JP2003132331A - Base material for non-contact data carrier and non- contact data carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a base material for a non-contact data carrier capable of improving the adhesion strength of front/back protection films by providing through holes in the base material for the non-contact data carrier to be a central layer and to provide the non-contact data carrier. SOLUTION: This base material 11 for the non-contact data carrier is provided with an antenna formed in, at least, one surface side of a film base material and an IC chip 15 connected to the end part of the antenna. The film base material is characterized in having the through holes 18 for sticking the protection films 21 and 22 stacked on the front/back of the base material for the non-contact data carrier. The non-contact data carrier 10 is characterized in that the protection films are stacked covering the whole front back surfaces of the base material for the non-contact data carrier and, at least, parts of the front/rear protection films are stuck to each other via the through holes by fusion.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a non-contact data carrier and a base material for the non-contact data carrier which is a constituent material thereof. More specifically, the present invention relates to a non-contact data carrier in which protective films are laminated on both sides, which uses a non-contact data carrier base material having a through hole in its center layer base material.

[0002]

"Non-contact data carrier" capable of recording and reading information in a non-contact manner (generally, "non-contact IC tag", "wireless IC tag", "non-contact IC", "non-contact I").
It may be expressed as “C label” or the like. ) Has come to be widely used for information management of goods and merchandise, logistics management, and the like. This non-contact data carrier is generally in a form in which an antenna coil is formed on the surface of a film or paper base and an IC chip is mounted, but when high durability is required or in the case of outdoor use, the antenna is used. A form in which a protective film is laminated on the surface is preferable.

[0003]

Although various embodiments of such a non-contact data carrier are known, the following are considered to be the mainstream in the form in which films are laminated. (1) I is applied to a coil antenna made by winding a copper wire
A non-contact data carrier to which a C chip is connected, sandwiched between protective films on the front and back, and pasted together. In this case, the winding cost is high, and a complicated process is required to connect the IC chips. Further, the thickness of the winding portion is inevitably increased, and it is impossible to manufacture a thin one having a protective film attached thereto. (2) A non-contact data carrier in which a planar coil antenna is formed on a flat film base material and an IC chip is connected to the end of the antenna, and the front and back surfaces are bonded together with a protective film. In this case, it is necessary to select one having good adhesiveness between the film base material and the protective film, and there is a problem in that material selection is restricted. Further, there is a problem that residual air is likely to be generated in a portion surrounded by the coil antenna, and that a high quality product cannot be obtained.

FIG. 3 is a diagram showing a conventional non-contact data carrier. The above embodiment (2) is shown. Figure 3
3A is a plan view, FIG. 3B and FIG.
FIG. 3B shows a cross section taken along line AA of FIG.
Is an embodiment in which the protective film and the non-contact data carrier base material are heat-sealed, and FIG. 3C shows an embodiment in which the protective film and the non-contact data carrier base material are bonded with an adhesive. . The base material 41 for the non-contact data carrier is a portion which becomes a central layer material of the non-contact data carrier 40, and in the plan view of FIG.
Since it has the same size as 0, it appears in the same shape in plan view.

As shown in FIG. 3A, in the non-contact data carrier 40 of the conventional example, a planar coil antenna 42 is formed on the base film 4b, and the IC chip 45 is formed at both connection ends 42e of the coil antenna 42. Is installed. In the embodiment of FIG. 3, the conductive member 43 is provided in a part of the coil.
Thus, a jumping circuit is formed on the back surface of the base film 4b. The conducting member 43 is an integral member of the caulking metal fittings 44 and the like, and can be easily connected to the coil by a mechanical operation.

In the case of FIG. 3B, the protective films 51 and 52 also serving as oversheets are heat-sealed and adhered to the base film 4b. Therefore, in this case, it is necessary that the three-layer films are heat-fusible and of the same material, or even if they are different materials, they are heat-bonded to each other, and the selection of materials is restricted. Become. Figure 3 (C)
In this case, the protective films 51 and 52 are laminated on the non-contact data carrier base material film 4b via the adhesives 46 and 47, whereby the non-contact data carrier 40 is constituted. Also in this case, there is a problem such as selection of the adhesives 46 and 47. Further, in either case, residual air is generated in the inner peripheral portion of the coil during the manufacturing process, which causes quality problems. Therefore,
The present invention has been completed by researching the non-contact data carrier in the laminated form as described in (2) above in order to manufacture it with low cost, high strength adhesion, and high quality.

[0007]

The first aspect of the present invention for solving the above-mentioned problems is to provide an antenna formed on at least one surface side of a film base material, and an IC chip connected to an end portion of the antenna. A non-contact data carrier base material having, wherein the film base material is provided with through holes for adhering protective films to be laminated on the front and back of the non-contact data carrier base material, The base material for a non-contact data carrier. Since it is such a base material for a non-contact data carrier, the adhesiveness of the front and back protective films can be enhanced, and the durability of the non-contact data carrier is enhanced.

A second aspect of the present invention for solving the above-mentioned problems is that a protective film is laminated so as to cover the entire front and back surfaces of the non-contact data carrier substrate, and at least a part of the front and back protective films is laminated. A non-contact data carrier characterized by being heat-sealed and bonded through a through hole. Since it is such a non-contact data carrier, the adhesiveness of the front and back protective films can be enhanced, and the durability of the non-contact data carrier is enhanced.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION A base material for a non-contact data carrier and a non-contact data carrier of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an example of a non-contact data carrier and a base material for a non-contact data carrier of the present invention. 1A is a plan view, and FIG. 1B is a cross section taken along line AA of FIG. The base material 11 for a non-contact data carrier of the present invention is a base film 1.
Coil antenna 12 formed on at least one surface side of b
And the IC chip 15 attached to both connection ends 12e of the antenna. The IC chip 15 is fixed to both the connecting ends 12e of the antenna by an adhesive (not shown), and the spike-shaped bumps 23 and 24 are set to bite into the connecting ends 12e of the antenna. A part of the coil forms a jumping circuit on the back surface of the base material film 1b by the conductive member 13.
It is not essential to use the and may be through holes. In addition, various configurations of non-contact data carriers that do not use the conductive member 13 and the like are known.

The base film 1b is provided with through holes 18a for adhering protective films laminated on the front and back of the base,
18b, 18c, ..., 18n are provided. The shape of the through holes is not particularly limited, and may be circular, elliptical, or quadrangular, and it is not necessary that all through holes have the same shape and size. The size of the through hole is set to be within the inner peripheral region of the coil or the outer peripheral region of the coil. Usually, it is a preferred embodiment that a hole having a diameter of several mm to several tens of mm or a circular hole or a rectangular hole having an intersection is provided. The number of through holes provided is also not particularly limited. In handling a base material for a non-contact data carrier, it is not appropriate to provide a large number of through-holes or make the through-holes large enough so that the base material cannot maintain a flat original shape.

The through hole 18 can be provided in the inner peripheral region of the coil antenna 12, the outer peripheral region of the coil, or both. When a wide space can be formed in the inner peripheral area of the coil antenna, it is appropriate to provide a through hole in the center portion of the carrier in order to increase the adhesion. This also has the effect of facilitating deaeration of the air remaining in the inner peripheral area of the coil. Base film for non-contact data carrier 1
If the shape of b is made smaller than the shape of the protective films 21 and 22 so as to fit within the area of the protective film, the edge portion 11e of the protective film forms a continuous adhesive portion without depending on the through hole. be able to. In the case of a hot press, the non-contact data carrier is introduced into the press machine in a multi-faceted state, but punched in a straight line at the same time as the through holes, leaving a connection between adjacent edges of each non-contact data carrier. As a result, such an adhesive portion can be formed. As described above, the present invention is characterized in that at least one through hole is provided in the non-contact data carrier base material 11.

[0012] The protective film may not necessarily protect the non-contact data carrier, but may itself be an essential substrate. For example, in the case of a card-shaped non-contact data carrier, when a thin-layer non-contact data carrier base material is inserted in the center and both surfaces thereof are covered with a hard vinyl chloride base material to form a card base material, , Corresponds to an embodiment of the present invention. Therefore, the protective film also includes a sheet-shaped one. The protective film (or sheet) needs to be heat-meltable, but the non-contact data carrier substrate 11 itself is not limited to heat-meltable. Even if the heat-sealing property between the protective film and the non-contact data carrier substrate is poor, the non-contact data carrier substrate 1b
This is because the protective film can be bonded by the self-heat-bonding property through the through hole.

As shown in the sectional view of FIG.
Since a, 18b, 18c, ..., 13n directly contact between the protective films 21 and 22 during hot pressing,
Non-contact data carrier substrate 1b and protective film 21,
If 22 and 22 are laminated and hot pressed, the self-heat-bonding protective films can be obtained as an integral laminate regardless of the adhesiveness with the base film 1b. Therefore, the protective film (or sheet) and the base film 1
It is not necessary to consider the adhesiveness with b, and the restriction of material selection is reduced. In the case of FIG. 1, the coil antenna 12 is formed only on one side of the base film 1b, but it may be formed on both sides of the base film. in this case,
The front and back coils have the same winding direction, and the front and back coil antennas are connected by a conducting member or through holes.

FIG. 2 is a diagram showing a process of manufacturing the contactless data carrier of the present invention. FIG. 2A is a step of preparing a non-contact data carrier base material. In general,
A photo-etching step of applying a photosensitive solution and etching the base film 1b in which copper foil or aluminum foil is laminated,
The coil antenna 12 is formed by a step of performing resist printing and etching. The coil antenna 12 may also be formed by a printed wiring technique using conductive ink. Both ends 12e of the coil antenna
Then, an IC chip 15 is mounted by applying an adhesive agent (not shown). At this time, the spike-shaped bumps of the IC chip bite into both connection end portions 12e of the coil antenna to secure the connection. Bumps up to base film 1b,
You may try to cut in. However, since the bump is not limited to the spike shape as described above, for example, in the case of a planar bump, the bump may be fixed with an anisotropic conductive adhesive so as to conduct in a specific direction.

Although the IC chip is mounted and functions as a non-contact data carrier, in the non-contact data carrier of the present invention, a through hole 18 is further provided in the base material and a protective film is laminated. The through holes 18 may be formed in a continuous process using a punching device, or may be punched in the cut sheet state. As for the area and size of the through-hole, if the area is large and the shape is not deformed while maintaining the shape, the larger the area, the greater the adhesiveness and the greater the strength effect.

Next, in the process of FIG. 2B, the protective films 21 and 22 are laminated. In the case of finishing into a hard card state, generally, the non-contact data carrier substrate 11 is sandwiched between heat-fusible materials such as a hard vinyl chloride sheet, and then a hot press is applied via a mirror plate. By doing so, a card-shaped non-contact data carrier is obtained. Even if there is a difference in thickness between the through-hole portion and the non-through-hole portion, there is an effect that a uniform thickness can be forced when the hot pressing with a mirror plate is performed. If the sheet is not limited to a card and is in a flexible sheet state, the protective film may be laminated in a continuous thermal lamination process.

FIG. 2C shows a state after the protective film is bonded. Protective film 2 through the through hole
A heat-bonded portion 30 is formed between 1 and 22 to obtain a non-contact data carrier in which the film layers are firmly bonded. In the case of FIG. 2, since the width of the non-contact data carrier base material 11 is narrower than that of the protective films 21 and 22, the non-contact data carrier 10 is continuously bonded at both end edges without using through holes. It constitutes the section 30e. When such an adhesive portion is formed, it is preferable to prevent peeling from the edge of the non-contact data carrier.

Next, materials and the like used in the present invention will be described. Various materials such as paper, PET, polypropylene, polyethylene, vinyl chloride, acrylic, amorphous polyester, polyurethane, ABS resin, polystyrene and nylon are used as the base film 1b used for the base material 11 for non-contact data carrier. However, it is necessary to select the coil antenna in consideration of the process of forming the coil antenna and the like.
In the case of paper, it is preferable to use paper that has been subjected to water resistance treatment and has high insulation. A thickness of 15 to 300 μm can be used,
In order for the non-contact data carrier after lamination to have a uniform thickness, it is preferable to use a thin film base material. Generally, 20 to 100 in terms of strength, workability, cost, etc.
μm is more preferable.

As the film (or sheet) used for the protective films 21 and 22, a heat-fusible material can be used. Specifically, acrylic, non-crystalline polyester, polyurethane, polypropylene, polyethylene, vinyl chloride, vinylidene chloride, ABS resin and the like, and composite products thereof can be used. The thickness is selected according to the purpose of those 15~500μm extent.

The IC chip (semiconductor device) is formed by forming an integrated circuit and a memory on a silicon base material, and has a size of about 2 mm × 2 mm and a thickness of 0. Those within 5 mm are used. Generally 125k for communication with reader / writer
Hz, 13.56MHz, 800MHz, 2.45GH
The frequency band of z, 5.8 GHz (microwave) will be used. Non-contact IC tags often use 13.56 MHz, and various reader / writers are commercially available.

[0021]

Embodiments Embodiments of the present invention will be described with reference to FIGS. A 50 μm thick aluminum foil was dry laminated on a 25 μm thick polyethylene terephthalate (PET) film to prepare a carrier base film 1b. After the photosensitive resist (made by The Inktech Co., Ltd.) made of vinyl chloride-based resin was applied on the surface of the aluminum foil so that the thickness after drying was 1 μm, the coil antenna pattern was exposed and developed. , Etching the exposed aluminum area with ferric chloride aqueous solution,
A sheet having the coil antenna 12 of (× 3 surface) was obtained.

Next, the thickness is 200 μm and the height is 70 μm.
An IC chip 15 having m-shaped spike-shaped bumps 23 and 24 is prepared, an epoxy thermosetting adhesive is applied to the IC chip mounting portion, and then the bumps of the IC chip are faced down to form the coil antenna 12. Both connection ends 1
2e was aligned and placed. Furthermore, IC chip 1
From the 5 side, apply heat and pressure at 150 ° C and 1.2 MPa to the IC
The chip was mounted and the non-contact data carrier substrate 11 was completed. Next, one circular through hole having a diameter of 20 mm was provided at the center of the inner peripheral area of the coil antenna of the base film 1b, and six small circular through holes 18 having a diameter of 6 mm were provided on both sides of the base. Further, a groove-shaped punched portion having a width of 4 mm was formed so that the diagonal portions between the respective impositions were left so as to be connected to each other, and the other edge portions formed continuous adhesive portions when the outer dimension was cut.

The non-contact data carrier substrate 11 is used as a central layer, and a white hard vinyl chloride sheet having a thickness of 360 μm is laminated on both sides of the central layer. C, 0.5 MPa, 1
It was pressed and laminated under the condition of 20 seconds. afterwards,
The non-contact data carrier 10 was completed by making an external dimension cut into a predetermined card-like shape so that the cutting position would pass through the center of a groove having a width of 4 mm.

The completed non-contact data carrier had a thickness of 0.745 mm, and the hard vinyl chloride sheets on the front and back were firmly adhered. No bubbles were generated in the non-contact data carrier, and the flatness was good. In addition, after recording the specified data on the contactless data carrier,
As a reading device, a BiStatix reader “WAVE” manufactured by Motorola Co., Ltd. was used to perform an information reading test, and it was confirmed that reading and writing could be performed without any trouble.

[0025]

As described above, since the base material for a non-contact data carrier of the present invention is provided with the through holes, the protective films laminated on the front and back can be firmly bonded.
INDUSTRIAL APPLICABILITY The non-contact data carrier of the present invention can be formed thin and has no residual air, resulting in excellent quality. Further, since there are few restrictions on material selection, there is a merit in terms of cost.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a non-contact data carrier and a base material for a non-contact data carrier of the present invention.

FIG. 2 is a diagram showing a process of manufacturing a contactless data carrier of the present invention.

FIG. 3 is a diagram showing a conventional non-contact data carrier.

[Explanation of symbols]

1b, 4b Base film 10,40 Non-contact data carrier 11,41 Non-contact data carrier base 12,42 Coil antenna 12e, 42e Both connection end parts 13,43 Conductive member 15,45 IC chip 18,18a , 18b, 18c, ..., 18n Through holes 21, 22, 51, 52 Protective films 23, 24 Bumps 30 Thermal fusion bonding parts 46, 47 Adhesives

Claims (6)

[Claims] 1. An antenna formed on at least one side of a film substrate, and an IC connected to an end of the antenna.
A base material for a non-contact data carrier having a chip, wherein the film base material is provided with through holes for adhering protective films to be laminated on the front and back of the base material for a non-contact data carrier. Characteristic base material for non-contact data carriers. 2. The contactless data carrier according to claim 1, wherein the antenna has a planar coil shape, and the through hole is provided in an inner peripheral area of the coil, an outer peripheral area of the coil, or both of them. Substrate. 3. The antenna has a planar coil shape and is formed on one surface side of the film base material, and a part of the antenna is provided on the other surface side of the non-contact data carrier base material through a conductive member or a through hole. The non-contact data carrier base material according to claim 1 or 2, which is connected. 4. The antenna has a planar coil shape and is formed on both surface sides of the film base material, and the antenna is connected to the antenna on the other surface side of the film base material through a conducting member or a through hole. The base material for a non-contact data carrier according to claim 1 or 2, characterized in that 5. A protective film is laminated so as to cover the entire front and back surfaces of the base material for a non-contact data carrier according to any one of claims 1 to 4, and at least a part of the front and back protective films is heat-sealed through a through hole. A non-contact data carrier characterized by being bonded together. 6. The non-contact data carrier according to claim 5, wherein the non-contact data carrier has a continuous adhesive portion between front and back protective films at an edge portion thereof.