JP4632289B2 - プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル - Google Patents
プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル Download PDFInfo
- Publication number
- JP4632289B2 JP4632289B2 JP2003575687A JP2003575687A JP4632289B2 JP 4632289 B2 JP4632289 B2 JP 4632289B2 JP 2003575687 A JP2003575687 A JP 2003575687A JP 2003575687 A JP2003575687 A JP 2003575687A JP 4632289 B2 JP4632289 B2 JP 4632289B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- guide frame
- receptacle assembly
- opening
- transceiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003860 storage Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 230000014759 maintenance of location Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 17
- 239000000758 substrate Substances 0.000 description 12
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000006261 foam material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
- H01R13/6584—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members formed by conductive elastomeric members, e.g. flat gaskets or O-rings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/939—Electrical connectors with grounding to metal mounting panel
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
104 リセプタクル組立体
106 ホスト基板(回路基板)
122 ガイドフレーム
128 上壁
130 下壁
132,134 側壁
138 内部収容室
150 ヒートシンク
152 クリップ
154 保持タブ
155 ばね部材
156 横レール
160 周辺面
162 係合面
170 切欠部
186 前部
188 後部
190,192 横部
194 開口
Claims (19)
- 電気モジュールを受容するよう構成された内部収容室を形成するために結合された上壁、下壁及び両側壁を有する金属製のガイドフレームであって、前記上壁、下壁及び両側壁の一つは該壁を貫通する開口を有するガイドフレームと、
前記開口上に実装されたヒートシンクと
を具備するリセプタクル組立体であって、
前記ヒートシンクは、前記ガイドフレームの前記内部収容室に隣接して配置された係合面を有し、
該係合面は、前記内部収容室内に設置される際に前記モジュールと物理的に接触するよう構成され、
前記開口が貫通された前記壁は、前記ヒートシンクが前記開口を覆うよう該開口上に実装される際に、前記ヒートシンクを支持し、
前記リセプタクル組立体は、前記ヒートシンク上に固定されるばね部材をさらに具備し、
該ばね部材は、前記モジュールが挿入される際に前記ヒートシンクが前記ガイドフレームから離れる外方に移動できるよう撓むと共に、前記ヒートシンクに所望の力を及ぼして熱伝導を促進することを特徴とするリセプタクル組立体。 - 前記開口は前記上壁に設けられ、
前記下壁は回路基板に実装されるよう構成されることを特徴とする請求項1記載のリセプタクル組立体。 - 前記開口は前記上壁に設けられ、
該上壁は、前記開口の周辺を画定し且つ前記開口上に実装される際に前記ヒートシンクを支持する前部、後部及び横部を有することを特徴とする請求項1記載のリセプタクル組立体。 - 前記開口は前記両側壁の切欠部を有し、
前記ヒートシンクは、前記切欠部内の前記両側壁の縁に載置されることを特徴とする請求項1記載のリセプタクル組立体。 - 前記リセプタクル組立体は、前記両側壁に形成された保持タブをさらに具備し、
該保持タブは、前記ガイドフレームに前記ヒートシンクを保持するクリップと係合することを特徴とする請求項1記載のリセプタクル組立体。 - 前記リセプタクル組立体は、前記ヒートシンク上に設けられたクリップをさらに具備し、
該クリップは、前記ガイドフレームに確実に係合して前記ガイドフレームに前記ヒートシンクを保持することを特徴とする請求項1記載のリセプタクル組立体。 - 前記リセプタクル組立体は、前記ガイドフレームの前記両側壁上にスナップ係合する横レールを有するクリップをさらに具備し、
前記横レールは、前記ヒートシンク上に延びると共に弾性的に係合するばね部材により連結されることを特徴とする請求項1記載のリセプタクル組立体。 - 前記ヒートシンクの前記係合面は、前記ガイドフレームの前記内部収容室内に延びるよう段状をなすことを特徴とする請求項1記載のリセプタクル組立体。
- 前記ヒートシンクは、前記係合面を取り囲む周辺面を有し、
該周辺面は、前記係合面を含む平面に対して凹んでいることを特徴とする請求項1記載のリセプタクル組立体。 - 前記モジュールが除去される際に、前記ヒートシンクの前記係合面は、前記モジュールの設置経路と干渉する高さで前記ガイドフレームの前記内部収容室内に位置し、
前記ヒートシンクは、前記モジュールが前記ヒートシンク及び前記モジュール間に当接接続部を提供するよう設置される際に、前記モジュールにより外方へ移動可能であることを特徴とする請求項1記載のリセプタクル組立体。 - 前記ヒートシンクの前記係合面は、前記モジュールの設置時に前記モジュールの上面に沿って摺動するよう平坦且つ円滑であることを特徴とする請求項1記載のリセプタクル組立体。
- 前記リセプタクル組立体は、前記ヒートシンクの前記係合面上に配置される熱接触材料をさらに具備し、
該熱接触材料は、前記モジュールが設置される際に、前記ヒートシンクの前記係合面と、該係合面に隣接する前記モジュールの面との間で圧縮されるよう構成されていることを特徴とする請求項1記載のリセプタクル組立体。 - 前記リセプタクル組立体は、前記両側壁の一方に形成された三角形の保持タブをさらに具備し、
該保持タブがクリップと係合することにより、前記ガイドフレームに対する水平及び垂直の移動から前記ヒートシンクを保持することを特徴とする請求項1記載のリセプタクル組立体。 - トランシーバを受容するよう構成された内部収容室を形成するために結合された上壁、下壁及び両側壁を有する金属製のガイドフレームであって、前記上壁、下壁及び両側壁の一つは該壁を貫通する開口を有するガイドフレームと、
前記開口上に実装されたヒートシンクと
を具備するトランシーバリセプタクル組立体であって、
前記ヒートシンクは、前記ガイドフレームの前記内部収容室に隣接して配置された係合面を有し、
該係合面は、前記内部収容室内に設置される際に前記トランシーバと物理的に接触するよう構成され、
前記開口が貫通された前記壁は、前記ヒートシンクが前記開口を覆うよう該開口上に実装される際に、前記ヒートシンクを支持し、
前記トランシーバリセプタクル組立体は、前記ヒートシンク上に固定されるばね部材を有するクリップをさらに具備し、
前記ばね部材は、前記トランシーバが挿入される際に、前記ガイドフレームから離れる外方へ前記ヒートシンクが移動できるよう撓み、
前記クリップは、前記ガイドフレームの前記両側壁上にスナップ係合する横レールを有することを特徴とするトランシーバリセプタクル組立体。 - 前記開口は、前記上壁、下壁及び両側壁の一つの前部、後部及び対向する横部により取り囲まれ、
該前部、後部及び横部は、前記開口の周辺を画定すると共に、前記ヒートシンクが前記内部収容室内に延びる最大距離を画定することを特徴とする請求項14記載のトランシーバリセプタクル組立体。 - 前記ヒートシンクの前記係合面は、前記ガイドフレームの前記内部収容室内に延びるよう段状をなすことを特徴とする請求項14記載のトランシーバリセプタクル組立体。
- 前記ヒートシンクは、前記係合面を取り囲む周辺面を有し、
該周辺面は、前記係合面を含む平面に対して凹んでいることを特徴とする請求項14記載のトランシーバリセプタクル組立体。 - 前記トランシーバが除去される際に、前記ヒートシンクの前記係合面は、前記トランシーバの設置経路と干渉する高さで前記ガイドフレームの前記内部収容室内に位置し、
前記ヒートシンクは、前記トランシーバが前記ヒートシンク及び前記トランシーバ間に当接接続部を提供するよう設置される際に、前記トランシーバにより外方へ移動可能であることを特徴とする請求項14記載のトランシーバリセプタクル組立体。 - 前記ヒートシンクの前記係合面は、前記トランシーバの設置時に前記トランシーバの上面に沿って摺動するよう平坦且つ円滑であることを特徴とする請求項14記載のトランシーバリセプタクル組立体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36218502P | 2002-03-06 | 2002-03-06 | |
US37286102P | 2002-04-16 | 2002-04-16 | |
PCT/US2003/006574 WO2003077626A1 (en) | 2002-03-06 | 2003-03-05 | Pluggable electronic module and receptacle with heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005520296A JP2005520296A (ja) | 2005-07-07 |
JP4632289B2 true JP4632289B2 (ja) | 2011-02-16 |
Family
ID=27807959
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003575470A Expired - Lifetime JP4251452B2 (ja) | 2002-03-06 | 2003-03-05 | トランシーバモジュール組立体のイジェクタ機構 |
JP2003575687A Expired - Lifetime JP4632289B2 (ja) | 2002-03-06 | 2003-03-05 | プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003575470A Expired - Lifetime JP4251452B2 (ja) | 2002-03-06 | 2003-03-05 | トランシーバモジュール組立体のイジェクタ機構 |
Country Status (5)
Country | Link |
---|---|
US (4) | US7001217B2 (ja) |
JP (2) | JP4251452B2 (ja) |
CN (2) | CN1314307C (ja) |
AU (4) | AU2003220046A1 (ja) |
WO (4) | WO2003077376A1 (ja) |
Families Citing this family (400)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060025786A1 (en) * | 1996-08-30 | 2006-02-02 | Verigen Transplantation Service International (Vtsi) Ag | Method for autologous transplantation |
US6980421B2 (en) * | 2002-06-28 | 2005-12-27 | Shuttle Inc. | Front panel for personal computer |
US6893293B2 (en) * | 2002-08-02 | 2005-05-17 | Finisar Corporation | Angled EMI shield for transceiver-PCB interface |
JP3982362B2 (ja) * | 2002-08-23 | 2007-09-26 | 住友電気工業株式会社 | 光データリンク |
JP2004111249A (ja) * | 2002-09-19 | 2004-04-08 | Fujitsu Component Ltd | コネクタ装置 |
US6916196B2 (en) * | 2003-03-22 | 2005-07-12 | Tyco Electronics Corporation | Push button de-latch mechanism for pluggable electronic module |
JP2004340373A (ja) * | 2003-04-21 | 2004-12-02 | Usui Kokusai Sangyo Kaisha Ltd | 外部制御式ファンクラッチの制御方法 |
US7627343B2 (en) | 2003-04-25 | 2009-12-01 | Apple Inc. | Media player system |
US6824416B2 (en) * | 2003-04-30 | 2004-11-30 | Agilent Technologies, Inc. | Mounting arrangement for plug-in modules |
US6776660B1 (en) | 2003-04-30 | 2004-08-17 | Japan Aviation Electronics Industry, Limited | Connector |
NL1023662C2 (nl) * | 2003-06-13 | 2004-12-14 | Framatome Connectors Int | Afschermingsbehuizing. |
JP3920256B2 (ja) * | 2003-10-02 | 2007-05-30 | 日本航空電子工業株式会社 | カード用コネクタ |
US6919505B2 (en) | 2003-12-04 | 2005-07-19 | Eaton Corporation | Electronic apparatus and enclosure employing substantially co-planar portions with mating crenellations |
US7090523B2 (en) * | 2004-01-06 | 2006-08-15 | Tyco Electronics Corporation | Release mechanism for transceiver module assembly |
US7406691B2 (en) | 2004-01-13 | 2008-07-29 | International Business Machines Corporation | Minimizing complex decisions to allocate additional resources to a job submitted to a grid environment |
US6872094B1 (en) * | 2004-03-01 | 2005-03-29 | Tyco Electronics Corporation | Transceiver pluggable module |
US6980437B2 (en) * | 2004-03-03 | 2005-12-27 | Tyco Electronics Corporation | Pluggable electronic receptacle with heat sink assembly |
JP4348725B2 (ja) * | 2004-03-25 | 2009-10-21 | Smk株式会社 | 電子部品取付用ソケット |
US7895378B2 (en) | 2004-04-27 | 2011-02-22 | Apple Inc. | Method and system for allowing a media player to transfer digital audio to an accessory |
US7441058B1 (en) | 2006-09-11 | 2008-10-21 | Apple Inc. | Method and system for controlling an accessory having a tuner |
US7293122B1 (en) | 2004-04-27 | 2007-11-06 | Apple Inc. | Connector interface system facilitating communication between a media player and accessories |
US8117651B2 (en) | 2004-04-27 | 2012-02-14 | Apple Inc. | Method and system for authenticating an accessory |
US7673083B2 (en) | 2004-04-27 | 2010-03-02 | Apple Inc. | Method and system for controlling video selection and playback in a portable media player |
US7441062B2 (en) | 2004-04-27 | 2008-10-21 | Apple Inc. | Connector interface system for enabling data communication with a multi-communication device |
US7529870B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player with multiple lingoes |
US7529872B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player using a protocol with multiple lingoes |
US7529871B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player with multiple protocol versions |
US7826318B2 (en) | 2004-04-27 | 2010-11-02 | Apple Inc. | Method and system for allowing a media player to transfer digital audio to an accessory |
US7526588B1 (en) | 2004-04-27 | 2009-04-28 | Apple Inc. | Communication between an accessory and a media player using a protocol with multiple lingoes |
EP1598686A3 (en) * | 2004-05-17 | 2005-12-07 | JDS Uniphase Corporation | RF absorbing strain relief bushing |
KR100617710B1 (ko) * | 2004-05-21 | 2006-08-28 | 삼성전자주식회사 | 플러그형 광송수신기 모듈의 체결 장치 |
US7266547B2 (en) | 2004-06-10 | 2007-09-04 | International Business Machines Corporation | Query meaning determination through a grid service |
JP2005352787A (ja) * | 2004-06-10 | 2005-12-22 | Matsushita Electric Ind Co Ltd | タイミング解析方法およびタイミング解析装置 |
US7422464B2 (en) * | 2004-07-07 | 2008-09-09 | Molex Incorporated | Mechanism for delatching small size plug connectors |
US7093985B2 (en) * | 2004-07-12 | 2006-08-22 | Protokraft, Llc | Wall mount fiber optic connector and associated method for forming the same |
US6991481B1 (en) * | 2004-07-16 | 2006-01-31 | Avonex Corporation | Method and apparatus for a latchable and pluggable electronic and optical module |
TWI251993B (en) * | 2004-08-06 | 2006-03-21 | Ind Tech Res Inst | Locking mechanism of removable optical module |
CN100360972C (zh) * | 2004-09-08 | 2008-01-09 | 财团法人工业技术研究院 | 一种可插拔式光学模块的伸出式闩锁结构 |
US7405931B2 (en) * | 2004-09-20 | 2008-07-29 | Nortel Networks Limited | Floating heatsink for removable components |
US7224582B1 (en) * | 2004-09-20 | 2007-05-29 | Nortel Networks Limited | Floating heatsink for removable components |
US7125261B2 (en) * | 2004-10-05 | 2006-10-24 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a pluggable function |
US20060078259A1 (en) * | 2004-10-12 | 2006-04-13 | Triquint Technology Holding Co. | Latching mechanism for small form factor pluggable modules |
GB2419470B (en) * | 2004-10-21 | 2009-04-29 | Agilent Technologies Inc | Temperature control of heat-generating devices |
GB2419476B (en) * | 2004-10-21 | 2009-04-08 | Agilent Technologies Inc | Optical networking systems |
US7033191B1 (en) | 2004-12-02 | 2006-04-25 | Optical Communication Products, Inc. | Pluggable optical transceiver with sliding actuator |
US7254034B2 (en) * | 2004-12-15 | 2007-08-07 | Lucent Technologies Inc. | Thermal management for shielded circuit packs |
US7322845B2 (en) * | 2004-12-16 | 2008-01-29 | Molex Incorporated | Connector delatching mechanism with return action |
US7309250B2 (en) * | 2004-12-16 | 2007-12-18 | Molex Incorporated | Plug connector ejector mechanism with integrated return action |
US7198414B2 (en) * | 2004-12-22 | 2007-04-03 | Finisar Corporation | Planar decoupling in optical subassembly |
US7249895B2 (en) * | 2004-12-22 | 2007-07-31 | Finisar Corporation | Optical transceiver with capacitive coupled signal ground with chassis ground |
US7511970B2 (en) * | 2004-12-27 | 2009-03-31 | Cisco Technology, Inc. | Method and apparatus for shielding a circuit board of a circuit board chassis |
US7859847B2 (en) * | 2004-12-29 | 2010-12-28 | Hewlett-Packard Development Company, L.P. | Spring adapted to hold electronic device in a frame |
US7590623B2 (en) | 2005-01-06 | 2009-09-15 | International Business Machines Corporation | Automated management of software images for efficient resource node building within a grid environment |
US7668741B2 (en) * | 2005-01-06 | 2010-02-23 | International Business Machines Corporation | Managing compliance with service level agreements in a grid environment |
US7525216B2 (en) | 2005-01-07 | 2009-04-28 | Apple Inc. | Portable power source to provide power to an electronic device via an interface |
US7823214B2 (en) | 2005-01-07 | 2010-10-26 | Apple Inc. | Accessory authentication for electronic devices |
US7562035B2 (en) | 2005-01-12 | 2009-07-14 | International Business Machines Corporation | Automating responses by grid providers to bid requests indicating criteria for a grid job |
US7571120B2 (en) | 2005-01-12 | 2009-08-04 | International Business Machines Corporation | Computer implemented method for estimating future grid job costs by classifying grid jobs and storing results of processing grid job microcosms |
US7349200B2 (en) * | 2005-02-04 | 2008-03-25 | Hewlett-Packard Development Company, L.P. | Latching mechanism |
JP4614803B2 (ja) * | 2005-03-25 | 2011-01-19 | 富士通株式会社 | Sfpモジュールの実装構造 |
JP4708827B2 (ja) * | 2005-03-29 | 2011-06-22 | フォート デザイン アンド デヴェロップメント | 光ファイバコネクタ解除機構 |
EP1708311B1 (en) * | 2005-03-29 | 2008-12-31 | Fourte Design & Development | Fiber optic transceiver module secured in a cage and release mechanism |
US7433193B2 (en) * | 2005-05-11 | 2008-10-07 | Cisco Technology, Inc. | Techniques for controlling a position of a transceiver module relative to a connector |
JP2006352068A (ja) * | 2005-05-19 | 2006-12-28 | Opnext Japan Inc | プラガブルモジュールおよびケージ |
PL1891847T3 (pl) * | 2005-06-02 | 2012-05-31 | Koninl Philips Electronics Nv | Urządzenie elektroniczne wyposażone w zespół chłodzący do chłodzenia modułu wprowadzanego przez użytkownika i zespół chłodzący do chłodzenia takiego modułu |
US7457126B2 (en) * | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
KR100693920B1 (ko) * | 2005-07-07 | 2007-03-12 | 삼성전자주식회사 | 히트 스프레더, 이를 갖는 반도체 패키지 모듈 및 메모리모듈 |
US20070036489A1 (en) * | 2005-08-15 | 2007-02-15 | Barbara Grzegorzewska | Industrial interconnect system incorporating transceiver module cage |
US7150653B1 (en) * | 2005-09-21 | 2006-12-19 | Cisco Technology, Inc. | Techniques for EMI shielding of a transceiver module |
JP4819490B2 (ja) * | 2005-11-28 | 2011-11-24 | 富士通株式会社 | Sfpモジュールの実装構造 |
US7322854B2 (en) * | 2005-12-06 | 2008-01-29 | Molex Incorporated | Spring-biased EMI shroud |
JP4730092B2 (ja) * | 2005-12-28 | 2011-07-20 | 日立電線株式会社 | ラッチ機構及びラッチ機構付き電子モジュール |
US7455554B2 (en) | 2005-12-28 | 2008-11-25 | Molex Incorporated | EMI shroud with bidirectional contact members |
JP2007200422A (ja) * | 2006-01-25 | 2007-08-09 | Toshiba Corp | パタンド磁気記録媒体の製造方法 |
US7355857B2 (en) * | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
US7195404B1 (en) | 2006-03-03 | 2007-03-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver module with electromagnetic interference absorbing material and method for making the module |
US7422481B2 (en) * | 2006-03-22 | 2008-09-09 | Finisar Corporation | Electromagnetic interference containment in a transceiver module |
US7585005B1 (en) | 2006-03-23 | 2009-09-08 | Emc Corporation | Locking mechanism for securing bezels |
US7211739B1 (en) | 2006-03-27 | 2007-05-01 | Emc Corporation | Electromagnetic interference (EMI) shield for a cable-bulkhead interface |
US7632114B2 (en) * | 2006-03-30 | 2009-12-15 | Apple Inc. | Interface connecter between media player and other electronic devices |
CN200950168Y (zh) * | 2006-04-26 | 2007-09-19 | 武汉电信器件有限公司 | 光电模块单臂拉环式解锁装置 |
US7529094B2 (en) * | 2006-04-28 | 2009-05-05 | Tyco Electronics Corporation | Integrated heat sink and light pipe mounting assembly |
US7296937B1 (en) * | 2006-05-05 | 2007-11-20 | Tyco Electronics Corporation | Transceiver module assembly with unlatch detection switch |
US8006019B2 (en) | 2006-05-22 | 2011-08-23 | Apple, Inc. | Method and system for transferring stored data between a media player and an accessory |
US7415563B1 (en) | 2006-06-27 | 2008-08-19 | Apple Inc. | Method and system for allowing a media player to determine if it supports the capabilities of an accessory |
US20080019100A1 (en) * | 2006-07-18 | 2008-01-24 | All Best Electronics Co., Ltd. | Plug module base with heat dissipating element |
TWM306031U (en) * | 2006-08-11 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Shielding device and electronic product using the same |
JP4199272B2 (ja) * | 2006-08-23 | 2008-12-17 | 日本航空電子工業株式会社 | コネクタ |
US7499286B2 (en) * | 2006-08-31 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Mounting adapter for electronic modules |
US7558894B1 (en) | 2006-09-11 | 2009-07-07 | Apple Inc. | Method and system for controlling power provided to an accessory |
WO2008070873A2 (en) * | 2006-12-07 | 2008-06-12 | Finisar Corporation | Electromagnetic radiation containment and heat management in an electronic module |
US7625137B2 (en) * | 2006-12-19 | 2009-12-01 | Finisar Corporation | Communications device |
US7547149B2 (en) * | 2006-12-19 | 2009-06-16 | Finisar Corporation | Optical connector latch assembly for an optoelectronic module |
US7646615B2 (en) * | 2006-12-19 | 2010-01-12 | Finisar Corporation | Electromagnetic inferference shield for an optoelectronic module |
US7845862B2 (en) * | 2006-12-19 | 2010-12-07 | Finisar Corporation | Communications device |
US7540788B2 (en) | 2007-01-05 | 2009-06-02 | Apple Inc. | Backward compatible connector system |
US7438596B2 (en) * | 2007-01-12 | 2008-10-21 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
US7322841B1 (en) * | 2007-02-19 | 2008-01-29 | Inventec Corporation | Push-pull mechanism for removable electronic device |
CN201104378Y (zh) * | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
JP5227396B2 (ja) * | 2007-05-04 | 2013-07-03 | トムソン ライセンシング | スマートカードヒートシンク |
DE202007006626U1 (de) * | 2007-05-09 | 2007-10-04 | Hamburg Industries Co., Ltd., Shen Keng | Verbindungseinrichtung |
US7764504B2 (en) * | 2007-05-16 | 2010-07-27 | Tyco Electronics Corporation | Heat transfer system for a receptacle assembly |
JP2008287111A (ja) * | 2007-05-18 | 2008-11-27 | Fujitsu Ltd | プラガブルモジュール |
US7928324B2 (en) * | 2007-06-20 | 2011-04-19 | Finisar Corporation | Gasketed collar for reducing electromagnetic interference (EMI) emission from optical communication module |
US7554805B2 (en) * | 2007-06-25 | 2009-06-30 | Shuttle Inc. | Heat dissipation structure for electronic devices |
US7762844B2 (en) * | 2007-06-28 | 2010-07-27 | Finisar Corporation | Electrical connector with EMI shield |
CN201115287Y (zh) * | 2007-08-20 | 2008-09-10 | 鸿富锦精密工业(深圳)有限公司 | 屏蔽装置及使用所述屏蔽装置的电子产品 |
US7422457B1 (en) | 2007-08-31 | 2008-09-09 | Hon Hai Precision Ind. Co., Ltd. | Plug-in module with improved latch mechanism |
US8095713B2 (en) * | 2007-09-04 | 2012-01-10 | Apple Inc. | Smart cables |
US7841779B1 (en) | 2007-09-07 | 2010-11-30 | Fourte Design & Development, Llc | Fiber optic module release mechanism |
US7402070B1 (en) | 2007-09-12 | 2008-07-22 | Hon Hai Precision Ind. Co., Ltd. | Latch mechanism with spring back function |
US7445485B1 (en) | 2007-09-12 | 2008-11-04 | Hon Hai Precision Ind. Co., Ltd. | Latch mechanism with pull tape |
US7539018B2 (en) * | 2007-10-31 | 2009-05-26 | Tyco Electronics Corporation | Heat sink retaining clip for an electrical connector assembly |
US7557305B2 (en) * | 2007-11-01 | 2009-07-07 | Nextronics Engineering Corp. | Connector housing for a small and portable transmitting-receiving module |
US7559800B2 (en) * | 2007-12-05 | 2009-07-14 | Hon Hai Precision Ind. Co., Ltd. | Electronic module with anti-EMI metal gasket |
JP4915342B2 (ja) * | 2007-12-21 | 2012-04-11 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
JP4998249B2 (ja) * | 2007-12-21 | 2012-08-15 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
US7760507B2 (en) * | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
US7525818B1 (en) | 2008-01-11 | 2009-04-28 | Tyco Electronics Corporation | Memory card connector with EMI shielding |
US7555191B1 (en) | 2008-01-30 | 2009-06-30 | Joshua John Edward Moore | Self-locking unidirectional interposer springs for optical transceiver modules |
US8047966B2 (en) | 2008-02-29 | 2011-11-01 | Apple Inc. | Interfacing portable media devices and sports equipment |
US7780361B2 (en) * | 2008-04-02 | 2010-08-24 | Ciena Corporation | Card guide and heatsink assemblies for pluggable electro-optic modules |
US7621773B2 (en) * | 2008-04-11 | 2009-11-24 | Tyco Electronics Corporation | Receptacle assembly including a light pipe structure |
US7727018B2 (en) * | 2008-04-22 | 2010-06-01 | Tyco Electronics Corporation | EMI gasket for an electrical connector assembly |
US7859849B2 (en) * | 2008-05-14 | 2010-12-28 | Finisar Corporation | Modular heatsink mounting system |
CN101600331B (zh) * | 2008-06-04 | 2012-10-03 | 富士康(昆山)电脑接插件有限公司 | 屏蔽罩 |
US7852633B2 (en) | 2008-07-24 | 2010-12-14 | Yamaichi Electronics Co., Ltd. | Connector for connection to a module board |
US8098493B2 (en) * | 2008-08-15 | 2012-01-17 | Finisar Corporation | CFP mechanical platform |
US7892007B2 (en) * | 2008-08-15 | 2011-02-22 | 3M Innovative Properties Company | Electrical connector assembly |
US7789676B2 (en) * | 2008-08-19 | 2010-09-07 | Tyco Electronics Corporation | Electrical connector with electrically shielded terminals |
US7641515B1 (en) | 2008-08-21 | 2010-01-05 | Tyco Electronics Corporation | Center plate for a connector assembly |
US8208853B2 (en) | 2008-09-08 | 2012-06-26 | Apple Inc. | Accessory device authentication |
US8238811B2 (en) | 2008-09-08 | 2012-08-07 | Apple Inc. | Cross-transport authentication |
US7733652B2 (en) * | 2008-09-17 | 2010-06-08 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
US7625223B1 (en) | 2008-10-01 | 2009-12-01 | Tyco Electronics Corporation | Connector system with floating heat sink |
US8064207B2 (en) * | 2008-10-14 | 2011-11-22 | Hon Hai Precision Ind. Co., Ltd. | Electronic module with ejector mechanism |
US8035975B2 (en) * | 2008-10-14 | 2011-10-11 | Hon Hai Precision Ind. Co., Ltd. | Low profile electronic module with ejector mechanism |
JP2010108800A (ja) * | 2008-10-31 | 2010-05-13 | Japan Aviation Electronics Industry Ltd | コネクタ |
EP2345115B1 (en) * | 2008-11-03 | 2019-04-03 | Finisar Corporation | Transceiver module for communications network |
CN101742833B (zh) * | 2008-11-20 | 2012-07-04 | 英业达股份有限公司 | 电子装置 |
US7878844B2 (en) * | 2009-01-08 | 2011-02-01 | Tyco Electronics Corporation | Panel connector assembly |
US7794241B2 (en) | 2009-01-14 | 2010-09-14 | Tyco Electronics Corporation | Straddle mount connector for pluggable transceiver module |
US7833068B2 (en) * | 2009-01-14 | 2010-11-16 | Tyco Electronics Corporation | Receptacle connector for a transceiver assembly |
US7704097B1 (en) | 2009-02-17 | 2010-04-27 | Tyco Electronics Corporation | Connector assembly having an electromagnetic seal element |
US8011950B2 (en) * | 2009-02-18 | 2011-09-06 | Cinch Connectors, Inc. | Electrical connector |
JP5342299B2 (ja) * | 2009-03-30 | 2013-11-13 | 古河電気工業株式会社 | コネクタおよびコネクタアセンブリ |
US8169783B2 (en) * | 2009-03-30 | 2012-05-01 | Tyco Electronics Corporation | Latch assembly for a pluggable electronic module |
US8123559B2 (en) * | 2009-04-01 | 2012-02-28 | Hon Hai Precision Ind. Co., Ltd. | Stacked pluggable cage having intermediate walls interengaged each other |
US8152562B2 (en) * | 2009-04-02 | 2012-04-10 | Fci Americas Technology Llc | Cable panel mount |
US8052335B2 (en) * | 2009-05-01 | 2011-11-08 | Ciena Corporation | Ejector apparatus and associated assembly method for pluggable transceivers |
CN101907908B (zh) * | 2009-06-04 | 2013-03-13 | 富准精密工业(深圳)有限公司 | 电子设备及其机箱 |
US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
CN101938061B (zh) * | 2009-07-02 | 2013-11-13 | 富士康(昆山)电脑接插件有限公司 | 线缆连接器组件 |
US7771225B1 (en) | 2009-07-13 | 2010-08-10 | Hon Hai Precision Ind. Co., Ltd. | Low profile electronic module with ejector |
US8035973B2 (en) * | 2009-08-31 | 2011-10-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage |
US7869224B1 (en) * | 2009-09-18 | 2011-01-11 | All Best Precision Technology Co., Ltd. | Housing structure for pluggable transceiver module |
US8534930B1 (en) | 2009-09-24 | 2013-09-17 | Juniper Networks, Inc. | Circuit boards defining openings for cooling electronic devices |
US8223498B2 (en) * | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
KR101093268B1 (ko) * | 2009-12-18 | 2011-12-14 | 삼성모바일디스플레이주식회사 | 표시 장치의 제조 방법 |
US8339784B2 (en) * | 2010-01-06 | 2012-12-25 | Methode Electronics, Inc. | Thermal management for electronic device housing |
JP5593714B2 (ja) * | 2010-01-29 | 2014-09-24 | 富士通株式会社 | 電子素子のシールド構造及びこれを備えた電子装置 |
US8203084B2 (en) * | 2010-03-16 | 2012-06-19 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
WO2011120188A1 (en) * | 2010-03-29 | 2011-10-06 | Telefonaktiebolaget L M Ericsson (Publ) | Cooling device for pluggable module, assembly of the cooling device and the pluggable module |
CN203313588U (zh) * | 2010-05-03 | 2013-11-27 | 莫列斯公司 | 电磁干扰垫片组件以及斜置屏蔽壳体组件 |
US8011958B1 (en) * | 2010-05-19 | 2011-09-06 | Amphenol East Asia Electronic Technology (Shenzhen) Ltd. | E-easy series connector assembly with shielding function |
WO2011146701A2 (en) | 2010-05-19 | 2011-11-24 | Molex Incorporated | Improved emi shielding member, particularly suitable for shielding of module cages |
JP2011248243A (ja) * | 2010-05-28 | 2011-12-08 | Fujitsu Component Ltd | 光電変換モジュール及び光電変換装置 |
CN201966463U (zh) * | 2010-06-08 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | 电转接器 |
US9246280B2 (en) | 2010-06-15 | 2016-01-26 | Molex, Llc | Cage, receptacle and system for use therewith |
US8449203B2 (en) * | 2010-06-23 | 2013-05-28 | Tellabs Operations, Inc. | Cooling method for CXP active optical transceivers |
CN201774093U (zh) | 2010-07-26 | 2011-03-23 | 富士康(昆山)电脑接插件有限公司 | 连接器及其组件 |
US8382509B2 (en) * | 2010-08-06 | 2013-02-26 | Fci Americas Technology Llc | Electrical connector assembly including compliant heat sink |
US8345426B2 (en) | 2010-08-16 | 2013-01-01 | Tyco Electronics Corporation | Guide system for a card module |
CN103201911B (zh) * | 2010-10-25 | 2016-09-28 | 莫列斯有限公司 | 插座连接器组件、多隔间插座及混合式壳体 |
US8345445B2 (en) * | 2010-11-23 | 2013-01-01 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
TWI445483B (zh) * | 2010-12-23 | 2014-07-11 | Compal Electronics Inc | 殼體結構及具有其之電子裝置 |
US8427834B2 (en) * | 2010-12-28 | 2013-04-23 | International Business Machines Corporation | Rotatable latch for compressing thermal interface material between a heat generating electrical component and a cooling electrical component |
US8885342B2 (en) | 2010-12-29 | 2014-11-11 | Methode Electronics, Inc. | Thermal management for electronic device housing |
US8358504B2 (en) * | 2011-01-18 | 2013-01-22 | Avago Technologies Enterprise IP (Singapore) Pte. Ltd. | Direct cooling system and method for transceivers |
CN102610960B (zh) * | 2011-01-20 | 2014-12-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
CN102610961B (zh) * | 2011-01-21 | 2014-12-03 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
US8911280B2 (en) | 2011-01-31 | 2014-12-16 | Apple Inc. | Apparatus for shaping exterior surface of a metal alloy casing |
US8460018B2 (en) * | 2011-01-31 | 2013-06-11 | Apple Inc. | Flat object ejector assembly |
US9064200B2 (en) * | 2011-01-31 | 2015-06-23 | Apple Inc. | Flat object ejector assembly |
US8665160B2 (en) | 2011-01-31 | 2014-03-04 | Apple Inc. | Antenna, shielding and grounding |
US8587939B2 (en) | 2011-01-31 | 2013-11-19 | Apple Inc. | Handheld portable device |
CN102651520B (zh) * | 2011-02-25 | 2014-10-29 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
CN202076595U (zh) * | 2011-02-25 | 2011-12-14 | 富士康(昆山)电脑接插件有限公司 | 连接器 |
CN102651521B (zh) | 2011-02-25 | 2014-09-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
US8717770B2 (en) | 2011-04-28 | 2014-05-06 | Finisar Corporation | Latching mechanisms for pluggable electronic devices |
US8830679B2 (en) * | 2011-05-27 | 2014-09-09 | Fci Americas Technology Llc | Receptacle heat sink connection |
WO2012174085A2 (en) * | 2011-06-13 | 2012-12-20 | The Wiremold Company | Rising receptacle box assembly |
CN102832490A (zh) * | 2011-06-16 | 2012-12-19 | 鸿富锦精密工业(深圳)有限公司 | 连接器组合 |
US9818670B2 (en) * | 2011-07-29 | 2017-11-14 | Infinera Corporation | Cooling device installation using a retainer assembly |
US8444437B2 (en) * | 2011-08-03 | 2013-05-21 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
US8670236B2 (en) | 2011-08-03 | 2014-03-11 | Tyco Electronics Corporation | Cage assembly for receiving a pluggable module |
US8449331B2 (en) | 2011-08-03 | 2013-05-28 | Tyco Electronics Corporation | Cage and connector cover for a receptacle assembly |
US8556658B2 (en) * | 2011-08-03 | 2013-10-15 | Tyco Electronics Corporation | Receptacle assembly for a pluggable module |
US8371861B1 (en) | 2011-08-03 | 2013-02-12 | Tyco Electronics Corporation | Straddle mount connector for a pluggable transceiver module |
US8371882B1 (en) | 2011-08-03 | 2013-02-12 | Tyco Electronics Corporation | Straddle mount connector for a pluggable transceiver module |
US20130048367A1 (en) * | 2011-08-22 | 2013-02-28 | Zlatan Ljubijankic | Emi shielding members for connector cage |
JP2013051133A (ja) * | 2011-08-31 | 2013-03-14 | Yamaichi Electronics Co Ltd | リセプタクル用ケージ、リセプタクルアッセンブリー、トランシーバモジュールアッセンブリー |
US8817469B2 (en) * | 2011-09-23 | 2014-08-26 | Infinera Corporation | Heat transfer using a durable low-friction interface |
TWM461182U (zh) * | 2011-11-08 | 2013-09-01 | Molex Inc | 連接器系統和連接器 |
CN103123509B (zh) * | 2011-11-18 | 2015-11-25 | 华为技术有限公司 | 一种单板控温装置及方法 |
US8622770B2 (en) * | 2011-12-01 | 2014-01-07 | Finisar Corporation | Electromagnetic radiation shield for an electronic module |
JP2013138110A (ja) * | 2011-12-28 | 2013-07-11 | Honda Tsushin Kogyo Co Ltd | 電気コネクタ用ケージ |
US8890004B2 (en) | 2012-01-23 | 2014-11-18 | Tyco Electronics Corporation | Electrical connector assembly with EMI cover |
US8979558B2 (en) * | 2012-03-12 | 2015-03-17 | Fci Americas Technology Llc | Interposer assembly |
CN102612302A (zh) * | 2012-03-13 | 2012-07-25 | 华为技术有限公司 | 光模块散热装置及通信设备 |
JP2013200394A (ja) | 2012-03-23 | 2013-10-03 | Yamaichi Electronics Co Ltd | リセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリー |
US8535096B1 (en) | 2012-03-27 | 2013-09-17 | Tyco Electronics Corporation | Die cast cage for a receptacle assembly |
CN202949055U (zh) * | 2012-05-01 | 2013-05-22 | 莫列斯公司 | 连接器 |
JP5897765B2 (ja) * | 2012-05-04 | 2016-03-30 | モレックス エルエルシー | 連結されたコネクタシステム |
US8599559B1 (en) | 2012-05-30 | 2013-12-03 | Tyco Electronics Corporation | Cage with a heat sink mounted on its mounting side and an EMI gasket with its fingers electrically connected to the mounting side |
BR112014027300A2 (pt) * | 2012-05-30 | 2017-06-27 | Schweitzer Engineering Lab Inc | dispositivo de comunicação |
WO2013186587A1 (en) * | 2012-06-12 | 2013-12-19 | Fci | Connector assembly |
CN103676027B (zh) * | 2012-09-14 | 2016-01-27 | 泰科电子(上海)有限公司 | 连接器 |
US9217837B2 (en) * | 2012-09-15 | 2015-12-22 | Finisar Corporation | Latch mechanism for communications module |
US8879267B2 (en) | 2012-10-09 | 2014-11-04 | Tyco Electronics Corporation | Transceiver assembly |
US9146366B2 (en) * | 2012-10-15 | 2015-09-29 | Finisar Corporation | Latch mechanism for communication module |
US9538632B2 (en) | 2012-10-18 | 2017-01-03 | Apple Inc. | Printed circuit board features of a portable computer |
US20140151010A1 (en) * | 2012-12-03 | 2014-06-05 | Tyco Electronics Corporation | Heat sink |
US20140153192A1 (en) * | 2012-12-05 | 2014-06-05 | Molex Incorporated | Module cage with integrated emi aspect |
US10091911B2 (en) * | 2012-12-11 | 2018-10-02 | Infinera Corporation | Interface card cooling using heat pipes |
US20140196943A1 (en) * | 2013-01-11 | 2014-07-17 | Molex Incorporated | Resilient Adherent EMI Shielding Member |
US9250402B2 (en) * | 2013-02-05 | 2016-02-02 | Sumitomo Electric Industries, Ltd. | Pluggable optical transceiver having pull-pull-tab |
CN105164560B (zh) * | 2013-03-05 | 2017-03-22 | 菲尼萨公司 | 用于通信模块的闩锁机构 |
WO2014141490A1 (ja) * | 2013-03-13 | 2014-09-18 | 山一電機株式会社 | リセプタクルアッセンブリーおよびトランシーバモジュールアッセンブリー |
US10321607B2 (en) | 2013-03-13 | 2019-06-11 | Yamaichi Electronics Co., Ltd. | Receptacle assembly and transceiver module assembly |
CN203277695U (zh) * | 2013-04-03 | 2013-11-06 | 正凌精密工业股份有限公司 | 连接器模块 |
DE102013013816A1 (de) * | 2013-05-02 | 2014-11-06 | Nvidia Corporation | Elektronische Einrichtung und in elektronischer Einrichtung verwendete Sockelverbindungseinheit |
US9843148B2 (en) * | 2013-07-19 | 2017-12-12 | Foxconn Interconnect Technology Limited | Flippable electrical connector |
WO2015024015A1 (en) * | 2013-08-16 | 2015-02-19 | Molex Incorporated | Connector with thermal management |
US20150072561A1 (en) * | 2013-09-06 | 2015-03-12 | Tyco Electronics Corporation | Cage with emi absorber |
EP3050411B1 (en) | 2013-09-23 | 2019-02-27 | Coriant Operations, Inc. | Fixation of heat sink on sfp/xfp cage |
US9313925B2 (en) * | 2013-09-30 | 2016-04-12 | Infinera Corporation | Pluggable module housing assembly |
EP3053225B1 (en) | 2013-10-04 | 2020-05-06 | Signify Holding B.V. | Connector comprising a heat sink and lighting device |
JP6464645B2 (ja) | 2013-11-05 | 2019-02-06 | 富士通株式会社 | 光伝送装置及び製造方法 |
US9063705B2 (en) * | 2013-11-11 | 2015-06-23 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Latch mechanism for securing an electronic module |
US9877413B2 (en) * | 2013-11-12 | 2018-01-23 | Molex, Llc | Thermally configured connector system |
CN103702534B (zh) * | 2013-12-18 | 2016-09-07 | 上海岱诺信息技术有限公司 | 双层壳体的电子设备机壳结构 |
CN104916977B (zh) | 2014-03-12 | 2017-05-24 | 富士康(昆山)电脑接插件有限公司 | 电子卡连接器 |
CN106134013B (zh) * | 2014-03-27 | 2019-05-07 | 莫列斯有限公司 | 插座组件、插头组件和连接器系统 |
TWM483461U (zh) * | 2014-03-31 | 2014-08-01 | Super Micro Computer Inc | 可擴充型伺服器機箱 |
US9912107B2 (en) | 2014-04-01 | 2018-03-06 | Te Connectivity Corporation | Plug and receptacle assembly having a thermally conductive interface |
WO2015164538A1 (en) | 2014-04-23 | 2015-10-29 | Tyco Electronics Corporation | Electrical connector with shield cap and shielded terminals |
US9451722B2 (en) * | 2014-05-12 | 2016-09-20 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Rack mountable network switch |
US9402332B2 (en) * | 2014-05-21 | 2016-07-26 | Molex, Llc | Heat dissipative air guide |
CN203839574U (zh) * | 2014-05-21 | 2014-09-17 | 泰科电子(上海)有限公司 | 连接器、连接器组件和设备 |
US9543708B2 (en) | 2014-06-19 | 2017-01-10 | Tyco Electronics Corporation | Pluggable connector and communication system configured to reduce electromagnetic interference leakage |
JP5892449B1 (ja) | 2014-08-28 | 2016-03-23 | 本多通信工業株式会社 | コネクタの抜去機構と、光モジュール |
US9235017B1 (en) | 2014-10-01 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver with a heat dissipating structure |
KR102286337B1 (ko) * | 2014-10-17 | 2021-08-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체 |
CN110071383B (zh) * | 2014-11-03 | 2021-11-26 | 3M创新有限公司 | 连接器 |
US11079560B2 (en) | 2014-11-26 | 2021-08-03 | Hewlett Packard Enterprise Development Lp | Transceiver module |
TWI612733B (zh) | 2014-12-23 | 2018-01-21 | Molex Llc | 插座、插頭模組及連接器系統 |
CN105792626B (zh) * | 2014-12-26 | 2019-03-26 | 菲尼萨公司 | 电磁干扰屏蔽罩 |
CN110662388A (zh) | 2015-01-11 | 2020-01-07 | 莫列斯有限公司 | 模块壳体及连接器端口 |
US9646231B2 (en) * | 2015-03-06 | 2017-05-09 | Htc Corporation | Casing and electronic device using the same |
US9609739B2 (en) * | 2015-03-10 | 2017-03-28 | Kabushiki Kaisha Toshiba | Electronic device |
US9673567B1 (en) * | 2015-03-12 | 2017-06-06 | Juniper Networks, Inc. | Apparatus, system, and method for preventing electric shock during maintenance of telecommunication systems |
TWM508146U (zh) * | 2015-04-15 | 2015-09-01 | Molex Taiwan Ltd | 屏蔽罩組件 |
US9615492B2 (en) | 2015-04-16 | 2017-04-04 | International Business Machines Corporation | Electromagnetic gaskets for a cable connection |
CN204517046U (zh) * | 2015-04-30 | 2015-07-29 | 泰科电子(上海)有限公司 | 连接器的屏蔽外壳 |
US9391407B1 (en) * | 2015-06-12 | 2016-07-12 | Tyco Electronics Corporation | Electrical connector assembly having stepped surface |
US9832916B2 (en) * | 2015-06-16 | 2017-11-28 | Source Photonics (Chengdu) Co., Ltd. | EMI shielding device for an optical transceiver |
US10153571B2 (en) | 2015-08-18 | 2018-12-11 | Molex, Llc | Connector system with thermal management |
CN110531474B (zh) | 2015-09-10 | 2022-08-26 | 申泰公司 | 具有高热消散模块的机架安装式设备和具有增加的冷却的收发器插座 |
US10186794B2 (en) * | 2015-09-25 | 2019-01-22 | Molex, Llc | Connector system with adapter |
US9620906B1 (en) * | 2015-11-02 | 2017-04-11 | Te Connectivity Corporation | EMI shielding for pluggable modules |
US10884203B2 (en) * | 2015-11-16 | 2021-01-05 | Accedian Networks Inc. | Cooling apparatus for pluggable modules |
CN106793669B (zh) * | 2015-11-20 | 2019-04-19 | 华为技术有限公司 | 一种散热组件及通信设备 |
US9869837B2 (en) * | 2015-12-08 | 2018-01-16 | Te Connectivity Corporation | Heat dissipating communication system |
JP6755754B2 (ja) * | 2015-12-14 | 2020-09-16 | 日本ルメンタム株式会社 | 光モジュール及び光伝送装置 |
CN108713355B (zh) | 2016-01-11 | 2020-06-05 | 莫列斯有限公司 | 路由组件及使用路由组件的系统 |
CN110839182B (zh) | 2016-01-19 | 2021-11-05 | 莫列斯有限公司 | 集成路由组件以及采用集成路由组件的系统 |
CN106990488B (zh) * | 2016-01-21 | 2019-02-05 | 正淩精密工业股份有限公司 | 连接器壳体散热结构 |
CA2992540A1 (en) | 2016-02-12 | 2017-08-17 | Sumitomo Electric Industries, Ltd. | Heat dissipation device for optical transceiver, and optical communication device |
US9825408B2 (en) * | 2016-03-14 | 2017-11-21 | Te Connectivity Corporation | Connector module assembly having a gasket plate |
US10401581B2 (en) * | 2016-03-17 | 2019-09-03 | Ciena Corporation | Optical module heatsink lifter and method |
US9983370B1 (en) * | 2016-05-24 | 2018-05-29 | Cisco Technology, Inc. | Passive heat sink for a small form factor pluggable |
US10034407B2 (en) * | 2016-07-22 | 2018-07-24 | Intel Corporation | Storage sled for a data center |
US10389397B2 (en) * | 2016-07-26 | 2019-08-20 | Laird Technologies, Inc. | Small form-factor pluggable (SFP) transceivers |
US20180034211A1 (en) * | 2016-07-26 | 2018-02-01 | Foxconn Interconnect Technology Limited | Electrical connector assembly |
US9666995B1 (en) | 2016-08-08 | 2017-05-30 | Te Connectivity Corporation | EMI containment cage member |
US9924615B2 (en) | 2016-08-15 | 2018-03-20 | Te Connectivity Corporation | Receptacle assembly having a heat exchanger |
US10659168B2 (en) | 2016-08-23 | 2020-05-19 | Schweitzer Engineering Laboratories, Inc. | Low-power fiber optic transceiver |
CN206098950U (zh) * | 2016-10-10 | 2017-04-12 | 中兴通讯股份有限公司 | 一种电子设备 |
US9893474B1 (en) * | 2016-10-12 | 2018-02-13 | International Business Machines Corporation | Active cable heat sink |
CN108061943B (zh) * | 2016-11-07 | 2020-01-17 | 泰科电子(上海)有限公司 | 连接器 |
EP3530089A4 (en) * | 2017-01-12 | 2020-06-03 | Samtec, Inc. | FIXED HEATER CAGE |
US10079442B2 (en) * | 2017-01-16 | 2018-09-18 | Foxconn Interconnect Technology Limited | Transceiver and mechanism for receiving the same |
CN107046206B (zh) * | 2017-01-23 | 2021-07-20 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US9935403B1 (en) | 2017-02-13 | 2018-04-03 | Te Connectivity Corporation | Pluggable module having cooling channel |
US9929500B1 (en) * | 2017-03-09 | 2018-03-27 | Tyler Ista | Pluggable transceiver module with integrated release mechanism |
US10551581B2 (en) * | 2017-04-20 | 2020-02-04 | Mellanox Technologies, Ltd. | Optical connector cage with enhanced thermal performance |
CN108987966B (zh) * | 2017-05-21 | 2021-03-23 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件及其转接件 |
US10446960B2 (en) * | 2017-05-21 | 2019-10-15 | Foxconn Interconnect Technology Limited | Electrical connector assembly equipped with heat pipe and additional heat sink |
US10194565B2 (en) * | 2017-06-05 | 2019-01-29 | Cisco Technology, Inc. | Electromagnetic interference shielding apparatus |
CN111033916B (zh) | 2017-06-07 | 2021-10-19 | 申泰公司 | 一种具有固定散热器的收发器组件阵列及浮动收发器 |
CN207052873U (zh) * | 2017-06-08 | 2018-02-27 | 珠海泰科电子有限公司 | 电磁屏蔽弹片及具有电磁屏蔽弹片的连接器外壳 |
US10104760B1 (en) | 2017-06-12 | 2018-10-16 | Te Connectivity Corporation | Pluggable module having cooling channel with heat transfer fins |
JP6888434B2 (ja) * | 2017-06-16 | 2021-06-16 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
US10890565B2 (en) * | 2017-06-22 | 2021-01-12 | Olympus America Inc. | Portable phased array test instrument |
US10644472B2 (en) | 2017-06-28 | 2020-05-05 | Mellanox Technologies, Ltd. | Cable adapter |
US10128627B1 (en) * | 2017-06-28 | 2018-11-13 | Mellanox Technologies, Ltd. | Cable adapter |
CN107548224B (zh) * | 2017-07-07 | 2021-03-09 | 新华三技术有限公司 | 一种元器件壳体和pcb板 |
US10374355B2 (en) | 2017-07-07 | 2019-08-06 | Amphenol Corporation | Asymmetric latches for pluggable transceivers |
US11070006B2 (en) | 2017-08-03 | 2021-07-20 | Amphenol Corporation | Connector for low loss interconnection system |
CN107464576B (zh) * | 2017-08-07 | 2019-05-28 | 郑州云海信息技术有限公司 | 一种硬盘模组用免工具快速拆装装置 |
US11056838B2 (en) | 2017-08-23 | 2021-07-06 | Samtec, Inc. | Transceiver receptacle with EMI cage and bezel clips that provide high shielding effectiveness |
US10404008B2 (en) * | 2017-10-06 | 2019-09-03 | Te Connectivity Corporation | Connector system with receptacle and plug connectors having complimentary angled connector platforms |
US10320113B2 (en) * | 2017-10-17 | 2019-06-11 | Mellanox Technologies, Ltd. | Cage receptacle assembly with heat dissipation units |
CA3080574A1 (en) * | 2017-10-27 | 2019-05-02 | CurrentWrx, LLC DBA Cargoglide | Roof-top rail system for vehicle cargo storage |
CN109728475B (zh) * | 2017-10-30 | 2024-05-07 | 泰科电子(上海)有限公司 | 连接器组件 |
US10555439B2 (en) * | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
US10219412B1 (en) | 2017-11-27 | 2019-02-26 | Nokia Solutions And Networks Oy | Connector assembly and associated heat sink housing for use in a radio unit |
US10617034B2 (en) * | 2017-12-12 | 2020-04-07 | Cloud Light Technology Limited | Heat dissipation system of enclosed electronic module with single/multiple active components |
CN109991704A (zh) * | 2018-01-02 | 2019-07-09 | 台达电子工业股份有限公司 | 光收发模块 |
CN110197962B (zh) * | 2018-02-26 | 2022-08-19 | 富士康(昆山)电脑接插件有限公司 | 散热件及具有该散热件的电连接器组件 |
CN110275253A (zh) * | 2018-03-14 | 2019-09-24 | 泰科电子(上海)有限公司 | 连接器 |
US10348039B1 (en) * | 2018-03-30 | 2019-07-09 | Microsoft Technology Licensing, Llc | Connector shielding |
TWI651037B (zh) * | 2018-04-25 | 2019-02-11 | 和碩聯合科技股份有限公司 | 機殼組件及電子裝置 |
US10705309B2 (en) | 2018-06-06 | 2020-07-07 | Mellanox Technologies, Ltd. | RF EMI reducing fiber cable assembly |
US10791652B2 (en) * | 2018-06-12 | 2020-09-29 | Eagle Technology, Llc | Systems and methods for heatsink to rail thermal interface enhancement |
JP2019216063A (ja) * | 2018-06-14 | 2019-12-19 | 山一電機株式会社 | コネクタ用ケージ及びこれを備えたコネクタ装置 |
US20190387650A1 (en) * | 2018-06-14 | 2019-12-19 | Cisco Technology, Inc. | Heat sink for pluggable module cage |
FR3083018B1 (fr) * | 2018-06-25 | 2021-05-28 | Sagemcom Broadband Sas | Systeme de connexion electrique comportant un dispositif de connexion primaire et un dispositif de connexion secondaire |
US10575442B2 (en) * | 2018-07-06 | 2020-02-25 | Te Connectivity Corporation | Heat sink assembly for an electrical connector |
US10444453B1 (en) | 2018-07-25 | 2019-10-15 | Mellanox Technologies, Ltd. | QSFP-DD to SFP-DD adapter |
US10955628B2 (en) * | 2018-07-31 | 2021-03-23 | Lumentum Operations Llc | Latching for a transceiver module |
WO2020024109A1 (en) * | 2018-07-31 | 2020-02-06 | Lumentum Operations Llc | Electromagnetic interference leakage reduction for a pluggable optical module |
CN112888981A (zh) * | 2018-08-02 | 2021-06-01 | 申泰公司 | 收发器闩锁和热桥 |
TWI690259B (zh) * | 2018-08-02 | 2020-04-01 | 台灣莫仕股份有限公司 | 屏蔽罩組件 |
US10942322B2 (en) | 2018-08-02 | 2021-03-09 | Molex, Llc | Shield cage assembly |
CN110881260B (zh) * | 2018-09-06 | 2021-06-25 | 泰科电子(上海)有限公司 | 壳体组件和安装夹 |
US10797417B2 (en) | 2018-09-13 | 2020-10-06 | Amphenol Corporation | High performance stacked connector |
CN208862209U (zh) | 2018-09-26 | 2019-05-14 | 安费诺东亚电子科技(深圳)有限公司 | 一种连接器及其应用的pcb板 |
CN110972444B (zh) * | 2018-09-30 | 2022-09-06 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
CN110972443B (zh) * | 2018-09-30 | 2023-09-15 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
US11271348B1 (en) | 2018-10-24 | 2022-03-08 | Amphenol Corporation | High performance electrical connector |
US10874032B2 (en) * | 2018-10-31 | 2020-12-22 | Hewlett Packard Enterprise Development Lp | Rotatable cold plate assembly for cooling pluggable modules |
CN109407224A (zh) * | 2018-11-07 | 2019-03-01 | 东莞讯滔电子有限公司 | 一种散热组件、连接器及连接器组件 |
CN111200205A (zh) * | 2018-11-20 | 2020-05-26 | 至良科技股份有限公司 | 电连接器壳座组合、电连接器及电子装置 |
US10547133B1 (en) * | 2018-12-17 | 2020-01-28 | Te Connectivity Corporation | Vertical communication system |
US11573054B2 (en) | 2018-12-18 | 2023-02-07 | Commscope Technologies Llc | Thermal management for modular electronic devices |
WO2020154507A1 (en) | 2019-01-25 | 2020-07-30 | Fci Usa Llc | I/o connector configured for cable connection to a midboard |
CN113557459B (zh) | 2019-01-25 | 2023-10-20 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接到中板的i/o连接器 |
WO2020172395A1 (en) | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
US10741954B1 (en) | 2019-03-17 | 2020-08-11 | Mellanox Technologies, Ltd. | Multi-form-factor connector |
TWI732491B (zh) * | 2019-03-19 | 2021-07-01 | 美商莫仕有限公司 | 計算盒子及其卡組件 |
US11086081B2 (en) | 2019-03-21 | 2021-08-10 | Schweitzer Engineering Laboratories, Inc. | Conductive cooling for small form-factor pluggable (SFP) fiber optic transceivers |
TWI735857B (zh) * | 2019-03-29 | 2021-08-11 | 佳必琪國際股份有限公司 | 小型可插拔連接器殼體結構 |
CN210404248U (zh) * | 2019-04-08 | 2020-04-24 | 莫列斯有限公司 | 电连接装置 |
US10925186B2 (en) * | 2019-05-15 | 2021-02-16 | Hewlett Packard Enterprise Development Lp | Vertical lift heat transfer device for pluggable modules |
CN112180519B (zh) * | 2019-07-01 | 2022-09-16 | 台达电子工业股份有限公司 | 光学收发器散热模块 |
TWI688319B (zh) * | 2019-07-29 | 2020-03-11 | 緯創資通股份有限公司 | 可限制不同模組安裝順序之電子裝置及其機殼模組 |
US10939573B1 (en) * | 2019-08-28 | 2021-03-02 | Dell Products, L.P. | Electronic module carrier for an information handling system |
CN112531371B (zh) * | 2019-09-17 | 2022-06-03 | 美国莫列斯有限公司 | 连接器组合 |
WO2021061916A1 (en) | 2019-09-27 | 2021-04-01 | Fci Usa Llc | High performance stacked connector |
CN210430205U (zh) * | 2019-09-30 | 2020-04-28 | 东莞讯滔电子有限公司 | 电连接器 |
US10952355B1 (en) * | 2019-10-16 | 2021-03-16 | Juniper Networks, Inc | Apparatus, system, and method for electromagnetic interference mitigation in optical module cages |
CN210630166U (zh) * | 2019-10-18 | 2020-05-26 | 莫列斯有限公司 | 连接器组件 |
US11169330B2 (en) | 2019-10-24 | 2021-11-09 | Mellanox Technologies Tlv Ltd. | Wavelength-splitting optical cable |
US11653474B2 (en) | 2019-11-20 | 2023-05-16 | Molex, Llc | Connector assembly |
TWI733445B (zh) * | 2019-12-05 | 2021-07-11 | 台灣莫仕股份有限公司 | 連接器組件 |
CN114731774A (zh) * | 2019-12-31 | 2022-07-08 | 华为技术有限公司 | 光口屏蔽固定装置、光模块及通信设备 |
CN115513728A (zh) * | 2020-01-15 | 2022-12-23 | 莫列斯有限公司 | 连接器组件 |
TWI797413B (zh) * | 2020-01-15 | 2023-04-01 | 台灣莫仕股份有限公司 | 連接器組件 |
CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
TWI718873B (zh) * | 2020-02-18 | 2021-02-11 | 四零四科技股份有限公司 | 具有可活動導熱組件的電子裝置及其相關的散熱模組 |
TWI704862B (zh) * | 2020-02-20 | 2020-09-11 | 四零四科技股份有限公司 | 將可抽換模組所產生之熱量傳導至機殼模組之散熱結構以及具有前述散熱結構之電子裝置 |
US11152750B2 (en) * | 2020-03-12 | 2021-10-19 | TE Connectivity Services Gmbh | Corner EMI springs for a receptacle cage |
TWI728765B (zh) | 2020-03-30 | 2021-05-21 | 台灣莫仕股份有限公司 | 連接器組件 |
CN113471748B (zh) | 2020-03-30 | 2024-01-30 | 莫列斯有限公司 | 连接器组件 |
TWI730712B (zh) | 2020-04-09 | 2021-06-11 | 財團法人工業技術研究院 | 具有降低串音干擾的高速連接器與絕緣塑膠件 |
US11245230B2 (en) | 2020-05-18 | 2022-02-08 | TE Connectivity Services Gmbh | EMI shielding for a receptacle cage |
CN113823932A (zh) * | 2020-06-18 | 2021-12-21 | 莫列斯有限公司 | 连接器组件 |
US11249264B2 (en) * | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
US11300363B2 (en) * | 2020-07-07 | 2022-04-12 | Cisco Technology, Inc. | Heat sink assembly for electronic equipment |
TWM603661U (zh) * | 2020-07-23 | 2020-11-01 | 瑞傳科技股份有限公司 | 電子裝置機板省力抽拔結構 |
US11462852B2 (en) | 2020-08-14 | 2022-10-04 | Google Llc | Blind mate thermal cooling solution for small form factor pluggable transceiver |
CN213151096U (zh) * | 2020-08-27 | 2021-05-07 | 泰科电子(上海)有限公司 | 连接器壳体组件 |
TWI748639B (zh) | 2020-09-09 | 2021-12-01 | 至良科技股份有限公司 | 電連接器組及其插座及插頭 |
CN114269106A (zh) * | 2020-09-16 | 2022-04-01 | 华为技术有限公司 | 散热装置和电子设备 |
US11665857B2 (en) * | 2020-09-17 | 2023-05-30 | Te Connectivity Solutions Gmbh | Heat sink assembly for an electrical connector assembly |
US11199669B1 (en) * | 2020-09-24 | 2021-12-14 | Hewlett Packard Enterprise Development Lp | Modular faceplate optical sub-assembly |
CN114256699A (zh) * | 2020-09-25 | 2022-03-29 | 莫列斯有限公司 | 连接器组件 |
US11678466B2 (en) * | 2020-11-03 | 2023-06-13 | Cisco Technology, Inc. | Heat sink for optical module |
US11367979B1 (en) | 2020-12-28 | 2022-06-21 | Industrial Technology Research Institute | Terminal components of connector and connector structure |
US11450980B2 (en) * | 2021-01-04 | 2022-09-20 | Te Connectivity Solutions Gmbh | Receptacle cage for a receptacle connector assembly |
CN214204113U (zh) * | 2021-03-02 | 2021-09-14 | 东莞立讯技术有限公司 | 接口连接器 |
US20230107130A1 (en) * | 2021-09-30 | 2023-04-06 | Nanning Fulian Fugui Precision Industrial Co., Ltd. | Computer expansion module providing cooling for components placed therein |
JP2023074201A (ja) * | 2021-11-17 | 2023-05-29 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ装置 |
US11855381B2 (en) * | 2022-02-16 | 2023-12-26 | Hewlett Packard Enterprise Development Lp | Chassis having an insertion key assembly for a pluggable module |
US11924959B2 (en) * | 2022-04-19 | 2024-03-05 | Dell Products L.P. | Heatsink based power delivery for CPUs |
US11809004B1 (en) * | 2022-05-06 | 2023-11-07 | Juniper Networks, Inc. | Systems and methods for electromagnetic interference absorptive brushes |
US11997824B2 (en) | 2022-08-17 | 2024-05-28 | Eagle Technology, Llc | Systems and methods for providing a high performance air-cooled chassis for electronic modules |
TWI832606B (zh) * | 2022-12-12 | 2024-02-11 | 台灣莫仕股份有限公司 | 連接器組件 |
Family Cites Families (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2042827B (en) * | 1979-02-23 | 1983-04-13 | Trw Inc | Connector hood constructions |
US4414605A (en) * | 1981-06-29 | 1983-11-08 | The United States Of America As Represented By The Secretary Of The Navy | Positive locking mechanism |
US4401355A (en) * | 1981-07-01 | 1983-08-30 | Rca Corporation | Filtered connector |
US4659163A (en) * | 1984-06-13 | 1987-04-21 | Amp Incorporated | Filtered shielded connector assembly |
US4597173A (en) * | 1984-06-20 | 1986-07-01 | The United States Of America As Represented By The Secretary Of The Navy | Electronic module insertion and retraction mechanism |
US4738637A (en) * | 1985-10-11 | 1988-04-19 | Amp Incorporated | Receptacle assembly with ground plane spring |
EP0249406A1 (en) * | 1986-06-10 | 1987-12-16 | Allied Corporation | Multi-core cable connectors |
US5640302A (en) * | 1992-06-29 | 1997-06-17 | Elonex Ip Holdings | Modular portable computer |
US5316495A (en) * | 1993-01-15 | 1994-05-31 | The Whitaker Corporation | Latching system for electrical connectors |
US5464054A (en) | 1993-08-09 | 1995-11-07 | Thermalloy, Inc. | Spring clamp and heat sink assembly |
SE502998C2 (sv) * | 1994-06-10 | 1996-03-11 | Ericsson Telefon Ab L M | Elektriskt kopplingsdon samt kretskort |
US5524908A (en) | 1994-09-14 | 1996-06-11 | W. L. Gore & Associates | Multi-layer EMI/RFI gasket shield |
US5492480A (en) | 1994-10-31 | 1996-02-20 | Fusselman; David L. | Memory card connector having improved resilient eject mechanism and method of use |
US5546281A (en) | 1995-01-13 | 1996-08-13 | Methode Electronics, Inc. | Removable optoelectronic transceiver module with potting box |
JP3057546B2 (ja) * | 1995-02-23 | 2000-06-26 | モレックス インコーポレーテッド | ガイド機構付きコネクタ組立 |
US5600540A (en) | 1995-05-15 | 1997-02-04 | Blomquist; Michael L. | Heat sink and retainer for electronic integrated circuits |
WO1998002940A1 (de) | 1996-07-12 | 1998-01-22 | Siemens Aktiengesellschaft | Geschirmte leiterplattensteckbuchse mit schirmungskontaktierung zu einer gerätewand |
US5805430A (en) | 1996-07-22 | 1998-09-08 | International Business Machines Corporation | Zero force heat sink |
US5793614A (en) * | 1996-09-03 | 1998-08-11 | Tektronix, Inc. | Injector/ejector for electronic module housing |
US5959244A (en) * | 1997-08-29 | 1999-09-28 | Hewlett-Packard Company | Front and rear contacting EMI gasket |
US5901263A (en) | 1997-09-12 | 1999-05-04 | International Business Machines Corporation | Hot pluggable module integrated lock/extraction tool |
CN2358604Y (zh) * | 1998-11-25 | 2000-01-12 | 富士康(昆山)电脑接插件有限公司 | 电连接器的退卡装置 |
US6095862A (en) * | 1999-02-04 | 2000-08-01 | Molex Incorporated | Adapter frame assembly for electrical connectors |
TW415681U (en) | 1999-02-11 | 2000-12-11 | Hon Hai Prec Ind Co Ltd | Electronic card connector |
US6362961B1 (en) * | 1999-04-22 | 2002-03-26 | Ming Chin Chiou | CPU and heat sink mounting arrangement |
US6135793A (en) * | 1999-08-26 | 2000-10-24 | 3Com Corporation | Coupler for grounding of a modular transceiver housing |
US6517382B2 (en) * | 1999-12-01 | 2003-02-11 | Tyco Electronics Corporation | Pluggable module and receptacle |
JP4174149B2 (ja) * | 1999-12-01 | 2008-10-29 | 矢崎総業株式会社 | 半嵌合防止コネクタ |
US6524134B2 (en) * | 1999-12-01 | 2003-02-25 | Tyco Electronics Corporation | Pluggable module and receptacle |
US6231384B1 (en) * | 1999-12-29 | 2001-05-15 | Hon Hai Precision Ind. Co., Ltd. | Panel mounted cable end connector |
US6335869B1 (en) | 2000-01-20 | 2002-01-01 | International Business Machines Corporation | Removable small form factor fiber optic transceiver module and electromagnetic radiation shield |
US6482017B1 (en) * | 2000-02-10 | 2002-11-19 | Infineon Technologies North America Corp. | EMI-shielding strain relief cable boot and dust cover |
US6508595B1 (en) * | 2000-05-11 | 2003-01-21 | International Business Machines Corporation | Assembly of opto-electronic module with improved heat sink |
US6368122B2 (en) * | 2000-05-23 | 2002-04-09 | Hon Hai Precisiopn Ind. Co., Ltd. | Bracket having a recoverable door |
DE50006288D1 (de) * | 2000-08-10 | 2004-06-03 | Infineon Technologies Ag | Schirmblech, insbesondere für opto-elektronische transceiver |
US6558191B2 (en) * | 2000-08-22 | 2003-05-06 | Tyco Electronics Corporation | Stacked transceiver receptacle assembly |
TW454982U (en) * | 2000-08-24 | 2001-09-11 | Hon Hai Prec Ind Co Ltd | Socket connector |
TW505267U (en) | 2001-01-04 | 2002-10-01 | Hon Hai Prec Ind Co Ltd | Fastener for heat sink device |
US6607308B2 (en) * | 2001-02-12 | 2003-08-19 | E20 Communications, Inc. | Fiber-optic modules with shielded housing/covers having mixed finger types |
US6371787B1 (en) | 2001-03-07 | 2002-04-16 | International Business Machines Corporation | Pull-to-release type latch mechanism for removable small form factor electronic modules |
US6419523B1 (en) | 2001-04-04 | 2002-07-16 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6364709B1 (en) | 2001-04-20 | 2002-04-02 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6443768B1 (en) | 2001-09-14 | 2002-09-03 | Molex Incorporated | Small form factor connector cage |
US6416361B1 (en) * | 2001-11-16 | 2002-07-09 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6368153B1 (en) | 2001-11-16 | 2002-04-09 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6478622B1 (en) | 2001-11-27 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6434015B1 (en) | 2001-12-03 | 2002-08-13 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable module having release device |
US6614659B2 (en) * | 2001-12-07 | 2003-09-02 | Delphi Technologies, Inc. | De-mountable, solderless in-line lead module package with interface |
US6430053B1 (en) | 2001-12-13 | 2002-08-06 | Stratos Lightwave | Pluggable transceiver module having rotatable release and removal lever with living hinge |
US6788540B2 (en) | 2002-01-30 | 2004-09-07 | Jds Uniphase Corporation | Optical transceiver cage |
-
2003
- 2003-03-05 AU AU2003220046A patent/AU2003220046A1/en not_active Abandoned
- 2003-03-05 US US10/382,212 patent/US7001217B2/en not_active Expired - Lifetime
- 2003-03-05 AU AU2003213734A patent/AU2003213734A1/en not_active Abandoned
- 2003-03-05 WO PCT/US2003/006760 patent/WO2003077376A1/en not_active Application Discontinuation
- 2003-03-05 AU AU2003223221A patent/AU2003223221A1/en not_active Abandoned
- 2003-03-05 US US10/379,887 patent/US6752663B2/en not_active Expired - Lifetime
- 2003-03-05 US US10/382,214 patent/US6749448B2/en not_active Expired - Lifetime
- 2003-03-05 WO PCT/US2003/006829 patent/WO2003077375A1/en active Application Filing
- 2003-03-05 CN CNB038084317A patent/CN1314307C/zh not_active Expired - Lifetime
- 2003-03-05 US US10/382,208 patent/US6816376B2/en not_active Expired - Lifetime
- 2003-03-05 JP JP2003575470A patent/JP4251452B2/ja not_active Expired - Lifetime
- 2003-03-05 JP JP2003575687A patent/JP4632289B2/ja not_active Expired - Lifetime
- 2003-03-05 CN CNB038084333A patent/CN100377443C/zh not_active Expired - Lifetime
- 2003-03-05 WO PCT/US2003/006828 patent/WO2003077377A1/en not_active Application Discontinuation
- 2003-03-05 WO PCT/US2003/006574 patent/WO2003077626A1/en active Application Filing
- 2003-03-05 AU AU2003220045A patent/AU2003220045A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2003077626A1 (en) | 2003-09-18 |
US20030171033A1 (en) | 2003-09-11 |
CN1647322A (zh) | 2005-07-27 |
JP4251452B2 (ja) | 2009-04-08 |
WO2003077375A1 (en) | 2003-09-18 |
WO2003077377A1 (en) | 2003-09-18 |
WO2003077376A1 (en) | 2003-09-18 |
US20030171016A1 (en) | 2003-09-11 |
JP2005519452A (ja) | 2005-06-30 |
CN1314307C (zh) | 2007-05-02 |
CN100377443C (zh) | 2008-03-26 |
US6816376B2 (en) | 2004-11-09 |
AU2003213734A1 (en) | 2003-09-22 |
AU2003220046A1 (en) | 2003-09-22 |
US20030169581A1 (en) | 2003-09-11 |
AU2003223221A1 (en) | 2003-09-22 |
US20030161108A1 (en) | 2003-08-28 |
US6752663B2 (en) | 2004-06-22 |
AU2003220045A1 (en) | 2003-09-22 |
CN1647599A (zh) | 2005-07-27 |
JP2005520296A (ja) | 2005-07-07 |
US7001217B2 (en) | 2006-02-21 |
US6749448B2 (en) | 2004-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4632289B2 (ja) | プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル | |
TWI658777B (zh) | 具有附接散熱器之殼體 | |
US6980437B2 (en) | Pluggable electronic receptacle with heat sink assembly | |
US7539018B2 (en) | Heat sink retaining clip for an electrical connector assembly | |
US8870471B2 (en) | Receptacle cage, receptacle assembly, and transceiver module assembly | |
CN108738278B (zh) | 用于电连接器组件的散热器 | |
US7794241B2 (en) | Straddle mount connector for pluggable transceiver module | |
US6304436B1 (en) | Connector system with outwardly opening door for a removable transceiver module | |
US6788540B2 (en) | Optical transceiver cage | |
US20080285236A1 (en) | Heat transfer system for a receptacle assembly | |
US7583510B2 (en) | Transceiver cage assembly with grounding device | |
US7037136B1 (en) | Connector module | |
JP2005196213A (ja) | トランシーバモジュール組立体 | |
US20140202755A1 (en) | Receptacle cage, receptacle assembly, and transceiver module assembly | |
US6972968B2 (en) | Shielding cage assembly adapted for dense transceiver modules | |
CN114400468A (zh) | 连接器系统 | |
US11515666B2 (en) | System for vehicle battery charging around charge-adverse time periods | |
CN111900567A (zh) | 具有电缆式插座连接器的插座组件 | |
US6867969B2 (en) | Shielding cage assembly adapted for dense transceiver modules | |
WO2006066046A1 (en) | Emi gasket for plug connector with latch mechanism | |
CN116646783A (zh) | 连接器组件 | |
CN115149318A (zh) | 罩壳及具有罩壳的插座组件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060228 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080616 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080911 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081111 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101001 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101111 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4632289 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131126 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |