JP2005136705A - Bonding structure and bonding method for piezoelectric vibrator, piezoelectric device and its manufacturing method, and portable telephone set and electronic apparatus using piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding structure or the like capable of downsizing a piezoelectric device and bonding a piezoelectric vibrator to a substrate made of an insulating material so as to obtain sufficient bonding strength in a simple manufacturing process. <P>SOLUTION: A through hole 53 put through the end part of the piezoelectric vibrator 32 and a connecting electrode part 34 is formed from a first surface 34a being the surface of a connecting electrode part 34 facing a substrate electrode 31 to a second surface 34c being the surface of the connecting electrode part opposite to the first surface. A conductive adhesive 53 for bonding a substrate electrode part 31 to the connecting the electrode part 34 or the like is applied to the substrate electrode part 31, and the connecting electrode part 34 of the piezoelectric vibrator 32 is fixed to the applied conductive adhesive 53, and the conductive adhesive 43 is put through the through-hole 53, and a protruding part 43a protruding from the second surface 34c is formed, and the protruding part 43a is hardened with its external dimension larger than the internal dimension of the through-hole 53. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric vibrating piece bonding structure and bonding method, a piezoelectric device and a manufacturing method thereof, and a cellular phone device and an electronic apparatus using the piezoelectric device.

Piezoelectric vibrating piece housed in a package for small information devices such as HDDs (hard disk drives), mobile computers, IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems Piezoelectric devices such as vibrators and piezoelectric oscillators are widely used.
FIG. 12A is a schematic plan view showing a configuration example of such a piezoelectric device (see Patent Document 1). FIG. 12B is a schematic plan view showing a state where the piezoelectric vibrating piece is not mounted on the piezoelectric device of FIG. FIG. 12C is a schematic cross-sectional view taken along line AA in FIG.
In FIG. 12A, the piezoelectric device 1 accommodates a piezoelectric vibrating piece 3 inside a package 2. In this case, the package 2 is formed by forming an insulating material in a shallow box shape. After the piezoelectric vibrating reed 3 is accommodated and fixed inside, the package 2 is sealed by a lid (not shown).

  The package 2 is formed by molding, laminating and sintering a plurality of substrates made of ceramic green sheets, and a hole formed by removing the material at the time of molding is provided inside the package 2. Thus, a space for accommodating the piezoelectric vibrating piece 3 is formed.

The piezoelectric vibrating piece 3 is formed of a so-called AT-cut vibrating piece formed into a rectangular plate shape by etching, for example, quartz, and a driving excitation electrode 7 is formed on the surface. Connection electrodes 7 a and 7 a connected to the excitation electrode 7 are formed close to each other at one end in the longitudinal direction of the piezoelectric vibrating piece 3 and at both ends in the width direction. The excitation electrode 7 and the connection electrode portions 7 a and 7 a are provided on the front and back of the piezoelectric vibrating piece 3.
In the piezoelectric vibrating reed 3, connection electrode portions 7 a and 7 a provided on the base 3 a are joined to the package side in the internal space of the package 2.

Specifically, as shown in FIGS. 12B and 12C, electrodes 5 and 5 connected to a mounting electrode portion (not shown) provided on the bottom surface of the package 2 on the surface of the substrate 2a of the package 2. Further, electrode pads 6 and 6 are formed on the electrodes 5 and 5, respectively. The connection electrodes 7 a and 7 a shown in FIG. 12A provided on the electrode pads 6 and 6 and the base portion 3 a of the piezoelectric vibrating piece 3 are joined via conductive adhesives 8 and 8.
That is, the conductive adhesives 8, 8 are applied to the surfaces of the electrode pads 6, 6, and the piezoelectric vibrating reed 3 is pressed and mounted thereon, and the conductive adhesives 8, 8 are cured.

Here, in order to ensure the bonding strength of the piezoelectric vibrating piece 3, it is necessary to increase the bonding area where the conductive adhesive 8 adheres to the piezoelectric vibrating piece 3.
Therefore, if a sufficient amount of the conductive adhesives 8 and 8 are applied to the connection electrodes 7a and 7a, the bonding area becomes large. However, when the application amount of the conductive adhesive is increased, there is a problem that the connection electrodes 7a and 7a provided in a narrow interval flow in the width direction of the package 2 and are short-circuited.

  Therefore, in this conventional example, in order to secure the bonding strength of the piezoelectric vibrating reed 3 while restricting the conductive adhesive from spreading in the width direction of the package 2, the conductive adhesives 8 and 8 are connected to the connection electrode portion. It is applied not only between 7a, 7a and the electrode pads 6, 6, but also between the wall surface 2b of the package 2. As a result, the bonding area is increased and fixedly held. That is, slits 6a and 6a opened on the wall surface 2b side of the package 2 are provided on the electrode pads 6 and 6 so that the conductive adhesives 8 and 8 flow to the side surface 2b side. Thereby, the connection electrode is prevented from being short-circuited while securing a certain degree of connection strength.

  13 (a) and 13 (b), on the other hand, through holes 24, 24 are provided at the end of the piezoelectric vibrator 22 accommodated in a package (not shown), and lead pins 28, 28 are formed at the base 27. In this configuration, the piezoelectric vibrating piece 22 is fixed by the component 26 (see Patent Document 2). That is, as shown in FIG. 13B, the lead pin 28 of the component 26 is passed through the through hole 20a provided in the bottom surface of the package 20 and the through hole 24 of the piezoelectric vibrator 22, and the lead pin 28 and the piezoelectric vibrator 22 are connected. The piezoelectric vibrator 22 is fixed inside the package 20 by bonding with alloy solders 29, 29, 29, and 29.

JP2002-9576 JP 59-11022

  However, recently, with the spread of mobile phones and the like, higher strength performance is required for the bonding strength between the substrate electrode formed on the substrate of the piezoelectric device and the connection electrode of the piezoelectric vibrator. For example, in an impact test that has been performed in the past, it was sufficient to withstand a drop impact from a height of 750 mm with a single vibrator, but a higher position with a weight of about 100 to 150 grams (g) was applied. There is a demand for performance that requires joint strength to withstand impact. On the other hand, since the piezoelectric device and the piezoelectric vibrating piece inside the mobile phone and the like are also downsized, the application amount and the application area of the conductive adhesive are limited, and sufficient bonding strength can be ensured. It has become an issue.

In this regard, in the structure of FIG. 12, as shown in FIG. 12 (c), the conductive adhesives 8, 8 are formed on the surfaces of the electrode pads 6, 6, part of the surfaces of the electrode portions 5, 5, and the package 2. Are in contact with the wall surfaces 2b, 2b.
However, when viewing the connection electrodes 7a and 7a, the portions that contact the conductive adhesives 8 and 8 are only the surfaces on the electrode pads 6 and 6 side, and the bonding strength is insufficient.
Therefore, although the bonding strength of the conductive adhesives 8 and 8 to the package 2 side is ensured, the bonding strength between the conductive adhesives 8 and 8 and the connection electrodes 7a and 7a is insufficient. As a result, the bonding strength between the substrate electrode formed on the substrate of the piezoelectric device and the connection electrode of the piezoelectric vibrator is not sufficiently ensured.

  On the other hand, when the structure of FIG. 13 is adopted, as shown in FIG. 13B, a through hole is provided at the bottom of the package, and the strength of the package 2 may be insufficient. For this reason, if the thickness of the bottom portion of the package 2 is increased, the entire piezoelectric device becomes larger, which is against the demand for miniaturization. Furthermore, it is necessary to prepare the component 26 and join the lead pin 28 and the piezoelectric vibrator 22 with alloy solder, which complicates the manufacturing process.

  Accordingly, the present invention has been made to solve the above-described problems, and a sufficient bonding strength can be obtained with a simple manufacturing process while realizing miniaturization of a piezoelectric device that accommodates a piezoelectric vibrating piece in a package. An object of the present invention is to provide a joining structure for joining a piezoelectric vibrating piece to a base made of an insulating material, a joining method, a piezoelectric device and a manufacturing method thereof, and a mobile phone device and an electronic apparatus using the piezoelectric device.

  According to the first aspect of the present invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are bonded to the substrate electrode portion provided on the substrate formed of an insulating material. In the bonding structure, the end portion of the piezoelectric vibrating piece and the connection electrode portion are connected to a surface of the connection electrode portion from a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion. A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward the second surface which is a surface opposite to the first surface, and the substrate electrode portion includes: A conductive adhesive for bonding the substrate electrode portion and the connection electrode portion is applied, and the connection electrode portion of the piezoelectric vibrating piece is fixed to the applied conductive adhesive, The conductive adhesive penetrates through the through hole and is formed on the second surface. This is achieved by a joining structure of piezoelectric vibrating reeds, characterized in that the protruding portion is formed and the protruding portion is hardened by forming an outer dimension larger than the inner dimension of the through hole. .

According to the configuration of the first invention, the conductive adhesive applied to the substrate electrode portion is in contact with the first surface of the connection electrode portion, and further, the connection electrode portion and the inside of the through hole. Since they are in contact with each other, it is possible to secure a large contact area where the conductive adhesive contacts the connection electrode portion.
Here, since the contact area between the conductive adhesive and the connection electrode part is secured at least in the first surface of each connection electrode part and inside each through hole, the purpose is to secure bonding strength. As a result, it is not necessary to apply the conductive adhesive widely in a plane. For this reason, the connection electrodes which are close to each other with a narrow interval in the width direction are not short-circuited.
Furthermore, with downsizing, even when there is another electrode between the connection electrode and the package inner side wall, according to the configuration of the present invention, it is not necessary to widely apply the conductive adhesive in a plane, The connection electrode part and the other electrode are not short-circuited.

  Further, since the protruding portion is hardened by forming an outer dimension larger than the inner dimension of the through hole, the protruding portion is prevented from coming out from the opening on the first surface side of the through hole. For example, it plays a role like a rivet, and the substrate electrode part and the connection electrode part can be physically fixed.

  As a result, according to the present invention, the piezoelectric device that accommodates the piezoelectric vibrating piece in the package can be reduced in size, and the substrate electrode portion and the connection electrode portion can be sufficiently provided via the conductive adhesive. A bonding structure for bonding the piezoelectric vibrating piece to the base made of an insulating material can be provided so that the bonding strength can be obtained.

According to a second aspect of the present invention, in the configuration of the first aspect, the projecting portion has an outer dimension that is at least larger than an inner dimension of the opening on the first surface side of the through hole, or at least an opening on the second surface side. It is characterized by being hardened by forming an outer dimension larger than the inner dimension of the part.
In the configuration of the second invention, in the case where the protrusion is hardened by forming an outer dimension larger than at least the inner dimension of the opening on the first surface side of the through hole, the protrusion is For example, it serves as a rivet that prevents the first surface side from coming out of the opening.
And if the protrusion is hardened by forming an outer dimension larger than the inner dimension of the opening on the first surface side, it is sufficient to play the role of the rivet, so that it has less conductivity. Use of adhesive is sufficient. As a result, the weight of the piezoelectric device can be reduced.

  In the configuration of the second invention, when the protruding portion is hardened by forming an outer dimension larger than the inner dimension of the opening on the second surface side of the through hole, the protruding portion is It is in contact with the second surface of the connection electrode portion. As a result, a larger contact area can be ensured between the substrate electrode portion and the connection electrode portion, and electrical connection is achieved with better conductivity.

  According to the third aspect of the present invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are different from the substrate electrode portion provided on the substrate formed of an insulating material. In the joining structure to be joined, the end part of the piezoelectric vibrating piece and the connection electrode part are connected to the connection electrode part from a first surface that is a surface of the connection electrode part and faces the substrate electrode part. A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward a second surface that is a surface opposite to the first surface, and the substrate electrode portion Is coated with a conductive adhesive for joining the substrate electrode portion and the connection electrode portion, and the connection electrode portion of the piezoelectric vibrating piece is fixed to the applied conductive adhesive. The conductive adhesive penetrates through the through-hole and A protruding portion that protrudes on the surface is formed, and a conductive adhesive is further applied to the protruding portion to form an enlarged protruding portion, and the enlarged protruding portion has an inner dimension of the through hole. This is achieved by a piezoelectric vibrating piece joining structure characterized in that it is hardened by forming a large outer dimension.

According to the configuration of the third invention, the conductive adhesive applied to the substrate electrode part contacts the first surface of the connection electrode part, and contacts the connection electrode part inside the through hole. In addition, since the enlarged protrusion is reliably in contact with the second surface, a large contact area can be secured for the conductive adhesive to contact the connection electrode.
In addition, since the enlarged protrusion is hardened by forming an outer dimension larger than the inner dimension of the through hole, the enlarged protrusion functions as a rivet, for example, and the substrate electrode part and the connection electrode The part can be physically fixed.

Further, since the enlarged protrusion is formed by adding a conductive adhesive, the configuration of the conventional manufacturing apparatus is used without any change in order to form the enlarged protrusion. Can do.
As a result, according to the present invention, the piezoelectric device that accommodates the piezoelectric vibrating piece in the package can be reduced in size, and the substrate electrode portion and the connection electrode portion can be sufficiently provided via the conductive adhesive. A bonding structure for bonding the piezoelectric vibrating piece to the base made of an insulating material can be provided so that the bonding strength can be obtained.

  According to the fourth aspect of the present invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating reeds are different from the substrate electrode portions provided on the substrate formed of an insulating material. A piezoelectric device in which the piezoelectric vibrating piece is accommodated in a package including the substrate by being bonded to the end portion of the piezoelectric vibrating piece and the connection electrode portion on the surface of the connection electrode portion. From the first surface facing the substrate electrode portion toward the second surface which is the surface of the connection electrode portion and opposite to the first surface, the end of the piezoelectric vibrating piece and A through-hole penetrating the connection electrode portion is formed, and a conductive adhesive for bonding the substrate electrode portion and the connection electrode portion is applied to the substrate electrode portion, and this is applied The conductive adhesive has a front of the piezoelectric vibrating piece. The connection electrode portion is fixed, and the conductive adhesive penetrates the through hole and forms a protruding portion that protrudes to the second surface, and the protruding portion has an inner dimension of the through hole. This is achieved by a piezoelectric device characterized in that it is hardened to form large outer dimensions.

  In the fifth aspect of the present invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are different from the substrate electrode portion provided on the substrate formed of an insulating material. A piezoelectric device in which the piezoelectric vibrating piece is accommodated in a package including the substrate by being bonded to the end portion of the piezoelectric vibrating piece and the connection electrode portion on the surface of the connection electrode portion. From the first surface facing the substrate electrode portion toward the second surface which is the surface of the connection electrode portion and opposite to the first surface, the end of the piezoelectric vibrating piece and A through-hole penetrating the connection electrode portion is formed, and a conductive adhesive for bonding the substrate electrode portion and the connection electrode portion is applied to the substrate electrode portion, and this is applied The conductive adhesive has a front of the piezoelectric vibrating piece. A connecting electrode portion is fixed, and the conductive adhesive forms a protruding portion that penetrates the through hole and protrudes to the second surface, and further to the protruding portion, the conductive adhesive Is applied to form an enlarged protrusion, which is achieved by a piezoelectric device, wherein the enlarged protrusion is hardened to form an outer dimension larger than an inner dimension of the through-hole. .

  According to the sixth aspect of the present invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating reed are provided for the substrate electrode portions provided on the substrate formed of an insulating material. In the joining method of joining, the end of the piezoelectric vibrating piece and the connection electrode part are connected to the surface of the connection electrode part from the first surface that is the surface of the connection electrode part and faces the substrate electrode part. A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward the second surface which is a surface opposite to the first surface, and the substrate electrode portion and the connection electrode are formed. Applying a conductive adhesive for joining parts to the base electrode part, and placing the conductive electrode applied to the substrate electrode part while pressing the connection electrode part of the piezoelectric vibrating piece, By passing the conductive adhesive through the through-hole, the first It is achieved by a method for joining piezoelectric vibrating reeds, characterized in that a protrusion protruding on the surface is formed, and the protrusion is formed to have an outer dimension larger than the inner dimension of the through hole and cured. The

According to the configuration of the sixth invention, the conductive adhesive applied to the substrate electrode part is brought into contact with the first surface of the connection electrode part, and is brought into contact with the connection electrode part inside the through hole. Therefore, it is possible to secure a large contact area where the conductive adhesive contacts the connection electrode portion.
In addition, since the protrusion is hardened by forming an outer dimension larger than the inner dimension of the through hole, the protrusion functions as a rivet, for example, and the substrate electrode part and the connection electrode part are connected to each other. Can be physically fixed.
As a result, according to the present invention, the piezoelectric device that accommodates the piezoelectric vibrating piece in the package can be reduced in size, and the substrate electrode portion and the connection electrode portion can be sufficiently provided via the conductive adhesive. It is possible to provide a bonding method for bonding the piezoelectric vibrating piece to the base made of an insulating material so that the bonding strength can be obtained.

  According to the seventh aspect of the present invention, there is provided a conductive material for the forming step of forming the piezoelectric vibrating piece and the substrate electrode portion provided on the substrate of the package for housing the piezoelectric vibrating piece. An application step of applying an adhesive, a bonding step of bonding connection electrode portions provided on both ends of the substrate electrode portion and the width direction of the piezoelectric vibrating piece, and a sealing step of hermetically sealing the package, In the forming step, the connection electrode portion is connected to the end portion of the piezoelectric vibrating piece and the connection electrode portion from the first surface that is the surface of the connection electrode portion and faces the substrate electrode portion. A through hole penetrating the end of the piezoelectric vibrating piece and the connection electrode portion toward the second surface, which is the surface opposite to the first surface, and in the joining step, Application to the substrate electrode part in the application process The conductive adhesive protrudes to the second surface by placing the connection electrode portion of the piezoelectric vibrating piece on the conductive adhesive while pushing the conductive adhesive through the through hole. This is achieved by a method for manufacturing a piezoelectric device, characterized in that a protrusion is formed, and the protrusion is formed to have an outer dimension larger than the inner dimension of the through hole and cured.

  In the eighth aspect of the invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are provided for the substrate electrode portions provided on the substrate formed of an insulating material. In the joining method of joining, the end of the piezoelectric vibrating piece and the connection electrode part are connected to the surface of the connection electrode part from the first surface that is the surface of the connection electrode part and faces the substrate electrode part. A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward the second surface which is a surface opposite to the first surface, and the substrate electrode portion and the connection electrode are formed. A conductive adhesive for joining the parts is applied to the substrate electrode part, and is placed on the applied conductive adhesive while pressing the connection electrode part of the piezoelectric vibrating piece. Protrusions to the second surface by penetrating the conductive adhesive And forming an enlarged protrusion by further applying a conductive adhesive to the protrusion, and forming the enlarged protrusion to have an outer dimension larger than the inner dimension of the through hole. This is achieved by a method for joining piezoelectric vibrating reeds characterized by being cured.

For this reason, the conductive adhesive applied to the substrate electrode part is brought into contact with the first surface of the connection electrode part, and is brought into contact with the connection electrode part inside the through hole. Is reliably in contact with the second surface, it is possible to ensure a large contact area where the conductive adhesive contacts the connection electrode portion.
In addition, since the enlarged protrusion is hardened by forming an outer dimension larger than the inner dimension of the through hole, the enlarged protrusion functions as a rivet, for example, and the substrate electrode part and the connection electrode The part can be physically fixed.

Furthermore, since the enlarged protrusion is formed by additionally applying a conductive adhesive, it can be used without changing the configuration of the conventional manufacturing apparatus in order to form the enlarged protrusion.
As a result, according to the present invention, the piezoelectric device that accommodates the piezoelectric vibrating piece in the package can be reduced in size, and the substrate electrode portion and the connection electrode portion can be sufficiently provided via the conductive adhesive. It is possible to provide a bonding method for bonding the piezoelectric vibrating piece to the base made of an insulating material so that the bonding strength can be obtained.

  According to the ninth aspect of the present invention, in the ninth aspect of the invention, the step of forming the piezoelectric vibrating piece and the substrate electrode portion provided on the substrate of the package for housing the piezoelectric vibrating piece are electrically conductive. An application step of applying an adhesive, a bonding step of bonding a plurality of connection electrode portions provided at an end portion of the substrate electrode portion and the piezoelectric vibrating piece, and a sealing step of hermetically sealing the package In the forming step, the end of the piezoelectric vibrating piece and the connection electrode portion are connected to the surface of the connection electrode portion from the first surface that is the surface of the connection electrode portion and faces the substrate electrode portion. And forming a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is a surface opposite to the first surface, and in the joining step, The conductive material applied to the substrate electrode part in the application process By placing the connection electrode portion of the piezoelectric vibrating piece on the adhesive while pressing, and passing the conductive adhesive through the through-hole, the conductive adhesive protrudes from the second surface. Forming an enlarged protruding portion by applying a conductive adhesive to the protruding portion, and forming the enlarged protruding portion so as to have an outer dimension larger than an inner dimension of the through-hole. This is achieved by a method for manufacturing a piezoelectric device, characterized in that

  According to the tenth aspect of the present invention, the connection electrode portions provided at both ends of the piezoelectric vibrating piece are bonded to the substrate electrode portion provided on the substrate formed of an insulating material. Accordingly, a mobile phone device using a piezoelectric device in which the piezoelectric vibrating piece is accommodated in a package including the substrate, wherein the connection electrode portion is provided at an end portion of the piezoelectric vibrating piece and the connection electrode portion. From the first surface facing the substrate electrode portion toward the second surface that is the surface of the connection electrode portion and opposite to the first surface. A through-hole penetrating the end portion and the connection electrode portion is formed, and a conductive adhesive for bonding the substrate electrode portion and the connection electrode portion is applied to the substrate electrode portion. This applied conductive adhesive The connection electrode portion of the piezoelectric vibrating piece is fixed, and the conductive adhesive forms a protruding portion that penetrates the through hole and protrudes to the second surface, and the protruding portion is the through hole. This is achieved by a mobile phone device characterized in that a control clock signal is obtained by a piezoelectric device which is hardened by forming an outer dimension larger than the inner dimension of the hole.

  Furthermore, in the eleventh aspect of the invention, the connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating reed are provided on the substrate electrode portion provided on the substrate formed of an insulating material. An electronic apparatus using a piezoelectric device that is configured to accommodate the piezoelectric vibrating piece in a package including the substrate by being bonded to the end portion of the piezoelectric vibrating piece and the connection electrode portion. The piezoelectric vibration from the first surface facing the substrate electrode portion toward the second surface that is the surface of the connection electrode portion and the surface opposite to the first surface. A through-hole penetrating the end portion of the piece and the connection electrode portion is formed, and a conductive adhesive for bonding the substrate electrode portion and the connection electrode portion is applied to the substrate electrode portion. And this applied conductive adhesive The connection electrode portion of the piezoelectric vibrating piece is fixed, and the conductive adhesive forms a protruding portion that penetrates the through hole and protrudes to the second surface. Is achieved by an electronic device characterized in that a control clock signal is obtained by a piezoelectric device that is hardened by forming an outer dimension larger than an inner dimension of the through hole.

(First embodiment)
1 and 2 show a first embodiment of a piezoelectric device according to the present invention. FIG. 1 is a schematic plan view thereof, and FIG. 2 is a schematic cross-sectional view taken along line BB of FIG.
1 and 2, the piezoelectric device 30 shows an example in which a crystal resonator is configured. The piezoelectric device 30 accommodates a piezoelectric vibrating piece 32, for example, a crystal vibrating piece in a package 36. . The manufacturing method of the package 36 will be briefly described. For example, a plurality of substrates formed by forming an aluminum oxide ceramic green sheet as an insulating material are stacked and then sintered. Each of the plurality of substrates is formed with a predetermined hole on the inner side thereof, so that a predetermined internal space S2 is formed on the inner side when stacked.
The internal space S2 is a housing space for housing the piezoelectric vibrating piece 32.
That is, as shown in FIG. 2, in this embodiment, the package 36 is formed by, for example, stacking the first laminated substrate 51 and the second laminated substrate 52 from below.
Unlike the present embodiment, the package may be formed of a material other than the ceramic green sheet.

In the inner space S2 of the package 36, in the vicinity of the left end portion, the first laminated substrate 51, which is a package substrate that is exposed to the inner space S2 and forms the inner bottom portion, is, for example, nickel-plated and gold-plated on tungsten metallization. Substrate electrode portions 31, 31 formed in (1) are provided.
The substrate electrode portions 31, 31 are connected to the outside and supply a drive voltage. For this reason, the substrate electrode portions 31, 31 are mounted terminals 48, 49 formed exposed on the bottom surface of the package 36. And are electrically connected.

  The package 36 is not limited to such a shallow box shape. For example, a shallow box-shaped lid (not shown) is placed on the first substrate 51 which is a package substrate, with the opening facing downward. Various forms of packages can be used, such as a form in which a piezoelectric vibrating piece is housed inside and sealed so as to face down.

A lid (also referred to as a lid) 39 is joined to the open upper end of the package 36 by using a low melting point glass 33 to seal the package 36. The lid 39 may be formed of a metal such as ceramics or Kovar. In this embodiment, preferably, after sealing and fixing to the package 36, the laser beam L2 is externally applied as shown in FIG. In order to adjust the frequency by the mass reduction method by irradiating the metal coating portion (not shown) of the piezoelectric vibrating piece 32, the piezoelectric vibrating piece 32 is made of a material that transmits light, particularly thin glass.
As a glass material suitable for the lid 39, for example, borosilicate glass is used, for example, as a thin glass manufactured by the downdraw method.

In the present embodiment, the piezoelectric vibrating piece 32 is formed of quartz, and a so-called AT-cut vibrating piece obtained by cutting a quartz wafer into a rectangle according to a predetermined orientation is used.
Note that, unlike the present embodiment, the piezoelectric vibrating piece 32 may use a piezoelectric material such as lithium tantalate or lithium niobate.

  As shown in FIGS. 1 and 2, excitation electrodes 45 and 45 are formed on the main surface, that is, the front surface and the back surface of the rectangular piezoelectric vibrating piece 32. Further, connection electrode portions 34 and 35 are respectively provided at both ends in the width direction on the base 46 side of the piezoelectric vibrating piece 32, and each of the connection electrode portions 34 and 35 extends from the surface of the piezoelectric vibrating piece 32 to the peripheral portion. Are formed in the same form on the back surface. These connection electrode portions 34 and 35 are integrally connected to the excitation electrodes 45 and 45.

  As shown in FIG. 2, the end portion 46 and the connection electrode portion 34 of the piezoelectric vibrating piece 32 are connected to the connection electrode portion 34 from a first surface 34 a that is the surface of the connection electrode portion 34 and faces the substrate electrode portion 31. A through-hole 53 that penetrates the base 46 and the connection electrode portion 34 of the piezoelectric vibrating piece 32 is formed toward the second surface 34c that is the surface opposite to the second surface 34a. A through-hole 53 is similarly formed in the connection electrode portion 35. However, since the connection electrode portion 35 has the same configuration as the connection electrode portion 34, description thereof will be omitted as appropriate.

Then, a conductive adhesive 43 as a mounting agent for joining the substrate electrode portion 31 and the connection electrode portion 34 is applied on the substrate electrode portion 31, and the piezoelectric vibrating piece 32 is applied on the conductive adhesive 43. The connecting electrode portion 34 is placed and fixed.
In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component that exhibits a bonding force can be used containing conductive particles such as fine silver (Ag) particles, Silicone, epoxy or polyimide conductive adhesives can be used.

  As shown in FIG. 2, the conductive adhesive 43 penetrates the through hole 53 and forms a protruding portion 43 a that protrudes to the second surface 34 c of the connection electrode portion 34. The protrusion 43 a is hardened by forming an outer dimension larger than the inner dimension of the through hole 53.

According to the above configuration, the conductive adhesive 43 applied to the substrate electrode portion 31 is in contact with the first surface 34 a of the connection electrode portion 34, and further, the through-hole-side surface of the connection electrode portion inside the through-hole 53. Since it is in contact with 34b, it is possible to secure a large contact area where the conductive adhesive 43 comes into contact with the connection electrode portion 34.
Here, the contact area between the conductive adhesive 43 and the connection electrode portions 34, 35 is ensured at least in the first surfaces 34 a of the connection electrode portions 34, 35 and in the through holes 53, 53. For the purpose of securing the bonding strength, it is not necessary to apply the conductive adhesive 43 widely in a plane. For this reason, the connection electrodes 34 and 35 that are close to each other in the width direction are not short-circuited.

  Moreover, since the protrusion 43a of the conductive adhesive 43 is hardened by forming an outer dimension larger than the inner dimension of the through hole 53, the protrusion 43a is prevented from falling off from the first surface 34a. The substrate electrode part 31 and the connection electrode parts 34 and 35 can be physically fixed.

  As described above, according to the present embodiment, the piezoelectric device that accommodates the piezoelectric vibrating piece 32 in the package 36 can be reduced in size, and the substrate electrode portion 31 and the connection electrode portion 34 can be provided via the conductive adhesive 43. , 35 can be provided with a bonding structure for bonding the piezoelectric vibrating piece 32 to a substrate made of an insulating material.

Here, the piezoelectric vibrating piece 32 is not limited to the AT-cut vibrating piece, for example, a base portion fixed to the package 36 side, and a pair of base portions extending in parallel toward one side with the base portion as a base end. A so-called tuning fork-type piezoelectric vibrating piece (not shown) that includes a vibrating arm and is shaped like a tuning fork as a whole can also be used. It is also possible to use a so-called convex-type vibrating piece (not shown) or the like in which the short sides at both ends of the AT-cut vibrating piece as shown in FIGS. 1 and 2 are thinly formed.
In the case of an AT cut vibrating piece, a so-called inverted mesa structure is particularly effective. In other words, the bonding strength between the substrate electrode portion 31 and the connection electrode portions 34 and 35 can be ensured without applying the conductive adhesive 43 widely in a planar manner, so that the vibration surface has a reverse mesa structure with a concave shape. In the piezoelectric vibrator, the region where the conductive adhesive 43 can be applied is limited to the outer peripheral portion of the vibration surface. The structure is particularly advantageous.

The piezoelectric device 30 of the present embodiment is configured as described above. Next, an example of a manufacturing method thereof will be described mainly with reference to FIGS.
FIG. 3 is a flowchart showing an example of a method for manufacturing the piezoelectric device 30, and FIG. 4 is a schematic plan view of the piezoelectric vibrating piece 32. FIG. 5 is a flowchart illustrating an example of a mounting process that is a part of the method for manufacturing the piezoelectric device 30. FIG. 6 is a schematic diagram showing each process corresponding to each of steps ST121 to ST124 in FIG.

(Formation process)
First, the package 36 is formed (ST11) by the manufacturing method described above with reference to FIGS. 1 and 2 and prepared, and separately from this, the lid 39 is formed (ST211).
Next, in step ST111, which is the first stage of the formation process for forming the piezoelectric vibrating piece, the quartz crystal wafer is cut into a rectangle according to a predetermined orientation, and the so-called AT-cut vibrating piece 32 shown in FIG. obtain. Then, for example, a through hole is formed in the quartz wafer by drilling or etching. As a result, as shown in FIG. 4A, the through holes 53 and 53 are formed at both ends in the width direction of the piezoelectric vibrating piece 32, respectively.

Unlike the present embodiment, in step ST111, which is the first stage of the formation process, first, a through hole is formed in the quartz wafer by drilling or etching, and then the quartz wafer is rectangular according to a predetermined orientation. The piezoelectric vibrating piece 32 shown in FIG. 1 which is a so-called AT-cut vibrating piece may be obtained.
Moreover, the shape of the opening of the through holes 53 is not limited to a circle. For example, unlike the present embodiment, an elliptical shape may be used as shown in FIG. 4B, or a rectangular shape opened to the long side of the vibrating piece 32 as shown in FIG. 4C.

Next, in step ST112, which is the second stage of the formation process, the excitation electrodes 45 and 45 described above are formed on the piezoelectric vibrating piece 32, and the connection electrode portions 34 and 35 are formed at both ends in the width direction of the piezoelectric vibrating piece 32, respectively. . Excitation electrodes 45 and 45 and connection electrode portions 34 and 35 are formed by, for example, a base metal layer made of chromium or the like and a silver (Ag) or gold (Au) layer by sputtering in sequence and a photo process using a mask. To do.
Accordingly, as shown in FIG. 6B, the end portion 46 and the connection electrode portion 34 of the piezoelectric vibrating piece 32 are separated from the first surface 34 a that is the surface of the connection electrode portion 34 and faces the substrate electrode portion 31. A through-hole 53 penetrating the end 46 of the piezoelectric vibrating piece 32 and the connection electrode portion 34 is directed toward the second surface 34c which is the surface of the connection electrode portion 34 and the surface opposite to the second surface 34a. It is formed. Although not shown, a through hole 53 is similarly formed in the connection electrode portion 35.
Then, if necessary, in step ST113, a driving voltage is applied to the piezoelectric vibrating piece 32, the frequency is measured, an electrode film is added, or a part thereof is trimmed with a laser beam or the like, thereby roughening the frequency. Make adjustments.

Next, in step ST <b> 12, the piezoelectric vibrating piece 32 is mounted on the prepared package 36. This mounting process will be described in detail with reference to FIGS.
(Coating process)
First, step ST121 is a conductive adhesive application step, and the conductive adhesive 43 is dropped onto the substrate electrode portion 31 provided on the substrate of the package 36 by using a syringe or a nozzle (not shown). As shown in FIG. 6A, a conductive adhesive 43 for bonding the substrate electrode part 31 and the connection electrode part 34 is applied.

(Joining process)
Next, in step ST122 which is the first stage of the joining process, the piezoelectric vibrating piece 32 held by the head of the mounting apparatus (not shown) is placed on the conductive adhesive 43 while being pressed. Specifically, as shown in FIG. 6B, the connection electrode portion 34 formed on the base portion 46 of the piezoelectric vibrating piece 32 is positioned on the conductive adhesive 43 applied in step ST121, and mounting (not shown) is performed. The piezoelectric vibrating piece 32 is placed while being pressed in the direction of arrow X1 in FIG. As a result, the conductive adhesive 43 is passed through the through hole 53 to form a protruding portion 43 a that protrudes from the second surface of the connection electrode portion 34.

Next, in step ST123, which is the second stage of the joining process, as shown in FIG. 6D, the protrusion 43a of the conductive adhesive 43 is pressed in the direction of the arrow X2 with a jig of a mounting device (not shown). . Thereby, as shown in FIG.6 (e), the protrusion part 43a of the conductive adhesive 43 forms an outer dimension larger than the inner dimension of the through-hole 53, for example, becomes a mushroom shape (ST124).
Next, the conductive adhesive 43 is cured by a curing device (not shown).
Note that the connection electrode portion 35 and the substrate electrode portion 31 in FIG. 1 are simultaneously joined in the same manner as the connection electrode portion 34 and the substrate electrode portion 31 described above.

(Sealing process)
Next, in step ST13 of FIG. 3 which is a sealing process, as described in FIGS. 1 and 2, the sealing material 33 is used for the package 36 in a vacuum or in an inert gas atmosphere such as nitrogen. The package 36 is hermetically sealed by sealing the lid 39.
Next, in step ST14, as described with reference to FIG. 2, frequency adjustment is performed to complete the piezoelectric vibrator (ST15).

With the above manufacturing method, the conductive adhesive 43 applied to the substrate electrode part 31 in step ST121 is in contact with the first surface 34a of the connection electrode part 34, and further, the through hole of the connection electrode part is formed inside the through hole 53. Since it is in contact with the side surface 34b, a large contact area where the conductive adhesive 43 comes into contact with the connection electrode portion 34 can be secured.
Here, the contact area between the conductive adhesive 43 and the connection electrode portions 34, 35 is ensured at least in the first surfaces 34 a of the connection electrode portions 34, 35 and in the through holes 53, 53. For the purpose of securing the bonding strength, it is not necessary to apply the conductive adhesive 43 widely in a plane. For this reason, the connection electrodes 34 and 35 that are close to each other in the width direction are not short-circuited.

  Moreover, since the protrusion 43a of the conductive adhesive 43 is hardened by forming an outer dimension larger than the inner dimension of the through hole 53, the protrusion 43a is prevented from falling off from the first surface 34a. The substrate electrode part 31 and the connection electrode parts 34 and 35 can be physically fixed.

  In the process of applying the conductive adhesive 43, conductive particles such as silver (Ag) fine particles constituting the conductive adhesive 43 are located inside the conductive adhesive 43 and are used as adhesive components. Even if the synthetic resin is located outside the conductive adhesive 43, the conductive adhesive 43 penetrates through the through-hole 53 while contacting the through-hole side surface 34b of the connection electrode portion 34 and rubbing each other. Silver (Ag) fine particles and the like are exposed to the outside in the course of sliding of the conductive adhesive 43, and the conduction performance is improved between the conductive adhesive 43 and the connection electrode portion 34.

In step ST124 of FIG. 5, the protrusion 43a of the conductive adhesive 43 forms an outer dimension larger than the inner dimension of the through hole 53. At this time, the protrusion 43a is at least the first of the through hole. It is only necessary that the outer dimension larger than the inner dimension of the opening on the one surface side is formed and cured.
If the protrusion 43a is hardened by forming at least an outer dimension larger than the inner dimension of the opening on the first surface 34a side of the through hole 53, the protrusion 43a can be removed from the opening on the first surface 34a side. This is because it is sufficient to prevent, for example, the role of rivets.
Thereby, it is sufficient to use less conductive adhesive, and the weight of the piezoelectric device can be reduced.

  Further, in step ST124 of FIG. 3, when the protrusion 43a is hardened by forming an outer dimension larger than the inner dimension of the opening on the second surface 34c side of the through hole, the protrusion 43a is connected. It comes into contact with the second surface 34c of the electrode part 34. As a result, a larger contact area can be ensured between the substrate electrode portion 31 and the connection electrode portion 34, and better conduction performance can be obtained.

(First modification of the first embodiment)
FIG. 4B is a diagram showing a first modification of the first embodiment. The shape of the through holes 54 is an ellipse whose major axis is the long side direction of the piezoelectric vibrating piece 32. Thereby, even if the opening areas of 54 and 54 are the same as the circular through holes 53 and 53 shown in FIG. 4A, the distance W2 between the through holes 54 and 54 is reduced to the through hole of FIG. It can be set larger than the distance W1 between 53 and 53.
For this reason, even if the application amount of the conductive adhesive 43 is larger than that in the first embodiment, the distance W1 is larger than the distance W2, so that, for example, the conductivity protruding on the second surface of one connection electrode portion 34 is increased. The protruding portion 43 a of the adhesive 43 does not come into contact with the other connection electrode portion 35.
Thereby, the application amount of the conductive adhesive 43 is increased more than the first embodiment without short-circuiting the connection electrodes 34 and 35 that are close to each other at a narrow interval in the width direction, and the bonding strength is increased. Furthermore, it can be secured.

(Second modification of the first embodiment)
FIG. 4 (c) is a diagram illustrating a second modification of the first embodiment. The shape of the through holes 55 and 55 is a rectangle that is opened to the long side of the piezoelectric vibrating piece 32.
For this reason, since the conductive adhesive 43 flows from the side where the through holes 55, 55 are released to the long side of the piezoelectric vibrating piece 32, for example, the conductive adhesive 43 protrudes to the second surface of one connection electrode portion 34. The protruding portion 43 a of the adhesive 43 does not come into contact with the other connection electrode portion 35.
Thereby, the conductive adhesive 43 is increased more than the first embodiment without short-circuiting the connection electrodes 34 and 35 that are close to each other at a narrow interval in the width direction, thereby further ensuring the bonding strength. be able to.

(Third modification of the first embodiment)
FIG. 7 is a diagram illustrating a third modification of the first embodiment.
In this modification, step ST123 in FIG. 5 for pressing the conductive adhesive 43 in the first embodiment is omitted.
Even if step ST123 is omitted, by controlling the viscosity of the conductive adhesive 43, the piezoelectric vibrating piece 32 is pressed in step ST122 in FIG. 5 to form the protrusion 43a, as shown in FIG. The protruding portion 43 a can form an outer dimension larger than the inner dimension of the through hole 53.
Further, in the process of curing the conductive adhesive 43 by a curing device (not shown), the conductive adhesive 43 is controlled during the time from the start of curing until the conductive adhesive 43 is completely cured by controlling the curing conditions. The second surface 34 c of the connection electrode portions 34, 35 flows, and the protrusion 43 a can form an outer dimension larger than the inner dimension of the through hole 53.
According to this modification, a part of the manufacturing steps can be omitted compared to the first embodiment, so that the production efficiency can be increased.

(Fourth modification of the first embodiment)
FIG. 8 is a diagram illustrating a fourth modification of the first embodiment.
In this modification, the inner dimension of the opening on the first surface 34a side of the connection electrode part 34 of the through hole 53 is smaller than the inner dimension of the opening on the second surface 34c side.
For this reason, the inside dimension of the through-hole 53 increases from the first surface 34a toward the second surface 34c as shown in FIG. This means that the surface area of the connection electrode portion 34b constituting the inner wall of the through hole 53 is larger than that in the case where the inner dimension inside the through hole 53 is the same from the first surface 34a to the second surface 34b.
Therefore, a larger contact area where the conductive adhesive 43 comes into contact with the connection electrode portion 34 can be secured inside the through hole 53.

(Fifth modification of the first embodiment)
FIG. 9 is a diagram illustrating a fifth modification of the first embodiment.
In this modification, the inner dimension of the opening on the first surface 34a side of the connection electrode portion 34 of the through hole 53 is larger than the inner dimension of the opening on the second surface 34c side.
For this reason, according to this modification, the contact area where the conductive adhesive 43 contacts the connection electrode portion 34 can be ensured larger in the through hole 53 as in the second modification.

(Second Embodiment)
FIG. 10 is a schematic plan view for explaining the second embodiment of the method of joining the piezoelectric vibrating reed 32 of the piezoelectric device 30. Except for the configuration shown in the figure, the second embodiment is the same as the first embodiment. Since the part which attached | subjected the code | symbol same as a form is a common structure, the overlapping description is abbreviate | omitted and it demonstrates below centering on difference.

The second embodiment is different from the first embodiment in that a conductive adhesive is further applied to the protrusion 43a to form an enlarged protrusion 143, and the enlarged protrusion 143 is That is, the outer dimension larger than the inner dimension of the through hole 53 is formed and cured.
Specifically, in FIG. 5 which is a flowchart showing the manufacturing method of the first embodiment, step ST123 for pressing the conductive adhesive 43 is omitted, and instead of step ST123, the protrusion 43a is further expanded. Apply conductive adhesive. Specifically, this additional conductive adhesive is applied and cured so as to form an enlarged protrusion 143 (also referred to as conductive adhesive 143) having an outer dimension larger than the inner diameter of the through-hole 53. .
Note that the non-conductive adhesive may be used for the enlarged protrusion 143.

According to the present embodiment, the conductive adhesive 43 applied to the substrate electrode portion 31 is in contact with the first surface 34 a of the connection electrode portion 34, and the through hole side surface 34 b of the connection electrode portion inside the through hole 53. Furthermore, since the enlarged protrusion 143 is reliably in contact with the second surface 34c, a large contact area can be secured for the conductive adhesives 43 and 143 to contact the connection electrode 34.
Further, since the enlarged protrusion 143 is hardened by forming an outer dimension larger than the inner dimension of the through-hole 53, the enlarged protrusion 143 serves as a rivet, for example, and the substrate electrode part 31 and the connection electrode part 34 can be physically fixed.

Furthermore, since the enlarged protrusion 143 is formed by additionally applying a conductive adhesive, the configuration of the conventional manufacturing apparatus is used without any change in order to form the enlarged protrusion 143. Can do.
Thus, according to the present embodiment, the substrate electrode unit 31 and the connection electrode can be connected via the conductive adhesives 43 and 143 while realizing the miniaturization of the piezoelectric device that accommodates the piezoelectric vibrating piece 32 in the package 36. It is possible to provide a bonding structure in which the piezoelectric vibrating piece 32 is bonded to a base made of an insulating material so that sufficient bonding strength between the portions 34 can be obtained.

FIG. 11 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention.
In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for setting the received content as voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation / demodulation unit of the transmission / reception signal. A controller (CPU) 301 is provided.
The controller 301 is an information input / output unit 302 including an LCD as an image display unit and operation keys for inputting information in addition to modulation and demodulation of transmission / reception signals, and a memory which is an information storage unit including a RAM, a ROM, etc. 303 is controlled. Therefore, the piezoelectric device 30 is attached to the controller 301, and the output frequency is used as a clock signal suitable for the control content by a predetermined frequency dividing circuit (not shown) built in the controller 301. Has been. The piezoelectric device 30 attached to the controller 301 may not be a single piezoelectric device 30 but may be an oscillator that combines the piezoelectric device 30 and a predetermined frequency dividing circuit.

The controller 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmission unit 307 and the reception unit 306. As a result, even if the basic clock from the controller 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.
As described above, by using the piezoelectric device 30 according to the above-described embodiment in an electronic apparatus such as the digital cellular phone device 300, the piezoelectric vibrating piece is correctly fixed in the package. A high digital cellular phone device 300 can be obtained.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to all piezoelectric devices as long as the piezoelectric vibrating piece is accommodated in the package, regardless of the name of the crystal resonator, the crystal oscillator, or the like.

The schematic plan view which shows embodiment of the piezoelectric device of this invention. The BB schematic sectional drawing of FIG. The flowchart which shows an example of the manufacturing process of the piezoelectric device of FIG. 1 is a schematic plan view showing a piezoelectric vibrating piece of the present invention. The flowchart which shows an example of the mounting process of the piezoelectric device of FIG. The figure which shows a part of manufacturing process of the piezoelectric device of FIG. The figure which shows a part of manufacturing process of the piezoelectric device of FIG. The figure which shows a part of manufacturing process of the piezoelectric device of FIG. The figure which shows a part of manufacturing process of the piezoelectric device of FIG. The figure which shows a part of manufacturing process of the piezoelectric device of FIG. 1 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a piezoelectric device according to an embodiment of the present invention. Schematic which shows the well-known structural example of a piezoelectric device. Schematic which shows the other well-known fixing method.

Explanation of symbols

30 ... Piezoelectric device, 31, 31 ... Substrate electrode part, 32 ... Piezoelectric vibrating piece,
34, 35 ... connecting electrode part, 36 ... package, 43 ... conductive adhesive, 53, 53 ... through hole

Claims (11)

A bonding structure in which connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are bonded to a substrate electrode portion provided on a substrate formed of an insulating material,
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface,
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part, and the connection electrode of the piezoelectric vibrating piece is applied to the applied conductive adhesive. Part is fixed,
The conductive adhesive forms a protruding portion that penetrates the through hole and protrudes to the second surface;
The bonding structure of the piezoelectric vibrating piece, wherein the protrusion is hardened by forming an outer dimension larger than an inner dimension of the through hole.   The protrusion is cured by forming at least an outer dimension larger than an inner dimension of the opening on the first surface side of the through hole or at least an outer dimension larger than an inner dimension of the opening on the second surface side. The piezoelectric vibrating piece joining structure according to claim 1, wherein: A bonding structure in which connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece are bonded to a substrate electrode portion provided on a substrate formed of an insulating material,
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface.
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part, and the connection electrode of the piezoelectric vibrating piece is applied to the applied conductive adhesive. Part is fixed,
The conductive adhesive penetrates the through hole and forms a protruding portion protruding on the second surface;
A conductive adhesive is further applied to the protruding portion to form an enlarged protruding portion,
The joining structure of a piezoelectric vibrating piece, wherein the enlarged protrusion is hardened by forming an outer dimension larger than an inner dimension of the through hole. By connecting connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece to a substrate electrode portion provided on a substrate formed of an insulating material, the piezoelectric vibrating piece is attached to a package including the substrate. A piezoelectric device adapted to contain
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface.
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part, and the connection electrode of the piezoelectric vibrating piece is applied to the applied conductive adhesive. Part is fixed,
The conductive adhesive penetrates the through hole and forms a protruding portion protruding on the second surface;
The piezoelectric device is characterized in that the protrusion is cured by forming an outer dimension larger than an inner dimension of the through hole. By connecting connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece to a substrate electrode portion provided on a substrate formed of an insulating material, the piezoelectric vibrating piece is attached to a package including the substrate. A piezoelectric device adapted to contain
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface.
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part, and the connection electrode of the piezoelectric vibrating piece is applied to the applied conductive adhesive. Part is fixed,
The conductive adhesive penetrates the through hole and forms a protruding portion protruding on the second surface;
A conductive adhesive is further applied to the protruding portion to form an enlarged protruding portion,
The piezoelectric device is characterized in that the enlarged protrusion is hardened by forming an outer dimension larger than an inner dimension of the through hole. A bonding method for bonding connection electrode portions respectively provided at both ends in the width direction of a piezoelectric vibrating piece to a substrate electrode portion provided on a substrate formed of an insulating material,
From the first surface that is the surface of the connection electrode portion and that faces the substrate electrode portion, to the end portion of the piezoelectric vibrating piece and the connection electrode portion, the surface of the connection electrode portion and the first surface A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward the second surface, which is the opposite surface,
Applying a conductive adhesive for joining the substrate electrode part and the connection electrode part to the base electrode part,
Place on the conductive adhesive applied to the substrate electrode portion while pressing the connection electrode portion of the piezoelectric vibrating piece,
Forming a protruding portion protruding on the second surface by passing the conductive adhesive through the through hole;
The method of joining piezoelectric vibrating reeds, wherein the protruding portion is formed and cured so as to have an outer dimension larger than an inner dimension of the through hole. A forming step of forming a piezoelectric vibrating piece;
An application step of applying a conductive adhesive to a substrate electrode portion provided on a substrate of a package for housing the piezoelectric vibrating piece;
A bonding step of bonding connection electrode portions provided at both ends of the substrate electrode portion and the width direction of the piezoelectric vibrating piece;
Sealing step for hermetically sealing the package,
In the forming step, the end of the piezoelectric vibrating piece and the connection electrode portion are connected to the surface of the connection electrode portion from the first surface facing the substrate electrode portion. Forming a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is a surface opposite to the first surface;
In the joining step, the conductive electrode applied to the substrate electrode portion in the applying step is placed while pressing the connection electrode portion of the piezoelectric vibrating piece, and the conductive adhesive is passed through the through hole. The conductive adhesive forms a protruding portion that protrudes from the second surface, and the protruding portion is formed to have an outer dimension larger than an inner dimension of the through hole, and is cured. A method for manufacturing a piezoelectric device. A bonding method for bonding connection electrode portions respectively provided at both ends in the width direction of a piezoelectric vibrating piece to a substrate electrode portion provided on a substrate formed of an insulating material,
From the first surface that is the surface of the connection electrode portion and that faces the substrate electrode portion, to the end portion of the piezoelectric vibrating piece and the connection electrode portion, the surface of the connection electrode portion and the first surface A through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion is formed toward the second surface, which is the opposite surface,
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part,
Placed on the applied conductive adhesive while pressing the connection electrode portion of the piezoelectric vibrating piece,
Forming a protruding portion protruding on the second surface by passing the conductive adhesive through the through hole;
A conductive adhesive is further applied to the protrusion to form an enlarged protrusion,
The method of joining piezoelectric vibrating reeds, wherein the enlarged protrusion is formed and cured so as to have an outer dimension larger than an inner dimension of the through hole. A forming step of forming a piezoelectric vibrating piece;
An application step of applying a conductive adhesive to a substrate electrode portion provided on a substrate of a package for housing the piezoelectric vibrating piece;
A bonding step of bonding a plurality of connection electrode portions provided at an end portion of the substrate electrode portion and the piezoelectric vibrating piece;
Sealing step for hermetically sealing the package,
In the forming step, the end of the piezoelectric vibrating piece and the connection electrode portion are connected to the surface of the connection electrode portion from the first surface facing the substrate electrode portion. Forming a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is a surface opposite to the first surface;
In the joining step, the conductive electrode applied to the substrate electrode portion in the applying step is placed while pressing the connection electrode portion of the piezoelectric vibrating piece, and the conductive adhesive is passed through the through hole. The conductive adhesive forms a protruding portion that protrudes from the second surface, and a conductive adhesive is further applied to the protruding portion to form an enlarged protruding portion. A method for manufacturing a piezoelectric device, wherein the piezoelectric device is formed and cured to have an outer dimension larger than an inner dimension of the through hole. By connecting the connecting electrode portions provided at both ends of the piezoelectric vibrating piece to the substrate electrode portion provided on the substrate formed of an insulating material, the piezoelectric vibrating piece is accommodated in the package including the substrate. A mobile phone device using the piezoelectric device as described above,
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface,
The substrate electrode portion is coated with a conductive adhesive for joining the substrate electrode portion and the connection electrode portion. The applied conductive adhesive includes a connection electrode portion of the piezoelectric vibrating piece. Is fixed,
The conductive adhesive penetrates the through hole and forms a protruding portion protruding on the second surface;
A cellular phone device characterized in that a control clock signal is obtained by a piezoelectric device in which the protruding portion is hardened by forming an outer dimension larger than an inner dimension of the through hole. By connecting connection electrode portions provided at both ends in the width direction of the piezoelectric vibrating piece to a substrate electrode portion provided on a substrate formed of an insulating material, the piezoelectric vibrating piece is attached to a package including the substrate. An electronic device using a piezoelectric device adapted to accommodate
The end portion of the piezoelectric vibrating piece and the connection electrode portion include a first surface that is a surface of the connection electrode portion and faces the substrate electrode portion, a surface of the connection electrode portion and the first surface. Is formed with a through-hole penetrating the end portion of the piezoelectric vibrating piece and the connection electrode portion toward the second surface which is the opposite surface,
A conductive adhesive for joining the substrate electrode part and the connection electrode part is applied to the substrate electrode part, and the connection electrode of the piezoelectric vibrating piece is applied to the applied conductive adhesive. Part is fixed,
The conductive adhesive penetrates the through hole and forms a protruding portion protruding on the second surface;
An electronic apparatus characterized in that a control clock signal is obtained by a piezoelectric device in which the protruding portion is hardened by forming an outer dimension larger than an inner dimension of the through hole.

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