JP2011053257A - Plasma display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display device, favorably discharging heat in the interior while visually achieving reduction in thickness. <P>SOLUTION: This plasma display device 1 is provided with: a chassis 4 supporting a PDP2 on its front surface; a plurality of circuit boards 16 located on a specific region of the back surface of the chassis 4; and a back cover 7 including an edge portion 71 covering the outside of the specific region of the back surface of the chassis 4 and a projecting portion 72 accommodating the plurality of circuit boards 16. The projecting portion 72 is provided with an air inlet 11 and an air outlet 10, and a fan 9 is arranged in a space defined by the projecting portion 72. A space between the chassis 4 and the circuit boards 16 is provided with a partition wall 17 partitioning the space into the chassis side and the circuit board side. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a plasma display apparatus using a plasma display panel as a display device.

  In recent years, thin display devices have begun to spread rapidly. Such thin display devices are becoming more and more popular in the future and are expected to replace conventional CRTs. Currently, thin display devices are often installed on the floor like conventional CRTs. However, in the future, wall hangings or wall-mounting methods that take advantage of the space-saving features of thin display devices will become mainstream. .

  By the way, in the conventional plasma display device which is one of the thin display devices, an intake port and an exhaust port are provided in the back cover, and forced convection (ventilation) is used by using a fan to exhaust internal heat to the outside. Yes. Some fans use natural convection (ventilation) to discharge internal heat to the outside without using a fan.

  For example, Patent Document 1 discloses a plasma display device 101 as shown in FIG. In the plasma display apparatus 101, a plasma display panel (hereinafter referred to as “PDP”) 102, a chassis 103 that supports the PDP 102 on the front surface, a rear surface of the chassis 103, in a casing constituted by a front cover 108 and a back cover 107. And a plurality of circuit boards 120 attached to each other through bosses. Further, a heat conductive sheet 104 is sandwiched between the PDP 102 and the chassis 103.

  Further, an intake port 111 is provided at the lower part of the back cover 107, an exhaust port 110 is provided at the upper part, and a fan 109 is disposed inside the back cover 107 so as to overlap the exhaust port 110. When the fan 109 is operated, outside air is taken into the back cover 107 through the intake port 111 as indicated by an arrow a in the figure, and air in the back cover 107 is exhausted as indicated by an arrow b in the figure. It is discharged to the outside through 110. Thereby, the chassis 103 and the circuit board 120 are cooled by forced convection, and heat radiated from the PDP 102 through the chassis 103 and heat of the circuit board 120 are discharged to the outside.

JP 2003-162228 A

  Incidentally, the plasma display device is required to be thinner. To cope with this, for example, it is conceivable that the circuit board is concentrated in the center of the back surface of the chassis and the thickness of the peripheral edge of the back cover is reduced to achieve a visual reduction in thickness.

  However, in such a case, heat concentration occurs in a portion sandwiched between the circuit board and the chassis, heat is accumulated in the portion, and heat dissipation efficiency is reduced.

  In view of such circumstances, an object of the present invention is to provide a plasma display device that can discharge internal heat satisfactorily while achieving visual thinning.

  In order to solve the above-described conventional problems, a plasma display apparatus according to the present invention includes a PDP, a chassis that supports the PDP on the front surface, a plurality of circuit boards positioned on a predetermined area on the rear surface of the chassis, and the chassis. And a back cover that protrudes to the opposite side of the chassis inside the edge and has a protrusion that accommodates the plurality of circuit boards. Are provided with an air inlet and an air outlet, and a fan is disposed in a space surrounded by the protruding portion. A space sandwiched between the chassis and the plurality of circuit boards is defined as a chassis. A partition wall is provided for partitioning into a circuit board side and a circuit board side.

  According to said structure, since the partition is arrange | positioned between the circuit board and chassis which were arrange | positioned centrally, they can be interrupted | blocked thermally. As a result, heat concentration at the portion sandwiched between the circuit board and the chassis can be prevented, and the heat of the circuit board can be effectively discharged to the outside by forced convection by the fan. Moreover, the heat radiated from the PDP through the chassis can be released into the atmosphere through the edge of the back cover by radiation. Therefore, according to the present invention, the internal heat can be discharged well while the plasma display device is visually reduced in thickness.

1 is a schematic cross-sectional view showing a configuration of a plasma display device according to an embodiment of the present invention. 1 is a schematic perspective view of the plasma display device of FIG. Layout diagram showing heat pipe arrangement Layout diagram showing arrangement of heat pipe of modification Schematic sectional view of a conventional plasma display device

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

  1 and 2 show a plasma display device 1 according to an embodiment of the present invention. The plasma display device 1 includes a PDP 2 that displays an image, a chassis 4 that supports the PDP 2 on the front surface, and a plurality of circuit boards 16 that are disposed on the back side of the chassis 4 and that drive the PDP 2. . In FIG. 1, a plurality of circuit boards 16 are depicted as one board for simplification. In addition, the plasma display device 1 includes a front cover 8 and a back cover 7 that constitute a housing that accommodates the PDP 2, the chassis 4, and the circuit board 16.

  The PDP 2 has a rectangular shape, and in the present embodiment, the installation base 6 having the legs 5 has an upright posture in which the longitudinal direction is substantially horizontal and the short direction is substantially vertical. Has been placed. Specifically, the PDP 2 is configured by adhering a front glass substrate and a back glass substrate, and a discharge space is formed therein.

  The chassis 4 is used as a support material that also serves as a heat sink, and is made of a metal such as aluminum in consideration of heat dissipation. In the present embodiment, the heat conductive sheet 3 is sandwiched between the PDP 2 and the chassis 4. The heat conductive sheet 3 is joined to the PDP 2 and the chassis 4 using an adhesive or the like.

  The heat conductive sheet 3 is for efficiently transferring the heat generated in the PDP 2 to the chassis 4 and has a thickness of about 1 mm to 2 mm. As the heat conductive sheet 3, an insulating resin sheet, a graphite sheet, a metal sheet, or the like in which a synthetic resin material such as acrylic, urethane, silicon resin, or rubber is added with a filler that enhances heat conductivity can be used. The heat conductive sheet 3 itself may have an adhesive force, and the PDP 2 may be held on the chassis 4 only by the heat conductive sheet 3, or a double-sided adhesive tape may be used without giving the heat conductive sheet 3 an adhesive force. The PDP 2 may be held by the chassis 4.

  The circuit boards 16 are densely arranged and are located on a predetermined region on the back surface of the chassis 4. In the present embodiment, as shown in FIG. 2, the predetermined area on the back surface of the chassis 4 is a central lower portion of the back surface. A plurality of electronic components 16 a are mounted on one surface of the circuit board 16, and the circuit board 16 is disposed in parallel with the rear surface of the chassis 4 so that one surface thereof faces away from the chassis 4.

  In the present embodiment, a partition wall 17 is provided between the chassis 4 and the circuit board 16 to partition the space between them into the chassis 4 side and the circuit board 16 side. The circuit board 16 is attached to the partition wall 17 via a boss.

  The partition wall 17 is preferably provided so as to be continuous with the edge portion 71 of the back cover 7. Moreover, it is preferable that the partition wall 17 is provided so as to close the space surrounded by the protruding portion 72 from the chassis 4 side. Although illustration is omitted, the partition wall 17 is provided with notches for inserting a cable connecting the PDP 2 and the circuit board 16 at appropriate positions.

  The front cover 8 is a rectangular frame body when viewed from the front, and covers the peripheral edge of the front surface of the PDP 2. The front cover 8 is made of resin, for example. On the other hand, the back cover 7 has a shape that encloses the PDP 2 and the chassis 4 from above the circuit board 16. The back cover 7 can be made of, for example, a metal with a high-radiation ceramic sheet attached to the front and back, a metal with an alumite treatment such as black, or a metal with carbon black applied. For these metals, an alloy mainly composed of aluminum or iron is used.

  Specifically, the back cover 7 has an edge 71 that covers the outside of the predetermined area on the back surface of the chassis 4, and a protrusion 72 that protrudes to the opposite side of the chassis 4 inside the edge 71 and accommodates the circuit board 16. And have.

  In the present embodiment, since the predetermined area is the central lower part of the back surface of the chassis 4, the edge portion 71 that covers the outside has a U-shape that opens downward when viewed from the back. However, the shape of the edge portion 71 is not limited to this. For example, the predetermined region that defines the region where the circuit board 16 exists is the central portion of the rear surface of the chassis 4, and the edge portion 71 corresponds to the rear view. It may be a rectangular frame.

  The protrusion 72 extends from the periphery of the bottom wall 72a toward the chassis 4 with the circuit board 16 sandwiched between the rear surface of the chassis 4 and connects the periphery of the bottom wall 72a and the inner edge of the edge 71. And a peripheral wall 72b. The peripheral wall 72b has a rectangular tube shape that is long on the left and right, and a pair of sides that constitute the upper side part that constitutes the upper surface of the projecting part 72, the lower side part that constitutes the lower surface of the projecting part 72, and the left and right side surfaces of the projecting part 72 It has a side.

  Further, in the present embodiment, as a configuration for performing ventilation in the protruding portion 72, the intake port 11 for taking in outside air is provided in the lower side portion of the peripheral wall 72b, and the internal air is discharged to the upper side portion of the peripheral wall 72b. An exhaust port 10 is provided. A fan 9 is disposed in the space surrounded by the protrusions 72.

  The intake port 11 and the exhaust port 10 are actually a collection of minute through-holes arranged on a plurality of straight lines. In FIG. 1, these through-holes are represented by one opening for simplification. Yes. Each through-hole has a size of about several millimeters so that a user's finger cannot be inserted in order to prevent contact with the inside which becomes a high temperature from the outside. This can prevent burns and the like. In addition, the shape of each through hole may be a rectangle, a circle or an ellipse.

  In the present embodiment, a centrifugal fan is employed as the fan 9, and the fan 9 is arranged in such a posture that the air sucked from the rear is discharged upward. In the present embodiment, the heat diffusion plate 15 is disposed in parallel with the circuit board 16 so as to contact the electronic component 16 a mounted on the circuit board 16, and the fan 9 is attached to the back surface of the heat diffusion plate 15. ing. A heat sink 14 is attached to the back of the heat diffusion plate 15 above the fan 9 so that air discharged upward from the fan 9 flows between the fins of the heat sink 14.

  Further, in the present embodiment, a configuration for positively releasing the heat transferred from the circuit board 16 to the partition wall 17 described above to the edge portion 71 of the back cover 7 is employed. Specifically, a plurality of heat pipes 18 are arranged as heat transfer members across the front surface of the partition wall 17 facing the chassis 4 side and the inner wall surface of the edge portion 71 of the back cover 7 facing the chassis 4 side. Yes. These heat pipes 18 are also in contact with the back surface of the chassis 4. More specifically, as shown in FIG. 3, the heat pipes 18 are arranged radially from the partition wall 17 around a portion where the circuit board 16 and the partition wall 17 overlap.

  Each heat pipe 18 is obtained by vacuum-sealing a small amount of hydraulic fluid in a metal sealed container such as copper and forming a capillary structure on the inner surface of the sealed container. For example, water is used as the working fluid. When a part of the heat pipe 18 is heated, the working liquid evaporates in the heating part, the steam moves to the low temperature part, the vapor condenses in the low temperature part, and the condensed liquid is heated by the capillary phenomenon. To recirculate. The heat pipe 18 is a heat dissipating device that utilizes the fact that the series of phase changes occur continuously to quickly move heat. The heat pipe 18 is preferably disposed so that one end thereof overlaps the circuit board 16 in the front-rear direction (the thickness direction of the chassis 4).

  Next, heat dissipation of the plasma display device 1 of the present embodiment will be described.

  Heat generated in the PDP 2 is released from the front surface of the PDP 2 into the atmosphere by radiation action or the like, and is transmitted to the chassis 4 through the heat conductive sheet 3 provided on the back surface of the PDP 2. The heat transferred to the chassis 4 is released into the atmosphere through the edge 71 of the back cover 7 by radiation as shown by an arrow C in FIG.

  In the plasma display device 1 of the present embodiment, even if the plasma display device 1 is wall-mounted or wall-closed and the protrusion 72 of the back cover 7 approaches or contacts the wall surface, the edge 71 of the back cover 7 and the wall surface Since a heat dissipation space can be ensured between them, good heat dissipation can be obtained.

  On the other hand, the circuit board 16 in the protrusion 72 is cooled by forced convection. That is, when the fan 9 is operated, outside air is taken into the protruding portion 72 through the intake port 11 as indicated by an arrow A in FIG. 1, and air in the protruding portion 72 is exhausted as indicated by an arrow B in the drawing. It is discharged to the outside through the mouth 10. Thereby, the heat of the circuit board 16 is discharged outside.

  In this embodiment, since the exhaust port 10 is provided in the upper side part of the surrounding wall 72b and faces the said heat radiating space, the said heat radiating space is also a heat radiating path through which exhaust air flows. That is, since the air discharged from the exhaust port 10 flows along the edge 71 of the back cover 7, the amount of heat released from the edge 71 to the atmosphere can be increased.

  More specifically, the heat generated by the electronic component 16 a mounted on the circuit board 16 is transmitted to the heat sink 14 through the heat diffusion plate 15 and is caused to flow between the fins of the heat sink 14 by the fan 9. Transmitted to the air. Further, the heat transmitted to the heat diffusing plate 15 is also released into the atmosphere through the bottom wall 72a of the protrusion 72 by radiation.

  On the other hand, the heat that has not been transferred to the heat diffusing plate 15 is radiated from the entire circuit board 16 (particularly the other surface opposite to the one surface on which the electronic component 16a is mounted) or by the convection in the protrusion 72. And transmitted to the partition wall 17. The heat transmitted to the protrusion 72 is released into the atmosphere as it is.

  As described above, in the plasma display device 1 of the present embodiment, the partition walls 17 are disposed between the centrally arranged circuit boards 16 and the chassis 4, so that they can be thermally blocked. As a result, heat concentration at the portion sandwiched between the circuit board 16 and the chassis 4 can be prevented, and the heat of the circuit board 16 can be effectively discharged to the outside by forced convection by the fan 9. Further, the heat radiated from the PDP 2 through the chassis 4 can be released into the atmosphere via the edge 71 of the back cover 7 by radiation. Therefore, according to this embodiment, the internal heat can be discharged well while the plasma display device 1 is visually thinned.

  Further, in the present embodiment, the partition wall 17 and the edge portion 71 of the back cover 7 are thermally connected by the heat pipe 18, so that heat transferred from the circuit board 16 to the partition wall 17 can be released to the edge portion 71. it can. Thereby, the partition wall 17 can be effectively cooled, and problems such as unstable operation and life of the circuit board 16 caused by heat can be prevented.

  If the heat pipe 18 is inclined to some extent, the heat transfer action is more effective. For this reason, if the heat pipes 18 are arranged radially as in the present embodiment, the heat of the portion sandwiched between the circuit board 16 and the chassis 4 can be more actively moved to the low temperature portion of the periphery. . Thereby, the heat dissipation efficiency can be further improved.

  In addition, in the said embodiment, although the inlet port 11 and the exhaust port 10 were provided in the surrounding wall 72b of the protrusion part 72, it is also possible to provide these 11, 10 in the bottom wall 72a. However, when the plasma display apparatus 1 is used in a house, it is assumed that the plasma display apparatus 1 is wall-mounted or wall-closed. If the port 10 is provided, intake and exhaust may be difficult. Therefore, the intake port 11 and the exhaust port 10 are preferably provided on the peripheral wall 72b of the protruding portion 72 as in the above-described embodiment.

  Moreover, in the said embodiment, although the heat pipe 18 is also contacting the back surface of the chassis 4, they may be spaced apart. However, even if the partition wall 17 is provided, the portion of the chassis 4 facing the circuit board 16 is likely to be hot, so that the heat pipe 18 is also in contact with the back surface of the chassis 4 as in the above embodiment. It is preferable. If it is in this way, the heat pipe 18 can efficiently release heat from the portion of the chassis 4 that tends to become high temperature to the edge 71 of the back cover 7, and the temperature of the portion of the chassis 4 that tends to become high temperature rises. Can be suppressed.

  Further, the heat pipes 18 do not necessarily have to be radially arranged extending from the partition wall 17, and may be arranged to form the same V shape in a plurality of stages, for example, as shown in FIG. 4.

  Moreover, in the said embodiment, although the several heat pipe 18 was used as a heat-transfer member, it is also possible to use one heat-transfer plate which spreads in fan shape from the partition 17, for example as a heat-transfer member.

  INDUSTRIAL APPLICABILITY The present invention is effective in reducing the temperature of a heat concentration portion when circuit boards are concentrated in order to achieve further thinning in a plasma display device.

1 Plasma display device 2 PDP
DESCRIPTION OF SYMBOLS 3 Thermal conductive sheet 4 Chassis 7 Back cover 71 Edge 72 Projection 72a Bottom wall 72b Perimeter wall 8 Front cover 9 Fan 10 Exhaust port 11 Inlet port 16 Circuit board 17 Bulkhead 18 Heat pipe (heat transfer member)

Claims (6)

A plasma display panel;
A chassis that supports the plasma display panel on the front surface;
A plurality of circuit boards located on a predetermined area of the back surface of the chassis;
An edge that covers the outside of the predetermined region on the back surface of the chassis, and a back cover that protrudes to the opposite side of the chassis inside the edge and has a protrusion that accommodates the plurality of circuit boards.
The projecting portion is provided with an intake port and an exhaust port, and a fan is disposed in a space surrounded by the projecting portion,
A plasma display device, wherein a partition that partitions a space between them into a chassis side and a circuit board side is provided between the chassis and the plurality of circuit boards.   The plasma display device according to claim 1, further comprising a heat transfer member disposed across a front surface of the partition wall facing the chassis side and an inner wall surface of the edge portion of the back cover facing the chassis side.   The plasma display device according to claim 2, wherein the heat transfer member is also in contact with a back surface of the chassis.   4. The plasma display device according to claim 2, wherein the heat transfer member is a plurality of heat pipes in which a working fluid is sealed in an airtight container.   The plasma display device according to claim 4, wherein the plurality of heat pipes are arranged radially extending from the partition wall. The protrusion has a bottom wall facing the back surface of the chassis across the plurality of circuit boards, and a peripheral wall extending from the periphery of the bottom wall to the chassis side,
The plasma display device according to claim 1, wherein the intake port and the exhaust port are provided in the peripheral wall.

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