JP3879923B2 - Manufacturing method of lid for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a lid that is attached to an opening of an electronic component such as a piezoelectric device in which a piezoelectric vibrating piece is accommodated in a package.
[0002]
[Prior art]
Piezoelectric vibrating piece housed in a package for small information devices such as HDDs (hard disk drives), mobile computers, IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems Piezoelectric devices such as vibrators and piezoelectric oscillators are widely used.
FIG. 12 is a schematic cross-sectional view showing a configuration example of such a piezoelectric device.
In the figure, a piezoelectric device 1 contains a piezoelectric vibrating piece 3 inside a package 2. The piezoelectric vibrating piece 3 is formed using a quartz substrate, for example. The piezoelectric vibrating piece 3 has a base portion 3 a bonded to an electrode portion 6 formed on the inner bottom portion of the package 2 using a conductive adhesive 6 a.
[0003]
The package 2 is formed by cutting a ceramic green sheet into a frame shape with a mold, laminating a plurality of sheets to form an internal space inside, and then sintering. The piezoelectric vibrating reed 3 described above is accommodated in the internal space S1 of the package 2, and the opening 5 of the package 2 is closed by the lid 4 after the accommodation.
Specifically, the lid 4 is bonded to the upper end of the package 2 adjacent to the opening 5 of the package 2 by using a brazing material 4a.
Thereby, the internal space S1 in which the piezoelectric vibrating reed 3 is accommodated is hermetically sealed by the lid 4.
[0004]
[Problems to be solved by the invention]
By the way, in the piezoelectric device 1 having such a structure, the lid 4 is made of a material having a linear expansion coefficient close to that of the material constituting the package 2, or laser light is applied to the piezoelectric vibrating piece 3 after the lid 4 is sealed. In order to cope with the frequency adjustment performed by partially evaporating the electrode portion of the piezoelectric vibrating piece 3, it may be formed of glass that transmits laser light.
[0005]
In this case, the lid 4 is exposed on the upper surface of the package 2, but with such a structure, the lid 4 may be damaged by an externally applied impact. If the lid 4 is broken, not only the appearance of the product is damaged, but if the damage is large, the airtightness is impaired, and a predetermined oscillation performance may not be obtained.
[0006]
Therefore, a configuration as shown in FIG. 13 is also conceivable.
FIG. 13 shows an example of the structure of a piezoelectric device that attempts to prevent damage to the lid as much as possible by devising the form of the package. The parts denoted by the same reference numerals as those in FIG. 12 are the piezoelectric devices 1 in FIG. It is the same composition as.
[0007]
In FIG. 13, the package 2 of the piezoelectric device 10 includes a frame portion 7. That is, the frame part 7 is provided with an upward stepped part 5a outside the opening 5 of the package 2 and a low wall-like inner periphery on the outside.
By applying the brazing material 4a to the upward stepped portion 5a, the lid 4 is joined.
Therefore, in the piezoelectric device 10, since the lid 4 is surrounded by the frame portion 7, the side surface of the lid 4 that is susceptible to impact from the outside is protected by the frame portion 7. The lid 4 is less likely to be damaged.
[0008]
However, the upper surface 4b of the lid 4 showing a large area remains exposed to the outside, and if this portion is subjected to an impact, it is still easily damaged. Further, since the package 2 includes the frame portion 7, the size is increased, which is disadvantageous in that it is disadvantageous for miniaturization of the piezoelectric device. For this reason, there is a problem that there are few advantages obtained even if the enlargement of the package is allowed.
[0009]
An object of this invention is to provide the manufacturing method of the lid | cover for electronic components of a structure strong against the impact from the outside.
[0017]
[Means for Solving the Problems]
The above object is achieved according to the first invention, a step of uniformly coating a synthetic resin material becomes transparent after at least cured to the one surface of the glass substrate, heat curing said synthetic resin material coated on the glass substrate A step of stacking a plurality of glass substrates having a heat-cured resin and bonding them together with an adhesive, and a block in which the plurality of glass substrates with a heat-curing resin are bonded together after the heat curing step. A step of forming a plurality of processing blocks by cutting into sizes, a step of chamfering by polishing the processing blocks, and removing the adhesive of the processing blocks to obtain a chip-like lid It is achieved by the manufacturing method of the lid for electronic components provided with a process.
[0018]
According to the above configuration, the synthetic resin material is applied to each glass substrate prior to the step of cutting a block in which the plurality of glass substrates are bonded to a predetermined size to form a plurality of processing blocks. Yes. For this reason, it is possible to effectively prevent the glass substrate from being cracked or chipped in the cutting step, and the productivity is improved.
[0021]
As described above, according to the present invention, it is possible to provide a method for manufacturing a lid for an electronic component having a structure resistant to external impacts .
[0022]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2 show a first embodiment of a piezoelectric device according to the present invention. FIG. 1 is a schematic plan view thereof, and FIG. 2 is a schematic cross-sectional view taken along line AA of FIG.
In the figure, the piezoelectric device 30 shows an example in which a piezoelectric vibrator is configured, and the piezoelectric device 30 houses a piezoelectric vibrating piece 32 in a package 36. The package 36 is formed, for example, by laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet as an insulating material, and then sintering. Each of the plurality of substrates is formed with a predetermined hole on the inner side thereof, so that a predetermined internal space S2 is formed on the inner side when stacked.
This internal space S2 is a housing space for housing the piezoelectric vibrating piece.
That is, as shown in FIG. 2, in this embodiment, the package 36 is formed by, for example, stacking the first laminated substrate 61, the second laminated substrate 64, and the third laminated substrate 68 from below. ing.
[0023]
In the inner space S2 of the package 36, in the vicinity of the left end portion, the second laminated substrate 64 that is exposed to the inner space S2 and constitutes the inner bottom portion is, for example, an electrode formed by nickel plating and gold plating on tungsten metallization. Portions 31, 31 are provided.
The electrode portions 31 are connected to the outside to supply a driving voltage. Conductive adhesives 43, 43 are applied on the electrode portions 31, 31, and the base 51 of the piezoelectric vibrating piece 32 is placed on the conductive adhesives 43, 43. 43 are hardened. In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component exhibiting a bonding force and containing conductive particles such as fine silver particles can be used. A system-based or polyimide-based conductive adhesive or the like can be used.
[0024]
The piezoelectric vibrating piece 32 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. In the case of the present embodiment, the piezoelectric vibrating piece 32 has a particularly illustrated shape in order to form a small size and obtain necessary performance.
That is, the piezoelectric vibrating piece 32 has a base portion 51 fixed to the package 36 side as will be described later, and a pair of vibrations extending in parallel with the base portion 51 as a base end in a bifurcated manner toward the right in the drawing. A so-called tuning fork-type piezoelectric vibrating piece having arms 34 and 35 and having a shape like a tuning fork as a whole is used.
[0025]
Here, in FIG. 1, in the base 51 of the piezoelectric vibrating piece 32, a notch portion provided at a position close to the base end side of the pair of vibrating arms 34 and 35 is reduced in the width direction of the base 51. Alternatively, the constricted portions 52 and 52 may be provided.
Thereby, the leakage of vibration of the piezoelectric vibrating piece 32 can be prevented, and the CI (crystal impedance) value can be reduced.
Further, long grooves 34a and 35a extending in the longitudinal direction may be formed in the pair of vibrating arms 34 and 35, respectively. In this case, the long grooves are respectively formed in the same manner on the upper and lower surfaces of the vibrating arms 34 and 35, as shown as the long grooves 34a and 34a in FIG.
As described above, the long grooves 34a and 35a extending in the longitudinal direction are formed in the pair of vibrating arms 34 and 35, respectively, and the excitation electrodes (not shown) are formed in the long grooves 34a and 35a, whereby the electric field efficiency in the vibrating arms 34 and 35 is increased. Has the advantage of improving.
[0026]
An extraction electrode (not shown) for transmitting a driving voltage is formed on a portion of the base 51 of the piezoelectric vibrating piece 32 that comes into contact with the conductive adhesives 43 and 43, whereby the piezoelectric vibrating piece 32 is driven. The working electrodes are electrically connected to the electrode portions 31 and 31 on the package 36 side via the conductive adhesives 43 and 43.
The extraction electrode is formed integrally with an excitation electrode (not shown) formed in the long grooves 34a and 35a of the piezoelectric vibrating piece 32 and transmits a drive voltage to the excitation electrode.
In addition, a through hole 37 that is opened to the outside is provided near the center of the bottom surface of the package 36 by forming through holes 37 a and 37 b that are continuous with the two laminated substrates constituting the package 36. Of the two through holes constituting the through hole 37, the outer through hole 37a, which is the second hole, has a larger inner diameter than the first hole 37b that opens inside the package. Yes. Thereby, the through-hole 37 is a stepped opening including a downward stepped portion 62 in FIG.
[0027]
Here, as the metal sealing material 38 filled in the through hole 37, for example, a sealing material not containing lead is preferably selected. For example, silver brazing, Au / Sn alloy, Au / Ge alloy Selected from etc. Correspondingly, nickel plating and gold plating are preferably formed on the tungsten metallization on the metal covering portion on the surface of the stepped portion 62.
[0028]
Further, in this embodiment, the lowermost substrate 61 of the multilayer substrate constituting the package 36 is formed with a recess 42 corresponding to the thickness of the multilayer substrate by forming a hole near the right end in FIG. ing. The concave portion 42 is located below the tip portion that is the free end of the piezoelectric vibrating piece 32. Thereby, in this embodiment, when an impact is applied to the package 36 from the outside, the free end of the piezoelectric vibrating piece 32 abuts on the inner bottom surface of the package 36 even when the free end of the piezoelectric vibrating piece 32 is displaced in the direction of arrow D and shakes. Is effectively prevented from being done.
[0029]
A lid 70 manufactured as described later is joined to the opened upper end of the package 36 to be sealed. After the lid 70 is sealed and fixed to the package 36, as shown in FIG. 2, the laser beam L1 is irradiated from the outside to the metal coating portion at the tip of the piezoelectric vibrating piece 32, and the frequency is adjusted by a mass reduction method. In order to perform the above, it is made of a material that transmits light, in particular, thin glass.
As a glass material suitable for the lid 70, for example, borosilicate glass having a thickness of about 50 μm to 150 μm is used as a thin glass manufactured by a downdraw method. The composition of borosilicate glass generally includes SiO ₂ , Al ₂ O ₃ , BaO, B ₂ O in a predetermined ratio, and further includes Na ₂ O, K ₂ O, ZnO, etc. depending on the type. ing. These borosilicate glasses are determined in consideration of the required intensity, the wavelength of the laser beam used in the above-described frequency adjustment, and the like.
[0030]
As shown in FIG. 7, the lid 70 is formed by laminating a transparent synthetic resin material 72 on the thin glass 71 as described above.
Such a lid 70 has not only the piezoelectric device 30 in the present embodiment but also a similar configuration, for example, provided on the display surface of the liquid crystal panel and in the opening of the apparatus so as to cover the liquid crystal cell. The present invention can be applied to openings of various electric and electronic parts such as a lid to be mounted.
[0031]
When such a lid 70 is laminated with a glass material such as the thin glass 71 and a transparent synthetic resin material 72, the strength of the plate-like lid 70 is improved, and when a shock is applied from the outside. A structure that is not easily damaged can be obtained. In particular, by adopting such a structure for the lid that closes the opening of the electronic component, the sealing performance of the electronic component can be improved, and further, the portion exposed to the outside such as a liquid crystal display panel is protected. The function to perform can be improved. That is, the synthetic resin material 72 laminated on the thin glass 71 has a protective effect as a buffer material that prevents the object from directly colliding with the thin glass 71 from the outside by covering the thin glass 71. Further, by laminating the synthetic resin material 72 on the thin glass 71, various effects such as supporting the thin glass 71 and improving the strength of the lid 70 are exhibited.
[0032]
In order to exhibit such an effect, the synthetic resin material 72 applied to the lid 70 is transparent and corresponds to the applied electronic component, for example, in the piezoelectric device 30 of the present embodiment. When applying, heat resistance which is not damaged by heating in the manufacturing process is required.
For this reason, examples of the synthetic resin material 72 that can be used include a fluororesin, a silicon resin, and an epoxy resin.
Of these, when coating thin glass 71 using fluororesin, in addition to excellent chemical resistance against kerosene, xylene, methanol, 20% sulfuric acid, etc., heat resistance, low wear, antifouling Excellent in adhesiveness and non-adhesiveness. Further, since it can be baked at a relatively low temperature, there is almost no generation of decomposition gas, and it can be overcoated even when the coating film is partially peeled off.
[0033]
Furthermore, the laminated structure of the lid body 70 is not limited to the configuration shown in FIG. 7, and as shown in the figure, the lid body has a structure other than the structure in which each end surface of the thin glass glass 71 and the synthetic resin material 72 appears on the side surface. The entire side surface of 70 may be covered with the synthetic resin material 72 (not shown). In the case of such a configuration, the portion of the lid 70 that is most vulnerable to impact from the outside can be protected by the synthetic resin material 72.
[0034]
In the present embodiment, as shown in FIG. 2, when the lid body 70 is fixed to the package 36, the synthetic resin material 72 is positioned at a portion exposed to the outside, that is, the upper surface in the drawing. Has been.
Thereby, it is possible to effectively prevent damage from being caused by an impact on the exposed surface facing the outside of the lid 70.
On the contrary, the synthetic resin material 72 can be disposed on the side of the lid 70 exposed to the inner surface of the package 36 in a state where the lid 70 closes the opening 36 a of the package 36.
In this case, an impact is applied to the package 36, and even if the free end of the piezoelectric vibrating piece 32 hits the inner surface of the lid 70, that is, the synthetic resin material 72 in the package 36, the thin glass 71 of the lid 70 is damaged. Receiving can be effectively prevented.
Thus, the front and back of the lid 70 can be used properly depending on which advantage is selected.
[0035]
Further, as shown in FIG. 7, the lid body 70 is provided with chamfered portions 73, 73, 73, 73 in which each corner portion is obliquely chamfered.
That is, as shown in FIG. 7, when the lid body 70 is formed in a rectangular shape as a whole, when the lid body 70 that is extremely small and thin is to be fixed to the package 36, Will get caught and become difficult to work. Therefore, the corners of the lid 70 can be chamfered as shown in the figure to prevent catching. In addition, the corner portion that is not chamfered is easily damaged by an impact, but such damage can be prevented by chamfering the corner portion of the lid 70 as illustrated.
[0036]
Next, with reference to FIG. 3 thru | or FIG. 6, embodiment as an example of the manufacturing method of the cover body 70 is described.
FIG. 3 is a flowchart showing the manufacturing process of the lid 70, and FIGS. 4 to 6 are explanatory diagrams showing the manufacturing process of the lid 70.
First, in FIG. 3, a synthetic resin material 76 is dropped onto a glass plate 75 as a glass substrate that is the same material as the above-described thin glass (ST10). This process is shown in FIG. Here, the synthetic resin material 76 to be applied is the same as the synthetic resin material 72 described with reference to FIG. 7, but is made liquid by a solvent and does not necessarily need to be transparent at this point. A transparent material is used. In this embodiment, for example, a fluororesin coating agent is used as the synthetic resin material 76, and for example, “FC-107 Fine Fluorocoat” manufactured by Fine Chemical Japan Co., Ltd. can be used.
[0037]
Next, in FIG. 3, the synthetic resin material 76 is uniformly applied to the glass plate 75 (ST11). This is shown in FIG. 4 (b). In this example, the glass plate 75 is placed on a turntable of a spin coater (not shown), and the glass plate 75 is rotated in the direction of arrow B. Thereby, the synthetic resin material 76 dripped on the glass plate 75 spreads uniformly as shown by the radial arrows. It can be uniformly coated by so-called spin coating.
Subsequently, in FIG. 4C, the synthetic resin material 76 spread uniformly on the glass plate 75 is heated and cured (ST12 in FIG. 3). In this case, for example, the synthetic resin material 76 is cured by heating at an ambient temperature of 220 degrees Celsius (hereinafter, temperature display is all “degrees Celsius”) for about 60 minutes and at 200 degrees for about 120 minutes. A substrate after the synthetic resin material 76 is applied and cured on the glass plate 75 is referred to as a workpiece 77.
[0038]
Next, as shown in FIG. 5D, the main surfaces of the workpieces 77 are laminated so that the main surfaces of the workpieces 77 overlap with each other, for example, by applying an ultraviolet curable adhesive and irradiating ultraviolet rays. Are combined to form a work block 78 (ST13 in FIG. 3).
Then, as shown in FIG. 5 (e), the work block 78 is cut along YC1, YC2, and vertical and horizontal cutting lines as shown by TC1, TC2, TC3, TC4, and TC5 (ST14 in FIG. 3). ). Thereby, a plurality of cut processing blocks 81 are obtained.
[0039]
Next, as shown in FIG. 6 (f), as a polishing apparatus, a processing block 81 is put together with a predetermined abrasive in a cylindrical barrel processing device 82, and processing is performed on the inner peripheral surface of the processing device 82. The corners of the block 81 are chamfered (ST15 in FIG. 3).
In FIG. 6 (f), the processing block 81 is shown extremely large relative to the processing device 82 for the sake of convenience of understanding. However, originally, the curvature radius of the inner peripheral surface of the processing device 82 and the processing block are shown. The size 81 is determined in accordance with an appropriate chamfering process, and a large number of processing blocks 81 are placed in the processing device 82 at the same time.
Next, as shown in FIG. 6 (g), the ultraviolet curable adhesive is melted and peeled off, and separated into individual pieces from the stacked and fixed state of the processing block 81 (ST16 in FIG. 3). A small piece is completed as the lid 70 (ST17 in FIG. 3).
[0040]
As described above, according to the manufacturing method of the present embodiment, the work block 78 bonded with the plurality of glass plates 75 is cut into a predetermined size to form a plurality of processing blocks 81. The synthetic resin material 76 is applied to each glass plate 75. For this reason, the lid 70 can be manufactured without causing the glass plate 75 to be broken or chipped in the cutting step (ST14) of FIG.
[0041]
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the piezoelectric device of the present invention, and portions having the same reference numerals as those of the piezoelectric device 30 described in FIGS. 1 and 2 have a common configuration. The description which overlaps is abbreviate | omitted and it demonstrates centering around difference.
The piezoelectric device 90 according to the second embodiment in FIG. 8 is different from the piezoelectric device 30 in the first embodiment in the configuration of the lid.
[0042]
As shown in FIG. 8, the lid body 91 of the piezoelectric device 90 has a three-layer structure in which one layer of the thin glass glass 71 and the synthetic resin material 72 is plural, unlike the lid body 70 of FIG. . In particular, in this case, the synthetic resin material 72 is arranged between the two glass sheets 71 and 71.
When such a three-layer structure lid 90 is employed, a lid can be manufactured using a laminated glass manufacturing technique. In addition, such a three-layered lid has an advantage that when it is attached to an electronic component such as a piezoelectric device, the front and back surfaces are not distinguished, and the handling is easy in the manufacturing process.
Other functions and effects are the same as those in the first embodiment. Of course, the lid is not limited to such a three-layer structure, but can be formed with a larger number of layer structures.
[0043]
9 and 10 show a third embodiment of the piezoelectric device of the present invention. FIG. 9 is a schematic plan view thereof, and FIG. 10 is a schematic cross-sectional view taken along line EE of FIG.
In the piezoelectric device 100 according to the third embodiment, the portions denoted by the same reference numerals as those of the piezoelectric device 30 described with reference to FIGS. The explanation will be centered.
[0044]
Compared with the piezoelectric device 30 of the first embodiment, the piezoelectric device 100 according to the third embodiment has the same lid structure, but a partially different package structure.
That is, unlike the package 36 of the first embodiment, the package 106 of the piezoelectric device 100 overlaps the third multilayer substrate 68 with another multilayer substrate, and largely removes the inside thereof to thereby remove the frame portion 93. Is forming.
[0045]
The frame portion 93 is located outside the opening 106a of the package, and the inner peripheral shape of the frame portion 93 is similar to the inner periphery of the lid body 70 as shown in FIG. It has a shape. That is, the inner peripheral shape of the frame portion 93 is a shape corresponding to the chamfered portions 73, 73, 73, 73 of the lid body 70.
[0046]
The third embodiment is configured as described above. As shown in FIG. 10, the lid 70 enters the inside of the frame portion 93 tightly and is fixed by the brazing material 33.
In the sealing operation for sealing and fixing the lid body 70, the lid body 70 is formed in a rectangular shape as a whole, and is extremely small and thin. When it is going to seal and fix in, it will become difficult to work because the corner | angular part of the cover body 70 will be caught. However, the lid 70 has chamfered corners, and is prevented from being caught on the frame 93 when inserted. In addition, the frame portion 93 is also formed in the inner peripheral shape of the frame portion on the package side in accordance with the chamfered shape of the lid body 70, so that the lid 70 can be securely sealed.
Other functions and effects are the same as those of the first embodiment.
[0047]
FIG. 11 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention.
In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation and demodulation unit of the transmission / reception signal. A controller 301 is provided.
In addition to modulation and demodulation of transmission / reception signals, the controller 301 controls an information input / output unit 302 including an LCD as an image display unit, an operation key for inputting information, an information storage unit 303 including a RAM, a ROM, and the like. Is supposed to do. For this reason, the piezoelectric device 30 or the piezoelectric device 90 or the piezoelectric device 100 is attached to the controller 301, and the output frequency is controlled by a predetermined frequency dividing circuit (not shown) incorporated in the controller 301. It is designed to be used as a suitable clock signal. The piezoelectric device 30 attached to the controller 301 may not be a single device such as the piezoelectric device 30 but may be an oscillator that combines the piezoelectric device 30 and a predetermined frequency dividing circuit.
[0048]
The controller 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmission unit 307 and the reception unit 306. As a result, even if the basic clock from the controller 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.
[0049]
As described above, by using the piezoelectric device according to the above-described embodiment in an electronic device such as the mobile phone device 300 including the control unit, it is possible to effectively prevent the lid from being damaged. An accurate clock signal can be generated without impairing the above.
[0050]
The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to all piezoelectric devices regardless of the names of piezoelectric vibrators, piezoelectric oscillators, etc., as long as the piezoelectric vibrating reed is accommodated in the package.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a first embodiment of a piezoelectric device of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line AA in FIG.
FIG. 3 is a flowchart showing a manufacturing process of the lid of the piezoelectric device of FIG. 1;
4 is an explanatory view showing a manufacturing process of the lid of the piezoelectric device of FIG. 1, wherein (a) shows a state in which a synthetic resin material is dropped onto a glass substrate, and (b) shows a synthetic resin material on the glass substrate. (C) shows a state in which the synthetic resin material is uniformly applied on the glass substrate.
5A and 5B are explanatory views showing a manufacturing process of the lid of the piezoelectric device of FIG. 1, wherein FIG. 5D shows a state in which workpieces are stacked and bonded together, and FIG. 5E shows a state in which a glass block is cut.
6 is an explanatory view showing a manufacturing process of the lid of the piezoelectric device of FIG. 1, wherein (f) shows a state in which the processing block is polished and chamfered, and (g) is for processing after chamfering. A mode that the adhesive of a block is peeled is shown.
7 is a schematic perspective view showing a configuration of a lid of the piezoelectric device of FIG. 1. FIG.
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the piezoelectric device of the present invention.
FIG. 9 is a schematic plan view showing a third embodiment of the piezoelectric device of the present invention.
10 is a schematic cross-sectional view taken along line EE of FIG.
FIG. 11 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a piezoelectric device according to each embodiment of the invention.
FIG. 12 is a schematic cross-sectional view showing an example of a conventional piezoelectric device.
FIG. 13 is a schematic cross-sectional view showing an example of a piezoelectric device having a structure for protecting a lid.
[Explanation of symbols]
30, 90, 100 ... Piezoelectric device, 32 ... Piezoelectric vibrating piece, 36, 106 ... Package, 37 ... Through hole, 70, 91 ... Lid, 71 ... Thin glass, 72 ... Synthetic resin material, 42 ... Recess, 43 ... Conductive adhesive, 51 ... Base.

Claims (1)

A step of uniformly applying a synthetic resin material which becomes transparent after being cured on at least one surface of the glass substrate;
Heat curing the synthetic resin material applied to the glass substrate;
After the heat curing step, a step of stacking a plurality of glass substrates having a heat-cured resin and bonding them together with an adhesive,
A step of cutting a block obtained by bonding a plurality of glass substrates with heat-curing resin to a predetermined size to form a plurality of processing blocks;
Polishing and chamfering the processing block;
A method for producing a lid for electronic parts, comprising: removing the adhesive of the processing block to obtain a chip-shaped lid.

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