JP2008259004A - Piezoelectric device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device constituted so that occurrence of connection failure between an integrated circuit chip and a piezoelectric vibrator is prevented and a manufacturing method thereof. <P>SOLUTION: The piezoelectric device is provided with the piezoelectric vibrator 10 which stores a piezoelectric vibration chip 13 in an insulating package 11, a double-faced adhesive tape one surface of which is joined to the bottom surface of the package and the integrated circuit chip 40 joined to the other surface of the double-faced adhesive tape, wherein a connection terminal 25 of the piezoelectric vibration chip formed on the bottom surface of the package of the piezoelectric vibrator is connected to an electrode pad 43 of the integrated circuit chip 40 by wire bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to an improvement in a piezoelectric device formed using a piezoelectric vibrator and a manufacturing method thereof.

Piezoelectric devices are widely used in small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems.
As a piezoelectric device, for example, a piezoelectric oscillator requires a piezoelectric vibrator and an integrated circuit chip that performs temperature compensation thereof.

As the piezoelectric vibrator, one having a structure in which a piezoelectric vibrating piece is accommodated in a package is used. If the integrated circuit chip is bonded to the bottom surface of the package, necessary components can be assembled vertically. Such a structure has the advantage that the mounting space can be reduced because the horizontal size of the piezoelectric oscillator can be made small (Patent Document 1).

JP 2005-33761 A

However, when the piezoelectric oscillator having such a structure is formed, there is a problem described in FIG. 19 particularly when the package of the piezoelectric vibrator is large and the external shape of the integrated circuit chip is considerably smaller than this.
That is, a die pad 2 is arranged inside the lead frame 1 in the figure,
An integrated circuit chip 3 is bonded to one surface (the upper surface in the drawing) of the die pad 2 via an adhesive 4.
A piezoelectric vibrator 5 having an outer shape larger than that of the integrated circuit chip 3 is bonded to the other surface (lower surface in the drawing) of the die pad 2 with an adhesive 6 interposed therebetween.

Here, the piezoelectric vibrator 5 has a configuration in which a piezoelectric vibrating piece (not shown) is accommodated in a package 7 having an internal space and hermetically sealed by a lid body 8. The connection terminal 9 which is the mounting terminal is exposed.
In the case shown in the drawing, since the piezoelectric vibrator 5 is turned upside down so that the lid body 8 faces down, the connecting terminal 9 exposed on the bottom surface faces upward, and the connecting terminal 9 The electrode pads of the integrated circuit chip 3 are electrically connected by wire bonding.
Thereafter, resin molding is performed, the connection lead is cut, and the exposed portion of the lead is preformed to form a piezoelectric oscillator that is an electronic component module.

Here, in the step before the resin molding, the adhesive 6 is applied to the bottom surface of the package 7 of the piezoelectric vibrator 5 in a wide range to be bonded to the die pad 2, and the adhesive 6 of the package 7 is applied. This region is adjacent to the connection terminal 9 of the piezoelectric vibrator 5.
The adhesive 6 may spread over the connection terminals 9 due to variations in the application amount of the adhesive 6 and variations in the application position.
Thereafter, as described above, when the electrode pads of the integrated circuit chip 3 are connected to the connection terminals 9 by wire bonding, connection failure may occur due to the influence of the adhesive touching the connection terminals 9.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a piezoelectric device in which a connection failure between an integrated circuit chip and a piezoelectric vibrator does not occur, and a manufacturing method thereof.

In the present invention, the above-described object is achieved by bonding one surface to the bottom surface of the package and the piezoelectric vibrator in which the piezoelectric vibrating piece having the excitation electrode formed is housed in an insulating package. A double-sided adhesive tape; and an integrated circuit chip bonded to the other surface of the double-sided adhesive tape, wherein the package of the piezoelectric vibrator is electrically connected to the excitation electrode of the piezoelectric vibrating piece. This is achieved by a piezoelectric device including the connection terminal provided on the bottom surface and connecting the connection terminal and the electrode pad of the integrated circuit chip by wire bonding.

According to the configuration of the above invention, since the integrated circuit chip is fixed without interposing a die pad or the like on the bottom surface of the piezoelectric vibrator including the package, the horizontal size can be reduced and the mounting area can be reduced. As well as reducing the height, the height dimension can be reduced to the limit to achieve miniaturization.
In particular, since the integrated circuit chip is bonded to the package via a double-sided adhesive tape, an adhesive for bonding the integrated circuit chip is close to the connection terminal of the piezoelectric vibrator exposed on the bottom surface of the package. Not done. For this reason, since there is no possibility that such an adhesive spreads and adheres to the connection terminal, when connecting the connection terminal of the piezoelectric vibrating piece and the electrode pad of the integrated circuit chip by wire bonding, the connection There is no need to worry about defects.

In another aspect of the invention, the one surface of the double-sided adhesive tape is bonded to the bottom surface of the package so that the connection terminal is exposed, and the other surface of the double-sided adhesive tape is the integrated surface. A chip bonding region to which a circuit chip is bonded and a non-chip bonding region to which the integrated circuit chip is not bonded; and an inner end of a connection lead of a lead frame for terminals is bonded to the non-chip bonding region. It is characterized by being.
According to the configuration of the present invention, not only the integrated circuit chip is appropriately connected to the package of the piezoelectric vibrator, but also the lead frame for the terminal is arranged and joined, so that a compact piezoelectric oscillator can be obtained. realizable.

According to another aspect of the present invention, in another invention, one surface is bonded to a piezoelectric vibrator in which a piezoelectric vibrating piece on which an excitation electrode is formed is housed in an insulating package, and the bottom surface of the package. The first double-sided adhesive tape, the other side of the first double-sided adhesive tape, the die pad of the lead frame joined on one side, and the other side of the die pad A second double-sided adhesive tape whose surfaces are bonded, and an integrated circuit chip bonded to the other surface of the second double-sided adhesive tape, wherein the package of the piezoelectric vibrator includes the piezoelectric This is achieved by a piezoelectric device having a connection terminal electrically connected to the excitation electrode of a resonator element on the bottom surface and connecting the connection terminal and an electrode pad of the integrated circuit chip by wire bonding.

According to the configuration of the above invention, since the integrated circuit chip bonded to the die pad is fixed to the bottom surface of the piezoelectric vibrator including the package, the horizontal size can be reduced and the mounting area can be reduced. Can be reduced in size.
In particular, since the integrated circuit chip is bonded to the package via a double-sided adhesive tape, an adhesive for bonding the integrated circuit chip is close to the connection terminal of the piezoelectric vibrator exposed on the bottom surface of the package. Not done. For this reason, there is no possibility that such an adhesive adheres to the connection terminal. Therefore, in connecting the connection terminal of the piezoelectric vibrating piece and the electrode pad of the integrated circuit chip by wire bonding, a connection failure is caused. There is no need to worry.
Moreover, since the die pad is used, the strength is high accordingly.

In another aspect of the invention, the bottom surface of the package of the piezoelectric vibrator is bonded to the other surface of the die pad by applying an adhesive instead of the second double-sided adhesive tape. It is characterized by that.
According to the configuration of the invention, an adhesive is applied to the other surface of the die pad in place of the second double-sided adhesive tape.
That is, although the integrated circuit chip is bonded with an adhesive, the die pad and the piezoelectric vibrator package are bonded with a double-sided tape, so the area where the adhesive is applied is compared with the connection terminal of the package. It is far away. That is, since the double-sided adhesive tape is used at a location close to the connection terminal and the adhesive is used at a remote location, the adhesive spreads and hardly adheres to the connection terminal. For this reason, the conduction failure of the bonding wire with respect to the connection terminal is effectively prevented.

According to another aspect of the present invention, the connection exposed on the bottom surface of the piezoelectric vibrator having a piezoelectric vibrating piece housed in an insulating package having a connection terminal formed on the bottom surface is provided. In the lead bonding process, which joins the double-sided adhesive tape to avoid the terminal and the inner end of the lead for connecting the lead frame to the peripheral edge, avoiding the central area of the exposed adhesive surface of the double-sided adhesive tape An edge bonding step, an integrated circuit chip bonding step for bonding an integrated circuit chip to the central region of the exposed adhesive surface of the double-sided adhesive tape, an electrode pad of the integrated circuit chip, and the connection terminal on the bottom surface of the package This is achieved by a method of manufacturing a piezoelectric device including a wire bonding step of electrically connecting the two by wire bonding.

According to the configuration of the invention, the integrated circuit chip is fixed without interposing a die pad or the like on the bottom surface of the piezoelectric vibrator including the package. Therefore, the size in the horizontal direction can be reduced, the mounting area can be reduced, and the size can be reduced by reducing the height dimension to the limit.
In addition, since the integrated circuit chip is bonded via the double-sided adhesive tape, the adhesive for bonding the integrated circuit chip is not close to the connection terminal of the piezoelectric vibrator exposed on the bottom surface of the package. For this reason, since there is no possibility that such an adhesive spreads and adheres to the connection terminal during application, the connection terminal of the piezoelectric vibrator and the electrode pad of the integrated circuit chip are connected by wire bonding. In the wire bonding process, connection failure does not occur.

Furthermore, in another invention, the above object is exposed to the bottom surface of the piezoelectric vibrator having a piezoelectric vibrating piece housed in an insulating package having a connection terminal formed on the bottom surface. A first tape joining step for joining one side of the first double-sided adhesive tape, and one side of the die pad of the lead frame so as to avoid the connection terminal, and the other side of the first double-sided tape Die pad bonding step for bonding surfaces, a second tape bonding step for bonding one surface of the second double-sided adhesive tape to the other surface of the die pad, and integration on the other surface of the second double-sided adhesive tape An integrated circuit chip bonding process for bonding the circuit chip; and a wire bonding process for electrically connecting the electrode pads of the integrated circuit chip and the connection terminals on the bottom surface of the package by wire bonding. The manufacturing method of Dale piezoelectric device is achieved.

According to the configuration of the present invention, since the integrated circuit chip bonded to the die pad is fixed to the bottom surface of the piezoelectric vibrator including the package, the horizontal size can be reduced and the mounting area can be reduced. Can be reduced in size.
In particular, since the integrated circuit chip is bonded to the package via a double-sided adhesive tape, the adhesive for bonding the integrated circuit chip is close to the connection terminal of the piezoelectric vibrator exposed on the bottom surface of the package. Not done. For this reason, since there is no possibility that such an adhesive spreads and adheres to the connection terminal during application, the connection terminal of the piezoelectric vibrating piece and the electrode pad of the integrated circuit chip are connected by wire bonding. There is no need to worry about poor connection in the wire bonding process.
In addition, compared with the manufacturing method of the above-mentioned other inventions, the die pad is used, so that the strength is high accordingly.

In another aspect of the invention, in the first tape joining step, the first double-sided adhesive tape is not attached to the bottom surface of the package, but the other side of the first double-sided adhesive tape is attached to one of the die pads of the lead frame. It is characterized in that it is joined to the surface.
According to the configuration of the present invention, the first double-sided adhesive tape may be applied not to the package side in advance but to the die pad side.

Furthermore, in another invention, the above object is exposed to the bottom surface of the piezoelectric vibrator having a piezoelectric vibrating piece housed in an insulating package having a connection terminal formed on the bottom surface. In order to avoid the connection terminal, a tape bonding step of bonding one surface of the double-sided adhesive tape, and a die pad bonding step of bonding the other surface of the double-sided tape to one surface of the die pad of the lead frame, An adhesive application step in which an adhesive is applied to the other surface of the die pad; and an integrated circuit chip bonding step in which an integrated circuit chip is bonded by the applied adhesive;
This is achieved by a method of manufacturing a piezoelectric device including a wire bonding step of electrically connecting the electrode pads of the integrated circuit chip and the connection terminals on the bottom surface of the package by wire bonding.
According to the structure of this invention, compared with the manufacturing method of another invention, the points which the integrated circuit chip has joined with the adhesive agent differ. However, since the die pad and the package of the piezoelectric vibrator are bonded with a double-sided tape, the region where the adhesive is applied is relatively far from the connection terminal of the package. That is, since the double-sided adhesive tape is used at a location close to the connection terminal and an adhesive is used at a remote location, the adhesive hardly adheres to the connection terminal. For this reason, the conduction | electrical_connection defect of the bonding wire with respect to the connecting terminal in a wire bonding process is prevented effectively.

1 and 2 show a piezoelectric oscillator as a first embodiment of a piezoelectric device of the present invention. FIG. 1 is a schematic sectional view before resin molding, and FIG. 2 is a piezoelectric vibration used in the piezoelectric oscillator. It is a schematic sectional drawing of a child.
As shown in FIG. 1, a piezoelectric oscillator 30 as an example of a piezoelectric device has an integrated circuit chip 40 disposed above a piezoelectric vibrator 10.
First, the piezoelectric vibrator 10 will be described.
The piezoelectric vibrator 10 is formed by housing a piezoelectric vibrating piece 13 in an insulating package 11 and sealing it with a lid 12.
Here, as the package 11 which is a container for the piezoelectric vibrator 10, ceramic is suitable as a material thereof. Particularly, as a preferable material, a piezoelectric vibrating piece 13 or a thermal expansion coefficient of a lid which will be described later is matched, or A material having a very close thermal expansion coefficient is selected. In this embodiment, for example, a ceramic green sheet is used.

That is, the package 11 can be formed by laminating and sintering green sheets molded into the shape of FIG. In this case, the electrode part 23 is formed on the substrate constituting the bottom of the package 11.
The green sheet to be stacked on the substrate is a frame-like shape with the inner material removed,
By superimposing this on the substrate, the package 11 is a box-shaped container having an internal space S. Using this internal space S, the piezoelectric vibrating piece 13 is accommodated. A lid 12 made of a metal such as ceramic, glass or Kovar is joined to the package 11 via a low melting glass, a brazing material 16 such as nickel or Kovar. Thereby, the package 11 is hermetically sealed.

On the ceramic material forming the package 11, for example, a conductive paste such as silver / palladium or a conductive paste such as tungsten metallization is used to form a required conductive pattern, and after sintering, Nickel and gold or silver are sequentially plated to form the electrode portion 23 described above.
The electrode portion 23 is connected to a connection terminal 25 which is a mounting terminal exposed on the bottom surface of the package 11 by a conductive pattern such as a conductive through hole 24. The conductive pattern for connecting the electrode portion 23 and the connection terminal 25 may be formed on the surface of a castellation (not shown) used when the package 11 is formed, and the outer surface of the package 11 may be routed.

The piezoelectric vibrating piece 13 is formed of a so-called AT-cut vibrating piece obtained by processing a wafer formed of, for example, a piezoelectric material so as to become a thin rectangular substrate. As a piezoelectric material,
For example, quartz is used in this embodiment, and piezoelectric materials such as lithium tantalate and lithium niobate can be used in addition to quartz. The shape of the piezoelectric vibrating piece 13 is not limited to a flat type, and a convex type or an inverted mesa type vibrating piece can be used.
Alternatively, for example, a so-called tuning fork type vibration piece having a base and a pair of vibrating arms extending in parallel from the base, or a sensor piece of a gyro sensor, etc. can be used. There is. Furthermore, the present invention can also be applied to a surface acoustic wave vibrator element piece.

As shown in FIG. 2, such a piezoelectric vibrating piece 13 is cantilevered on the electrode portion 23 inside the package 11.
Thereby, the drive voltage supplied from the outside of the package 11 through the connection terminal 25 is
It is applied to the excitation electrode (not shown) from the electrode part 23 on the package 11 side through the conductive adhesive 28 and the lead electrode of the piezoelectric vibrating piece 13. Therefore, the main surface of the piezoelectric vibrating piece 13 is driven by a thickness-shear vibration caused by a piezoelectric action.

The lead frame 20 of FIG. 1 is made of, for example, an Fe alloy such as 42 alloy or Cu—Sn.
, Cu—Fe, Cu—Zn, Cu—Ni, or other Cu alloys, or ternary alloys obtained by adding a third element to these alloys are used. In the embodiment shown in FIG. 1, there is no island part to be a die pad part, and the package 11 side and the frame part are joined as will be described later.

In the space inside a plurality of lead terminals to be described later of the lead frame 20, there is an integrated circuit chip 4.
0 is arranged. The integrated circuit chip 40 is a semiconductor chip, for example, the piezoelectric vibrator 1.
An oscillation circuit that oscillates 0, a temperature compensation circuit, and the like are provided.
The surface 41 of the integrated circuit chip 40 is an active surface where the electrode pads 43 of the integrated circuit chip 40 are exposed, and the lower surface 42 of the integrated circuit chip 40 in FIG. 1 is an inactive surface.
The bottom surface 17 of the package 11 of the piezoelectric vibrator 10 and the inactive surface 42 of the integrated circuit chip 40 are joined by a double-sided adhesive tape 31.
That is, in FIG. 1, one surface which is the lower surface of the double-sided adhesive tape 31 is the package 1
The inactive surface 42 of the integrated circuit chip 40 is attached to the other surface which is the upper surface.

FIG. 3 is a schematic cross-sectional view showing a configuration example of a double-sided adhesive tape (double-sided adhesive tape).
In the figure, the double-sided adhesive tape 31 can be, for example, a die bonding tape used when fixing a semiconductor element to a substrate. That is, the double-sided adhesive tape 31 is obtained by forming resinous adhesive layers (adhesive layers) 33 and 34 on both front and back surfaces of a resin film 32 serving as a base material.
It is traded under the name “DAF tape” and can be used for both dicing and die bonding.

As described above, according to this embodiment, the integrated circuit chip 40 is fixed to the bottom surface 17 of the package 11 of the piezoelectric vibrator 10 including the package 11 without interposing a die pad or the like.
For this reason, the piezoelectric oscillator 30 can be reduced in size in the horizontal direction, and not only can the mounting area be reduced, but also the height dimension can be reduced to the limit to achieve miniaturization.
In particular, since the integrated circuit chip 40 is bonded to the package 11 via the double-sided adhesive tape 31, the bonding for bonding the integrated circuit chip to the connection terminal 25 of the piezoelectric vibrator 10 exposed on the bottom surface 17 of the package 11. The agent is not in close proximity.
For this reason, since there is no possibility that the adhesive spreads and adheres to the connection terminal 25 during application, when connecting the connection terminal of the piezoelectric vibrating piece 13 and the electrode pad 43 of the integrated circuit chip 40 by wire bonding, There is no need to worry about poor connections.

4 and 5 are schematic cross-sectional views showing a second embodiment of the piezoelectric oscillator of the present invention, and show the state before resin molding for the convenience of understanding.
In these drawings, the portions denoted by the same reference numerals as those in the first embodiment are the same as the corresponding parts in the first embodiment, and therefore, redundant description is omitted. Explained.

In the piezoelectric oscillator 30-1 of the second embodiment, unlike the first embodiment, the lead frame 20 has a die pad 26 for joining the integrated circuit chip 40.
The first double-sided adhesive tape 31-1 and the second double-sided adhesive tape 31-2 are used.
Specifically, the first double-sided adhesive tape 31-1 having one surface (lower surface) bonded to the bottom surface of the package 11 of the piezoelectric vibrator 10 and the other surface of the first double-sided adhesive tape. (Top)
On the other hand, a lead frame die pad 26 bonded to one surface 26a and a second double-sided adhesive tape 31-2 bonded to one surface (lower surface) of the other surface 26b of the die pad 26. And an integrated circuit chip 40 bonded to the other surface (upper surface) of the second double-sided adhesive tape 31-2, a connection terminal 25 formed on the bottom surface of the package 11, and an integrated circuit chip Forty electrode pads 43 are connected by wire bonding.

The present embodiment is configured as described above. Compared to the first embodiment, the package 11 and the integrated circuit chip 40 are not bonded to each other, but are bonded to the die pad 26. Only it has become structurally strong. Other functions and effects are the same as those of the first embodiment.

FIG. 5 is a modification of the piezoelectric oscillator of FIG.
Compared with the configuration of FIG. 4, the piezoelectric oscillator 30-2 of this modified example has the piezoelectric oscillator 30-of FIG. 4.
1 differs from using the second double-sided adhesive tape 31-2 in that the adhesive 35 is used, and the other configurations are exactly the same.
Therefore, according to this modification, although the integrated circuit chip 40 is bonded with the adhesive 35, the die pad 26 and the package 11 of the piezoelectric vibrator 10 are connected to the (first) double-sided tape 3.
1-1, the region where the adhesive 35 is applied is the package 11
It is sufficiently away from the connection terminal 25.
That is, since the double-sided adhesive tape 31-1 is used at a location close to the connection terminal 25 and an adhesive is used at a remote location, the adhesive 35 spreads and adheres to the connection terminal 25. No. For this reason, the conduction failure of the bonding wire 44 to the connection terminal 25 is effectively prevented.

(Piezoelectric device manufacturing method)
(Manufacturing method according to the first embodiment)
Next, a first embodiment of a method for manufacturing a piezoelectric oscillator as an example of a piezoelectric device will be described with reference to FIGS.
In these drawings, the left diagram is a schematic plan view of each process, and the right diagram is a schematic cross-sectional view.
In addition, the steps before the explanation in each drawing, that is, the formation steps of the piezoelectric vibrating piece and the piezoelectric vibrator, are formed by a general method from the above description regarding these structures. Is omitted.

(Tape joining process)
First, as shown in FIG. 6, a double-sided adhesive tape 31 is affixed to the bottom surface of the insulating package 11 of the piezoelectric vibrator 10 so as to avoid the connection terminals 25 and 25 exposed on the bottom surface.
(Lead inner end joining process)
Next, as shown in FIG. 7, a lead frame 20 is prepared.
For example, the lead frame 20 extends inward from supporting leads 22 and 22 arranged horizontally in parallel with each other as shown in the drawing, and the inner end 2 of the connecting lead is bent to a predetermined degree.
1 is laminated and pasted on the piezoelectric vibrator 10 to which the double-sided adhesive tape 31 is stuck.
At this time, the periphery of the double-sided adhesive tape 31 affixed to the package 11 of the piezoelectric vibrator 10 avoids the central region of the exposed adhesive surface and avoids the region where the connection terminals 25 of the package 11 are formed. The inner end 21 of the connecting lead is joined.
At this stage, as shown in an enlarged view in FIG. 8, the double-sided adhesive tape 31 joins the inner end 21 of the connecting lead and the package 11.

(Integrated circuit chip bonding process)
Next, as shown in FIG. 9, the integrated circuit chip 40 is joined to the central region of the exposed adhesive surface of the double-sided adhesive tape 31. Accordingly, as shown in FIG. 10, the double-sided adhesive tape 31 can join the piezoelectric vibrator 10 and the integrated circuit chip 40.
(Wire bonding process)
Subsequently, as shown in FIG. 11, the electrode pads 43 of the integrated circuit chip 40 and the package 11
The bottom connection terminal 25 is electrically connected by wire bonding.
In this embodiment, since the integrated circuit chip 40 is bonded to the package 11 via the double-sided adhesive tape 31, the integrated circuit is connected to the connection terminal 25 of the piezoelectric vibrator 10 exposed on the bottom surface of the package. The adhesive for joining the chip 40 is not close. For this reason, since there is no possibility that the adhesive adheres to the connection terminal 25, in the step of connecting the connection terminal 25 of the piezoelectric vibrator 10 and the electrode pad 43 of the integrated circuit chip 40 by wire bonding, connection failure is caused. There is no need to worry.
(Molding process)
Subsequently, after resin molding, unnecessary portions of the lead frame 20 are cut and the connecting leads are bent to complete the piezoelectric oscillator.

(Manufacturing method according to the second embodiment)
Next, a second embodiment of a method for manufacturing a piezoelectric oscillator will be described with reference to FIGS. This embodiment is different from the first embodiment in that a die pad is used, and double-sided adhesive tape is used for each of the front and back surfaces of the die pad (the first double-sided adhesive tape 31-1 and the second double-sided tape). The adhesive tape 31-2) or one of them is used as an adhesive.

(Tape joining process)
The process of sticking the first double-sided adhesive tape 31-1 shown in FIG. 12 to the package 11 is the same as that of the first embodiment (see FIG. 6).
In the tape joining process of this embodiment, the first double-sided adhesive tape 31-1 may be affixed to the die pad 26 as shown in FIG.
Here, the die pad 26 is formed of the same material as that of the lead frame 20. For example, a rectangular island portion as shown in the figure is provided, and an integrated circuit chip or a piezoelectric vibrator is joined thereto. It is.

(Lead inner end joining process)
And after sticking the 1st double-sided adhesive tape 31-1 to one surface of the die pad 26, as shown in FIG.13 (b), the back surface side of the piezoelectric vibrator 10 is made into the 1st surface of one surface of the die pad 26. 1 is attached to the double-sided adhesive tape 31-1.
In this case, as indicated by a dotted line, the inner end 21 of the connecting lead is connected to the double-sided adhesive tape 3.
The double-sided adhesive tape 3 is aligned so as to be superimposed on the piezoelectric vibrator 10 to which 1-1 is attached.
Affix by 1-1.
That is, the inner edge 21 of the connection lead is a peripheral portion of the piezoelectric vibrator 10 bonded to the die pad 26 avoiding the central region of the package 11 and avoiding the region where the connection terminal 25 of the package 11 is formed. Are aligned.
On the other hand, when the first double-sided adhesive tape 31-1 is previously attached to the package 11 as described with reference to FIG. 12, the first double-sided adhesive attached to the package 11 as shown in FIGS. 14 and 15. The inner end 21 of the connecting lead is joined to the peripheral edge of the exposed surface of the tape 31-1 that avoids the central region and avoids the region where the connection terminal 25 of the package 11 is formed.

(Integrated circuit chip bonding process)
Next, as shown in FIGS. 16 to 17, the integrated circuit chip 40 is bonded.
In the case of FIGS. 16A and 16B, the second double-sided adhesive tape 31-2 is pasted on the joint surface of the integrated circuit chip 40 in advance, and the second double-sided adhesive tape 31-2 is exposed. The bonded surface is pasted to the other surface (upper surface) of the die pad 26.
In the case of FIG. 16C, an adhesive 35 made of, for example, a thermosetting resin is applied in advance to the other surface of the die pad 26, and the integrated circuit chip 40 is placed thereon, followed by heat curing. Let As a result, the state shown in FIG. 17 is obtained. FIGS. 17A and 17B show a case where two double-sided adhesive tapes 31-1 and 31-2 are used, and FIG. 17C shows a case where a double-sided adhesive tape and an adhesive are used.

(Wire bonding process)
Subsequently, as shown in FIG. 18, the electrode pad 43 of the integrated circuit chip 40 and the package 11.
The bottom connection terminal 25 is electrically connected by wire bonding. This step and the subsequent molding step are the same as those in the first embodiment.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
Further, the shape of the package of the piezoelectric vibrator 10 is not limited to the illustrated one, and various forms can be applied.

1 is a schematic cross-sectional view showing a first embodiment of a piezoelectric oscillator of the present invention. FIG. 2 is a schematic cross-sectional view of a piezoelectric vibrator of the piezoelectric oscillator of FIG. 1. The schematic sectional drawing of the double-sided adhesive tape used for the piezoelectric oscillator of FIG. The schematic sectional drawing which shows 2nd Embodiment of the piezoelectric oscillator of this invention. FIG. 6 is a schematic cross-sectional view of a modified example of the piezoelectric oscillator of FIG. 4. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. The figure which shows the process of 1st Embodiment of the manufacturing method of the piezoelectric oscillator of this invention. 1 is a schematic cross-sectional view of a piezoelectric oscillator not included in the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Piezoelectric vibrator, 11 ... Package, 13 ... Piezoelectric vibrating piece, 20 ... Lead frame, 25 ... Connection terminal, 30 ... Piezoelectric device (piezoelectric oscillator), 31 ...
-Double-sided adhesive tape, 40 ... Integrated circuit chip

Claims (8)

A piezoelectric vibrator in which a piezoelectric vibrating piece on which an excitation electrode is formed is housed in an insulating package;
A double-sided adhesive tape having one surface bonded to the bottom surface of the package;
An integrated circuit chip bonded to the other surface of the double-sided adhesive tape,
The package of the piezoelectric vibrator includes a connection terminal electrically connected to the excitation electrode of the piezoelectric vibrating piece on the bottom surface,
The piezoelectric device, wherein the connection terminal and the electrode pad of the integrated circuit chip are connected by wire bonding. The one surface of the double-sided adhesive tape is bonded to the bottom surface of the package so as to expose the connection terminal,
The other surface of the double-sided adhesive tape has a chip bonding region to which the integrated circuit chip is bonded and a non-chip bonding region to which the integrated circuit chip is not bonded,
2. The piezoelectric device according to claim 1, wherein an inner end of a connection lead of a terminal lead frame is bonded to the non-chip bonding region. A piezoelectric vibrator in which a piezoelectric vibrating piece on which an excitation electrode is formed is housed in an insulating package;
A first double-sided adhesive tape having one surface bonded to the bottom surface of the package;
A lead frame die pad bonded on one side to the other side of the first double-sided adhesive tape;
A second double-sided adhesive tape having one surface bonded to the other surface of the die pad;
An integrated circuit chip bonded to the other surface of the second double-sided adhesive tape,
The package of the piezoelectric vibrator includes a connection terminal electrically connected to the excitation electrode of the piezoelectric vibrating piece on the bottom surface,
A piezoelectric device, wherein the connection terminal and an electrode pad of the integrated circuit chip are connected by wire bonding. The bottom surface of the package of the piezoelectric vibrator is bonded to the other surface of the die pad by applying an adhesive instead of the second double-sided adhesive tape. The piezoelectric device according to claim 3. Tape bonding in which a double-sided adhesive tape is bonded to the bottom surface of the piezoelectric vibrator that houses a piezoelectric vibrating piece in an insulating package having connection terminals formed on the bottom surface so as to avoid the connection terminals exposed on the bottom surface. Process,
Avoiding the central region of the exposed adhesive surface of the double-sided adhesive tape, joining the inner end of the lead to join the inner end of the lead for connecting the lead frame to the peripheral portion;
An integrated circuit chip joining step for joining the integrated circuit chip to the central region of the exposed adhesive surface of the double-sided adhesive tape;
And a wire bonding step of electrically connecting the electrode pads of the integrated circuit chip and the connection terminals on the bottom surface of the package by wire bonding. One side of the first double-sided adhesive tape avoids the connection terminal exposed on the bottom surface of the piezoelectric vibrator having the piezoelectric vibration piece accommodated in the insulating package having the connection terminal formed on the bottom surface. A first tape joining step for joining the surfaces of
A die pad bonding step of bonding the other surface of the first double-sided tape to one surface of the die pad of the lead frame;
A second tape bonding step of bonding one surface of a second double-sided adhesive tape to the other surface of the die pad;
An integrated circuit chip bonding step of bonding the integrated circuit chip to the other surface of the second double-sided adhesive tape;
A method of manufacturing a piezoelectric device, comprising: a wire bonding step of electrically connecting electrode pads of the integrated circuit chip and the connection terminals on the bottom surface of the package by wire bonding. In the first tape bonding step, the first double-sided adhesive tape is not attached to the bottom surface of the package, but the other surface of the first double-sided adhesive tape is placed on one surface of the die pad of the lead frame. The method for manufacturing a piezoelectric device according to claim 6, wherein bonding is performed. One side of the double-sided adhesive tape is attached to the bottom surface of the piezoelectric vibrator in which the piezoelectric vibrating piece is housed in an insulating package having a connection terminal formed on the bottom surface so as to avoid the connection terminal exposed on the bottom surface. A tape joining process to join,
A die pad bonding step of bonding the other surface of the double-sided tape to one surface of the die pad of the lead frame;
An adhesive application step in which an adhesive is applied to the other surface of the die pad;
An integrated circuit chip bonding step of bonding the integrated circuit chip with the applied adhesive;
A method of manufacturing a piezoelectric device, comprising: a wire bonding step of electrically connecting electrode pads of the integrated circuit chip and the connection terminals on the bottom surface of the package by wire bonding.

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