TWI445483B - 殼體結構及具有其之電子裝置 - Google Patents
殼體結構及具有其之電子裝置 Download PDFInfo
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Description
本發明是有關於一種殼體結構及具有其之電子裝置,且特別是有關於一種包含心層且心層具有隔熱區與導熱區的殼體結構及具有其之電子裝置。
近年來,可攜式電子裝置的功能越來越多元化,體積越來越小,加上無線通訊及無線網路的便利性,讓人們得以透過可攜式電子裝置獲取網路資訊,使得可攜式電子裝置日益普及。可攜式電子裝置是人們到處攜帶的工作平台,儲存大量的資料及應用程式,若結構強度不合安全保護標準、不耐壓、不耐撞,將造成攜帶上的困擾。為了增加可攜性,可攜式電子裝置不斷地縮小厚度、重量,但降低厚度、重量在某些設計的特點上是與結構強度的維持相互牴觸的。因此,增加可攜式電子裝置本身結構上的強度,並設法減少整體結構的厚度、重量,一直是可攜式電子裝置在設計上的重點。
將聚酯薄膜(mylar)、石墨、竹纖維或碳纖維等輕量化材料結合於金屬材料而構成的複合材料兼具了結構強度佳及輕薄的特性,因此被應用於電子裝置的殼體。當上述複合材料包含了石墨等高導熱材質時,電子裝置的殼體表面對應於其內發熱元件的位置可能會具有較高的溫度,而讓使用者感到不適。
本發明提供一種殼體結構,其表面對應於發熱元件的位置的溫度可被降低。
本發明提供一種電子裝置,其殼體結構的表面對應於發熱元件的位置的溫度可被降低。
本發明提出一種殼體結構,適用於一電子裝置。電子裝置具有一發熱元件。殼體結構包括一心層、一第一材料層及一第二材料層。心層具有一導熱區、一隔熱區、一第一表面及相對於第一表面的一第二表面,其中導熱區相鄰於隔熱區。第一材料層配置於第一表面並接觸導熱區與隔熱區。第二材料層配置於第二表面並接觸導熱區與隔熱區。發熱元件對位於隔熱區且將發熱元件所產生之一熱能藉由第二材料層及導熱區傳遞至第一材料層。
本發明提出一種電子裝置,包括一殼體結構及一發熱元件。殼體結構包括一心層、一第一材料層及一第二材料層。心層具有一導熱區、一隔熱區、一第一表面及相對於第一表面的一第二表面,其中導熱區相鄰於隔熱區。第一材料層配置於第一表面並接觸導熱區與隔熱區。第二材料層配置於第二表面並接觸導熱區與隔熱區。發熱元件設置於一電路板上且對位於隔熱區,其中發熱元件所產生之一熱能藉由第二材料層及導熱區傳遞至第一材料層。
在本發明之一實施例中,上述之隔熱區的材質包括保麗龍、棉花、木材或植物纖維。
在本發明之一實施例中,上述之導熱區在一第一方向
的導熱速度大於一第二方向的導熱速度,其中第二方向為心層平面的法線向量且第一方向垂直於第二方向。
在本發明之一實施例中,上述之導熱區的材質包括石墨。
在本發明之一實施例中,上述之殼體結構,更包括一第一黏結層及一第二黏結層。第一黏結層位於心層與第一材料層之間,用以使心層與第一材料層相互黏結。第二黏結層位於心層與第二材料層之間,用以使心層與第一材料層相互黏結。
在本發明之一實施例中,上述之位於導熱區與第一材料層間之第一黏結層及位於導熱區與第二材料層之間之第二黏結層為高熱傳導係數的黏結層。
在本發明之一實施例中,上述之發熱元件接觸第二材料層。
在本發明之一實施例中,上述之心層為一編織物層且第一材料層及第二材料層可為一金屬板。
基於上述,本發明的殼體結構在心層中配置了隔熱區且隔熱區對位於電子裝置內的發熱元件。藉由隔熱區的阻隔,發熱元件所產生的熱不會直接傳導至殼體結構之表面對應於發熱元件的位置,而會透過第一材料層、心層之導熱區、及第二材料層的傳導而較為均勻地分散至殼體結構的其它部分。藉此,可避免使用者接觸殼體結構之表面對應於發熱元件的位置時因高溫而產生不適,以增加電子裝置使用上的舒適度。
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
圖1為本發明一實施例之電子裝置的局部剖視圖。請參考圖1,本實施例的電子裝置100包括一殼體結構110及一發熱元件120。殼體結構110包括一心層112、一第一材料層114、及一第二材料層116,其中心層112區分為隔熱區118與導熱區119。心層112的導熱區119具有一開口112a、一第一表面112b及相對於第一表面112b的一第二表面112c。第一材料層114配置於第一表面112b,且第二材料層116配置於第二表面112c。隔熱區118配置於開口112a且用以相鄰於導熱區119。心層112位於第一材料層114與第二材料層116之間且可為一編織物層,其中第一材料層114與第二材料層116的材質為高熱傳導係數之材質且第一材料層114與第二材料層116可為金屬板。第一材料層114與第二材料層116的材質可為鋁、銅、鐵等具有高熱傳導係數的材質,但是在本發明中的實施例中,為了兼顧電子裝置之殼體的強度及重量,通常會採用鋁作為第一材料層114及第二材料層116的材質,但是並不限制本發明之範圍。殼體結構110遮蔽發熱元件120,且發熱元件120對位於隔熱區118。隨著製程之不同,若心層112為一編織物層,則心層之隔熱區118與導熱區119可直接編織在一起,但並不限制本發明之範圍。
在上述配置方式之下,殼體結構110在心層112的開口112a中配置了隔熱區118,且隔熱區118對位於電子裝置100內的發熱元件120,其中發熱元件120裝設在一電路板上。藉由隔熱區118的阻隔,發熱元件120所產生的熱能H不會直接傳導至殼體結構110之表面對應於發熱元件120的位置110a而產生熱點的缺陷。發熱元件120的熱能H會透過第二材料層116直接將熱傳遞至心層112的導熱區119中並藉由導熱區119的傳導而較為均勻地將熱能H分散至殼體結構110的其它部分。藉此,可避免使用者接觸殼體結構110之表面對應於發熱元件120的位置110a時因高溫而產生不適,以增加電子裝置100使用上的舒適度。在本發明中,心層112的導熱區119可為一具有高熱傳導係數的編織層且心層的導熱區119可為一具有石墨材質的編織層。
隔熱區118通常為具有低熱傳導係數的隔熱元件且為了同時增加殼體結構之強度及降低殼體結構的重量,隔熱區通常也可為一具有低熱傳導係數的編織物。在本實施例中,隔熱區118的材質例如為保麗龍、棉花、或植物纖維等具有較低熱傳導係數的材料。在其它實施例中,隔熱區118、心層112、第一材料層114及第二材料層116可選用其它適當材質,本發明不對此加以限制。
在本發明之實施例中,雖然第一材料層114、心層112的導熱區119、及第二材料層116的材質均為高熱傳導係數的材質,但是其功用略微不同。第二材料層116主要是藉由其高熱傳導係數的特性吸收發熱元件120所產生的熱後快速地將熱傳遞至心層112導熱區119上。心層112導熱區119雖然同樣為高熱傳導係數的材質,但是心層112導熱區119在進行熱傳遞的過程中,在第一方向的熱傳遞速度遠大於在第二方向的熱傳遞速度,其中第二方向為心層112平面的法線向量且第一方向為垂直於第二方向的方向。由於心層112在平面方向的熱傳遞速度較快,因此當接收由第二材料層116所傳遞而來的熱能H時,此熱能H將會迅速地分散至心層112導熱區119的其它部分並將分散後的熱能H藉由第一材料層114傳遞至電子裝置之殼體結構110外以使電子裝置之殼體結構110在具有散熱效能的同時不會在第一材料層114表面對位於發熱元件120之位置產生熱點的缺陷。
圖2為圖1之殼體結構的局部放大圖。請參考圖2,在本實施例中,殼體結構110更包括一第一黏結層111及一第二黏結層113。第一黏結層111位於心層112與第一材料層114之間用以使第一材料層114與心層112相互黏結。第二黏結層113位於心層112與第二材料層116之間,用以使第二材料層114與心層112相互黏結。心層112、第一材料層114及第二材料層116藉由第一黏結111及第二黏結層113而穩固地相互結合並構成複合材料層。利用此複合材料層作為殼體將有助於提高電子裝置之殼體的強度。本發明更進一步地將具有高熱傳導係數的編織層作為心層,以在提高殼體強度的同時提昇電子裝置的散熱效率。隨著產品設計之不同,位於第一材料層114與心層112之導熱區119之間的第一黏結層111可為一高熱傳導係數的黏結層以迅速將分散後的熱能由心層112的導熱區119傳遞至第一材料層114進行散熱。位於第二材料層116與心層112之導熱區119之間的第二黏結層113可為一高熱傳導係數的黏結層以迅速將由發熱元件120所發出之熱能迅速傳遞至心層112的導熱區119進行熱能分散的程序。在本發明的實施例中所使用的高熱傳導係數的黏結層為一導熱膠且高熱傳導係數黏結層的熱傳導率約大於0.2W/mk,但是並不限制本發明之範圍。位於第一材料層114與心層112之隔熱區119之間的第一黏結層111可為一高耐熱性的黏結層以使隔熱區119與第一材料層之間的黏結力不會因高溫的影響而降低。位於第二材料層116與心層112之隔熱區119之間的第二黏結層113可為一高耐熱性的黏結層以使隔熱區119與第二材料層116之間的黏結力不會因高溫的影響而降低。隨著製程需求之不同,心層112之隔熱區119與第一材料層114之間的第一黏結層111及隔熱區與第二材料層之間的第二黏結層113也可同樣為高熱傳導係數的黏結層,但是並不限制本發明之範圍。
在製作殼體結構110的過程中,例如是在結合心層112、第一黏結層114及第二黏結層116之前,先在心層112會對位於發熱元件120的位置形成開口112a。接著,將心層112的一側黏結至第一材料層114及第二材料層116其中之一,並將隔熱元件118配置於開口112a中。最後,將心層112的另一側黏結至第一材料層114及第二材料層116其中之另一,使隔熱元件118位於第一材料層114及第二材料層116之間,以完成殼體結構110的製作。
隨著產品設計之不同,當隔熱元件118與心層112為同一層且隔熱元件118成為心層112上之隔熱區時,則心層112區分為隔熱區及導熱區,其中隔熱區對位於電子裝置100內的發熱元件120用以使發熱元件120的熱能夠經由導熱區均勻地將熱分散至殼體結構110的其它部分,避免殼體結構的表面產生熱點的缺陷。
圖3為本發明另一實施例之電子裝置的局部剖視圖。請參考圖3,本實施例的殼體結構210的心層212、第一材料層214、及第二材料層216的配置方式,與圖1所示之殼體結構110的心層112、第一材料層114、第二材料層116及隔熱元件118的配置方式相同,於此不加以贅述。電子裝置200的發熱元件220除了對位於隔熱區218之外,更接觸第二材料層216,以使發熱元件220產生的熱能H’能夠更快速地藉由第二材料層216的傳導傳遞至心層212的導熱區219以將熱分散至殼體結構210的其它部分。
在圖3的實施例中,發熱元件220例如是配置於電路板230上的中央處理器(Central Processing Unit,CPU)或其它電子元件,本發明不對發熱元件的種類加以限制。
綜上所述,本發明的殼體結構在心層中配置了隔熱區且隔熱區對位於電子裝置內的發熱元件。藉由隔熱區的阻隔,發熱元件所產生的熱不會直接傳導至殼體結構之表面
對應於發熱元件的位置,而會透過第一材料層、心層之導熱區、及第二材料層的傳導而較為均勻地分散至殼體結構的其它部分。藉此,可避免使用者接觸殼體結構之表面對應於發熱元件的位置時因高溫而產生不適,以增加電子裝置使用上的舒適度。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100、200‧‧‧電子裝置
110、210‧‧‧殼體結構
110a‧‧‧位置
111‧‧‧第一黏結層
113‧‧‧第二黏結層
112、212‧‧‧心層
112a‧‧‧開口
112b‧‧‧第一表面
112c‧‧‧第二表面
114、214‧‧‧第一材料層
116、216‧‧‧第二材料層
118、218‧‧‧隔熱區
119、219‧‧‧導熱區
120、220‧‧‧發熱元件
230‧‧‧電路板
H、H’‧‧‧熱能
圖1為本發明一實施例之電子裝置的局部剖視圖。
圖2為圖1之殼體結構的局部放大圖。
圖3為本發明另一實施例之電子裝置的局部剖視圖。
100...電子裝置
110...殼體結構
110a...位置
112...心層
112a...開口
112b...第一表面
112c...第二表面
114...第一材料層
116...第二材料層
118...隔熱區
119...導熱區
120...發熱元件
H...熱能
Claims (16)
- 一種殼體結構,適用於一電子裝置,該電子裝置具有一發熱元件,該殼體結構包括:一心層,具有一導熱區、一隔熱區、一第一表面及相對於該第一表面的一第二表面,其中該導熱區相鄰於該隔熱區且圍繞該隔熱區;一第一材料層,配置於該第一表面並接觸該導熱區與該隔熱區;一第二材料層,配置於該第二表面並接觸該導熱區與該隔熱區;以及其中該發熱元件對位於該隔熱區且將該發熱元件所產生之一熱能藉由該第二材料層及該導熱區傳遞至該第一材料層。
- 如申請專利範圍第1項所述之殼體結構,其中該隔熱區的材質包括保麗龍、棉花、木材或植物纖維。
- 如申請專利範圍第1項所述之殼體結構,其中該導熱區在一第一方向的導熱速度大於一第二方向的導熱速度,其中該第二方向為該心層平面的法線向量且該第一方向垂直於該第二方向。
- 如申請專利範圍第1項所述之殼體結構,其中該導熱區的材質包括石墨。
- 如申請專利範圍第1項所述之殼體結構,更包括:一第一黏結層,位於該心層與該第一材料層之間,用以使該心層與該第一材料層相互黏結;以及 一第二黏結層,位於該心層與該第二材料層之間,用以使該心層與該第一材料層相互黏結。
- 如申請專利範圍第5項所述之殼體結構,其中位於該導熱區與該第一材料層間之該第一黏結層及位於該導熱區與該第二材料層之間之該第二黏結層為高熱傳導係數的黏結層。
- 如申請專利範圍第1項所述之殼體結構,其中該發熱元件接觸該第二材料層。
- 如申請專利範圍第1項所述之殼體結構,其中該心層為一編織物層且該第一材料層及該第二材料層可為一金屬板。
- 一種電子裝置,包括:一殼體結構,包括:一心層,具有一導熱區、一隔熱區、一第一表面及相對於該第一表面的一第二表面,其中該導熱區相鄰於該隔熱區且圍繞該隔熱區;一第一材料層,配置於該第一表面並接觸該導熱區與該隔熱區;一第二材料層,配置於該第二表面並接觸該導熱區與該隔熱區;以及一發熱元件,設置於一電路板上且對位於該隔熱區,其中該發熱元件所產生之一熱能藉由該第二材料層及該導熱區傳遞至該第一材料層。
- 如申請專利範圍第9項所述之電子裝置,其中該 隔熱元件的材質包括保麗龍、棉花、或植物纖維。
- 如申請專利範圍第9項所述之電子裝置,其中該導熱區在一第一方向的導熱速度大於一第二方向的導熱速度,其中該第二方向為該心層平面的法線向量且該第一方向垂直於該第二方向。
- 如申請專利範圍第9項所述之電子裝置,其中該心層的材質包括石墨。
- 如申請專利範圍第9項所述之電子裝置,其中該殼體結構更包括:一第一黏結層,位於該心層與該第一材料層之間,用以使該心層與該第一材料層相互黏結;以及一第二黏結層,位於該心層與該第二材料層之間,用以使該心層與該第一材料層相互黏結。
- 如申請專利範圍第13項所述之電子裝置,其中位於該導熱區與該第一材料層間之該第一黏結層及位於該導熱區與該第二材料層之間之該第二黏結層為高熱傳導係數的黏結層。
- 如申請專利範圍第9項所述之電子裝置,其中該發熱元件接觸該第二材料層。
- 如申請專利範圍第9項所述之電子裝置,其中該心層為一編織物層且該第一材料層及該第二材料層可為一金屬板。
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- 2011-12-07 TW TW100145068A patent/TWI472423B/zh not_active IP Right Cessation
- 2011-12-21 DE DE102011121899A patent/DE102011121899A1/de not_active Ceased
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TW201226168A (en) | 2012-07-01 |
CN102573417A (zh) | 2012-07-11 |
US20120162921A1 (en) | 2012-06-28 |
CN102548283B (zh) | 2014-12-10 |
US8574702B2 (en) | 2013-11-05 |
TWI472423B (zh) | 2015-02-11 |
US8681502B2 (en) | 2014-03-25 |
DE102011121899A1 (de) | 2012-06-28 |
CN102548283A (zh) | 2012-07-04 |
TW201236539A (en) | 2012-09-01 |
US20120164360A1 (en) | 2012-06-28 |
CN102573417B (zh) | 2015-04-08 |
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