JP3491677B2 - Opto-electric hybrid board and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an opto-electric hybrid board having an opto-electric conversion function for use in optical communication, in which an optical waveguide section and an electric wiring section are mounted together, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, research and development of optical switching devices, optical interconnection devices, etc. have been actively carried out in order to realize large capacity and high speed communication. These devices have an electric signal processing unit, an optical signal processing unit, and an opto-electric conversion unit that mutually converts an optical signal and an electric signal.
The opto-electric conversion part is LD (laser diode) or PD
It is composed of a photoelectric conversion element such as (photodiode) and an electric element for driving or amplifying the photoelectric conversion element.

In the conventional optical interconnection, a silicon substrate is used for a substrate on which an optical waveguide is formed and an optical element is mounted due to its characteristics, and a substrate on which electric wiring is formed and an electric element is mounted is used. In many cases, a ceramic substrate or a printed circuit board is used. The substrates are connected by bonding wires in a state where the optical element substrate is mounted on the electric substrate.

Further, Japanese Patent Laid-Open No. 9-236731 discloses a substrate on which both an optical element and an electric element are mounted. This publication discloses a substrate in which both an optical element and an electric element are mounted on a ceramic wiring substrate and a siloxane-based polymer is used as a material for an optical waveguide.

[0005]

However, the prior art having a structure in which the substrate on which the optical waveguide is formed and the optical element is mounted and the substrate on which the electrical wiring is formed and the electrical element is mounted are connected by the bonding wire. However, since the wire is relatively long, if the drive frequency is increased to increase the transmission capacity, noise is superimposed on the signal, and it is not possible to realize higher frequencies.

The mixed substrate disclosed in Japanese Unexamined Patent Publication No. 9-236731 has a structure in which an optical waveguide made of a siloxane polymer is formed on a ceramic multilayer wiring substrate. As described above, when the wiring board and the optical waveguide are made of different materials, it is necessary to form the electrical insulating layer of the wiring board and the optical waveguide by different materials in separate processes. It has been difficult to achieve three-dimensional complete mixed mounting and cost reduction of the waveguide section and the electric wiring section. The siloxane-based polymer used as a resin for an optical waveguide in the present mixed substrate is difficult to form fine wiring and via holes by photosensitivity, and therefore cannot be used as a material for an electric insulating film.

In view of the above problems, the present invention provides an opto-electric hybrid board and a method of manufacturing the opto-electric hybrid board in which the optical waveguide section and the electric wiring section can be three-dimensionally mixed and reduced in cost. To aim.

[0008]

In order to achieve the above object, an opto-electric hybrid board according to the present invention is an optical waveguide comprising an electric wiring portion having an electric wiring layer and an electric insulating layer, and a core portion and a clad portion. An optical / electrical hybrid substrate, wherein the electrical insulating layer of the electrical wiring portion and the optical waveguide portion are made of the same material, and the core portion of the optical waveguide portion is made of the same material. Has a part that is dimensionally curved
And one end of the optical waveguide portion is the opto-electric hybrid board.
End on the side surface of the optical waveguide and the other end of the optical waveguide is
It is characterized in that it is terminated on the surface of the electric hybrid board .

According to the opto-electric hybrid board of the present invention configured as described above, since the electric wiring portion and the optical waveguide portion can be formed in the same process, the optical waveguide portion and the electric wiring portion can be formed. It is possible to achieve three-dimensional mixed mounting and cost reduction of the opto-electric hybrid mounting substrate.

[0010]

[0011]

[0012]

[0013]

[0014]

The method for manufacturing an opto-electric hybrid board according to the present invention is an opto-electric hybrid board including an electric wiring portion having an electric wiring layer and an electric insulating layer, and an optical waveguide portion including a core portion and a clad portion. A method of manufacturing a substrate, wherein a photosensitive resin whose refractive index is changed by the amount of exposure light to be irradiated is used as the material, and a refractive index of a portion which becomes a core portion of the photosensitive resin which constitutes the optical waveguide is to be larger than the refractive index of the portion to be the cladding portion of the photosensitive resin, the exposure light by scanning while focusing on the desired position of the photosensitive resin, the core portion of the optical waveguide section, before
One end of the optical waveguide is a side surface of the opto-electric hybrid board.
, And the other end of the optical waveguide section is
The method is characterized by including a step of forming a three-dimensional curved line in the photosensitive resin so as to terminate at the surface of the mounting substrate .

As a result, the electric wiring portion and the optical waveguide portion can be formed in the same process, and the optical waveguide portion and the electric wiring portion can be three-dimensionally mixed and the cost of the opto-electric hybrid board can be reduced. To be

[0017]

[0018]

[0019]

[0020]

[0021]

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

(First Reference Example ) FIG. 1 is a sectional view showing a first reference example of an opto-electric hybrid board according to the present invention.

The opto-electric hybrid board (hereinafter referred to as "mixed board") of this reference example has a copper wiring 2 and an interlayer via hole 3.
A ceramic multilayer wiring board 1 having electrical wiring formed on both surfaces and inside thereof, a fine electrical wiring portion formed on the ceramic multilayer wiring board 1 including an electrical insulating layer 4 and fine copper wiring 5, and an optical waveguide clad layer. 6 and an optical waveguide core layer 7, and an optical waveguide portion also provided on the ceramic multilayer wiring substrate 1. An LD (laser diode) 8 is mounted on the ceramic multilayer wiring board 1 via high melting point solder bumps 9, and a driver silicon LSI 10 is mounted via solder bumps 11. Further, a control silicon LSI 12 is mounted on the fine electric wiring portion.

In the mixed board constructed as described above, the control silicon LSI 12 is the driver silicon LSI 1
0 is controlled and the driver silicon LSI 10 drives the LD 8. The LD 8 and the optical waveguide core 7 are optically coupled.

Next, the manufacturing process of the mixed substrate shown in FIG. 1 will be described with reference to FIG. FIG. 2 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

In the manufacturing process of the mixed board, first, as shown in FIG. 2A, the ceramic multilayer wiring board 1 is prepared.

First, alumina powder, flux, organic binder, solvent and plasticizer are thoroughly mixed in a ball mill, and this mixture is spread on a carrier tape with a blade and dried to form a green sheet. Next, the green sheet is perforated with a mold, a conductor paste made of metal powder is filled therein, and a desired conductor pattern is printed on the green sheet. Next, a plurality of green sheets thus configured are stacked and fired. As described above, the ceramic multilayer wiring board 1 is produced.

Subsequently, as shown in FIG. 1B, a fine electric wiring portion and an optical waveguide portion are formed on the ceramic multilayer wiring substrate 1.

First, a photosensitive resin to be the lower clad layer 6a of the optical waveguide portion and the electric insulating layer 4 of the fine electric wiring portion is spin-coated on the ceramic multilayer wiring substrate 1. Next, exposure and development are performed to form a via pattern in the portion used as the fine electric wiring portion, and the lower clad layer 6a is formed.
The portion used as is left as a uniform resin film, and the photosensitive resin is removed from the portion where the surface of the ceramic multilayer wiring board 1 is to be exposed. A resin whose refractive index changes with the amount of exposure light is used as the above-mentioned photosensitive resin, and in the process of exposure and development, the amount of exposure light is adjusted so that the refractive index of the lower clad 6b is slightly smaller than that of the optical waveguide core 7 described later. Adjust. Then, the photosensitive resin is cured at a temperature specific to the resin. Next, a plating resist is applied using a spin coating method, exposed and developed, and patterned to form fine copper wiring, and then copper plating is performed to form the fine copper wiring 5, and then the plating resist is applied. Remove.

Then, a photosensitive resin to be the optical waveguide core layer 7 and the electric insulating layer 4 of the fine electric wiring portion is spin-coated. Next, exposure and development are performed, a via pattern is formed in a portion used as a fine electric wiring, a core pattern is formed in a portion used as the optical waveguide core 7, and a portion where the surface of the ceramic multilayer wiring substrate 1 is to be exposed. Removes the photosensitive resin. A resin whose refractive index changes according to the amount of exposure light is used as the above-mentioned photosensitive resin. In the process of exposure and development, the optical waveguide core layer 7 is patterned and the refractive index of the core layer 7 is adjusted to the lower clad layer 6a. The exposure light amount is adjusted so as to be slightly larger. Then, the photosensitive resin is cured at a temperature specific to the resin. Next, a plating resist is applied using a spin coating method,
After performing exposure and development and patterning for forming fine copper wiring, copper plating is performed to form fine copper wiring 5
After forming, the plating resist is removed.

Subsequently, a photosensitive resin to be the upper clad layer 6b of the optical waveguide clad layer 6 and the electric insulating layer 4 of the fine electric wiring portion is spin-coated. Next, exposure and development are performed, a via pattern is formed in a portion used as a fine electric wiring, and a core pattern is formed in a portion used as the upper clad layer 6b to expose the surface of the ceramic multilayer wiring substrate 1. Removes the photosensitive resin. In addition,
A resin whose refractive index changes with the amount of exposure light is used as the above-mentioned photosensitive resin, and in the processes of exposure and development, the amount of exposure light is adjusted so that the refractive index of the upper cladding 6b is slightly smaller than that of the optical waveguide core 7. Then, the photosensitive resin is cured at a temperature specific to the resin. Next, a plating resist is applied using a spin coat method, exposed and developed, and patterned to form fine copper wiring, and then copper plating is performed to form fine copper wiring 5, and then plating is performed. Remove the resist.

Then, as shown in FIG.
Are mounted on the ceramic multilayer wiring board 1 using the high melting point solder 9.

Finally, as shown in FIG. 3D, the driver silicon LSI 10 is mounted on the ceramic multilayer wiring board 1 and the control silicon LSI 12 is mounted on the fine electric wiring portion via the solder bumps 11. To do.

Through the above steps, the LD8, which is an optical element, and the LSI1, which is an electrical element, have a three-layered fine electrical wiring portion consisting of the electrical insulating layer 4 and the fine copper wiring 5, and an optical waveguide.
A mixed board on which 0 and 12 are mounted is formed. According to the manufacturing method described above, the ceramic multilayer wiring board 1
The fine electric wiring part and the optical waveguide part can be formed in the same process using the same material as the material of the electrical insulating layer 4 and the optical waveguide in the upper separate parts. The number of wiring layers of the fine electric wiring portion can be arbitrarily selected. Further, the optical waveguide is not limited to the configuration of the three-dimensional optical waveguide as described above.

FIG. 3 is a side view of the optical waveguide in the hybrid board shown in FIG.

As can be seen from the figure, an optical waveguide is formed on the ceramic multilayer wiring substrate 1 in such a structure that the optical waveguide clad layer 6 surrounds the optical waveguide core layer 7. Although FIG. 3 shows an example in which three optical waveguide core layers 7 are provided, the number of core layers 7 may be changed according to the purpose of use of the optical circuit and the like.

(Second Reference Example ) FIG. 4 is a sectional view showing a second reference example of the hybrid substrate of the present invention.

The mixed board of this reference example has a ceramic multilayer wiring board 21 having electric wiring formed on both surfaces and inside by copper wiring 22 and interlayer via holes 23. On the upper surface of the wiring board 21, a fine electric wiring layer portion including an electric insulating layer 24 and a fine copper wiring 25 is formed over the entire surface. Further, an optical waveguide core is formed on a necessary portion on the fine electric wiring layer portion. An optical waveguide portion including the layer 27 and the optical waveguide clad 26 is formed. The electric insulating layer 24 and the optical waveguide portion are formed of the same material. Further, the LD 28 is mounted on the fine electric wiring layer portion through the high melting point solder bump 29, and the driver silicon L
The SI 30 and the control silicon LSI 32 are mounted via the solder bumps 31.

In the mixed board constructed as described above, the control silicon LSI 32 is the driver silicon LSI 1
0 for the driver silicon LSI 30 to drive the LD 28
To drive. The laser diode 28 and the optical waveguide core 27 are optically coupled.

Next, the manufacturing process of the mixed board shown in FIG. 4 will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

In the manufacturing process of the mixed board, first, as shown in FIG. 5A, a ceramic multilayer wiring board 21 is prepared.

First, alumina powder, flux, organic binder, solvent and plasticizer are thoroughly mixed in a ball mill, and then this mixture is spread on a carrier tape with a blade and dried to form a green sheet. Next, the green sheet is perforated with a mold, a conductor paste made of metal powder is filled therein, and a desired conductor pattern is printed on the green sheet. Next, a plurality of green sheets thus configured are stacked and fired. As described above, the ceramic multilayer wiring board 21 is produced.

Subsequently, as shown in FIG. 6B, a fine electric wiring portion is formed on the entire upper surface of the ceramic multilayer wiring board 21.

First, on the ceramic multilayer wiring board 21,
A photosensitive resin to be the electric insulation layer 24 is applied by spin coating. Next, exposure and development are performed to form a pattern of the electric insulating layer, and then heating is performed at a temperature unique to the resin to cure the resin. Next, a plating resist is applied by spin coating, exposure and development are performed, and after patterning the electric conductor layer, copper plating is applied to form the fine copper wiring 25. Furthermore, the desired fine electric wiring layer portion is formed on the ceramic multilayer wiring substrate 21 by repeating the above-described step of forming the electric insulating layer and the step of forming the fine copper wiring layer as many times as necessary.

Subsequently, as shown in FIG. 3C, an optical waveguide portion is formed on the fine electric wiring portion formed of the electric insulating layer 4 and the fine copper wiring 5 formed on the ceramic multilayer wiring substrate 21. .

First, the lower cladding layer 26a of the optical waveguide portion
The same resin as that of the electric insulating layer 24 is coated on the fine electric wiring portion by spin coating, exposed and developed, and the optical waveguide lower clad layer 26a is patterned into a desired shape. Cure the resin. Next, the same resin as the electrical insulating layer 24 to be the optical waveguide core layer 27 is applied by spin coating, exposed and developed to pattern the optical waveguide core layer 7 on a target portion, and the resin is applied at a temperature unique to the resin. Let it harden.

Next, the same resin as that of the electrical insulating layer 24 to be the optical waveguide upper clad layer 26b is applied by spin coating, exposed and developed, and the upper clad layer 26b is patterned into a desired shape. The resin is cured at the temperature of. A material whose refractive index changes with the amount of exposure light is used for the resin forming the clad layers 26a and 26b and the core layer 27, and in the process of exposure and development, patterning is performed and the refractive index of the optical waveguide core layer 27 is clad. The exposure light amount is adjusted so as to be slightly higher than the refractive index of the layer 26.

Finally, as shown in FIG.
8 is mounted on the fine electric wiring portion via the high melting point solder 29, and the driver silicon LSI 30 and the control silicon LSI 32 are mounted on the fine electric wiring portion via the solder bumps 31.

Through the above steps, the mixed substrate of this reference example is formed. According to the manufacturing method described above, the optical waveguide part is formed on the fine electrical wiring part of the ceramic multilayer wiring substrate 21 by the same process using the same material as the material of the electrical insulating layer 24 and the optical waveguide. You can
The number of wiring layers of the fine electric wiring portion can be arbitrarily selected. Further, the optical waveguide is not limited to the configuration of the three-dimensional optical waveguide as described above.

FIG. 6 is a sectional view showing an embodiment of the mixed board of the present invention.

The mixed board of this embodiment has a ceramic multilayer wiring board 41 having electrical wiring formed on both surfaces and inside by copper wiring 42 and interlayer via holes 43. On the upper surface of the wiring board 41, a fine electric wiring layer portion including an electric insulating layer 44 and a fine copper wiring 45 is formed over the entire surface. Further, in the fine electric wiring layer portion, an optical transmission core that is an optical waveguide is formed. The layer 53 and the optical receiving core layer 55 are formed. The electrical insulating layer 44 and the optical waveguide are made of the same material. The LD 48 is mounted on the fine electric wiring layer portion via the high melting point solder bump 49, and the PD 54, the driver silicon LSI 50 and the control silicon LSI 52 are mounted via the solder bump 51.

In the mixed substrate of the present embodiment having the above-mentioned configuration, the control silicon LSI 52 controls the driver silicon LSI 50, and the driver silicon LSI 5
0 drives the LD 48. The LD 48 and the optical transmission core 53, and the PD 54 and the optical reception core 55 are optically coupled to each other.

Next, the manufacturing process of the mixed substrate shown in FIG. 6 will be described with reference to FIG. FIG. 7 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

First, alumina powder, flux, organic binder, solvent and plasticizer are thoroughly mixed in a ball mill, and then this mixture is spread on a carrier tape with a blade and dried to form a green sheet. Next, the green sheet is perforated with a mold, a conductor paste made of metal powder is filled therein, and a desired conductor pattern is printed on the green sheet. Next, a plurality of green sheets thus configured are stacked and fired. As described above, the ceramic multilayer wiring board 41 is produced.

Subsequently, as shown in FIG. 9B, a fine electric wiring portion is formed on the entire upper surface of the ceramic multilayer wiring board 41.

First, on the ceramic multilayer wiring board 41,
A photosensitive resin to be the electric insulating layer 44 is applied by spin coating. Next, exposure and development are performed to form a pattern of the electric insulating layer, and then heating is performed at a temperature unique to the resin to cure the resin. Next, a plating resist is applied by spin coating, exposure and development are performed, patterning of the electric conductor layer is performed, and then copper plating is performed to form the fine copper wiring 45. Further, the desired fine electric wiring layer portion is formed on the ceramic multilayer wiring substrate 41 by repeating the above-mentioned step of forming the electric insulating layer and the step of forming the fine copper wiring as many times as necessary.

Subsequently, as shown in FIG. 7C, an optical waveguide is formed in the electric insulating layer 44 of the fine electric wiring portion formed on the ceramic multilayer wiring board 41. As the photosensitive resin, a resin whose refractive index changes depending on the amount of laser light as exposure light to be irradiated is used, and the optical waveguide core layers 53, 5
5 so that the refractive index of 5 is slightly higher than that of the surrounding electric insulating layer 44, the laser light is applied to the core layers 53, 5 of the photosensitive resin.
By scanning while focusing on the position where 5 is formed, three-dimensional optical waveguide core layers 53, 55 are formed on the photosensitive resin.
Write.

Finally, as shown in FIG.
8 is mounted on the fine electric wiring portion through the high melting point solder 49, and the PD 54 and the driver silicon LSI 5 are mounted.
0 and control silicon LSI 52 with solder bumps 51
It is mounted on the fine electric wiring part via.

Through the above steps, the mixed substrate of this embodiment is formed. According to the manufacturing method described above, the optical waveguide part is formed on the fine electrical wiring part of the ceramic multilayer wiring substrate 41 by the same process using the same material as the material of the electrical insulating layer 44 and the optical waveguide. You can

[0061]

EXAMPLES In order to realize the mixed substrate of the present invention, it is necessary to use a material having a high light transmittance and realizing a low cost fine processing. For example, an epoxy acrylate resin having a fluorene skeleton (V259P manufactured by Nippon Steel Chemical Co., Ltd.)
A) satisfies these conditions and has an optical loss of about 0.3 dB / cm as an optical waveguide for single mode, which is comparable to other polymer materials developed for optical waveguides. Has performance. Further, the above epoxy acrylate resin has UV photosensitivity,
Moreover, since the resolution required for miniaturization is high, it is possible to form electrical wiring of about several microns at low cost.

Here, a process of forming an optical waveguide using an epoxy acrylate resin having a fluorene skeleton will be described.

First, a coating solution in which an epoxy acrylate resin having a fluorene skeleton is dissolved is applied to a substrate forming an optical waveguide by a spin coating method, a dip coating method or the like to obtain a coating film. Next, baking treatment is performed to evaporate the solvent, and then exposure is performed to adjust the lower cladding to an appropriate refractive index. Then 160
By performing a heat treatment (post-baking) at 30 ° C. to 250 ° C. for about 30 to 90 minutes, the exposed portion is solidified to form the lower clad. Next, a coating solution in which an epoxy acrylate resin having a fluorene skeleton is dissolved is applied on the lower clad by a spin coating method, a dip coating method or the like to obtain a coating film. Next, after baking treatment is performed to evaporate the solvent, exposure is performed through a glass mask having a predetermined pattern to adjust the refractive index of the core and cure the target portion. At this time,
The refractive index of the core is 1 more than the refractive index of the cladding around it.
It must be small with a difference of less than%.

Next, the above-mentioned substrate is immersed in a potassium hydroxide or amine-based alkali developing solution to dissolve and develop the unexposed portion, and further, at 160 to 250 ° C. for 30 to 90 ° C.
By performing heat treatment (post bake) for about a minute,
The exposed portion is solidified to form the shape of the optical waveguide core. Next, as an upper clad, an epoxy acrylate resin having a fluorene skeleton is formed on the core and the lower clad by the same method as the above lower clad. Through the above steps, it has heat resistance and the core cross-section height and width are several μ.
A single-mode optical waveguide having a size of about m or a multi-mode optical waveguide having a height and width of a core cross section of about several tens of μm can be produced by a simple method.

As another embodiment, in a mixed board having a structure as shown in FIG. 1, for example, in order to effectively dissipate the heat generated from the LD 8, the ceramic multilayer wiring board 1 is made of a ceramic material. Aluminum nitride, silicon carbide, or beryllium oxide having good conductivity may be used.

Still another embodiment is shown in FIG.
In the mixed board having the structure as shown in FIG. 5, when the LD8 is die-bonded, the strain generated in the LD8 due to the difference in thermal expansion between the LD8 and the ceramic multilayer wiring board 1 due to the temperature change is reduced, and the ceramic multilayer wiring board is reduced. As the first ceramic material, a material having a coefficient of thermal expansion close to that of the material of LD8 may be used.

Here, in the above-described embodiments and examples, the example in which the electric wiring portion and the optical waveguide portion are provided on the ceramic multilayer wiring substrate is shown, but the opto-electric hybrid board of the present invention is It is not always necessary that the electric wiring portion and the optical waveguide portion are provided on the substrate. Further, in the configuration in which the electric wiring portion and the optical waveguide portion are provided on the substrate, the substrate is not limited to the ceramic multilayer wiring substrate, and a substrate having any configuration such as a simple ceramic substrate or a single-layer wiring substrate can be used. The electric wiring portion and the optical waveguide portion may be provided in the.

The present invention is not limited to the above-described embodiments and examples, and various modifications and improvements may be added without departing from the gist of the present invention.

[0069]

As described above, according to the present invention, the electric insulating layer of the electric wiring portion and the optical waveguide portion are made of the same material, and the core portion of the optical waveguide portion has a three-dimensional structure in the material. have a portion formed in a curved shape, one of the optical waveguide portion
The end ends at the side of the opto-electric hybrid board,
Since the end of one side terminates at the surface of the opto-electric hybrid board ,
The electric wiring portion and the optical waveguide portion can be formed in the same process, and the optical waveguide portion and the electric wiring portion can be three-dimensionally mixedly mounted and the cost of the opto-electric hybrid board can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first reference example of an opto-electric hybrid board according to the present invention.

FIG. 2 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

FIG. 3 is a side view of an optical waveguide in the hybrid board shown in FIG.

FIG. 4 is a cross-sectional view showing a second reference example of the opto-electric hybrid board according to the present invention.

FIG. 5 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

FIG. 6 is a sectional view showing an embodiment of an opto-electric hybrid board according to the present invention.

FIG. 7 is a cross-sectional view showing a manufacturing process of the mixed board shown in FIG.

[Explanation of symbols]

1,21,41 Ceramic multilayer wiring board 2,22,42 copper wiring 3,23,43 Interlayer via hole 4,24,44 Electrical insulation layer 5,25,45 Fine copper wiring 6,26 Optical waveguide clad layer 6a, 26a Lower clad layer 6b, 26b Upper clad layer 7,27 Optical waveguide core layer 8, 28, 48 LD (laser diode) 9,29,49 High melting point solder bump Silicon LSI for 10, 30, 50 drivers 11,31,51 Solder bump 12, 32, 52 Control silicon LSI 53 Optical transmission core layer 54 PD (photodiode) 55 Optical receiving core layer

Front page continuation (51) Int.Cl. ⁷ Identification code FI H05K 3/46 G02B 6/12 B // H01L 31/0232 M H01S 5/022 H01L 31/02 C (72) Inventor Masataka Ito Tokyo Port 5-7-1, Shiba-ku, NEC Within NEC Corporation (72) Inventor Yoshinobu Kanayama 5-7-1, Shiba 5-chome, Minato-ku, Tokyo (72) Inventor Masahiko Fujiwara 5-5 Shiba, Minato-ku, Tokyo No. 7-1 within NEC Corporation (56) Reference JP 4-172307 (JP, A) JP 1-269903 (JP, A) JP 9-318831 (JP, A) JP 6-310833 (JP, A) JP 62-174996 (JP, A) JP 11-72638 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 1/02 H05K 3/46 G02B 6/13

Claims (2)

(57) [Claims] 1. An opto-electric hybrid board comprising an electric wiring portion having an electric wiring layer and an electric insulating layer, and an optical waveguide portion including a core portion and a clad portion, wherein the electric wiring portion is electrically insulated. The layer and the optical waveguide portion are made of the same material, and the core portion of the optical waveguide portion has a portion formed in the material in a three-dimensional curved shape.
And one end of the optical waveguide portion is the opto-electric hybrid board.
End on the side surface of the optical waveguide and the other end of the optical waveguide is
An opto-electric hybrid board characterized by terminating at the surface of the electro-mix board. 2. A method of manufacturing an opto-electric hybrid board comprising an electric wiring part having an electric wiring layer and an electric insulating layer, and an optical waveguide part comprising a core part and a clad part, said electric wiring part. And a step of forming the optical waveguide section, the electrical insulating layer of the electrical wiring section and the optical waveguide section are made of the same material, and the refractive index is changed by the amount of exposure light to be irradiated. A photosensitive resin that changes is used as the material so that the refractive index of the core portion of the photosensitive resin forming the optical waveguide portion is higher than the refractive index of the cladding portion of the photosensitive resin. By exposing light to a desired position of the photosensitive resin while scanning the core portion of the optical waveguide portion so that one end portion of the optical waveguide portion is the opto-electrical portion.
The other end of the optical waveguide section ends on the side surface of the mixed board.
A method of manufacturing an opto-electric hybrid board, comprising the step of: three-dimensionally forming a curved line in the photosensitive resin so as to terminate on the surface of the opto-electric hybrid board.