of the individual regions 514 to 516.

  In the embodiment described above, an example in which one suction port 511 to 513 is provided in each of the individual regions 514 to 516 of the contact portion 51 has been described. The suction port may be formed. FIG. 14 is a schematic bottom view showing the configuration of the contact portion according to the second modification.

  For example, as shown in FIG. 14, the contact portion 51 </ b> B according to the second modified example is further provided with respect to the individual region 515 in addition to the three suction ports 511 to 513 arranged along the advancing direction of peeling. Two suction ports 512A and 512B are provided. The suction port 512 and the suction ports 512A and 512B are arranged in an arc shape with respect to the individual region 515. In addition, the suction port 512 and the suction ports 512A and 512B may be connected to one intake device 542 (see FIG. 4), or may be connected to individual intake devices.

  Thus, by providing the plurality of suction ports 512, 512A, and 512B for one individual region 515, the support substrate S can be held more strongly.

  Here, an example in which a total of three suction ports 512, 512A, and 512B are provided for the individual region 515 is shown, but four or more suction ports may be provided for the individual region 515. Similarly, a plurality of suction ports may be provided in the individual area 514 and the individual area 516.

  Further, in the embodiment described above, an example in which the superposed substrate to be peeled is the superposed substrate T in which the substrate to be processed W and the support substrate S are bonded by the adhesive G has been described. However, the superposition | polymerization board | substrate used as the peeling object of a peeling apparatus is not limited to this superposition | polymerization board | substrate T. FIG. For example, in the peeling apparatus 5, in order to generate an SOI substrate, a superposed substrate in which a donor substrate on which an insulating film is formed and a substrate to be processed are bonded to each other can be a peeling target.

  Here, a method for manufacturing an SOI substrate will be described with reference to FIGS. 15A and 15B. 15A and 15B are schematic views showing a manufacturing process of the SOI substrate. As shown in FIG. 15A, the polymerization substrate Ta for forming the SOI substrate is formed by bonding the donor substrate K and the handle substrate H.

  The donor substrate K is a substrate in which the insulating film 6 is formed on the surface and the hydrogen ion implantation layer 7 is formed at a predetermined depth near the surface to be bonded to the handle substrate H. As the handle substrate H, for example, a silicon wafer, a glass substrate, a sapphire substrate, or the like can be used.

  In the peeling apparatus 5, for example, in a state where the donor substrate K is held by the first holding unit 50 and the handle substrate H is held by the second holding unit 70, a part of the outer peripheral portion of the polymerization substrate Ta is used using the moving unit 61. Is applied to the hydrogen ion implantation layer 7 formed on the donor substrate K. As a result, as shown in FIG. 15B, the silicon-silicon bond in the hydrogen ion implantation layer 7 is cut, and the silicon layer 8 is peeled from the donor substrate K. As a result, the insulating film 6 and the silicon layer 8 are transferred onto the upper surface of the handle substrate H, and the SOI substrate Wa is formed. The handle substrate H may be held by the first holding unit 50, and the donor substrate K may be held by the second holding unit 70.

  Further, in the embodiment described above, an example in the case where the target substrate W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and each region is divided. Adhesives with different adhesive strengths may be applied.

  In the above-described embodiment, an example in which the superposed substrate T is held by the dicing frame F has been described. However, the superposed substrate T is not necessarily held by the dicing frame F.

  In the above-described embodiment, an example in which the sharp member 91 included in the peeling attraction part 90 is a flat blade has been described. However, the sharp member 91 may be a razor blade, a roller blade, an ultrasonic cutter, or the like. Good.

  Further, in the above-described embodiment, the first additional moving part 62 is provided in a part corresponding to the individual area 515 of the contact part 51, and the second additional moving part 63 is a part corresponding to the individual area 516 of the contact part 51. However, the additional moving unit may be provided only in one of the part corresponding to the individual area 515 and the part corresponding to the individual area 516. Moreover, the peeling apparatus 5 does not necessarily need to be provided with an additional moving part.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

F Dicing frame P Dicing tape S Support substrate T Superposition substrate W Substrate 1 Peeling system 5 Peeling device 10 Peeling device 10 Peeling station 20 Peeling station 20 Second treatment block 30 Control device 50 First holding part 51 Contact part 52 Elastic member 53 1st suction part 54 2nd suction part 55 3rd suction part 61 movement part 62 1st additional movement part 63 2nd additional movement part 70 2nd holding part 80 frame holding part 90 peeling induction part 91 sharp member

Claims (12)

A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving unit that moves a part of the outer periphery of the first holding unit in a direction away from the second holding unit ;
One or a plurality of additional moving parts that move a part of the first holding part in a direction away from the second holding part ;
The first holding part is
A non- divided contact portion that has flexibility and contacts substantially the entire surface of the first substrate;
A suction part that is provided in the contact part and sucks a contact surface of the first substrate with the contact part ;
A thin plate-like elastic member provided on the surface of the contact portion opposite to the contact surface with the first substrate ;
The elastic member is
Divided into a plurality of elastic member pieces lined up along the direction of peeling,
The moving unit is
Among the plurality of elastic member pieces, provided corresponding to the elastic member pieces arranged on the most starting side of peeling,
The additional moving unit is
A peeling apparatus, wherein the peeling device is provided on at least one of the elastic member pieces other than the elastic member piece arranged on the most starting side of the peeling. The suction area of the contact portion is
Divided into multiple individual areas,
The suction part is
The peeling apparatus according to claim 1, wherein a plurality of the peeling areas are provided corresponding to the individual regions. A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A contact portion having flexibility and contacting substantially the entire surface of the first substrate;
A suction part that is provided in the contact part and sucks a contact surface of the first substrate with the contact part ;
The suction area of the contact portion is
Partitioned into a plurality of individual regions by one or more arcs that swell in the direction of peeling.
The suction part is
A plurality of peeling devices provided corresponding to the individual regions . The individual area provided on the end point side of peeling includes a linear groove extending in a direction orthogonal to the direction of progress of peeling, and at least one of the individual areas provided on the starting side of peeling from the individual area. 4. The peeling device according to claim 2, further comprising an arc-shaped groove that swells in a peeling direction. A first holding unit for holding the first substrate among the superposed substrates in which the first substrate and the second substrate are bonded;
A second holding unit for holding the second substrate among the superposed substrates;
A moving part that moves a part of the outer peripheral part of the first holding part in a direction away from the second holding part,
The first holding part is
A contact portion having flexibility and contacting substantially the entire surface of the first substrate;
A suction part that is provided in the contact part and sucks a contact surface of the first substrate with the contact part ;
The suction area of the contact portion is
Divided into multiple individual areas,
The suction part is
A plurality are provided corresponding to the individual areas,
The individual area provided on the end point side of peeling includes a linear groove extending in a direction orthogonal to the direction of progress of peeling, and at least one of the individual areas provided on the starting side of peeling from the individual area. Is provided with an arc-shaped groove that swells in the direction of peeling. The first holding part is
The peeling apparatus according to claim 3, further comprising a thin plate-like elastic member provided on a surface of the contact portion opposite to the contact surface with the first substrate. The peeling apparatus according to claim 6 , further comprising one or a plurality of additional moving units that move a part of the first holding unit in a direction away from the second holding unit. The elastic member is
Divided into a plurality of elastic member pieces lined up along the direction of peeling,
The moving unit is
Among the plurality of elastic member pieces, provided corresponding to the elastic member pieces arranged on the most starting side of peeling,
The additional moving unit is
The peeling device according to claim 7 , wherein the peeling device is provided on at least one of the elastic member pieces other than the elastic member piece arranged on the most starting point side of the peeling. The peeling apparatus according to claim 1, 7 or 8 , wherein the moving unit and the additional moving unit are operated in order from the one closer to the peeling start side. The contact portion is
6. The peeling apparatus according to claim 3, wherein a part corresponding to the individual region arranged on the most starting side of peeling is divided from other parts. A loading / unloading station on which a superposed substrate in which the first substrate and the second substrate are bonded is placed;
A substrate transfer device for transferring the superposed substrate placed on the carry-in / out station;
A peeling station where a peeling device for peeling the superposed substrate transferred by the substrate transfer device into the first substrate and the second substrate is disposed;
The peeling device is
A first holding unit for holding the first substrate among the superposed substrates;
A second holding unit for holding the second substrate among the superposed substrates;
A moving unit that moves a part of the outer periphery of the first holding unit in a direction away from the second holding unit ;
One or a plurality of additional moving parts that move a part of the first holding part in a direction away from the second holding part ;
The first holding part is
A non- divided contact portion that has flexibility and contacts substantially the entire surface of the first substrate;
A suction part that is provided in the contact part and sucks a contact surface of the first substrate with the contact part ;
Wherein a thin plate-shaped elastic member provided on a surface opposite to the contact surface of the first substrate at the contact portion,
The elastic member is
Divided into a plurality of elastic member pieces lined up along the direction of peeling,
The moving unit is
Among the plurality of elastic member pieces, provided corresponding to the elastic member pieces arranged on the most starting side of peeling,
The additional moving unit is
A peeling system provided on at least one of the elastic member pieces other than the elastic member piece arranged on the most starting point side of the peeling. A non- divided contact portion that contacts the substantially entire surface of the first substrate among the superposed substrates having the first substrate and the second substrate bonded to each other; and the contact portion, A suction portion for sucking a contact surface of the first substrate with the contact portion; and a thin plate-like elastic member provided on a surface opposite to the contact surface of the contact portion with the first substrate. An abutting step in which the abutting portion of the first holding portion divided into a plurality of elastic member pieces arranged in the direction of peeling is brought into contact with substantially the entire surface of the first substrate. ,
A first holding step of sucking and holding the first substrate by sucking the contact surface of the first substrate by the suction unit;
A second holding step of holding the second substrate of the superposed substrates by a second holding unit that holds the second substrate of the superposed substrates;
Among the plurality of elastic member pieces, the elastic member piece is provided corresponding to the elastic member piece arranged closest to the starting point of peeling, and a part of the outer peripheral part of the first holding part moves in a direction away from the second holding part. A moving step of moving a part of the outer peripheral portion of the first holding portion in a direction away from the second holding portion by the moving portion to be moved ;
1 provided on at least one of the elastic member pieces other than the elastic member piece arranged on the most starting point side of the peeling, and moving a part of the first holding part in a direction away from the second holding part. Or the peeling method characterized by including the additional movement process of moving a part of said 1st holding | maintenance part in the direction which leaves | separates from the said 2nd holding | maintenance part by several additional movement part .

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