JP2002341777A - Plasma display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display device, in which a rise in the temperature of a panel or parts in the upper part of the panel is suppressed even if a heat generating board is disposed in the upper part of the panel for high integration of circuit boards. SOLUTION: The circuit boards built in the upper part of the plasma display device are vertically arranged in different positions in a case so that the heat of one circuit board does not influence the other circuit board. Moreover, the heat radiation is improved by mounting the circuit boards on a metallic case via a heat conductive sheet excellent in thermal conductivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an improvement in an assembly structure of a display panel and a display drive circuit in a plasma display device.

[0002]

2. Description of the Related Art A plasma display device (hereinafter abbreviated as PDP) has a smaller depth including a housing as compared with a display device using a conventional cathode ray tube, and it is easy to increase the screen size, as well as brightness and contrast. Excellent in terms of. Because of its small depth, it is expected to be used as a public display device such as a showroom as a wall-mounted display and a display device used for presentations in companies. In addition, if mass production reduces the price, it is expected to be widely used for space-saving TVs for home use. Since PDP uses plasma discharge as a light emission principle, a plasma display panel (hereinafter simply referred to as a panel) and a driving circuit generate a large amount of heat and a temperature inside a housing increases as compared with a cathode ray tube or a liquid crystal display device. Therefore, if heat is released to the outside of the housing and the temperature of the panel and the temperature of the drive circuit are not suppressed, display characteristics of the panel may be degraded or the life of components mounted on the circuit board may be shortened. Also, if there is a large temperature difference in the panel surface, the glass of the panel may be broken. PDPs tend to consume more and more power due to improvements in display brightness, built-in BS tuners, and the like. Since heat generation increases due to an increase in power consumption, heat radiation becomes more and more important.

FIG. 10 is a sectional view of a housing 50 of a conventional PDP. The structure of a conventional PDP housing 50 will be described with reference to FIG. The housing 50 includes a front cover 10 and a back cover 7.
Having. A PDP panel 1 is attached to a front cover 10. A heat conductive rubber sheet 2 having good heat conductivity is adhered to the back surface of the panel. A panel supporting member 3 made of an aluminum plate is adhered in close contact with the heat conductive rubber sheet 2. Generally, the panel support member 3 is made of, for example, an aluminum material having a high thermal conductivity, and has a role of diffusing the heat of the panel by heat and dissipating it to the air in the housing. For example, two upper circuit boards 4A and a lower circuit board 4B are attached to the panel support member 3. Many components including the heat-generating component 5 are attached to the upper circuit board 4A and the lower circuit board 4B. The heat generated from the panel 1 is transmitted to the panel supporting member 3 through the heat conductive rubber sheet 2 and is released from the surface of the panel supporting member 3 into the air. The panel support member 3 functions as a reinforcing member that holds the panel 1 and prevents the panel from being deformed. Upper circuit board 4
A and the lower circuit board 4B are attached to the panel supporting member 3 at predetermined intervals by posts 45 of the attaching member. A plurality of ventilation holes 6 are provided in a lower portion of the back cover 7. The fan 16 is provided on the upper part of the housing 50. When the fan 16 is operated, the air flowing from the vent hole 6 flows through the path shown by the arrow 9 and the fan 1
6 to the outside. The panel support member 3 and the heat-generating component 5 are cooled by the airflow flowing from the ventilation hole 6 and flowing inside.

[0004] In a conventional example, there is a case of a natural air cooling system having no fan 16 and having only an exhaust hole at an upper portion. In such a case, when the air is warmed by the heat generated from the heat-generating component 5, the density of the air is reduced and an ascending airflow is generated. Due to this rising airflow, the internal air is exhausted from the upper exhaust hole, and cool air flows in from the lower vent hole 6. The occurrence of such an updraft in the housing is called a “chimney effect”. Since the PDP has a small depth and the panel is normally used upright, such an upward airflow is generated in the housing.

[0005]

A fan 1 shown in FIG.
6 can generate an airflow at a wind speed of several m / s, so that the cooling effect is considerably higher than in the case of natural air cooling. However, the fan 16 is a noise source, and if the noise countermeasures are not taken properly, the quality of the product will be significantly reduced. No noise is generated by natural air cooling. However, since the airflow depends on the upward airflow due to the change in the density of the air, the wind speed was as small as about 0.5 m / s at the maximum, and the cooling effect was limited.

Further, in the above-described conventional heat dissipation method, the air flowing in from the ventilation hole 6 is supplied to the lower part of the panel supporting member 3 or the heat generating component 5 on the lower circuit board 4B regardless of the presence or absence of the fan.
The air temperature rises as you pass through the area, and the air temperature rises toward the top. Therefore, a difference occurs in the cooling effect, and the temperature of the upper part of the panel 1 becomes higher than the temperature of the lower part. FIG. 11 is a front view showing the temperature distribution on the surface of the conventional natural air-cooled panel 1. As shown in FIG. In FIG. 11, the vertical direction in the figure corresponds to the vertical direction of the panel 1. As shown in FIG. 11, the temperature of the upper part of the panel 1 is 75 ° C. to 85 ° C., the temperature of the lower part is 65 ° C. to 70 ° C., and there is a difference of 10 ° C. to 15 ° C. in the vertical direction. This is because even though the calorific value of the panel 1 is almost uniform over the entire surface,
This is because the heat generated in the lower portion rises and hinders the cooling effect in the upper portion. FIG. 12 is a front view of the PDP of FIG.
It is the result of measuring the temperature of the air flowing in the vicinity of the lower circuit board 4B arranged at the lower part in the housing 50 and the upper circuit board 4A arranged at the upper part. As shown in FIG.
The temperature at the bottom of 0 is 42 ° C, and the temperature at the center is 56 ° C.
° C and the upper temperature was 68 ° C. The temperature difference between the upper part and the lower part is about 24 ° C., which indicates that the cooling effect of the upper part of the panel is low.

[0007] In order to solve such a problem, in the case where the conventional fan is not provided, a device for reducing the power consumption of the electric circuit is devised, and a component having a large heat generation is not disposed on the upper portion of the housing 50. Was like that. However, due to the increase of various circuits built in the PDP, a high-density and large-sized circuit board has to be incorporated, and the arrangement of the circuit board has been restricted. That is, the upper circuit board 4A having the heat-generating component 5 must be arranged also on the upper part of the housing 50. As a result, not only the temperature of the upper circuit board 4A but also the temperature of the upper part of the panel 1 is increased, and the temperature difference in the plane of the panel 1 is also increased. Will occur. An object of the present invention is to provide a PDP capable of suppressing an increase in the temperature of a panel and the temperature of a circuit component even when a circuit board that generates a large amount of heat is provided on an upper portion of a housing.

[0008]

According to the present invention, there is provided a plasma display apparatus comprising: a flat panel support member having a plasma display panel mounted thereon; a panel support member mounted substantially parallel to the panel support member; A circuit board having a plurality of upper and lower heat-generating components different from each other, and a housing that houses the panel support member and the circuit board, has a ventilation hole below the circuit board, and has an exhaust hole above. It is characterized by. According to the present invention, since the distance between each of the plurality of circuit boards and the panel support member is different, the air that flows in from the lower air hole and flows upward in the housing is divided for each circuit board. Follow the route Therefore, the air heated through the region including the heat-generating component of the lower circuit board does not hit the heat-generating component on the upper circuit board. Air having substantially the same temperature as the outside air temperature flowing into the air holes is applied to the upper circuit board. Therefore, the cooling effect equivalent to that of the lower circuit board can be obtained without obstructing the heat radiation of the upper circuit board due to the temperature rise of the rising air current as in the related art.

The distance between the panel support member and the upper circuit board disposed in the upper part of the housing among the plurality of circuit boards is made wider than the distance between the lower circuit substrate disposed in the lower part and the panel support member. The air flowing from the vent hole and passing through the region including the lower circuit board disposed at the lower portion passes between the upper circuit board disposed at the upper portion and the panel support member and flows out of the exhaust hole. It is characterized by having done.
Since the unheated air passing through a path away from the lower circuit board passes near the upper board, the cooling effect of the upper board is high.

[0010] Among the plurality of circuit boards, an interval between an upper circuit board disposed in an upper portion of the housing and the panel supporting member is smaller than an interval between a lower circuit board disposed in a lower portion and the panel supporting member. The air flowing from the vent hole and passing between the panel support member and the lower circuit board disposed at the lower portion passes through a region including the upper circuit board disposed at the upper portion, and flows out of the exhaust hole. It is characterized by. The air heated near the lower circuit board does not pass near the upper circuit board, and the unheated air passing between the panel support member and the lower circuit board passes near the upper board. High effect.

A plurality of upper and lower circuit boards are provided between the upper and lower circuit boards having different distances from the panel support member, and the air flowing from the ventilation holes is divided into the plurality of upper and lower circuit boards. It further has a plate-shaped member that divides the flow so as to pass through the path. Since the respective paths of the upper and lower circuit boards are separated by the plate-like member, both the upper and lower circuit boards are cooled by receiving an airflow having substantially the same temperature as the outside air. Therefore, there is no difference in the cooling effect between the two circuit boards. The plate-shaped member is a metal plate, and is attached to the upper circuit board so that heat of the upper circuit board is transmitted to the plate-shaped member. Since the metal plate is attached to the upper circuit board, the heat of the upper circuit board is transmitted to the plate. Therefore, the cooling effect of the upper circuit board is further enhanced.

The housing is made of resin, a metal plate is provided inside a predetermined portion, and the metal plate and the heat generating component of the upper circuit board are connected by a heat conductive member. Even if the housing is made of resin and has poor thermal conductivity, the heat of the heat-generating components is dissipated from the inner metal plate, so that the heat radiation effect of the upper circuit board is high. A heat radiation hole is provided in a predetermined portion of the housing provided with the metal plate. Since the metal plate comes into contact with the outside air at the heat radiation holes of the housing, the cooling effect of the upper circuit board attached to the metal plate is high. A heat radiating member is provided on a back surface of an upper region of the panel supporting member. Since the heat of the panel supporting member is dissipated by the heat dissipating member, the panel is effectively cooled.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION A plus display device (PD) of the present invention
A preferred embodiment of P) will be described with reference to FIGS. In each cross-sectional view, the size in the left-right direction corresponding to the depth of the PDP is enlarged for easy understanding.

<< First Embodiment >> FIG. 1 shows a first embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a perspective view of a PDP according to a first embodiment of the present invention, and FIG. 2 is a II-II of FIG.
It is sectional drawing. 1 and 2, a heat conductive rubber sheet 2 having good heat conductivity is attached to the back surface of a panel 1 of a PDP. The heat conductive rubber sheet 2 is a composite material of silicon and rubber, and is generally commercially available. A panel supporting member 3 made of, for example, an aluminum plate is attached to the heat conductive rubber sheet 2. These structures are the same as the conventional one shown in FIG. The housing 51 includes the front cover 30
And a back cover 37, and the front cover 30 has an opening 3
0A is formed. The housing 51 is made of metal or plastic. The panel 1 is attached to the opening 30A. The housing 51 has a ventilation hole 31 at the bottom in the figure and an exhaust hole 32 at the top. Inside the housing 51, for example, two upper circuit boards 4A and lower circuit boards 4B to which electronic circuits including the heat-generating components 5 for controlling the panel 1 are attached are provided. The upper circuit board 4A is attached to the panel support member 3 by four attachment posts 34. The lower circuit board 4B is attached to the panel support member 3 by four attachment posts 35 shorter than the attachment posts 34. By changing the length of each of the mounting posts 34 and 35, the panel support member 3 and the upper circuit board 4
The distance between each of A and the lower circuit board 4B can be changed. For example, the upper circuit board 4A is separated from the panel supporting member 3 by about 40 mm, and the lower circuit board 4B is separated from the panel supporting member 3 by about 10 mm.

By arranging the upper circuit board 4A and the lower circuit board 4B in this manner, the opening 3
The air flowing from 1B and passing through the vicinity of the heat generating component 5 on the lower circuit board 4B flows out of the exhaust hole 32 via a path indicated by an arrow 39B. On the other hand, the lower circuit board 4 of the ventilation hole 31
Air flowing from the opening 31A away from the lower circuit board B, the space between the lower circuit board 4B and the rear cover 37 is indicated by an arrow 39A.
And flows out of the exhaust hole 32 through the vicinity of the heat generating component 5 mounted on the upper circuit board 4A. The air flowing in from the opening 31B cools the heat generating components 5 on the circuit board when passing through the vicinity of the lower circuit board 4B.
The warmed air flows out between the upper circuit board 4A and the panel supporting member 3 to the outside. Therefore, the heat generating component 5 on the upper circuit board 4A hardly touches the heated air. On the other hand, the outside air flowing from the opening 31A passes through a path 39A separated from the lower circuit board 4B. Therefore, the temperature does not rise and passes through the vicinity of the upper circuit board 4A at substantially the same temperature as the outside air temperature. Thus, the heat-generating component 5 on the upper circuit board 4A is cooled by air having substantially the same temperature as the outside air temperature. The PDP of this example and the conventional PDP shown in FIG. 10 from which the fan 16 was removed were operated under exactly the same conditions, such as the ambient temperature, to measure the temperature of each part. When the fan is removed in the conventional structure, the temperature of the highest temperature portion of the PDP panel 1 (panel maximum temperature) is 8
Although it was 8 ° C., the panel maximum temperature of the PDP of this example was 84 ° C., which was 4 ° C. lower. The temperature of a specific heat-generating component on the upper circuit board 4A was 83 ° C. in the PDP having the conventional structure and no fan, but in the present embodiment, the temperature was 7 ° C.
It became 8 ° C and decreased by 5 ° C.

<< Second Embodiment >> A second embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a sectional view of the PDP according to the second embodiment of the present invention at the same position as in FIG. In the configuration shown in FIG. 3, the positions of the upper circuit board 4A and the lower circuit board 4B in the housing 51 are different from the positions of the first embodiment shown in FIG. Other configurations are the same as those in FIG. In this embodiment, the length of the mounting post 34 is
Less than 5 lengths. Therefore, the upper circuit board 4A is arranged near the panel support member 3, and the lower circuit board 4B is arranged away from the panel support member 3.

In the configuration shown in FIG. 1, the air heated while passing near the heat-generating component 5 on the lower circuit board 4B passes through the back side of the upper circuit board 4A. Therefore, the upper circuit board 4A itself is slightly affected by the air heated by the lower circuit board 4B, and the heat radiation effect is reduced. In the configuration shown in FIG. 3, the air flowing from the opening 31B passes through the back side of the lower circuit board 4B and is hardly heated, and passes near the upper circuit board 4A while maintaining a temperature close to the outside air temperature.
Therefore, the cooling effect of the heat generating component 5 of the upper circuit board 4A is higher than that of FIG. FIG. 4 shows the measurement results of the temperature of each part in the housing 51 of the PDP of this embodiment. In FIG.
62 ° C. above the upper circuit board 4A, lower circuit board 4B
The temperature was 42 ° C. in the lower part and 44 ° C. in the middle part between the two. Comparing the temperature in FIG. 4 with the temperature in FIG. 12 of the conventional example, it can be seen that the air temperature in the upper part and the middle part is significantly reduced. The PDP of this embodiment and the conventional PD shown in FIG.
The temperature measurement test was performed by operating the fan without the fan 16 of P under exactly the same conditions. As a result, the temperature of the heat generating component 5 attached to the upper circuit board 4A of the conventional PDP becomes 9
Although the temperature was 8 ° C., the temperature of the heat-generating component 5 of the PDP of this example was 93 ° C., which was 5 ° C. lower. The temperature of the heat-generating component 5 of the lower circuit board 4B depends on the PDP of the prior art and the PDP of the present embodiment.
The temperature was 92 ° C. in each case, which was the same.

<< Third Embodiment >> A third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a view showing a P of the third embodiment of the present invention.
FIG. 3 is a sectional view of the DP at the same position as in FIG. 2. In FIG. 5, the configuration of a housing 51, a panel 1, a heat conductive rubber sheet 2 and a panel support member 3, and an upper circuit board 4 in the housing 51
The arrangement positions of A and the lower circuit board 4B are the same as those in FIG. In the present embodiment, a heat radiating plate 8 made of an aluminum plate or the like is provided on a surface of the upper circuit board 4A on which the heat-generating component 5 is not attached via a heat conductive rubber sheet 26. Heat sink 8
It is desirable that the width in the direction perpendicular to the paper surface of the drawing be larger than the width of the upper circuit board 4A. It is desirable that the lower end of the radiator plate 8 be extended to near the ventilation hole 31. The heat radiating plate 8 shown in FIG. 5 is bent at the bent portion 8A in order to keep the space between the heat radiating plate 8 and the lower circuit board 4B wide.

According to the configuration shown in FIG. 5, the airflow flowing from the ventilation hole 31 and passing through the path indicated by the arrow 39A far from the panel 1 and the airflow passing through the path indicated by the arrow 39B near the panel 1 are radiated. It is separated by a plate 8. Therefore, the upper circuit board 4
The air passing near A is not affected by the lower circuit board 4B at all, and the air temperature is exactly the same as the outside air temperature. Thereby, the cooling effect of the upper circuit board 4A is improved as compared with the first embodiment. The heat of the upper circuit board 4A is
A is transmitted to the heat sink 8 and diffused. Thereby, the heat sink 8
However, the heat dissipation plate 8 is cooled by the air passing through the path of the arrow 39B, and the cooling effect of the upper circuit board 4A is improved by the heat diffusion effect and the cooling effect by the airflow. By improving both of the cooling effects, the temperature of the heat generating component 5 on the upper circuit board 4A becomes lower than that of the first embodiment. A temperature measurement test was performed on the PDP of the present embodiment and the PDP of the conventional structure with the fan removed. As a result, the temperature of the heat generating component 5 of the upper circuit board 4A is 98 ° C. in the conventional structure.
However, in this example, the temperature was 88 ° C., which was lower by 10 ° C. The temperature of the heat generating component 5 of the lower circuit board 4B was 92 ° C., which was the same in both the conventional PDP and the PDP of the present invention.

In this embodiment, a resin shielding plate may be provided instead of the heat radiating plate 8 attached to the upper circuit board 4A via the heat conductive rubber sheet 26. This shield plate may not be attached to the upper circuit board 4A, but may be disposed with a gap between the shield board and the upper circuit board 4A. In this case, since there is no heat diffusion to the shielding plate, the cooling effect is inferior to the case of using the heat radiating plate 8, but the weight and cost can be reduced.

<< Fourth Embodiment >> FIG. 6 shows a fourth embodiment of the present invention.
This will be described with reference to FIG. FIG. 6 shows a PD according to a fourth embodiment of the present invention.
FIG. 3 is a sectional view of P at the same position as FIG. 2. In FIG.
The configurations of the housing 51, the panel 1, the heat conductive rubber sheet 2, and the panel support member 3, and the arrangement positions of the upper circuit board 4A and the lower circuit board 4B in the housing 51 are the same as those in FIG. In this embodiment, the back cover 37 of the housing 51 is made of resin, and a heat radiating plate 44 made of aluminum or the like is attached to the inner surface of the back cover 37, and the heat conductive soft material is provided between the heat radiating plate 44 and the upper circuit board 4A. The elastic member 27 is filled.

According to this embodiment, the heat of the heat-generating component 5 of the upper circuit board 4A is transmitted to the back cover 37 and radiated.
A temperature measurement test was performed on the PDP of this embodiment and the PDP of the conventional example. As a result, the temperature of the heat generating component 5 of the upper circuit board 4A was 98 ° C. in the conventional example, but was 7 ° C. in the present example.
The temperature dropped to 6 ° C, which was significantly lower. When the back cover 37 is not a metal but a resin having poor heat conductivity, the heat conductive soft elastic member 27 is provided between the back cover 37 and the plurality of heat generating components 5 having different heights on the upper circuit board 4A. Since it is necessary that the filler be filled without gaps, a gel filler having elasticity is desirable. Examples of such a filling member include:
Sircon (R) manufactured by Fuji Kogaku Kogyo Co., Ltd. is available. In this case, if a large number of holes 45 are provided in the back cover 37 so that the heat radiating plate 44 comes into contact with the outside air, the heat radiating effect is further improved.

FIG. 7 is a sectional view of a PDP of this embodiment having a heat radiating plate 44A obtained by modifying the heat radiating plate 44 shown in FIG. The heat radiating plate 44A is formed by bending a plate of aluminum or the like into a convex shape. The heat conductive soft elastic member 27 is filled between the convex portion of the heat radiating plate 44A and the heat generating component 5 of the upper circuit board 4A. According to this configuration, even if the height of the heat generating component 5 is low and the distance between the heat generating component 5 and the back cover 37 is large, it is not necessary to increase the thickness of the heat conductive soft elastic member 27. Therefore,
Heat transfer loss due to the heat conductive rubber can be reduced, and heat can be efficiently transmitted to the heat radiating plate 44A. Further, since the air flowing through the path indicated by the arrow 39A in FIG. 6 passes through the hollow portion 44B of the heat radiating plate 44A, the heat radiating plate 44A
It is also cooled by 9A. Therefore, the cooling effect of the heat sink 44A is improved. A temperature measurement test was performed with the conventional structure when the fan was removed and with the configuration in FIG.
Could be lowered from 98 ° C to 92 ° C. In the PDP shown in FIG. 7, the resin back cover 37 can be used which is less expensive than the case where the entire back cover is made of metal, so that the manufacturing cost of the PDP can be reduced.

<< Fifth Embodiment >> A fifth embodiment of the present invention is shown in FIG.
This will be described with reference to FIG. FIG. 8 is a sectional view of the PDP according to the fifth embodiment of the present invention at the same position as in FIG. 8, the configuration of the housing 1, the panel 1, the heat conductive rubber sheet 2, and the panel support member 3, and the upper circuit board 4 in the housing 51
The arrangement positions of A and the lower circuit board 4B are the same as those in FIG. In this embodiment, a grid-like heat dissipating member 12 having a plurality of ventilation holes 13 is provided between the upper portion of the panel support member 3 and the back cover 37. It is desirable to use a material having high thermal conductivity such as aluminum for the heat radiation member 12. FIG.
FIG. 9 is a sectional view taken along the line XI-XI in FIG. 8. Arrows 39A, 39B
The air flowing through the casing 51 through the path indicated by the arrow is discharged through the ventilation hole 13. By providing the heat radiating member 12, the heat generated in the panel is transmitted to the panel supporting member 3 and further diffused to the heat radiating member 12. The heat dissipating member 12 is a housing 51
Since the cooling is performed by the airflow flowing through the inside, the temperature of the upper portion of the panel supporting member 3 which tends to be higher than that of the lower portion of the panel supporting member 3 decreases, and the temperature distribution of the panel supporting member 3 can be made uniform.
When a temperature measurement experiment as described above was performed for the present embodiment, the temperature of the highest temperature portion on the upper part of the panel 1 was 8
5 ° C became 80 ° C and decreased by 5 ° C. The temperature at the bottom of panel 1 was the same as the value shown in FIG. By making the temperature distribution of the panel supporting member 3 uniform, the temperature distribution of the panel 1 becomes uniform, and the distortion of the glass of the panel 1 due to the thermal expansion due to the non-uniform temperature distribution can prevent the panel 1 from being damaged. Can be. The heat dissipating member may have a fin shape in addition to the porous member as described above.

[0025]

As described in detail in each of the embodiments described above, the image display device of the present invention is capable of controlling the temperature at the upper part of the panel and the temperature at the upper part of the panel even if the circuit board on which the heat-generating components are mounted is arranged on the back surface at the upper part of the panel. The temperature rise of the components on the circuit board can be suppressed. Thereby, the temperature unevenness on the panel surface is suppressed, and the panel can be prevented from being damaged, and the components can be prevented from being deteriorated and damaged due to the high temperature.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plasma display device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view of a plasma display device according to a second embodiment of the present invention.

FIG. 4 is a front view showing measured values of the air temperature in the housing of the plasma display device according to the second embodiment of the present invention;

FIG. 5 is a sectional view of a plasma display device according to a third embodiment of the present invention.

FIG. 6 is a sectional view of another example of the plasma display device according to the fourth embodiment;

FIG. 7 is a sectional view of another example of the plasma display device according to the fourth embodiment;

FIG. 8 is a sectional view of a plasma display device according to a fifth embodiment.

FIG. 9 is a sectional view of a plasma display device according to a fifth embodiment.

FIG. 10 is a cross-sectional view of a conventional plasma display device.

FIG. 11 is a front view showing a temperature distribution on a panel surface of a conventional plasma display device.

FIG. 12 is a front view showing the temperature inside the housing of the conventional plasma display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Panel 2 Thermal conductive rubber sheet 3 Panel support member 4A, 4B Circuit board 5 Heat generating component 6, 31 Vent hole 7, 37 Back cover 8 Heat radiating plate 10, 30 Front cover 12 Heat radiating member 45 Heat radiating hole 16 Fan

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 5C058 AA11 AB06 BA35 5E322 AA01 AA11 AB04 AB06 BA01 BA03 BA05 FA05 5G435 AA12 BB06 EE03 EE04 EE13 EE36 GG44 KK02

Claims (10)

[Claims] 1. A flat panel support member to which a plasma display panel is attached, a plurality of upper and lower heat-generating components which are attached substantially parallel to the panel support member and have different distances from the panel support member. A circuit board having the circuit board, the panel support member and the circuit board being housed, having a ventilation hole below the circuit board, having an exhaust hole above and having a housing arranged to cover the back surface of the panel support member. Plasma display device. 2. A distance between an upper circuit board disposed in an upper part of a housing and a panel supporting member of the plurality of circuit boards is smaller than a distance between a lower circuit board disposed in a lower part and the panel supporting member. Air that flows into the air hole and passes through the region including the lower circuit board disposed at the lower portion passes through the space between the upper circuit board disposed at the upper portion and the panel supporting member and flows out of the exhaust hole. The plasma display device according to claim 1, wherein the plasma display device is configured as follows. 3. A distance between an upper circuit board disposed in an upper part of a housing and a panel supporting member of the plurality of circuit boards is determined by a distance between a lower circuit board disposed in a lower part and the panel supporting member. The air inlet passes through the vent hole and passes between the panel support member and the lower circuit board disposed below. The air passes through a region including the upper circuit board disposed above and flows out of the exhaust hole. The plasma display device according to claim 1, wherein: 4. A plurality of upper and lower circuit boards having different distances from each other with respect to the panel support member,
4. The plasma display device according to claim 1, further comprising a plate-shaped member for diverting the air flowing from the vent hole so as to pass through a path divided for each of the plurality of upper and lower circuit boards. 5. The plasma display device according to claim 4, wherein said plate-shaped member is a metal plate, and is attached to said upper circuit board so that heat of the upper circuit board is transmitted to said plate-shaped member. . 6. The housing is made of resin, a metal plate is provided inside a predetermined portion, and the metal plate and a heat generating component of the upper circuit board are connected by a heat conductive member. Item 2. The plasma display device according to item 1. 7. The plasma display device according to claim 7, wherein a heat radiating hole is provided in a predetermined portion of the housing provided with the metal plate. 8. The plasma display device according to claim 1, wherein a heat radiating member is provided on a back surface of an upper region of the panel supporting member. 9. The plasma display device according to claim 8, wherein the heat radiation member has a fin shape. 10. The plasma display device according to claim 8, wherein said heat radiating member is a porous member having a plurality of ventilation holes.