KR20030024132A - Contactless IC Card Using Adhesive Substrate and Method of Manufacturing the Card - Google Patents

Abstract

PURPOSE: A non-contact IC card using an adhesive substrate and a manufacturing method thereof are provided to simply and economically manufacture the non-contact IC card, and to arrange an electronic part and an antenna more freely. CONSTITUTION: The non-contact IC card comprises the substrate(1) limiting a basic form, the electronic part including an IC chip(3), a capacitor, a filter and a condenser, and the antenna(4) for communicating with a card reader/writer. An adhesive layer(2) is formed on the substrate(1). The electronic part and the antenna(4) are attached on the adhesive layer(2). The antenna(4) is formed by attaching a copper wire along the circumference of the substrate(1) as much as proper times.

Description

Contactless IC Card Using Adhesive Substrate and Method of Manufacturing the Card

Field of invention

The present invention relates to a contactless IC card. More specifically, the present invention relates to a non-contact IC card in which an electronic component and an antenna are formed on an adhesive substrate. More specifically, the present invention relates to a non-contact IC card capable of replacing a conventional barcode system by forming an IC chip and an antenna having at least a memory function on a sticky substrate.

Background of the Invention

There is a growing interest in IC cards having memory functions and processor functions for use in electronic money and the like. In addition to serving as a pass card (pass card) used in subways and buses, etc., it is also recently used to replace the conventional bar-code. Barcodes, which are used to identify or manage various types of products or books in libraries, are generally used worldwide due to the advantage of easily identifying target products through barcode readers / writers. to be.

However, since the barcode is exposed to the outside and is easily damaged, the damaged barcode can no longer be identified by the reader / writer. Is difficult. In addition, since the barcodes can be identified only when the laser emitted from the reader / writer is exactly matched to the barcode, it is inconvenient that a product must be matched to the laser radiator of the reader / writer. As a result, a method of attaching a non-contact IC card incorporating an IC chip storing product information onto a product surface has emerged.

In general, an IC card is classified into a contact IC card that performs a command by sharing a contact point with a reader / writer and a contactless IC card that performs a command by receiving electromagnetic waves generated from the reader / writer through a coil antenna. . In the case of a non-contact IC card, an electronic component including an IC chip, a capacitor, a filter, a conductor, and the like must be embedded in a card board. To this end, conventionally, a method of adhering as a conductive adhesive on a board having a circuit pattern or using a method for A method of forming, inserting and fixing a hole almost the same size as an electronic component was used. The antenna embedded in the card board uses a method of attaching a common copper wire onto a synthetic resin plate by ultrasonic welding or etching a coil on a printed plate, using a conductive adhesive to reduce the thickness of the card. Printing on (polyethylene terephthalate) film has been used.

Such a conventional IC card has a problem in that it is not easy to embed an electronic component such as an IC chip, a capacitor, a filter, and the like in the card substrate, and eventually has to go through a complicated step of using ultrasonic waves or separately forming a circuit pattern. Especially in the case of a contactless IC card for replacing a bar code, such a complicated process is never preferable in terms of economics or manufacturing process compared to the replacement effect. In addition, the thickness of the existing IC card is too thick to be attached to the product in place of the barcode.

An object of the present invention is to provide a non-contact IC card and a method of manufacturing the same that can be produced simply and economically.

Another object of the present invention is to provide a non-contact IC card of a thinner thickness and a manufacturing method thereof compared with the conventional non-contact IC card.

It is still another object of the present invention to provide a non-contact IC card and a method of manufacturing the same capable of arranging electronic components and antennas more freely.

It is still another object of the present invention to provide a contactless IC card and a method of manufacturing the same, which can replace the conventional barcode system more effectively.

Still another object of the present invention is to provide a contactless IC card replacing the conventional barcode and a method of manufacturing the same, which can be easily attached and used by a user by removing the release paper.

The above and other objects of the present invention can be achieved by the present invention described below.

1 is a schematic perspective view of a contactless IC card according to the present invention.

FIG. 2A is an exploded perspective view of a non-contact IC card in which an adhesive layer is formed on one surface of a substrate as an embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line A-A of FIG. 2A.

FIG. 3A is an exploded perspective view schematically illustrating a non-contact IC card in which adhesive layers are formed on both surfaces of a substrate as an embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line B-B of FIG. 3A.

FIG. 4A is a cross-sectional view schematically illustrating a substrate having an adhesive layer formed on one surface and a hole formed therein for inserting and bonding an IC chip, and FIG. 4B is an adhesive layer formed on both surfaces thereof. Is a cross-sectional view schematically showing a substrate on which a hole for inserting and bonding an IC chip is formed.

Brief description of the main symbols in the drawing

1 substrate 2 adhesive layer

3: IC chip 4: antenna

5 input / output electrode 6 release paper

7: cover sheet 8: hole

Summary of the Invention

The non-contact IC card using the adhesive substrate according to the present invention is much more economical and simple to manufacture than the conventional non-contact IC card for replacing a barcode, and an adhesive layer is formed on one surface, and at least a memory function on the surface of the adhesive layer. An electronic component including an IC chip having an antenna and an antenna are made of a bonded substrate and a release paper adhered to an adhesive layer of the substrate, and is used in a non-contact manner with a card reader / writer.

Hereinafter, with reference to the accompanying drawings will be described in detail the contents of the present invention.

Detailed Description of the Invention

1 is a perspective view schematically showing a non-contact IC card according to the present invention, wherein the non-contact IC card according to the present invention includes a substrate 1, an IC chip 3, and a card reader / It consists of an antenna 4 for communicating with a lighter (not shown). The substrate 1 is generally made of a synthetic resin material, but may be replaced with a paper having a sufficient thickness. In the case of an IC card for replacing a barcode to be described below, a thin paper is more preferable. That is, additional printing may be performed on the surface of the non-contact IC card according to the needs of the user. In particular, the card has a thin thickness and a light weight.

Contactless IC cards can be broadly classified into memory type cards and microprocessor type cards according to their purpose. In the case of simple memory types, a power supply may be provided by including a battery inside an IC chip or by electromagnetic induction with a card reader / writer. As supplied, it may not contain any batteries at all. Depending on the communication distance, it can be classified into proximity type (10mm or less), short distance type (10mm ~ 10cm), and far type (several centimeters to several m). You need to wind up. Although only the IC chip 3 and the antenna 4 are shown in this figure, the non-contact IC card according to the present invention includes both the memory type and the microprocessor type described above, and is used for both the near type, the near type and the remote type. It is possible.

In the non-contact IC card according to the present invention, the adhesive layer 2 is formed on the substrate 1, and the electronic component and the antenna 4 including the IC chip 3 are adhered on the adhesive layer 2. The electronic component may include a capacitor, a filter, a capacitor, and the like, in addition to the IC chip 3 as necessary. The antenna 4 is formed by adhering copper wires along the outer circumferential surface of the substrate 1 by an appropriate number of times, and the antenna 4 formed in advance in accordance with the shape of the outer circumferential surface of the substrate 1 is formed on the substrate 1. You may use the method of sticking. If necessary, the antenna 4 formed through etching may be attached to the substrate 1. In another method, the antenna 4 and the IC chip 3 are placed in a mold formed separately from the substrate 1 on which the adhesive layer 2 is formed, and then the mold is pressed onto the substrate. (4) and IC chip 3 may be adhered to the substrate.

However, the method of forming the antenna 4 is not necessarily limited to being formed along the outer circumferential surface of the substrate 1, and may be formed in other forms in order to avoid electromagnetic mutual induction.

The adhesive layer 2 is an essential part of the present invention, and is intended to attach the electronic component and the antenna 4 in a suitable form where necessary. In other words, if the shape of the antenna 4 is made by continuously attaching the coil onto the adhesive layer 2, the overall shape of the antenna can be easily changed by changing the pattern of attaching the coil without changing the whole process. . The adhesive layer 2 may have an adhesive strength of about an ordinary adhesive tape or a double-sided tape, and may be such that the electronic component and the antenna 4 are not easily detached after being adhered to the substrate 1. In the case of an IC card for replacing a barcode to be described below, a normal double-sided tape including a release paper 6 may be used.

In general, the signal transmitted from the card reader / writer is stored in the IC chip 3 via the antenna 4. For this purpose, an electrical connection between the antenna 4 and the IC chip 3 is required, and thus a method of connecting both ends of the antenna 4 to the electrode 5 of the IC chip 3 is proposed. In the non-contact IC card according to the present invention, the antenna 4 is formed of a coated copper wire, and both ends of the antenna are connected to the electrode 5 of the IC chip 3. The sheath of the antenna may be painted with a non-conductor. To this end, by pressing a welding terminal over the contact point of the antenna 4 and the electrode 5, and applying pressure and radiating ultrasonic waves from the welding terminal, the coating is peeled off by ultrasonic energy and the electrode and the antenna are electrically welded. Connect.

Preferably, the antenna 4 and the IC chip 3 are electrically connected by using a conductive adhesive. To this end, the both ends of the antenna 4 are stripped and contacted with the electrodes 5 of the IC chip 3, and then electrically connected by applying a conductive adhesive over the contact points. More preferably, accurate connection can be achieved by using a microcapsule type as the conductive adhesive. The microcapsules with the conductive adhesive inserted thereon are applied onto the contact points, and pressurized while applying heat only through the weld terminals to the necessary portions. Only the capsule of the part contacting the welding terminal is broken, and the conductive adhesive therein locally connects the electrode and the antenna, thereby eliminating the problem that unnecessary conductive adhesive penetrates into the IC chip.

In this figure, the antenna 4 is shown to be electrically connected to the electrode 5 of the IC chip 3, but may be electrically connected to the antenna under the electrode 5 of the IC chip 3. In particular, in the case where the antenna 4 and the IC chip 3 are placed in the substrate after the arrangement of the antenna 4 and the IC chip 3 are separately formed as described above, both ends of the antenna 4 are connected to the electrodes 5 of the IC chip 3. It is preferable to connect below. This is because, after fixing the IC chip 3, it is easy to arrange the antenna 4 and to connect both ends of the antenna 4 over the electrodes of the IC chip 3 to facilitate the work process. As a result, both ends of the antenna 4 are positioned above the electrode 5 in the mold, but the antenna and the IC chip disposed in the mold are moved by pressing the mold onto the adhesive layer 2 of the substrate 1. On the substrate 1 to be brought, both ends of the antenna 4 are positioned below the electrode 5 of the IC chip 3.

FIG. 2A is an exploded perspective view of a non-contact IC card in which an adhesive layer is formed on one surface of a substrate as an embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line A-A of FIG. 2A. The contactless card replacing the conventional barcode requires a separate means for attaching the contactless card to the product in order to be attached to and used with the product like the barcode. To this end, the contactless IC card according to the present invention does not form a separate attaching means, but instead solves the problem of attaching the product and the card through the adhesive layer 2 formed on the substrate. That is, after attaching the electronic component including the IC chip 3 and the antenna 4 on the adhesive layer 2, the release paper 6 is further attached thereto. The release paper 6 is for the same purpose as release paper used in conventional double-sided tape. However, the release paper 6 is not necessarily limited to paper, and when the card is attached to the product, the release paper 6 protects the electronic components and the antenna 4 fixed on the substrate, and the card is attached to the product. It is sufficient to be able to detach | desorb easily from the adhesion layer 2.

The user who wants to use the non-contact IC card according to the present invention detaches the release paper 6 attached to the adhesive layer 2 of the substrate 1, and then attaches the adhesive layer 2 to the surface of the desired product. do. According to the function of the attached contactless card, the information of the product can be identified only if it enters within a predetermined distance from a predetermined card reader / writer.

FIG. 3A is an exploded perspective view schematically illustrating a non-contact IC card in which adhesive layers are formed on both surfaces of a substrate as an embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line B-B of FIG. 3A. This figure shows a contactless IC card, which is an improvement of the contactless IC card described in FIG. 2A, to prevent damage to the IC chip 3 and the antenna 4, which may occur when the contactless IC card is attached to the product surface. It is for. To this end, after the adhesive layers 2 are formed on both surfaces of the substrate 1 and the IC chip 3 and the antenna 4 are adhered onto the adhesive layer on one surface, the IC chip 3 and the antenna 4 are attached. The pressure-sensitive adhesive layer 2 is completely sealed using the cover sheet 7. The release paper 6 is further attached onto the adhesive layer 2 to which the IC chip and the antenna are not attached. The cover sheet 7 is to protect the IC chip 3, the antenna 4, and the adhesive layer 2 from the outside, and molding the entire adhesive layer 2 instead of using a separate sheet ( The adhesion layer 2 can also be covered by molding.

The user who wants to use the non-contact IC card according to the present invention detaches the release paper 6 attached to the adhesive layer 2 of the substrate 1, and then attaches the adhesive layer 2 to the surface of the desired product. do. According to the function of the attached contactless card, the information of the product can be identified only if it is within a predetermined distance from a predetermined card reader / writer.

4A is a cross-sectional view schematically illustrating a substrate having an adhesive layer formed on one surface and a hole formed therein for inserting and attaching an IC chip as an embodiment of the present invention, and FIG. 4B is an adhesive layer formed on both surfaces thereof. Is a cross-sectional view schematically showing a substrate on which a hole for inserting and bonding an IC chip is formed. In this figure, a method for effectively fixing an electronic component including the IC chip 3 to the substrate 1 is described. The fixing is uncertain only by attaching the electronic component to the adhesive layer 2. It is to solve the problem that due to the protruding portion by the electronic component may be too thick to replace the conventional bar code.

To this end, a hole 8 having a size and shape corresponding to the electronic component is formed in the substrate 1 and a method of fixing the electronic component to the hole 8 is used. In the case of the IC chip 3 molded on one side as a non-conductor, the IC chip 3 may be protected by the molding part (not shown) even when adhered to the adhesive layer 2, but preferably the molding A hole 8 is formed so as to correspond to one portion, and the molded surface is inserted into the hole 8 so that the electrode 5 of the IC chip 3 adheres to the adhesive layer 2. That is, by forming the input and output electrodes 5 of the IC chip 3 to protrude from both sides, the molding part is inserted into the hole 8 formed in the substrate 1 and the electrode 5 is attached to the adhesive layer 2. To stick to it.

The non-contact IC card using the adhesive substrate according to the present invention can be produced thinner and simpler and more economically than the conventional non-contact IC card, and by removing the release paper, the user can easily attach and use it at a desired position. It has the effect of providing a contactless IC card that can replace the bar code system more effectively.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (12)

An electronic component and an antenna to which an adhesive layer is formed on one surface, and an IC chip including at least a memory function on the surface of the adhesive layer; And Release paper bonded to the adhesive layer of the substrate; A contactless IC card, characterized in that used in a contactless manner with a card reader / writer. The non-contact IC card according to claim 1, wherein the substrate is formed with a hole for inserting and attaching the electronic component. The non-contact IC card according to claim 1, wherein the antenna is coated with a non-conductive coating, and then the non-conductive coating at both ends of the antenna is peeled off and then connected to the input / output electrodes of the IC chip using a conductive adhesive, respectively. The antenna and at least the antenna of claim 1, wherein the antenna and at least the IC chip are disposed in a form formed separately from the substrate, and the antenna and at least the IC chip are pressed onto a pressure-sensitive adhesive layer of the substrate. A non-contact IC card, wherein the IC chip is adhered to the adhesive layer of the substrate. An electronic component and an antenna to which an adhesive layer is formed on both surfaces, and which includes an IC chip having at least a memory function on one adhesive layer surface; A cover sheet adhered to the adhesive layer surface; And A release paper adhered to a surface of the other adhesive layer of the substrate; A contactless IC card, characterized in that used in a contactless manner with a card reader / writer. 6. The non-contact IC card according to claim 5, wherein the substrate is formed with a hole for inserting and adhering the electronic component. The non-contact IC card according to claim 5, wherein the antenna is coated with a non-conductive coating, and then the non-conductive coating at both ends of the antenna is peeled off and then connected to the input / output electrodes of the IC chip using a conductive adhesive, respectively. The antenna and at least the IC of claim 5, wherein the antenna and at least the IC chip are disposed in a mold formed separately from the substrate, and the antenna and at least the IC chip are pressed onto the adhesive layer of the substrate. A non-contact IC card, wherein the IC chip is adhered to the adhesive layer of the substrate. In a thin card in which an electronic component including an IC chip having at least a memory function and an antenna are embedded in a substrate and used in a non-contact manner with a card reader / writer, an adhesive layer is formed on the substrate surface, and the adhesive layer surface A noncontact IC card comprising the electronic component and the antenna attached to each other. The non-contact IC card according to claim 9, wherein the substrate is formed with a hole for inserting and adhering the electronic component. The non-contact IC card according to claim 9, wherein the antenna is coated with a non-conductive coating, and the non-conductive coating at both ends of the antenna is peeled off, and then connected to the input / output electrodes of the IC chip using a conductive adhesive, respectively. The antenna and at least the IC of claim 9, wherein the antenna and at least the IC chip are disposed in a mold formed separately from the substrate, and the antenna and at least the IC chip are pressed onto the adhesive layer of the substrate. A non-contact IC card, wherein the IC chip is adhered to the adhesive layer of the substrate.