JP4117958B2 - IC tag structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC tag structure that has an IC chip and an antenna that store tag information as main internal parts, is attached to an article, etc., and communicates information and the like with an external device in a non-contact manner.
[0002]
[Prior art]
As a system for automatically reading and identifying tag information attached to articles, etc., there is a system using a bar code system, but an IC called a data carrier system that can handle a larger amount of information and can be read out remotely. Tag system development is progressing.
[0003]
This IC tag system is composed of a transponder called an IC tag attached to an article or the like and an interrogator. Between these transponders and the interrogator, a transmission medium such as magnetism, induction electromagnetic field, microwave (radio wave), etc. It communicates without contact via
[0004]
FIG. 1 is an exploded perspective view showing a conventional IC tag structure. Reference numeral 1 denotes an IC chip that stores tag information, which is mounted on the substrate 2. Pattern portions 2 a and 2 b are formed on the substrate 2, and the IC chip 1 is connected to the pattern portions 2 a and 2 b of the substrate 2 by wire bonding or the like to constitute an IC module portion 3. Reference numeral 4 denotes a copper wire wound in a coil shape serving as an antenna. The connection end 4a at the beginning of winding and the connection end 4b at the end of winding of the coiled copper wire 4 are connected to the pattern portions 2a, 2b of the substrate 2 by solder 2c to constitute an IC tag.
[0005]
After connecting the connection end portions 4a and 4b of the coiled copper wire 4 to the IC module portion 3, the film 5 and the film 6 are used and bonded together from above and below to complete the IC doug. The film is made of a resin such as polyethylene formed into a sheet shape, and is adhered by a method by heat welding or by a film having an adhesive. In addition, when the IC tag is directly attached to an article or the like, the surface to be attached to the article is configured with a film having an adhesive in advance, and is attached to the article via the adhesive to be used as an automatic tag information recognition system. Used.
[0006]
FIG. 2 is a cross-sectional view showing a state where a conventional IC tag is attached to an article. The IC module part 3 and the coiled copper wire 4 sandwiched and bonded between the film 5 and the film 6 are made of a pressure-sensitive adhesive on one side of the film 5 (the side opposite to the surface where the IC module part and the coiled copper wire are bonded). It is affixed on the article 7.
[0007]
[Problems to be solved by the invention]
By the way, since the IC tag attached to the article stores the tag information of the attached article itself, the IC tag once attached may be erroneously replaced with another article. The tag information is recognized and adversely affects the handling of the article. Therefore, the IC tag once attached to the article needs to have an IC tag structure that cannot be used again.
FIG. 3 is a cross-sectional view showing a state where the IC tag of FIG. 2 is peeled off. As shown in FIG. 3, the film 5 and the film 6 are separated and peeled off, but the IC module part 3 and the coiled copper wire 4 may be peeled off while being adhered to the film 6. If the IC module part 3 and the coiled copper wire 4 are well separated and peeled off, the IC tag is broken and cannot be used. However, when peeled off in the state as shown in FIG. 3, the IC chip 1 and the coiled copper wire 2 remain connected for the function of the IC tag. End up.
Therefore, the present invention intends to provide a structure in which when an IC tag once attached to an article is to be peeled off, the IC tag is reliably destroyed by peeling off.
[0008]
[Means for Solving the Problems]
A coil-shaped copper wire serving as an antenna and an IC chip, the IC chip being mounted on a substrate, connected to the pattern portion of the substrate to constitute an IC module portion, and further, the pattern portion of the substrate and the coil shape In an IC tag structure in which an IC tag formed by connecting a connection end of a copper wire is sandwiched between two films and bonded,
The two films have adhesives with different adhesive strengths on the surface sandwiching the IC tag, and the IC module part is adhered only to one film having an adhesive with weak adhesive strength, a not adhered configured to the other film with a strong adhesive with adhesion of glued the IC module portion side opposed to the film, when the so peeled the film, said coiled copper wire adhesion peeling with a strong state where the pressure-sensitive adhesive was stuck to the film with the said IC module portion by Rukoto peeling state sticks to the film having a weak adhesive strength adhesive, each of which the IC tag structure to be separated .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The basic configuration is as described in the conventional example, but the present invention is characterized by the configuration of the adhesive of the two films. FIG. 4 is a partial cross-sectional view of an IC tag structure showing an embodiment of the present invention, in which an IC module portion 3 and a coiled copper wire 4 are sandwiched and adhered between a film 9 and a film 8 and attached to an article 7. It is sectional drawing of the state carried out.
FIG. 5 is a cross-sectional view showing a state where the IC tag of the embodiment of the present invention of FIG. 4 is peeled off.
[0010]
The IC tag is constructed by adhering it so as to be sandwiched between films 8 and 9 having an adhesive. The film 8 having adhesives 8a and 8b on both sides thereof is used, and the film 9 having an adhesive 9a only on one side (side where the IC tag is sandwiched) is used. The film 8 may be a film in which an adhesive is formed. The film 8 has an outer shape smaller than the outer shape of the film 9. After the films 8 and 9 are bonded together, they are attached to the article 7 or the like via the adhesive 8b on the outer surface of the film 8 (the surface not sandwiching the IC module portion 3), and used for an automatic recognition system. At this time, the adhesive 8b on the surface sandwiching the IC module portion 3 of the film 8 and the adhesive 8b on the side of the film 8 that is attached to the article 7 or the like is the other adhesive (the surface of the film 9 that sandwiches the IC module portion 3). The adhesive 9a) is made of a material having a stronger adhesive strength. As the pressure-sensitive adhesive 8b, a material having a strong adhesive force is used in order to strengthen the adhesion (adhesion) to the article 7. The adhesive 8a is not particularly limited as long as the adhesive surface with the coiled copper wire 4 is strong. For example, the other portion (the portion other than the surface to be bonded to the coiled copper wire 4) may not have the adhesive.
10 is a part which does not have the adhesive 8a, and is just in a position which contacts an IC module part.
[0011]
When the IC tag once pasted is to be peeled off, the end portion 9b of the film 9 having a large outer shape is picked and peeled off. As shown in the cross-sectional view of FIG. 5, the film 8 having a strong adhesive force remains attached to the article side, and the film 9 having a weaker adhesive force than the film 8 is peeled off. The coiled copper wire 4 is bonded to both the film 8 and the film 9, but remains on the film 8 side due to the adhesive force of the adhesive 8 a of the film 8, and the IC module unit 3 is attached to the film 9 by the adhesive of the film 9. It will be peeled off with sticking. The IC module portion 3 is not in a state of being bonded to the film 8 because the IC module portion 3 is on the position of the portion 10 having no adhesive on the film 8 side. Therefore, the IC module part 3 is peeled off while being stuck to the film 9. With this configuration, it becomes an effective means for ensuring separation of the coiled copper wire and the IC module part.
[0012]
If an attempt is made to peel all the film in this state, although not shown, the connection end portion of the coiled copper wire 4 connected to the substrate pattern portion of the IC module portion is cut and the IC tag is destroyed. With such a configuration, it is possible to provide a structure that is destroyed when an IC tag once attached to an article or the like is to be peeled off. And it can be prevented from being used again.
[0013]
Furthermore, as another embodiment, the adhesive of the film 9 may be provided only in a portion that contacts the IC module portion 3. According to this configuration, the coiled copper wire 4 is not bonded to the film 9, and only the IC module unit 3 is bonded to the film 9, so that the coiled copper wire 4 and the IC module unit 3 are separated when peeled off. It is separated and the IC tag is destroyed.
[0014]
【The invention's effect】
In consideration of the adhesive strength of the film, the coil-shaped copper wire and the IC module portion are configured to be easily separated, so that when the IC tag attached to the article is peeled off, it is surely destroyed.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a conventional IC tag structure.
FIG. 2 is a cross-sectional view showing a state in which a conventional IC tag is attached to an article.
3 is a cross-sectional view showing a state where the IC tag of FIG. 2 is peeled off.
FIG. 4 is a partial cross-sectional view showing a state where an IC tag according to an embodiment of the present invention is attached to an article.
5 is a cross-sectional view showing a state where the IC tag of FIG. 5 is peeled off.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC chip 2 Board | substrate 2a Pattern part 2b Pattern part 2c Solder 3 IC module part 4 Coiled copper wire 5 Film 6 Film 7 Article 8 Film 8a Adhesive 8b Adhesive 9 Film 9a Adhesive 9b Tip part 10 It does not have an adhesive portion

Claims (1)

A coil-shaped copper wire serving as an antenna and an IC chip, the IC chip being mounted on a substrate, connected to the pattern portion of the substrate to constitute an IC module portion, and further, the pattern portion of the substrate and the coil shape In an IC tag structure in which an IC tag formed by connecting a connection end of a copper wire is sandwiched between two films and bonded,
The two films have adhesives with different adhesive strengths on the surface sandwiching the IC tag, and the IC module part is adhered only to one film having an adhesive with weak adhesive strength, a not adhered configured to the other film with a strong adhesive with adhesion of glued the IC module portion side opposed to the film, when the so peeled the film, said coiled copper wire adhesion peeling with a strong state where the pressure-sensitive adhesive was stuck to the film with the said IC module portion by Rukoto peeling state sticks to the film having a weak adhesive strength adhesive, respectively, characterized in that it is separated IC tag structure.

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