JP2009053741A - Radio ic device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radio IC device for simplifying manufacturing, for achieving miniaturization, and for improving environment resistance and a method for manufacturing the same. <P>SOLUTION: This radio IC device is provided with (a) an electromagnetic coupling modules 20 in which a radio IC chip is mounted so as to be electrically conducted on a power feeding circuit substrate 22 including an inductance element; (b) a radiating plate 28; and (c) an adhesive layer 26 formed so as to be adhered to the electromagnetic coupling module 20 and the radiating plate 28 to cover the electromagnetic coupling module 20 and the radiating plate 28 with its both main faces having adhesiveness, and extended to the peripheral of the electromagnetic coupling module 20 and the radiating plate 28. A matching circuit for carrying impedance matching with the radiating plate 28 and the radio IC chip or a resonance circuit are formed by using an inductance element on the power feeding circuit substrate 22. The radiating plate 28 and the power feeding circuit 22 are coupled by an electromagnetic field. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wireless IC device and a manufacturing method thereof, for example, a wireless IC device such as a non-contact type wireless IC tag used in an RF-ID (Radio Frequency Identification) system and a manufacturing method thereof.

  Conventionally, a wireless IC device including a wireless IC chip and a radiation plate has been proposed.

For example, Patent Document 1 discloses a wireless IC device shown in a plan view of FIG. In this wireless IC device, a main antenna element 101 is formed as a radiation plate on a dielectric substrate 104, and the wireless IC chip 105 is connected to the main antenna element 104 so as to be electrically conductive. Further, an auxiliary antenna element 102 and a matching unit 103 for impedance matching between the main antenna element and the wireless IC chip 105 are arranged on the substrate 104 in a state of being close to the main antenna element 101.
JP 2005-244778 A

  However, this wireless IC device has the following problems.

(1) The wireless IC chip 105 and the main antenna element 101 or the auxiliary antenna element 102 need to be electrically connected, and the wireless IC chip 105 needs to be mounted with high accuracy. For this reason, an expensive mounting apparatus and time is required for accurate mounting.

(2) Since the auxiliary antenna element 102 is arranged on the same plane as the main antenna element 101 and the size thereof is also large, the size of the wireless tag is also increased.

(3) Since the antenna elements 101 and 102 and the wireless IC chip 105 are arranged in an exposed state, the environmental resistance is poor.

  In view of such circumstances, the present invention is intended to provide a wireless IC device that can be easily manufactured, can be reduced in size, and can improve environmental resistance, and a manufacturing method thereof.

  In order to solve the above-described problems, the present invention provides a wireless IC device configured as follows.

  The wireless IC device includes: (a) an electromagnetic coupling module mounted so that the wireless IC chip is electrically connected to a power supply circuit board including an inductance element; (b) a radiation plate; and (c) both main surfaces thereof. An adhesive layer that adheres to the electromagnetic coupling module and the radiation plate, covers the electromagnetic coupling module and the radiation plate, and extends to the periphery of the electromagnetic coupling module and the radiation plate; Prepare. A matching circuit for performing impedance matching between the radiation plate and the wireless IC chip and a resonance circuit for setting a frequency of transmission / reception signals are formed on the power supply circuit board using the inductance element. The radiation plate and the feeder circuit board are coupled by an electromagnetic field.

  According to the above configuration, since the radiation plate and the feeder circuit board are coupled by an electromagnetic field, the alignment accuracy between the radiation plate and the feeder circuit board is such that the radiation plate and the feeder circuit board are electrically connected. This can be more relaxed than when connecting. Moreover, it becomes easy to manufacture a wireless IC device continuously by using an adhesive layer.

  Further, by forming the matching circuit on the power supply circuit board on which the wireless IC chip is mounted, the area occupied only by the matching circuit can be reduced, and the wireless IC device can be downsized.

  Further, when the wireless IC device is fixed to the article, an electromagnetic coupling module and / or a portion extending around the radiation plate of the adhesive layer sticks to the article, and the electromagnetic coupling module and / or between the adhesive layer and the article. A radiation plate is arranged. The electromagnetic coupling module and / or the radiation plate disposed between the adhesive layer and the article are covered with the adhesive layer and are not exposed to the outside, and thus are protected by the adhesive layer.

  Preferably, a base material on which the radiation plate is formed is provided.

  In this case, it becomes easy to form a radiation plate and attach it to the adhesive layer.

  Preferably, the base material covers the entire one main surface of the adhesive layer.

  In this case, the adhesive layer can be prevented from being exposed to the outside when the other main surface of the adhesive layer is attached to the article and the wireless IC device is fixed.

  Preferably, a release layer is further provided on the adhesive layer.

  In this case, when the wireless IC device is fixed to the article, the release layer is peeled off, and the adhesive layer is attached to the article. Since the adhesive layer is not exposed until the start of use, handling of the wireless IC device is facilitated.

  Preferably, the radiation plate is formed in advance on an article for fixing the wireless IC device.

  In this case, the process of attaching the wireless IC device can be simplified.

  Preferably, a portion of the article where the radiation plate is formed in advance and its periphery are covered with the adhesive layer.

  In this case, the environmental resistance of the radiation plate is improved.

  Preferably, the electromagnetic coupling module is embedded in the adhesive layer.

  In this case, both the power supply circuit board and the wireless IC chip can be arranged in the adhesive layer to improve environment resistance and impact resistance.

  Preferably, the periphery of the wireless IC chip is covered with a protective member.

  In this case, since the wireless IC chip that is likely to fail is covered and protected by a protective member different from the adhesive layer, the reliability is improved.

  Preferably, the feeder circuit board is disposed such that a main surface on which the wireless IC chip is mounted faces the radiation plate.

  In this case, the wireless IC chip is disposed between the radiation plate and the power supply circuit board. When the wireless IC device is attached, the wireless IC chip is protected from an external impact or the like by the power feeding circuit board or the radiation plate.

  In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a wireless IC device configured as follows.

  The method of manufacturing a wireless IC device includes (1) a first step of forming a radiation plate on a sheet-like substrate, and (2) a second step of forming an adhesive layer on the substrate on which the radiation plate is formed. And (3) a third step of mounting an electromagnetic coupling module mounted on the adhesive layer so that a wireless IC chip is electrically connected to a power supply circuit board including an inductance element, and (4) the step And a fourth step of covering the adhesive layer and the electromagnetic coupling module with a release sheet.

  According to the above method, a matching circuit or a resonance circuit for impedance matching between the radiation plate and the wireless IC chip is formed on the feeder circuit board using the inductance element, and the radiation plate and the feeder circuit board are coupled by the electromagnetic field. The wireless IC device can be easily manufactured.

  The wireless IC device manufactured by the above method is used by peeling off a release sheet and attaching an adhesive layer to an article.

  In order to solve the above problems, the present invention provides a method for manufacturing another wireless IC device configured as follows.

  The method of manufacturing a wireless IC device includes (1) a first step of forming a radiation plate on the surface of an article, and (2) a second step of forming an adhesive layer on the surface of the article on which the radiation plate is formed. And (3) a third step of mounting an electromagnetic coupling module mounted so that a wireless IC chip is electrically connected to a power supply circuit board including an inductance element on the adhesive layer; and (4) the adhesive layer. And a fourth step of coating the electromagnetic coupling module with a substrate.

  According to the above method, the wireless IC device is manufactured in a state of being attached to an article. By simultaneously forming the radiation plate in the printing process of articles such as wrapping paper and cardboard, the process can be shortened.

  According to the above method, a matching circuit or a resonance circuit for impedance matching between the radiation plate and the wireless IC chip is formed on the feeder circuit board using the inductance element, and the radiation plate and the feeder circuit board are coupled by the electromagnetic field. The wireless IC device can be easily manufactured.

  In order to solve the above problems, the present invention provides another method of manufacturing a wireless IC device configured as follows.

  The method for manufacturing a wireless IC device includes (1) a first step of forming a radiation plate on the surface of an article, and (2) a wireless IC on a power supply circuit board including an inductance element in an adhesive layer formed on a base material. A second step of mounting an electromagnetic coupling module mounted so that the chip is electrically conductive; (3) covering the surface of the article with the radiation plate facing the adhesive layer and the electromagnetic coupling module; And a third step.

  According to the above method, the wireless IC device is manufactured in a state of being attached to an article. By simultaneously forming the radiation plate in the printing process of articles such as wrapping paper and cardboard, the process can be shortened. Moreover, by using the sheet | seat base material in which the adhesion layer was formed previously, since the process of forming an adhesion layer can be skipped and manufacturing time can be shortened, it is suitable for mass production.

  According to the above method, a matching circuit or a resonance circuit for impedance matching between the radiation plate and the wireless IC chip is formed on the feeder circuit board using the inductance element, and the radiation plate and the feeder circuit board are coupled by the electromagnetic field. The wireless IC device can be easily manufactured.

  Moreover, in order to solve the said subject, this invention provides the manufacturing method of another radio | wireless IC device comprised as follows.

  The wireless IC device manufacturing method includes (1) a first step of forming an adhesive layer on the surface of an article, and (2) a wireless IC chip electrically connected to a power supply circuit board including an inductance element in the adhesive layer. A second step of mounting the electromagnetic coupling module so mounted, (3) a third step of forming a radiation plate on a substrate, (4) the adhesive layer and the electromagnetic coupling module, And a fourth step of coating with the base material with the radiation plate facing.

  According to the above method, the wireless IC device is manufactured in a state of being attached to an article.

  According to the above method, a matching circuit or a resonance circuit for impedance matching between the radiation plate and the wireless IC chip is formed on the feeder circuit board using the inductance element, and the radiation plate and the feeder circuit board are coupled by the electromagnetic field. The wireless IC device can be easily manufactured.

  According to the present invention, a wireless IC device that can be reduced in size and improved in environmental resistance can be easily manufactured.

  Hereinafter, an embodiment of a wireless IC device used in an RF-ID system will be described as an embodiment of the present invention with reference to FIGS. 1a to 4c.

  Example 1 A wireless IC device of Example 1 will be described with reference to FIGS. FIG. 1 a is a cross-sectional view schematically showing a manufacturing process of a wireless IC device. 1b to 1d are cross-sectional views of a wireless IC device.

  As shown in FIG. 1 b, in the wireless IC device 10, an adhesive layer 26 is formed on a base material 30, and the electromagnetic coupling module 20 is mounted on the adhesive layer 26. The radiation plate 28 is formed on the substrate 30 and covered with the adhesive layer 26.

  Next, a method for manufacturing the wireless IC device of Example 1 will be described with reference to FIG.

  The sheet-like base material 31 is unwound from the roll 50 in the direction indicated by the arrow, and the radiation electrode having a predetermined shape is printed on the base material 31 using the printer 51, and then passed through the curing device 52 and cured. The radiation plate 28 is formed.

  For the base material 31, a resin-based sheet material such as PET, PEN, PP, LCP, PI or the like, a paper-based sheet material such as synthetic paper, a metal vapor deposition film, or the like is used. The printer 51 is of a type such as flexo, gravure, screen, rotary screen, offset, ink jet. The ink used for printing of the radiation plate 28 includes a metal material such as Ag, Cu, Ni, a conductive organic material, or a resist. The curing device 52 selects a device that cures the ink by heat, ultraviolet rays, or etching according to the type of ink.

  Next, the adhesive layer 27 is formed on the base material 31 on which the radiation plate 28 is formed using the adhesive layer forming device 53 so as to cover the entire radiation plate 28. As the adhesive layer forming device 53, a device for attaching an adhesive sheet, a potting device, a coater for applying an adhesive, a doctor blade device, or the like is used.

  Next, the electromagnetic coupling module 20 is mounted on the adhesive layer 27 using the mounting machine 54. At this time, as will be described later, the electromagnetic coupling module 20 can be mounted on the radiation plate 28 with loose accuracy. As the mounting machine 54, a tape supply type or a high-speed mounting machine is used.

  Next, the release sheet 18 is pressure-bonded to the adhesive layer 27 and the electromagnetic coupling module 20, and the adhesive layer 27 and the electromagnetic coupling module 20 are covered with the release sheet 18.

  Next, the wireless IC device is completed by cutting into individual products by a cutting process (not shown).

  Note that when the adhesive layer is attached to an article immediately after the electromagnetic coupling module is mounted on the adhesive layer, a wireless IC device can be manufactured without using a release sheet.

  As shown in FIG. 1 b, the wireless IC device 10 is peeled off the release sheet, and the adhesive layer 26 is attached to the article 40 as shown in FIG. 1 d with the adhesive layer 26 exposed.

  The wireless IC device 10 is easy to handle because the adhesive layer 26 is not exposed by the release sheet until it is attached. By forming the radiation plate 28 on a part of the substrate 30, the radiation plate 28 can be easily formed. If the base material 30 that supports the adhesive layer 26 has appropriate rigidity, the adhesive layer 26 can be easily attached to the article 40. When the wireless IC device 10 is attached, the base material 30 covers the entire surface of the adhesive layer 26 and prevents the adhesive layer 26 from being exposed.

  Even if the electromagnetic coupling module 20 is embedded in the adhesive layer 26a as in the wireless IC device 10a shown in FIG. 1c by applying a thick adhesive and adjusting the pressure when the electromagnetic coupling module is mounted on the adhesive layer. Good. In this case, the base material 30 when the wireless IC device 10a is attached to the article by reducing or eliminating the gap around the electromagnetic coupling module 20 and reducing or eliminating the protrusion of the electromagnetic coupling module 20 is provided. By reducing or eliminating the unevenness of the surface, the environmental resistance and impact resistance can be improved.

  The thickness of the adhesive layer is 2 mm or less, and the distance between the electromagnetic coupling module and the radiation plate is 0.5 mm or less.

  What is necessary is just to select the material excellent in required environmental resistance as the material of the adhesion layer. For example, when sticking to low energy surface condition articles such as PP and PET, which are general packaging members for containers and bags, select an acrylic adhesive with strong adhesive strength and excellent environmental resistance. Therefore, it is excellent in heat resistance (−40 to 100 ° C., up to −55 to 125 ° C. within 1 minute), chemical resistance (pH = 2 to 13 and strong acid and strong alkali are possible within 1 minute), and the like. In addition, when pasting on high-temperature articles such as polyimide, it is a silicone-based adhesive with excellent temperature resistance, and when pasting on rubber members, it is suitable for rubber-based adhesives and parts that require strong chemical resistance. Choose an epoxy adhesive.

  In the electromagnetic coupling module 20, as shown in FIGS. 1 b to 1 d, a wireless IC chip (not shown) is mounted on the power supply circuit board 22, and the periphery of the wireless IC chip is molded with a resin 24. The wireless IC chip is mounted by flip chip bonding, die bonding, wire bonding, or the like, and is electrically connected to the power supply circuit board 22.

  The wireless IC chip that is likely to fail is covered and protected by the resin 24 different from the adhesive layer 26, so that the reliability is improved. The resin 24 is preferably formed so that the surface 24a opposite to the power supply circuit board 22 is a flat surface so that adsorption or the like when mounting the electromagnetic coupling module 20 is easy.

  The feeder circuit board 22 is, for example, a multilayer board made of ceramic or resin, and a feeder circuit including an inductance element is formed by an in-plane conductor or an interlayer connection conductor, and the feeder circuit is coupled to the radiation plate by an electromagnetic field. . The power feeding circuit includes a resonance circuit having a resonance frequency corresponding to the operating frequency at which the wireless IC chip operates, and matches the characteristic impedance between the radiation plate 28 and the wireless IC chip.

  In addition, even if the electric power feeding circuit board 22 is a single layer board | substrate, a electric power feeding circuit may be formed only in the surface of an electric power feeding circuit board.

  The radiation plate 28 radiates, for example, a UHF band transmission signal supplied from the power supply circuit of the power supply circuit board 22 via electromagnetic field coupling into the air, and receives the received signal via the electromagnetic field coupling. The power is supplied to the power supply circuit of the substrate 12.

  Since the radiation plate 28 and the feeding circuit board 22 are coupled by an electromagnetic field, the positioning of the feeding circuit board 22 and the radiation plate 28 is more than that in the case where the radiation plate 28 and the feeding circuit board 22 are electrically connected by a conductor. Accuracy can be relaxed. Therefore, it is easy to manufacture and suitable for mass production. Further, since the wireless IC chip is electrically insulated from the radiation plate 28, it is possible to prevent the wireless IC chip from being destroyed by static electricity from the radiation plate 28 or the like.

The wireless IC device according to the first embodiment uses the fact that the RF-ID function operates only when the electromagnetic coupling module 20 is close to the radiation plate 28 without being in electrical contact. effective.
(1) Since the electromagnetic coupling module functions sufficiently even when the mounting accuracy is rough, the manufacturing process can be speeded up, and the time required for mounting the electromagnetic coupling module can be greatly reduced.
(2) Since the surface on which the electromagnetic coupling module is mounted is the entire bottom surface of the electromagnetic coupling module, the bonding area is large, sufficient bonding strength is obtained, and no additional fixing resin is required.
(3) The portion where the electromagnetic coupling module is in contact with the object is hard to be damaged because it is a strongly resin-molded surface.
(4) The electromagnetic coupling module and the radiation plate can be protected with only one sheet-like base material, and can be attached to the object with the smallest number of members, thereby reducing the cost. Moreover, it can be formed in a continuous line from substrate sheet supply to inspection and individual product division, and the process becomes simple.
(5) The distance between the electromagnetic coupling module and the antenna can be communicated at 2 mm or less, and the convex portion of the module is not conspicuous due to the depression of the adhesive layer portion. Thereby, the damage prevention effect is high.
(6) By setting the distance between the electromagnetic coupling module and the radiation plate to 0.5 mm or less, stable communication is possible.

  Second Embodiment A wireless IC device according to a second embodiment will be described with reference to FIGS. 2a to 2c. FIG. 2A is a cross-sectional view schematically showing a manufacturing process of the wireless IC device. 2b and 2c are cross-sectional views of the wireless IC device.

  Example 2 is substantially the same as Example 1. In the following, differences will be mainly described, and the same reference numerals are used for the same components as those in the first embodiment.

  As shown in FIG. 2 b, the wireless IC device 12 of the second embodiment is different from the first embodiment in that an adhesive layer 26 is disposed between the radiation plate 28 and the base material 30, and between the base material 30 and the adhesive layer 26. The electromagnetic coupling module 20 is arranged on the front side.

  The wireless IC device of Example 2 is manufactured by the process shown in FIG.

  That is, the radiation electrode is printed on the surface of an article 40 such as cardboard or paper to which the wireless IC device is attached using ink and then cured to form the radiation plate 28. Next, the adhesive layer 26 is transferred onto the surface of the article 40 on which the radiation plate 28 is formed, using the transfer device 63. Next, the electromagnetic coupling module 20 is mounted on the adhesive layer 26. Next, the base material 30 is pressure-bonded and attached to the adhesive layer 26 and the electromagnetic coupling module 20 to cover them.

  Through the above steps, the wireless IC device 12 attached to the article 40 is completed as shown in FIG. 2b. The base material 30 of the wireless IC device 12 has a convex portion formed on the surface thereof depending on the thickness of the electromagnetic coupling module 20.

  By thickening the adhesive layer and adjusting the pressure when the electromagnetic coupling module is mounted on the adhesive layer, the electromagnetic coupling module 20 is embedded in the adhesive layer 26a like the wireless IC device 12a shown in FIG. 30 surfaces can be flattened.

  The wireless IC device according to the second embodiment has the same effects as (1), (2), (4), (5), and (6) described in the first embodiment.

In addition, the wireless IC device according to the second embodiment is replaced with the effect (3) described in the first embodiment.
(3a) Since there is an adhesive layer between the object and the module, it functions as a cushioning material.
It has the effect.

In addition, the wireless IC device of Example 2 is
(7) The process can be shortened by simultaneously forming the radiation electrode in the printing process of wrapping paper or cardboard.
It has the effect.

  <Example 3> The wireless IC device of Example 3 will be described with reference to FIGS. 3a to 3c. FIG. 3A is a cross-sectional view schematically showing a manufacturing process of the wireless IC device. 3b and 3c are cross-sectional views of the wireless IC device.

  As shown in FIG. 3b, the wireless IC device 14 of Example 3 is different from Example 1 in that an adhesive layer 26 is disposed between the radiation plate 28 and the base material 30, and between the radiation plate 28 and the adhesive layer 26. The electromagnetic coupling module 20 is arranged on the front side.

  The wireless IC device of Example 3 is manufactured by the process shown in FIG.

  That is, the radiation plate 28 is formed by printing the radiation electrode on the surface of the article 40 to which the wireless IC device is attached using ink and then curing the radiation electrode.

  A base material 30 on which the adhesive layer 26 is formed in advance is prepared, and the electromagnetic coupling module 20 is mounted on the adhesive layer 26 of the base material 30.

  Then, the substrate 30 on which the electromagnetic coupling module 20 is mounted on the adhesive layer 26 is attached to the article 40 on which the radiation plate 28 is formed, and the adhesive layer 26 and the electromagnetic coupling module are provided on the surface of the article 40 on which the radiation plate 28 is formed. Crimp and bond with 20 facing each other.

  Through the above steps, as shown in FIG. 3B, the wireless IC device 14 attached to the article 40 is completed. The base material 30 of the wireless IC device 14 has a convex portion formed on the surface thereof depending on the thickness of the electromagnetic coupling module 20.

  By thickening the adhesive layer and adjusting the pressure when the electromagnetic coupling module is mounted on the adhesive layer, the electromagnetic coupling module 20 is embedded in the adhesive layer 26a like the wireless IC device 14a shown in FIG. 30 surfaces can be flattened.

  The wireless IC device according to the third embodiment has the same effects as (1), (2), (4), (5), and (6) described in the first embodiment.

  The wireless IC device of the third embodiment does not have the effect (3) described in the first embodiment.

  Further, the wireless IC device of the third embodiment has the effect (7) described in the third embodiment.

Furthermore, the wireless IC device of Example 3 is
(8) By using a base material on which an adhesive layer has been formed in advance, the step of forming the adhesive layer can be omitted, and the production time can be shortened, which is suitable for mass production.
It has the effect.

  <Example 4> The wireless IC device of Example 4 will be described with reference to FIGS. 4a to 4c. FIG. 4A is a cross-sectional view schematically showing a manufacturing process of the wireless IC device. 4b and 4c are cross-sectional views of the wireless IC device.

  As shown in FIG. 4b, in the wireless IC device 16 of the fourth embodiment, the radiation plate 28 is disposed between the base material 30 and the adhesive layer 26 as in the first embodiment, but unlike the first embodiment, The electromagnetic coupling module 20 is disposed between the substrate 30 and the radiation plate 28 and the adhesive layer 26.

  The wireless IC device of Example 4 is manufactured by the process shown in FIG. 4A.

  That is, the adhesive layer 26 is transferred to the surface of the article 40. Next, the electromagnetic coupling module 20 is mounted on the adhesive layer 26.

  Separately from this, the radiation plate 28 is formed by printing and curing the radiation electrode on the substrate 30.

  Next, the base material 30 on which the radiation plate 28 is formed is bonded by pressure bonding to the adhesion layer 26 and the electromagnetic coupling module 20 in a state where the radiation plate 28 faces the adhesion layer 26 and the electromagnetic coupling module 20 on the article 40. .

  Through the above steps, the wireless IC device 16 attached to the article 40 is completed as shown in FIG. The base material 30 of the wireless IC device 16 has a convex portion formed on the surface thereof depending on the thickness of the electromagnetic coupling module 20.

  By thickening the adhesive layer and adjusting the pressure when the electromagnetic coupling module is mounted on the adhesive layer, the electromagnetic coupling module 20 is embedded in the adhesive layer 26a like the wireless IC device 16a shown in FIG. 30 surfaces can be flattened.

  The wireless IC device according to the fourth embodiment has the same effects as (1) to (6) described in the first embodiment.

  <Summary> As described above, the wireless IC device can be easily manufactured as a wireless IC device that can be reduced in size and improved in environmental resistance.

  In other words, a power supply circuit board containing a circuit for matching the impedances of the two is disposed between the wireless IC chip and the radiation plate. By manufacturing the power supply circuit substrate using a multilayer substrate or the like, the wireless IC device for RF-ID can be reduced in size.

  The feeder circuit board is electromagnetically coupled to the radiation plate and is not electrically conductive. For this reason, the alignment accuracy during mounting of the power supply circuit board and the radiation plate can be relaxed, and an expensive mounting machine is also unnecessary.

  An adhesive layer is applied to the entire surface of the radiation plate, and a feeder circuit board is mounted thereon. Since the feeder circuit board is electromagnetically coupled to the radiation plate, the feeder circuit board operates as an RF-ID only by mounting the feeder circuit board on the protective layer. Since a radiation plate is arrange | positioned between a base material and the adhesion layer, the environmental resistance of a radiation plate can be improved. Since the adhesive layer on the surface of the radiation plate serves both for adhesion of the power supply circuit board and for protection of the radiation plate, a step of separately forming a protective film for the radiation plate is not required.

  Since the entire back surface of the power supply circuit board serves as an adhesive surface, the adhesive strength can be improved compared to a structure in which only the electrode portions are bonded.

  The wireless IC device of the present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

It is sectional drawing which shows the manufacturing process of a wireless IC device. Example 1 It is sectional drawing of a wireless IC device. Example 1 It is sectional drawing of a wireless IC device. (Modification of Example 1) It is sectional drawing of a wireless IC device. Example 1 It is sectional drawing which shows the manufacturing process of a wireless IC device. (Example 2) It is sectional drawing of a wireless IC device. (Example 2) It is sectional drawing of a wireless IC device. (Modification of Example 2) It is sectional drawing which shows the manufacturing process of a wireless IC device. (Example 3) It is sectional drawing of a wireless IC device. (Example 3) It is sectional drawing of a wireless IC device. (Modification of Example 3) It is sectional drawing which shows the manufacturing process of a wireless IC device. (Example 4) It is sectional drawing of a wireless IC device. (Example 4) It is sectional drawing of a wireless IC device. (Modification of Example 4) It is a top view of a wireless IC device. (Conventional example)

Explanation of symbols

10, 10a Wireless IC device 12, 12a Wireless IC device 14, 14a Wireless IC device 16, 16a Wireless IC device 18 Release sheet 20 Electromagnetic coupling module 22 Feed circuit board 24 Resin (protective member)
26 Adhesive layer 28 Radiation plate 31 Base material 40 Article

Claims (14)

An electromagnetic coupling module mounted on a power supply circuit board including an inductance element so that the wireless IC chip is electrically conductive;
A radiation plate,
Both main surfaces have adhesiveness, are attached to the electromagnetic coupling module and the radiation plate, cover the electromagnetic coupling module and the radiation plate, and extend to the periphery of the electromagnetic coupling module and the radiation plate. An adhesive layer;
With
The wireless IC device, wherein the radiation plate and the feeder circuit board are coupled by an electromagnetic field.   The wireless IC device according to claim 1, further comprising a matching circuit and / or a resonance circuit in the power supply circuit board.   The wireless IC device according to claim 1, further comprising a base material on which the radiation plate is formed.   The wireless IC device according to claim 3, wherein the base material covers the entire one main surface of the adhesive layer.   The wireless IC device according to claim 1, further comprising a release layer on the adhesive layer.   The wireless IC device according to any one of claims 1 to 4, wherein the radiation plate is formed in advance on an article for fixing the wireless IC device.   The wireless IC device according to claim 6, wherein a portion where the radiation plate of the article is formed in advance and its periphery are covered with the adhesive layer.   The wireless IC device according to claim 1, wherein the electromagnetic coupling module is embedded in the adhesive layer.   The wireless IC device according to claim 1, wherein a periphery of the wireless IC chip is covered with a protective member.   The wireless circuit according to claim 1, wherein the power supply circuit board is disposed such that a main surface on which the wireless IC chip is mounted faces the radiation plate. IC device. A first step of forming a radiation plate on a sheet-like substrate;
A second step of forming an adhesive layer on the substrate on which the radiation plate is formed;
A third step of mounting an electromagnetic coupling module mounted on the adhesive layer so that a wireless IC chip is electrically connected to a power supply circuit board including an inductance element;
A fourth step of covering the adhesive layer and the electromagnetic coupling module with a release sheet;
A method of manufacturing a wireless IC device, comprising: A first step of forming a radiation plate on the surface of the article;
A second step of forming an adhesive layer on the surface of the article on which the radiation plate is formed;
A third step of mounting an electromagnetic coupling module mounted on the adhesive layer so that a wireless IC chip is electrically connected to a power supply circuit board including an inductance element;
A fourth step of coating the adhesive layer and the electromagnetic coupling module with a substrate;
A method of manufacturing a wireless IC device, comprising: A first step of forming a radiation plate on the surface of the article;
A second step of mounting an electromagnetic coupling module mounted on the adhesive layer formed on the base material so that the wireless IC chip is electrically connected to the power supply circuit board including the inductance element;
A third step of coating the surface of the article with the radiation plate facing the adhesive layer and the electromagnetic coupling module;
A method of manufacturing a wireless IC device, comprising: A first step of forming an adhesive layer on the surface of the article;
A second step of mounting an electromagnetic coupling module mounted on the adhesive layer so that a wireless IC chip is electrically connected to a power supply circuit board including an inductance element;
A third step of forming a radiation plate on the substrate;
A fourth step of covering the adhesive layer and the electromagnetic coupling module with the base material with the radiation plate facing;
A method of manufacturing a wireless IC device, comprising:

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