JP4251452B2 - トランシーバモジュール組立体のイジェクタ機構 - Google Patents
トランシーバモジュール組立体のイジェクタ機構 Download PDFInfo
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- JP4251452B2 JP4251452B2 JP2003575470A JP2003575470A JP4251452B2 JP 4251452 B2 JP4251452 B2 JP 4251452B2 JP 2003575470 A JP2003575470 A JP 2003575470A JP 2003575470 A JP2003575470 A JP 2003575470A JP 4251452 B2 JP4251452 B2 JP 4251452B2
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
- H01R13/6584—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members formed by conductive elastomeric members, e.g. flat gaskets or O-rings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/939—Electrical connectors with grounding to metal mounting panel
Description
104 リセプタクル組立体
106 ホスト基板(印刷回路基板)
122 ガイドフレーム
128 上壁
130 下壁
132,134 側壁
180,600 イジェクタ機構
182,636 ベイル
184,622,624 駆動アーム
512 足部
514 主本体
516 イジェクタタブ
520 足部
526 段状輪郭
527 内面
528 傾斜前端
530 傾斜面
534 スロット
536,630,632 付勢要素
538,539 側壁
540 保持収容室
548 肩
640 横棒
642,644 クリップ
Claims (22)
- 印刷回路基板に実装するよう構成されたリセプタクル組立体に係止するよう構成され電気モジュール組立体において、
前記リセプタクル組立体の対向する両側壁のそれぞれに沿って縦方向に延びるよう構成された駆動アームを有するイジェクタ機構を具備し、
前記駆動アームは、該駆動アームと共に縦方向に延びるイジェクタタブと、前記駆動アームの各々と共に該各駆動アームと接触した状態で縦方向に延びる付勢要素とを具備し、
前記駆動アームは、前記イジェクタタブに隣接すると共に該イジェクタタブに向かって傾斜する傾斜前端を具備し、
前記イジェクタタブは前記傾斜前端とは逆に傾斜する傾斜面を具備することを特徴とする電気モジュール組立体。 - 前記駆動アームは段状輪郭を有する内面を具備することを特徴とする請求項1に記載の電気モジュール組立体。
- 前記駆動アームは、スロットを有する内面を具備し、
前記付勢要素の一つは前記スロット内に配置されることを特徴とする請求項1に記載の電気モジュール組立体。 - 前記付勢要素は前記駆動アームと共平面に延びることを特徴とする請求項1に記載の電気モジュール組立体。
- 前記駆動アームは、前記駆動アームの縦軸にほぼ直交して延びる足部を具備することを特徴とする請求項1に記載の電気モジュール組立体。
- 前記駆動アームに接触した状態で回転可能に実装されたベイルをさらに具備することを特徴とする請求項1に記載の電気モジュール組立体。
- 前記電気モジュール組立体は回転可能に実装されたベイルをさらに具備し、
該ベイルは、該ベイルから鈍角に延びて前記駆動アームと接触状態にある少なくとも一つの足部を具備することを特徴とする請求項1に記載の電気モジュール組立体。 - 前記駆動アームは第1駆動アーム及び第2駆動アームを具備し、
前記電気モジュール組立体は、前記第1及び第2駆動アームの間を延びる横棒をさらに具備し、
該横棒は、ベイルを受容するよう構成された第1及び第2クリップを具備することを特徴とする請求項1に記載の電気モジュール組立体。 - 前記駆動アームは、縦方向に延びる主本体と、該主本体から縦方向に延びるイジェクタタブと、該主本体から横方向に延びる足部と具備することを特徴とする請求項1に記載の電気モジュール組立体。
- 前記駆動アームの前記イジェクタタブは、前記駆動アームの主本体に対して小さい幅を有することを特徴とする請求項1に記載の電気モジュール組立体。
- 印刷回路基板に実装するよう構成されたリセプタクル組立体に係止するよう構成された電気モジュール組立体において、
第1及び第2側壁と、イジェクタ機構とを具備し、
前記第1及び第2側壁の各々は、保持収容室を有すると共に、前記リセプタクル組立体のガイドフレーム内に摺動可能に挿入するよう構成され、
前記イジェクタ機構は、前記ガイドフレームの対向する両側壁のそれぞれに隣接して縦方向に延びるよう構成された第1及び第2駆動アームを具備し、
該各アームは、該各アームと共に縦方向に延びて前記ガイドフレームの各側壁に形成された係止タブを撓めるよう構成されたイジェクタタブと、前記各駆動アームに当接する縦方向に延びる付勢要素とを具備し、
前記駆動アームは、前記イジェクタタブに隣接すると共に該イジェクタタブに向かって傾斜する傾斜前端を具備し、
前記イジェクタタブは前記傾斜前端とは逆に傾斜する傾斜面を具備することを特徴とする電気モジュール組立体。 - 前記各駆動アームは、縦方向に延びる主本体と、該主本体から縦方向に延びるイジェクタタブと、該主本体から横方向に延びる足部と具備することを特徴とする請求項11記載の電気モジュール組立体。
- 前記各駆動アームは、前記モジュール組立体の前記各側壁の保持収容室内に摺動挿入するよう構成された段状輪郭面を有することを特徴とする請求項11記載の電気モジュール組立体。
- 前記各駆動アームの内面はスロットを有し、
該スロットは前記付勢要素をそれぞれ含み、
該付勢要素は、前記モジュール組立体の保持収容室の肩と着座係合した状態であることを特徴とする請求項11記載の電気モジュール組立体。 - 前記電気モジュール組立体はベイルをさらに具備し、
該ベイルは、該ベイルと鈍角に配向された足部を有し、
該足部は、前記駆動アームの外面の一部に接触すると共に、前記付勢要素に荷重を加えることを特徴とする請求項11記載の電気モジュール組立体。 - 上壁、下壁及び対向する両側壁を有するガイドフレームを具備するリセプタクル組立体であって、前記両側壁の各々は該側壁内に係止タブを有するリセプタクル組立体と、
前記ガイドフレーム内に挿入するよう構成されたトランシーバモジュール組立体であって、該トランシーバモジュール組立体は、該モジュール組立体が前記ガイドフレーム内に挿入される際に、前記ガイドフレームの前記両側壁に隣接して延びる対向する両側面を具備し、前記モジュール組立体の前記両側面の各々は、前記リセプタクル組立体の前記係止タブのそれぞれと係合する保持収容室を具備するトランシーバモジュール組立体と、
前記モジュール組立体の前記保持収容室と摺動係合するよう構成された実質的に平行な第1及び第2駆動アームを具備するイジェクタ機構であって、前記駆動アームは、前記ガイドフレームの前記各側壁に隣接して縦方向の配置可能であり、前記各駆動アームは、アームと共に縦方向に延びると共にガイドフレームの係止タブの各々を撓めるよう構成されたイジェクタタブを具備するイジェクタ機構と、
前記各駆動アームに当接する縦方向に延びる付勢要素とを具備し、
前記イジェクタタブに隣接すると共に該イジェクタタブに向かって傾斜する傾斜前端を具備し、
前記イジェクタタブは前記傾斜前端とは逆に傾斜する傾斜面を具備することを特徴とするモジュール組立体。 - 前記モジュール組立体は、鈍角に配向された足部を有する回転可能に実装されたベイルをさらに具備し、
前記足部は、係止位置及び非係止位置で前記ベイルに接触することを特徴とする請求項16記載のモジュール組立体。 - 前記各駆動アームと共に縦方向に延びる前記付勢要素は前記各駆動アームと一体に形成されたことを特徴とする請求項16記載のモジュール組立体。
- 前記保持収容室は、前記コンタクトアームの外側輪郭と相補的な形状をなすことを特徴とする請求項16記載のモジュール組立体。
- 前記各保持収容室は肩を有し、
該肩は、前記付勢要素の各々に対して着座を提供することを特徴とする請求項16記載のモジュール組立体。 - 前記各駆動アームは内面を有し、
該内面は前記付勢要素を保持するためのスロットを有することを特徴とする請求項16記載のモジュール組立体。 - 前記各駆動アームは段状面を有し、
前記各保持収容室は前記段状面を受容するよう構成されていることを特徴とする請求項16記載のモジュール組立体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36218502P | 2002-03-06 | 2002-03-06 | |
US37286102P | 2002-04-16 | 2002-04-16 | |
PCT/US2003/006829 WO2003077375A1 (en) | 2002-03-06 | 2003-03-05 | Transceiver module assembly ejector mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005519452A JP2005519452A (ja) | 2005-06-30 |
JP4251452B2 true JP4251452B2 (ja) | 2009-04-08 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003575687A Expired - Lifetime JP4632289B2 (ja) | 2002-03-06 | 2003-03-05 | プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル |
JP2003575470A Expired - Lifetime JP4251452B2 (ja) | 2002-03-06 | 2003-03-05 | トランシーバモジュール組立体のイジェクタ機構 |
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Application Number | Title | Priority Date | Filing Date |
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JP2003575687A Expired - Lifetime JP4632289B2 (ja) | 2002-03-06 | 2003-03-05 | プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル |
Country Status (5)
Country | Link |
---|---|
US (4) | US6752663B2 (ja) |
JP (2) | JP4632289B2 (ja) |
CN (2) | CN1314307C (ja) |
AU (4) | AU2003220045A1 (ja) |
WO (4) | WO2003077376A1 (ja) |
Families Citing this family (399)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060025786A1 (en) * | 1996-08-30 | 2006-02-02 | Verigen Transplantation Service International (Vtsi) Ag | Method for autologous transplantation |
US6980421B2 (en) * | 2002-06-28 | 2005-12-27 | Shuttle Inc. | Front panel for personal computer |
US6893293B2 (en) * | 2002-08-02 | 2005-05-17 | Finisar Corporation | Angled EMI shield for transceiver-PCB interface |
JP3982362B2 (ja) * | 2002-08-23 | 2007-09-26 | 住友電気工業株式会社 | 光データリンク |
JP2004111249A (ja) * | 2002-09-19 | 2004-04-08 | Fujitsu Component Ltd | コネクタ装置 |
US6916196B2 (en) * | 2003-03-22 | 2005-07-12 | Tyco Electronics Corporation | Push button de-latch mechanism for pluggable electronic module |
JP2004340373A (ja) * | 2003-04-21 | 2004-12-02 | Usui Kokusai Sangyo Kaisha Ltd | 外部制御式ファンクラッチの制御方法 |
US7627343B2 (en) | 2003-04-25 | 2009-12-01 | Apple Inc. | Media player system |
US6824416B2 (en) * | 2003-04-30 | 2004-11-30 | Agilent Technologies, Inc. | Mounting arrangement for plug-in modules |
US6776660B1 (en) | 2003-04-30 | 2004-08-17 | Japan Aviation Electronics Industry, Limited | Connector |
NL1023662C2 (nl) * | 2003-06-13 | 2004-12-14 | Framatome Connectors Int | Afschermingsbehuizing. |
JP3920256B2 (ja) * | 2003-10-02 | 2007-05-30 | 日本航空電子工業株式会社 | カード用コネクタ |
US6919505B2 (en) | 2003-12-04 | 2005-07-19 | Eaton Corporation | Electronic apparatus and enclosure employing substantially co-planar portions with mating crenellations |
US7090523B2 (en) * | 2004-01-06 | 2006-08-15 | Tyco Electronics Corporation | Release mechanism for transceiver module assembly |
US7406691B2 (en) | 2004-01-13 | 2008-07-29 | International Business Machines Corporation | Minimizing complex decisions to allocate additional resources to a job submitted to a grid environment |
US6872094B1 (en) * | 2004-03-01 | 2005-03-29 | Tyco Electronics Corporation | Transceiver pluggable module |
US6980437B2 (en) * | 2004-03-03 | 2005-12-27 | Tyco Electronics Corporation | Pluggable electronic receptacle with heat sink assembly |
JP4348725B2 (ja) * | 2004-03-25 | 2009-10-21 | Smk株式会社 | 電子部品取付用ソケット |
US7526588B1 (en) | 2004-04-27 | 2009-04-28 | Apple Inc. | Communication between an accessory and a media player using a protocol with multiple lingoes |
US7529871B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player with multiple protocol versions |
US7826318B2 (en) | 2004-04-27 | 2010-11-02 | Apple Inc. | Method and system for allowing a media player to transfer digital audio to an accessory |
US7529872B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player using a protocol with multiple lingoes |
US7529870B1 (en) | 2004-04-27 | 2009-05-05 | Apple Inc. | Communication between an accessory and a media player with multiple lingoes |
US7293122B1 (en) | 2004-04-27 | 2007-11-06 | Apple Inc. | Connector interface system facilitating communication between a media player and accessories |
US7895378B2 (en) | 2004-04-27 | 2011-02-22 | Apple Inc. | Method and system for allowing a media player to transfer digital audio to an accessory |
US7441062B2 (en) | 2004-04-27 | 2008-10-21 | Apple Inc. | Connector interface system for enabling data communication with a multi-communication device |
US7441058B1 (en) | 2006-09-11 | 2008-10-21 | Apple Inc. | Method and system for controlling an accessory having a tuner |
US8117651B2 (en) | 2004-04-27 | 2012-02-14 | Apple Inc. | Method and system for authenticating an accessory |
US7673083B2 (en) | 2004-04-27 | 2010-03-02 | Apple Inc. | Method and system for controlling video selection and playback in a portable media player |
EP1598686A3 (en) * | 2004-05-17 | 2005-12-07 | JDS Uniphase Corporation | RF absorbing strain relief bushing |
KR100617710B1 (ko) * | 2004-05-21 | 2006-08-28 | 삼성전자주식회사 | 플러그형 광송수신기 모듈의 체결 장치 |
US7266547B2 (en) | 2004-06-10 | 2007-09-04 | International Business Machines Corporation | Query meaning determination through a grid service |
JP2005352787A (ja) * | 2004-06-10 | 2005-12-22 | Matsushita Electric Ind Co Ltd | タイミング解析方法およびタイミング解析装置 |
WO2006010100A1 (en) * | 2004-07-07 | 2006-01-26 | Molex Incorporated | Mechanism for delatching small size plug connectors |
US7093985B2 (en) * | 2004-07-12 | 2006-08-22 | Protokraft, Llc | Wall mount fiber optic connector and associated method for forming the same |
US6991481B1 (en) * | 2004-07-16 | 2006-01-31 | Avonex Corporation | Method and apparatus for a latchable and pluggable electronic and optical module |
TWI251993B (en) * | 2004-08-06 | 2006-03-21 | Ind Tech Res Inst | Locking mechanism of removable optical module |
CN100360972C (zh) * | 2004-09-08 | 2008-01-09 | 财团法人工业技术研究院 | 一种可插拔式光学模块的伸出式闩锁结构 |
US7224582B1 (en) * | 2004-09-20 | 2007-05-29 | Nortel Networks Limited | Floating heatsink for removable components |
US7405931B2 (en) * | 2004-09-20 | 2008-07-29 | Nortel Networks Limited | Floating heatsink for removable components |
US7125261B2 (en) * | 2004-10-05 | 2006-10-24 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a pluggable function |
US20060078259A1 (en) * | 2004-10-12 | 2006-04-13 | Triquint Technology Holding Co. | Latching mechanism for small form factor pluggable modules |
GB2419470B (en) * | 2004-10-21 | 2009-04-29 | Agilent Technologies Inc | Temperature control of heat-generating devices |
GB2419476B (en) * | 2004-10-21 | 2009-04-08 | Agilent Technologies Inc | Optical networking systems |
US7033191B1 (en) | 2004-12-02 | 2006-04-25 | Optical Communication Products, Inc. | Pluggable optical transceiver with sliding actuator |
US7254034B2 (en) * | 2004-12-15 | 2007-08-07 | Lucent Technologies Inc. | Thermal management for shielded circuit packs |
US7322845B2 (en) * | 2004-12-16 | 2008-01-29 | Molex Incorporated | Connector delatching mechanism with return action |
US7309250B2 (en) * | 2004-12-16 | 2007-12-18 | Molex Incorporated | Plug connector ejector mechanism with integrated return action |
US7198414B2 (en) * | 2004-12-22 | 2007-04-03 | Finisar Corporation | Planar decoupling in optical subassembly |
US7249895B2 (en) * | 2004-12-22 | 2007-07-31 | Finisar Corporation | Optical transceiver with capacitive coupled signal ground with chassis ground |
US7511970B2 (en) * | 2004-12-27 | 2009-03-31 | Cisco Technology, Inc. | Method and apparatus for shielding a circuit board of a circuit board chassis |
US7859847B2 (en) * | 2004-12-29 | 2010-12-28 | Hewlett-Packard Development Company, L.P. | Spring adapted to hold electronic device in a frame |
US7668741B2 (en) * | 2005-01-06 | 2010-02-23 | International Business Machines Corporation | Managing compliance with service level agreements in a grid environment |
US7590623B2 (en) | 2005-01-06 | 2009-09-15 | International Business Machines Corporation | Automated management of software images for efficient resource node building within a grid environment |
US7525216B2 (en) | 2005-01-07 | 2009-04-28 | Apple Inc. | Portable power source to provide power to an electronic device via an interface |
US7823214B2 (en) | 2005-01-07 | 2010-10-26 | Apple Inc. | Accessory authentication for electronic devices |
US7562035B2 (en) | 2005-01-12 | 2009-07-14 | International Business Machines Corporation | Automating responses by grid providers to bid requests indicating criteria for a grid job |
US7571120B2 (en) | 2005-01-12 | 2009-08-04 | International Business Machines Corporation | Computer implemented method for estimating future grid job costs by classifying grid jobs and storing results of processing grid job microcosms |
US7349200B2 (en) * | 2005-02-04 | 2008-03-25 | Hewlett-Packard Development Company, L.P. | Latching mechanism |
JP4614803B2 (ja) * | 2005-03-25 | 2011-01-19 | 富士通株式会社 | Sfpモジュールの実装構造 |
EP1708311B1 (en) * | 2005-03-29 | 2008-12-31 | Fourte Design & Development | Fiber optic transceiver module secured in a cage and release mechanism |
JP4708827B2 (ja) * | 2005-03-29 | 2011-06-22 | フォート デザイン アンド デヴェロップメント | 光ファイバコネクタ解除機構 |
US7433193B2 (en) * | 2005-05-11 | 2008-10-07 | Cisco Technology, Inc. | Techniques for controlling a position of a transceiver module relative to a connector |
JP2006352068A (ja) * | 2005-05-19 | 2006-12-28 | Opnext Japan Inc | プラガブルモジュールおよびケージ |
WO2006129281A2 (en) * | 2005-06-02 | 2006-12-07 | Koninklijke Philips Electronics N.V. | Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module |
US7457126B2 (en) | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
KR100693920B1 (ko) * | 2005-07-07 | 2007-03-12 | 삼성전자주식회사 | 히트 스프레더, 이를 갖는 반도체 패키지 모듈 및 메모리모듈 |
US20070036489A1 (en) * | 2005-08-15 | 2007-02-15 | Barbara Grzegorzewska | Industrial interconnect system incorporating transceiver module cage |
US7150653B1 (en) * | 2005-09-21 | 2006-12-19 | Cisco Technology, Inc. | Techniques for EMI shielding of a transceiver module |
JP4819490B2 (ja) * | 2005-11-28 | 2011-11-24 | 富士通株式会社 | Sfpモジュールの実装構造 |
US7322854B2 (en) * | 2005-12-06 | 2008-01-29 | Molex Incorporated | Spring-biased EMI shroud |
JP4730092B2 (ja) * | 2005-12-28 | 2011-07-20 | 日立電線株式会社 | ラッチ機構及びラッチ機構付き電子モジュール |
US7455554B2 (en) | 2005-12-28 | 2008-11-25 | Molex Incorporated | EMI shroud with bidirectional contact members |
JP2007200422A (ja) * | 2006-01-25 | 2007-08-09 | Toshiba Corp | パタンド磁気記録媒体の製造方法 |
US7355857B2 (en) * | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
US7195404B1 (en) | 2006-03-03 | 2007-03-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver module with electromagnetic interference absorbing material and method for making the module |
US7422481B2 (en) * | 2006-03-22 | 2008-09-09 | Finisar Corporation | Electromagnetic interference containment in a transceiver module |
US7585005B1 (en) | 2006-03-23 | 2009-09-08 | Emc Corporation | Locking mechanism for securing bezels |
US7211739B1 (en) | 2006-03-27 | 2007-05-01 | Emc Corporation | Electromagnetic interference (EMI) shield for a cable-bulkhead interface |
US7632114B2 (en) * | 2006-03-30 | 2009-12-15 | Apple Inc. | Interface connecter between media player and other electronic devices |
CN200950168Y (zh) * | 2006-04-26 | 2007-09-19 | 武汉电信器件有限公司 | 光电模块单臂拉环式解锁装置 |
US7529094B2 (en) * | 2006-04-28 | 2009-05-05 | Tyco Electronics Corporation | Integrated heat sink and light pipe mounting assembly |
US7296937B1 (en) * | 2006-05-05 | 2007-11-20 | Tyco Electronics Corporation | Transceiver module assembly with unlatch detection switch |
US8006019B2 (en) | 2006-05-22 | 2011-08-23 | Apple, Inc. | Method and system for transferring stored data between a media player and an accessory |
US7415563B1 (en) | 2006-06-27 | 2008-08-19 | Apple Inc. | Method and system for allowing a media player to determine if it supports the capabilities of an accessory |
US20080019100A1 (en) * | 2006-07-18 | 2008-01-24 | All Best Electronics Co., Ltd. | Plug module base with heat dissipating element |
TWM306031U (en) * | 2006-08-11 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Shielding device and electronic product using the same |
JP4199272B2 (ja) * | 2006-08-23 | 2008-12-17 | 日本航空電子工業株式会社 | コネクタ |
US7499286B2 (en) * | 2006-08-31 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Mounting adapter for electronic modules |
US7558894B1 (en) | 2006-09-11 | 2009-07-07 | Apple Inc. | Method and system for controlling power provided to an accessory |
US7804696B2 (en) * | 2006-12-07 | 2010-09-28 | Finisar Corporation | Electromagnetic radiation containment in an electronic module |
US7646615B2 (en) * | 2006-12-19 | 2010-01-12 | Finisar Corporation | Electromagnetic inferference shield for an optoelectronic module |
US7547149B2 (en) * | 2006-12-19 | 2009-06-16 | Finisar Corporation | Optical connector latch assembly for an optoelectronic module |
US7845862B2 (en) * | 2006-12-19 | 2010-12-07 | Finisar Corporation | Communications device |
US7625137B2 (en) * | 2006-12-19 | 2009-12-01 | Finisar Corporation | Communications device |
US7540788B2 (en) | 2007-01-05 | 2009-06-02 | Apple Inc. | Backward compatible connector system |
US7438596B2 (en) * | 2007-01-12 | 2008-10-21 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
US7322841B1 (en) * | 2007-02-19 | 2008-01-29 | Inventec Corporation | Push-pull mechanism for removable electronic device |
CN201104378Y (zh) * | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
JP5227396B2 (ja) * | 2007-05-04 | 2013-07-03 | トムソン ライセンシング | スマートカードヒートシンク |
DE202007006626U1 (de) * | 2007-05-09 | 2007-10-04 | Hamburg Industries Co., Ltd., Shen Keng | Verbindungseinrichtung |
US7764504B2 (en) * | 2007-05-16 | 2010-07-27 | Tyco Electronics Corporation | Heat transfer system for a receptacle assembly |
JP2008287111A (ja) * | 2007-05-18 | 2008-11-27 | Fujitsu Ltd | プラガブルモジュール |
US7928324B2 (en) * | 2007-06-20 | 2011-04-19 | Finisar Corporation | Gasketed collar for reducing electromagnetic interference (EMI) emission from optical communication module |
US7554805B2 (en) * | 2007-06-25 | 2009-06-30 | Shuttle Inc. | Heat dissipation structure for electronic devices |
US7614913B2 (en) * | 2007-06-28 | 2009-11-10 | Finisar Corporation | Connector receptacle with receptacle EMI shield |
CN201115287Y (zh) * | 2007-08-20 | 2008-09-10 | 鸿富锦精密工业(深圳)有限公司 | 屏蔽装置及使用所述屏蔽装置的电子产品 |
US7422457B1 (en) | 2007-08-31 | 2008-09-09 | Hon Hai Precision Ind. Co., Ltd. | Plug-in module with improved latch mechanism |
US8095713B2 (en) * | 2007-09-04 | 2012-01-10 | Apple Inc. | Smart cables |
US7841779B1 (en) | 2007-09-07 | 2010-11-30 | Fourte Design & Development, Llc | Fiber optic module release mechanism |
US7445485B1 (en) | 2007-09-12 | 2008-11-04 | Hon Hai Precision Ind. Co., Ltd. | Latch mechanism with pull tape |
US7402070B1 (en) | 2007-09-12 | 2008-07-22 | Hon Hai Precision Ind. Co., Ltd. | Latch mechanism with spring back function |
US7539018B2 (en) * | 2007-10-31 | 2009-05-26 | Tyco Electronics Corporation | Heat sink retaining clip for an electrical connector assembly |
US7557305B2 (en) * | 2007-11-01 | 2009-07-07 | Nextronics Engineering Corp. | Connector housing for a small and portable transmitting-receiving module |
US7559800B2 (en) * | 2007-12-05 | 2009-07-14 | Hon Hai Precision Ind. Co., Ltd. | Electronic module with anti-EMI metal gasket |
JP4915342B2 (ja) * | 2007-12-21 | 2012-04-11 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
JP4998249B2 (ja) * | 2007-12-21 | 2012-08-15 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
US7760507B2 (en) * | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
US7525818B1 (en) | 2008-01-11 | 2009-04-28 | Tyco Electronics Corporation | Memory card connector with EMI shielding |
US7555191B1 (en) | 2008-01-30 | 2009-06-30 | Joshua John Edward Moore | Self-locking unidirectional interposer springs for optical transceiver modules |
US8047966B2 (en) | 2008-02-29 | 2011-11-01 | Apple Inc. | Interfacing portable media devices and sports equipment |
US7780361B2 (en) * | 2008-04-02 | 2010-08-24 | Ciena Corporation | Card guide and heatsink assemblies for pluggable electro-optic modules |
US7621773B2 (en) * | 2008-04-11 | 2009-11-24 | Tyco Electronics Corporation | Receptacle assembly including a light pipe structure |
US7727018B2 (en) * | 2008-04-22 | 2010-06-01 | Tyco Electronics Corporation | EMI gasket for an electrical connector assembly |
US7859849B2 (en) * | 2008-05-14 | 2010-12-28 | Finisar Corporation | Modular heatsink mounting system |
CN101600331B (zh) * | 2008-06-04 | 2012-10-03 | 富士康(昆山)电脑接插件有限公司 | 屏蔽罩 |
US7852633B2 (en) | 2008-07-24 | 2010-12-14 | Yamaichi Electronics Co., Ltd. | Connector for connection to a module board |
US7892007B2 (en) * | 2008-08-15 | 2011-02-22 | 3M Innovative Properties Company | Electrical connector assembly |
US8098493B2 (en) * | 2008-08-15 | 2012-01-17 | Finisar Corporation | CFP mechanical platform |
US7789676B2 (en) * | 2008-08-19 | 2010-09-07 | Tyco Electronics Corporation | Electrical connector with electrically shielded terminals |
US7641515B1 (en) | 2008-08-21 | 2010-01-05 | Tyco Electronics Corporation | Center plate for a connector assembly |
US8238811B2 (en) | 2008-09-08 | 2012-08-07 | Apple Inc. | Cross-transport authentication |
US8208853B2 (en) | 2008-09-08 | 2012-06-26 | Apple Inc. | Accessory device authentication |
US7733652B2 (en) * | 2008-09-17 | 2010-06-08 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
US7625223B1 (en) | 2008-10-01 | 2009-12-01 | Tyco Electronics Corporation | Connector system with floating heat sink |
US8035975B2 (en) * | 2008-10-14 | 2011-10-11 | Hon Hai Precision Ind. Co., Ltd. | Low profile electronic module with ejector mechanism |
US8064207B2 (en) * | 2008-10-14 | 2011-11-22 | Hon Hai Precision Ind. Co., Ltd. | Electronic module with ejector mechanism |
JP2010108800A (ja) * | 2008-10-31 | 2010-05-13 | Japan Aviation Electronics Industry Ltd | コネクタ |
JP5117621B2 (ja) * | 2008-11-03 | 2013-01-16 | フィニサー コーポレイション | 通信モジュールのグラウンドコンタクト |
CN101742833B (zh) * | 2008-11-20 | 2012-07-04 | 英业达股份有限公司 | 电子装置 |
US7878844B2 (en) * | 2009-01-08 | 2011-02-01 | Tyco Electronics Corporation | Panel connector assembly |
US7833068B2 (en) * | 2009-01-14 | 2010-11-16 | Tyco Electronics Corporation | Receptacle connector for a transceiver assembly |
US7794241B2 (en) | 2009-01-14 | 2010-09-14 | Tyco Electronics Corporation | Straddle mount connector for pluggable transceiver module |
US7704097B1 (en) | 2009-02-17 | 2010-04-27 | Tyco Electronics Corporation | Connector assembly having an electromagnetic seal element |
US8011950B2 (en) * | 2009-02-18 | 2011-09-06 | Cinch Connectors, Inc. | Electrical connector |
JP5342299B2 (ja) * | 2009-03-30 | 2013-11-13 | 古河電気工業株式会社 | コネクタおよびコネクタアセンブリ |
US8169783B2 (en) * | 2009-03-30 | 2012-05-01 | Tyco Electronics Corporation | Latch assembly for a pluggable electronic module |
US8123559B2 (en) * | 2009-04-01 | 2012-02-28 | Hon Hai Precision Ind. Co., Ltd. | Stacked pluggable cage having intermediate walls interengaged each other |
US8152562B2 (en) * | 2009-04-02 | 2012-04-10 | Fci Americas Technology Llc | Cable panel mount |
US8052335B2 (en) * | 2009-05-01 | 2011-11-08 | Ciena Corporation | Ejector apparatus and associated assembly method for pluggable transceivers |
CN101907908B (zh) * | 2009-06-04 | 2013-03-13 | 富准精密工业(深圳)有限公司 | 电子设备及其机箱 |
US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
CN101938061B (zh) * | 2009-07-02 | 2013-11-13 | 富士康(昆山)电脑接插件有限公司 | 线缆连接器组件 |
US7771225B1 (en) | 2009-07-13 | 2010-08-10 | Hon Hai Precision Ind. Co., Ltd. | Low profile electronic module with ejector |
US8035973B2 (en) * | 2009-08-31 | 2011-10-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage |
US7869224B1 (en) * | 2009-09-18 | 2011-01-11 | All Best Precision Technology Co., Ltd. | Housing structure for pluggable transceiver module |
US8534930B1 (en) | 2009-09-24 | 2013-09-17 | Juniper Networks, Inc. | Circuit boards defining openings for cooling electronic devices |
US8223498B2 (en) * | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
KR101093268B1 (ko) * | 2009-12-18 | 2011-12-14 | 삼성모바일디스플레이주식회사 | 표시 장치의 제조 방법 |
US8339784B2 (en) * | 2010-01-06 | 2012-12-25 | Methode Electronics, Inc. | Thermal management for electronic device housing |
JP5593714B2 (ja) * | 2010-01-29 | 2014-09-24 | 富士通株式会社 | 電子素子のシールド構造及びこれを備えた電子装置 |
US8203084B2 (en) * | 2010-03-16 | 2012-06-19 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
WO2011120188A1 (en) | 2010-03-29 | 2011-10-06 | Telefonaktiebolaget L M Ericsson (Publ) | Cooling device for pluggable module, assembly of the cooling device and the pluggable module |
WO2011140064A2 (en) * | 2010-05-03 | 2011-11-10 | Molex Incorporated | Emi gasket assembly for angled cage application and shielding cage incorporating same |
CN203136434U (zh) | 2010-05-19 | 2013-08-14 | 莫列斯公司 | 插座组件及emi屏蔽元件 |
US8011958B1 (en) * | 2010-05-19 | 2011-09-06 | Amphenol East Asia Electronic Technology (Shenzhen) Ltd. | E-easy series connector assembly with shielding function |
JP2011248243A (ja) * | 2010-05-28 | 2011-12-08 | Fujitsu Component Ltd | 光電変換モジュール及び光電変換装置 |
CN201966463U (zh) * | 2010-06-08 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | 电转接器 |
US9246280B2 (en) | 2010-06-15 | 2016-01-26 | Molex, Llc | Cage, receptacle and system for use therewith |
US8449203B2 (en) * | 2010-06-23 | 2013-05-28 | Tellabs Operations, Inc. | Cooling method for CXP active optical transceivers |
CN201774093U (zh) | 2010-07-26 | 2011-03-23 | 富士康(昆山)电脑接插件有限公司 | 连接器及其组件 |
US8382509B2 (en) | 2010-08-06 | 2013-02-26 | Fci Americas Technology Llc | Electrical connector assembly including compliant heat sink |
US8345426B2 (en) | 2010-08-16 | 2013-01-01 | Tyco Electronics Corporation | Guide system for a card module |
WO2012061142A2 (en) * | 2010-10-25 | 2012-05-10 | Molex Incorporated | Adapter frame with integrated emi and engagement aspects |
US8345445B2 (en) * | 2010-11-23 | 2013-01-01 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
TWI445483B (zh) * | 2010-12-23 | 2014-07-11 | Compal Electronics Inc | 殼體結構及具有其之電子裝置 |
US8427834B2 (en) * | 2010-12-28 | 2013-04-23 | International Business Machines Corporation | Rotatable latch for compressing thermal interface material between a heat generating electrical component and a cooling electrical component |
US8885342B2 (en) | 2010-12-29 | 2014-11-11 | Methode Electronics, Inc. | Thermal management for electronic device housing |
US8358504B2 (en) * | 2011-01-18 | 2013-01-22 | Avago Technologies Enterprise IP (Singapore) Pte. Ltd. | Direct cooling system and method for transceivers |
CN102610960B (zh) * | 2011-01-20 | 2014-12-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
CN102610961B (zh) * | 2011-01-21 | 2014-12-03 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
US8665160B2 (en) | 2011-01-31 | 2014-03-04 | Apple Inc. | Antenna, shielding and grounding |
US9064200B2 (en) * | 2011-01-31 | 2015-06-23 | Apple Inc. | Flat object ejector assembly |
US8460018B2 (en) * | 2011-01-31 | 2013-06-11 | Apple Inc. | Flat object ejector assembly |
US8911280B2 (en) | 2011-01-31 | 2014-12-16 | Apple Inc. | Apparatus for shaping exterior surface of a metal alloy casing |
US8587939B2 (en) | 2011-01-31 | 2013-11-19 | Apple Inc. | Handheld portable device |
CN102651521B (zh) | 2011-02-25 | 2014-09-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
CN202076595U (zh) * | 2011-02-25 | 2011-12-14 | 富士康(昆山)电脑接插件有限公司 | 连接器 |
CN102651520B (zh) * | 2011-02-25 | 2014-10-29 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
US8717770B2 (en) * | 2011-04-28 | 2014-05-06 | Finisar Corporation | Latching mechanisms for pluggable electronic devices |
US8830679B2 (en) * | 2011-05-27 | 2014-09-09 | Fci Americas Technology Llc | Receptacle heat sink connection |
US8901419B2 (en) | 2011-06-13 | 2014-12-02 | The Wiremold Company | Rising receptacle box assembly |
CN102832490A (zh) * | 2011-06-16 | 2012-12-19 | 鸿富锦精密工业(深圳)有限公司 | 连接器组合 |
US9818670B2 (en) * | 2011-07-29 | 2017-11-14 | Infinera Corporation | Cooling device installation using a retainer assembly |
US8371882B1 (en) | 2011-08-03 | 2013-02-12 | Tyco Electronics Corporation | Straddle mount connector for a pluggable transceiver module |
US8449331B2 (en) | 2011-08-03 | 2013-05-28 | Tyco Electronics Corporation | Cage and connector cover for a receptacle assembly |
US8670236B2 (en) | 2011-08-03 | 2014-03-11 | Tyco Electronics Corporation | Cage assembly for receiving a pluggable module |
US8444437B2 (en) * | 2011-08-03 | 2013-05-21 | Tyco Electronics Corporation | Electrical connector assembly with EMI gasket |
US8556658B2 (en) * | 2011-08-03 | 2013-10-15 | Tyco Electronics Corporation | Receptacle assembly for a pluggable module |
US8371861B1 (en) | 2011-08-03 | 2013-02-12 | Tyco Electronics Corporation | Straddle mount connector for a pluggable transceiver module |
US20130048367A1 (en) * | 2011-08-22 | 2013-02-28 | Zlatan Ljubijankic | Emi shielding members for connector cage |
JP2013051133A (ja) | 2011-08-31 | 2013-03-14 | Yamaichi Electronics Co Ltd | リセプタクル用ケージ、リセプタクルアッセンブリー、トランシーバモジュールアッセンブリー |
US8817469B2 (en) * | 2011-09-23 | 2014-08-26 | Infinera Corporation | Heat transfer using a durable low-friction interface |
TWM461182U (zh) * | 2011-11-08 | 2013-09-01 | Molex Inc | 連接器系統和連接器 |
CN103123509B (zh) * | 2011-11-18 | 2015-11-25 | 华为技术有限公司 | 一种单板控温装置及方法 |
US8622770B2 (en) * | 2011-12-01 | 2014-01-07 | Finisar Corporation | Electromagnetic radiation shield for an electronic module |
JP2013138110A (ja) * | 2011-12-28 | 2013-07-11 | Honda Tsushin Kogyo Co Ltd | 電気コネクタ用ケージ |
US8890004B2 (en) | 2012-01-23 | 2014-11-18 | Tyco Electronics Corporation | Electrical connector assembly with EMI cover |
US8979558B2 (en) * | 2012-03-12 | 2015-03-17 | Fci Americas Technology Llc | Interposer assembly |
CN102612302A (zh) * | 2012-03-13 | 2012-07-25 | 华为技术有限公司 | 光模块散热装置及通信设备 |
JP2013200394A (ja) | 2012-03-23 | 2013-10-03 | Yamaichi Electronics Co Ltd | リセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリー |
US8535096B1 (en) | 2012-03-27 | 2013-09-17 | Tyco Electronics Corporation | Die cast cage for a receptacle assembly |
CN103384037B (zh) * | 2012-05-01 | 2016-07-06 | 莫列斯有限公司 | 连接器 |
CN104350645B (zh) * | 2012-05-04 | 2016-04-20 | 莫列斯公司 | 成组连接器系统 |
US8599559B1 (en) | 2012-05-30 | 2013-12-03 | Tyco Electronics Corporation | Cage with a heat sink mounted on its mounting side and an EMI gasket with its fingers electrically connected to the mounting side |
BR112014027300A2 (pt) * | 2012-05-30 | 2017-06-27 | Schweitzer Engineering Lab Inc | dispositivo de comunicação |
US9277673B2 (en) * | 2012-06-12 | 2016-03-01 | FCI Asia PTE, Ltd. | Connector assembly |
CN103676027B (zh) * | 2012-09-14 | 2016-01-27 | 泰科电子(上海)有限公司 | 连接器 |
US9217837B2 (en) | 2012-09-15 | 2015-12-22 | Finisar Corporation | Latch mechanism for communications module |
US8879267B2 (en) * | 2012-10-09 | 2014-11-04 | Tyco Electronics Corporation | Transceiver assembly |
US9146366B2 (en) * | 2012-10-15 | 2015-09-29 | Finisar Corporation | Latch mechanism for communication module |
US9538632B2 (en) | 2012-10-18 | 2017-01-03 | Apple Inc. | Printed circuit board features of a portable computer |
US20140151010A1 (en) * | 2012-12-03 | 2014-06-05 | Tyco Electronics Corporation | Heat sink |
US20140153192A1 (en) * | 2012-12-05 | 2014-06-05 | Molex Incorporated | Module cage with integrated emi aspect |
US10091911B2 (en) * | 2012-12-11 | 2018-10-02 | Infinera Corporation | Interface card cooling using heat pipes |
US20140196943A1 (en) * | 2013-01-11 | 2014-07-17 | Molex Incorporated | Resilient Adherent EMI Shielding Member |
US9250402B2 (en) | 2013-02-05 | 2016-02-02 | Sumitomo Electric Industries, Ltd. | Pluggable optical transceiver having pull-pull-tab |
EP2965137B1 (en) | 2013-03-05 | 2019-09-04 | Finisar Corporation | Latch mechanism for communication module |
US10321607B2 (en) | 2013-03-13 | 2019-06-11 | Yamaichi Electronics Co., Ltd. | Receptacle assembly and transceiver module assembly |
WO2014141490A1 (ja) * | 2013-03-13 | 2014-09-18 | 山一電機株式会社 | リセプタクルアッセンブリーおよびトランシーバモジュールアッセンブリー |
CN203277695U (zh) * | 2013-04-03 | 2013-11-06 | 正凌精密工业股份有限公司 | 连接器模块 |
DE102013013816A1 (de) * | 2013-05-02 | 2014-11-06 | Nvidia Corporation | Elektronische Einrichtung und in elektronischer Einrichtung verwendete Sockelverbindungseinheit |
US9843148B2 (en) * | 2013-07-19 | 2017-12-12 | Foxconn Interconnect Technology Limited | Flippable electrical connector |
WO2015024015A1 (en) * | 2013-08-16 | 2015-02-19 | Molex Incorporated | Connector with thermal management |
US20150072561A1 (en) * | 2013-09-06 | 2015-03-12 | Tyco Electronics Corporation | Cage with emi absorber |
US9681583B2 (en) | 2013-09-23 | 2017-06-13 | Coriant Operations Inc. | Fixation of heat sink on SFP/XFP cage |
US9313925B2 (en) * | 2013-09-30 | 2016-04-12 | Infinera Corporation | Pluggable module housing assembly |
CN105594074B (zh) | 2013-10-04 | 2019-05-31 | 飞利浦照明控股有限公司 | 包括散热器的照明设备连接器 |
JP6464645B2 (ja) | 2013-11-05 | 2019-02-06 | 富士通株式会社 | 光伝送装置及び製造方法 |
US9063705B2 (en) * | 2013-11-11 | 2015-06-23 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Latch mechanism for securing an electronic module |
US9877413B2 (en) * | 2013-11-12 | 2018-01-23 | Molex, Llc | Thermally configured connector system |
CN103702534B (zh) * | 2013-12-18 | 2016-09-07 | 上海岱诺信息技术有限公司 | 双层壳体的电子设备机壳结构 |
CN104916977B (zh) | 2014-03-12 | 2017-05-24 | 富士康(昆山)电脑接插件有限公司 | 电子卡连接器 |
US9960553B2 (en) | 2014-03-27 | 2018-05-01 | Molex, Llc | Thermally efficient connector system |
TWM483461U (zh) * | 2014-03-31 | 2014-08-01 | Super Micro Computer Inc | 可擴充型伺服器機箱 |
US9912107B2 (en) | 2014-04-01 | 2018-03-06 | Te Connectivity Corporation | Plug and receptacle assembly having a thermally conductive interface |
WO2015164538A1 (en) | 2014-04-23 | 2015-10-29 | Tyco Electronics Corporation | Electrical connector with shield cap and shielded terminals |
US9451722B2 (en) * | 2014-05-12 | 2016-09-20 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Rack mountable network switch |
CN203839574U (zh) * | 2014-05-21 | 2014-09-17 | 泰科电子(上海)有限公司 | 连接器、连接器组件和设备 |
US9402332B2 (en) * | 2014-05-21 | 2016-07-26 | Molex, Llc | Heat dissipative air guide |
US9543708B2 (en) | 2014-06-19 | 2017-01-10 | Tyco Electronics Corporation | Pluggable connector and communication system configured to reduce electromagnetic interference leakage |
JP5892449B1 (ja) | 2014-08-28 | 2016-03-23 | 本多通信工業株式会社 | コネクタの抜去機構と、光モジュール |
US9235017B1 (en) | 2014-10-01 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver with a heat dissipating structure |
KR102286337B1 (ko) * | 2014-10-17 | 2021-08-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체 |
EP3216092A1 (en) * | 2014-11-03 | 2017-09-13 | 3M Innovative Properties Company | A connector |
EP3224660A4 (en) | 2014-11-26 | 2017-11-01 | Hewlett-Packard Enterprise Development LP | Transceiver module |
US10551580B2 (en) | 2014-12-23 | 2020-02-04 | Molex, Llc | Connector system with air flow |
CN105792626B (zh) * | 2014-12-26 | 2019-03-26 | 菲尼萨公司 | 电磁干扰屏蔽罩 |
WO2016112379A1 (en) | 2015-01-11 | 2016-07-14 | Molex, Llc | Circuit board bypass assemblies and components therefor |
US9646231B2 (en) * | 2015-03-06 | 2017-05-09 | Htc Corporation | Casing and electronic device using the same |
US9609739B2 (en) * | 2015-03-10 | 2017-03-28 | Kabushiki Kaisha Toshiba | Electronic device |
US9673567B1 (en) * | 2015-03-12 | 2017-06-06 | Juniper Networks, Inc. | Apparatus, system, and method for preventing electric shock during maintenance of telecommunication systems |
TWM508146U (zh) * | 2015-04-15 | 2015-09-01 | Molex Taiwan Ltd | 屏蔽罩組件 |
US9615492B2 (en) | 2015-04-16 | 2017-04-04 | International Business Machines Corporation | Electromagnetic gaskets for a cable connection |
CN204517046U (zh) * | 2015-04-30 | 2015-07-29 | 泰科电子(上海)有限公司 | 连接器的屏蔽外壳 |
US9391407B1 (en) * | 2015-06-12 | 2016-07-12 | Tyco Electronics Corporation | Electrical connector assembly having stepped surface |
WO2016201618A1 (en) * | 2015-06-16 | 2016-12-22 | Source Photonics (Chengdu) Co., Ltd. | Emi shielding device for an optical transceiver |
TWM542267U (zh) | 2015-08-18 | 2017-05-21 | Molex Llc | 連接器系統 |
WO2017044825A1 (en) | 2015-09-10 | 2017-03-16 | Samtec, Inc. | Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling |
US10186794B2 (en) | 2015-09-25 | 2019-01-22 | Molex, Llc | Connector system with adapter |
US9620906B1 (en) * | 2015-11-02 | 2017-04-11 | Te Connectivity Corporation | EMI shielding for pluggable modules |
US10884203B2 (en) * | 2015-11-16 | 2021-01-05 | Accedian Networks Inc. | Cooling apparatus for pluggable modules |
CN106793669B (zh) * | 2015-11-20 | 2019-04-19 | 华为技术有限公司 | 一种散热组件及通信设备 |
US9869837B2 (en) * | 2015-12-08 | 2018-01-16 | Te Connectivity Corporation | Heat dissipating communication system |
JP6755754B2 (ja) * | 2015-12-14 | 2020-09-16 | 日本ルメンタム株式会社 | 光モジュール及び光伝送装置 |
KR102092627B1 (ko) | 2016-01-11 | 2020-03-24 | 몰렉스 엘엘씨 | 루트설정 조립체 및 이를 사용한 시스템 |
JP6626213B2 (ja) | 2016-01-19 | 2019-12-25 | モレックス エルエルシー | 一体型ルーティングアセンブリ及びそれを用いたシステム |
CN106990488B (zh) * | 2016-01-21 | 2019-02-05 | 正淩精密工业股份有限公司 | 连接器壳体散热结构 |
CN108604931A (zh) | 2016-02-12 | 2018-09-28 | 住友电气工业株式会社 | 用于光收发器的散热装置以及光通信装置 |
US9825408B2 (en) * | 2016-03-14 | 2017-11-21 | Te Connectivity Corporation | Connector module assembly having a gasket plate |
US10401581B2 (en) * | 2016-03-17 | 2019-09-03 | Ciena Corporation | Optical module heatsink lifter and method |
US9983370B1 (en) * | 2016-05-24 | 2018-05-29 | Cisco Technology, Inc. | Passive heat sink for a small form factor pluggable |
US10034407B2 (en) * | 2016-07-22 | 2018-07-24 | Intel Corporation | Storage sled for a data center |
US20180034211A1 (en) * | 2016-07-26 | 2018-02-01 | Foxconn Interconnect Technology Limited | Electrical connector assembly |
US10389397B2 (en) * | 2016-07-26 | 2019-08-20 | Laird Technologies, Inc. | Small form-factor pluggable (SFP) transceivers |
US9666995B1 (en) | 2016-08-08 | 2017-05-30 | Te Connectivity Corporation | EMI containment cage member |
US9924615B2 (en) | 2016-08-15 | 2018-03-20 | Te Connectivity Corporation | Receptacle assembly having a heat exchanger |
US10659168B2 (en) | 2016-08-23 | 2020-05-19 | Schweitzer Engineering Laboratories, Inc. | Low-power fiber optic transceiver |
CN206098950U (zh) * | 2016-10-10 | 2017-04-12 | 中兴通讯股份有限公司 | 一种电子设备 |
US9893474B1 (en) * | 2016-10-12 | 2018-02-13 | International Business Machines Corporation | Active cable heat sink |
CN108061943B (zh) * | 2016-11-07 | 2020-01-17 | 泰科电子(上海)有限公司 | 连接器 |
CN113038792A (zh) * | 2017-01-12 | 2021-06-25 | 申泰公司 | 带有附连的散热器的壳架 |
US10079442B2 (en) * | 2017-01-16 | 2018-09-18 | Foxconn Interconnect Technology Limited | Transceiver and mechanism for receiving the same |
CN107046206B (zh) * | 2017-01-23 | 2021-07-20 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US9935403B1 (en) | 2017-02-13 | 2018-04-03 | Te Connectivity Corporation | Pluggable module having cooling channel |
US9929500B1 (en) * | 2017-03-09 | 2018-03-27 | Tyler Ista | Pluggable transceiver module with integrated release mechanism |
US10551581B2 (en) * | 2017-04-20 | 2020-02-04 | Mellanox Technologies, Ltd. | Optical connector cage with enhanced thermal performance |
CN108987966B (zh) * | 2017-05-21 | 2021-03-23 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件及其转接件 |
US10446960B2 (en) * | 2017-05-21 | 2019-10-15 | Foxconn Interconnect Technology Limited | Electrical connector assembly equipped with heat pipe and additional heat sink |
US10194565B2 (en) * | 2017-06-05 | 2019-01-29 | Cisco Technology, Inc. | Electromagnetic interference shielding apparatus |
CA3066003C (en) | 2017-06-07 | 2022-06-21 | Samtec, Inc. | Transceiver assembly array with fixed heatsink and floating transceivers |
CN207052873U (zh) * | 2017-06-08 | 2018-02-27 | 珠海泰科电子有限公司 | 电磁屏蔽弹片及具有电磁屏蔽弹片的连接器外壳 |
US10104760B1 (en) | 2017-06-12 | 2018-10-16 | Te Connectivity Corporation | Pluggable module having cooling channel with heat transfer fins |
JP6888434B2 (ja) * | 2017-06-16 | 2021-06-16 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
US10890565B2 (en) * | 2017-06-22 | 2021-01-12 | Olympus America Inc. | Portable phased array test instrument |
US10128627B1 (en) * | 2017-06-28 | 2018-11-13 | Mellanox Technologies, Ltd. | Cable adapter |
US10644472B2 (en) | 2017-06-28 | 2020-05-05 | Mellanox Technologies, Ltd. | Cable adapter |
US10374355B2 (en) | 2017-07-07 | 2019-08-06 | Amphenol Corporation | Asymmetric latches for pluggable transceivers |
CN107548224B (zh) * | 2017-07-07 | 2021-03-09 | 新华三技术有限公司 | 一种元器件壳体和pcb板 |
WO2019028373A1 (en) | 2017-08-03 | 2019-02-07 | Amphenol Corporation | CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTIONS |
CN107464576B (zh) * | 2017-08-07 | 2019-05-28 | 郑州云海信息技术有限公司 | 一种硬盘模组用免工具快速拆装装置 |
WO2019040610A1 (en) | 2017-08-23 | 2019-02-28 | Samtec, Inc. | RECEIVER-RECEIVER RECEPTACLE WITH EMI CAGE AND GRIPPER ATTACHES PROVIDING HIGH PROTECTION EFFICIENCY |
US10404008B2 (en) * | 2017-10-06 | 2019-09-03 | Te Connectivity Corporation | Connector system with receptacle and plug connectors having complimentary angled connector platforms |
US10320113B2 (en) * | 2017-10-17 | 2019-06-11 | Mellanox Technologies, Ltd. | Cage receptacle assembly with heat dissipation units |
CN111386212A (zh) * | 2017-10-27 | 2020-07-07 | 库伦特莱克斯有限责任公司以卡高格里德名义营业 | 用于车辆货物存储的棚顶轨道系统 |
CN109728475B (zh) * | 2017-10-30 | 2024-05-07 | 泰科电子(上海)有限公司 | 连接器组件 |
US10555439B2 (en) * | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
US10219412B1 (en) | 2017-11-27 | 2019-02-26 | Nokia Solutions And Networks Oy | Connector assembly and associated heat sink housing for use in a radio unit |
US10617034B2 (en) * | 2017-12-12 | 2020-04-07 | Cloud Light Technology Limited | Heat dissipation system of enclosed electronic module with single/multiple active components |
CN109991704A (zh) * | 2018-01-02 | 2019-07-09 | 台达电子工业股份有限公司 | 光收发模块 |
CN110197962B (zh) * | 2018-02-26 | 2022-08-19 | 富士康(昆山)电脑接插件有限公司 | 散热件及具有该散热件的电连接器组件 |
CN110275253A (zh) * | 2018-03-14 | 2019-09-24 | 泰科电子(上海)有限公司 | 连接器 |
US10348039B1 (en) * | 2018-03-30 | 2019-07-09 | Microsoft Technology Licensing, Llc | Connector shielding |
TWI651037B (zh) * | 2018-04-25 | 2019-02-11 | 和碩聯合科技股份有限公司 | 機殼組件及電子裝置 |
US10705309B2 (en) | 2018-06-06 | 2020-07-07 | Mellanox Technologies, Ltd. | RF EMI reducing fiber cable assembly |
US10791652B2 (en) * | 2018-06-12 | 2020-09-29 | Eagle Technology, Llc | Systems and methods for heatsink to rail thermal interface enhancement |
US20190387650A1 (en) * | 2018-06-14 | 2019-12-19 | Cisco Technology, Inc. | Heat sink for pluggable module cage |
JP2019216063A (ja) * | 2018-06-14 | 2019-12-19 | 山一電機株式会社 | コネクタ用ケージ及びこれを備えたコネクタ装置 |
FR3083018B1 (fr) * | 2018-06-25 | 2021-05-28 | Sagemcom Broadband Sas | Systeme de connexion electrique comportant un dispositif de connexion primaire et un dispositif de connexion secondaire |
US10575442B2 (en) * | 2018-07-06 | 2020-02-25 | Te Connectivity Corporation | Heat sink assembly for an electrical connector |
US10444453B1 (en) | 2018-07-25 | 2019-10-15 | Mellanox Technologies, Ltd. | QSFP-DD to SFP-DD adapter |
US10955628B2 (en) * | 2018-07-31 | 2021-03-23 | Lumentum Operations Llc | Latching for a transceiver module |
WO2020024109A1 (en) * | 2018-07-31 | 2020-02-06 | Lumentum Operations Llc | Electromagnetic interference leakage reduction for a pluggable optical module |
US10942322B2 (en) | 2018-08-02 | 2021-03-09 | Molex, Llc | Shield cage assembly |
TWI690259B (zh) * | 2018-08-02 | 2020-04-01 | 台灣莫仕股份有限公司 | 屏蔽罩組件 |
CN112888981A (zh) * | 2018-08-02 | 2021-06-01 | 申泰公司 | 收发器闩锁和热桥 |
CN110881260B (zh) * | 2018-09-06 | 2021-06-25 | 泰科电子(上海)有限公司 | 壳体组件和安装夹 |
US10797417B2 (en) | 2018-09-13 | 2020-10-06 | Amphenol Corporation | High performance stacked connector |
CN208862209U (zh) | 2018-09-26 | 2019-05-14 | 安费诺东亚电子科技(深圳)有限公司 | 一种连接器及其应用的pcb板 |
CN110972444B (zh) * | 2018-09-30 | 2022-09-06 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
CN110972443B (zh) * | 2018-09-30 | 2023-09-15 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
US11271348B1 (en) | 2018-10-24 | 2022-03-08 | Amphenol Corporation | High performance electrical connector |
US10874032B2 (en) * | 2018-10-31 | 2020-12-22 | Hewlett Packard Enterprise Development Lp | Rotatable cold plate assembly for cooling pluggable modules |
CN109407224A (zh) * | 2018-11-07 | 2019-03-01 | 东莞讯滔电子有限公司 | 一种散热组件、连接器及连接器组件 |
CN111200205A (zh) * | 2018-11-20 | 2020-05-26 | 至良科技股份有限公司 | 电连接器壳座组合、电连接器及电子装置 |
US10547133B1 (en) * | 2018-12-17 | 2020-01-28 | Te Connectivity Corporation | Vertical communication system |
EP3867729A4 (en) * | 2018-12-18 | 2022-07-27 | CommScope Technologies LLC | THERMAL MANAGEMENT FOR MODULAR ELECTRONIC DEVICES |
CN117175250A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接到中板的i/o连接器 |
CN117175239A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 插座连接器和电连接器 |
CN113728521A (zh) | 2019-02-22 | 2021-11-30 | 安费诺有限公司 | 高性能线缆连接器组件 |
US10741954B1 (en) | 2019-03-17 | 2020-08-11 | Mellanox Technologies, Ltd. | Multi-form-factor connector |
TWI732491B (zh) | 2019-03-19 | 2021-07-01 | 美商莫仕有限公司 | 計算盒子及其卡組件 |
US11086081B2 (en) | 2019-03-21 | 2021-08-10 | Schweitzer Engineering Laboratories, Inc. | Conductive cooling for small form-factor pluggable (SFP) fiber optic transceivers |
TWI735857B (zh) * | 2019-03-29 | 2021-08-11 | 佳必琪國際股份有限公司 | 小型可插拔連接器殼體結構 |
CN210404248U (zh) * | 2019-04-08 | 2020-04-24 | 莫列斯有限公司 | 电连接装置 |
US10925186B2 (en) * | 2019-05-15 | 2021-02-16 | Hewlett Packard Enterprise Development Lp | Vertical lift heat transfer device for pluggable modules |
CN112180519B (zh) * | 2019-07-01 | 2022-09-16 | 台达电子工业股份有限公司 | 光学收发器散热模块 |
TWI688319B (zh) * | 2019-07-29 | 2020-03-11 | 緯創資通股份有限公司 | 可限制不同模組安裝順序之電子裝置及其機殼模組 |
US10939573B1 (en) * | 2019-08-28 | 2021-03-02 | Dell Products, L.P. | Electronic module carrier for an information handling system |
CN112531371B (zh) * | 2019-09-17 | 2022-06-03 | 美国莫列斯有限公司 | 连接器组合 |
WO2021061916A1 (en) | 2019-09-27 | 2021-04-01 | Fci Usa Llc | High performance stacked connector |
CN210430205U (zh) * | 2019-09-30 | 2020-04-28 | 东莞讯滔电子有限公司 | 电连接器 |
US10952355B1 (en) * | 2019-10-16 | 2021-03-16 | Juniper Networks, Inc | Apparatus, system, and method for electromagnetic interference mitigation in optical module cages |
CN210630166U (zh) * | 2019-10-18 | 2020-05-26 | 莫列斯有限公司 | 连接器组件 |
US11169330B2 (en) | 2019-10-24 | 2021-11-09 | Mellanox Technologies Tlv Ltd. | Wavelength-splitting optical cable |
US11653474B2 (en) | 2019-11-20 | 2023-05-16 | Molex, Llc | Connector assembly |
TWI733445B (zh) * | 2019-12-05 | 2021-07-11 | 台灣莫仕股份有限公司 | 連接器組件 |
CN114731774A (zh) * | 2019-12-31 | 2022-07-08 | 华为技术有限公司 | 光口屏蔽固定装置、光模块及通信设备 |
TWI797413B (zh) * | 2020-01-15 | 2023-04-01 | 台灣莫仕股份有限公司 | 連接器組件 |
CN115513728A (zh) * | 2020-01-15 | 2022-12-23 | 莫列斯有限公司 | 连接器组件 |
CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
TWI718873B (zh) * | 2020-02-18 | 2021-02-11 | 四零四科技股份有限公司 | 具有可活動導熱組件的電子裝置及其相關的散熱模組 |
TWI704862B (zh) * | 2020-02-20 | 2020-09-11 | 四零四科技股份有限公司 | 將可抽換模組所產生之熱量傳導至機殼模組之散熱結構以及具有前述散熱結構之電子裝置 |
US11152750B2 (en) * | 2020-03-12 | 2021-10-19 | TE Connectivity Services Gmbh | Corner EMI springs for a receptacle cage |
CN113471748B (zh) * | 2020-03-30 | 2024-01-30 | 莫列斯有限公司 | 连接器组件 |
TWI728765B (zh) | 2020-03-30 | 2021-05-21 | 台灣莫仕股份有限公司 | 連接器組件 |
TWI730712B (zh) | 2020-04-09 | 2021-06-11 | 財團法人工業技術研究院 | 具有降低串音干擾的高速連接器與絕緣塑膠件 |
US11245230B2 (en) | 2020-05-18 | 2022-02-08 | TE Connectivity Services Gmbh | EMI shielding for a receptacle cage |
CN113823932A (zh) * | 2020-06-18 | 2021-12-21 | 莫列斯有限公司 | 连接器组件 |
US11249264B2 (en) | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
US11300363B2 (en) * | 2020-07-07 | 2022-04-12 | Cisco Technology, Inc. | Heat sink assembly for electronic equipment |
TWM603661U (zh) * | 2020-07-23 | 2020-11-01 | 瑞傳科技股份有限公司 | 電子裝置機板省力抽拔結構 |
US11462852B2 (en) | 2020-08-14 | 2022-10-04 | Google Llc | Blind mate thermal cooling solution for small form factor pluggable transceiver |
CN213151096U (zh) * | 2020-08-27 | 2021-05-07 | 泰科电子(上海)有限公司 | 连接器壳体组件 |
TWI748639B (zh) | 2020-09-09 | 2021-12-01 | 至良科技股份有限公司 | 電連接器組及其插座及插頭 |
CN114269106A (zh) * | 2020-09-16 | 2022-04-01 | 华为技术有限公司 | 散热装置和电子设备 |
US11665857B2 (en) * | 2020-09-17 | 2023-05-30 | Te Connectivity Solutions Gmbh | Heat sink assembly for an electrical connector assembly |
US11199669B1 (en) * | 2020-09-24 | 2021-12-14 | Hewlett Packard Enterprise Development Lp | Modular faceplate optical sub-assembly |
CN114256699A (zh) * | 2020-09-25 | 2022-03-29 | 莫列斯有限公司 | 连接器组件 |
US11678466B2 (en) * | 2020-11-03 | 2023-06-13 | Cisco Technology, Inc. | Heat sink for optical module |
US11367979B1 (en) | 2020-12-28 | 2022-06-21 | Industrial Technology Research Institute | Terminal components of connector and connector structure |
US11450980B2 (en) * | 2021-01-04 | 2022-09-20 | Te Connectivity Solutions Gmbh | Receptacle cage for a receptacle connector assembly |
CN214204113U (zh) * | 2021-03-02 | 2021-09-14 | 东莞立讯技术有限公司 | 接口连接器 |
US20230107130A1 (en) * | 2021-09-30 | 2023-04-06 | Nanning Fulian Fugui Precision Industrial Co., Ltd. | Computer expansion module providing cooling for components placed therein |
JP2023074201A (ja) * | 2021-11-17 | 2023-05-29 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ装置 |
US11855381B2 (en) * | 2022-02-16 | 2023-12-26 | Hewlett Packard Enterprise Development Lp | Chassis having an insertion key assembly for a pluggable module |
US11924959B2 (en) * | 2022-04-19 | 2024-03-05 | Dell Products L.P. | Heatsink based power delivery for CPUs |
US11809004B1 (en) * | 2022-05-06 | 2023-11-07 | Juniper Networks, Inc. | Systems and methods for electromagnetic interference absorptive brushes |
TWI832606B (zh) * | 2022-12-12 | 2024-02-11 | 台灣莫仕股份有限公司 | 連接器組件 |
Family Cites Families (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2042827B (en) * | 1979-02-23 | 1983-04-13 | Trw Inc | Connector hood constructions |
US4414605A (en) * | 1981-06-29 | 1983-11-08 | The United States Of America As Represented By The Secretary Of The Navy | Positive locking mechanism |
US4401355A (en) * | 1981-07-01 | 1983-08-30 | Rca Corporation | Filtered connector |
US4659163A (en) * | 1984-06-13 | 1987-04-21 | Amp Incorporated | Filtered shielded connector assembly |
US4597173A (en) * | 1984-06-20 | 1986-07-01 | The United States Of America As Represented By The Secretary Of The Navy | Electronic module insertion and retraction mechanism |
US4738637A (en) * | 1985-10-11 | 1988-04-19 | Amp Incorporated | Receptacle assembly with ground plane spring |
EP0249406A1 (en) * | 1986-06-10 | 1987-12-16 | Allied Corporation | Multi-core cable connectors |
US5640302A (en) * | 1992-06-29 | 1997-06-17 | Elonex Ip Holdings | Modular portable computer |
US5316495A (en) * | 1993-01-15 | 1994-05-31 | The Whitaker Corporation | Latching system for electrical connectors |
US5464054A (en) * | 1993-08-09 | 1995-11-07 | Thermalloy, Inc. | Spring clamp and heat sink assembly |
SE502998C2 (sv) * | 1994-06-10 | 1996-03-11 | Ericsson Telefon Ab L M | Elektriskt kopplingsdon samt kretskort |
US5524908A (en) * | 1994-09-14 | 1996-06-11 | W. L. Gore & Associates | Multi-layer EMI/RFI gasket shield |
US5492480A (en) | 1994-10-31 | 1996-02-20 | Fusselman; David L. | Memory card connector having improved resilient eject mechanism and method of use |
US5546281A (en) | 1995-01-13 | 1996-08-13 | Methode Electronics, Inc. | Removable optoelectronic transceiver module with potting box |
JP3057546B2 (ja) * | 1995-02-23 | 2000-06-26 | モレックス インコーポレーテッド | ガイド機構付きコネクタ組立 |
US5600540A (en) * | 1995-05-15 | 1997-02-04 | Blomquist; Michael L. | Heat sink and retainer for electronic integrated circuits |
WO1998002940A1 (de) | 1996-07-12 | 1998-01-22 | Siemens Aktiengesellschaft | Geschirmte leiterplattensteckbuchse mit schirmungskontaktierung zu einer gerätewand |
US5805430A (en) | 1996-07-22 | 1998-09-08 | International Business Machines Corporation | Zero force heat sink |
US5793614A (en) * | 1996-09-03 | 1998-08-11 | Tektronix, Inc. | Injector/ejector for electronic module housing |
US5959244A (en) * | 1997-08-29 | 1999-09-28 | Hewlett-Packard Company | Front and rear contacting EMI gasket |
US5901263A (en) | 1997-09-12 | 1999-05-04 | International Business Machines Corporation | Hot pluggable module integrated lock/extraction tool |
CN2358604Y (zh) * | 1998-11-25 | 2000-01-12 | 富士康(昆山)电脑接插件有限公司 | 电连接器的退卡装置 |
US6095862A (en) * | 1999-02-04 | 2000-08-01 | Molex Incorporated | Adapter frame assembly for electrical connectors |
TW415681U (en) * | 1999-02-11 | 2000-12-11 | Hon Hai Prec Ind Co Ltd | Electronic card connector |
US6362961B1 (en) | 1999-04-22 | 2002-03-26 | Ming Chin Chiou | CPU and heat sink mounting arrangement |
US6135793A (en) * | 1999-08-26 | 2000-10-24 | 3Com Corporation | Coupler for grounding of a modular transceiver housing |
JP4174149B2 (ja) | 1999-12-01 | 2008-10-29 | 矢崎総業株式会社 | 半嵌合防止コネクタ |
US6524134B2 (en) * | 1999-12-01 | 2003-02-25 | Tyco Electronics Corporation | Pluggable module and receptacle |
US6517382B2 (en) | 1999-12-01 | 2003-02-11 | Tyco Electronics Corporation | Pluggable module and receptacle |
US6231384B1 (en) * | 1999-12-29 | 2001-05-15 | Hon Hai Precision Ind. Co., Ltd. | Panel mounted cable end connector |
US6335869B1 (en) | 2000-01-20 | 2002-01-01 | International Business Machines Corporation | Removable small form factor fiber optic transceiver module and electromagnetic radiation shield |
US6482017B1 (en) * | 2000-02-10 | 2002-11-19 | Infineon Technologies North America Corp. | EMI-shielding strain relief cable boot and dust cover |
US6508595B1 (en) * | 2000-05-11 | 2003-01-21 | International Business Machines Corporation | Assembly of opto-electronic module with improved heat sink |
US6368122B2 (en) * | 2000-05-23 | 2002-04-09 | Hon Hai Precisiopn Ind. Co., Ltd. | Bracket having a recoverable door |
DE50006288D1 (de) * | 2000-08-10 | 2004-06-03 | Infineon Technologies Ag | Schirmblech, insbesondere für opto-elektronische transceiver |
US6558191B2 (en) * | 2000-08-22 | 2003-05-06 | Tyco Electronics Corporation | Stacked transceiver receptacle assembly |
TW454982U (en) * | 2000-08-24 | 2001-09-11 | Hon Hai Prec Ind Co Ltd | Socket connector |
TW505267U (en) | 2001-01-04 | 2002-10-01 | Hon Hai Prec Ind Co Ltd | Fastener for heat sink device |
US6607308B2 (en) * | 2001-02-12 | 2003-08-19 | E20 Communications, Inc. | Fiber-optic modules with shielded housing/covers having mixed finger types |
US6371787B1 (en) | 2001-03-07 | 2002-04-16 | International Business Machines Corporation | Pull-to-release type latch mechanism for removable small form factor electronic modules |
US6419523B1 (en) | 2001-04-04 | 2002-07-16 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6364709B1 (en) | 2001-04-20 | 2002-04-02 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6443768B1 (en) | 2001-09-14 | 2002-09-03 | Molex Incorporated | Small form factor connector cage |
US6416361B1 (en) | 2001-11-16 | 2002-07-09 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6368153B1 (en) | 2001-11-16 | 2002-04-09 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6478622B1 (en) * | 2001-11-27 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US6434015B1 (en) | 2001-12-03 | 2002-08-13 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable module having release device |
US6614659B2 (en) * | 2001-12-07 | 2003-09-02 | Delphi Technologies, Inc. | De-mountable, solderless in-line lead module package with interface |
US6430053B1 (en) | 2001-12-13 | 2002-08-06 | Stratos Lightwave | Pluggable transceiver module having rotatable release and removal lever with living hinge |
US6788540B2 (en) | 2002-01-30 | 2004-09-07 | Jds Uniphase Corporation | Optical transceiver cage |
-
2003
- 2003-03-05 US US10/379,887 patent/US6752663B2/en not_active Expired - Lifetime
- 2003-03-05 WO PCT/US2003/006760 patent/WO2003077376A1/en not_active Application Discontinuation
- 2003-03-05 WO PCT/US2003/006829 patent/WO2003077375A1/en active Application Filing
- 2003-03-05 AU AU2003220045A patent/AU2003220045A1/en not_active Abandoned
- 2003-03-05 AU AU2003213734A patent/AU2003213734A1/en not_active Abandoned
- 2003-03-05 JP JP2003575687A patent/JP4632289B2/ja not_active Expired - Lifetime
- 2003-03-05 US US10/382,208 patent/US6816376B2/en not_active Expired - Lifetime
- 2003-03-05 WO PCT/US2003/006828 patent/WO2003077377A1/en not_active Application Discontinuation
- 2003-03-05 US US10/382,214 patent/US6749448B2/en not_active Expired - Lifetime
- 2003-03-05 JP JP2003575470A patent/JP4251452B2/ja not_active Expired - Lifetime
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CN1314307C (zh) | 2007-05-02 |
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CN1647599A (zh) | 2005-07-27 |
US20030171033A1 (en) | 2003-09-11 |
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AU2003223221A1 (en) | 2003-09-22 |
JP4632289B2 (ja) | 2011-02-16 |
AU2003220045A1 (en) | 2003-09-22 |
JP2005520296A (ja) | 2005-07-07 |
US20030171016A1 (en) | 2003-09-11 |
CN1647322A (zh) | 2005-07-27 |
CN100377443C (zh) | 2008-03-26 |
AU2003220046A1 (en) | 2003-09-22 |
WO2003077375A1 (en) | 2003-09-18 |
JP2005519452A (ja) | 2005-06-30 |
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