JP3551289B2 - Electronic component mounting socket and electronic component accommodated in the electronic component mounting socket - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting socket for mounting components such as an electret condenser microphone (hereinafter, referred to as ECM) and electronic components to a substrate.
[0002]
[Prior art]
For example, an ECM 800 used for a mobile phone or a PHS (hereinafter, referred to as a mobile phone or the like) has two connectors 810 protruding from the back side as shown in FIG. The substrate is soldered directly to the conductive pattern of the substrate, or attached to the substrate 850 using a socket 820 as shown in FIG.
[0003]
The socket 820 includes a substantially rectangular parallelepiped body 822 having two openings 821 into which connectors 810 are inserted, and a conductive pattern 823 formed from the inner peripheral surface of the opening 821 to the outer peripheral surface of the body 822. And the conductive pattern 823 extends outside the body 822.
[0004]
[Problems to be solved by the invention]
However, because the ECM is sensitive to heat, it is not desirable to solder directly to the conductive pattern on the substrate. Further, even when the above-mentioned socket is used, it is necessary to solder the socket to the substrate.
[0005]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounting socket capable of securely connecting an electronic component such as an ECM to a substrate without soldering. The purpose is.
[0006]
[Means for Solving the Problems]
Electronic component mounting socket according to the present invention,An electronic component mounting socket for mounting an electronic component on a substrate,A body formed of an insulating member and having a housing portion for housing the electronic component;Attached to the body to electrically connect between the electronic components housed in the housing and the pattern formed on the boardAnd a contact,The contact is a part that is inserted into and fitted into a groove formed in the body, and a part that is connected to one end of the fitting part and that is located in the housing part and that can contact an electronic component. And a connection portion that is a portion bent into a hairpin shape connected to the other end side of the fitting portion and that is located outside the body and can contact a pattern formed on the substrate,The body is formed with at least substantially L-shaped engaging claws facing each other. When a projecting portion projecting from an edge of the substrate is inserted between the engaging claws, the engaging claws are formed. Pinches the convex portion, and the contactConnectionAre in contact with the pattern formed on the substrate.
[0007]
On the other hand, the electronic component according to the present invention is an electronic component that is housed in a socket and mounted on a substrate, and a contact is formed in a planar shape along the case wall surface, and is housed in the socket. The contact is configured to be electrically connected to the socket.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a schematic perspective view showing a procedure for mounting an electronic component mounting socket according to an embodiment of the present invention on a substrate, and FIG. 2 is a drawing of the electronic component mounting socket according to an embodiment of the present invention. (A) is a schematic plan view, (B) is a schematic side view, (C) is a schematic bottom view, and (D) is a schematic II line in (A) of FIG. FIG. 3 is a cross-sectional view, FIG. 3 is a drawing of a body constituting an electronic component mounting socket according to an embodiment of the present invention, FIG. 3 (A) is a schematic plan view, FIG. 4C is a schematic bottom view, FIG. 4D is a schematic sectional view taken along line II-II of FIG. 4A, and FIG. 4 constitutes an electronic component mounting socket according to the embodiment of the present invention. (A) is a schematic plan view of a lead frame state, FIG. (B) is a schematic side view of a lead frame state, 5 is a schematic sectional view showing a mounting procedure of the electronic component mounting socket board according to the embodiment of the present invention.
[0009]
FIG. 6 is a schematic plan view showing a relationship between an electronic component mounting socket according to an embodiment of the present invention and a projection of a substrate to which the socket is mounted, and FIG. 7 is an electronic component mounting according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing a state in which a socket is incorporated in an electronic device. FIG. 8 is a view showing another embodiment of the present invention, and FIG. 8A shows a procedure for mounting an electronic component mounting socket on a substrate. FIG. 9 (B) is a schematic cross-sectional view, FIG. 9 (B) is a schematic side view for explaining an example of connection between a contact and a conductive pattern when this electronic component mounting socket is used, and FIG. 9 shows an embodiment of the present invention. FIG. 10 is a schematic sectional view showing a procedure for attaching the electronic component mounting socket to another substrate, and FIG. 10 is a schematic sectional view of an electronic component mounting socket according to another embodiment of the present invention.
[0010]
An electronic component mounting socket A according to an embodiment of the present invention is an electronic component mounting socket for mounting an ECM 300 as an electronic component on a substrate 400, and has an insulating body 100 provided with a housing portion 110 to which the ECM 300 is mounted. And a contact 200 having conductivity that is attached to the body 100 such that a contact portion 220 at one end faces the housing portion 110 and a connection portion 230 at the other end faces the outside of the body 100. The body 100 is formed with three engaging claws 111, 122, 122 which are engaged with the substrate 400. When the engaging claws 111, 122, 122 are engaged with the substrate 400, the contact 200 Is in contact with the conductive patterns 413a, 413b, 413c formed on the substrate 400.
[0011]
The ECM 300 as an electronic component does not have two contacts protruding from the back surface unlike the conventional one, and as shown in FIG. 5, two flat contact members 310 and 320 are formed concentrically on the back surface. Formed with an insulating material interposed therebetween. Here, the outermost contact 320 is a ground terminal, and the inner contact 310 is a signal terminal. This has the significance that the outermost contact 320, which is likely to cause a short-circuit accident, is used as a ground terminal, so that even if a short-circuit accident occurs, no damage is caused. Further, the case forming the upper surface and the outer peripheral portion of the ECM 300 is formed in a cylindrical shape so that it can be inserted into the housing portion 110.
[0012]
On the other hand, the substrate 400 to which the ECM 300 is mounted by the electronic component mounting socket A is a so-called flexible substrate, and as shown in FIG. 1, a tongue-shaped convex portion 410 protrudes from an edge portion. The electronic component mounting socket A is mounted on the electronic device.
[0013]
Cutouts 411, 412, 412 are formed at the tip of the protrusion 410 and the left and right side surfaces, respectively. Further, the corner of the tip of the projection 410 is cut obliquely. Three conductive patterns 413a, 413b, and 413c are formed on the protrusion 410 thus formed. Of the conductive patterns 413a, 413b, and 413c, the conductive patterns 413a and 413c on both sides are connected outside the drawing. The conductive patterns 413a, 413b, 413c constitute a part of an external circuit (not shown). Further, at a position deviated from the center of the convex portion 410, a positioning concave portion 414 which forms a part of a means for positioning the body 100 at a fixed position is formed.
[0014]
The body 100 of the electronic component mounting socket A is formed of an insulating synthetic resin such as ABS. The body 100 includes a circular housing portion 110 that matches the outer shape of the ECM 300, and an extending portion 120 that extends from the housing portion 110.
[0015]
The inner diameter of the housing 110 is set to be larger than the outer diameter of the ECM 300 by the thickness of the side surface of the microphone holder 500 described later. Three slits 114 are opened in parallel on the bottom of the housing 110. The slit 114 is a portion into which a contact 200 described later fits. The slit 114 is parallel to the sliding direction when the electronic component mounting socket A is mounted on the substrate 400.
[0016]
The accommodation section 110 is formed deeper than the thickness dimension of the ECM 300. For this reason, a wall 113 is formed at the edge of the housing 110.
[0017]
An engaging claw 111 is formed on the edge of the housing 110, which is on the side opposite to the side where the extension 120 extends. An inwardly facing claw 111 a is formed at the tip of the engagement claw 111, and engages with the notch 411 at the tip of the protrusion 410 of the substrate 400.
[0018]
Further, a positioning protrusion 112 corresponding to the concave portion 414 for positioning the substrate 400 is formed on the back surface side of the housing portion 110. That is, the protrusion 112 is a part of a means for positioning the body 100 at the fixed position, and regulates the position of the electronic component mounting socket A with respect to the substrate 400 by fitting into the recess 414.
[0019]
The ECM 300 fitted in the housing 110 is fixed by a rubber microphone holder 500 as an elastic member. That is, as shown in FIG. 1, the microphone holding holder 500 is formed in a bottomed cylindrical shape having a sound hole 511 formed in a bottom portion 510, and is fitted into the housing portion 110 with the bottom portion 510 facing up. The ECM 300 is fixed to the accommodation unit 110.
[0020]
Three grooves 121 are formed in parallel on the back side of the extension 120. The groove 121 is continuous with the slit 114 and does not penetrate to the surface of the extension 120. The groove 121 is parallel to the sliding direction when the electronic component mounting socket A is mounted on the substrate 400, similarly to the slit 114.
[0021]
Engagement claws 122 projecting to the rear surface side are formed on both left and right sides of the extension portion 120. Inwardly facing claws 122a, 122a are formed at the tips of the engaging claws 122, 122 so as to engage with the notches 412, 412 on the side surface of the convex portion 410 of the substrate 400. I have.
[0022]
The distance between the claws 111a, 122a, 122a of the above-mentioned three engaging claws 111, 122, 122 and the back surface of the body 100 is set to be equal to or slightly larger than the thickness of the substrate 400.
[0023]
The contact 200 attached to the body 100 formed in this way electrically connects the contacts 310 and 320 of the ECM 300 and the conductive patterns 413a, 413b and 413c of the substrate 400, and As a lead frame from a metal plate having As shown in FIG. 4, the contact 200 includes a fitting portion 210 for fixing to the body 100, a contact portion 220 extending from the fitting portion 210, and a contact portion 220 extending from the opposite side of the fitting portion 210. And an extended connecting portion 230.
[0024]
The fitting part 210 is formed in a substantially rectangular shape, and a substantially elliptical raised part 211 for fixing the contact 200 to the groove 121 of the body 100 is formed in the center thereof. Substantially triangular barbs 212 for preventing slip-off are projected from both side surfaces of the fitting portion 210.
[0025]
From the fitting part 210, a connecting part 230 described later and a continuous part 240 parallel to the connecting part 230 extend. The connecting portion 240 is provided for connecting the contact 200 to the tie bar 250, and is cut when the contact 200 is actually incorporated into the body 100 and used as the contact 200.
[0026]
The end of the contact portion 220 is formed to be convex upward and is located above the fitting portion 210. The contact portion 220 is a portion that comes into contact with the contacts 310 and 320 of the ECM 300, and a distal end portion of the contact portion 220 is plated with gold to ensure good conductivity.
[0027]
On the other hand, the connection part 230 is bent in a hairpin shape toward the back side of the fitting part 210. The connection portion 230 is a portion that comes into contact with the conductive patterns 413a, 413b, and 413c formed on the substrate 400, and the leading end portion is plated with gold to ensure good conductivity. Note that the connection portion 230 is located on the back side and is not visible in FIG. 4A, so that a state before being bent into a hairpin shape is indicated by a broken line.
[0028]
In the contact 200 thus formed, when the fitting part 210 is fitted into the groove 121, the contact part 220 faces the housing part 110 of the body 100 from the slit 114, and the connection part 230 is outside the body 100, that is, It faces the back side of the body 100. In particular, the tip of the connection portion 230, that is, the portion in contact with the conductive patterns 413a, 413b, and 413c has the same height as the claw 122a of the engagement claw 122.
[0029]
The contact 200 thus formed is attached to the body 100 in a state where the contact part 220 is exposed from the slit 114 to the housing part 110 side. At this time, the raised portion 211 and the barb 212 of the fitting portion 210 bite into the groove 121 of the body 100, so that the contact 200 is fixed to the body 100.
[0030]
Next, a procedure for mounting the ECM 300 on the substrate 400 using the electronic component mounting socket A configured as described above will be described.
[0031]
First, the ECM 300 is fitted into the microphone holding holder 500. Next, the ECM 300 is housed in the housing 110 of the electronic component mounting socket A together with the microphone holding holder 500. At this time, the contact portion 220 of the center contact 200 contacts the contact 310 on the inner peripheral side, and the contact portions 220 of the contacts 200 on both sides contact the outermost contact 320. As described above, since the contacts 200 are in contact with the outermost two contacts at the two outer positions, it is possible to prevent the ECM 300 from being mounted in an inclined state, and to ensure more reliable contact. Can be.
[0032]
The electronic component mounting socket A to which the ECM 300 has been mounted in this way is mounted on the substrate 400.
The electronic component mounting socket A is placed on the projection 410 with the engagement claws 111 and 111 aligned with the notches 412 and 412 on the side surface of the projection 410 of the substrate 400. That is, the electronic component mounting socket A is brought in the direction indicated by the arrow α in FIGS. This position is the insertion position of the electronic component mounting socket A. In this state, the dimensions of the three conductive patterns 413a, 413b, and 413c are set such that the connection portions 230 of the three contacts 200 are already on the upper side (see FIG. 6).
[0033]
From this state, the electronic component mounting socket A is slid toward the base end side of the projection 410 as shown by an arrow β in FIGS. Due to this sliding, the engaging claws 122 capture the edge of the side surface of the convex portion 410 from the cutout portions 412 412 of the side surface portion, and the engaging claw 111 captures the notch portion 411 of the distal end portion of the convex portion 410. . Thus, the electronic component mounting socket A is mounted on the projection 410 of the substrate 400.
[0034]
In this state, since the substrate 400 is between the claws 111a, 122a, 122a of the engaging claws 111, 122, 122 and the bottom surface of the body 100, the connecting portions 230 of the contacts 200 are connected to the conductive patterns 413a, 413b, 413c. It will be in pressure contact. Further, during a period from the state where the electronic component mounting socket A is placed on the projection 410 to the state where the electronic component mounting socket A is slid, the connection portions 230 of the contacts 200 are electrically conductive patterns 413a, 413b and 413c. Therefore, the insulating member of the substrate 400 is not shaved by the slide. In other words, since the shavings of the insulating member do not get caught between the conductive patterns 413a, 413b, 413c and the connecting portion 230, good conductivity between them is guaranteed.
[0035]
Further, as shown in FIG. 7, a rib 610 protrudes from the back side of a housing 600 of a mobile phone or the like as an electronic device incorporating the board 400 to which the electronic component mounting socket A is mounted. The rib 610 is formed at a position surrounding the sound hole 620 opened in the housing 600.
[0036]
When the electronic component mounting socket A to which the ECM 300 is mounted is mounted on the housing 600, the rib 610 surrounds the sound hole 511 of the microphone holding holder 500. That is, a space surrounded by the rib 610 is formed between the sound holes 511 and 620. The rib 610 has a significance of preventing sound leakage and a significance of changing acoustic characteristics depending on the size of the space.
[0037]
In the electronic component mounting socket A described above, the contact 200 is bent in a substantially hairpin shape, but the electronic component mounting socket according to the present invention is not limited to this. For example, as shown in FIG. 8A, the contact 200 includes a fitting portion 210 for fixing to the body 100, a contact portion 220 extending from the fitting portion 210, and a contact portion 220. Has a connecting part 230 extending from the fitting part 210 on the opposite side, but the connecting part 230 is not bent in a hairpin shape toward the back side of the fitting part 210, It may extend to the opposite side of 220. In this case, the distal end portion of the connection portion 230 is formed to be convexly curved downward and is securely connected to the conductive patterns 413a, 413b, and 413c. In this case, since the connection portions between the connection portions 230 of the contacts 200 and the conductive patterns 413a, 413b, 413c are located outside the electronic component mounting socket A, as shown in FIG. It is also possible to solder to.
[0038]
In the substrate 400 described above, the cutouts 411, 412, and 412 are formed at the tip end and the side surface of the protrusion 410, but it is not particularly necessary to form the cutouts 412 and 412 on the side surface. That is, even with the convex portion 450 as shown in FIG. 9, the electronic component mounting socket A can be slid and mounted. However, in this case, it is better to form the conductive patterns 413a, 413b, and 413c longer than the protrusion 410 in which the notch 412 is formed. This is because if the notch 412 on the side surface is not formed, the amount of sliding in the state where the connection part 430 of the contact 200 is in contact increases, so that the conductive patterns 413a, 413b, and 413c are provided with the notch 412. If the length is the same as that obtained, the insulating member of the convex portion 450 is shaved by the connecting portion 230, and the shavings are sandwiched between the conductive patterns 413a, 413b, 413c and the connecting portion 230. This is because good conductivity between the two may not be guaranteed.
[0039]
In the electronic component mounting socket A, the ECM 300 is attached to the housing 110 using the microphone holder 500. However, as shown in FIG. A fixing claw 116 for fixing the ECM 300 may be provided at the upper end of the wall 113 formed on the edge of the 110. In this case, there is an effect that the microphone holding holder 500 becomes unnecessary.
[0040]
The electronic component mounting socket A is not only used for mounting the ECM 300, but can also be used for mounting other types of microphones or other electronic components. In this case, it is a matter of course that the shape and the like of the housing portion, the contact, and the like must be appropriately changed according to the electronic component to be mounted.
[0041]
【The invention's effect】
The electronic component mounting socket according to claim 1,An electronic component mounting socket for mounting an electronic component on a substrate,A body formed of an insulating member and having a housing portion for housing the electronic component;Attached to the body to electrically connect between the electronic components housed in the housing and the pattern formed on the boardAnd a contact,The contact is a part that is inserted into and fitted into a groove formed in the body, and a part that is connected to one end of the fitting part and that is located in the housing part and that can contact an electronic component. And a connection portion that is a portion bent into a hairpin shape connected to the other end side of the fitting portion and that is located outside the body and can contact a pattern formed on the substrate,The body has at least substantially L-shaped engaging claws facing each other. When a convex portion protruding from an edge of the substrate is inserted between the engaging claws, the engaging claws are formed. Pinches the convex portion, and the contactConnectionAre in contact with the pattern formed on the substrate.
[0042]
With this electronic component mounting socket, the electronic component can be electrically connected to the circuit on the board simply by housing the electronic component in the housing portion, so that the electronic component is not soldered as in the related art, Can be easily installed. In particular, since the electronic component mounting socket does not require soldering, it is effective for mounting electronic components that are weak to heat, such as ECM. In addition, the body can be fixed to the substrate with a simple configuration, which contributes to labor saving of positive assembly.Moreover, since the contact is pressed against the pattern on the substrate, the connection between the contact and the pattern can be reliably ensured.
[0045]
Claims2In the electronic component mounting socket described in (1), one end of each of the plurality of contacts is separated from each other in the radial direction of the concentric circle. When the electronic component is accommodated in the accommodation section, the contact is configured to be electrically connected at a position corresponding to the contact.
[0046]
Therefore, the electronic component can be attached without providing a protruding contact as in the related art. That is, when using the conventional electronic components, the electronic component mounting socket had to be formed thicker by the amount of the protruding contacts, but with this electronic component mounting socket, it is not necessary to consider the protruding portion. It can be formed thin and small.
[0047]
Claims3In the electronic component mounting socket described in (1), the concentric contact located at the outermost periphery is a ground terminal, and the inner peripheral contact is a signal terminal, which accommodates an electronic component.
[0048]
For this reason, by using an electronic component in which the outermost contact, which is likely to cause a short-circuit accident, is used as a ground terminal, even if a short-circuit accident occurs, damage can be prevented.
[0051]
An electronic component mounting socket according to claim 4.Is the pattern on the board,While the body slides from the insertion position to the fixed position,ConnectionAnd has a length in contact with.
[0052]
Therefore, when the electronic component mounting socket is mounted on the board, the insulating member of the board is not shaved, so that shavings do not get caught between the conductive pattern and the connection portion, and a good conductive property between the two. Is guaranteed.
[0053]
Claims5In the electronic component mounting socket according to the first aspect, means for positioning the body at a fixed position is provided on the body and the substrate.
[0054]
Since the positioning means is provided, the positioning of the electronic component mounting socket with respect to the substrate is facilitated, and the effect of more securely fixing the electronic component mounting socket to the substrate is exhibited.
[0055]
An electronic component mounting socket according to claim 6.A slit is formed on the back surface of the body and communicates with the groove and the accommodating portion and is capable of accommodating a main portion of the contact.
[0056]
For this reasonIn addition, the height of the body with respect to the substrate surface can be reduced.
[0057]
Claims7The electronic component mounting socket according to the present invention is configured such that an elastic member is disposed between an electronic component side wall and an inner wall of the housing portion of the body, and the electronic component is mounted in the housing portion by press-fitting the electronic component. Have been.
[0058]
Since the elastic member is interposed between the electronic component and the inner wall of the housing of the body, the electronic component can be easily housed in the housing of the body.
[0059]
Further, the electronic component mounting socket according to claim 8 is provided with a contact hole.Contact partHas elasticity and is electrically connected to the electronic component by pressing.
[0060]
Because of this configuration, the contact between the electronic component and the electronic component mounting socket is more reliably connected.
[0061]
The electronic component mounting socket according to claim 9 is, Electronic componentsA microphone, the upper surface of which is fixed to a sound hole formed in a housing for housing the body, and a rib formed around the sound hole of the housing interposed between the microphone upper surface and the housing. The microphone and the body are attached with the elastic member pressed and deformed.
[0062]
For this reason, the sound that has entered through the sound hole of the housing is reliably collected by the microphone, so that even a small sound can be reliably input.
[0063]
Claims10Electronic components according to the claims1, 2, 3, 4, 5, 6, 7, 8 or 9An electronic component that is housed in an electronic component mounting socket and mounted on a substrate, wherein a contact is formed in a planar shape along the case wall surface and is housed in the electronic component mounting socket, so that the contact becomes an electronic component. It is designed to be electrically connected to the component mounting socket.
[0064]
For this reason, this electronic component can be mounted without directly soldering to the board by using the above-mentioned electronic component mounting socket. Further, since the contacts are formed in a planar shape, the electronic components can be attached to the electronic component without providing a conventional protruding contact. That is, when using the conventional electronic components, the electronic component mounting socket had to be formed thicker by the amount of the protruding contacts, but with this electronic component mounting socket, it is not necessary to consider the protruding portion. It can be formed thin and small.
[0065]
Claims11Has a case formed in a cylindrical shape.
[0066]
When the electronic component mounting socket is housed in the housing portion of the body, it is not necessary to consider a direction in particular, so that the work becomes easy. Further, since there is no protruding contact as described above, it contributes to downsizing of the electronic component.
[0067]
Claims12In the electronic component according to the above, a plurality of contacts are formed concentrically on the bottom surface of the case via an insulating material.
[0068]
By adopting this configuration, the above-mentioned protruding contact is not required for the electronic component, which contributes to downsizing of the electronic component.
[0069]
ClaimsThirteenIn the electronic component according to (1), the concentric contact located on the outermost periphery is a ground terminal, and the contact on the inner periphery is a signal terminal.
[0070]
By configuring the contact of the electronic component in this way, the outermost contact that is most likely to cause a short circuit becomes a ground terminal, and there is an effect that even if a short circuit occurs, a particularly large problem does not arise. .
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a procedure for mounting an electronic component mounting socket according to an embodiment of the present invention to a substrate.
2A and 2B are drawings of an electronic component mounting socket according to an embodiment of the present invention, wherein FIG. 2A is a schematic plan view, FIG. 2B is a schematic side view, and FIG. FIG. 3D is a schematic bottom view, and FIG. 3D is a schematic sectional view taken along line II of FIG.
3A and 3B are drawings of a body constituting an electronic component mounting socket according to an embodiment of the present invention, wherein FIG. 3A is a schematic plan view, FIG. 3B is a schematic side view, and FIG. (C) is a schematic bottom view, and (D) is a schematic II-II sectional view of FIG. (A).
4A and 4B are drawings of a contact constituting an electronic component mounting socket according to an embodiment of the present invention, wherein FIG. 4A is a schematic plan view of a lead frame state, and FIG. It is a schematic side view of.
FIG. 5 is a schematic cross-sectional view showing a procedure for mounting the electronic component mounting socket according to the embodiment of the present invention to a board.
FIG. 6 is a schematic plan view showing a relationship between an electronic component mounting socket according to the embodiment of the present invention and a protrusion of a substrate to which the electronic component mounting socket is mounted.
FIG. 7 is a schematic sectional view showing a state in which the electronic component mounting socket according to the embodiment of the present invention is incorporated in an electronic device.
8A and 8B are drawings showing another embodiment of the present invention, in which FIG. 8A is a schematic sectional view showing a procedure for mounting an electronic component mounting socket on a board, and FIG. It is a schematic side view explaining an example of connection of a contact and a conductive pattern at the time of using a component mounting socket.
FIG. 9 is a schematic cross-sectional view showing a procedure for mounting the electronic component mounting socket according to the embodiment of the present invention to another substrate.
FIG. 10 is a schematic sectional view of an electronic component mounting socket according to another embodiment of the present invention.
FIG. 11 is a schematic perspective view of a conventional electronic component mounting socket of this type and an ECM mounted thereon.
[Explanation of symbols]
A Electronic component mounting socket
100 body
110 accommodation
111, 122 Locking claw
200 contacts
220 contacts
230 Connection
300 ECM (electronic parts)
400 substrates
413a, 413b, 413c pattern

Claims (13)

An electronic component mounting socket for mounting an electronic component on a substrate, comprising a body formed of an insulating member and having a housing portion for housing the electronic component, and an electronic component housed in the housing portion and a pattern formed on the substrate. And a contact mounted on the body for electrically connecting between the fitting, the contact being inserted into a groove formed in the body and fitted, and a fitting And a contact portion located in the housing portion and capable of contacting the electronic component, and a portion bent into a hairpin shape and connected to the other end side of the fitting portion, and a lower portion of the body. And a connection portion that can be in contact with a pattern formed on the substrate, and at least substantially L-shaped locking claws facing each other are formed on the body. Board edge between nails Wherein the convex portion is projected is inserted, that the locking pawl is held between the convex portion, connecting portions of the contacts are brought into contact with the pattern formed on the substrate And electronic parts mounting socket. In the electronic component, a plurality of contacts are provided concentrically on a bottom surface forming a case via an insulating material, and one ends of the plurality of contacts are separated from each other in a radial direction of the concentric circles. The electronic component mounting socket according to claim 1, wherein the electronic component mounting socket is electrically connected at a position corresponding to the electronic component. 3. The electronic component mounting socket according to claim 2, wherein the concentric contact located on the outermost periphery is a ground terminal, and the contact on the inner periphery is a signal terminal. 4. The electronic component according to claim 1, wherein the pattern on the substrate has a length in contact with the connection part of the contact while the body slides from the insertion position to the fixed position. Mounting socket. 5. The electronic component mounting socket according to claim 1, wherein the body and the substrate are provided with means for positioning the body at a fixed position. 6. The electronic component mounting according to claim 1, wherein a slit that communicates with the groove and the housing and that can house a main part of the contact is formed on a back surface of the body. socket. An elastic member is arranged between a side wall of the electronic component and an inner wall of the housing portion of the body, and the electronic component is attached to the housing portion and housed by press-fitting the electronic component. The electronic component mounting socket according to 3, 4, or 5. 7. The electronic component mounting socket according to claim 1, wherein the contact portion of the contact has elasticity and is electrically connected to the electronic component by press contact . The electronic component is a microphone, a top surface of which is fixed to a sound hole formed in a housing for housing the body, and a rib formed around the sound hole of the housing and the top surface of the microphone and the housing. The electronic component according to claim 1, 2, 3, 4, 5, 6, 7, or 8, wherein the microphone and the body are attached in a state where an elastic member interposed between the bodies is pressed and deformed. Mounting socket. An electronic component that is housed in the electronic component mounting socket according to claim 1, 2, 3, 4, 5, 6, 7, 8, or 9 and is mounted on a substrate, and the contact element is planar along a case wall surface. Is formed and accommodated in the electronic component mounting socket, whereby the contact is electrically connected to the electronic component mounting socket. The electronic component according to claim 9, wherein the case is formed in a cylindrical shape. 12. The electronic component according to claim 10, wherein a plurality of contacts are formed concentrically on the bottom surface of the case via an insulating material. 13. The electronic component according to claim 12, wherein the concentric contact located at the outermost periphery is a ground terminal, and the inner contact is a signal terminal.

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