JP4262293B2 - Manufacturing method of image display device - Google Patents

Description

  The present invention relates to a phosphor in a sealed container that holds the interior at a pressure lower than atmospheric pressure, a mechanism for causing the phosphor to emit light, and a tubular exhaust pipe that is sealed to maintain the inside of the sealed container at or below atmospheric pressure. The present invention relates to a method of manufacturing an image display apparatus having a sealed exhaust pipe whose sealing part is made of metal, and specifically, targets a flat image display apparatus.

Conventional self-luminous flat image display devices include, for example, a plasma display, an EL display device, and a flat image display device using an electron beam.
As an image display device using a sealed container that holds the inside at a pressure lower than atmospheric pressure, a television cathode ray tube or the like can be cited as a representative, but a plasma display, a flat panel image display device using an electron beam, etc. It is a device / equipment using a sealed container that keeps the interior at a pressure lower than atmospheric pressure.

  With respect to these display devices, at present, there is an increasing demand for larger screens and higher definition, and there is an increasing need for self-luminous flat-plate image display devices.

  In order to construct a self-luminous flat panel image display device using an electron beam, for example, an electron is placed in a sealing container sandwiched between a face plate, a rear plate, and an outer frame, and the inside is maintained at a pressure lower than atmospheric pressure. There has been filed a thin image display device that uses a surface conduction electron-emitting device as an electron source for generating a beam, accelerates the electron beam, irradiates a phosphor, emits light, and displays an image (see Patent Document 1).

FIG. 1 shows a part of a cross section of a flat image display device using a surface conduction electron-emitting device.
In the figure, 101 is a rear plate made of an insulating material such as soda glass, and 102 is a surface conduction electron-emitting device.

FIG. 2B schematically shows the surface conduction electron-emitting device 102.
In the same figure, 205 and 206 are electrodes arranged at a constant interval (about 2 μm), 207 is a conductive thin film formed by applying organic Pd (CCP4230 manufactured by Okuno Pharmaceutical Co., Ltd.), 208 is an electron emission portion, An electron emission portion 208 that emits electrons is formed by an energization process called forming.

Here, forming means that the electron emission portion 208 is electrically high resistance by applying a voltage between the device electrodes 205 and 206 to locally destroy, deform or alter the conductive thin film 207. It is to form.
Note that the electron emission portion 208 may be cracked in a part of the conductive thin film 207 and emit electrons from the vicinity of the crack.

In addition, a conductive thin film 207 of the surface conduction electron-emitting device 200 (corresponding to 102 in FIG. 1) using an SnO ₂ film, an Au thin film (see Non-Patent Document 1), a carbon thin film ( Non-Patent Document 2) has been reported.

  Further, in FIG. 1, reference numeral 103 denotes a wiring for supplying an electric signal to the surface conduction electron-emitting device 102, which is connected to a drive circuit unit 306 as shown in FIG.

  Reference numeral 105 denotes a face plate made of soda glass, and an inner surface of the face plate 105 is coated with a phosphor 107 covered with an Al thin film metal back 106. Reference numeral 108 denotes a frit glass, and reference numeral 109 denotes an outer frame. The face plate 105 and the rear plate 101 are sandwiched between the outer frames 109 and sealed using the frit glass 108 to form a sealed container 112 that can be hermetically sealed to atmospheric pressure or lower. .

  Further, 110 is a region that does not affect the image, for example, a getter installed outside the image display region, and 111 is an exhaust pipe.

  In addition to a surface conduction electron-emitting device, a thermoelectron source using a heated cathode and a field-emission electron-emitting device (Non-patent Document 3, etc.) are known as electron sources.

In the above-described configuration, the inside of the sealed container is evacuated by a vacuum pump (not shown) initially connected to the exhaust pipe 111. Since the exhaust pipe exhausts the inside of the sealed container as quickly as possible, the inner diameter should be as large as possible.

The surface conduction electron-emitting device 102 is energized and the above-described forming is performed. After the heat degassing and the getter 110 is flushed, the exhaust pipe 111 is sealed (chip off).

  Further, when an electric signal, which is an image display signal, is supplied to the device electrode 104 of the surface conduction electron-emitting device 102 by an external drive circuit (not shown), electrons are converted into a beam form from the electron-emitting portion (FIG. 2 (b) 208). The emitted electrons collide with the phosphor 107 accelerated by the high voltage (1 to 10 KV) applied to the phosphor 107 and the metal back 106 to emit light and display an image.

  As a sealing means for maintaining the pressure in the conventional sealed container, the sealed container is exhausted through an exhaust pipe integrated with the sealed container or physically connected, mainly through an exhaust pipe made of glass. There has been used a means for heating the exhaust pipe in an exhaust state at an atmospheric pressure or lower, melting, sealing, and cutting.

As a very general means of such sealing / cutting means, a method of manufacturing a fluorescent lamp, an incandescent lamp or the like is known.
For example, in FIGS. 3 and 5 of Patent Document 2, it is disclosed that a sealing burner is applied to both sides of a glass exhaust pipe to soften it by heating and crush or seal off with a burner. 3 to 8 of Patent Document 3, a sealing burner is applied from both sides of a glass exhaust pipe, heated and softened, melted, and then scribed in a predetermined position by a cutter to seal the exhaust pipe It is disclosed that the site is cut.

Furthermore, as a tip-off method for the exhaust pipe of the self-luminous flat panel display, Patent Document 4 discloses a thin-walled exhaust pipe made of hard glass having a low thermal expansion coefficient of 9 mm in outer diameter and 7 mm in inner diameter by heating with an electric heater. Examples have been disclosed.

JP-A-2-299136 JP-A-5-174710 JP-A-6-162997 JP-A-7-57637 G. Dittmer: "Thin Solid Films", 9,317 (1972) Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1983) W. P. Dyke & W. W. Dolan, "Field emission", Advance in Electron Physics, 8, 89 (1956), C.I. A. Spindt, "Physical properties of thin-film field emission cathodes with molybdenum cones" Appl. Phys. , 47, 5248 (1976), etc.), metal / insulating layer / metal type electron-emitting device (C.A. Mead “The tunnel-emission amplifier, J. Appl. Phys., 32,646 (1961)).

  Normally, when heating and softening / melting / shrinking a glass exhaust pipe, the outer diameter, inner diameter, thickness, uniformity of the tubular exhaust pipe, the material of the glass used, that is, hard glass, soft glass, etc. Due to the difference, various conditions for heating, softening, melting and cutting are set, and in some cases, it is necessary to change the conditions for each sealing.

  In addition, as disclosed in Patent Document 4 described above, the tubular glass exhaust pipe heated and softened in a state below atmospheric pressure is convex inward and easily forms a molten state called a meat reservoir. In some cases, there is always a concern that a microcrack (crack) occurs and a vacuum leak occurs.

  Furthermore, when heating, softening, and melting are performed on the tubular glass exhaust pipe, many gas components such as structural water contained in the glass of the tubular glass exhaust pipe are released. The gas components released from the first exhaust pipe that is sealed in a state where there are multiple exhaust pipes and the exhaust is continued are exhausted to some extent through the exhaust pipe before sealing, but taking some time. It is necessary to perform sealing.

  However, the gas component released when the exhaust pipe to be sealed at the end is sealed is exhausted to the exhaust side, but partially or the same amount of gas component as exhausted to the exhaust side. Will also stay in the sealed container.

  Naturally, it is preferable that the gas component mainly composed of structural water or the like stays in the sealed container for an electron source that holds the sealed container in an extremely low pressure state and emits electrons and an image display device using the electron source. Not a thing.

  Also, in order to minimize the amount of gas emitted when sealing the exhaust pipe, it is improved to some extent by setting the heating temperature lower, reducing the heating area as much as possible, or selecting a glass material with less structural water. Although it is possible to reduce the reliability of the sealing itself, the softening / melting condition is lowered.

  On the other hand, it is possible to arrange a so-called getter member that adsorbs the released gas species at the time of sealing in the sealed container, but the structure of the getter disposed in the sealed container is complicated due to the structure of the flat image display device. It should be fully inferred.

  In addition, the conditions for the getter material to fully exhibit its ability, that is, if it is an evaporative type, it is flushed, and if it is a non-evaporable type, the getter member is energized or heated and activated, and the glass exhaust pipe is In order to seal and further maintain the pressure in the sealed container, the manufacturing process itself becomes complicated, for example, a step for expressing the adsorption / exhaust capacity of the getter member is required.

  It should be fully inferred that the getter member that has developed the adsorption / exhaust ability before sealing is deteriorated in the initial stage due to structural water or the like released during sealing.

  On the other hand, even when the getter member is activated or flushed after sealing the exhaust pipe and the released gas adsorption function is exhibited, the released gas from the getter member itself stays, and the pressure in the sealed container is the adsorption exhaust of the getter member. Relying on the capability contributes to the complexity of the configuration within the sealed container.

  If the pressure in the sealed container rises by one or more digits from the original pressure, it is easily guessed that the reliability and durability of the electron source or image display device will be reduced. Should be done.

  The present invention has been made in view of the above-described problems of the prior art, and is a tubular exhaust pipe that improves the above-described problems and has a small amount of released gas during sealing in an image display device having a tubular exhaust pipe sealing portion. It is an object of the present invention to provide a sealing method, a flat panel image display device using the sealing method, and a manufacturing method thereof.

The present inventors have solved the above-mentioned problems in the conventional image display device, and as a result of intensive studies to achieve the object of the present invention, the present invention has been achieved.
The image display device and the manufacturing method thereof provided by the present invention are as follows.

The method for manufacturing an image display device according to the present invention is a sealing portion made of a plated metal, and the thickness of the sealing portion is 30% to 70% of the thickness of a portion other than the sealing portion. An exhaust pipe having the sealing portion is connected to the container, and the container is evacuated to a pressure lower than atmospheric pressure, and the sealing portion of the exhaust pipe is pressure-bonded and sealed and separated.

  Preferably, the metal of the sealing part is copper, an alloy containing copper, aluminum, an alloy containing aluminum, silver, an alloy containing silver, tungsten, an alloy containing tungsten, molybdenum, an alloy containing molybdenum , Either.

  Preferably, the plating treatment is a plating treatment made of a metal made of zinc, gold, tin, nickel, rhodium, palladium, chromium, cadmium, or an alloy containing one or more of these metals.

  According to the present invention, since the exhaust pipe sealing part is made of metal, gas such as glass-containing structural water generated when sealing the glass exhaust pipe sealing part is hardly released.

  Even if there are a plurality of exhaust pipes connected to the sealed container and the sealing part is made of one metal and the other exhaust pipe sealing parts are made of glass, the metallic exhaust according to the present invention is used. By sealing the tube sealing part last, the gas released when sealing other glass exhaust pipes is exhausted out of the sealed container from the exhaust pipe having a metallic sealing part, and the exhaust pipe is sealed. It is possible to remove the harmful effects of the gas released from the time remaining in the sealed container.

  Since there is almost no released gas at the time of sealing, it is possible to reduce the number of members for the arrangement of members (such as getters) for maintaining the pressure in the container installed in a sealed container, and a complicated container structure The manufacturing cost can be reduced.

  The reliability of the sealing process and the yield can be eliminated by eliminating concerns such as the occurrence of a puddle, the accompanying micro-destruction (crack), and the occurrence of leaks, which was a concern when sealing glass exhaust pipes. It can contribute to improvement.

  In addition, it is possible to relax the specifications related to the thickness of the sealing portion required for the glass exhaust pipe, the outer diameter of the exhaust pipe, and the like, and as a result, it is possible to reduce the component cost.

  Further, since only the portion to be sealed of the metal exhaust pipe sealing portion is thinner than the others, cutting can be easily performed while maintaining the strength of the exhaust pipe, and the yield of the sealing process is improved.

  In addition, since the metal surface of the metal sealing portion is plated, oxidation of the metal surface does not occur when sealing the panel for joining the exhaust pipe to the sealed container. Is not peeled off from the metal surface and scattered in the panel and the manufacturing apparatus, and there is no contamination of the inside of the panel by the metal oxide or damage to the exhaust apparatus of the manufacturing apparatus.

  Furthermore, when the connecting member of the metal exhaust pipe is made of an alloy containing iron and nickel close to the thermal expansion coefficient of the sealed container or an alloy and glass containing iron and nickel, when connecting the connecting member to the sealed container, The sealed container is not cracked and the yield is improved.

  As a result, the image quality and reliability of the image display apparatus can be improved, and at the same time, the operation period of the manufacturing apparatus can be extended and the manufacturing yield can be improved, thereby reducing the manufacturing cost.

  By this invention, compared with a glass exhaust pipe, there exists an effect which improves the sealing reliability of an exhaust pipe significantly.

  According to the present invention, it is possible to greatly reduce the gas released at the time of sealing, which has been released during sealing of the exhaust pipe made of glass and stays in the sealed container.

  Thereby, the pressure in the sealed container as the image display device after sealing the exhaust pipe can be increased to a desired pressure in a short time, and the manufacturing time can be shortened.

  In addition, since the amount of gas released at the time of sealing is small, the number of pressure maintaining components such as getter members installed at the time of sealing the glass exhaust pipe can be reduced, which is effective in reducing costs.

  Furthermore, since the metal surface is plated, the metal surface does not oxidize when sealing the panel that joins the exhaust pipe to the sealed container, so that the metal oxide peels off the metal surface when sealing the exhaust pipe. Therefore, it does not scatter in the panel and the manufacturing apparatus, and there is no contamination of the panel inside by the metal oxide or damage to the exhaust apparatus of the manufacturing apparatus.

As a result, the deterioration of the image display quality due to the oxidation of the emission gas and the metal exhaust pipe at the time of sealing the glass exhaust pipe, that is, the deterioration of the electron source in the electron emission element or the element deterioration in the discharge cell, etc. Can be reduced.

  In addition, since only the planned sealing part of the metal exhaust pipe sealing part is thinner than the others, cutting can be easily performed while maintaining the strength of the exhaust pipe, and the yield of the sealing process is improved. This is effective in reducing the cost of the display device.

  Furthermore, when the connection member of the metal exhaust pipe is made of an alloy containing iron and nickel close to the thermal expansion coefficient of the sealed container or an alloy and glass containing iron and nickel, when connecting the exhaust pipe to the sealed container, There is no crack in the sealed container, the yield is improved, and the cost of the image display device is reduced.

  Moreover, by being able to mechanize such a crimping | sealing sealing, compared with the process using a heating coil, a burner flame, etc., the safety | security of an operator and the safety | security of a manufacturing apparatus can be improved.

  Further, the manufacturing quantity of the image display device can be increased by mechanization. In addition, since the manufacturing process of the image display device can be performed under optimum conditions, the yield of the image display device is improved.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments to which the present invention is applied will be described in detail with reference to the drawings.

FIG. 4 shows a step of sealing the metal exhaust pipe sealing portion in the present invention.
In FIG. 4A, a sealed container 112 as an image display device, an exhaust pipe 111 for exhausting the inside of the sealed container to atmospheric pressure or less, a metallic exhaust pipe sealing portion 401 whose inner surface is plated, A connecting portion 403 connecting the exhaust system device (not shown) and the exhaust pipe 111, and a device for pressure-sealing the metal exhaust pipe sealing portion 401 (hydraulic shut-off device called pincher, hereinafter referred to as pincher) ) 402 and a hydraulic device 405 for applying hydraulic pressure to an operation deadline 404 (a portion called a bit, hereinafter referred to as a bit) of the pincher 402. The bit 404 includes a fixed side bit 404a that is fixed and an operating side bit 404b that operates.

  In FIG. 4A, while the sealed container 112 is evacuated to the atmospheric pressure or lower through the exhaust pipe 111, the pincher is sealed, that is, the fixed bit 404a is sealed with a metal exhaust pipe. It is shown that the working side bit is set apart from the end surface of the sealing portion 401 of the metal exhaust pipe while being brought into contact with the end surface of the stop portion 401.

  In FIG. 4B, the operating side bit 404b starts to move due to the pressure from the hydraulic device 405, and the shape of the exhaust pipe is starting to be deformed below the outer diameter of the exhaust pipe 111.

  FIG. 4C shows that the operating side bit 404b further moves, deforms the exhaust pipe shape to the thickness of the exhaust pipe 111 or less, and proceeds to the pressure sealed state.

  In FIG. 4D, the exhaust pipe 111 is pressure-bonded and sealed by the pressure applied between the operating side bit 404b and the fixed side bit 404a. And it has shown that the working side bit 404b is starting to retract | separate while separating to the sealed container side and the exhaust system side.

FIG. 5 shows an example of an exhaust pipe configuration having a metal tubular exhaust pipe sealing portion according to the present invention.
In FIG. 5, the metal tubular exhaust pipe 500 is a cylindrical exhaust pipe, the surface of the metal tubular exhaust pipe 500 is surface-treated at a plating treatment site 504, and the metal exhaust pipe sealing site 501 is made of metal. This indicates that the tubular exhaust pipe 500 is to be sealed and is thinner than other parts of the metal tubular exhaust pipe 500.

  Further, it is possible to use an exhaust pipe composed of a connecting member 503 for connecting to a sealed container and a metal tubular exhaust pipe 500 connected using a sealing adhesive 502 for maintaining airtightness.

  A silver brazing member or the like can be used as the sealing adhesive 502, but other adhesive members may be used as long as the airtightness is maintained. As the connection member 503, an alloy member containing iron and nickel can be used.

  FIG. 6 shows an example of connecting the exhaust pipe having the configuration shown in FIG. 5 to a sealed container 601 and an exhaust system device (not shown). The sealing container 601 is connected to a connecting member 503 with a low melting point glass 603, The exhaust system mechanism (apparatus) shows an example in which the metal tubular exhaust pipe 500 is connected using the O-ring 606 of the exhaust pipe connecting portion 604.

  As an example of a method for connecting the sealed container 601 and the connecting member 503 shown in FIG. 6, when the sealed container 601 is sealed, the exhaust pipe connecting member 503 shown in FIG. Thus, the sealed container 601 with the exhaust pipe joined thereto is produced.

  Further, as shown in FIG. 6, an exhaust pipe connecting portion 604 using an O-ring 606 can be connected to the exhaust device side.

  FIG. 7 is an example in which the connection method with the exhaust device is different from that in FIG. 6. The connection member 505 is bonded with a sealing adhesive 506, and the connection member 505 is connected to the connection portion 702 on the exhaust system mechanism side 703. The other example which has connected using the low melting glass 701 is shown. The connecting member 503 and the connecting member 505, and the sealing adhesive 502 and the sealing adhesive 506 are made of the same material.

  FIG. 8 shows a configuration including a glass substrate 801 and an exhaust pipe, in which the sealed container 601 shown in FIG. 7 is replaced with a glass substrate 801 in order to perform individual emission gas measurement in the exhaust pipe section.

FIG. 9 shows another example of an exhaust pipe configuration having a metal tubular exhaust pipe sealing portion according to the present invention.
In FIG. 9, a metal tubular exhaust pipe 500 is a cylindrical exhaust pipe, the surface of the metal tubular exhaust pipe 500 is surface-treated at a plating treatment site 504, and the metal exhaust pipe sealing site 501 is made of metal. This indicates that the tubular exhaust pipe 500 is to be sealed and is thinner than other parts of the metal tubular exhaust pipe 500.

  As shown in FIG. 9, the metal tubular exhaust pipe 500 uses a sealed container side connecting member 1101 for a sealed container, and uses a low melting glass 603 to maintain airtightness with the connecting member 503. In addition, an exhaust pipe having a configuration in which the metal tubular exhaust pipe 500 and the metal tubular exhaust pipe 500 are connected using a sealing adhesive 502 can be preferably used.

  A silver brazing member or the like can be used as the sealing adhesive 502, but other adhesive members may be used as long as the airtightness is maintained. As the connection member 503, an alloy member containing iron and nickel can be used. In addition, although frit glass is preferably used for the low melting point glass 603, other adhesives may be used as long as confidentiality is maintained, like the sealing adhesive 502.

  In FIG. 10, the exhaust pipe having the configuration shown in FIG. 9 is connected by a sealed container 601 and a low-melting glass 603, and the exhaust system device includes a metal tubular exhaust pipe 500 and an O-ring 606 of the exhaust pipe connecting portion 604. An example of using and connecting is shown.

  As an example of a connection method between the sealed container 601 and the connection member 503 illustrated in FIG. 10, the following method can be used.

  When the sealed container 601 is sealed, the sealed container side connection member 901 shown in FIG. 9 is simultaneously connected with the low-melting glass 603, so that the sealed container 601 to which the sealed container side connection member 1101 is joined is manufactured.

  Meanwhile, an exhaust pipe member is prepared in which the connection member 503 is connected to the metal tubular exhaust pipe 500 in advance using the sealing adhesive 502.

  Before connecting to the exhaust system device, the above-mentioned sealed container side connecting member 901 and connecting member 503 are connected using the sealing adhesive 502, and the exhaust pipe structure connected to the sealed container as shown in FIG. Is made.

  Further, as shown in FIG. 10, an exhaust pipe connecting portion 604 using an O-ring 606 can be connected to the exhaust device side.

  FIG. 11 is an example in which the connection method with the exhaust device is different from the example of FIG. 10, the connection member 505 is bonded with a sealing adhesive 506, and the exhaust system side connection member 1101 is bonded with a low melting point glass 1102. Another example is shown in which the exhaust system side connection member 1101 is connected to the connection portion 702 on the exhaust system mechanism side 703 using a low-melting glass 701. The connecting member 503 and the connecting member 505, the sealing adhesive 502 and the sealing adhesive 506, the sealed container side connecting member 901, and the exhaust system side connecting member 1101 are made of the same material.

  FIG. 12 shows an example in which the sealed container shown in FIG. 11 is replaced with a glass substrate 801 and a glass substrate 801 and an exhaust pipe are used in order to perform individual emission gas measurement in the exhaust pipe portion.

FIG. 13 shows an example of a manufacturing apparatus used when the image display apparatus shown in FIG. 1 is crimped and sealed in the process shown in FIG.
A manufacturing apparatus is shown in which the position of the bit 404 is detected by using a position detector 1302 to detect the pressure-bonded state of the exhaust pipe sealing portion and the control device 1301 controls the hydraulic device 405.

FIG. 1 is an example of a schematic diagram illustrating a configuration of a sealed container as an image display device according to the present invention.
In FIG. 1, 101 is a rear plate, 105 is a face plate which is a transparent glass substrate, 107 is a phosphor coated on the inside of the face plate 105, 106 is a metal back applied to the surface of the phosphor 107, 109 is An outer frame 108 is a frit glass as a low-melting glass, and 110 is a getter installed to maintain the pressure in the sealed container.

FIG. 2A is a schematic view showing a part of a surface conduction electron-emitting device installed on the rear plate 101 and wiring for driving the electron source.
In the figure, reference numeral 200 denotes one of a plurality of surface conduction electron-emitting devices, 202 denotes an upper wiring, 201 denotes a lower wiring, 203 denotes an interlayer insulating film that electrically insulates the upper wiring 202 and the lower wiring 201, and 204 denotes A wiring pad is shown.

FIG. 2B is a schematic view showing the structure of the surface conduction electron-emitting device 200 in an enlarged manner.
In the figure, 205 and 206 are element electrodes, 207 is a conductive thin film, and 208 is an electron emission portion.

FIG. 3 is an example showing a block diagram of the image display apparatus.
In this figure, 308 is an image display device, 302 is a flat display panel as a display device body, 301 is an image display section in the flat display panel, and 304 and 305 are element electrodes (205 and 206 in FIG. 2B). ) Represents a modulation signal side Xn (lower wiring 201 in FIG. 2A) wiring for applying a voltage to the scanning signal side Yn (upper wiring 202 in FIG. 2A) wiring, and 306 represents a modulation signal side A driving circuit unit for driving the Xn wiring and the scanning signal side Yn wiring is shown. The high voltage applying device 307 is a device for applying a high voltage to the face plate side in order to collide electrons with the face plate. Show.

First, an example of a flat panel image display device using a surface conduction electron-emitting device will be described.
In the configuration of FIG. 1, soda glass as the rear plate 101, borosilicate glass, quartz glass, a glass substrate was formed a SiO ₂ on the surface and an insulating substrate such as a ceramic substrate of alumina or the like is used as a face plate 105 A glass substrate such as transparent soda glass is used.

As a material of the device electrode 104 (205, 206 in FIG. 2B) of the surface conduction electron-emitting device 102 (200 in FIG. 2A), a general conductor is used, for example, Ni, Cr, Printing composed of metals or alloys such as Au, Mo, W, Pt, Ti, Al, Cu and Pd, and metals or metal oxides such as Pd, Ag, Au, RuO ₂ and Pd-Ag and glass It is appropriately selected from a conductor, a transparent conductor such as In ₂ O ₃ —SnO ₂ , and a semiconductor material such as polysilicon.

The electrode material can be formed by vacuum evaporation, sputtering, chemical vapor deposition, etc., and the desired shape can be obtained by photolithography (including processing techniques such as etching and lift-off). Or by other printing methods.
In short, it is only necessary to form the element electrode material into a desired shape, and the manufacturing method is not particularly limited.

  The element electrode interval L shown in FIG. 2B is preferably several hundred nm to several hundred μm. Since it is required to fabricate with good reproducibility, a more preferable inter-element electrode L is several μm to several tens μm.

  The element electrode length W is preferably several μm to several hundred μm from the resistance value of the electrode, electron emission characteristics, and the like, and the film thickness of the element electrodes 205 and 206 is preferably several tens nm to several μm.

  In addition to the configuration shown in FIG. 2B, a configuration in which the conductive thin film 207 and the device electrodes 205 and 206 are formed in this order on the rear plate 101 may be employed.

  In order to obtain good electron emission characteristics, the conductive thin film 207 is particularly preferably a fine particle film composed of fine particles. The film thickness is determined by step coverage to the device electrodes 205 and 206 and resistance between the device electrodes 205 and 206. Although it is set depending on the value and energization forming conditions described later, it is preferably 0.1 nm to several hundred nm, and particularly preferably 1 nm to 50 nm.

The resistance value is a value of Rs of 10 ² to 10 ⁷ Ω / □. Note that Rs is an amount that appears when the resistance R of a thin film having a thickness t, a width w, and a length l is R = Rs (l / w). In addition, the material constituting the conductive thin film 207 is a metal such as Pd, Pt, Ru, Ag, Au, Ti, In, Cu, Cr, Fe, Zn, Sn, Ta, W, Pb, PbO, SnO ₂ , Oxides such as In ₂ O ₃ , PbO, Sb ₂ O ₃ , borides such as HfB ₂ , ZrB ₂ , LaB ₆ , CeB ₆ , YB ₄ , GdB ₄ , TiC, ZrC, HfC, TaC, SiC, WC, etc. Carbides, nitrides such as TiN, ZrN, and HfN, semiconductors such as Si and Ge, and carbon.

  The fine particle film described here is a film in which a plurality of fine particles are aggregated, and not only the state in which the fine particles are dispersed and arranged, but also the state in which the fine particles are adjacent to each other or overlap each other (island-like shape). The diameter of the fine particles is 0.1 nm to several hundred nm, preferably 1 nm to 20 nm.

The conductive thin film 207 is manufactured by applying an organic metal solution to the rear plate 101 provided with the device electrodes 205 and 206 and drying it to form an organic metal thin film.
Here, the organometallic solution refers to a solution of an organometallic compound whose main element is the metal that forms the conductive thin film 207 described above.

  Thereafter, the organometallic thin film is heated and baked and patterned by lift-off, etching, or the like to form the conductive thin film 207.

  Note that the conductive thin film 207 is formed by the application method of the organometallic solution, but the present invention is not limited to this, but a vacuum evaporation method, a sputtering method, a chemical vapor deposition method, a dispersion coating method, a dipping method, a spinner method, etc. It may be formed by.

The electron emission portion 208 is a high-resistance crack formed in a part of the conductive thin film 207, and is formed by a process called energization forming.
In the energization forming, the element electrode 205, 206 is energized from an electrode (not shown), and the conductive thin film 207 is locally broken, deformed or altered to change the structure.

  The voltage waveform at the time of energization is particularly preferably a pulse waveform, and there are a case where a voltage pulse having a constant pulse peak value is applied continuously and a case where a voltage pulse is applied while increasing the pulse peak value.

As an example, a case where the pulse peak value is a constant voltage will be described.
The pulse waveform is a triangular waveform, the pulse width is several μsec to 10 msec, the pulse interval is several μsec to 100 msec, and the peak value (peak voltage during energization forming) is appropriately selected according to the form of the surface conduction electron-emitting device 200. The pressure is applied for several seconds to several tens of minutes under a preferable pressure of not more than atmospheric pressure, for example, a pressure of not more than about 6.67 × 10 ⁻³ Pa.

  The waveform applied between the device electrodes 205 and 206 is not limited to a triangular waveform, and a desired waveform such as a rectangular wave may be used.

  On the other hand, when applying a voltage pulse while gradually increasing the crest value, the crest value of the triangular wave (peak voltage at the time of energization forming) is increased by, for example, about 0.1 V step and applied at an appropriate pressure. .

  In this case, the energization forming process applies a voltage that does not cause local destruction or deformation of the conductive thin film 307 for a certain period of time between pulses, for example, a voltage of about 0.1 V is applied, the device current is measured, and the resistance For example, the energization forming may be terminated when a value of 1 MΩ or more is obtained.

It is desirable to perform a process called activation on the element for which energization forming has been completed.
The activation treatment is, for example, a pressure of about 1.33 × 10 ⁻² to 10 ⁻³ Pa, and, as with the energization forming, carbon and carbon compounds derived from organic substances existing in an appropriate pressure are formed on the conductive thin film. The device current (current flowing between the device electrodes 205 and 206) and the emission current (device current emitted from the electron emission unit 208) are remarkably changed.

  The activation process is completed, for example, when the emission current is saturated while measuring the device current and the emission current.

  The voltage pulse to be applied is preferably an operation driving voltage at the time of image display, and a voltage larger than that is preferably used. The formed crack may have conductive fine particles having a particle diameter of 0.1 nm to several tens of nm. The conductive fine particles contain at least a part of elements constituting the conductive thin film 207. Further, the electron emission portion 208 and the conductive thin film 207 in the vicinity thereof may contain carbon and a carbon compound.

  The surface conduction electron-emitting device 200 may be a planar type in which the surface conduction electron-emitting device 200 is planarly formed on the surface of the rear plate 101 or a vertical type formed on a surface perpendicular to the rear plate 101. Furthermore, if a flat-type image display device using an electron-emitting device such as a thermionic source using a hot cathode, a field emission type electron-emitting device, etc. is taken as an example, if it is an element that emits electrons, There are no restrictions.

  Next, the arrangement of the surface conduction electron-emitting devices 200 and wiring for supplying electric (power) signals for image display to the devices will be described.

  As wiring examples, two orthogonal wirings (Y: upper wiring 202 and X: lower wiring 201, which are called simple matrix wirings) can be used, and the device electrode 205 of the surface-type electron-emitting device 200, Each of 206 is electrically connected directly from the lower wiring 201 through the wiring pad 204 from the upper wiring 202.

  A plurality of upper wirings 202, wiring pads 204, and lower wirings 201 are produced by a printing method such as a screen printing method or an offset printing method.

  The conductive paste to be used includes noble metals such as Ag, Au, Pd, Pt, etc., and base metals such as Cu, Ni alone or any combination thereof, and after printing the wiring pattern with a printing machine, the temperature is 500 ° C. Firing at the above temperature. The thickness of the formed upper and lower printed wirings is about several μm to several hundred μm.

  Further, at least where the upper and lower wirings 202 and the lower wiring 201 overlap each other, an interlayer insulating film 203 having a thickness of about several to several hundreds of μm printed and baked (500 ° C. or higher) is sandwiched between them to obtain electrical insulation. .

  The end portion of the upper wiring 202 in the Y direction applies a scanning signal which is an image display signal for scanning the row on the Y side of the surface conduction electron-emitting device 200 according to the input signal. Thus, it is electrically connected to the drive circuit unit 306 as scanning side electrode drive means.

  On the other hand, the end portion of the lower wiring in the X direction applies a modulation signal, which is an image display signal for modulating each column of the surface conduction electron-emitting devices 200 in accordance with the input signal, as shown in FIG. Thus, it is electrically connected to the drive circuit unit 306 as the modulation signal drive means. The rear plate 101 is provided with a hole for evacuating.

  The phosphor 107 applied to the inside of the face plate 105 consists of only a single phosphor in the case of monochrome, but when displaying a color image, a phosphor emitting three primary colors of red, green, and blue and a black stripe or It is necessary to form pixels with the black matrix as a boundary.

  As a manufacturing method, there are a photolithography method using a phosphor slurry or a printing method. Patterning is performed on pixels of a desired size to form phosphors of respective colors.

  Further, a metal thin film such as aluminum is formed by filming of the polymer film, and the manufactured metal back 106 is applied to the surface of the phosphor 107. In order to apply a high voltage to the metal back 106, as shown in FIG.

  The face plate 105 may be provided with a transparent conductive thin film between the phosphor 107 and the face plate 105 in order to further increase the conductivity.

  As the material of the outer frame 109, the same material as the face plate 105 or the rear plate 101, or glass, ceramics, metal, or the like having a coefficient of thermal expansion substantially equal to them can be used.

  Further, a getter 110 is installed on the outer frame 109. Alternatively, a support member other than the outer frame can be installed inside the sealed container, and a getter can be installed on the support member.

  The rear plate 101, the outer frame 109, and the face plate 105 are sandwiched in this order, and the frit glass 108 is applied to the face plate 105, the portion where the rear plate 101 and the outer frame 109 are in contact, and the rear plate 101 and An exhaust pipe 111 having a thermal expansion coefficient represented by the following relational expression is installed, a frit glass 108 is applied to the connection portion, and heated and sealed in an electric furnace or the like.

When the thermal expansion coefficient of the rear plate is A, the thermal expansion coefficient of the connection member of the exhaust pipe is B, and the thermal expansion coefficient of the frit glass is C,
A × 0.95 ≦ B ≦ A × 1.10, A × 0.75 ≦ C ≦ A × 1.05, B × 0.75 ≦ C ≦ B × 1.0
The following relational expression holds.

  In the present invention, an exhaust pipe having the structure shown in FIG. 5 is first prepared, and the sealed container described in the present invention is obtained by joining the exhaust pipe 111 at the same time when sealing the sealed container. I can do things.

  In the method of manufacturing the exhaust pipe having the configuration as shown in FIG. 5, first, the metal tubular exhaust pipe 500 is ground with a lathe or the like, and the metal exhaust pipe sealing portion 501 is manufactured. The amount to be ground is such that it can be easily cut with a pincher while maintaining the strength as an exhaust pipe, and a grinding amount of 30% to 70% of the thickness of the metallic tubular exhaust pipe 500 is appropriately used.

  Next, the ground metal tubular exhaust pipe 500 is plated. Plating is performed so that the surface of the metallic tubular exhaust pipe 500 is prevented from being oxidized by heat oxidation and the metal tubular exhaust pipe 500 may be formed with a plating portion 504.

  The method for performing the plating treatment can be appropriately selected from electrolytic plating, electroless plating, alloy plating, composite plating, radient, alumite treatment, and the like. The thickness of the plating site 504 formed by plating is appropriately selected from 1 μm to 1000 μm, and preferably 5 μm to 200 μm is used as appropriate.

Next, the exhaust pipe 111 is manufactured by bonding the connecting member 503 with the sealing adhesive 502.
As another exhaust pipe configuration example, as shown in FIG. 9, an exhaust pipe 111 having a configuration in which a sealing container side connection member 901 is bonded to a connection member 503 with a low melting point glass 902 can be used.

  The sealed container side connecting member 901 may be bonded in advance to the sealed container 601 and then connected to the exhaust pipe to which the connecting member 503 is bonded, or the sealed container side connecting member 901 is bonded. The exhaust pipe 111 may be connected to a sealed container.

  The material of the outer frame 109 is the same material as the face plate 105 or the rear plate 101, or glass, ceramics, metal, or the like having a coefficient of thermal expansion substantially the same as those.

  Further, a getter 110 is installed on the outer frame 109. Then, the frit glass 108 is applied to the face plate 105 and the portion where the rear plate 101 and the outer frame 109 are in contact, and the rear plate 101, the outer frame 109, and the face plate 105 are brought into contact with each other.

  Further, the rear plate 101 is provided with holes (not shown). The rear plate 101 and the exhaust pipe 111 are installed there, and a frit glass 108 is applied to the connecting portion thereof, and an electric furnace or the like is used. Heat and seal.

  In the case of a color display image display device, the face plate 105 and the rear plate 101 are aligned and sealed in order to correspond one-to-one with the surface conduction electron-emitting devices 102 and the phosphor 107 pixels (not shown). To do.

Through the above steps, the container surrounded by the rear plate 101, the outer frame 109, and the face plate 105 is formed so as to be kept hermetically at a pressure equal to or lower than atmospheric pressure.
An adapter connected to the exhaust system (exhaust pipe connection portion 604 in FIGS. 6 and 10, exhaust system mechanism side connection portion 702 in FIGS. 7 and 11) is connected to the end of the exhaust pipe 111, and the exhaust system device The inside of the sealed container is evacuated to a pressure of about 1.33 × 10 ⁻³ Pa or less.

  Furthermore, the above-described energization forming, that is, an electrical signal for forming is applied to the element electrode 104 (205 and 206 in FIG. 2B), energization processing is performed, and further activation processing is performed.

  Next, the whole sealed container is heated and degassed while the inside of the sealed container is evacuated by the exhaust system device.

  Next, the getter 110 is heated at high frequency from the outside, and the getter material containing Ba as a main component is flushed.

Next, the tip-off process of the exhaust pipe 111 will be described as shown in FIG.
First, as shown in FIG. 4A, the fixed side bit 404a of the pincher 402 is positioned at the end face of the metal exhaust pipe sealing part 401, and the working side bit 404b is the end face of the metal exhaust pipe sealing part 401. Set so that it is away from.

  Next, as shown in FIG. 4B, by applying hydraulic pressure from the hydraulic device 405, the operating side bit 404b is operated, and the metal exhaust pipe seal of the exhaust pipe 111 is fixed to the fixed side bit 404a. The stop part 401 is crushed and the diameter is reduced.

  Next, as shown in FIG. 4 (c), the metal exhaust pipe sealing portion 401 is further crushed by the working side bit 404 b, and the exhaust pipe shape is deformed to be less than the thickness of the metal exhaust pipe sealing portion 401. Then, crimp and seal.

  Next, as shown in FIG. 4D, after completion of the crimping and sealing, the hydraulic pressure from the hydraulic device 405 is stopped, and the operating side bit 404b is pulled away from the metal exhaust pipe sealing part 401 that has been crimped and sealed. .

  By the series of processes described above, the sealed container becomes an image display device. In the image display device manufactured as described above, scanning drive means (305 and 306 in FIG. 3) connected to the upper wiring 202, and modulation driving means (304 and 306 in FIG. 3) connected to the lower wiring 201, A scanning signal, which is an image signal, and a modulation signal are provided to each of the surface conduction electron-emitting devices 102 and 200.

  A driving voltage, that is, an electric signal is applied as a difference voltage between them, a current flows through the conductive thin film 207, and electrons are emitted as an electron beam according to the electric signal from the electron emitting portion 208, a part of which is a crack. , Accelerated by a high voltage (1 to 10 KV) applied to the metal back 106 and the phosphor 107, collides with the phosphor 107, causes the phosphor to emit light, and displays an image.

  The purpose of the metal back 106 here is to improve the brightness by specularly reflecting the light on the inner surface side of the phosphor to the face plate 105 side, and to act as an electrode for applying an electron beam acceleration voltage. In other words, the phosphor 107 is protected from damage caused by collision of negative ions generated in the sealed container.

  In addition to surface conduction electron-emitting devices as the above-mentioned electron sources, those using field-emission electron-emitting devices, simple matrix types, and electron beams emitted from electron sources using control electrodes (grid electrode wiring) The manufacturing method of the image display device of the present invention can also be applied to an image display device that controls and displays an image, an image display device that uses plasma discharge, and the like.

  In short, if the exhaust pipe is connected to the sealed container, and the exhaust pipe is used and it is necessary to maintain the inside of the sealed container at atmospheric pressure or lower, the metal tubular exhaust pipe seal of the present invention is used. The manufacturing method, the manufacturing apparatus, and the image display device of the image display device having the stop portion can be applied.

Hereinafter, the present invention will be specifically described using examples. (Example 1)
The present invention will be described with reference to FIGS. 4 to 5, 8, 14, and 15.
A container made of a soda glass substrate (SL; manufactured by Nippon Sheet Glass Co., Ltd., thermal expansion coefficient: 86 × 10 −7 (1 / ° C.)) having a thickness of 2.8 mm was prepared.

  Next, as shown in FIG. 5, a copper exhaust pipe having a thickness of 1 mm, an outer diameter of 10 mm (inner diameter of 8 mm) and a length of 100 mm is used as the metal tubular exhaust pipe 500, and the central portion of the metal tubular exhaust pipe 500 is The metal exhaust pipe sealing part 501 was formed by grinding with a lathe device to a thickness of 0.5 mm and a length of 20 mm.

  Next, the entire copper exhaust pipe was placed in a plating bath, and Ni metal was formed to a thickness of 75 μm by electrolytic plating.

  Next, FN50 (thermal expansion coefficient: 94 × 10 −7 (1 / ° C.) which is an alloy of iron and nickel having an outer diameter of 10 mm, an inner diameter of 6 mm, and a length of 20 mm is combined with the copper exhaust pipe as the connecting member 503. 5 is processed into a cylindrical shape so that the structure shown in FIG. 5 can be maintained, and further, a metal brazing member is used as a sealing member of the metal exhaust pipe sealing portion and a sealant adhesive 502, and the metal tubular exhaust pipe 500 is sealed. Further, as shown in Fig. 8, a silver brazing member 506 is used on the exhaust system mechanism 703 side of the metal tubular exhaust pipe 500, and a connecting member 505 is connected to connect to the soda glass substrate. A tube was made.

  In order to connect to the soda glass substrate 801 with respect to the exhaust pipe prepared and produced in this way, frit glass 603 (manufactured by Nippon Electric Glass Co., Ltd. LS-3081 thermal expansion coefficient: 74 × 10 −7 (1 / ° C.) )) And fixedly connected by heating at 410 ° C. for 20 minutes. The distance from the end surface of the glass substrate to the end of the exhaust pipe connecting member 503 was about 135 mm.

  No cracks or cracks occurred in the glass substrate produced as described above. This container is fixed to the base (not shown) of the exhaust system device.

  After that, as shown in FIG. 8, the connection member 505 of the metal tubular exhaust pipe 500 and the connection part 702 on the exhaust system mechanism side were hermetically connected using the same frit glass 701 as described above.

  Although not shown, the exhaust system device includes a vacuum gauge (commonly referred to as a BA gauge) used for observing pressure after the exhaust pipe connecting portion 702, observation of gas species in the exhaust, or leakage in the connecting portion. Quadrupole mass spectrometer (commonly known as Q-mass) used for checking, etc., and pressure gauge (vacuum gauge) required for measuring gas discharge by differential pressure flow method (commonly known as orifice method or throughput method), etc. Is arranged.

As described above, the pressure becomes 1.33 × 10 ⁻³ Pa or less by an external exhaust system device (not shown) such as a vacuum pump through the copper exhaust pipe set on the stand (not shown) of the exhaust system device. Was exhausted. After that, a leak check was performed, but there was no leak.

  Next, the container was heated at 250 ° C. for 8 hours to degas the constituent members. In order to maintain the extremely low pressure below the atmospheric pressure and the release of water and other gases adhering (adsorbed) to the surface of internal components, heating the sealed container after connecting it to the exhaust system It is valid.

  The atmosphere information inside the exhaust pipe after heat degassing is for the vacuum gauge and Q-mass (quadrupole mass spectrometer) attached after the connection part on the exhaust system side, and for the emission gas observation just after sealing Observations were made from the pressure gauge (vacuum gauge) required for the orifice method.

  After waiting until the temperature of the container returns to room temperature and the atmosphere is stabilized, the pipe exhaust pipe (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. is placed at the center of the copper exhaust pipe (position about 67.5mm from the glass substrate). Was used to crimp and seal the copper exhaust pipe. The copper exhaust pipe was easily disconnected from the exhaust system side at the same time that the shut-off device was operated.

  In addition, when the outer diameter of the copper exhaust pipe becomes larger, it is possible to use a pipe closing device ALM-10-2B manufactured by Sumiden Asahi Seiko Co., Ltd.

  When the copper exhaust pipe was observed from the surface of the glass substrate, it was observed that there was no foreign matter inside the copper exhaust pipe as shown in FIG.

  FIG. 14 shows the change in the amount of released gas immediately after sealing in this example. Note that “total amount of released gas in sealing” described in FIG. 14 is a value of an integrated amount of released gas from immediately after sealing to 1000 seconds later.

(Reference Example 1)
Instead of the exhaust pipe configuration having the copper exhaust pipe sealing portion used in Example 1, a soda glass exhaust pipe (L29F) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 120 mm as a glass exhaust pipe as shown in FIG. ; Made by Nippon Electric Glass) and a container in which a heating and sealing jig for heating and melting the glass exhaust pipe was used in advance, the same treatment as in Example 1 was performed, and the heat degassing was performed. It was.

  Then, after the temperature of the container returns to room temperature and waits until the atmosphere is stabilized, the glass exhaust pipe is softened and melted using a heat sealing jig, and the connection part 702 on the exhaust system mechanism side is further connected in the tube axis direction. The softened and melted glass portion was stretched by moving to the exhaust system mechanism 703 side.

  Subsequently, the stretched and deformed portion was melted using a hand gas burner to complete the sealing.

  In addition, the mechanism for extending | stretching the glass exhaust pipe to the exhaust apparatus side of a pipe axial direction in the state which heated, softened and fuse | melted is not shown in FIG.

FIG. 14 shows the change in the amount of released gas immediately after sealing in this reference example.
As is clear from the change in released gas immediately after sealing in Example 1 and Reference Example 1, it can be seen that when a metal sealing portion is sealed, the increase in released gas, that is, the change in pressure is very small.

  It has also been found that the gas species released from the sealing process by heating and melting the glass exhaust pipe contain the most structural water contained in the glass.

  Similarly, when a sealed container as an image display device is manufactured by a manufacturing method using sealing by heating and melting a glass exhaust pipe, the discharged structural water may adversely affect the electron source that emits electrons. Is obvious.

  The only way to prevent this is to install a mechanism / member that quickly adsorbs the released gas at the time of sealing, or leave it until the getter member installed in the sealed container sufficiently adsorbs and exhausts the released gas. Obviously, the structure inside the sealed container is complicated, and it becomes an obstacle to shortening the production tact.

(Reference Example 2)
A container was produced in exactly the same manner as in Example 1 except that the sealing part of the copper exhaust pipe was not ground with a lathe device.
The center of the copper exhaust pipe (position about 65 mm from the glass substrate) was sealed by crimping the copper exhaust pipe using a pipe cutoff device (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. The copper exhaust pipe was fully pressed and kept in vacuum simultaneously with the operation of the cutoff device, but was not disconnected from the exhaust system side.

  Since the crimp sealing part was not completely separated, it was necessary to separate it separately using metal scissors.

(Reference Example 3)
A container was produced in exactly the same manner as in Example 1 except that the copper exhaust pipe was not plated with Ni metal.
The change in the amount of released gas after sealing was as good as in Example 1.

Next, when the copper exhaust pipe was viewed from the surface of the glass substrate, it was observed that many foreign substances were present inside the copper exhaust pipe as shown in FIG.
When the exhaust pipe was peeled off from the glass substrate and the foreign matter inside the copper exhaust pipe was analyzed, it was found to be a copper oxide.

(Reference Example 4)
Except for not using the connection member 503 in Example 1, the container was produced in the same manner as in the case where the soda glass substrate was cracked when the exhaust pipe was heated and connected with frit glass. there were.

  As is clear from the results of Example 1 and Reference Examples 1 to 4, the sealing process using the exhaust pipe having the metal exhaust pipe sealing part is compared with the glass exhaust pipe sealing process. The amount of outgassing is clearly less.

  Further, since the metal exhaust pipe sealing portion is thinner than the others, it can be easily crimped and sealed while maintaining the strength of the exhaust pipe, and the sealing yield is high.

  Furthermore, by pre-plating the metal exhaust pipe, it is possible to prevent the generation of metal oxide, and there is no foreign matter mixed in the exhaust pipe.

  Furthermore, by using a connection member that takes into account the thermal expansion coefficient for the sealed container, cracks do not occur in the glass substrate when the exhaust pipe is connected, so the yield of exhaust pipe connection is high.

(Example 2)
A method for manufacturing the sealed container 112 as an image display device will be described with reference to FIGS.
The rear plate 101 has a thickness of 2.8 mm, a size of 240 mm × 320 mm, and the face plate 105 has a thickness of 2.8 mm, a size of 190 mm × 270 mm, soda glass (SL; thermal expansion coefficient of Japanese plate glass: 86 × 10 ⁻⁷ (1 / ° C)).

The rear plate 101 has one hole for an exhaust pipe having a hole diameter of Φ6.0 mm.
The element electrode 104 of the surface conduction electron-emitting device 102 which is an electron source is formed by depositing platinum by a vapor deposition method and processing it by a photolithography technique (including processing techniques such as etching and lift-off methods). It processed into the shape of the space | interval L = 2micrometer and element electrode length W = 300micrometer.

  After applying an organic palladium solution (CCP-4230, manufactured by Okuno Pharmaceutical Co., Ltd.) containing an organometallic solution as the conductive thin film 207, heat treatment is performed at 300 ° C. for 10 minutes to form fine particles containing palladium as a main component. A fine particle film having an average particle size of 8 nm was formed and processed by a photolithography technique (including processing techniques such as etching and lift-off) to obtain a conductive thin film 207 of 200 × 100 μm.

Next, the width of the upper wiring 202 (100 lines) is 500 μm, the thickness is 12 μm, the width of the lower wiring 201 (200 lines) 204 (20000 pieces) is 300 μm, and the thickness is 8 μm. It was formed by printing and baking.

  The interlayer insulating layer 203 was printed and baked (baking temperature 550 ° C.) with a glass paste, and the thickness was 20 μm.

On the other hand, a green phosphor (P22GN4, manufactured by Kasei Optonix Co., Ltd.) is applied to the face plate 105 as the phosphor 107, and aluminum having a thickness of 200 nm is used as the metal back 106 using polymer filming. Made.

  The outer frame 109 has a thickness of 6 mm, an outer shape of 150 mm × 230 mm, a width of 10 mm, and is made of soda glass (SL; Japanese plate glass, thermal expansion coefficient: 86 × 10 −7 (1 / ° C.)). A barium getter was attached.

  LS-3081 manufactured by Nippon Electric Glass Co., Ltd. is used as a frit glass 108 sandwiched between the rear plate 101 and the face plate 105 and applied to the face plate 101 and a portion where the rear plate 105 and the outer frame 109 are in contact with each other. (Coefficient of thermal expansion: 74 × 10 −7 (1 / ° C.)) and heated and fixed at 410 ° C. for 20 minutes.

  Next, as a metal tubular exhaust pipe 500 having a metal exhaust pipe sealing portion 501 shown in FIG. 5 as an exhaust pipe, a copper exhaust pipe having a thickness of 1 mm, an outer diameter of 10 mm (inner diameter of 8 mm) and a length of 100 mm is used. The center portion of the metal tubular exhaust pipe 500 was ground to a thickness of 0.5 mm and a length of 20 mm by a lathe device to form a metal exhaust pipe sealing portion 501.

  Next, the entire copper exhaust pipe was placed in a plating bath, and Ni metal was formed to a thickness of 75 μm by electrolytic plating.

  Next, FN50 (thermal expansion coefficient: 94 × 10 −7 (1 / ° C.) which is an alloy of iron and nickel having an outer diameter of 10 mm, an inner diameter of 6 mm, and a length of 20 mm is combined with the copper exhaust pipe as the connecting member 503. Then, a silver brazing member was used as the sealing adhesive 502, and the exhaust pipe connected to the soda glass substrate was manufactured while ensuring sealing performance.

  The frit glass described above is used as a tubular exhaust pipe (sealed container side connecting member 505) from the sealed container side as shown in FIG. And fixedly connected by heating at 410 ° C. for 20 minutes. The distance from the rear plate rear surface to the end of the copper exhaust pipe 500 of the exhaust pipe was 115 mm.

  The sealed container produced as described above had no cracks or cracks. This sealed container is fixed to the base (not shown) of the exhaust system device.

  Thereafter, as shown in FIG. 6, the end portion of the copper exhaust pipe was connected to the exhaust device side connection portion 601 using an O-ring.

  As described above in the first embodiment, the exhaust system device includes a vacuum gauge (commonly referred to as a BA gauge) that is used for observation of pressure after the exhaust pipe connection portion, observation of gas species in the exhaust, or a connection portion. Pressure gauge (vacuum gauge) required for measuring the amount of gas released by the quadrupole mass spectrometer (commonly known as Q-mass) used for leak checks and the differential pressure flow method (commonly known as the orifice method or throughput method) ) Etc. are arranged.

As described above, the inside of the sealed container set on the stand (not shown) of the exhaust system apparatus passes through the exhaust pipe 111, that is, in the present invention, the external vacuum exhaust system (not shown) through the exhaust pipe having the copper exhaust pipe sealing portion. The gas was exhausted until the pressure became 1.33 × 10 ⁻³ Pa or less. After that, a leak check was performed, but there was no leak.

  For forming, a voltage pulse having a triangular waveform (base 1 msec, period 10 msec, peak value 5 V) was applied for 60 seconds to form an electron emission portion 208, and activation was also performed.

Next, the entire sealed container was heated at 250 ° C. for 8 hours to degas the constituent members.
In order to maintain the ultra-low pressure below the atmospheric pressure and release of water and other gases adhering (adsorbed) to the surface of the components inside the sealed container, the sealed container is heated after being connected to the exhaust device. It is effective.

Next, getter processing was performed in which the getter member 110 was heated at high frequency from the outside to form a getter material vapor deposition film containing Ba as a main component.
The pressure and atmosphere information inside the sealed container after heat degassing and getter treatment were monitored with a vacuum gauge and Q-mass (quadrupole mass spectrometer).

  After the sealed container had returned to room temperature, the metal exhaust pipe sealing planned part was crimped and sealed using the Sumiden Asahi Seiko Co., Ltd. pipe cutoff device (ALM-10M). . The pressure sealed part was completely cut off to produce an image display device.

  Since there is no change in the getter member vapor deposition film, it can be seen that there is no generation of gas species that change the vapor deposition film of the getter member and that the pressure in the sealed container is maintained.

If the outer diameter of the metal exhaust pipe becomes large, it is possible to use the pipe closing device ALM-10-2B manufactured by Sumiden Asahi Seiko Co., Ltd.

  Using the image display device in which the metallic exhaust pipe sealing portion is sealed by the above-described method, the image display device is connected to the image display means as shown in FIG. 3, and the image signal is supplied to the electron-emitting device. When 5 kV was applied to the back 106 to emit light and the display operation was confirmed, it was confirmed that a bright and uniform image display was obtained, and that the image display device could be manufactured by the method for manufacturing an image display device of the present invention.

(Reference Example 5)
Instead of the exhaust pipe configuration having the metal exhaust pipe sealing portion used in Example 2, the soda glass exhaust pipe (L29F; NEC Electric Glass) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 120 mm as shown in FIG. And a glass exhaust pipe sealing jig were used, and heat degassing and getter treatment were performed in the same manner as in Example 2.

  After that, using a heat sealing jig in the same manner as in Reference Example 1, after softening and melting the glass exhaust pipe, the exhaust pipe connecting portion is moved to the exhaust device side in the tube axis direction to soften and melt. After the stretched glass part was stretched, the stretched and deformed part was melted using a hand gas burner to complete the sealing.

  When the deposited film on the getter member was observed after the sealing was completed, it was observed that the deposited film near the exhaust pipe was slightly retracted.

  This was presumed to be due to the effect of the gas species released when the glass exhaust pipe was heated and melted and sealed.

  When the display operation of the image display device thus manufactured was checked by the same method as in Example 2, the display screen as a whole was slightly darker than that of the image display device manufactured in Example 2.

  Further, when a life test was performed in order to compare the reliability with the image display device manufactured in Example 2, the life was only about half, and the influence of the gas type released when the glass exhaust pipe was heated and sealed. Guessed.

(Reference Example 6)
An image display device was produced in exactly the same manner as in Example 2 except that the sealing portion of the copper exhaust pipe was not ground with a lathe device.

  The center of the copper exhaust pipe (position 75 mm from the glass substrate) was sealed by crimping the copper exhaust pipe using a pipe cutoff device (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. The copper exhaust pipe was sufficiently pressed and kept in vacuum simultaneously with the operation of the shut-off device, but was not separated from the exhaust system device side, so it was necessary to separate it from the exhaust-type device using metal scissors.

(Reference Example 7)
An image display device was fabricated in exactly the same manner as in Example 2, except that the inner surface of the copper exhaust pipe was not plated with Ni metal.
When this image display device was disassembled and examined, many foreign substances as shown in FIG. 15 adhered to the inside of the face plate and the rear plate, and it was found that it was copper oxide when analyzed.

  By heating when connecting the copper exhaust pipe to the sealed container, copper oxide is formed on the copper surface, and when it is crimped and sealed to the copper exhaust pipe, it is assumed that it peeled off and scattered in the panel .

(Reference Example 8)
Except for not using the connection member 503 in Example 2, some of the containers manufactured may cause cracks in the rear plate 101 when the exhaust pipe is heated and connected with frit glass. It was.

  As apparent from the results of Example 2 and Reference Examples 5 to 8, the image display device was manufactured using an exhaust pipe having a metal exhaust pipe sealing portion as compared with the glass exhaust pipe sealing treatment. The method improves the reliability of the sealing process and the reliability of the image display device manufacturing method.

  Further, since the metal exhaust pipe sealing portion is thinner than the others, it can be easily crimped and sealed while maintaining the strength of the exhaust pipe, and the manufacturing yield of the image display device is remarkably improved.

  Furthermore, by pre-plating the metal exhaust pipe, generation of metal oxide can be prevented, and the image quality of the image display device is improved.

  Furthermore, by using a connecting member that takes into account the thermal expansion coefficient for the sealed container, cracks do not occur in the sealed container when the exhaust pipe is connected, so that the manufacturing yield of the image display device is significantly improved.

(Example 3)
In Example 2, the connecting member 505 made of FN50 shown in FIG. 7 is used with a silver brazing member 506, and the copper exhaust pipe connected while ensuring the sealing property is further connected. Further, the connecting member 505 is connected to the exhaust system mechanism side. An image display device was produced in exactly the same manner except that the connection portion 702 was connected and exhausted using the low melting point glass 701.

  As in Example 2, the image display means as shown in FIG. 3 was connected, an image signal was supplied to the electron-emitting device, and simultaneously 5 KV was applied to the phosphor 107 and the metal back 106 to emit light, and the display operation was confirmed. However, it was confirmed that a bright and uniform image display was obtained, and that the image display device could be manufactured by the method for manufacturing an image display device of the present invention.

(Example 4)
Another embodiment of the present invention will be described with reference to FIGS. 4, 9, 12, 14, and 15.

  A container made of a soda glass substrate 801 (SL; manufactured by Nippon Sheet Glass Co., Ltd., thermal expansion coefficient: 86 × 10 −7 (1 / ° C.)) was prepared.

As shown in FIG. 12, a soda glass glass exhaust pipe (manufactured by Nippon Sheet Glass Co., Ltd .; L29F coefficient of thermal expansion: 92 × 10 −7 (1 / ° C.)) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 30 mm In order to connect as a tubular exhaust pipe (sealed container side connecting member 901) from the glass substrate 801 side, the above glass exhaust pipe is connected to the frit glass 603 (LS-3081 manufactured by Nippon Electric Glass Co., Ltd.): 74 × 10 ^-7 (1 / ° C)) was baked at 410 ° C for 20 minutes and connected to the glass substrate 801.

  Next, as shown in FIG. 9, a copper exhaust pipe having a thickness of 1 mm, an outer diameter of 10 mm (inner diameter of 8 mm) and a length of 80 mm is used as the metal tubular exhaust pipe 500, and the central portion of the metal tubular exhaust pipe 500 is The metal exhaust pipe sealing part 501 was formed by grinding with a lathe device to a thickness of 0.5 mm and a length of 20 mm.

  Next, the entire copper exhaust pipe was placed in a plating bath, and Ni metal was formed to a thickness of 75 μm by electrolytic plating.

Next, FN50 (thermal expansion coefficient: 94 × 10 ⁻⁷ (1 / ° C.), which is an alloy of iron and nickel having an outer diameter of 10 mm, an inner diameter of 6 mm, and a length of 20 mm, is combined with the copper exhaust pipe for the connecting member 503. 9 is processed into a cylindrical shape so that the configuration shown in FIG. 9 can be maintained, and a silver brazing member is used as the sealing adhesive 502 and connected to the sealing container connecting side of the metal tubular exhaust pipe 500 while ensuring sealing performance. .

  Next, as shown in FIG. 12, the connection member 505 was similarly connected to the exhaust system mechanism 703 side of the metal tubular exhaust pipe 500 using a silver brazing member as the sealing adhesive 506 while ensuring the sealing performance.

Thereafter, a glass exhaust pipe 1101 made of soda glass having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 30 mm (made by Nippon Sheet Glass Co., Ltd .; L29F coefficient of thermal expansion: 92 × 10 ⁻⁷ ) is connected to the connection member 505 on the exhaust system mechanism side. (1 / ° C.) was used as the low-melting glass 1102, and the above-mentioned frit glass was melt-coated using a hand gas burner or the like and hermetically connected.

  In order to connect the prepared and produced exhaust pipe to the sealed container side connection member 901 on the soda glass substrate 801 side, the frit glass 902 (manufactured by Nippon Electric Glass Co., Ltd. LS-3081 thermal expansion coefficient: 74 × 10 −7 (1 / ° C.)) and fixedly connected by heating at 410 ° C. for 20 minutes. The distance from the end surface of the glass substrate to the end of the exhaust pipe connecting member 503 was 170 mm.

The container produced as described above is fixed to the base (not shown) of the exhaust system device.
After that, as shown in FIG. 12, the exhaust system side connection member 1101 of the metal tubular exhaust pipe 500 and the exhaust system mechanism side connection portion 702 were hermetically connected using the same frit glass 701 as described above.

  Although not shown, the exhaust system device includes a vacuum gauge (commonly referred to as a BA gauge) used for observing pressure after the exhaust pipe connecting portion 702, observation of gas species in the exhaust, or leakage in the connecting portion. Pressure gauge (vacuum gauge) required for measuring the amount of gas released by the quadrupole mass spectrometer (commonly known as Q-mass) used for checks and the differential pressure flow method (commonly known as the orifice method or throughput method) Etc. are arranged.

As described above, the pressure becomes 1.33 × 10 ⁻³ Pa or less by an external exhaust system device (not shown) such as a vacuum pump through the copper exhaust pipe set on the stand (not shown) of the exhaust system device. Was exhausted. After that, a leak check was performed, but there was no leak.

Next, the whole sample for examination of sealing was heated at 250 ° C. for 8 hours to degas the constituent members.
In order to maintain the extremely low pressure below the atmospheric pressure and the release of gas such as water adhering (adsorbing) to the surface of internal components, heating the sealed container after connecting it to the exhaust system It is valid.

  The atmosphere information inside the exhaust pipe after heat degassing is for the vacuum gauge and Q-mass (quadrupole mass spectrometer) attached after the connection part on the exhaust system side, and for the emission gas observation just after sealing Observations were made from the pressure gauge (vacuum gauge) required for the orifice method.

  After waiting until the temperature of the container returns to room temperature and the atmosphere is stabilized, the center part of the copper exhaust pipe (position 85 mm from the glass substrate) is used with a pipe cutoff device (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. The copper exhaust pipe was crimped and sealed. The copper exhaust pipe was disconnected from the exhaust system side at the same time as the cutoff device was operated.

  In addition, when the outer diameter of the copper exhaust pipe becomes larger, it is possible to use a pipe closing device ALM-10-2B manufactured by Sumiden Asahi Seiko Co., Ltd.

  FIG. 14 shows the change in the amount of released gas immediately after sealing in this example. Note that “total amount of released gas in sealing” described in FIG. 14 is a value of an integrated amount of released gas from immediately after sealing to 1000 seconds later.

  When the copper exhaust pipe was observed from the surface of the glass substrate of the container, as shown in FIG. 15, it was observed that there was no foreign matter inside the copper exhaust pipe and it was clean.

  The pressure of the exhaust device was observed for several days thereafter, but the pressure was stable, and no signs of the occurrence of vacuum leak from the sealed portion could be seen.

(Reference Example 9)
Instead of the exhaust pipe configuration having the copper exhaust pipe sealing portion used in Example 4, a soda glass exhaust pipe (L29F) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 120 mm as a glass exhaust pipe as shown in FIG. ; Made by Nippon Electric Glass) and a container in which a heating and sealing jig for heating and melting the glass exhaust pipe was used in advance, the same treatment as in Example 1 was performed, and the heat degassing was performed. It was.

  Then, after the temperature of the container returns to room temperature and waits until the atmosphere is stabilized, the glass exhaust pipe is softened and melted using a heat sealing jig, and the connection part 702 on the exhaust system mechanism side is further connected in the tube axis direction. The softened and melted glass portion was stretched by moving to the exhaust system mechanism 703 side.

  Subsequently, the stretched and deformed portion was melted using a hand gas burner to complete the sealing.

  In addition, the mechanism for extending | stretching the glass exhaust pipe to the exhaust apparatus side of a pipe axial direction in the state which heated, softened and fuse | melted is not shown in FIG.

FIG. 14 shows the change in the amount of released gas immediately after sealing in this reference example.
As is clear from the change in released gas immediately after sealing in Example 4 and Reference Example 9, it can be seen that when the metal sealing portion is sealed, the increase in released gas, that is, the change in pressure is very small.

  It has also been found that the gas species released from the sealing process by heating and melting the glass exhaust pipe contain the most structural water contained in the glass.

  Similarly, when a sealed container as an image display device is manufactured by a manufacturing method using sealing by heating and melting a glass exhaust pipe, the discharged structural water may adversely affect the electron source that emits electrons. Is obvious.

  The only way to prevent this is to install a mechanism / member that quickly adsorbs the released gas at the time of sealing, or leave it until the getter member installed in the sealed container sufficiently adsorbs and exhausts the released gas. Obviously, the structure inside the sealed container is complicated, and it becomes an obstacle to shortening the production tact.

(Reference Example 10)
A container was produced in exactly the same manner as in Example 4 except that the sealing part of the copper exhaust pipe was not ground with a lathe device.
The copper exhaust pipe was crimped and sealed at the center of the copper exhaust pipe (position 70 mm from the glass substrate) using a pipe cutoff device (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. The copper exhaust pipe was fully pressed and kept in vacuum simultaneously with the operation of the cutoff device, but was not disconnected from the exhaust system side.

  Since the crimp sealing part was not completely separated, it was necessary to separate it from the exhaust system using metal scissors.

(Reference Example 11)
A container was produced in exactly the same manner as in Example 4 except that the inner surface of the copper exhaust pipe was not plated with Ni metal.
The change in the amount of released gas after sealing was as good as in Example 1.

Next, when the copper exhaust pipe was viewed from the glass substrate surface, it was observed that a large number of foreign matters were present inside the copper exhaust pipe as shown in FIG.
When the exhaust pipe was peeled off from the glass substrate and the foreign matter inside the copper exhaust pipe was analyzed, it was found to be a copper oxide.

(Reference Example 12)
Except for not using the connecting member 503 in Example 4, some of the containers manufactured may cause cracks in the soda glass substrate when the exhaust pipe is heated and connected with frit glass. It was.

(Example 5)
A method for manufacturing the sealed container 112 as an image display device will be described with reference to FIGS. 1 to 4 and FIGS. 9 to 10.
The rear plate 101 has a thickness of 2.8 mm, a size of 240 mm × 320 mm, and the face plate 105 has a thickness of 2.8 mm, a size of 190 mm × 270 mm, soda glass (SL; Japanese plate glass thermal expansion coefficient: 86 × 10 −7 (1 / ° C)).

The rear plate 101 has one hole for an exhaust pipe having a hole diameter of Φ6.0 mm.
The device electrode 104 of the surface conduction electron-emitting device 102 which is an electron source is formed by depositing platinum by a vapor deposition method and processing it by a photolithography technique (including processing techniques such as etching and lift-off methods). It processed into the shape of the space | interval L = 2micrometer and element electrode length W = 300micrometer.

  After applying an organic palladium solution (CCP-4230, manufactured by Okuno Pharmaceutical Co., Ltd.) containing an organometallic solution as the conductive thin film 207, heat treatment is performed at 300 ° C. for 10 minutes to form fine particles containing palladium as a main component. A fine particle film having an average particle diameter of 8 nm was formed and processed by a photolithography technique (including processing techniques such as etching and lift-off) to obtain a conductive thin film 207 of 200 × 100 μm.

Next, the width of the upper wiring 202 (100 lines) is 500 μm, the thickness is 12 μm, the width of the lower wiring 201 (200 lines) 204 (20,000) is 300 μm, and the thickness is 8 μm. It was formed by printing and baking.

  The interlayer insulating layer 203 was printed and baked (baking temperature 550 ° C.) with a glass paste, and the thickness was 20 μm.

On the other hand, a green phosphor (P22GN4, manufactured by Kasei Optonix Co., Ltd.) is applied to the face plate 105 as the phosphor 107, and aluminum having a thickness of 200 nm is used as the metal back 106 using polymer filming. Made.

The outer frame 109 has a thickness of 6 mm, an outer shape of 150 mm × 230 mm, a width of 10 mm, and is made of soda glass (SL; thermal expansion coefficient of Japanese plate glass: 86 × 10 ⁻⁷ (1 / ° C.)). A barium getter was attached.

The outer frame 109 is sandwiched between the rear plate 101 and the face plate 105, and LS-3081 manufactured by Nippon Electric Glass Co., Ltd. is used as the frit glass 108 applied to the face plate 101 and the portion where the rear plate 105 and the outer frame 109 are in contact. (Coefficient of thermal expansion: 74 × 10 ⁻⁷ (1 / ° C.)), and fixed by heating at 410 ° C. for 20 minutes.

At the same time, a soda glass exhaust pipe (manufactured by Nippon Sheet Glass Co., Ltd .; L29F coefficient of thermal expansion: 92 × 10 ⁻⁷ (1 / ° C.)) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 30 mm is shown in FIG. In order to connect as a tubular exhaust pipe (sealed container side connecting member 901) from the sealed container 601 side, the above glass exhaust pipe is connected to frit glass 603 (manufactured by Nippon Electric Glass Co., Ltd. LS-3081). Connection was made using a coefficient: 74 × 10 ⁻⁷ (1 / ° C.).

  Next, as a metal tubular exhaust pipe 500 having a metal exhaust pipe sealing portion 501 shown in FIG. 9 as an exhaust pipe, a copper exhaust pipe having a thickness of 1 mm, an outer diameter of 10 mm (inner diameter of 8 mm) and a length of 80 mm is used. The center portion of the metal tubular exhaust pipe 500 was ground by a lathe device to a thickness of 0.5 mm and a length of 20 mm to form a metal exhaust pipe sealing portion 501.

  Next, the entire copper exhaust pipe was placed in a plating bath, and Ni metal was formed to a thickness of 75 μm by electrolytic plating.

  Next, FN50 (thermal expansion coefficient: 94 × 10 −7 (1 / ° C.) which is an alloy of iron and nickel having an outer diameter of 10 mm, an inner diameter of 6 mm, and a length of 20 mm is combined with the copper exhaust pipe as the connecting member 503. Then, a silver brazing member was used as the sealing adhesive 502, and the exhaust pipe connected to the soda glass substrate was manufactured while ensuring sealing performance.

  The exhaust pipe prepared and manufactured in this way was 115 mm from the rear plate rear surface to the end of the copper exhaust pipe 500 of the exhaust pipe.

  The sealed container produced as described above had no cracks or cracks. This sealed container is fixed to the base (not shown) of the exhaust system device.

  Thereafter, as shown in FIG. 10, the end portion of the copper exhaust pipe was connected to the exhaust pipe connecting portion 604 using an O-ring.

  As described above in the fourth embodiment, the exhaust system device includes a vacuum gauge (commonly referred to as a BA gauge) used for observing the pressure after the exhaust pipe connecting portion, observation of gas species in the exhaust, or a connecting portion. Pressure gauge (vacuum) required for measuring the amount of gas released by the quadrupole mass spectrometer (commonly known as Q-mass) and the differential pressure flow method (commonly known as the orifice method or throughput method) Etc.) are arranged.

As described above, the inside of the sealed container set on the stand (not shown) of the exhaust system apparatus passes through the exhaust pipe 111, that is, in the present invention, the external vacuum exhaust system (not shown) through the exhaust pipe having the copper exhaust pipe sealing portion. The gas was exhausted until the pressure became 1.33 × 10 ⁻³ Pa or less. After that, a leak check was performed, but there was no leak.

  For forming, a voltage pulse having a triangular waveform (base 1 msec, period 10 msec, peak value 5 V) was applied for 60 seconds to form an electron emission portion 208, and activation was also performed.

Next, the entire sealed container was heated at 250 ° C. for 8 hours to degas the constituent members.
In order to maintain the ultra-low pressure below the atmospheric pressure and release of water and other gases adhering (adsorbed) to the surface of the components inside the sealed container, the sealed container is heated after being connected to the exhaust device. It is effective.

Next, getter processing was performed in which the getter member 110 was heated at high frequency from the outside to form a getter material vapor deposition film containing Ba as a main component.
The pressure and atmosphere information inside the sealed container after heat degassing and getter treatment were monitored with a vacuum gauge and Q-mass (quadrupole mass spectrometer).

  After the sealed container had returned to room temperature, the metal exhaust pipe sealing planned part was crimped and sealed using the Sumiden Asahi Seiko Co., Ltd. pipe cutoff device (ALM-10M). .

The pressure sealed part was completely cut off to produce an image display device.
Since there is no change in the getter member vapor deposition film, it can be seen that there is no generation of gas species that change the vapor deposition film of the getter member and that the pressure in the sealed container is maintained.

If the outer diameter of the metal exhaust pipe becomes large, it is possible to use the pipe closing device ALM-10-2B manufactured by Sumiden Asahi Seiko Co., Ltd.

  Using the image display device in which the metallic exhaust pipe sealing portion is sealed by the above-described method, the image display device is connected to the image display means as shown in FIG. 3, and the image signal is supplied to the electron-emitting device. When 5 kV was applied to the back 106 to emit light and the display operation was confirmed, it was confirmed that a bright and uniform image display was obtained, and that the image display device could be manufactured by the method for manufacturing an image display device of the present invention.

(Reference Example 13)
Instead of the exhaust pipe configuration having the metal exhaust pipe sealing portion used in Example 5, the soda glass exhaust pipe (L29F; Nippon Electric Glass) having an outer diameter of 10 mm, an inner diameter of 8 mm, and a length of 120 mm as shown in FIG. And a glass exhaust pipe sealing jig were used, and heat degassing and getter treatment were performed in the same manner as in Example 4.

  Then, in the same manner as in Reference Example 9, after using a heat sealing jig to soften and melt the glass exhaust pipe, the exhaust pipe connecting part is moved to the exhaust device side in the tube axis direction to soften and melt. After the stretched glass part was stretched, the stretched and deformed part was melted using a hand gas burner to complete the sealing.

  When the deposited film on the getter member was observed after the sealing was completed, it was observed that the deposited film near the exhaust pipe was slightly retracted. This was presumed to be due to the effect of the gas species released when the glass exhaust pipe was heated and melted and sealed.

  When the display operation of the image display device manufactured in this way was confirmed by the same method as in Example 4, the display screen was generally darker than that of the image display device manufactured in Example 5, especially around the exhaust pipe. Was extremely dark.

(Reference Example 14)
An image display device was produced in exactly the same manner as in Example 5 except that the sealing portion of the copper exhaust pipe was not ground with a lathe device.
The copper exhaust pipe was crimped and sealed at the center of the copper exhaust pipe (position 75 mm from the glass substrate) using a pipe cutoff device (ALM-10M) manufactured by Sumiden Asahi Seiko Co., Ltd. The copper exhaust pipe was fully pressed and kept in vacuum simultaneously with the operation of the cutoff device, but was not disconnected from the exhaust system side.

  Since the crimp sealing part was not completely separated, it was necessary to separate it from the exhaust system using metal scissors.

(Reference Example 15)
An image display device was fabricated in exactly the same manner as in Example 5 except that the inner surface of the copper exhaust pipe was not plated with Ni metal.

  When this image display device was disassembled and examined, many foreign substances as shown in FIG. 15 adhered to the inside of the face plate and the rear plate, and it was found that it was copper oxide when analyzed.

  By heating when connecting the copper exhaust pipe to the sealed container, copper oxide is formed on the copper surface, and when it is crimped and sealed to the copper exhaust pipe, it is assumed that it peeled off and scattered in the panel .

(Reference Example 16)
Except for not using the connecting member 503 and the sealed container side connecting member 901 in Example 5, some of the containers manufactured were connected to the rear plate 101 when the exhaust pipe was heated and connected with frit glass. Some cracks were generated.

  As apparent from the results of Example 5 and Reference Examples 13 to 16, the image display device was manufactured using an exhaust pipe having a metal exhaust pipe sealing portion as compared with the glass exhaust pipe sealing treatment. The method can improve the reliability of the sealing process and the reliability of the image display device manufacturing method.

  Further, since the metal exhaust pipe sealing portion is thinner than the others, it can be easily crimped and sealed while maintaining the strength of the exhaust pipe, and the manufacturing yield of the image display device is remarkably improved.

  Furthermore, by pre-plating the inside of the metal exhaust pipe, generation of metal oxide can be prevented, and the image quality of the image display device is improved.

  Furthermore, by using a connecting member that takes into account the thermal expansion coefficient for the sealed container, cracks do not occur in the sealed container when the exhaust pipe is connected, so that the manufacturing yield of the image display device is significantly improved.

(Example 6)
In Example 5, the connecting member 505 made of FN 50 shown in FIG. 11 is connected using the silver brazing member 506 while ensuring the sealing property, and the exhaust system side connecting member 1101 is used as the frit glass 1102. An image display device was manufactured in the same manner as in the above except that the exhaust pipe side connecting member 1101 was exhausted by connecting the exhaust pipe side connecting member 1101 to the exhaust system mechanism side connection portion 702 using the low melting point glass 701.

  As in Example 5, the image display means as shown in FIG. 3 was connected to supply an image signal to the electron-emitting device, and at the same time, 5 KV was applied to the phosphor 107 and the metal back 106 to emit light, and the display operation was confirmed. However, it was confirmed that a bright and uniform image display was obtained, and that the image display device could be manufactured by the method for manufacturing an image display device of the present invention.

(Example 7)
Except for producing a container for connecting a metal exhaust pipe in combination with a glass substrate having the following thermal expansion coefficient instead of the glass substrate 801 used in Example 1, the same method as in Example 1 was used. The container was prepared by the above, and the connection to the connection part of the exhaust system device and the exhaust were performed.

  When the glass substrate 801 and the connection member 503 are connected by the low melting point glass (frit glass) 603, the adhesion state of the connection part is important, and peeling between the connection member and the frit glass at the time of connection and after connection, We examined the occurrence of microfractures (cracks / cracks) on the glass substrate side at the connection end, microfractures (cracks / cracks) after exhausting the connection to the exhaust system, and occurrence of delamination.

○ ・ ・ ・ No abnormality occurred.
Δ: Peeling / cracking occurred depending on conditions such as the frit coating state and the temperature drop rate after firing.
X: Peeling / cracking occurred frequently.
In addition, the numerical value of a thermal expansion coefficient is a value from room temperature to 300 degreeC.

  From the above results, it has been found that it is preferable if the thermal expansion coefficient of the connecting member is in the range of 0.95 to 1.10 times the thermal expansion coefficient of the glass substrate.

(Example 8)
As in Example 7, the relationship between the low melting point glass (frit glass) to be used, the glass substrate, and the connection member is focused on the thermal expansion coefficient from room temperature to 300 ° C., and connected to the glass substrate used in Example 7. The low melting point glass shown in the following table was used at each sealing temperature in addition to LS3081 for the combination of the members for the same observation as in Example 7. The results are shown in the table below.

○, Δ, ×: Symbols having the same meaning as in Example 7 From the above results, the thermal expansion coefficient of the low-melting glass is 0.75 times to 1 each thermal expansion coefficient of the members connected by the low-melting glass. It was found that a preferable adhesion state was maintained at a magnification of .05.

Example 9
Instead of the glass substrate 801 used in Example 4 and the glass exhaust pipe member as the sealed container side connecting member 901, a combination of a glass substrate having a thermal expansion coefficient shown below and a glass exhaust pipe member is used. Except for producing a container for connecting the exhaust pipe, a container was produced in the same manner as in Example 4, and the connection to the connection part of the exhaust system unit and the exhaust were performed.

  When the glass substrate 801 and the sealed container side connecting member 901 are connected by the low melting point glass (frit glass) 603, the adhesion state of the connecting portion is important, and the sealed container side connecting member and the frit at the time of connection and after the connection are connected. Examination was made based on whether there was peeling from the glass, occurrence of microfracture (cracks / cracks) on the glass substrate side at the connection end, occurrence of microfractures (cracks / cracks) after connection exhaust to the exhaust system, and occurrence of exfoliation. .

○, Δ, ×: Symbols having the same meaning as in Example 7. The numerical value of the thermal expansion coefficient is a value from room temperature to 300 ° C.

  From the above results, it has been found that it is preferable if the thermal expansion coefficient of the sealed container side connecting member is in the range of 0.95 to 1.10 times the thermal expansion coefficient of the glass substrate.

(Example 10)
As in Example 9, the relationship between the low-melting glass (frit glass) to be used, the glass substrate, and the sealed container side connecting member was used in Example 9, focusing on the thermal expansion coefficient from room temperature to 300 ° C. For the combination of the glass substrate and the sealed container side connecting member, the low melting point glass shown in the table below was used at each sealing temperature in addition to LS3081, and the same observation as in Example 7 was performed. The results are shown in the table below.

Δ, ×: Symbols having the same meaning as in Example 7 From the above results, the thermal expansion coefficient of the low-melting glass is 0.75 times to 1.05 of each thermal expansion coefficient of the members connected by the low-melting glass. It has been found that a preferable adhesion state is maintained when the ratio is doubled.

(Example 11)
Instead of the copper tubular exhaust pipe used in Example 1, a container was produced in the same manner as in Example 1 except that a container was produced using a silver tubular exhaust pipe.

  As a result, although the silver tubular exhaust pipe has the defect that it is easily deformed as compared with the copper exhaust pipe, the same result as that of the copper exhaust pipe was obtained with regard to concerns about the released gas and the like.

Example 12
Instead of the copper tubular exhaust pipe used in Example 4, a container was produced in the same manner as in Example 3 except that a container was produced using a silver tubular exhaust pipe.

  As a result, although the silver tubular exhaust pipe has a drawback that it is easily deformed as compared with the copper exhaust pipe, the concern about the released gas and the like was obtained as in the case of the copper exhaust pipe.

(Example 13)
FIG. 13 is a diagram showing the manufacturing apparatus of the present embodiment.
In FIG. 13, reference numeral 1302 denotes a position detector that detects the position of the bit 404 of the pincher device 403, and reference numeral 1301 denotes a control device that controls the hydraulic device 405 based on information from the position detector 1302.

  The other reference numerals indicate that the same members as those shown in FIG. 4A and the like are the same.

  In the present embodiment, a manufacturing apparatus will be described in which the position of the bit 404 is detected, and the exhaust pipe 111 is chipped off while the hydraulic apparatus 405 is controlled based on information on the thickness of the exhaust pipe obtained thereby.

  The image display apparatus performed gettering up to the gettering process as in the second embodiment. Next, the chip-off process was performed as follows.

  The position where the fixed side bit 404a is applied to the copper exhaust pipe sealing part 401 and the operating side bit 404b is 1 cm away from the copper exhaust pipe sealing part 401 is detected by the position detector 1302, and 0 Position.

A signal is sent from the control device 1301 to the hydraulic device 405 to generate hydraulic pressure, and the operating bit 404b is moved to crimp the copper exhaust pipe sealing portion 401. The pressure of the hydraulic device 405 at this time was 1 kg / cm ² .

  After 1 minute in this state, the position detector 1002 detected that the position of the operating side bit 404b had moved by 2 cm. Therefore, it was determined that the copper exhaust pipe sealing portion 401 was crimped and sealed, and a signal was sent from the control device 1301 to the hydraulic device 405 to stop the hydraulic pressure.

  Thereafter, it was detected by the position detector 1002 that the working side bit 404b was 2 cm away from the copper exhaust pipe sealing portion, and the crimping sealing was completed.

  In this example, the pressure sealing was performed by detecting the position of the bit with the position detector 1302 in the pressure sealing state of the copper exhaust pipe sealing portion 401. Therefore, it was possible to determine whether or not the crimping and sealing process was completed, the yield was improved more than the yield of Example 2, and the yield was 98%.

It is the schematic which shows the structure of the sealed container (flat type image display apparatus) by this invention. FIG. 2 is a schematic configuration diagram illustrating an enlarged structure of a rear plate using a surface conduction electron-emitting device according to the present invention and a surface conduction electron-emitting device 200; 1 is a block schematic diagram of an image display device according to the present invention. It is the schematic of the sealing process of the metal tubular exhaust pipe by this invention. It is the schematic which shows the 1st example of the exhaust pipe structure which has a metal exhaust pipe sealing site | part by this invention. It is the schematic which shows the example of a connection to the exhaust apparatus of the sealed container which has the structure exhaust pipe of FIG. 5 by this invention. FIG. 6 is a schematic view showing another example of connection of a sealed container having the exhaust pipe configured in FIG. 5 to the exhaust device according to the present invention. It is the schematic which shows the structural example of the connection of the exhaust pipe and container in this invention. It is the schematic which shows the 2nd example of the exhaust pipe structure which has a metal exhaust pipe sealing site | part by this invention. It is the schematic which shows the example of a connection to the exhaust apparatus of the sealed container which has the structure exhaust pipe of FIG. 9 by this invention. FIG. 10 is a schematic view showing another connection example of the sealed container having the exhaust pipe having the configuration shown in FIG. 9 according to the present invention to the exhaust device. It is the schematic which shows the structural example of the connection of the exhaust pipe and container by this invention. It is the schematic which shows the manufacturing apparatus of the image display apparatus by this invention. It is a characteristic view which shows the discharge | emission gas amount change after the pressure-bonding sealing by this invention and a prior art example. It is a microscope picture which shows the foreign material generation | occurrence | production state after pressure bonding sealing by the presence or absence of a plating process. It is the schematic which shows the connection to the exhaust system of the sealed container of the structure which has the conventional glass exhaust pipe. It is the schematic which shows the structural example which connects a glass-made exhaust pipe and a board | substrate.

Explanation of symbols

101 Rear plate 102, 200 Surface conduction electron-emitting device 103 Wiring 104, 205, 206 Device electrode 105 Face plate 106 Metal back 107 Phosphor 108 Frit glass 109 Outer frame 110 Getter 111 Exhaust pipe 112, 601 Sealed container 201 Lower wiring 202 Upper wiring 203 Interlayer insulating layer 204 Wiring pad 207 Conductive thin film 208 Electron emission portion 301 Image display area 302 Flat display panel 303 Light spot emission area 304 Modulation signal side Xn wiring 305 Scanning signal side Yn wiring 306 Drive circuit section 307 High voltage application Device 308 Image display device 401 Metal exhaust pipe sealing part 402 Pincher 403, 604, 702 Exhaust system connection portion 404 Bit 404a Fixed side bit 404b Working side bit 405 Hydraulic device 500 Metal tubular exhaust pipe 501 Metal exhaust Tracheal sealing part 502, 506 Sealing adhesive 503, 505 Connection member 504 Plating part 602 Exhaust holes 603, 701, 902, 1102 Low melting glass 605 Tightening cap 606 O-ring 607 Spacer 608 Screw part 702 Exhaust system mechanism Side connection part 703 Exhaust system mechanism (apparatus)
801 Glass plate 901 Sealed container side connection member 1101 Exhaust system side connection member 1301 Control device 1302 Position detector 1601 Glass exhaust pipe 1602 Sealing jig

Claims (3)

An exhaust pipe provided with a sealing portion made of a plated metal and having a sealing portion in which the thickness of the sealing portion is 30% to 70% of the thickness of a portion other than the sealing portion. Connecting and evacuating the vessel to a pressure below atmospheric pressure;
A method of manufacturing an image display device, comprising: a step of pressure-bonding and sealing a sealing portion of the exhaust pipe. The metal of the sealing part is any one of copper, an alloy containing copper, aluminum, an alloy containing aluminum, silver, an alloy containing silver, tungsten, an alloy containing tungsten, molybdenum, an alloy containing molybdenum. The method for manufacturing an image display device according to claim 1 , wherein: 3. The plating process according to claim 1, wherein the plating process is a plating process made of a metal made of zinc, gold, tin, nickel, rhodium, palladium, chromium, cadmium, or an alloy containing one or more of these metals. The manufacturing method of the image display apparatus as described in any one of Claims 1-3.

Images