JP2012044038A - Heat dissipation structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic device, which is not easily broken even if the device is installed in an outdoor location or a high humidity location, and has higher heat dissipation effect.SOLUTION: A heat dissipation structure includes a first housing that accommodates an electric component generating heat and is formed of at least five surfaces, a second airtight housing having the first housing therein so as to have an interval from the first housing, and an air blower which is installed on the first housing and forcibly convects air in the interval formed between the first housing and the second airtight housing or inside the first housing. Out of the surfaces forming the first housing, the surface on which the air blower is installed has holes for the air blower, and at least another surface has air holes. The air, which is forcibly convected, flows into or out between the interval formed between the first housing and the second airtight housing and the interior of the first housing through the air holes to be circulated.

Description

  The present invention relates to a heat dissipation structure for a sealed electronic device installed outdoors.

  In recent years, electronic devices are sometimes installed and operated outdoors, such as when electronic devices are installed in places where there are no buildings, or when portable electronic devices are carried and installed in various places.

  In general, electronic devices are vulnerable to moisture such as rain water and moisture, dust, dust, and the like, and may be damaged when exposed to them. When an electronic device is installed outdoors, a sealed structure is often used to prevent intrusion of moisture such as rainwater and moisture, dust, and dust.

  Note that a double-structure control device is disclosed as an electronic device having a sealed structure (see Patent Document 1). A conventional electronic device such as this control device will be described with reference to FIG. FIG. 12 is a cross-sectional view showing an example of the structure of a conventional electronic device.

  50 is an outer casing, 51 is an inner casing housed in the outer casing 50, 52 is a discharge section for discharging wind flowing through the gap between the outer casing 50 and the inner casing 51, and 53 is inside the inner casing 51. The housed electrical part 54 with large heat generation, 54 is also housed in the inner casing 51 with a gap, and 55 is mounted in contact with the electrical part 53 to discharge the heat in the electrical part 53. The fan 56, which is attached in contact with the inside of the outer casing 50, sucks outside air and discharges it into the outer casing 50.

  Inside the inner casing 51, heat is released from the electrical component 53 and the electrical component 54, and air whose temperature has risen due to the heat of the electrical component 53 is discharged from the fan 55 to stir the inside of the inner casing 51, and the inner casing 51. Heat transfer to the wall. The air discharged from the fan 56 flows through the gap between the outer casing 50 and the inner casing 51 while taking heat from the inner casing 51 and is discharged from the discharge portion 52.

JP-A-9-181471

  In the case of electronic devices such as those described above, since the entire housing is not hermetically sealed, if it is installed outdoors or in places with high humidity, moisture may enter the housing of the electronic device and the electronic device may break down. There is. In addition, since electronic devices are also vulnerable to heat, for example, if installed in a hot and sunny place, the temperature of the electronic device rises due to heat from the inside in addition to heat from the outside, causing the electronic device to fail There is a fear.

  The present invention has been made to solve such problems, and it is an object of the present invention to provide a heat dissipation structure for an electronic device that is less likely to fail even when installed outdoors or in a place with high humidity, and has a high heat dissipation effect. To do.

  The heat dissipation structure for an electronic device according to the present invention includes an electrical component that generates heat, and the first casing having a gap between the first casing composed of at least five surfaces and the first casing. And a second sealed housing containing the first housing and a gap formed between the first housing and the second sealed housing or forced into the first housing. A blower that convects air in general, and has a blower hole on a surface of the first casing that is attached to the blower, and at least one other surface has a vent hole. Then, the forced convection air passes between the gap formed between the first casing and the second sealed casing through the vent hole and the inside of the first casing. It is characterized by circulating by going back and forth.

  Further, the heat dissipation structure of the electronic device includes an electrical component that generates heat, and the first casing having a gap between the first casing including at least five surfaces and the first casing. A second hermetically sealed housing containing air, and having air holes in at least two surfaces among the surfaces constituting the first housing, and the air naturally convected by the heat generated from the electrical component is It is circulated by going back and forth between a gap formed between the first casing and the second sealed casing and the inside of the first casing through a vent hole.

  The heat dissipation structure of the electronic device is characterized in that the electrical component is attached with a surface having a small area facing up and down.

  Further, the heat dissipation structure of the electronic device is characterized in that the electric component that generates a large amount of heat is attached in contact with any surface of the first casing.

  The heat dissipation structure of the electronic device is characterized in that a surface on which the electric component generating a large amount of heat is attached is the largest surface among the surfaces constituting the first casing.

  In the heat dissipation structure of the electronic device, the electrical components are a power source, a control device, and a recording device, and the power source and the recording device are attached in contact with a surface of the first casing.

  Moreover, the heat dissipation structure of the electronic device is characterized in that an electrical component that generates a large amount of heat among the electrical components is disposed below the first casing.

Therefore, according to the present invention, the sealed structure makes it difficult to break down even when installed outdoors or in high-humidity locations, and further efficiently circulates the wind inside the housing to efficiently dissipate heat from electronic devices. Structure can be provided.

It is a perspective view of the outer side casing of the electronic device which is one Example of this invention. It is a perspective view of the inner side housing | casing of the electronic device which is one Example of this invention. 1 is a perspective view of an outer casing and an inner casing of an electronic apparatus that is an embodiment of the present invention. It is sectional drawing 1 of the electronic device which is one Example of this invention. It is sectional drawing 2 of the electronic device which is one Example of this invention. It is sectional drawing 3 of the electronic device which is one Example of this invention. It is sectional drawing which shows the mode of the thermal radiation of the control apparatus of the electronic device which is one Example of this invention. It is sectional drawing 2 'of the electronic device which is one Example of this invention. It is sectional drawing 3 'of the electronic device which is one Example of this invention. It is a perspective view of the outer side housing | casing of the electronic device which is the other Example of this invention. It is a perspective view of the inner side housing | casing of the electronic device which is the other Example of this invention. It is sectional drawing which shows an example of the structure of the conventional electronic device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. FIG. 1 is a perspective view of an outer casing of an electronic apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of the inner casing of the electronic apparatus according to the embodiment of the present invention. FIG. 3 is a perspective view of an outer casing and an inner casing of an electronic apparatus according to an embodiment of the present invention. Here, the electronic device is described as a recording device that records an image or the like sent from the camera, but the electronic device is not limited to the recording device, and any electronic device may be used.

  In FIG. 1, 10 is a box-shaped outer casing composed of a rectangular or square back and upper, lower, left and right surfaces, 11 is an upper fixing portion A for fixing an inner casing attached to the inner upper portion of the outer casing, Reference numeral 12 denotes a lower fixing portion A for fixing the inner casing attached to the inner lower portion of the outer casing, and 13 is composed of a surface having the same shape as the back of the outer casing 10 and upper, lower, left and right surfaces. Is a door portion hermetically sealed as an electronic device by being connected to one side using a hinge or the like and closed so as to be combined with each side of the outer casing 10. In addition, the door part 13 demonstrates as a front surface of the outer side housing | casing 10, when closed.

  In FIG. 2, reference numeral 20 denotes a box-shaped inner casing that is housed in the outer casing 10, and is composed of at least a back surface and upper, lower, left, and right surfaces that are smaller than each surface constituting the outer casing 10, and 22 is an inner casing. 20 is a circular vent hole provided on the back surface of the inner casing 20 as a wind passage, 23 is a circular vent hole provided on the left side surface of the inner casing 20, and 24 is a right side surface of the inner casing 20. A circular vent hole provided as a wind path provided for the wind, 25 a circular vent hole provided as a wind path provided in the bottom surface of the inner casing 20, and 26 a wind vent provided in the ceiling surface of the inner casing 20. A circular ventilation hole 27 serving as a passageway, 27 is an upper fixing portion B for fixing the inner housing 20 provided in front of the ceiling surface of the inner housing 20 to the outer housing 10, and 28 is provided in front of the bottom surface of the inner housing 20. The inner casing 20 is changed to the outer casing 10. The lower fixing parts B and 30 are used to convert the input AC power into DC power or supply the stored power to each electrical component (cable is not shown), 31 is the entire electronic device A control device that performs control and processing, 32 is a recording device that records images and the like transmitted from the outside, 33 is a printed circuit board that controls lighting of LEDs (not shown), and 34 is the air inside the inner casing 20. It is a fan that sucks and discharges to the outside of the inner casing 20 through the vent hole 26. The power supply 30, the control device 31, and the printed circuit board 33 are attached in contact with the inner wall of the inner casing 20, respectively. Moreover, what operates using the electric power in this electronic device will be generically called an electrical component. These electrical components are mounted with the small area facing down (toward the direction of the wind) so as not to impede the flow of the wind.

  Here, the inner casing 20 is described as having no front surface, but there may be a case where it is not actually present or a part thereof. It is better to have the front side, and it is better not to consider the ease of maintenance such as taking out the recording apparatus, and any shape may be taken according to the purpose. In FIG. 3, the case where there is a front surface will be described.

  In FIG. 3, reference numeral 21 denotes a circular ventilation hole provided on the front surface of the inner casing 20.

  A state where the inner casing 20 is housed in the outer casing 10 will be described. The inner casing 20 is housed inside the outer casing 10 such that the upper fixing portion B27 and the lower fixing portion B28 of the inner casing 20 overlap with the upper fixing portion A11 and the lower fixing portion B12 of the outer casing 10, respectively. Each of the upper fixing portion B27 of the inner casing 20 and each of the upper fixing portion A11 of the outer casing 10, and each of the lower fixing portion B28 of the inner casing 20 and each of the lower fixing portions B12 of the outer casing 10 are screwed. Fixed using. Then, the electronic device is hermetically sealed by rotating and closing the door portion 13 with the side connected to the outer casing 10 as an axis.

  Next, with reference to FIGS. 4-7, about the flow of the wind inside the electronic device of this invention, and the mode of heat dissipation, the case where the fan is (A) operating and (B) is stopped in the angle figure This will be explained separately. 4 is a cross-sectional view of an electronic apparatus according to an embodiment of the present invention, taken along a broken line a in FIG. FIG. 5 is a cross-sectional view of an electronic apparatus according to an embodiment of the present invention, taken along a broken line b in FIG. The component parts and symbols are as described above. Moreover, although the part demonstrated as the front surface of the outer housing 10 is the door part 13, it demonstrates as the front surface of the outer housing 10 as mentioned above. 4-9, the thick arrow shows the state of forced convection (wind flow), the thin wavy arrow shows the state of natural convection, and the thin arrow in FIG. 7 shows the state of heat conduction.

  4 (A) and 5 (A), when the fan 34 is operating, air is circulated inside the enclosure by forced convection to carry heat, and the temperature inside the enclosure is averaged. The fan 34 sucks the air inside the inner casing 20 warmed by the heat released from the electrical components, and discharges the air toward the ceiling surface of the outer casing 10 through the vent hole 26. The air that has collided with the ceiling surface of the outer casing 10 is dispersed in all directions, and flows outward along the ceiling surface of the outer casing 10 through the gap between the ceiling surface of the outer casing 10 and the ceiling surface of the inner casing 20. At this time, the heat carried by the air is transmitted to the ceiling surface of the outer casing 10 and radiated from the ceiling surface of the outer casing 10 to the outside air. The air that has flowed outward through the gap collides with the front, rear, left, and right surfaces of the outer casing 10, and flows downward through the gap between the front, rear, left, and right surfaces of the outer casing 10 and the front, rear, left and right surfaces of the inner casing 20, respectively. At this time, the heat generated from each electrical component is transmitted to the front, rear, left and right surfaces of the inner housing 20 and further transmitted to the air flowing downward from the front, rear, left and right surfaces of the inner housing 20. This heat is transmitted to the front, rear, left and right surfaces of the outer housing 20 while being carried by the air, and is radiated to the outside air from the front, rear, left and right surfaces of the outer housing 20, and the air flowing through the gap is cooled. A portion of the cooled air flowing downward through the gap flows into the inner housing 20 from the vents 21, 22, 23, and 24, respectively, and the remaining cooled air further flows downward. Each of the flow collides with the bottom surface of the outer housing 10 and flows through the gap between the bottom surface of the outer housing 10 and the bottom surface of the inner housing 20 toward the center. At this time, the heat carried by the air is transmitted to the bottom surface of the outer housing 10 and is radiated from the bottom surface of the outer housing 10 to the outside air, so that the air flowing through the gap is further cooled. The cooled air that has flowed toward the center through the gap flows into the inside of the inner housing 20 from the air holes 25. The cooled air that has flowed into the inner housing 20 flows upward, and is circulated by being sucked and discharged again by the fan 34. At this time, the cooled air flowing upward in the inner housing 20 absorbs heat generated from each electrical component, and cools each electrical component. In this manner, air circulates in the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 and is efficiently dissipated.

  4 (B) and 5 (B), when the fan 34 is stopped, the air flow inside the housing is considerably smaller than when the fan 34 is operating, but the circulation flow is caused by natural convection. appear. The heat generated from each electronic component is transferred to the air inside the inner casing 20, and the heated air inside the inner casing 20 flows upward by natural convection. The air that has flowed upward passes through the stopped fan 34 and the vent hole 26, and then flows into the gap between the ceiling surface of the outer housing 10 and the ceiling surface of the inner housing 20. The air that has collided with the ceiling surface of the outer casing 10 is dispersed in all directions, and flows outward along the ceiling surface of the outer casing 10 through the gap between the ceiling surface of the outer casing 10 and the ceiling surface of the inner casing 20. At this time, the heat carried by the air is transmitted to the ceiling surface of the outer casing 10 and radiated from the ceiling surface of the outer casing 10 to the outside air. The air that has been radiated and cooled flows down through the gaps between the front and rear left and right surfaces of the outer housing 10 and the front and rear and left and right surfaces of the inner housing 20 by natural convection. At this time, the heat generated from each electrical component is transmitted to the front, rear, left and right surfaces of the inner housing 20 and further transmitted to the air flowing downward from the front, rear, left and right surfaces of the inner housing 20. This heat is transmitted to the front, rear, left and right surfaces of the outer housing 20 while being carried by the air, and is radiated to the outside air from the front, rear, left and right surfaces of the outer housing 20, and the air flowing through the gap is cooled. A portion of the cooled air flowing downward through the gap flows into the inner housing 20 from the vents 21, 22, 23, and 24, respectively, and the remaining cooled air further flows downward. Each of the flow collides with the bottom surface of the outer housing 10 and flows through the gap between the bottom surface of the outer housing 10 and the bottom surface of the inner housing 20 toward the center. At this time, the heat carried by the air is transmitted to the bottom surface of the outer housing 10 and is radiated from the bottom surface of the outer housing 10 to the outside air, so that the air flowing through the gap is further cooled. The cooled air that flows toward the center through the gap flows into the inner housing 20 from the air holes 25. The cooled air that has flowed into the inner casing 20 is heated by absorbing the heat released by each electrical component, and flows upward and circulates by natural convection. In this manner, even when the fan 34 is stopped, the air is circulated through the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 by natural convection, and the heat is efficiently radiated.

  In addition, each electrical component is mounted so that the surface with a small area with respect to the air flow direction faces the upstream side or the downstream side, so that the circulation efficiency is reduced without obstructing the air flow (less air resistance) It is increasing. Further, it may be attached with, for example, a corner so that the air resistance is reduced without directing the surface having a small area toward the upstream side or the downstream side.

  As described above, the fan 34 is operated, and the heat is circulated through the inside of the housing to prevent the heat from accumulating in a specific place, thereby preventing the failure of electrical parts. Since heat is transmitted without any problem, heat can be radiated from all surfaces of the outer casing 10 in a well-balanced manner, and the heat radiation effect is improved. Further, even if the fan 34 is not operated, the heat is radiated by the circulation of the wind inside the housing by natural convection, thereby ensuring the heat dissipation effect.

  FIG. 6 is a cross-sectional view taken along the broken line b in FIG. 3 when the electronic device is laid down with the back side being one embodiment of the present invention. This will be described below. The component parts and symbols are as described above. In addition, the wind flow is hardly changed from the above description, and the natural convection state when the fan is stopped is different. Here, although it is laid down, the relationship between the top, bottom, front, back, left, and right surfaces will be described as a ceiling surface even if the ceiling surface is laid down and turned to the right, for example, and the other surfaces are the same.

  In FIG. 6 (A), the flow of wind and the state of heat dissipation when the fan 34 is operating are the same as the flow of wind by forced convection in FIGS. 4 (A) and 5 (A). Omitted.

  In FIG. 6B, when the fan 34 is stopped, the flow of air inside the housing is considerably less than when the fan 34 is operating, but a circulating flow is generated by natural convection. The heat generated from each electronic component is transmitted to the air inside the inner casing 20, and the warmed air flows upward by natural convection. The air that has flowed upward becomes wind, flows through the vent hole 23, and flows into the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20. The air that has collided with the front surface of the outer housing 10 is dispersed in all directions, and flows along the front surface of the outer housing 10 toward the outer side through the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20. At this time, the heat carried by the air is transmitted to the front surface of the outer housing 10 and radiated from the front surface of the outer housing 10 to the outside air. The air that has been radiated and cooled is caused by natural convection to flow downward through the gaps between the ceiling surface, bottom surface, left and right side surfaces of the outer housing 10 and the ceiling surface, bottom surface, and left and right side surfaces of the inner housing 20. At this time, heat generated from each electrical component is conducted to the ceiling surface, bottom surface, and left and right side surfaces of the inner casing 20, and is transmitted to the air flowing downward from the ceiling surface, bottom surface, and left and right side surfaces of the inner casing 20, Carried by air. This heat is transmitted to the ceiling surface, bottom surface, and left and right side surfaces of the outer casing 20 while being carried by the air, and is radiated to the outside air from the ceiling surface, bottom surface, and left and right side surfaces of the outer casing 20, and the air flowing through the gap is cooled. Is done. Some of the cooled air that has flowed downward through the gap flows into the inner housing 20 from the vents 23, 24, 25, 26 and the fan 34, respectively, and the remaining cooled air further It flows downward, collides with the back surface of the outer housing 10, and flows through the gap between the back surface of the outer housing 10 and the back surface of the inner housing 20 toward the center. At this time, the heat carried by the air is transmitted to the back surface of the outer housing 10 and is radiated from the back surface of the outer housing 10 to the outside air, and the air flowing through the gap is further cooled. The cooled air that has flowed toward the center through the gap flows into the inside of the inner casing 20 from the air holes 22. The cooled air that has flowed into the inner casing 20 absorbs the heat generated from each electrical component, is warmed again, and flows upward and circulates by natural convection. In this manner, even when the fan 34 is stopped, the air is circulated through the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 by natural convection, and the heat is efficiently radiated.

  Here, when the electronic device is installed with the back face down, and the fan 34 is stopped, among the electrical parts inside the housing, the electrical components that generate a large amount of heat (in this embodiment, the back surface of the inner housing 20). The power supply 30 and the control device 31) that are disposed in contact with each other are arranged so as to be downward, so that the flow due to natural convection is increased, which is higher than the case where an electrical component that generates a large amount of heat is disposed upward. A heat dissipation effect can be obtained. On the other hand, even when the electronic device is installed upright, it is possible to enhance the heat dissipation effect by arranging the electric parts that generate a large amount of heat downward.

  FIG. 7 is a cross-sectional view showing a heat dissipation state of the electronic apparatus control apparatus according to an embodiment of the present invention. The component parts and symbols are as described above.

  The control device 31 generates heat and dissipates heat from the surface to the air inside the inner casing 20. Further, the heat generated from the control device 31 is conducted from the surface in contact with the inner casing 20 to the inner casing 20.

  Furthermore, with reference to FIGS. 8 and 9, the state of heat radiation inside the electronic apparatus when there is no front surface of the inner housing 20 will be described. 8 is a cross-sectional view of the electronic device taken along the broken line a in FIG. FIG. 9 is a cross-sectional view of the electronic device taken along broken line b in FIG. In addition, although a component and a code | symbol are as above-mentioned, it differs in the point which does not have the front surface of the inner side housing | casing 20 (open).

  In FIG. 8A, when the fan 34 is operating, only the air flow near the front surface of the outer housing 10 is different, and the air flow in the other directions is the same as the above-described flow. The description will focus on the flow of air near the front surface of the housing 10. The fan 34 sucks the air inside the inner casing 20 warmed by the heat generated from the electrical components, and discharges the air toward the ceiling surface of the outer casing 10 through the vent hole 26. The air that has collided with the ceiling surface of the outer casing 10 is dispersed in all directions, and flows outward along the ceiling surface of the outer casing 10 through the gap between the ceiling surface of the outer casing 10 and the ceiling surface of the inner casing 20. At this time, the heat carried by the air is transmitted to the ceiling surface of the outer casing 10 and radiated from the ceiling surface of the outer casing 10 to the outside air. Of the air that flows outward through the gap, the air that flows in the front direction collides with the front surface of the outer casing 10 and flows downward along the front surface of the outer casing 10. The air that flows downward flows into the inside of the inner casing 20 from the front surface of the inner casing 20 that is open. The air that has flowed into the inner housing 20 flows upward together with the air flowing from the lower direction, and is circulated by being sucked and discharged again by the fan 34. At this time, the cooled air flowing upward in the inner housing 20 absorbs heat generated from each electrical component and cools each electrical component. In this manner, air circulates in the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 and is efficiently dissipated.

  In FIG. 8B, when the fan 34 is stopped, the flow of air inside the housing is considerably less than when the fan 34 is operating, but circulating air is generated by natural convection. The heat generated from each electronic component is transmitted to the air inside the inner casing 20, and the warmed air flows upward by natural convection. The air that has flowed upward passes through the vent hole 23 and flows into the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20. The air that has collided with the front surface of the outer housing 10 is dispersed in all directions, and flows along the front surface of the outer housing 10 toward the outer side through the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20. At this time, the heat carried by the air is transmitted to the front surface of the outer housing 10 and radiated from the front surface of the outer housing 10 to the outside air. The air that has been radiated and cooled flows down through the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20 by natural convection. At this time, heat is transferred to the front surface of the outer casing 20 while being carried by the air, radiated from the front surface of the outer casing 20 to the outside air, and the air flowing through the gap is cooled. The cooled air flowing downward through the gap flows from the front surface of the opened inner casing 20 into the inner casing 20. The cooled air that has flowed into the inner housing 20 is heated by absorbing heat generated from each electrical component, and flows upward and circulates by natural convection. In this manner, even when the fan 34 is stopped, the air is circulated through the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 by natural convection, and the heat is efficiently radiated.

  FIG. 9 is a cross-sectional view taken along the broken line b in FIG. 3 when the electronic device is laid down with the back side being one embodiment of the present invention. The component parts and symbols are as described above. In addition, the air flow is hardly changed from the above description, and the natural convection state when the fan is stopped is different. Here, although it is laid down, the relationship between the top, bottom, front, back, left, and right surfaces will be described as a ceiling surface even if the ceiling surface is laid down and turned to the right, for example, and the other surfaces are the same. This will be described below.

  In FIG. 9A, the flow of air and the state of heat dissipation when the fan 34 is operating are the same as the flow of air by forced convection in FIG.

  In FIG. 9B, when the fan 34 is stopped, the air flow inside the housing is considerably smaller than when the fan 34 is operating, but a circulating flow is generated by natural convection. The heat generated from each electronic component is transmitted to the air inside the inner casing 20, and the warmed air flows upward by natural convection. The air flowing upward passes through the front surface of the inner casing 20 that is open and collides with the front surface of the outer casing 10. The air that has collided with the front surface of the outer housing 10 is dispersed in all directions, and flows along the front surface of the outer housing 10 toward the outer side through the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20. At this time, the heat carried by the air is transmitted to the front surface of the outer housing 10 and radiated from the front surface of the outer housing 10 to the outside air. The air that has been radiated and cooled flows down through the gaps between the ceiling surface, bottom surface, left and right side surfaces of the outer casing 10 and the ceiling surface, bottom surface, and left and right side surfaces of the inner casing 20 by natural convection. At this time, heat generated from each electrical component is conducted to the ceiling surface, bottom surface, and left and right side surfaces of the inner casing 20, and is transmitted to the air flowing downward from the ceiling surface, bottom surface, and left and right side surfaces of the inner casing 20, respectively. . This heat is transmitted to the ceiling surface, bottom surface, and left and right side surfaces of the outer casing 20 while being carried by the air, and is radiated to the outside air from the ceiling surface, bottom surface, and left and right side surfaces of the outer casing 20, and the air flowing through the gap is cooled. Is done. Some of the cooled air that has flowed downward through the gap flows into the inner housing 20 from the vents 23, 24, 25, 26 and the fan 34, respectively, and the remaining cooled air further It flows downward, collides with the back surface of the outer housing 10, and flows through the gap between the back surface of the outer housing 10 and the back surface of the inner housing 20 toward the center. At this time, the heat carried by the air is transmitted to the back surface of the outer housing 10 and is radiated from the back surface of the outer housing 10 to the outside air, and the air flowing through the gap is further cooled. The cooled air that has flowed toward the center through the gap flows into the inside of the inner casing 20 from the air holes 22. The cooled air that has flowed into the inner housing 20 is heated by absorbing heat generated from each electrical component, and flows upward and circulates by natural convection. In this manner, even when the fan 34 is stopped, the air is circulated through the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 by natural convection, and the heat is efficiently radiated.

  Here again, as in the case of FIG. 6, when the electronic device is installed with the back face down and the fan 34 is stopped, of the electrical components inside the housing, In such a case, the power supply 30 and the control device 31) arranged in contact with the back surface of the inner housing 20 are arranged so that the flow by natural convection is increased, and an electric component generating a large amount of heat is arranged upward. A higher heat dissipation effect can be obtained as compared with the case of doing so. On the other hand, even when the electronic device is installed upright, it is possible to enhance the heat dissipation effect by arranging the electric parts that generate a large amount of heat downward.

  As described above, when there is no front side of the inner casing 20 (the open side) is laid down and the fan 34 is stopped, air in the inner casing 20 is generated from each electrical component. Since the heat is absorbed and warmed, it flows upward due to natural convection, and directly collides with the front surface of the outer housing 10 to directly transfer the heat to the front surface of the outer housing 10, so that the heat dissipation effect is enhanced.

  Further, a configuration in which a connector is provided in the electronic apparatus with reference to FIGS. 10 and 11 and a part of the front surface of the inner casing 20 is left open will be described. FIG. 10 is a perspective view of the outer casing of the electronic apparatus according to the embodiment of the present invention. 11 is a perspective view of the inner housing of the electronic device according to one embodiment of the present invention.

  10, 14 is a connector part to which a cable or the like is connected for exchanging signals with the outside of the electronic device, and in FIG. 11, 29 is a recess part along the protruding part of the connector part 14.

  When the fan 34 is operating, except for the air flow near the connector 29 and near the front surface, the air flow and heat transfer inside the housing are almost the same as those described with reference to FIGS. Therefore, it demonstrates centering on a different part. The fan 34 sucks the air inside the inner casing 20 warmed by the heat generated from the electrical components, and discharges the air toward the ceiling surface of the outer casing 10 through the vent hole 26. The air that has collided with the ceiling surface of the outer casing 10 is dispersed in all directions, and flows outward along the ceiling surface of the outer casing 10 through the gap between the ceiling surface of the outer casing 10 and the ceiling surface of the inner casing 20. At this time, the heat carried by the air is transmitted to the ceiling surface of the outer casing 10 and radiated from the ceiling surface of the outer casing 10 to the outside air. Of the air that has flowed outward through the gap, the air that has flowed in the left side direction collides with the left side surface of the outer casing 10, and lowers the gap between the left side surface of the outer casing 10 and the left side surface of the inner casing 20. It flows in the direction. At this time, the heat generated from the electrical component (printed circuit board 33) is conducted to the left side surface of the inner casing 20, and is transmitted to the air flowing downward from the left side surface of the inner casing 20, and is carried by the air. This heat is transmitted to the left side surface of the outer casing 20 while being carried by the air, and is radiated to the outside air from each of the left side surfaces of the outer casing 20, so that the air flowing through the gap is cooled. A part of the cooled air flowing downward through the gap collides with the connector part 14 and is dispersed and flows downward, and another part of the cooled air which flows downward flows from the vent hole 23. The air flows into the inner housing 20 and the remaining air further flows downward, collides with the bottom surface of the outer housing 10, and flows through the gap between the bottom surface of the outer housing 10 and the bottom surface of the inner housing 20 toward the center. Of the air that flows outward through the gap between the ceiling surface of the outer housing 10 and the ceiling surface of the inner housing 20, the air that flows in the front direction collides with the front surface of the outer housing 10, and the outer housing 10. Flows downward along the front of the. Part of the air that has flowed downward flows downward through the gap between the front surface of the outer housing 10 and the front surface of the inner housing 20, and a part of the air flows from the front surface of the inner housing 20 that is open. The air flows into the inner housing 20 and the remaining air further flows downward, collides with the bottom surface of the outer housing 10, respectively, and the gap between the bottom surface of the outer housing 10 and the bottom surface of the inner housing 20 is directed toward the center. Flowing. At this time, the heat inside the inner housing 20 is transmitted to the front surface of the inner housing 20, is transmitted to the air flowing downward from the left side surface of the inner housing 20, and is carried by the air. This heat is transmitted to the front surface of the outer housing 20 while being carried by the air, and is radiated to the outside air from each of the left side surfaces of the outer housing 20, so that the air flowing through the gap is cooled. Further, the heat carried by the air is transmitted to the bottom surface of the outer housing 10 and is radiated from the bottom surface of the outer housing 10 to the outside air, and the air flowing through the gap is further cooled. The cooled air that has flowed into the inner casing 20 flows upward together with the air flowing from the lower direction, and is circulated by being sucked and discharged again by the fan 34. At this time, the cooled air flowing upward in the inner housing 20 absorbs heat generated from each electrical component, and cools each electrical component. In this manner, air circulates in the gap between the outer casing 10 and the inner casing 20 and the inside of the inner casing 20 and is efficiently dissipated.

  When the fan 34 is stopped, there is almost no wind flow inside the housing, and the heat transfer is almost the same as in the case described with reference to FIGS.

  As described above, the fan 34 is operated, and the heat is circulated through the inside of the housing to prevent the heat from accumulating in a specific place, thereby preventing the failure of electrical parts. Since heat is transmitted without any problem, heat can be radiated from all surfaces of the outer casing 10 in a well-balanced manner, and the heat radiation effect is improved. Further, even if the fan 34 is not operated, the heat is radiated by the circulation of the wind inside the housing by natural convection, thereby ensuring the heat dissipation effect. That is, by providing a gap with the casing having a double structure, the high-temperature flow inside the inner casing and the low-temperature flow in the gap between the outer casing and the inner casing do not interfere with each other, and a high heat dissipation effect can be obtained.

  In the above description of the electronic apparatus, a part of the effect when the image recording apparatus is assumed has been described. However, in addition to the image recording apparatus, the apparatus is used for an electronic apparatus installed outdoors or indoors or an apparatus other than the electronic apparatus. Of course, the configuration, operation, and contents thereof can be variously modified without departing from the spirit of the present invention.

  Further, even if the direction of the wind discharged from the fan 34 is reversed and the wind is discharged into the inner casing 20, the same effect as the above-described configuration can be obtained only by the direction of the flow of the wind being reversed. be able to. In addition, a dedicated fan may be separately provided in the recording device 32 that generates a large amount of heat, whereby heat can be efficiently released from the recording device 32 to the inner housing 20.

  In short, the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in each embodiment. Furthermore, you may combine suitably the component covering different embodiment.

10: Outer housing, 11: Upper fixing member A, 12: Lower fixing member A, 13: Door portion, 14: Connector portion, 20: Inner housing, 21: Vent (front), 22: Vent (back), 23: Vent hole (left side) 24: Vent hole (right side) 25: Vent hole (bottom surface) 26: Vent hole (ceiling surface) 27: Upper fixing member B 28: Lower fixing member B 29 : Depression part, 30: power supply device, 31: control device, 32: recording device, 33: printed circuit board, 34: fan.

Claims (7)

A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing;
A blower attached to the first housing and forcibly convection air into a gap formed between the first housing and the second sealed housing or the first housing; Prepared,
Among the surfaces constituting the first housing, the surface to which the fan is attached has a hole for the fan, and at least one other surface has a vent hole, and the forced convection air is It is circulated by going back and forth between a gap formed between the first casing and the second sealed casing and the inside of the first casing through the vent hole. Heat dissipation structure for electronic equipment. A first housing that is configured with at least five surfaces, and that includes an electrical component that generates heat;
A second sealed housing enclosing the first housing with a gap between the first housing and the first housing,
Ventilation holes are provided on at least two surfaces of the surfaces constituting the first casing, and the air naturally convected by the heat generated from the electrical component is connected to the first casing and the first through the ventilation holes. A heat dissipation structure for an electronic device, wherein the heat dissipation structure is circulated by going back and forth between a gap formed between the two sealed casings and the inside of the first casing. A heat dissipation structure for an electronic device according to claim 1,
A heat dissipation structure for an electronic device, wherein the electrical component is attached with a small area facing up and down. A heat dissipation structure for an electronic device according to claim 1,
An electronic device heat dissipation structure, wherein an electrical component that generates a large amount of heat is attached in contact with any surface of the first casing. A heat dissipation structure for an electronic device according to claim 4,
The heat radiation structure for an electronic device is characterized in that the surface on which the electric component generating a large amount of heat is attached is the largest surface among the surfaces constituting the first casing. A heat dissipation structure for an electronic device according to claim 3, wherein
The electrical component is a power source, a control device, and a recording device, and the power source and the recording device are attached in contact with a surface of the first casing. A heat dissipation structure for an electronic device according to claim 1,
A heat dissipation structure for an electronic device, wherein an electric component generating a large amount of heat among the electric components is disposed below the first housing.

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