JP2006269575A - Cooling structure of electronic apparatus unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a small cooling structure of an electronic apparatus unit which has an excellent cooling characteristic. <P>SOLUTION: A printed board 19 mounted with a heat generating device 21 is provided in a casing 18 of a basic unit 17 made of a high conductivity material and having an air inlet port 18b and an air discharge port 18d. Heat from a heat generator 21a of the heat-generating device 21 is thermally conducted to the heat-dissipating surface 18e of the casing 18 via a heat spreader 22 and thermally conductive rubber 24. An expanded cooling unit 25 composed of a member for conducting and radiating high-temperature heat is detachably attached on the heat-dissipating surface 18e of the basic unit 17. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is a natural air-cooled electronic device unit, which is composed of a basic unit portion and an extended cooling unit portion, and an electronic device unit whose unit configuration can be changed by selecting the installation environment temperature or the priority of the mounting space. The present invention relates to a cooling structure or a cooling structure of an electronic device unit having a multi-stacked structure of a main printed board and an optional printed board.

  Some electronic equipment units are used for various purposes. For this reason, electronic equipment is required to have specifications that are small and can be used at high temperatures. The calorific value of the ash gradually increased, making it difficult to meet the demand. In particular, there is a contradictory relationship between the small size and the high cooling characteristics, and it has been very difficult to achieve both. Therefore, conventionally, the following has been performed as a countermeasure against temperature. That is, (1) natural air cooling was changed to forced air cooling to achieve a high temperature specification. In this case, since the cooling fan is mounted, the reliability of the unit is lowered, resulting in an increase in cost, an increase in electric power, and the like. In addition, a volume for mounting the cooling fan is required, and the housing becomes large. (2) Lower the installation environment temperature of the unit. In order to reduce the installation environment temperature of the electronic device unit, it is necessary to provide a forced air device on the outside, or to widen the installation place or replace the place in order to suppress the influence of other heat generating components. (3) The size of the housing of the electronic device unit is increased to improve the cooling characteristics. In the case of natural air cooling, the cooling characteristics are determined by the volume of the housing. Therefore, the size of the housing of the electronic device unit has been increased to improve the cooling efficiency.

  The case (3) will be described with reference to FIG. 5A shows a case of a standard unit, and FIG. 5B shows a case of a high environmental temperature countermeasure unit. In any case, a printed board 2 which is a heat generating component is provided inside the housing 1, and an arrow 3 Shows the heat flow from the inside of the housing 1 to the outside. In the case of FIG. 5B, the volume of the housing 1 is increased to enhance the cooling efficiency.

  Further, in a natural air-cooled electronic device unit, in order to improve the cooling efficiency, (4) measures to increase the opening ratio of the intake / exhaust port of the housing and to cool by inserting a large amount of air inside (5 ) Measures are taken to dissipate heat by transferring heat to the housing by heat conduction. The countermeasure of (4), that is, the case where the opening ratio of the intake / exhaust port of the housing is increased will be described with reference to FIG. Reference numeral 4 denotes a housing of the electronic device unit, 5 denotes an installation surface such as a floor, and a spacing member 6 such as a rubber leg is provided between the housing 4 and the installation surface 5. The column 7 is erected, and a horizontal printed main printed board 8 and an optional printed board 9 are attached to the column 7 in two upper and lower stages. A heat generating device 10 is mounted on the lower surface of the main printed board 8. An intake port 4 b is provided on the bottom surface 4 a of the housing 4, an exhaust port 4 d is provided on the top surface 4 c of the housing 4, and an intake / exhaust port 4 f is provided on the side surface 4 e of the housing 4. A two-dot chain line 11 is an intake / exhaust separation line. The intake / exhaust port 4f above the line 11 is substantially an exhaust port, and the intake / exhaust port 4f below the line 11 is substantially an intake port. An exhaust port 9 a is also provided at the center of the option printed board 9.

  In the above configuration, the cooling air flows from the intake port 4f on the bottom surface 4a and the side surface 4e of the casing 4 through the intake / exhaust port 4f as shown by the arrow 12, and the exhaust port 4d and the side surface 4e on the top surface 4c. Flows out from the intake / exhaust port 4 f above the line 11. 13 is a heat generating center portion formed in the central portion between the printed boards 8 and 9, 14 is a high temperature portion similarly formed between the printed boards 8 and 9, and the heat generating center portion 13 is substantially the same as the intake / exhaust separation line 11. It becomes height.

  FIG. 7 shows the countermeasure of (5), that is, the case where heat is conducted to the casing 15 to dissipate heat. The bottom surface 15a of the casing 15 is not provided with an intake port, and the top surface 15b is provided with an exhaust port 15c. An intake / exhaust port 15e is provided at 15d. A heat conductive rubber 16 is provided between the lower surface of the heat generating device 10 and the inner bottom surface of the housing 15, and heat from the heat generating device 10 of the main printed board 8 that generates a large amount of heat is transmitted through the heat conductive rubber 16 through the housing 15. The bottom surface 15a of the housing 15 is thermally conducted to dissipate heat, and the remaining heat is released from the exhaust port 15c provided on the top surface 15b of the housing 15. In this case, since heat is conducted to the housing 15 to dissipate heat, if the housing 15 is large, the cooling effect of the main printed board 8 is large, the heat transfer between the optional printed board 9 is small, and the temperature rise of each part is It is suppressed.

Other prior art document information related to the invention of this application is as follows.
JP 2003-298269 A JP 2004-363525 A JP 2000-36678 A JP 2000-252656 A

  The above measures (1) and (3), that is, the measures to install a cooling fan or increase the size of the housing, are implemented when the installation environment temperature is high, but the installation environment temperature is a problem. However, there were more cases where downsizing was required, and the request for downsizing could not be met. In addition, the measure (2), that is, lowering the installation environment temperature of the electronic device unit is not only a small number of cases where the installation environment temperature becomes a problem, but also becomes a major obstacle (constraint) when constructing the entire system. It was not preferable.

  In the measure of (4), as shown in FIG. 6, when the printed boards 8 and 9 are horizontally mounted and are stacked in multiple stages with natural air cooling, an intake port 4b and an exhaust port 4d are provided to increase the opening ratio. However, heat is trapped between the printed boards 8 and 9, and the heat generating center portion 13 and the high temperature portion 14 are generated. Further, even if the intake / exhaust port 4f is provided on the side surface 4e, the heat generating center 13 is located between the printed boards 8 and 9, and intake and exhaust are mixed, so the convection is delayed and the optional printed board 9 is provided with the exhaust port 9a. However, low-temperature air does not enter between the printed boards 8 and 9, and heat is trapped. Furthermore, when the heat generation amount of the main printed board 8 is large and the maximum allowable temperature of the optional printed board 9 is low, it is necessary to lower the specification of the ambient temperature of the electronic device unit. Further, since the exhaust port 4d is required on the top surface 4c side, if there is a small fallen object on the casing 4, there is a possibility of entering the casing 4, which causes a short circuit. Further, since the bottom surface 4a also has the intake port 4b, if there is a fine metal object on the installation surface 5, there is a risk of short circuit. Furthermore, a large space is required above and below the housing 4 in order to reduce the ventilation resistance. For example, a spacing member 6 such as a rubber leg is required between the bottom surface 4 a and the installation surface 5.

  In the case of FIG. 7, which is a countermeasure of (5), the cooling effect is large when the casing 15 is large, but the cooling effect is reduced in the case of a small unit. Further, when the heat generation amount of the main printed board 8 is large and the maximum allowable temperature of the optional printed board 9 is low, it is necessary to lower the temperature specification around the electronic device unit. Furthermore, since there is an exhaust port 15c on the top surface 15b, if there is a small fallen object on the case 15, it will enter the case 15 and cause a short circuit. In addition, the bottom surface 15a is not provided with an intake port, but since heat is radiated from the bottom surface 15a, it is necessary to perform a surface treatment so as to obtain a high emissivity. It is necessary to provide a lot of space.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a cooling structure for an electronic device unit that is small and has high cooling characteristics.

  According to a first aspect of the present invention, there is provided a cooling structure for an electronic device unit, which is made of a high thermal conductivity material, and includes a printed board on which a heat generating device is mounted inside a housing having an air inlet and an air outlet. With a basic unit that conducts heat to the heat radiating surface of the chassis, and an extended cooling unit that is detachably attached to the heat radiating surface of the basic unit, and is composed of highly heat-conducting and high-heat radiation members It is.

  The cooling structure of the electronic device unit according to claim 2 is made of a material having high thermal conductivity, and a printed board on which a heat generating device is mounted is provided inside a housing having an air inlet and an air outlet, and heat from the heat generating device is provided. Is heat-conducted on the heat-dissipating surface of the housing, and a basic unit part in which the cover part is detachably attached to the opening provided on the opposite side of the heat-dissipating surface, and one of them is a member with high heat conduction and high-heat radiation on the front and back It is formed in an open casing, and this opening is detachably attached to the opening of the basic unit instead of the cover, and includes an extended cooling unit having an intake port and an exhaust port. is there.

  The cooling structure for an electronic device unit according to claim 3 is a casing made of a high thermal conductivity material, installed on the installation surface via a spacing member, provided with an intake port on the bottom surface, and provided with an intake / exhaust port on the side surface. A heat generating device mounted on the upper surface in the housing and provided horizontally, and an option printed circuit board provided horizontally below the main printed board in the housing, for heat from the heat generating device. It is designed to dissipate heat by conducting heat to the top surface of the housing.

  The cooling structure of the electronic device unit according to claim 4 is made of a high heat conductive material, is directly installed on the installation surface, and has a casing provided with intake / exhaust ports on the side surface, and a heating device is mounted on the upper surface in the casing. A main printed board installed horizontally and an optional printed board installed horizontally below the main printed board in the housing, and heat from the heat generating device is conducted to the top surface of the housing to dissipate it. It is a thing.

  As described above, according to the first aspect of the present invention, the extended cooling unit portion is detachably attached to the heat radiation surface of the basic unit portion, and when the installation environment temperature is normal, the cooling structure is limited to the basic unit portion. When the installation environment temperature is high due to downsizing, the extended cooling unit part is attached to the heat radiation surface of the basic unit part to improve the cooling characteristics, and both miniaturization and high cooling characteristics can be realized.

  According to the second aspect, when the installation environment temperature is normal, the cooling structure is used only as the basic unit portion to reduce the size, and when the installation environment temperature is high, the expansion cooling unit is installed in the opening of the casing of the basic unit portion. The opening of the part is attached and the cooling characteristics are improved by heat conduction and heat radiation, so that both miniaturization and high cooling characteristics can be realized.

  According to the third aspect, the heat generating portion is positioned above the inside of the casing, and the heat is conducted to the top surface having good cooling efficiency to dissipate the heat, thereby improving the cooling efficiency. In addition, because the heat generating part is located above, the intake / exhaust separation line is also located above, and the intake / exhaust port on the side functions more as an intake port. Efficiency increases. In addition, since no exhaust port is provided on the top surface, a cooling space on the top surface side may be small, miniaturization is possible, and a short circuit due to intrusion of falling objects does not occur, thereby increasing safety.

  According to the fourth aspect of the present invention, the heat generating part is positioned above the inside of the casing, and the heat is conducted to the top surface with good cooling efficiency to dissipate the heat, thereby improving the cooling efficiency. Further, the heat that cannot be radiated from the top surface is radiated through the installation surface where the long side surface and the bottom surface are in contact with each other, and is effectively cooled. In addition, because the heat generating part is located above, the intake / exhaust separation line is also located above, and the side intake / exhaust ports often function as intake ports, and the side intake area on the longer side also increases. As the option printed board is effectively cooled, heat is not trapped between the printed boards, and the cooling efficiency is increased. Furthermore, since the temperature of the option printed board is lowered, it is possible to mount various types of printed boards, and since there are no intake and exhaust ports on the top and bottom sides, a short circuit occurs due to falling objects. Therefore, safety can be improved. In addition, since no exhaust port is provided on the top surface, the cooling space on the top surface side may be small and downsizing is possible.

Best Embodiment 1
The best mode for carrying out the present invention will be described below with reference to the drawings. FIGS. 1A and 1B show a longitudinal side view of a basic unit portion and a side view of an extended cooling unit portion of a cooling structure for an electronic device unit according to Embodiment 1 of the present invention. This is the best mode of implementation. The casing 18 of the basic unit portion 17 is formed of a material having high thermal conductivity such as aluminum. An intake port 18b is provided on the bottom surface 18a of the casing 18, and an exhaust port 18d is provided on the top surface 18c. A support column 7 is erected on the inner side of one side surface 18 e of the housing 18, a printed board 19 is attached to the support column 7 with screws 20, and a heat generating device 21 is mounted on the inner surface side of the printed board 19. 21 has a protruding heat generating part (die part) 21a. A metal heat spreader 22 is bonded to the heat generating portion 21a through an adhesive portion 23, and a heat conductive rubber 24 is provided between the heat spreader 22 and one side surface 18e of the housing 18, and the side surface 18e dissipates heat. It becomes a surface.

  Reference numeral 25 denotes an extended cooling unit portion made of a member having high heat conduction and high heat radiation, here, a heat sink, and its attachment portion 25a is detachably attached to the heat radiation surface 18e of the basic unit portion 17.

  In the above configuration, the black arrow 3 indicates a heat flow and the white arrow 12 indicates an air flow. The heat from the heat generating portion 21a of the heat generating device 21 is diffused to the heat spreader 22 by conduction, and then the case is interposed via the heat conductive rubber 24. The heat radiating surface 18e is thermally conducted and is radiated from the heat radiating surface 18e by heat conduction and heat radiation. Moreover, the heat emissivity can be increased and the cooling characteristics can be improved by surface-treating the heat radiating surface 18e by coating or the like. With such a structure, most of the heat generated from the heat generating device 21 is released from the housing 18, but since the amount of heat radiation depends on the surface area and state of the housing 18, the cooling characteristics are limited. When the installation environment temperature is normal, the extended cooling unit portion 25 is not attached to the basic unit portion 17 and only the basic unit portion 17 is provided, and the cooling structure is downsized. When the installation environment temperature is high, the attachment portion 25a of the extended cooling unit portion 25 is attached to the heat radiating surface 18e of the casing 18 of the basic unit portion 17 to further improve heat conduction and heat radiation to improve the cooling characteristics.

  In the first embodiment, when the installation environment temperature is normal, the cooling structure is only the basic unit portion 17, so that the size and cost can be reduced. When the installation environment temperature is high, the basic unit portion 17 The attachment portion 25a of the extended cooling unit portion 25 is attached to the heat radiating surface 18e of the housing 18 to improve the cooling characteristics, and both miniaturization and high cooling characteristics can be realized.

Embodiment 2
2A and 2B show a vertical side view of the extended cooling unit portion and a vertical side view of the basic unit portion of the electronic device unit cooling structure according to the second embodiment, and the best implementation when there are many internal mounting parts. It is a form. The casing 27 of the basic unit portion 26 is formed of a material having high thermal conductivity such as aluminum. An intake port 27b is provided on the bottom surface 27a of the casing 27, and an exhaust port 27d is provided on the top surface 27c. A support column 7 is erected on the inner surface of one side surface 27 e of the housing 27, a printed board 19 is attached to the support column 7 with screws 20, and a heat generating device 21 is mounted on the inner surface side of the printed board 19. The heat spreader 22 is bonded to the heat generating portion 21a of the heat generating device 21 via the bonding portion 23, the heat conductive rubber 24 is provided between the heat spreader 22 and the side surface 27e of the housing 27, and the side surface 27e is the heat radiating surface. It becomes. Other printed boards 28 are also provided in the housing 27, an opening 27f is provided on the opposite side of the heat dissipation surface 27e of the housing 27, and a cover 27g made of the same material as the housing 27 is provided in the opening 27f. Removably attached.

  Reference numeral 29 denotes an extended cooling unit portion formed in a casing shape with one side opened by a member having high heat conduction and front and back sides having high heat radiation, and the opening portion 29a is detachably attached to the opening portion 27f of the basic unit portion 26 instead of the cover portion 27g. Attached to. Further, the bottom surface 29b of the extended cooling unit 29 is provided with an intake port 29c, and the top surface 29d is provided with an exhaust port 29e.

  In the above configuration, the heat from the heat generating portion 21a of the heat generating device 21 is diffused to the heat spreader 22 by heat conduction, and then is thermally conducted to the heat radiating surface 27e of the housing 27 via the heat conductive rubber 24, and from the heat radiating surface 27e. It is dissipated by heat conduction and heat radiation. Moreover, the heat emissivity can be increased by surface-treating the heat radiating surface 27e by coating or the like, and the cooling characteristics can be improved. When the installation environment temperature is normal, the extended cooling unit 29 is not attached to the basic unit 26, and the cover 27 g is attached to the opening 27 f of the housing 27. When the installation environment temperature is high, the cover 27g is removed from the opening 27f of the casing 27 of the basic unit 26, and the opening 29a of the extended cooling unit 29 is attached to the opening 27f. With this structure, the overall housing becomes larger, the number of intake / exhaust ports also increases, heat transfer due to internal convection increases, and heat radiation is received from the basic unit portion 26 on the back side of the extended cooling unit portion 29. Since the heat is radiated from the front side of the extended cooling unit 29, the cooling effect is improved. The cooling structure of the second embodiment is particularly effective when the heat generating material is mounted on the entire basic unit portion 26, and the cooling effect is increased by internal heat transfer and heat radiation.

  In the second embodiment, when the installation environment temperature is normal, the cooling structure is only the basic unit portion 26, and the size and cost can be reduced. When the installation environment temperature is high, the basic unit portion 26 The opening 29a of the extended cooling unit 29 is attached to the opening 27f of the housing 27, and the cooling characteristics are improved by heat transfer and heat radiation, so that both miniaturization and high cooling characteristics can be realized. Further, even if the internal components generate high heat, it can be easily handled by increasing the size of the extended cooling unit 29.

Embodiment 3
FIG. 3 shows a longitudinal side view of the cooling structure of the electronic device unit according to the third embodiment, and the housing 30 is formed of a high thermal conductivity material such as aluminum. The housing 30 is installed on the installation surface 5 via the spacing member 6, and an intake port 30b is provided on the bottom surface 30a, and an intake / exhaust port 30d is provided on both side surfaces 30c. Further, a support column 7 is erected on the inner surface of the top surface 30 e of the housing 30, and a main printed board 31 and an optional printed board 32 are attached to the support column 7 vertically in two stages by screws 33. A heat generating device 34 is mounted on the upper surface of the heat generating device 34, and a heat conductive rubber 35 is provided between the upper surface of the heat generating device 34 and the lower surface of the top surface 30 e of the housing 30. Reference numeral 11 denotes an intake / exhaust separation line of the intake / exhaust port 30d. An exhaust port 32 a is also provided at the center of the option printed board 32. The total height of the housing 30 and the spacing member 6 is h.

  In the above configuration, the heat of the heat generating device 34 is thermally conducted to the top surface 30e of the housing 30 through the heat conducting rubber 35, and is radiated from the top surface 30e by heat radiation and heat conduction. Since the top surface 30e is the portion with the highest cooling efficiency, efficient heat radiation is performed. Further, the heat that is not separated from the top surface 30e is thermally conducted to the side surface 30c and is radiated from the side surface 30c. Further, the option printed board 32 is cooled by the cooled air flowing in from the air inlet 30b of the bottom surface 30a of the housing 30, and since a large number of air inlets 30b are provided, the air intake resistance is small, and the option printed board 32 is directed to the air outlet 32a. Hot air flows out. Since the heat generating portion is located above, the heat generating center 13 is also located above, and the intake / exhaust separation line 11 is at substantially the same level as the heat generating center 13, so the intake / exhaust port 30d provided on the side surface 30c functions as an intake port. As a result, cold air flows between the printed boards 31 and 32 to effectively cool them. In particular, the cooling efficiency of the option printed board 32 is good.

  In the third embodiment, the heat generating device 34 is positioned in the upper part of the housing 30, and the heat is conducted to the top surface 30e having good cooling efficiency to dissipate the heat, thereby improving the cooling efficiency. Further, since the heat generating part is located above, the intake / exhaust separation line 11 is also located above, and the intake / exhaust port 30d on the side surface 30c also functions as an intake port, and heat is trapped between the printed boards 31 and 32. The cooling efficiency will increase. In addition, since the temperature of the option printed board 32 is particularly lowered, it is possible to mount various types of printed boards. Further, since no exhaust port is provided in the top surface 30e, the cooling space on the top surface 30e side may be small, miniaturization is possible, no short circuit occurs due to intrusion of falling objects, and safety is increased.

Embodiment 4
FIG. 4 shows a longitudinal side view of the cooling structure of the electronic device unit according to the fourth embodiment, and the housing 36 is formed of a high thermal conductivity material such as aluminum. The housing 36 is installed such that the bottom surface 36a is in contact with the installation surface 5, and intake and exhaust ports 36c are provided on both side surfaces 36b. Further, a support column 7 is erected on the inner surface of the top surface 36d of the housing 36, and a main printed board 31 and an optional printed board 32 are attached to the support column 7 in two vertical levels by screws 33. A heat generating device 34 is mounted on the upper surface of the heat generating device 34, and a heat conductive rubber 35 is provided between the upper surface of the heat generating device 34 and the lower surface of the top surface 36 d of the housing 36. Reference numeral 11 denotes an intake / exhaust separation line of the intake / exhaust port 36c. An exhaust port 32 a is also provided at the center of the option printed board 32. The height of the housing 36 is h.

  In the above configuration, the heat of the heat generating device 34 is thermally conducted to the top surface 36d of the housing 36 through the heat conducting rubber 35, and is radiated from the top surface 36d by heat radiation and heat conduction. Since the top surface 36d is the portion with the highest cooling efficiency, efficient heat dissipation is performed. In addition, the heat that is not radiated from the top surface 36d is thermally conducted to the side surface 36b and is radiated from the side surface 36b. Further, when the installation surface 5 is made of a material having high heat conductivity such as metal, the heat is conducted from the bottom surface 36a of the housing 36 to the installation surface 5 and the cooling effect is greatly improved. On the other hand, since the heat generating portion is located above, the heat generating center 13 is also located above, and the intake / exhaust separation line 11 is also located above. For this reason, many of the intake / exhaust ports 36 c provided on the side surface 36 b function as intake ports, and external cold air flows between the printed boards 31 and 32. Further, since the spacing member is not provided, the length of the side surface 36b is increased, the intake area is increased, and the intake amount is increased. The intake air passes through the exhaust port 32a of the option board 32 and is located between the printed boards 31 and 32. Inflow. As a result, the printed boards 31, 32, particularly the optional printed board 32, are effectively cooled.

  In the fourth embodiment, the heat generating device 34 is positioned above the housing 36, and the heat is conducted to the top surface 36d with good cooling efficiency to dissipate heat, thereby improving the cooling efficiency. Further, the heat that cannot be radiated from the top surface is radiated from the side surface 36b and the bottom surface 36a that is in contact with the installation surface 5, and the cooling effect is greatly improved. On the other hand, since the intake / exhaust separation line 11 is located above, the intake / exhaust port 36c of the side surface 36b functions as an intake port, and external cold air flows between the printed boards 31 and 32, and no spacing material is provided. The intake area of the side surface 36b is increased to increase the intake air amount, and the printed boards 31, 32, particularly the optional printed board 32, are effectively cooled, and various types of printed boards can be mounted. In addition, since the intake port and the exhaust port are not provided on the top surface 36d side and the bottom surface 36a side, a short circuit due to a metal object does not occur, safety is increased, and cooling spaces (intervals) on the top surface 36d side and the bottom surface 36a side are increased. It is possible to reduce the size.

It is the vertical side view of the basic unit part of the cooling structure of the electronic device unit by Embodiment 1 of this invention, and the side view of an extended cooling unit part. It is the vertical side view of the extended cooling unit part of the cooling structure of the electronic device unit by Embodiment 2, and the vertical side view of a basic unit part. It is a vertical side view of the cooling structure of the electronic device unit by Embodiment 3. It is a vertical side view of the cooling structure of the electronic device unit by Embodiment 4. It is a vertical side view of the cooling structure of the electronic device unit of the conventional standard and high environmental temperature countermeasure. It is a vertical side view of the cooling structure of the conventional electronic device unit which increases the conventional aperture ratio and performs manual cooling. It is a vertical side view of the cooling structure of the electronic device unit cooled by the heat conduction to the conventional housing | casing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 ... Heat flow 5 ... Installation surface 6 ... Spacing material 11 ... Intake / exhaust separation line 12 ... Heat flow 13 ... Heat generation center part 17, 26 ... Basic unit part 18, 27, 30, 36 ... Case 18b, 27b, 29c, 30b ... Intake port 18d, 27d, 29e ... Exhaust port 18e, 27e ... Heat dissipation surface 19 ... Printed board 21, 34 ... Heat generating device 21a ... Heat generating part 22 ... Heat spreader 24, 35 ... Thermal conductive rubber 25, 29 ... Extended cooling unit part 27f , 29a ... opening 27g ... cover part 30a, 36a ... bottom face 30c, 36b ... side face 30d, 36c ... intake / exhaust port 30e, 36d ... top face 31 ... main printed board,
32 ... Option printed board

Claims (4)

  A basic unit that is made of a high thermal conductivity material and has a printed board with a heat generating device mounted inside the housing that has an inlet and an exhaust port, and heat from the heat generating device is conducted to the heat dissipation surface of the housing And a cooling structure for an electronic device unit, which is detachably attached to the heat radiating surface of the basic unit portion, and an extended cooling unit portion made of a member having high heat conduction and high heat radiation.   A printed board made of a high thermal conductivity material with a heat generating device mounted inside the housing that has an air inlet and an exhaust port, and heat from the heat generating device is conducted to the heat radiating surface of the housing. A basic unit part in which a cover part is detachably attached to an opening provided on the opposite side of the surface, and a housing having one side opened by a member having high heat conduction and high heat radiation, and this opening part. A cooling structure for an electronic device unit, comprising: an extended cooling unit portion that is detachably attached to the opening of the basic unit portion instead of the cover portion and has an air inlet and an air outlet.   It is made of a material with high thermal conductivity, installed on the installation surface via a spacing material, an intake port is provided on the bottom surface, an intake / exhaust port is provided on the side surface, and a heating device is mounted on the top surface in the case The main printed board installed horizontally and the option printed board installed horizontally below the main printed board in the housing are radiated by conducting heat from the heat generating device to the top surface of the housing. A cooling structure for an electronic device unit, characterized in that A case made of high thermal conductivity material, installed directly on the installation surface and provided with intake / exhaust ports on the side, a main printed board with a heat generating device mounted on the upper surface in the case and provided horizontally, And an optional printed board provided horizontally below the main printed board, and the heat from the heat generating device is conducted to the top surface of the housing to dissipate the heat. Construction.

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