JP2009089214A - Digital broadcast receiving apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a receiving apparatus capable of suppressing noise mixture into a generated signal as much as possible to generate an analog video or sound signal. <P>SOLUTION: The receiving apparatus is provided with a tuner circuit part for receiving a high frequency signal and converting the received signal into an intermediate frequency signal, a digital demodulation circuit part for extracting a compressed digital video or sound signal from the intermediate frequency signal, a digital circuit part for releasing compression to the compressed signal, a video/sound output circuit for converting the compression-released signal into an analog video or sound signal, and an RF modulator part for converting the analog signal into a high frequency signal; wherein, the tuner circuit part and the RF modulator part are arranged on a first substrate, the digital demodulation circuit part, the digital circuit part and the video/sound output circuit are arranged on a second substrate, and a transmission line for transmitting the analog image or sound signal from the image/sound output circuit to the RF modulator part is arranged on an inner layer of the second substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a digital broadcast receiving apparatus that receives a digital broadcast.

  Conventionally, reception systems for receiving broadcast waves have been widely used. Here, an example of such a receiving system will be described with reference to FIG.

  As shown in the figure, the receiving system 800 includes a digital broadcast receiving device 500 and an analog broadcast receiving device (for example, CRT TV) 900. The digital broadcast receiving apparatus 500 includes an antenna 600, a tuner circuit unit 701, a digital demodulation circuit unit 801 having a digital demodulation IC 802, a video / audio processing IC 804, a video / audio processing memory 805, and a digital circuit unit 803 having a program memory 806, A power supply unit 807, a video / audio output circuit 808, a control microcomputer 809, and the like are provided.

  The analog broadcast receiving apparatus 900 includes a display processing unit 901, an audio processing unit 902, a video / audio input unit 903, an analog broadcast tuner circuit unit 904, and the like. With such a configuration, the receiving system 500 operates as follows.

  A broadcast signal (high frequency signal) received by the antenna 600 is transmitted to the tuner circuit unit 701, detected at a predetermined frequency, and converted into an intermediate frequency signal. This intermediate frequency signal is transmitted to the digital demodulation IC 802 of the digital demodulation circuit unit 801 and converted into a compressed digital video / audio signal (the one obtained by demodulating the broadcast signal).

  Further, the compressed digital video / audio signal is transmitted to the video / audio processing IC 804 of the digital circuit unit 803 and the compression is released (expanded). The expanded digital video / audio signal is converted into an analog video / audio signal (for example, a composite signal or a stereo analog audio signal) by using the video / audio processing memory 805, and the video / audio output circuit 808 performs analog broadcasting. The data is output to the receiving device 900.

  In the analog broadcast receiving apparatus 900, the composite signal and the stereo analog audio signal output from the receiving apparatus 500 are transmitted to the video / audio input unit 903. The analog broadcast tuner circuit unit 904 receives the analog broadcast, and transmits the video signal and audio signal of the broadcast to the video / audio input unit 903. The signal transmitted to the video / audio input unit 903 in this way is transmitted to the display processing unit 901 and the audio processing unit 902 so that video display and audio output are performed.

  Further, the control microcomputer 809 controls the operation state in each circuit. The power supply unit 807 is connected to the tuner circuit unit 701, the digital demodulation IC 802, the video / audio processing IC 804, the video / audio processing memory 805, and the program memory 806, and supplies drive power thereto. The program memory 806 stores a control code of the receiving device.

Patent Document 1 describes a digital broadcast receiver that reduces the influence of digital demodulator noise on a high-frequency signal input unit when digitally demodulating a received high-frequency signal. Patent Document 2 discloses a compact satellite broadcast receiving tuner in which an FM demodulator and an I / Q converter are provided in the same housing, and reduces mutual interference between the FM demodulator and the I / Q converter. A satellite broadcast receiving tuner is described. Patent Document 3 discloses an integrated unit including an RF modulator portion in which an RF modulator portion and a tuner portion are provided in the same housing in order to reduce an attachment area to a set device.
JP 2000-68673 A Japanese Patent Laid-Open No. 11-341375 Japanese Utility Model Publication No. 6-38379

  In the receiving apparatus as described above, it is necessary to avoid as much as possible noise from video and audio signals. Therefore, it is necessary to consider in order to avoid mixing noise as much as possible in mounting each circuit in the receiving apparatus. In particular, it is desirable to sufficiently consider the noise mixed from the outside of the receiving device, for example, by adopting a configuration of covering with a chassis.

  In addition, when an analog video or audio signal is generated and output, there is a possibility that the video or audio is greatly deteriorated due to noise mixed in the signal. Therefore, in the case where there is such a situation, further countermeasures against noise contamination are desired.

  Therefore, in view of the above-described problems, an object of the present invention is to provide a receiving apparatus that generates an analog video or audio signal, and that can suppress noise mixing in the signal or the like as much as possible.

  To achieve the above object, a receiving apparatus according to the present invention receives a high-frequency signal from a broadcasting station that broadcasts a high-frequency signal obtained by modulating a compressed digital video or audio signal, and detects the signal at a predetermined frequency. A tuner circuit unit that converts the signal into an intermediate frequency signal, a digital demodulation circuit unit that extracts the compressed digital video or audio signal from the intermediate frequency signal, and the compressed digital video or audio signal A digital circuit unit for converting the compressed digital video or audio signal into a decompressed digital video or audio signal, a video / audio output circuit for converting the compressed digital video or audio signal into an analog video or audio signal, An RF modulator for converting the analog video or audio signal into a high-frequency signal; the tuner circuit; a digital demodulation circuit; And a power supply unit that supplies power to the audio / video output circuit, wherein the tuner circuit unit and the RF modulator unit are disposed on a predetermined first substrate. On the other hand, the digital demodulation circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit are provided on a predetermined second substrate having an inner layer, and the inner layer of the second substrate includes A configuration (first configuration) is provided in which a transmission path for transmitting the analog video or audio signal from the video / audio output circuit toward the RF modulator section is arranged.

  According to this configuration, by covering the first substrate and the second substrate with, for example, a metallic chassis or the like, it is possible to reduce noise received by each circuit in the receiving device from the outside. Furthermore, a transmission path for transmitting an analog video or audio signal from the video / audio output circuit toward the RF modulator section is arranged in the inner layer of the second substrate. For this reason, it is possible to further reduce noise mixed from the outside into the analog video or audio signal.

  In the first configuration, the first substrate has a substantially flat plate shape having at least a first side, and a first connector for electrically connecting to the second substrate is provided on the first side. The second board has a substantially flat plate shape having at least a second side, and a second connector to be electrically connected to the first board faces the second side. The first substrate and the second substrate are arranged so that the first side and the second side face each other, and the first connector and the second connector are connected to each other, so that they are electrically connected to each other. Connected to each other (second configuration).

  According to this configuration, since the first connector and the second connector are disposed at positions facing each other while having the first substrate and the second substrate, electrical connection between the two substrates is facilitated. It can be realized.

  More specifically, as the second configuration, the intermediate frequency signal is transmitted from the tuner circuit unit to the digital demodulation circuit unit via the first connector and the second connector (third configuration). The configuration of

  Further, specifically as the third configuration, the second substrate is a multilayer substrate having three or more layers, while the number of layers in the first substrate is larger than the number of layers in the second substrate. It is good also as a few structures (4th structure). More specifically, the first substrate may be a two-layer substrate, and the second substrate may be a four-layer substrate (fifth configuration). According to this configuration, the cost can be reduced as compared with the case where both the substrates are multilayer substrates.

  More specifically, as the second configuration, the arrangement of the digital demodulation circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit on the second substrate is from the second side to the opposite side. The digital demodulation circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit may be arranged in this order (sixth configuration).

  Further, in the second configuration, the first substrate and the second substrate are provided so as to be covered with a chassis formed of a conductive material, and an earth pattern on the first substrate and an earth on the second substrate are provided. The patterns may be connected to the chassis so that they are electrically connected to each other (seventh configuration).

  In the seventh configuration, more specifically, the ground pattern on the first substrate is used as a ground for an analog circuit, while the ground pattern on the second substrate is used as a ground for a digital circuit. It is good also as a structure (8th structure).

  Further, in the seventh configuration, the connection between the ground pattern and the chassis in each of the substrates is made by solder connection (referred to as “first solder connection”), and the first solder connection is It is good also as a structure (9th structure) made | formed by the surface of one side of each board | substrate.

  According to this configuration, in the manufacturing process of the receiving device, it is not necessary to turn the substrate over every time the solder connection between the ground pattern and the chassis is performed. For this reason, it is possible to reduce the number of steps in the manufacturing process, and consequently to reduce the manufacturing cost.

  Further, in the ninth configuration, the first solder connection may be a configuration (tenth configuration) which is made on a surface of each substrate having a smaller distance from the chassis.

  According to this configuration, it is possible to avoid as much as possible the situation where the soldering device or the tool contacts the chassis in the manufacturing process of the receiving device. As a result, the efficiency of the mounting process can be improved, and the manufacturing cost can be reduced.

  In the ninth or tenth configuration, the first solder connection may be a configuration (an eleventh configuration) formed on a plurality of sides of each substrate. According to this configuration, since the number of connection points between the ground pattern and the chassis is increased, the impedance between the two can be further reduced.

  More specifically, as the eleventh configuration, the first solder connection may be configured on all sides of each substrate (a twelfth configuration). According to this configuration, the connection point between the ground pattern and the chassis can be efficiently provided over a wide area.

  Further, in the second configuration, the first connector and the second connector are both connected to each other by making a solder connection with a jumper wire (referred to as “second solder connection”). The solder connection may be configured (a thirteenth configuration) on one surface of each substrate.

  According to this configuration, in the manufacturing process of the receiving device, it is not necessary to turn the board over every time soldering related to the jumper wire is performed. For this reason, it is possible to reduce the number of steps in the manufacturing process, and consequently to reduce the manufacturing cost.

  In the ninth configuration, the first connector and the second connector are both connected to each other by making a solder connection (referred to as a “second solder connection”) with a jumper wire. The solder connection may be a configuration (fourteenth configuration) made on the surface of each of the substrates on which the first solder connection is made.

  According to this configuration, in the manufacturing process of the receiving device, for example, when the first solder connection and the second solder connection are performed simultaneously or continuously, it is not necessary to turn the substrate over for each solder connection. . For this reason, it is possible to reduce the number of steps in the manufacturing process, and consequently to reduce the manufacturing cost.

  In the fourteenth configuration, an input / output terminal for inputting / outputting a signal to / from the outside is provided, and the input / output terminal is soldered to the second substrate on the surface where the second solder connection is made. It is good also as a connected structure (15th structure).

  According to this configuration, in the manufacturing process of the receiving device, for example, when the solder connection and the second solder connection related to the input / output terminal are performed simultaneously or continuously, the substrate is turned over for each solder connection. There is no need. For this reason, it is possible to reduce the number of steps in the manufacturing process, and consequently to reduce the manufacturing cost.

  In the fifteenth configuration, the first substrate and the second substrate are disposed inside a substantially rectangular parallelepiped chassis, and a tuner input terminal for inputting the high-frequency signal from the outside to the tuner circuit unit, and The input / output terminals are provided so as to protrude from the chassis, and a surface of the chassis from which the tuner input terminals protrude and a surface from which the input / output terminals protrude are orthogonal to each other. It is good also as a structure (16th structure).

  According to this configuration, when the input / output terminal is connected to the external device, the relative arrangement state of the receiving device and the external device (the receiving device is externally connected) is changed by changing whether the protruding portion of the input / output terminal is bent or not. It is possible to change whether the device is connected upright or laid down. In any arrangement state, the tuner input terminal can be maintained on the side surface (the side surface when the adjacent surface between the receiving device and the external device is the bottom surface). Therefore, it is easy to make the relative arrangement state of the receiving device and the external device suitable for the situation without greatly changing the protruding direction of the tuner input terminal.

  In any of the first to sixteenth configurations, the RF modulator section may be configured to convert the analog video or audio signal into a high-frequency signal in the VHF band (a seventeenth configuration). According to this configuration, even when receiving a UHF band broadcast signal used in terrestrial digital broadcasting in Japan, the situation where the broadcast signal and the high-frequency signal interfere with each other is avoided as much as possible. Is possible.

  In any one of the first to seventeenth configurations, a shield plate may be mounted between the RF modulator unit and the tuner circuit unit (eighteenth configuration). According to this configuration, it is possible to avoid the situation in which the RF modulator unit and the tuner circuit unit give noise to each other as much as possible, and it is possible to reduce the degradation of performance in both.

  A receiving unit that receives a broadcast wave related to a digital video or audio signal, a video / audio output circuit that converts the digital video or audio signal into an analog video or audio signal, and a predetermined audio / video output circuit An RF modulator unit that receives the analog video or audio signal through a transmission path and converts the analog video or audio signal into a high-frequency signal, and the video / audio output circuit is disposed on a substrate having an inner layer, and the transmission If the receiving device has a configuration (19th configuration) arranged in the inner layer, it is possible to reduce as much as possible the noise mixed from the outside into the analog video or audio signal.

  As described above, according to the receiving device according to the present invention, the first substrate and the second substrate are covered with, for example, a metal chassis, thereby reducing noise received by each circuit in the receiving device from the outside. It becomes possible to make it. Furthermore, a transmission path for transmitting an analog video or audio signal from the video / audio output circuit toward the RF modulator section is arranged in the inner layer of the second substrate. For this reason, it is possible to further reduce noise mixed from the outside into the analog video or audio signal.

  An embodiment of the present invention will be described with reference to a receiving system that receives a digital broadcast wave and performs video display and audio output.

  A schematic configuration of the receiving system of the present embodiment is shown in FIG. As shown in the figure, the receiving system 100 includes an antenna 200, a receiving device 300, and a video display device 400. The receiving apparatus 300 includes a tuner circuit unit 301, a digital demodulation circuit unit 302, a digital circuit unit 304, a control microcomputer 308, a power supply unit 309, an RF modulator circuit unit (RF modulator unit) 310, a video / audio output circuit 311, and the like. ing.

  The digital demodulation circuit unit 302 includes a digital demodulation IC 303. The digital circuit unit 304 includes a video / audio processing IC 305, a video / audio processing memory 306, and a program memory 307 that stores control codes and the like of the receiving apparatus 300. The video display device 400 includes a display processing unit 401, an audio processing unit 402, and an analog broadcast tuner circuit unit 403.

  The antenna 200 is connected to a tuner input terminal of the tuner circuit unit 301 via a coaxial cable. The output side of the tuner circuit unit 301 is connected to the input side of the digital demodulation IC 303, and the output side of the digital demodulation IC 303 is connected to the input side of the video / audio processing IC 305.

  The video / audio processing memory 306, the program memory 307, and the video / audio output circuit 311 are connected to the video / audio processing IC 305, respectively. The audio / video processing IC 305 holds a serial control signal for controlling the tuner circuit unit 301 and the digital demodulation IC 303. The RF modulator circuit unit 310 is connected to the video / audio processing IC 305 via the video / audio output circuit 311.

  The power supply unit 309 is connected to the tuner circuit unit 301, the digital demodulation IC 303, the video / audio processing IC 305, the video / audio processing memory 306, the program memory 307, and the video / audio output circuit 311 and supplies driving power thereto. To do. Note that the RF modulator circuit unit 310 is connected to the video display device 400.

  The receiving device 300 is provided with a pin-shaped connector 315 for enabling connection with an external device (in particular, the video display device 400 is assumed). The connector 315 serves as an input / output terminal related to each circuit (the tuner circuit unit 301, the digital demodulation circuit unit 302, the power supply unit 309, the digital circuit unit 304, the video / audio output circuit 308, etc.) in the receiving device 300. To fulfill. The arrangement and configuration of the connector 315 will be described again.

  On the other hand, the video display device 400 includes an analog broadcast tuner circuit unit 403, a display processing unit 401, and an audio processing unit 402. The analog broadcast tuner circuit unit 403 is connected to the RF modulator circuit unit 310 on the receiving device 300 side, and the display processing unit 401 and the audio processing unit 402 are connected to the analog broadcast tuner circuit unit 403.

  Next, the operation of the receiving system 100 will be described below.

  A broadcast station broadcasts a compressed digital video and audio signal (for example, a signal representing the contents of a digital television broadcast program) as a high-frequency signal. This high frequency signal is received through the antenna 200 and transmitted to the tuner circuit unit 301. The high frequency signal is detected by the tuner circuit unit 301 at a predetermined frequency and converted to a signal of an intermediate frequency.

  The intermediate frequency signal is input to the digital demodulation IC 303 of the digital demodulation circuit unit 302 via a first connector 503, a jumper 510, and a second connector 504, which will be described later. The digital demodulation IC 303 extracts the above-mentioned compressed digital video and audio signals from the intermediate frequency signal. The compressed digital video and audio signals are transmitted to the video and audio processing IC 305, and converted into digital video and audio signals that have been decompressed (demodulated) using the video and audio processing memory 306. .

  The compressed digital video and audio signals are converted into analog video and audio signals by the video / audio output circuit 311 and amplified (amplified). Thereafter, the analog video and audio signals are modulated by the RF modulator circuit unit 310 into a high-frequency signal (RF signal) in the VHF band.

  This high frequency signal is transmitted to the analog broadcast tuner circuit unit 403 on the video display device 400 side. The display processing unit 401 performs video display based on the video signal included in the high frequency signal, and the audio processing unit 402 performs audio output based on the audio signal included in the high frequency signal. To do.

  Through the series of processes described above, the receiving system 100 can perform video display and audio output based on the received compressed digital video and audio signals. The analog broadcast tuner circuit unit 403 can also separately receive analog broadcast signals (analog video and audio signals). The display processing unit 401 and the audio processing unit 402 can receive the analog video and audio signals. It is also possible to perform video display and an audio processing unit based on the audio signal.

  Next, the mounting state of the receiving apparatus 300 will be described below.

  As a diagram showing the mounting state of the receiving apparatus 300, FIG. 2 shows a view from one surface (front surface), and FIG. 3 shows a view from the other surface (back surface). As shown in the figure, the receiving apparatus 300 includes a first board 500 and a second board 501 on which various circuits are mounted. These boards are made of metal (conductive) and have a substantially rectangular parallelepiped shape. 507 is covered. Each of the substrates has a flat plate shape (the mounting surface is rectangular) and is arranged so that predetermined sides of the substrates face each other.

  In addition, a tuner circuit unit 301 and an RF modulator circuit unit 310 are arranged on the first substrate 500, and a digital demodulation circuit unit 302, a digital circuit unit 304, a power supply unit 309, and an audio / video unit are arranged on the second substrate 501. An output circuit 311 is arranged. Each circuit arranged on the first substrate 500 and each circuit arranged on the second substrate 501 are separated from each other by the first shield plate 508. Note that as a more specific arrangement mode on the second substrate 501, the second connector 504, the digital demodulator circuit 302, the power source are arranged from the side adjacent to the first substrate 500 (the left side in FIG. 2). The unit 309, the digital circuit unit 304, and the video / audio output circuit 311 are arranged in this order.

  The tuner input terminal 502 is attached to the side of the frame portion of the chassis 507 that is not adjacent to the second substrate (left side in FIG. 2) so as to protrude vertically outward from the chassis 507. 500 is electrically connected to a tuner circuit unit 301 disposed on 500. The first substrate 500 is attached to the chassis 507, and the analog ground pattern of the tuner circuit unit 301 is electrically connected to the chassis 507. Further, in the first substrate 500, the second substrate 501 side is faced so as to face the side opposite to the side on which the tuner input terminal 502 is attached, that is, the side facing the second substrate 501. A first connector 503 for realizing connection is disposed.

  The chassis 507 has a first lid so as to face the front side surfaces of the first substrate 500 and the second substrate 501, and a second lid so as to face the back side surfaces of both substrates. In addition, between the first lid and the second lid, a frame portion is provided so as to surround the first substrate 500 and the second substrate 501 with four side walls. Thereby, the first substrate 500 and the second substrate 501 are accommodated in a substantially rectangular parallelepiped chassis 507 having the first lid and the second lid as both bottom surfaces and the frame portions as side surfaces (protrusions of terminals and the like). Is excluded).

  Similarly to the tuner input terminal 502, the RF output terminal 514 is attached so as to protrude vertically outward from the side of the chassis 507 that is not adjacent to the second substrate, and on the first substrate 500. Is electrically connected to the RF modulator circuit section 310 disposed in the circuit. In addition, the analog ground pattern of the RF modulator circuit unit 310 is electrically connected to the chassis 507. The tuner circuit unit 301 and the RF modulator circuit unit 310 are separated from each other by a third shield plate 515.

  In addition, the second connector 504 is disposed so as to face the side facing the first substrate 500 in the second substrate. The first connector 503 and the second connector 504 are connected to each other by a jumper 510. Therefore, it is not necessary to provide a terminal for realizing the connection between the first substrate 500 and the second substrate 501 outside the chassis 507. Via these connectors (503, 504), transmission of intermediate frequency signals from the first board 500 side to the second board 501 side, analog video from the second board 501 side to the first board 500 side, and An audio signal is transmitted.

  A multilayer substrate having an inner layer is used as the second substrate 501, and wiring for connecting the audio / video processing IC 305 and the audio / video processing memory 306 of the digital circuit unit 304 is arranged in an inner layer pattern. On the other hand, the first substrate 500 is not mounted with an IC having a large number of pins of several tens or more, and can have a smaller number of layers than the second substrate 501. In the receiving apparatus 300 of this embodiment, the first substrate 500 is a two-layer substrate, and the second substrate 501 is a four-layer substrate.

  In the second substrate 501, wiring for transmitting video and audio signals from the video / audio output circuit 311 to the RF modulator circuit unit 310 (particularly, wiring connecting the video / audio output circuit 311 and the second connector 504). Are arranged in an inner layer pattern. Note that as an arrangement of the jumpers 510 that connect the circuit on the first substrate 500 and the circuit on the second substrate 501, wiring for transmitting a signal from the first substrate 500 side to the second substrate 501 side; It is preferable that a distance be provided as much as possible between the second substrate 501 side and the wiring for transmitting a signal from the first substrate 500 side. Similarly, it is also preferable that a wiring for ground connection is inserted between these wirings. In this way, it is possible to avoid as much as possible that signals passing through both wirings interfere with each other or influence each other.

  The digital demodulating circuit portion 302 and the digital ground pattern of the digital circuit portion 304 of the second substrate 501 are electrically connected to the chassis 507. In the second substrate 501, the digital demodulation circuit unit 302 and other circuits (the digital circuit unit 304, the power supply unit 309, and the video / audio output circuit 311) are separated from each other by the second shield plate 509. .

  The ground patterns of the first substrate 500 and the second substrate 501 and the chassis 507 are all connected by solder connections 520 to 527 at a plurality of locations on one surface (back surface) of the substrate. More specifically, it is performed on all sides of each substrate (500, 501). Further, all the jumpers 510 that connect the first connector 503 and the second connector 504 are provided by being soldered to the respective connectors (503, 504) on the back surface side of the substrate.

  In this way, since any solder connection is made on one surface (here, the back surface) of the substrate, in the manufacturing process, for example, when each solder connection is performed simultaneously or subsequently, the substrate is connected at each solder connection. There is no need to turn it over. In addition, the distance between the mounting surface (front surface and back surface) of each substrate (500, 501) and the chassis (the portion covering the mounting surface) is larger on the back surface than on the front surface. It is getting smaller. In other words, the height of the chassis side is lower on the back side. Therefore, in the soldering process, it is possible to reduce the possibility that the soldering device or tool contacts the side surface of the chassis by making the solder connection on the back side surface, compared to the case where it is made on the front side surface. .

  In addition, one side of the second substrate 501 that is orthogonal to the side where the second connector is disposed (the upper side in FIG. 2) projects vertically outward from this side. A third connector 505 (corresponding to the connector 315 described above) is arranged. That is, the third connector 505 protrudes in a direction orthogonal to the axis of the tuner input terminal 502 (the direction of the L shape).

  The third connector 505 protrudes to the outside of the chassis 507, and each circuit provided on the first substrate 500 and the second substrate can be connected to an external device such as the video display device 400. . That is, the tuner input terminal 502 and the third connector 505 are provided so as to protrude from a chassis 507 that is a substantially rectangular parallelepiped, and the surface of the chassis 507 from which the tuner input terminal 502 protrudes and the third connector 505 are provided. The protruding surfaces are perpendicular to each other. The third connector 505 is made of a plastic conductive material and can be bent by applying an external force.

  Since the third connector 505 is arranged and configured in this manner, the connection mode between the receiving device 100 and the video display device 400 can be made more suitable for the situation. More specifically, by preventing the third connector 505 from being bent, it is possible to connect the receiving device 100 to the video display device 400 in an upright manner as shown in FIG. On the other hand, by bending the third connector 505 at a right angle, as shown in FIG. 5, the receiving device can be laid down and connected to the video display device 400.

  That is, it is possible to cope with both connection modes only by bending the pin-shaped third connector 505 without changing the design of the component layout or the like in the receiving device 300. Note that the third connector 505 and the second substrate 501 are connected by solder connection on the back side of the substrate.

  Since the UHF band is used for terrestrial digital broadcasting in Japan, it is preferable to convert the analog video and audio signals to a high frequency other than the UHF band in the RF modulator unit 310. . Therefore, in the present embodiment, the analog video and audio signals are converted to high frequencies in the VHF band. By doing so, it is possible to suppress the RF output signal generated by the RF modulator circuit unit 310 from affecting the digital broadcast signal received by the tuner circuit unit 301 as much as possible.

  In the present embodiment, no composite signal or stereo analog signal is used as the output of video and audio signals from the receiving device 100 to the video display device 400. Therefore, the analog broadcast tuner circuit unit 403 can receive video and audio signals related to digital broadcasting without occupying terminals related to the composite signal and stereo analog signal of the analog broadcast receiving TV.

  For example, when analog broadcasting is stopped and only digital broadcasting is performed, an antenna input terminal for receiving analog broadcasting is not required, so this antenna input terminal should be used as an audio input terminal for digital broadcasting. Is possible.

  Although one embodiment of the present invention has been described above, the embodiment of the present invention is not limited to this content, and various modifications can be made without departing from the gist of the present invention.

It is a block diagram of the receiving system which concerns on embodiment of this invention. It is a block diagram in the surface of the front side of the receiver which concerns on embodiment of this invention. It is a block diagram in the surface on the back side of the receiver which concerns on embodiment of this invention. It is explanatory drawing of the state which connected the receiving apparatus upright with respect to the video display apparatus. It is explanatory drawing of the state which laid down and connected the receiving apparatus with respect to the video display apparatus. It is a block diagram concerning the conventional receiving system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Reception system 200 Antenna 301 Tuner circuit part 302 Digital demodulation circuit part 303 Digital demodulation IC
304 Digital circuit section 305 Video / audio processing IC
306 Video / audio processing memory 307 Program memory 308 Control microcomputer 309 Power supply unit 310 RF modulator circuit unit 311 Video / audio output circuit unit 400 Video display device 401 Display processing unit 402 Audio processing unit 403 Analog broadcast tuner circuit unit 500 First substrate 501 Second board 502 Tuner input terminal 503 First connector 504 Second connector 505 Third connector (input / output terminal)
507 Chassis 508 First shield plate 509 Second shield plate 510 Jumper (jumper wire)
514 RF output terminal 520-527 Solder connection

Claims (19)

A tuner circuit unit that receives a high-frequency signal from a broadcasting station that broadcasts a high-frequency signal obtained by modulating a compressed digital video or audio signal, detects the signal at a predetermined frequency, and converts the signal into an intermediate-frequency signal;
A digital demodulation circuit unit for extracting the compressed digital video or audio signal from the intermediate frequency signal;
A digital circuit unit for converting the compressed digital video or audio signal into a decompressed digital video or audio signal;
A video / audio output circuit for converting the compressed digital video or audio signal into an analog video or audio signal;
An RF modulator for converting the analog video or audio signal into a high-frequency signal;
A power supply unit for supplying power to the tuner circuit unit, the digital demodulation circuit unit, the digital circuit unit, and the video / audio output circuit;
While the tuner circuit unit and the RF modulator unit are arranged and provided on a predetermined first substrate,
The digital demodulation circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit are arranged and provided on a predetermined second substrate having an inner layer,
A receiving apparatus, wherein a transmission path for transmitting the analog video or audio signal from the video / audio output circuit toward the RF modulator section is disposed in an inner layer of the second substrate. The first substrate is
A first connector having at least a first side and a first connector for being electrically connected to the second substrate, facing the first side;
The second substrate is
A substantially flat plate shape having at least a second side, and a second connector for being electrically connected to the first substrate is provided to face the second side,
The first substrate and the second substrate are:
The first side and the second side are arranged to face each other, and
The receiving apparatus according to claim 1, wherein the first connector and the second connector are connected to each other so as to be electrically connected to each other. The intermediate frequency signal is:
The receiving apparatus according to claim 2, wherein the receiving device is transmitted from the tuner circuit unit to the digital demodulation circuit unit via the first connector and the second connector. While the second substrate is a multilayer substrate having three or more layers,
The receiving device according to claim 3, wherein the number of layers in the first substrate is smaller than the number of layers in the second substrate.   The receiving apparatus according to claim 4, wherein the first substrate is a two-layer substrate, and the second substrate is a four-layer substrate. In the digital demodulation circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit, the arrangement mode on the second substrate,
The receiving apparatus according to claim 2, wherein the digital demodulating circuit unit, the power supply unit, the digital circuit unit, and the video / audio output circuit are arranged in this order from the second side toward the opposite side. The first substrate and the second substrate are provided to be covered with a chassis formed of a conductive material,
The receiving apparatus according to claim 2, wherein the ground pattern on the first substrate and the ground pattern on the second substrate are both electrically connected to each other by being connected to the chassis. While the ground pattern on the first substrate is used as an analog circuit ground,
The receiving apparatus according to claim 7, wherein the ground pattern on the second substrate is used as a ground of a digital circuit. The connection between the ground pattern and the chassis on each of the substrates is made by solder connection (referred to as “first solder connection”),
The first solder connection is:
The receiving apparatus according to claim 7, wherein the receiving apparatus is formed on one side of each substrate. The first solder connection is:
The receiving apparatus according to claim 9, wherein the receiving apparatus is formed on a surface having a smaller distance from the chassis among the surfaces of the substrates. The first solder connection is:
The receiving apparatus according to claim 9, wherein the receiving apparatus is formed on a plurality of sides of each substrate. The first solder connection is:
The receiving apparatus according to claim 11, wherein the receiving apparatus is formed on all sides of each substrate. The first connector and the second connector are both connected to each other by making a solder connection with a jumper wire (referred to as “second solder connection”).
The second solder connection is
The receiving apparatus according to claim 2, wherein the receiving apparatus is formed on one side of each substrate. The first connector and the second connector are both connected to each other by making a solder connection with a jumper wire (referred to as “second solder connection”).
The second solder connection is
The receiving device according to claim 9, wherein the receiving device is formed on a surface of the substrates on which the first solder connection is made. It has an input / output terminal to input / output signals to / from the outside.
The receiving device according to claim 14, wherein the input / output terminal is solder-connected to the second substrate on a surface where the second solder connection is made. The first substrate and the second substrate are disposed inside a substantially rectangular parallelepiped chassis,
A tuner input terminal for inputting the high-frequency signal from the outside to the tuner circuit unit, and the input / output terminal are provided so as to protrude from the chassis, respectively.
The receiving device according to claim 15, wherein a surface of the chassis from which the tuner input terminal protrudes and a surface from which the input / output terminal protrudes are orthogonal to each other. The RF modulator section is
The receiving apparatus according to any one of claims 1 to 16, wherein the analog video or audio signal is converted into a high-frequency signal in a VHF band.   The receiving apparatus according to any one of claims 1 to 17, wherein a shield plate is mounted between the RF modulator section and the tuner circuit section. A receiver for receiving broadcast waves related to digital video or audio signals;
A video / audio output circuit for converting the digital video or audio signal into an analog video or audio signal;
An RF modulator unit that receives the analog video or audio signal from the video / audio output circuit through a predetermined transmission path and converts the analog video or audio signal into a high-frequency signal;
The video / audio output circuit is provided on a substrate having an inner layer,
The receiving apparatus, wherein the transmission path is arranged in the inner layer.

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