JP5475116B2 - インクジェット印刷ヘッドアセンブリおよび印刷ヘッド集積回路 - Google Patents
インクジェット印刷ヘッドアセンブリおよび印刷ヘッド集積回路 Download PDFInfo
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Description
インク供給マニホルドと、
1つ又は複数の印刷ヘッド集積回路であって、各印刷ヘッド集積回路が、駆動回路及び複数のインクジェットノズルアセンブリを備える前面と、インク供給マニホルドに取り付けられた裏面と、裏面とインクジェットノズルアセンブリの間に流体連結を提供する少なくとも1つのインク供給チャネルとを有する、1つ又は複数の印刷ヘッド集積回路と、
駆動回路に電力を供給する少なくとも1つのコネクタ膜と、を備え、
コネクタ膜の接続端部が、インク供給マニホルドの少なくとも一部と1つ又は複数の印刷ヘッド集積回路の間に挟まれる、インクジェット印刷ヘッドアセンブリが提供される。
シリコン基板と、
駆動回路を備える少なくとも1つのCMOS層と、
インクジェットノズルアセンブリを備えるMEMS層と、を備え、
CMOS層は、シリコン基板とMEMS層の間に位置決めされる。
駆動回路及び複数のインクジェットノズルアセンブリを備える前面と、
インク供給マニホルドに取り付けるための裏面と、
裏面とインクジェットノズルアセンブリの間に流体連結を提供する少なくとも1つのインク供給チャネルとを有し、
裏面が、駆動回路に電力を供給するコネクタ膜の少なくとも一部を収容する凹状部分を有する、印刷ヘッド集積回路が提供される。
前面及び裏面を画定するシリコン基板と、
前面に位置決めされた複数のインクジェットノズルアセンブリと、
インクジェットノズルアセンブリに電力を供給する駆動回路と、
前面から裏面の方へ延びる1つ又は複数のシリコン貫通コネクタであって、駆動回路と1つ又は複数の対応する集積回路コンタクトの間に電気接続を提供するシリコン貫通コネクタとを備え、
集積回路コンタクトが、駆動回路に電力を供給する裏面に取り付けられたコネクタ膜に接続するように位置決めされる、印刷ヘッド集積回路が提供される。
1つ又は複数の印刷ヘッド集積回路を提供するステップであり、各印刷ヘッド集積回路が、駆動回路及び複数のインクジェットノズルアセンブリを備える前面と、1つ又は複数のインク入口及び凹状の縁部部分を有する裏面と、集積回路を通って延びる1つ又は複数のコネクタとを有し、各コネクタが、駆動回路に接続されたヘッド及び凹状の縁部部分内の基部を有する、ステップと、
印刷ヘッド集積回路の少なくとも1つの凹状の縁部部分内にコネクタ膜の接続端部を位置決めするステップであり、コネクタ膜が、複数の導電トラックを備え、各導電トラックが、接続端部にそれぞれの膜コンタクトを有する、ステップと、
各膜コンタクトを対応するコネクタの基部に接続させるステップと、
各印刷ヘッド集積回路の裏面をコネクタ膜とともにインク供給マニホルドに取り付けて、裏面電気接続を有するインクジェット印刷ヘッドアセンブリを提供するステップとを含む方法が提供される。
ウェーハを提供するステップであり、ウェーハが、ウェーハの前面に複数の部分的に製作されたノズルアセンブリと、前面からウェーハの裏面の方へ延びる1つ又は複数のシリコン貫通コネクタとを備える、ステップと、
ウェーハの前面に導電層を堆積させ、導電層をエッチングし、それに付随して、各ノズルアセンブリに対するアクチュエータ及び各シリコン貫通コネクタのヘッドを覆う前面接触パッドを形成するステップであり、前面接触パッドが、シリコン貫通コネクタをウェーハ内の駆動回路に接続させる、ステップと、
さらなるMEMS処理ステップを実行して、ノズルアセンブリ、ノズルアセンブリ向けのインク供給チャネル、及びシリコン貫通コネクタの形成を完成させるステップと、
ウェーハを複数の個々の印刷ヘッド集積回路に分割するステップであり、各印刷ヘッド集積回路が、シリコン貫通コネクタ及び接触パッドを介して駆動回路に裏面接続するように構成される、ステップと、を含む方法が提供される。
これまで出願人は、端部と端部が当接する構成でともにリンクさせてページ幅印刷ヘッドを画定できる印刷ヘッド集積回路(又は「チップ」)100について記載してきた。図1は、印刷ヘッドIC100の一部の前面を斜視図で示し、図2は、ともに当接する1対の印刷ヘッドICを示す。
次に図1に戻ると、印刷ヘッドIC100は、長手方向の縁部の1つに沿って延びる複数のボンドパッド105を有する。ボンドパッド105は、インクジェットノズル102の動作を制御するための印刷ヘッド制御装置(「SoPEC」)デバイスからデータ及び/又は電力を受け取る手段を提供する。
印刷ヘッドIC100へのワイヤボンド接続の固有の欠点のいくつかを考え、出願人は、裏面電気接続を使用し、したがって完全な平面であるインク射出面を有する印刷ヘッドIC2を開発した。
図14に示す印刷ヘッドIC2に対するMEMS製作プロセスについて、次に詳細に説明する。このMEMS製作プロセスは、TAB膜8への裏面接続に必要な特徴を組み込むために、米国特許出願第12/323,471号に記載のプロセスのいくつかの修正形態を含む。MEMSプロセスについて、本明細書では例示的な目的で詳細に説明するが、任意のインクジェットノズル製作プロセスの類似の修正形態も、裏面電気接続向けに構成された印刷ヘッド集積回路を提供するはずであることが、当業者には理解されるであろう。実際には、出願人は、図15に示す熱作動式の印刷ヘッドICを製作するのに適したMEMS製作プロセスについて、すでに言及してきた。したがって、本発明は、本明細書に後述する特定のノズルアセンブリ101に限定されるものではない。
Claims (8)
- インク供給マニホルドと、
1つ又は複数の印刷ヘッド集積回路と、を備えたインクジェット印刷ヘッドアセンブリであって、
各印刷ヘッド集積回路は、
・前面、前記インク供給マニホルドに取り付けられた裏面、および前記前面と前記裏面との間に流体連結を提供する少なくとも1つのインク供給チャネルを有するシリコン基板と、
・前記前面に設けられ、駆動回路を備える少なくとも1つのCMOS層と、
・複数のインクジェットノズルアセンブリを備えるMEMS層であって、前記CMOS層が前記シリコン基板と前記MEMS層との間に位置決めされるように前記CMOS層の上に配置されたMEMS層と、を備え、
前記インクジェット印刷ヘッドアセンブリは、前記駆動回路に電力を供給する少なくとも1つのコネクタ膜をさらに備え、
前記コネクタ膜の接続端部が、前記インク供給マニホルドの少なくとも一部と前記1つ又は複数の印刷ヘッド集積回路との間に挟まれ、
複数のシリコン貫通コネクタが、前記駆動回路と前記コネクタ膜の前記接続端部の間に電気接続を提供し、
各シリコン貫通コネクタが、前記MEMS層内の接触パッドから前記CMOS層を通って前記裏面の方へ直線的に延びており、前記接触パッドは前記CMOS層と電気的に接続され、
1つ又は複数の導体柱が、前記接触パッドと前記CMOS層の間に直線的に延びているインクジェット印刷ヘッドアセンブリ。 - 前記コネクタ膜が、複数の導電トラックを有する可撓性のポリマー膜を含む、請求項1に記載のインクジェット印刷ヘッドアセンブリ。
- 前記コネクタ膜が、テープ自動化ボンディング(TAB)膜である、請求項1に記載のインクジェット印刷ヘッドアセンブリ。
- 前記裏面が、前記コネクタ膜を収容する凹状部分を有する、請求項1に記載のインクジェット印刷ヘッドアセンブリ。
- 前記凹状部分が、各印刷ヘッド集積回路の長手方向の縁部領域に沿って画定される、請求項4に記載のインクジェット印刷ヘッドアセンブリ。
- 各シリコン貫通コネクタが、前記裏面の方へ先細りする、請求項1に記載のインクジェット印刷ヘッドアセンブリ。
- 各シリコン貫通コネクタが、銅から構成される、請求項1に記載のインクジェット印刷ヘッドアセンブリ。
- 印刷ヘッド集積回路であって、
・前面、インク供給マニホルドに取り付けられる裏面、および前記前面と前記裏面との間に流体連結を提供する少なくとも1つのインク供給チャネルを有するシリコン基板と、
・前記前面に設けられ、駆動回路を備える少なくとも1つのCMOS層と、
・複数のインクジェットノズルアセンブリを備えるMEMS層であって、前記CMOS層が前記シリコン基板と前記MEMS層との間に位置決めされるように前記CMOS層の上に配置されたMEMS層と、を備え、
複数のシリコン貫通コネクタが、前記MEMS層内の接触パッドから前記CMOS層を通って前記裏面の方へ直線的に延びており、前記接触パッドは前記CMOS層と電気的に接続され、
1つ又は複数の導体柱が、前記接触パッドと前記CMOS層の間に直線的に延びている印刷ヘッド集積回路。
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